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WO2008065093A2 - Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact - Google Patents

Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact Download PDF

Info

Publication number
WO2008065093A2
WO2008065093A2 PCT/EP2007/062842 EP2007062842W WO2008065093A2 WO 2008065093 A2 WO2008065093 A2 WO 2008065093A2 EP 2007062842 W EP2007062842 W EP 2007062842W WO 2008065093 A2 WO2008065093 A2 WO 2008065093A2
Authority
WO
WIPO (PCT)
Prior art keywords
contact
sensor unit
contacting
conductor structure
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/062842
Other languages
German (de)
English (en)
Other versions
WO2008065093A3 (fr
Inventor
Dirk Boghun
Alfred Umkehrer
Stephan Konrad
Gundolf Lippold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser Wetzer GmbH and Co KG
Original Assignee
Endress and Hauser Wetzer GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser Wetzer GmbH and Co KG filed Critical Endress and Hauser Wetzer GmbH and Co KG
Publication of WO2008065093A2 publication Critical patent/WO2008065093A2/fr
Publication of WO2008065093A3 publication Critical patent/WO2008065093A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a device for determining and / or monitoring at least one process variable.
  • the process variable is, for example, temperature, flow, humidity, level or pH.
  • the invention relates to a method for contacting a sensor unit, wherein the sensor unit is, for example, a thin-film or thick-film sensor.
  • thin-film sensors In process metrology more and more so-called thin-film sensors have been introduced in recent years. For example, they are thin-film resistance thermometers or specially developed sensor elements, such as those used for calorimetric flow measurement.
  • the thin-film technology enables small and robust designs with flexible packaging options and comparatively cost-effective, reproducible production in large numbers.
  • Thin film structures are usually not housed, such as semiconductor elements, so that common bonding methods are usually not applicable. Such would not be sufficiently resilient mechanically.
  • a common and mature contacting technology in particular In the case of thin-film resistance thermometers, the welding of thin nickel / silver or platinum tapes or tapes with diameters greater than or equal to 0.1 mm is carried out on specially provided and correspondingly metallized contact surfaces (pads) directly on the thin-film element. These welds must then be provided with special glass covers to ensure sufficient mechanical strength even at higher temperatures.
  • the so-welded and fixed Kunststoffdrähtchen can be extended with insulated wires or strands of larger diameter.
  • connection pads on the thin-film element are only very small in area, because a plurality of contact wires have to be applied or because with increasing miniaturization of the thin-film elements, the available space on the sensor element becomes smaller.
  • Low temperature masking pastes e.g. Polyimide.
  • the object of the invention is therefore to propose a simplification and improvement of the electrical contacting of thin film sensors.
  • the invention solves the problem in that at least one
  • Sensor unit is provided, that the sensor unit is applied with a bottom on an upper side of a substrate, that the sensor unit is connected for electrical contacting with at least one contact pad, that at least one contact board is provided that the contact board on a bottom with a Conductor structure is provided, wherein the conductor pattern is configured corresponding to the arrangement of the contact pad, that the conductor structure and the contact pad are electrically conductively connected to each other, and that the contact board on an upper side at least one contacting unit, wherein the contacting unit and the conductor structure are electrically conductively connected to each other ,
  • the sensor unit is located on a substrate and can be electrically contacted via at least one contact pad or via a plurality of contact pads.
  • a contact board which has a conductor structure which is designed corresponding to the arrangement of the contact pads or, preferably in such a way that each contact pad experiences an electrical connection to the contact board via the circuit board.
  • On the top of the contact board is the place for the arrangement of contacting units. That is, the wires, strands or bands are contacted according to the invention with the contact plate arranged above the sensor unit, on which therefore also more contact surface is located.
  • the term "sensor unit” should be understood to mean the thin-layer or thick-layer structure which serves for the actual measurement, ie the recording of the measured variable from which the process variable is determined or a change in the process variable is detected. Possibly. the sensor unit contains additional elements.
  • the sensor unit is first produced with suitable methods on the substrate.
  • a secure and more reliable contacting of such thin-film elements is achieved by the use of an additional contact board, which is applied in sandwich construction on the upper side of the thin-film sensor.
  • the contact boards have the same dimensions and consist of the same carrier material as the substrate on which the sensor unit is located.
  • a conductor structure is applied, which is preferably a mirror image of the arrangement of the contact pads on the Sensor unit or on the substrate of the sensor unit corresponds.
  • soldering pads which utilize the entire surface can be applied, which are connected via electrically conductive plated-through holes to the associated conductor structure on the underside of the contact board. On these solder pads can then be attached relatively easily by soldering or welding and thicker, insulated connecting wires or strands or bands directly.
  • Sensor element with the contacting board is preferably realized by solder joints or conductive adhesive between the contact pads on the sensor element and the congruent overlying conductor structures of the contact board. This can be done by appropriately mask applied solder paste or the use of so-called. Gridballs, as known from BGA (Ball Grid Array) components. If one uses higher melting solders for this purpose, it is ensured that this solder joint also has the subsequent soldering of the connecting strands or the later possibly required soldering / soldering of the sensor unit thus contacted, insofar as lower melting solders are used for this purpose.
  • the units according to the invention can be inexpensively produced in large numbers in the so-called use as standard printed circuit boards. On them are applied fully automatically by mask corresponding solder pastes / balls. Then, with automatic placement machines, as with conventional SMD components, the thin-film sensor elements are positioned and soldered in the reflow oven, for example. A fully automatic test (measuring the contact resistance and / or the electrical sensor parameters) is also possible, as with "normal" printed circuit boards, with the conventional test systems.A separation of the benefits and a separation of the functional sensor elements are only final for attaching the Connecting wires on the soldered contact boards required. An embodiment includes that the sensor unit between the
  • Top of the substrate and the bottom of the contact board is arranged.
  • An embodiment provides that the substrate and the contact board consist essentially of the same material.
  • An embodiment includes that the conductor structure of the contact board is configured in mirror image to the arrangement of the contact pad.
  • the contacting unit is a connection wire or a pigtail or a connection strip.
  • An embodiment includes that the sensor unit is a thin-film or thick-film sensor.
  • the sensor unit is a temperature sensor or a calorimetric flow sensor.
  • the invention solves the problem by a method for
  • a sensor unit which comprises at least the following steps: that the sensor unit is applied with a lower side on an upper side of a substrate, that the sensor unit is connected for electrical contacting with at least one contact pad that a contact board on a bottom with a corresponding to the arrangement of the contact pad Ladder structure is provided, and that the conductor pattern and the contact pad are electrically connected to each other.
  • the sensor unit is quasi enclosed between the substrate and the contact board.
  • the at least one contact pad is arranged, on the opposite side of the contact board, one of its arrangement according to configured conductor structure is predetermined.
  • the sensor unit is electrically connected to the contact plate via the connection between the contact pad and the conductor structure, and preferably the surface of the contact plate facing away from the sensor unit can be used for contacting it to the outside or to other components.
  • the place for contacting the sensor unit is on the Substrate limited, because there is, inter alia, the sensor unit. Due to the configuration of contact pad and conductor structure, the electrical contact is transferred to the contact board, the top allows significantly more space for contacting with contact strands, leads or bands.
  • the embodiments and details of the measuring device described above also apply correspondingly to the method and the details of the method are also valid for the device.
  • An embodiment of the method according to the invention provides that at least one contacting unit is applied on an upper side of the contact plate.
  • the contacting unit is, for example, a connecting wire or a pigtail or a connecting band.
  • An embodiment of the method according to the invention includes that the contacting unit and the conductor structure are electrically conductively connected to each other.
  • An embodiment of the method according to the invention provides that the conductor structure of the contact board is configured in mirror image to the arrangement of the contact pad.
  • Fig. 1 a lateral section through an inventive arrangement
  • FIG. 2 shows a section through the arrangement of FIG. 1.
  • a sensor unit 1 which is a so-called thin-film sensor, is located on a substrate 2.
  • the sensor unit 1 is designed, for example, such that the process variable temperature, flow or humidity are measured or can be monitored.
  • the sensor unit 1 in this example shown here is a temperature-sensitive resistance structure.
  • the sensor unit 1 is connected to two contact pads 3 (or contact surfaces), via which, for example, the electrical resistance of the sensor unit 1 can be measured.
  • the contact pads serve 3 Thus, the electrical contacting of the sensor unit 1.
  • the contact pads 3 are laterally offset from the sensor unit 1 attached.
  • the contact pads 3 are at least partially on the substrate 2 or on the sensor unit 1.
  • the contact pads 3 are part of the sensor unit 1.
  • a contacting board 5 is arranged, which via a conductor structure. 6 features.
  • the substrate 2 and the contacting board 5 have substantially the same dimensions.
  • the conductor structure 6 is designed such that it is a mirror image of the arrangement of the contact pads 3, so that therefore each electrical connection point of the sensor element 1 is guided to the contact board 5.
  • the contact pads 3 and the conductor structure 6 are connected to one another by means of solder connections 8 for the electrical contacting.
  • a conductive adhesive may be used.
  • a connection between the substrate 2 and the contact board 5 is preferably made at other locations.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un dispositif de détermination et/ou de contrôle d'au moins une grandeur de processus. Selon l'invention, on prévoit au moins une unité de détection (1); l'unité de détection (1) est disposée avec un côté inférieur sur un côté supérieur d'un substrat (2); l'unité de détection (1) est connectée à au moins une pastille de contact (3) pour la mise en contact électrique; on prévoit au moins une platine de contact (5); la platine de contact (5) est pourvue d'une structure conductrice (6) sur un côté inférieur, la structure conductrice étant conçue en correspondance avec la disposition de la pastille de contact (3); la structure conductrice (6) et la pastille de contact (3) sont mises en contact électrique l'une avec l'autre; et la platine de contact (5) présente au moins une unité de mise en contact (7) sur le côté supérieur, l'unité de mise en contact (7) et la structure conductrice (6) étant mises en contact électrique l'une avec l'autre. L'invention concerne également un procédé de mise en contact d'une unité de détection.
PCT/EP2007/062842 2006-11-27 2007-11-27 Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact Ceased WO2008065093A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006056171.6 2006-11-27
DE102006056171A DE102006056171A1 (de) 2006-11-27 2006-11-27 Vorrichtung zur Bestimmung und/oder Überwachung einer Prozessgröße und Verfahren zur Kontaktierung

Publications (2)

Publication Number Publication Date
WO2008065093A2 true WO2008065093A2 (fr) 2008-06-05
WO2008065093A3 WO2008065093A3 (fr) 2009-01-22

Family

ID=39326434

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/062842 Ceased WO2008065093A2 (fr) 2006-11-27 2007-11-27 Dispositif de détermination et/ou de contrôle d'une grandeur de processus et procédé de mise en contact

Country Status (2)

Country Link
DE (1) DE102006056171A1 (fr)
WO (1) WO2008065093A2 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
JPS5974653A (ja) * 1982-10-22 1984-04-27 Hitachi Ltd 半導体装置
US4677850A (en) * 1983-02-11 1987-07-07 Nippon Soken, Inc. Semiconductor-type flow rate detecting apparatus
DE8716103U1 (de) * 1987-12-05 1988-01-21 Degussa Ag, 6000 Frankfurt Meßwiderstand für Temperaturmessungen
US5856914A (en) * 1996-07-29 1999-01-05 National Semiconductor Corporation Micro-electronic assembly including a flip-chip mounted micro-device and method
DE19750123C2 (de) * 1997-11-13 2000-09-07 Heraeus Electro Nite Int Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung
DE19812690C1 (de) * 1998-03-23 1999-11-18 Siemens Ag Träger für einen temperaturabhängigen Widerstand
JP4486289B2 (ja) * 2001-03-30 2010-06-23 株式会社デンソー フローセンサ及びその製造方法
JP2006010547A (ja) * 2004-06-28 2006-01-12 Denso Corp 湿度センサモジュールおよび湿度センサの実装構造
US20060185429A1 (en) * 2005-02-21 2006-08-24 Finemems Inc. An Intelligent Integrated Sensor Of Tire Pressure Monitoring System (TPMS)
DE102005051672A1 (de) * 2005-10-28 2007-05-03 Hydac Electronic Gmbh Mehrdimensionaler Fluidströmungssensor

Also Published As

Publication number Publication date
WO2008065093A3 (fr) 2009-01-22
DE102006056171A1 (de) 2008-05-29

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