[go: up one dir, main page]

WO2008043528A3 - Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten - Google Patents

Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten Download PDF

Info

Publication number
WO2008043528A3
WO2008043528A3 PCT/EP2007/008780 EP2007008780W WO2008043528A3 WO 2008043528 A3 WO2008043528 A3 WO 2008043528A3 EP 2007008780 W EP2007008780 W EP 2007008780W WO 2008043528 A3 WO2008043528 A3 WO 2008043528A3
Authority
WO
WIPO (PCT)
Prior art keywords
silver
electrolyte composition
cyanide
substrates
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/008780
Other languages
English (en)
French (fr)
Other versions
WO2008043528A2 (de
Inventor
Stefan Schaefer
Thomas Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Priority to US12/445,049 priority Critical patent/US9212427B2/en
Priority to KR1020097009568A priority patent/KR101409701B1/ko
Priority to EP07818853.9A priority patent/EP2089561B1/de
Priority to CN2007800454144A priority patent/CN101627150B/zh
Priority to JP2009531764A priority patent/JP5439181B2/ja
Publication of WO2008043528A2 publication Critical patent/WO2008043528A2/de
Anticipated expiration legal-status Critical
Publication of WO2008043528A3 publication Critical patent/WO2008043528A3/de
Priority to US14/962,863 priority patent/US9657402B2/en
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Die vorliegende Erfindung betrifft eine cyanidfreie Elektrolytzusammensetzung zur Abscheidung einer Silber- oder Silberlegierungsschicht auf einem Substrat. Darüber hinaus betrifft die vorliegende Erfindung ein Verfahren zur Abscheidung solcher Schichten unter Verwendung der erfindungsgemäßen cyanidfreien Elektrolytzusammensetzung. Die erfindungsgemäße Elektrolytzusammensetzung weist wenigstens eine Silberionenquelle, eine Sulfonsäure und/oder ein Derivat einer Sulfonsäure, ein Netzmittel sowie ein Hydantoin auf. Die aus einer solchen Elektrolytzusammensetzung mittels des erfindungsgemäßen Verfahrens abgeschiedenen Silber- oder Silberlegierungsschichten sind matt und duktil.
PCT/EP2007/008780 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten Ceased WO2008043528A2 (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/445,049 US9212427B2 (en) 2006-10-09 2007-10-09 Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
KR1020097009568A KR101409701B1 (ko) 2006-10-09 2007-10-09 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법
EP07818853.9A EP2089561B1 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten
CN2007800454144A CN101627150B (zh) 2006-10-09 2007-10-09 无氰电解液组合物及在基板沉积银或银合金镀层的方法
JP2009531764A JP5439181B2 (ja) 2006-10-09 2007-10-09 基板に銀あるいは銀合金層を堆積するためのシアン化物非含有電解質組成物および方法
US14/962,863 US9657402B2 (en) 2006-10-09 2015-12-08 Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06021174A EP1918426A1 (de) 2006-10-09 2006-10-09 Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
EP06021174.5 2006-10-09

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/445,049 A-371-Of-International US9212427B2 (en) 2006-10-09 2007-10-09 Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substrates
US14/962,863 Continuation US9657402B2 (en) 2006-10-09 2015-12-08 Cyanide-free electrolyte composition and method for the deposition of silver or silver alloy layers on substrates

Publications (2)

Publication Number Publication Date
WO2008043528A2 WO2008043528A2 (de) 2008-04-17
WO2008043528A3 true WO2008043528A3 (de) 2009-04-16

Family

ID=37806683

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/008780 Ceased WO2008043528A2 (de) 2006-10-09 2007-10-09 Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten

Country Status (6)

Country Link
US (2) US9212427B2 (de)
EP (2) EP1918426A1 (de)
JP (1) JP5439181B2 (de)
KR (1) KR101409701B1 (de)
CN (1) CN101627150B (de)
WO (1) WO2008043528A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten
DE102009029558A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
RU2536127C2 (ru) * 2010-03-09 2014-12-20 Общество с ограниченной ответственностью "Санкт-Петербургский Центр "ЭЛМА (Электроникс Менеджмент)" Кислый электролит для серебрения
JP5854726B2 (ja) 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ニッケル上に銀ストライクを電気めっきする方法
US20160032479A1 (en) * 2013-03-15 2016-02-04 Enthone Inc. Electrodeposition of silver with fluoropolymer nanoparticles
DE102015008686A1 (de) 2015-07-02 2017-01-05 ORU e.V. Cyanidfreie, wässrige elektrolytische Zusammensetzung
CN105420770A (zh) * 2015-11-30 2016-03-23 苏州市金星工艺镀饰有限公司 一种防变色无氰镀银电镀液及其电镀方法
CN105350037A (zh) * 2015-12-17 2016-02-24 宏正（福建）化学品有限公司 一种碱性无氰镀锌镍合金镀液及其电镀工艺
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
CN112469847A (zh) * 2018-08-21 2021-03-09 优美科电镀技术有限公司 用于银的无氰化物沉积的电解质
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU724606A1 (ru) * 1978-03-20 1980-03-30 Институт общей и неорганической химии АН Украинской ССР Электролит серебрени
JPH0361393A (ja) * 1989-07-28 1991-03-18 Daiichi Koushiyou Kk 銀めっき法
JPH06330372A (ja) * 1993-05-20 1994-11-29 Electroplating Eng Of Japan Co ノンシアン銀めっき浴及びその銀めっき方法
JPH1121693A (ja) * 1997-07-01 1999-01-26 Daiwa Kasei Kenkyusho:Kk 錫−銀合金めっき浴及びめっき物
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
WO2005083156A1 (en) * 2004-02-24 2005-09-09 Technic, Inc. Non-cyanide silver plating bath composition

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246077A (en) 1975-03-12 1981-01-20 Technic, Inc. Non-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compounds
US4126524A (en) 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
US4161432A (en) * 1975-12-03 1979-07-17 International Business Machines Corporation Electroplating chromium and its alloys
JPS5293638A (en) * 1976-02-04 1977-08-06 Hitachi Ltd Silver plating solution
US4461680A (en) * 1983-12-30 1984-07-24 The United States Of America As Represented By The Secretary Of Commerce Process and bath for electroplating nickel-chromium alloys
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法
JP3481020B2 (ja) * 1995-09-07 2003-12-22 ディップソール株式会社 Ｓｎ−Ｂｉ系合金めっき浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JPH10121289A (ja) 1996-10-18 1998-05-12 Electroplating Eng Of Japan Co 非シアン系銀めっき浴
CN1163633C (zh) 1997-10-02 2004-08-25 戈尔德施米特股份公司 制备银化合物的方法
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
DE10026680C1 (de) 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
US20030159938A1 (en) * 2002-02-15 2003-08-28 George Hradil Electroplating solution containing organic acid complexing agent
TWI229150B (en) * 2003-03-05 2005-03-11 Tdk Corp Rare earth metal magnet and plating bath
CN100355944C (zh) * 2005-01-17 2007-12-19 上海大学 用于无氰镀银的光亮剂及其制备方法
EP1918426A1 (de) * 2006-10-09 2008-05-07 Enthone, Inc. Cyanidfreie Elektrolytzusammensetzung und Verfahren zur Abscheidung von Silber- oder Silberlegierungsschichten auf Substraten

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU724606A1 (ru) * 1978-03-20 1980-03-30 Институт общей и неорганической химии АН Украинской ССР Электролит серебрени
JPH0361393A (ja) * 1989-07-28 1991-03-18 Daiichi Koushiyou Kk 銀めっき法
JPH06330372A (ja) * 1993-05-20 1994-11-29 Electroplating Eng Of Japan Co ノンシアン銀めっき浴及びその銀めっき方法
JPH1121693A (ja) * 1997-07-01 1999-01-26 Daiwa Kasei Kenkyusho:Kk 錫−銀合金めっき浴及びめっき物
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
WO2005083156A1 (en) * 2004-02-24 2005-09-09 Technic, Inc. Non-cyanide silver plating bath composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 198045, Derwent World Patents Index; AN 1980-80449C, XP002515484 *

Also Published As

Publication number Publication date
KR101409701B1 (ko) 2014-06-19
US9657402B2 (en) 2017-05-23
CN101627150A (zh) 2010-01-13
CN101627150B (zh) 2011-06-22
KR20090073220A (ko) 2009-07-02
US20160122890A1 (en) 2016-05-05
WO2008043528A2 (de) 2008-04-17
EP2089561B1 (de) 2016-03-09
EP2089561A2 (de) 2009-08-19
US9212427B2 (en) 2015-12-15
EP1918426A1 (de) 2008-05-07
JP2010506048A (ja) 2010-02-25
US20100044239A1 (en) 2010-02-25
JP5439181B2 (ja) 2014-03-12

Similar Documents

Publication Publication Date Title
WO2008043528A3 (de) Cyanidfreie elektrolytzusammensetzung und verfahren zur abscheidung von silber- oder silberlegierungsschichten auf substraten
TW200639269A (en) Plating method
TW200513549A (en) Electroplating composite substrates
WO2009120344A3 (en) Methods for coating a substrate
WO2008127112A3 (en) Electrodeposition
WO2011014245A3 (en) Method for fabricating copper-containing ternary and quaternary chalcogenide thin films
WO2007147603A3 (de) Wässriges alkalisches, cyanidfreies bad zur galvanischen abscheidung von zink- und zinklegierungsüberzügen
WO2007111676A3 (en) Method of direct plating of copper on a substrate structure
WO2007111779A8 (en) Method of integrating peald ta-containing films into cu metallization
WO2008013516A3 (en) Seed layers, cap layers, and thin films and methods of making thereof
WO2007002070A3 (en) Zinc-nickel alloy electroplating system
EP1626039A3 (de) Verfahren zur Beschichtung von komplex geformten Strukturen
WO2011153095A3 (en) Metal gate structures and methods for forming thereof
WO2008153356A3 (en) Transparent conductive layer and preparation method thereof
TW200741972A (en) Semiconductor device and method for making the same
WO2009004774A1 (ja) 金属積層ポリイミド基盤及びその製造方法
WO2007127363A3 (en) Coatings containing multiple drugs
MX2012001920A (es) Sintesis de rocio termico directo de componentes de bateria de ion li.
TW200513546A (en) Catalyst composition and deposition method
TW200833608A (en) Indium compositions
MX2011006658A (es) Metodos para pasivar un sustrato metalico y sustratos metalicos recubiertos relacionados.
WO2009125143A3 (fr) Procede de formation d'une couche d'amorcage de depot d'un metal sur un substrat
WO2009046476A8 (de) Verfahren zur herstellung eines gleitlagerelements mit einer bismuthaltigen gleitschicht
TW200734472A (en) Flexible metal clad laminate and method for manufacturing the same
PL1883714T3 (pl) Zespolone tworzywo warstwowe do łożysk ślizgowych, zastosowanie i sposób wytwarzania

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780045414.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07818853

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2009531764

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 3045/DELNP/2009

Country of ref document: IN

Ref document number: 1020097009568

Country of ref document: KR

Ref document number: 2007818853

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12445049

Country of ref document: US