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WO2008055867A1 - Procédé pour produire des surfaces électroconductrices structurées - Google Patents

Procédé pour produire des surfaces électroconductrices structurées Download PDF

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Publication number
WO2008055867A1
WO2008055867A1 PCT/EP2007/061873 EP2007061873W WO2008055867A1 WO 2008055867 A1 WO2008055867 A1 WO 2008055867A1 EP 2007061873 W EP2007061873 W EP 2007061873W WO 2008055867 A1 WO2008055867 A1 WO 2008055867A1
Authority
WO
WIPO (PCT)
Prior art keywords
particles
electrolessly
layer
adhesive layer
transfer medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/061873
Other languages
German (de)
English (en)
Inventor
Rene Lochtman
Jürgen Kaczun
Norbert Schneider
Jürgen PFISTER
Norbert Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of WO2008055867A1 publication Critical patent/WO2008055867A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Definitions

  • the invention relates to a method for the production of structured and / or full-surface, electrically conductive surfaces on an electrically non-conductive support.
  • the method according to the invention is suitable, for example, for producing conductor tracks on printed circuit boards, RFI D antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, film conductors, printed conductors in solar cells or in LCD or plasma picture screens or galvanically coated products in any desired form. Also, the method is suitable for the production of decorative or functional surfaces on products that can be used to shield electromagnetic radiation, for heat conduction or as packaging.
  • a structured or full-surface adhesive layer is first applied to the electrically nonconductive carrier to produce such structured or full-surface, electrically conductive surfaces.
  • a metal foil or a metal powder is fixed.
  • a metal foil or a metal layer over the entire surface on a carrier body made of a Kunststoffmate- rial applied and pressed by means of a structured, heated punch against the carrier body and to fix it by its subsequent curing.
  • the structuring of the metal layer takes place by mechanical removal of the regions of the metal foil or of the metal powder which are not connected to the adhesive layer or to the carrier body.
  • Such a method is described for example in DE-A 101 45 749.
  • EP-A 0 130 462 it is known to apply a layer of a thermosetting resin with metal particles contained therein, wherein at least a part of the particles consist of a noble metal, structured on a transfer surface. Subsequently, the transfer medium with the side on which the resin and the metal particles Kel containing layer is applied, brought into contact with a carrier body. In this case, either an adhesive layer is applied to the layer containing the metal particles or to the carrier body such that the layer containing the metal particles is transferred to the carrier body by the transfer medium in the form of the structured surface to be produced.
  • a disadvantage of the method is the size of the metal particles used in the range of 150 to 420 .mu.m, which do not allow to produce very fine conductor track structures, that is, conductor tracks smaller than 100 .mu.m.
  • the proposed method requires a significant proportion of an expensive precious metal such as silver.
  • Another disadvantage is the use of a high metal filled ink that is very difficult to print at high resolution.
  • an unnecessary amount of metal is transferred because the entire metal-filled ink layer is transferred from the intermediate carrier to the substrate, although only a thin metal layer is needed on the surface in the further process.
  • a further disadvantage of the method is that before the transfer of the structured metal-containing layer, an additional compacting step is required before the transfer of the metal layer to the substrate, in order to achieve sufficient conductivity for the subsequent galvanization.
  • the object of the present invention is to provide a process which does not have the disadvantages of the processes known from the prior art.
  • the object is achieved by a method for producing structured and / or full-area, electrically conductive surfaces on an electrically nonconductive support, which comprises the following steps:
  • a carrier to which the electrically conductive, structured or full-surface surface is applied for example, rigid or flexible carrier are suitable.
  • the carrier is not electrically conductive. This means that the specific resistance is more than 10 9 ohm x cm.
  • Suitable carriers are, for example, reinforced or unreinforced polymers, as are commonly used for printed circuit boards.
  • Suitable polymers are epoxy resins, or modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, aramid-reinforced or glass-fiber reinforced or paper-reinforced epoxy resins (for example FR4), glass fiber reinforced plastics, liquid cristal polymers (LCP), polyphenylene sulfides (PPS), polyoxymethylenes (POM), polyaryl ether ketones (PAEK), polyether ether ketones (PEEK), polyamides (PA), polycarbonates (PC), polybutylene terephthalates (PBT), polyethylene terephthalates (PET), polyimides (PI) , Polyimide resins, cyanate esters, bismaleimide-triazine resins, nylon, vinyl ester resins, polyesters, polyester resins, polyamides, polyanilines, phenolic resins, polypyrroles, polyethylene naphthalate (PEN), polymethyl methacrylate
  • suitable substrates composites, foam-like polymers, Styropor® ®, styrodur ®, polyurethanes (PU), ceramic surfaces, textiles, paperboard, cardboard, paper, polymer coated paper, wood, mineral materials, silicon, glass, plant tissue and animal tissue.
  • the carrier can be both rigid and flexible.
  • an adhesive layer which has the shape of the structured or full-surface base layer is applied to the electrically nonconductive support.
  • Suitable materials for the adhesive layer are, for example, natural and synthetic polymers and their derivatives, natural resins and synthetic resins and their derivatives, natural rubber, synthetic rubber, proteins, and the like, as long as they adhere to the support material. These can, but do not have to be, chemically or physically curing, for example air-hardening, radiation-curing or temperature-curing.
  • the material for the adhesive layer is a polymer or polymer blend.
  • Preferred polymers as material for the adhesive layer are acrylated acrylates; Alkyd resins; Alkylvinylacetate; Alkylene vinyl acetate copolymers, in particular methylene vinyl acetate, ethylene vinyl acetate, butylene vinyl acetate; Alkylenvinylchlorid copolymers; Amino resins; Aldehyde and ketone resins; epoxy acrylates; epoxy resins; modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, vinyl ethers, ethylene-acrylic acid copolymers; Hydrocarbon resins; Melamine resins, maleic anhydride copolymers; Methacrylate; Natural rubber; synthetic rubber; Chlorinated rubber; Natural resins; Collophone resins; Phenol resins; Polyester; Polyester resins, such as
  • Particularly preferred polymers as material for the adhesive layer are acrylates, acrylate resins, methacrylates, methacrylate resins, melamine and amino resins, polyalkylenes, polyimides, epoxy resins, modified epoxy resins, for example bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated Epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, vinyl ethers, and phenolic resins, polyurethanes, polyesters, polyvinyl acetals, polyvinyl acetates, polystyrene copolymers, polystyrene acrylates, styrene-butadiene block copolymers, styrene-isoprene block copolymers, alkylene vinyl acetates and vinyl chloride copolymers, polyamides and their copolymers ,
  • the material used for the adhesive layer is preferably thermally or radiation-curing resins, for example modified epoxy resins, such as bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, cyanate esters, vinyl ethers, phenolic resins, melamine resins and amino resins, polyurethanes, and polyesters used.
  • modified epoxy resins such as bifunctional or polyfunctional bisphenol A or bisphenol F resins, epoxy novolac resins, brominated epoxy resins, cycloaliphatic epoxy resins; aliphatic epoxy resins, glycidyl ethers, cyanate esters, vinyl ethers, phenolic resins, melamine resins and amino resins, polyurethanes, and polyesters used.
  • this may furthermore be added to a solvent or a solvent mixture in order to adjust the viscosity suitable for the respective application method.
  • Suitable solvents are, for example, aliphatic and aromatic hydrocarbons (for example n-octane, cyclohexane, toluene, xylene), alcohols (for example methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, amyl alcohol), polyhydric alcohols, such as glycerol, ethylene glycol, propylene glycol, neopentyl glycol, alkyl esters (for example methyl acetate, ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, isopropyl acetate, 3-methylbutanol), alkoxy alcohols (for example methoxypropanol, methoxybutanol, ethoxypropanol), alkylbenzenes (cf.
  • aliphatic and aromatic hydrocarbons for example n-octane,
  • Preferred solvents are alcohols (for example ethanol, 1-propanol, 2-propanol, butanol), alkoxyalcohols (for example methoxypropanol, ethoxypropanol, butylglycol, butyldiglycol), butyrolactone, diglycol dialkyl ethers, diglycol monoalkyl ethers, dipropylene glycol dialkyl ethers, dipropylene glycol monoalkyl ethers, esters (for example ethyl acetate , Butyl acetate, butyl glycol acetate, butyl diglycol acetate, diglycol alkyl ether acetates, dipropylene glycol alkyl ether acetates, DBE), ethers (for example tetrahydrofuran), polyhydric alcohols such as glycerol, ethylene glycol, propylene glycol, neopentyl glycol, ketones (for example,
  • alkoxy alcohols for example, ethoxypropanol, butylglycol, butyldiglycol, and polyhydric alcohols, such as glycerol, esters, for example, butyldiglycol acetate, butylglycol acetate, methoxypropylacetate, dipropylene glycol methyl ether acetates, water, cyclohexanone, butyrolactone, N Methyl pyrrolidone, DBE and mixtures thereof as a solvent is particularly preferred.
  • alkoxy alcohols for example, ethoxypropanol, butylglycol, butyldiglycol, and polyhydric alcohols, such as glycerol, esters, for example, butyldiglycol acetate, butylglycol acetate, methoxypropylacetate, dipropylene glycol methyl ether acetates, water, cyclohexanone, butyrolactone, N Methy
  • liquid materials for the adhesive layer for example liquid epoxy resins, acrylate esters
  • the respective viscosity can alternatively also be adjusted via the temperature during application or via a combination of solvent and temperature.
  • electrolessly and / or electrolytically coatable particles are transferred from a transfer medium to the adhesive layer, wherein the electrolessly and / or electrolytically coatable particles are applied as a layer, preferably as a monolayer, on the transfer medium.
  • a monolayer of electrolessly and / or electrolytically coatable particles is that only at the surface of the adhesive layer of the target substrate is there a thin layer of electrolessly and / or electrolytically coatable particles. Also, a monolayer is more economical because less currentless and / or electrodepositable material is consumed. Also, adhesion of these particles to the adhesive layer is better because each transferred particle is directly associated with the adhesive.
  • Suitable as a transfer medium is any rigid or flexible support on which the electrolessly and / or electrolytically coatable particles can be applied. Suitable materials for the transfer medium are, for example, metals, glass, ceramics, plastics or any composite materials.
  • electrolessly and / or electrolytically coatable particles with a small amount of a binder and optionally further additives, such as, for example, dispersing aids and leveling agents, corrosion inhibitors, etc., are dispersed in a solvent and applied to the transfer medium, for example with a pressure medium. , Casting, rolling, doctor blade or spraying applied.
  • the binders used are preferably the same materials as for the later adhesive layer.
  • the amount and type of binder with which the electrolessly and / or electrolytically coatable particles adhere to the transfer medium is chosen so that the electroless and / or electroplated particles adhere only weakly on the transfer medium.
  • the electrolessly and / or electrolytically coatable particles adhere more strongly to the adhesive layer of the carrier after transfer than to the transfer medium so that the transfer medium can be removed without electrolessly and / or electrolytically coatable particles together with the transfer medium from the adhesive layer of the carrier be removed.
  • the transfer medium used is at least one endless belt, which runs around at least two shafts, or at least one roller.
  • the dispersion of the electrolessly and / or electrolytically coatable particles and the binder is applied to the endless belt or the roller, for example by means of a pressure, casting, rolling, doctoring or spraying method.
  • the dry film thickness of the applied dispersion is chosen such that it corresponds approximately to the diameter of the electrically conductive particles. This ensures that only a monolayer of particles is applied to the transfer medium.
  • the layer thickness is greater than the particle diameter, the cohesion of the electrolessly and / or electrolytically coatable particles is so low due to the small amount of binder within the particle layer that only a monolayer of particles is transferred during the subsequent transfer of the transfer layer to the substrate.
  • the endless belt or the roller After application and at least partial drying of the dispersion, the endless belt or the roller is brought into contact with the electrically nonconductive support on which the structured or full-surface adhesive layer is applied, preferably via a calender roller. Preferably moves Here, the electrically non-conductive carrier at the same speed as the endless belt or the roller. During contact of the electrically nonconductive carrier with the adhesive layer applied thereon with the endless belt or the roller to which the binder with the electrolessly and / or electrically coatable particles are applied, the electrolessly and / or electrolytically coatable particles of the endless belt or the roller transferred to the electrically non-conductive carrier.
  • the endless belt or rollers can also be used for transporting the carrier, however, an additional transport system can also be used.
  • the transfer can be carried out either on one side or on several sides, whereby the two sides are carried out either successively by the same or by several systems or the transfer takes place at the same time, for example at the top and bottom.
  • the residues of the at least partially dried dispersion of, for example, binders and electrolessly and / or electrolytically coatable particles still adhering to the transfer medium are cleaned off from the transfer medium.
  • the cleaning can be done, for example, magnetically, mechanically or by washing.
  • a scraper is passed over the transfer medium, which scrapes off residues of the at least partially dried dispersion from the transfer medium.
  • the scraped-off residues of the dispersion can subsequently be recycled, for example, directly or after purification and / or separation of the electrolessly and / or electrolytically coatable particles as starting materials for the dispersion preparation.
  • the washing can be carried out, for example, with a solvent in which the binder dissolves. Suitable for this purpose are all solvents which are described above, but preferably the solvent of the dispersion, whereby, for example, the residues of the dispersion can be recycled.
  • a binder is chosen which is compatible or miscible with the adhesive on the non-conductive support, or can react with it during curing.
  • the application of the dispersion of electrolessly and / or electrolytically coatable particles, binders and / or solvents to the transfer medium takes place, for example, by a continuous coating, for example by printing, casting, rolling, knife coating or spraying.
  • a rigid carrier as a transfer medium. If a rigid carrier is used as transfer medium, the dispersion with the electrolessly and / or electrolytically coatable particles is first applied to this and then the rigid carrier is brought into contact with the electrically non-conductive carrier with a defined contact pressure.
  • the rigid support serving as the transfer medium and the electrically non-conductive support are separated, wherein the electrolessly and / or electrolytically coatable particles adhere to the adhesive layer on the electrically nonconductive support.
  • a rigid support as a transfer medium, it is necessary, after transferring the electrolessly and / or electrolytically coatable particles not transferred to the electrically non-conductive support particles and the adhesive layer, before this new adhesive and electroless and / or galvanic coatable Particles is coated.
  • the coating of the rigid carrier as a transfer medium is carried out as well as in the endless belt or the roller, for example by printing, casting, rolling, knife coating or spraying.
  • the transfer medium is a film which is already coated with a layer, preferably a monolayer, of electrolessly and / or electrolytically coatable particles and is unwound from a supply of film. It is also possible that the film is initially not coated and the electroless and / or electroplated particles are applied to the film after unwinding. The application of the particles may, for example, as described above for endless belt, roller or rigid carrier, be carried out as a dispersion. After transferring the electrolessly and / or electrolytically coatable particles to the electrically non-conductive carrier, the film is collected, for example by winding, and then disposed of.
  • the electrolessly and / or electrolytically coatable particles adhere to the transfer medium with the aid of magnetic force.
  • the transfer medium it is possible for the transfer medium to be made of a magnetic material, on the other hand it is also possible to guide the transfer medium past a magnet, for example a permanent magnet or an electromagnet, whereby the electrolessly and / or electrolytically coatable magnetic particles on the transfer medium being held.
  • the magnetic force is chosen so that the particles adhere to the adhesive layer on contact with the adhesive layer on the electrically non-conductive support and detach from the transfer medium.
  • a dispersion of electroless and / or electroplated magnetic particles in a solvent but without the addition of a polymeric binder is applied to a magnetic, rigid or flexible support, such as a magnetic film.
  • the coating can be done, for example, by printing, casting, rolling, knife coating or spraying. After evaporation of the solvent to obtain a layer of the particles, which adheres by magnetic force on the magnetic carrier.
  • the dry layer thickness of the applied dispersion is chosen such that it corresponds approximately to the diameter of the electrolessly and / or electrolytically coatable magnetic particles.
  • the magnetic transfer layer is brought into contact with the adhesive layer on the electrically non-conductive support.
  • the electrolessly and / or electrolytically coatable particles adhere to the adhesive layer.
  • the particle layer on the magnetic carrier is not cohesively held together by a binder, only a monolayer of the electrolessly and / or electrolytically coatable particles can be transferred to the adhesive layer on the electrically nonconductive carrier.
  • the electrolessly and / or electrolytically coatable particles still adhering to the magnetic carrier after the coating of the adhesive layer are removed from the carrier surface, for example, by means of a magnet subjected to an alternating field or by switching off and / or removing an electromagnet. The electroless and / or electrolytically coatable particles can then be reused.
  • the transfer medium is a magnetic roller. Inside the magnet roller, at least one magnet is picked up which does not move while the roller rotates around the magnets. It can also be installed two or more magnets, for example, the magnetic fields differ in strength.
  • the first of the magnets accommodated in the roller is, for example, an occupation magnet.
  • the electrolessly and / or electrolytically coatable, magnetic or magnetisable particles are attracted by the coating magnets and thus adhere to the roll surface. Depending on the strength of the set magnetic field, you can achieve that only about a monolayer of particles is transferred to the roller.
  • optical monitoring it is possible, for example, to check, as required, whether the electrolessly and / or electrolytically coatable, magnetic or magnetisable particles rest on the roller surface as a monolayer.
  • optical monitoring for example, a laser optics is suitable.
  • the electrolessly and / or electrolytically coatable, magnetic or magnetizable particles adhering to the roll surface with the aid of the coating magnet are not electrically generated on the further rotation of the roll, possibly also by a downstream transfer magnet which produces a weaker magnetic field than the charge magnet delivered conductive carrier.
  • the electrically nonconductive support with the support thereon is brought adhesive layer led to the roll surface along.
  • the particle layer on the roller is not cohesively held together by a binder, only a monolayer of the electrolessly and / or electrolytically coatable, magnetic or magnetizable particles can be transferred to the adhesive layer on the electrically nonconductive support.
  • the electrolessly and / or electrolytically coatable, magnetic or magnetisable particles which are still adhering to the magnetic roller after the coating of the adhesive layer are removed from the roller surface or by a doctor, for example with the aid of a magnet subjected to an alternating field.
  • the recovered electroless and / or electrodepositable particles can be recycled, for example, as a starting material.
  • the cleaning can also be carried out by rinsing with a solvent, preferably the same solvent used to apply the electrolessly and / or electrolytically coatable, magnetic or magnetizable particles.
  • a solvent preferably the same solvent used to apply the electrolessly and / or electrolytically coatable, magnetic or magnetizable particles.
  • the solvent is taken directly from the reservoir and, in fact, after the previously electrolessly and / or galvanically coatable, magnetic or magnetizable particles have been separated, for example by a filter in a Umpump Vietnamese.
  • it is also possible to use new solvents for the cleaning in which case the mixture of electrolessly and / or electrolytically coatable, magnetic or magnetizable particles and solvents then being able to be added to the reservoir as starting material. Any missing quantities of electrolessly and / or electrolytically coatable, magnetic or magnetizable particles or solvents can be added if necessary to adjust the desired mixture.
  • At least one transfer magnet is followed by at least one transfer magnet.
  • the transmission magnet has a smaller magnetic field than the occupation magnet, so that the electrolessly and / or electrically coatable, magnetic or magnetisable particles are more easily released from the roll surface to the adhesive layer on the electrically nonconductive support.
  • the magnetic roll preferably immersed in a reservoir in which the electroless and / or electrodepositable, magnetic or magnetizable particles or a dispersion the particles are contained in a solvent.
  • the magnetic roller is mounted on the fly, for example, so that it does not rest on the bottom of the reservoir.
  • the mixture of at least electroless and / or galvanically coatable particles and solvent in the reservoir is kept in motion, for example by stirring or by pumping.
  • particles may optionally be removed by means of a magnetic cleaning of the electrically non-conductive support.
  • the magnetic cleaning takes place, for example, with the aid of a fleece, which orbits a magnet. Due to the magnetic force of the magnet, the unwanted particles settle on the fleece and are thus removed from the electrically non-conductive carrier.
  • electrolessly and / or electrolytically coatable particles after transfer from the transfer medium to the electrically nonconductive support, to be moved by the action of an external force to the side of the base layer facing away from the electrically nonconductive support.
  • the external force with which the electrolessly and / or electrolytically coatable particles are either moved in the direction of the transfer medium or on the side of the base layer facing away from the electrically nonconductive support is, for example, gravity or a magnetic force.
  • the force with which the electrolessly and / or electrolytically coatable, magnetic or magnetizable particles are moved is preferably a magnetic force. Since the magnitude of the magnetic force can be adjusted, it can be ensured hereby that in fact all electrolessly and / or electrolytically coatable, magnetic or magnetizable particles are moved either in the direction of the transfer medium or on the side of the base layer facing away from the electrically nonconductive support ,
  • the electrolessly and / or electrolytically coatable particles may be particles of any geometry from any electrolessly and / or electrolytically coatable material, from mixtures of different electrolessly and / or electrolytically coatable materials or else from mixtures of electrolessly and / or electrolytically coatable and non-electroless and / or galvanically coatable materials.
  • Suitable electroless and / or electrodepositable materials are, for example, carbon, for example carbon black, graphite, carbon nanotubes, electrically conductive metal complexes, conductive organic compounds or conductive polymers or metals, preferably zinc, nickel, copper, tin, cobalt, manganese, iron, magnesium - sium, lead, chromium, bismuth, silver, gold, aluminum, titanium, palladium, platinum, tantalum and alloys thereof or metal mixtures containing at least one of these metals.
  • suitable alloys are CuZn, CuSn, CuNi, SnPb, SnBi, SnCo, NiPb, ZnFe, ZnNi, ZnCo and ZnMn.
  • the electrolessly and / or electrolytically coatable particles are aluminum, iron, copper, nickel, zinc, carbon and mixtures thereof.
  • the electrolessly and / or electrolytically coatable particles preferably have an average particle diameter of from 0.001 to 100 ⁇ m, preferably from 0.005 to 50 ⁇ m and particularly preferably from 0.01 to 10 ⁇ m.
  • the average particle diameter can be determined by means of laser diffraction measurement, for example on a Microtrac X100 device.
  • the distribution of the particle diameter depends on their production method. Typically, the diameter distribution has only one maximum, but several maxima are also possible.
  • the surface of the electrolessly and / or electrolytically coatable particles can at least partially be provided with a coating ("coating").
  • Suitable coatings may be inorganic (for example SiC> 2 , phosphates) or organic in nature.
  • the electrolessly and / or electrolytically coatable particles may also be coated with a metal or metal oxide.
  • the metal may be in partially oxidized form.
  • electrolessly and / or electrolytically coatable particles are to be used, this can be done by mixing these types. It is particularly preferred if the varieties are selected from the group consisting of aluminum, iron, copper, nickel, zinc and carbon.
  • the electroless and / or electrodepositable particles may also include a first metal and a second metal in which the second metal is in the form of an alloy (with the first metal or one or more other metals) or which is electroless and / or electroplated coatable particles contain two different alloys.
  • the material from which the electrolessly and / or electrolytically coatable particles are formed is magnetizable or magnetizable.
  • Suitable materials are, for example, metals such as iron, nickel, cobalt or alloys such as NiFe, NiCuCo, AINiCo, SmCo.
  • Electroless and / or electroplaceable particles can be added to the dispersion in the form of their powders.
  • Such powders for example metal powders, are common commercial products or can be easily prepared by known methods, such as by electrolytic deposition or chemical reduction from solutions of metal salts or by reduction of an oxidic powder, for example by hydrogen, by spraying or atomizing a molten metal, especially in cooling media , for example, gases or water. Preference is given to the gas and water jets and the reduction of metal oxides.
  • Metal powder of the preferred Grain size can also be produced by grinding coarser metal powder. For this purpose, for example, a ball mill is suitable.
  • the carbonyl iron powder process for producing carbonyl iron powder is preferred. This is done by thermal decomposition of iron pentacarbonyl. This is described, for example, in Lijman's Encyclopedia of Industrial Chemistry, 5th Edition, Vol. A14, page 599.
  • the decomposition of the iron pentacarbonyl can be carried out, for example, at elevated temperatures and elevated pressures in a heatable decomposer comprising a tube made of a refractory material such as quartz glass or V2A steel in a preferably vertical position, that of a heating device, for example consisting of heating baths, heating wires or surrounded by a heating medium flows through the heating jacket.
  • the carbonyl iron powder is coated.
  • the coating reduces the adhesion of the carbonyl iron powder to the transfer medium. Also, no dust is formed. By reducing the adhesion, the coated carbonyl iron powder can be removed without residue. This is especially important if the carbonyl iron powder is held on the transfer medium by means of a magnet.
  • the coating may be inorganic and / or organic. In the case of organic coatings, polymers are preferred.
  • Suitable polymers are, for example, polyolefins such as polyethylene and polypropylene, polyamides, polytetrafluoroethylene, polyesters, polyethers, polystyrene, styrene-butadiene block copolymers (for example Styroflex® or Styrolux® from BASF) and silicone polymers.
  • polyolefins such as polyethylene and polypropylene
  • polyamides polytetrafluoroethylene
  • polyesters for example Styroflex® or Styrolux® from BASF
  • silicone polymers for example Styroflex® or Styrolux® from BASF
  • silicone polymers for example, silicone polymers.
  • Polyethylene, polypropylene, polytetrafluoroethylene are preferred.
  • metal oxides such as iron oxides, phosphates and silicates are preferred.
  • the shape of the electrolessly and / or electrolytically coatable particles has an influence on the properties of the dispersion after a coating.
  • the shape of the electrolessly and / or electrolytically coatable particles may be, for example, acicular, cylindrical, plate-shaped or spherical. These particle shapes represent idealized shapes, wherein the actual shape, for example due to production, may vary more or less strongly therefrom.
  • drop-shaped particles in the context of the present invention are a real deviation of the idealized spherical shape.
  • Electroless and / or electroplated particles with different particle shapes are commercially available. If mixtures of electrolessly and / or electrolytically coatable particles are used, the individual mixing partners can also have different particle shapes and / or particle sizes. It is also possible to use mixtures of only one type of electrolessly and / or electrolytically coatable particles having different particle sizes and / or particle shapes. In the case of different particle shapes and / or particle sizes, the metals aluminum, iron, copper, nickel and zinc and carbon are also preferred. In the case of different particle shapes, the combination of platelets and spheres is preferred.
  • the adhesive layer with the electrolessly and / or electrolytically coatable particles adhering thereto be at least partially dried and / or at least partially cured after application.
  • the curing and / or drying takes place, for example, by the action of heat, light (UV) and / or radiation, for example infrared radiation, electron radiation, gamma radiation, X-radiation, microwaves.
  • a suitable activator or hardener must be added.
  • the curing of the combination of different methods can also be achieved, for example by combining UV radiation and heat.
  • UV radiation can initially only harden the layer so that the formed structures no longer flow apart. Thereafter, the layer can be cured by exposure to heat. The heat can be done directly after the UV-curing and / or after the galvanic metallization.
  • the proportion of electrolessly and / or electrolytically coatable particles in the base layer is preferably in the range of 75 to 99.9 wt .-%, particularly preferably in the range of 85 to 99.9 wt .-%.
  • At least one metal layer is formed on the structured or full-surface base layer by electroless and / or galvanic coating.
  • the coating can be carried out by any method known to those skilled in the art. Also, any conventional metal coating can be applied by the method of coating.
  • the composition of the electrolyte solution used for the coating depends on which metal the electrically conductive structures are to be coated on the substrate. In principle, all metals which are nobler or equally noble as the most noble metal of the dispersion can be used for electroless and / or electroplating.
  • Typical metals which are deposited by electroless and / or electroplating on electrically conductive surfaces are for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium.
  • the thicknesses of the one or more deposited layers are within the usual range known to the person skilled in the art and are not essential to the invention.
  • Suitable electrolyte solutions which can be used to coat electrically conductive structures are those skilled in the art, for example, Werner Jillek, Gustl Keller, Manual of printed circuit board technology. Eugen G. Leuze Verlag, 2003, Volume 4, pages 332-352 known.
  • the layer thickness of the metal layer deposited on the electrically conductive structure by the method according to the invention depends on the contact time, which results from the passage speed of the substrate through the device and the number of cathodes positioned behind one another, and the current intensity with which the device is operated.
  • a higher contact time can be achieved, for example, by connecting several galvanic coating devices in series in at least one bath.
  • the electrically non-conductive carrier at its top and its underside with a currentless and / or galvanic coatable structured and / or full-surface base layer can be electrically connected to one another on the upper side and the underside of the carrier.
  • the via it is possible, for example, before or after the electroless and / or galvanic coating to form bores in the carrier, on the wall of which a conductive layer is applied by methods known to those skilled in the art.
  • the electrolessly and / or electrolytically coatable particles contained in the dispersion are at least partially exposed in order to obtain already electrolessly and / or electrolytically coatable nucleation sites at which the following electroless and / or galvanic metallization can deposit the metal ions to form a metal layer.
  • the particles consist of materials which oxidize easily, it may additionally be necessary to at least partially remove the oxide layer beforehand.
  • the removal of the oxide layer can already take place simultaneously with the onset of metallization without an additional process step is required.
  • An advantage that the particles must be exposed before the electroless and / or galvanic metallization is that the exposure of the particles must contain an approximately 5 to 10% by weight lower proportion of electrolessly and / or electrolytically coatable particles in the coating To obtain a continuous electrically conductive surface, as is the case when the particles are not exposed. Further advantages are the homogeneity and consistency of the coatings produced and the high process reliability.
  • the exposure of the electrolessly and / or electrolytically coatable particles can either mechanically, for example by brushing, grinding, milling, sand blasting or irradiation with supercritical carbon dioxide, physically, for example by heating, laser, UV light, corona or plasma discharge, or done chemically.
  • a suitable chemical or chemical mixture for the matrix material.
  • the matrix material can be at least partially dissolved and washed down by a solvent on the surface or can be at least partially destroyed by means of suitable reagents, the chemical structure of the matrix material, whereby the electrolessly and / or galvanically coatable particles be exposed.
  • Reagents that swell the matrix material are also suitable for exposing the electrolessly and / or electrolytically coatable particles.
  • swelling arise cavities in which the deposited metal ions can penetrate from the electrolyte solution, creating a larger Number of electroless and / or electrodepositable particles can be metallized.
  • the adhesion, the homogeneity and the continuity of the subsequently electrolessly and / or electrodeposited metal layer are significantly better than in the methods described in the prior art.
  • the process speed during metallization is also considerably higher, whereby additional cost advantages can be achieved.
  • the electroless and / or electrodepositable particles are preferably exposed to an oxidizing agent.
  • the oxidizing agent breaks up bonds in the matrix material, which allows the binder to be peeled off and thereby expose the particles.
  • Suitable oxidizing agents are, for example, manganates such as potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide, oxygen, oxygen in the presence of catalysts such as manganese, molybdenum, bismuth, tungsten and cobalt salts, ozone, vanadium pentoxide, selenium dioxide, Ammonium polysulfide solution, sulfur in the presence of ammonia or amines, manganese dioxide, potassium ferrate, dichromate / sulfuric acid, chromic acid in sulfuric acid or in acetic acid or in acetic anhydride, nitric acid, hydroiodic acid, hydrobromic acid, pyridinium dichromate, chromic acid-pyridine complex, chromic anhydride, chromium ( VI) oxide, periodic acid, lead tetraacetate, quinone, methylquinone, anthraquinone, bromine, chlorine, fluorine, iron (III) salt solutions
  • manganates such as potassium permanganate, potassium manganate, sodium permanganate; Sodium manganate, hydrogen peroxide, N-methyl-morpholine-N- oxide, percarbonates, for example sodium or potassium percarbonate, perborates, for example sodium or potassium perborate; Persulfates, for example sodium or potassium persulfate; Sodium, potassium and ammonium peroxodis and monosulfates, sodium hypochlorite, urea-hydrogen peroxide adducts, salts of oxohalogenic acids, such as, for example, chlorates or bromates or iodates, salts of halogenated acids, for example sodium periodate or sodium perchlorate, tetrabutylammonium peroxydisulfate, quinones , Iron (III) salt solutions, vanadium pentoxide, pyridinium dichromate, hydrochloric acid, bromine, chlorine, dichromate.
  • Iron (III) salt solutions vanadium pen
  • potassium permanganate potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide and its adducts
  • perborates percarbonates, persulfates, peroxodisulfates, sodium hypochlorite and perchlorates.
  • acidic or alkaline chemicals and / or chemical mixtures are, for example, concentrated or dilute acids, such as hydrochloric acid, sulfuric acid, phosphoric acid or nitric acid. Also organic acids, such as formic acid or acetic acid, may be suitable depending on the matrix material.
  • Suitable alkaline chemicals and / or chemical mixtures are, for example, bases, such as sodium hydroxide solution, potassium hydroxide solution, ammonium hydroxide or carbonates, for example sodium carbonate or potassium carbonate.
  • bases such as sodium hydroxide solution, potassium hydroxide solution, ammonium hydroxide or carbonates, for example sodium carbonate or potassium carbonate.
  • the temperature may be increased during the process.
  • Solvents can also be used to expose the electrolessly and / or electrolytically coatable particles in the matrix material.
  • the solvent must be matched to the matrix material as the matrix material must dissolve in the solvent or swell through the solvent. If a solvent is used in which the matrix material dissolves, the base layer is only brought into contact with the solvent for a short time, so that the upper layer of the matrix material is dissolved and thereby becomes detached.
  • Preferred solvents are xylene, toluene, halogenated hydrocarbons, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), diethylene glycol monobutyl ether.
  • MEK methyl ethyl ketone
  • MIBK methyl isobutyl ketone
  • diethylene glycol monobutyl ether diethylene glycol monobutyl ether.
  • the temperature during the dissolution process can be increased.
  • Suitable mechanical processes include, for example, brushing, grinding, polishing with an abrasive or pressure blasting with a jet of water, sandblasting or blasting with supercritical carbon. dioxide.
  • a suitable abrasive is, for example, pumice.
  • the water jet preferably contains small solid particles, for example pumice flour (Al 2 O 3 ) having an average particle size distribution of 40 to 120 ⁇ m, preferably 60 to 80 ⁇ m, and quartz flour (SiO 2 ) with a particle size> 3 ⁇ m.
  • the oxide layer is at least partially removed.
  • the removal of the oxide layer can take place, for example, chemically and / or mechanically.
  • Suitable substances with which the base layer can be treated to chemically remove an oxide layer from the electroless and / or electrodepositable particles are, for example, acids such as concentrated or dilute sulfuric acid or concentrated or dilute hydrochloric acid, citric acid, phosphoric acid, amidosulfonic acid, formic acid , Acetic acid.
  • Suitable mechanical methods for removing the oxide layer from the electroless and / or electrodepositable particles are generally the same as the mechanical methods of exposing the particles.
  • the process according to the invention for the production of electrically conductive, structured or full surface surfaces on a support can be operated in a continuous, partially continuous or discontinuous manner. It is also possible that only individual steps of the process are carried out continuously while other steps are carried out discontinuously.
  • the inventive method is suitable for example for the production of printed conductors on printed circuit boards.
  • printed circuit boards are, for example, those with multilayer inner and outer layers, micro-via, chip-on-board, flexible and rigid printed circuit boards, and are incorporated, for example, in products such as computers, telephones, televisions, automotive electrical components, keyboards, Radios, video, CD, CD-ROM and DVD players, game consoles, measuring and control devices, sensors, electrical kitchen appliances, electric toys, etc.
  • electrically conductive structures can be coated on flexible circuit carriers.
  • Such flexible circuit carriers are, for example, plastic films made of the materials mentioned above for the carrier, on which electrically conductive structures are printed.
  • the method according to the invention is suitable for the production of RFI D antennas, transponder antennas or other antenna structures, chip card modules, flat cables, seat heaters, foil conductors, printed conductors in solar cells or in LCD or plasma picture screens, capacitors, film capacitors, resistors, convectors or electrical fuses.
  • two or three-dimensional molded interconnect devices can also be produced by the method according to the invention.
  • antennas with contacts for organic electronic components as well as coatings on surfaces consisting of electrically non-conductive material for electromagnetic shielding (shielding) is also possible.
  • a use is further possible in the field of flowfields of bipolar plates for use in fuel cells.
  • the scope of the method according to the invention enables a cost-effective production of metallized, even non-conductive substrates, in particular for use as switches and sensors, absorbers for electromagnetic radiation or gas barriers or decorative parts, especially decorative parts for motor vehicles, sanitary, toy, household and office space and packaging as well as foils. Also in the field of security printing for bills, credit cards, identity papers, etc., the invention may find application. Textiles can be electrically and magnetically functionalized using the method according to the invention (antennas, transmitters, RFID and transponder antennas, sensors, heating elements, anti-static (also for plastics), shielding, etc.).
  • the inventive method can also be used for the metallization of holes, vias, blind holes, etc., for example, in printed circuit boards, RFID antennas or transponder antennas, flat cables, foil conductors with the aim of a through-connection of the upper and lower PCB side. This also applies if other substrates are used.
  • the metallized articles produced according to the invention - insofar as they comprise magnetizable metals - are used in areas of magnetizable functional parts, such as magnetic boards, magnetic games, magnetic surfaces, for example in the case of refrigerator doors. In addition, they find application in areas in which a good thermal conductivity is advantageous, for example in films for seat heaters, underfloor heating and insulation materials.
  • Preferred uses of the surfaces metallized according to the invention are those in which the products thus produced are printed circuit boards, RFI D antennas, transponder antennas, seat heating, flat cables, contactless chip cards, thin metal foils or polymer carriers coated on one or two sides, foil conductors, conductor tracks in solar cells or in LCD or plasma screens or as a decorative application such as for packaging materials.
  • An advantage of the method according to the invention is that a sufficient coating is possible even when using materials for the electrolessly and / or electrolytically coatable particles which easily oxidize.
  • FIGS. 1.1 and 1.2 show the transfer of electrolessly and / or electrolytically coatable particles to an electrically nonconductive support provided with an adhesive layer in a first embodiment
  • FIG. 2 shows the transfer of electrolessly and / or electrolytically coatable particles onto an electrically nonconductive support provided with an adhesive layer in a second embodiment
  • FIG. 3 shows an electrically non-conductive carrier with a base layer applied thereon
  • FIGS. 4.1 to 4.3 the application of electrolessly and / or electrolytically coatable particles to an electrically nonconductive support provided with an adhesive layer in a third embodiment
  • FIG. 5 shows the application of electrolessly and / or electrolytically coatable particles to an electrically nonconductive support provided with an adhesive layer in a fourth embodiment
  • FIGS. 1.1 and 1.2 the application of electrolessly and / or electrolytically coatable particles to an electrically non-conductive carrier provided with an adhesive layer is shown in a first embodiment.
  • an adhesive layer 3 is applied on an electrically non-conductive support 1.
  • the adhesive layer 3 has the structure of the electrically conductive surface which is to be produced.
  • a layer 7 which contains electrolessly and / or electrolytically coatable particles is applied to a transfer medium 5, wherein the electrolessly and / or electrolytically coatable particles are preferably contained in the layer 7 as a monolayer.
  • the electrically nonconductive support 1 with the adhesive layer 3 and the transfer medium 5 are brought into contact with the layer 7 containing the electrolessly and / or electrolytically coatable particles in such a way that the layer 7 containing the electrolessly and / or electrolytically coatable particles contacts the adhesive layer 3.
  • the electrolessly and / or electrolytically coatable particles are transferred from the layer 7 to the adhesive layer 3.
  • the adhesion forces of the adhesive layer 3 are greater than those of the layer 7.
  • the electrolessly and / or electrolytically coatable particles can adhere to the layer 7 with the aid of a polymer layer that has not fully cured and / or dried. It is also possible for the electrolessly and / or electrolytically coatable particles to adhere to the transfer medium 5 as a layer 7 by magnetic force.
  • the electrically nonconductive support and the transfer medium 5 are pressed against one another, wherein the electrically nonconductive support 1 and the transfer medium 5 are aligned that the adhesive layer 3 and the electrolessly and / or electrolytically coatable particles Assign layer 7 to each other.
  • the movement of the carrier 1 and the transfer medium 5 is shown towards each other.
  • the adhesive of the adhesive layer 3 hardens and / or dried.
  • the electrolessly and / or electrolytically coatable particles from the layer 7 are bonded to the adhesive layer 3.
  • FIG. 1.2 shows the method step in which, after transferring the layer 7 containing the electrolessly and / or electrolytically coatable particles to the adhesive layer 3 of the electrically nonconductive carrier 1, the transfer medium 5 is lifted off the electrically nonconductive carrier.
  • the movement of the electrically non-conductive support 1 and the transfer medium 5 is shown by the arrows 13 and 15.
  • FIG. 1.2 it can be seen that at the positions where the adhesive layer 3 is applied to the electrically non-conductive carrier 1, the layer 7 has been detached from the transfer medium 5 and adheres to the adhesive layer 3.
  • a base layer is produced on the electrically nonconductive support 1, which contains electrolessly and / or electrolytically coatable particles and can be electrolessly and / or electroplated.
  • FIG. 2 the method step in which electrolessly and / or electrolytically coatable particles are transferred from a transfer medium to the electrically nonconductive carrier is shown in a second embodiment.
  • the transfer medium 5 is designed as an endless belt 15.
  • the endless belt 15 rotates two shafts 17, 19. In order for the endless belt 15 to move, at least one of the shafts 17, 19 is driven. However, it is also possible that both shafts 17, 19 are driven.
  • the endless belt 15 rotates two shafts 17, 19, it is also possible that instead of the endless belt 15, which rotates the shafts 17, 19 a single shaft is provided, which acts as a transfer medium. Likewise, several individual waves can be arranged one behind the other. Furthermore, it is also possible that instead of two shafts 17, 19 an arbitrarily large number of waves is used, which circulates the endless belt 15.
  • the endless belt 15 is brought into contact with the layer 7 with the adhesive layer 3 on the electrically non-conductive support 1.
  • the electrolessly and / or electrolytically coatable particles are transferred from the layer 7 to the adhesive layer 3.
  • the endless belt 15 moves at the same speed as the electrically non-conductive carrier 1.
  • the movement of the endless belt 15 is represented by an arrow 21 and the movement of the electrically non-conductive carrier 1 by an arrow 23.
  • the removal of the endless belt 15 with the layer 7 applied thereon, which contains the electrolessly and / or electrolytically coatable particles, takes place in that the endless belt 15 is deflected via the shaft 19, while the electrically non-conductive carrier 1 continues, for example The same direction is moved as during the contact with the endless belt 15.
  • the layer 7, the currentless and / or galvanic contains coatable particles.
  • the adhesive layer 3 receives a surface which can be electrolessly and / or electroplated.
  • the still adhering to the endless belt 15 parts of the layer 7 are removed from the endless belt 15. This is done, for example, with the aid of a doctor blade 25 which brushes over the endless belt 15.
  • any other device known to a person skilled in the art with which a layer 7 can be removed from the endless belt 15 is also suitable.
  • the removal of the remainders of the layer 7 from the endless belt is necessary, so that when the layer 7 is applied to the endless belt again only one layer 7 is formed which preferably contains the electrolessly and / or electrolytically coatable particles as a monolayer. If the remainders of the layer 7 are not removed from the endless belt 15 after detachment from the electrically nonconductive support 1, then the remainders of the previous circulation could be superimposed by the re-applied layer 7, thus producing a multilayer, uneven layer, which generates the currentless and / or or galvanically coatable particles.
  • FIG. 3 shows an electrically nonconductive carrier with a base layer formed thereon.
  • the adhesive layer 3 is applied to the electrically non-conductive support 1, which has the structure of the electrically conductive surface to be generated.
  • a layer 33 which contains the electrolessly and / or electrolytically coatable particles, adheres to the adhesive layer 3.
  • This layer has the same structure as the adhesive layer.
  • the adhesive layer 3 and the layer 33 adhering thereto, which de-energize and / or galvanically coatable particles together form a base layer 31.
  • the electrolessly and / or electrolytically coatable particles in the layer 33 are preferably accommodated in such a way that they adhere to the electrically non-conductive carrier 1 remote side of the base layer 31 are located.
  • the electrolessly and / or electrolytically coatable particles are preferably contained in the base layer 31 such that they are visible on the surface 35 of the base layer 31.
  • electrolessly and / or electrolytically coatable particles are not visible or only to a small extent visible, it is possible to expose them.
  • the exposure can be done, for example, mechanically, physically or chemically
  • FIGS. 4.1 to 4.3 show the method for applying the electrolessly and / or electrolytically coatable particles to the electrically non-conductive carrier in a third embodiment.
  • electrolessly and / or electrolytically coatable particles 41 are first applied to the transfer medium 5 as a layer, preferably as a monolayer.
  • the electrolessly and / or electrolytically coatable particles 41 are held in a reservoir 43 from which they are supplied to the transfer medium 5.
  • the particles 41 can be applied to the transfer medium by means of printing, pouring, doctoring or spraying methods.
  • a magnet 45 is arranged on the side of the transfer medium 5 remote from the electrolessly and / or electrolytically coatable particulate 41.
  • the magnet may be both a permanent magnet and an electromagnet.
  • the electrolessly and / or electrolytically coatable particles 41 are held on the transfer medium 5.
  • the electrolessly and / or electrolytically coatable particles 41 it is necessary for the electrolessly and / or electrolytically coatable particles 41 to be formed from a magnetic or magnetizable material.
  • FIG. 4.2 shows the point in time shortly before the electrically nonconductive carrier 1 with the adhesive layer 3 applied thereto is brought into contact with the electrolessly and / or electrolytically coatable particles 41 on the transfer medium 5.
  • the magnetic force of the magnet 45 is selected such that it is smaller than the adhesive force of the adhesive layer 3.
  • the adhesive of the adhesive layer 3 after contact with the electroless and / or galva- Firstly at least partially curing and / or at least partially drying the electrically coatable particles 41 before the electrically nonconductive support 1 together with the adhesive layer 3 and the electrolessly and / or electrolytically coatable particles 41 adhering thereto is lifted off the transfer medium 5.
  • FIG. 4.3 shows the time point shortly after lifting off the electrically nonconductive carrier 1 with the adhesive layer 3 applied thereon and adhering electrolessly and / or electrolytically coatable particles 41 from the transfer medium 5.
  • the transfer medium 5 may, for example, be designed as a plate which is brought into contact with the electrically nonconductive support 1 or, as shown in FIG. 2, as an endless belt.
  • the transfer medium 5 is embodied as an endless belt, the magnet 45 is preferably arranged between the shafts 17, 19, which circumscribe the endless belt 15.
  • FIG. 1 A fourth embodiment in which the electrolessly and / or electrolytically coatable particles are held on the transfer medium by means of magnetic force is shown in FIG.
  • the transfer medium 5 is designed in the form of a hollow shaft 51. Inside the hollow shaft 51, an occupation magnet 53 and transmission magnet 55 are accommodated. With the help of the loading magnet 53, the electrolessly and / or electrolytically coatable particles 41 are attracted to the hollow shaft 51 and adhere to this. Due to the magnetic field of the transmission magnet 55, the electrolessly and / or electrolytically coatable particles 41 are held on the hollow shaft 51.
  • the magnetic force of the transmission magnet 55 is, however, chosen so that the electroless and / or electrodepositable particles 41, which come into contact with the adhesive layer 3 on the electrically non-conductive support 1, adhere to the adhesive layer 3 and not due to the strong magnetic force of the transfer magnet 55 are removed again from the adhesive layer 3 and continue to adhere to the hollow shaft 51.
  • the embodiment as shown in Figure 5, with loading magnet 53 and transmission magnet 55, it is also possible to provide only one magnet or more than two magnets.
  • the magnetic force in the area of the transfer of the electrolessly and / or electrolytically coatable particles 41 from the hollow shaft 51 to the adhesive layer 3 on the electrically nonconductive support 1 is smaller than the adhesion force of the adhesive layer 3
  • the contact of the electroless and / or electroplated particles 41 adhering to the hollow shaft 51 with the adhesive layer 3 on the electrically nonconductive support 1 further on the hollow shaft 51 adhering electroless and / or electrodepositable particles 41 are preferably before re-covering the hollow shaft 51st initially removed from the hollow shaft 51. This is done, for example, with the aid of a coil 57 which has an alternating field. is shaped. Through the alternating field 57, the hollow shaft 51 is demagnetized.
  • the electrolessly and / or electrolytically coatable particles 41 previously adhering to the hollow shaft 51 are detached from the hollow shaft 51.
  • the electrolessly and / or electrolytically coatable particles adhering to the hollow shaft 51 can also be removed by a squeegee or by gravity.
  • the hollow shaft 51 immersed in the embodiment shown in Figure 5 in a reservoir 59, in which the electrolessly and / or electroplated particles 41 are added. With the help of the loading magnet 53, the electrolessly and / or electrolytically coatable particles 41 are attracted to the hollow shaft 51 from the reservoir 59.
  • the electrolessly and / or electrolytically coatable particles 41 can be present both as a powder or as a dispersion in the reservoir. In the case of a dispersion, it is preferred if the dispersion is stirred and tempered in the reservoir. After being occupied by the coating magnet 53 and before the electrolessly and / or electrolytically coatable particles 41 are transferred to the adhesive layer 3, the volatile constituents of the dispersion can be removed, for example, at least partially by a drying step, which is not shown in FIG.
  • the coverage of the hollow shaft 51 with the electrolessly and / or electrolytically coatable particles 41 can be optically controlled, for example, by means of a laser optics, which is not shown in FIG. Due to the strength of the applied magnetic field, the layer thickness of the particles can be adjusted so that only a single particle layer is transferred.
  • FIG. 5 shows a magnetic cleaning.
  • a hollow shaft 61 provided with a fleece circumscribes a magnet 63.
  • the magnet 63 attracts electrolessly and / or electrolytically coatable particles which do not adhere to the adhesive layer 3 and subsequently remove them with the aid of the fleece of the hollow shaft 61.
  • a hollow shaft 51 with internal magnets 53, 55, 57 it is also possible to manufacture the hollow shaft 51 from a magnetic material or to cover it with a magnetic film on which the electrolessly and / or galvanically coated adhere to the particles. After transfer to the adhesive layer 3 of the electrically non-conductive support 1, such a hollow shaft 51 is preferably cleaned mechanically, for example with a doctor blade.
  • FIGS. 6.1 to 6.3 show the method step for the transfer of electrolessly and / or electrolytically coatable particles to the electrically non-conductive carrier in a fifth embodiment.
  • the electrolessly and / or electrolytically coatable particles 41 are first applied as a dispersion 71 to the transfer medium 5 to form a layer 73.
  • the electrolessly and / or electrolytically coatable particles 41 contained in the dispersion 71 are moved in the direction of the transfer medium 5 by means of a magnet 75.
  • a layer of the electrolessly and / or electrolytically coatable particles 41 forms, wherein the electrolessly and / or electrolytically coatable particles 41 contact the transfer medium 5.
  • the electrically non-conductive carrier 1 is brought into contact with the layer 73 with the adhesive layer 3 applied thereon.
  • This step is shown in Figure 6.2.
  • the layer 73 and / or the adhesive layer 3 need not be at least partially cured and / or at least partially dried become.
  • the layer 73 with the electrolessly and / or electrolytically coatable particles 41 is transferred only at the positions to the electrically nonconductive support 1 on which the adhesive layer 3 is located, it is necessary that the adhesion of the layer 73 to the electroless and / or electrolytically coatable particles 41 on the transfer medium 5 is smaller than the adhesion of the layer 73 with the electroless and / or electrodepositable particles 41 on the adhesive layer 3.
  • the adhesive layer 3 with the layer 73 adhering thereto and the electrolessly and / or electrically coatable particle 41 are at least partially cured and / or at least partially dried. Because the electrolessly and / or electroplated particles 41 are According to the invention, the electrolessly and / or electrolytically coatable particles 41 are located after the transfer of the layer 73 with the electrolessly and / or electrolytically coatable particles in the direction of the transfer medium 5 with the aid of the magnetic force of the magnet 75 41 on the adhesive layer 3 of the electrically non-conductive support 1 on the side facing away from the electrically non-conductive support 1 side of the base layer 31.
  • the electroless and / or electrodepositable particles 41 can thus easily electrolessly and / or galvanically coated with a metal layer.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé servant à produire des surfaces électroconductrices structurées sur un support non électroconducteur (1) et comprenant les étapes suivantes : (a) application sur le support non électroconducteur (1) d'une couche adhésive (3) présentant la structure de la surface électroconductrice; (b) transfert de particules (41) pouvant être revêtues galvaniquement et/ou sans courant d'un milieu de transfert (5) vers la couche adhésive (3), les particules (41) pouvant être revêtues galvaniquement et/ou sans courant étant déposées sous forme de couche sur le milieu de transfert (5); (c) enlèvement du milieu de transfert (5); (d) séchage au moins partiel et/ou durcissement au moins partiel de l'adhésif de la couche adhésive (3), les particules (41) pouvant être revêtues galvaniquement et/ou sans courant étant ainsi liées à la couche adhésive (3) et formant ainsi une couche de base (31); (e) dépôt par revêtement galvanique et/ou sans courant d'une couche métallique sur les particules (41) pouvant être revêtues galvaniquement et/ou sans courant qui adhèrent au support non électroconducteur (1) grâce à la couche adhésive (3).
PCT/EP2007/061873 2006-11-06 2007-11-05 Procédé pour produire des surfaces électroconductrices structurées Ceased WO2008055867A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06123508 2006-11-06
EP06123508.1 2006-11-06

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WO2008055867A1 true WO2008055867A1 (fr) 2008-05-15

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WO (1) WO2008055867A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011026760A1 (fr) 2009-09-04 2011-03-10 Basf Se Procédé de fabrication de surfaces électriquement conductrices
DE102014017746A1 (de) * 2014-12-01 2016-06-02 Pi Ceramic Gmbh Keramische Technologien Und Bauelemente Aktuatorvorrichtung
JP2018500758A (ja) * 2014-12-01 2018-01-11 ピーアイ セラミック ゲーエムベーハーＰｉ Ｃｅｒａｍｉｃ Ｇｍｂｈ アクチュエータ装置
CN110741737A (zh) * 2017-05-31 2020-01-31 克里奥瓦克有限公司 电子装置、用于制造电子装置的方法和设备及其组合物

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KR101896435B1 (ko) * 2016-11-09 2018-09-07 엔트리움 주식회사 전자파차폐용 전자부품 패키지 및 그의 제조방법

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EP0414362A2 (fr) * 1989-08-22 1991-02-27 Hewlett-Packard Company Procédé pour la formation des traces conductives sur un substrat
US20050153249A1 (en) * 2004-01-13 2005-07-14 Kabushiki Kaisha Toshiba Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic component
DE102004019412A1 (de) * 2004-04-19 2005-11-03 Man Roland Druckmaschinen Ag Verfahren zum Drucken elektrischer und/oder elektronischer Strukturen und Folie zur Verwendung in einem solchen Verfahren
DE102005019983A1 (de) * 2005-04-27 2006-11-02 Basf Ag Verfahren zur Herstellung metallisierter, extrudierter Kunststoff-Gegenstände

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EP0414362A2 (fr) * 1989-08-22 1991-02-27 Hewlett-Packard Company Procédé pour la formation des traces conductives sur un substrat
US20050153249A1 (en) * 2004-01-13 2005-07-14 Kabushiki Kaisha Toshiba Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic component
DE102004019412A1 (de) * 2004-04-19 2005-11-03 Man Roland Druckmaschinen Ag Verfahren zum Drucken elektrischer und/oder elektronischer Strukturen und Folie zur Verwendung in einem solchen Verfahren
DE102005019983A1 (de) * 2005-04-27 2006-11-02 Basf Ag Verfahren zur Herstellung metallisierter, extrudierter Kunststoff-Gegenstände

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011026760A1 (fr) 2009-09-04 2011-03-10 Basf Se Procédé de fabrication de surfaces électriquement conductrices
DE102014017746A1 (de) * 2014-12-01 2016-06-02 Pi Ceramic Gmbh Keramische Technologien Und Bauelemente Aktuatorvorrichtung
JP2018500758A (ja) * 2014-12-01 2018-01-11 ピーアイ セラミック ゲーエムベーハーＰｉ Ｃｅｒａｍｉｃ Ｇｍｂｈ アクチュエータ装置
US10770508B2 (en) 2014-12-01 2020-09-08 Pi Ceramic Gmbh Actuator device
DE102014017746B4 (de) 2014-12-01 2021-10-21 Pi Ceramic Gmbh Aktuatorvorrichtung
CN110741737A (zh) * 2017-05-31 2020-01-31 克里奥瓦克有限公司 电子装置、用于制造电子装置的方法和设备及其组合物
EP3636052A4 (fr) * 2017-05-31 2021-02-24 Cryovac, LLC Dispositif électronique, procédé et appareil de production d'un dispositif électronique, et composition associée
US11240916B2 (en) 2017-05-31 2022-02-01 Cryovac, Llc Electronic device, method and apparatus for producing an electronic device, and composition therefor

Also Published As

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