WO2008041445A1 - Work cleaning method - Google Patents

Abstract

An adhesive tape (T) is locally adhered by targeting a foreign material attached to a substrate (w), i.e., a work, and the adhesive tape (T) is removed to transfer the foreign material onto the adhesive tape (T) and the foreign material is removed from the substrate (w). Preferably, a pressing member (26) is relatively shifted along the substrate surface by pressing the adhesive tape (T) by the pressing member (26) from a nonadhesive surface, and at the same time, the adhesive tape (T) is adhered to the substrate (w) while feeding the tape from an adhesive tape feeding means with the relative shift of the pressing member (26), and the adhesive tape (T) is removed and recovered.

Description

 Specification

 Work cleaning method Technical field

 The present invention relates to a work cleaning method for removing foreign matters such as particles and dust adhering to a work such as a semiconductor wafer, a liquid crystal panel, a multilayer substrate and a lead frame.

 Background art

 In a substrate such as a semiconductor wafer, an oxide film is formed by rubbing the tip of a probe needle against a bump electrode made of, for example, aluminum for confirming the operation of a semiconductor element or the like formed on the surface of the substrate. Etc. are removed to establish electrical continuity with the electrode (see, for example, Patent Document 1).

 [0003] In such an inspection process, the oxide film fragments released from the electrodes by rubbing the probe needle become foreign matters and remain attached to the substrate. Therefore, since it affects the reliability of the package formed after the subsequent steps, it is necessary to remove this foreign matter. As a means for removing the foreign matter remaining on the substrate, a means for cleaning the substrate, a means for attaching and peeling the adhesive tape to the entire surface of the substrate, transferring the foreign matter to the adhesive tape and removing it, etc. are appropriately selected. Yes.

 Patent Document 1: Japanese Patent Laid-Open No. 11 133116 [paragraphs (0002) to (0005)]

 Disclosure of the invention

 Problems to be solved by the invention

[0004] Some substrates, such as semiconductor wafers, are not resistant to cleaning, and foreign substances are removed from such substrates by attaching and peeling an adhesive tape on the substrate. However, in recent years, when adhesive tape is applied to and peeled from the entire surface of large and thin substrates, there is a high risk of damage to the substrate due to the pressing force during application and the release stress during removal. . In other words, careful sticking and peeling of the adhesive tape is required, and processing takes time.

[0005] In addition, there is a risk that the organic substance that is the adhesive of the adhesive tape may remain on the substrate and contaminate the substrate. There is. Furthermore, in order to affix the adhesive tape to the entire surface of the substrate, it is necessary to use an adhesive tape with a width equal to or larger than the outer diameter of the substrate, and a large amount of adhesive tape is used for large substrates. If you increase the amount, it will cause problems!

[0006] The present invention has been made in view of such a situation, and is capable of accurately and efficiently removing foreign substances adhering to a workpiece such as various substrates and lead frames using an adhesive tape. The main purpose is to provide a method.

 Means for solving the problem

[0007] A first invention is a work cleaning method for removing foreign matter adhering to a work,

 It is characterized by sticking a sticky tape locally aiming at the foreign matter adhering to the workpiece, and removing the sticky tape from the workpiece by transferring the foreign matter to the sticky tape.

 [0008] According to this method invention, since the adhesive tape is applied only to the portion where the foreign matter is adhered, the adhesive tape is not used more than necessary. That is, the transferred material from the adhesive tape can be suppressed as much as possible, and foreign matter can be removed. As a result, the pressing force at the time of sticking the adhesive tape and the peeling stress at the time of peeling of the adhesive tape can be reduced, so that the work can be suppressed from being damaged. Also, the amount of adhesive tape used can be reduced.

[0009] A second invention is the above first invention, wherein

 The pressure-sensitive adhesive tape is pressed from the non-adhesive surface with a pressing member, and the pressure-sensitive adhesive tape is affixed to a place where foreign matter adheres to the workpiece, the pressure member is released, the pressure-sensitive adhesive tape is peeled off, and the peeled pressure-sensitive adhesive tape is collected. It is characterized by that.

[0010] According to this method invention, the adhesive tape is pressed and pasted only on the part where the foreign matter is adhered, and the adhesive tape attached to the shellfish is peeled off and collected to be transferred to the adhesive tape. Foreign materials can be collected with adhesive tape.

 [0011] A third invention is the above first invention, wherein

While pressing the adhesive tape from the non-adhesive surface with the pressing member, the pressing member is relatively moved along the work surface, and the adhesive tape is provided in conjunction with the relative movement of the pressing member. It is characterized in that the adhesive tape is affixed to the work while being fed out from the feeding means, and the adhesive tape is peeled off and collected.

 [0012] According to this method invention, even if the adhesion range of foreign matter is wide, the adhesive tape can be attached to the desired range by sliding movement.

[0013] A fourth invention is the above first invention, wherein

 The pressure-sensitive adhesive tape peeled off from the work is wound up and collected with the pressure-sensitive adhesive surface facing inward.

 [0014] According to this method invention, it is possible to collect the foreign matter transferred to the adhesive tape without peeling off and scattering. Therefore, the foreign matter removed from the workpiece is prevented from dropping and reattaching to the workpiece.

[0015] A fifth invention is the above first invention, wherein

 The foreign matter adhering to the workpiece is detected by the foreign matter inspection means, and the positional information on the foreign matter attachment position is obtained. Based on the acquired information, the adhesive tape is applied to the foreign matter attachment portion of the work. It is characterized by performing attachment peeling.

[0016] According to this method invention, the adhesive tape can be accurately applied to the foreign matter adhesion site of the workpiece to perform the peeling treatment.

[0017] A sixth invention is the above first invention, wherein

 The pressure-sensitive adhesive tape is in the form of a reel in which a pressure-sensitive adhesive layer formed on one surface of a base material is wound with a pressure-sensitive adhesive tape bonded thereto, and is supplied while peeling the separator from the pressure-sensitive adhesive tape.

 While winding up and separating the peeled separator into a reel,

 The adhesive tape from which the foreign matter has been transferred is reeled up and collected.

[0018] According to this method invention, the adhesive tape from which the foreign matter has been transferred is wound up and collected, so that it is possible to prevent foreign matters from re-scattering and contaminating unused adhesive tape and workpieces.

 [0019] A seventh invention is the above sixth invention, wherein

The tape recovery shaft connected to the tape recovery reel that winds and collects the adhesive tape from which foreign matter has been transferred, and the separator recovery reel that winds and collects the separator. It is characterized in that the winding operation of the separator collecting shaft is synchronized.

[0020] According to this method invention, it is possible to suppress tightening, slackening, winding misalignment, and the like caused by the difference in winding speed of the adhesive tape separator.

[0021] An eighth invention is the above sixth invention, wherein

 A separator is attached to the adhesive tape from which the foreign matter has been transferred and collected.

 [0022] According to this method invention, the foreign matter transferred to the adhesive surface is contained by the adhesive tape and the separator. Therefore, it is possible to prevent foreign matters from re-scattering.

 [0023] Note that the following can be used as the separator to be bonded to the adhesive tape from which the foreign matter has been transferred. For example, reuse the separator peeled off at the time of supply from the tape supply reel. Or use a new separator. In particular, when the separator is reused, the amount of industrial waste can be reduced.

 [0024] An eleventh invention is the above-mentioned first invention, wherein

 The pressure-sensitive adhesive tape is a reel formed by winding a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on one surface of a substrate, and the pressure-sensitive adhesive tape from which the foreign matter has been transferred while supplying the pressure-sensitive adhesive tape from the tape supply reel. It is characterized by winding and collecting in a reel shape.

 [0025] According to this method invention, since the adhesive tape does not have a separator! /, It can be realized with two configurations of a tape supply shaft and a tape recovery shaft. Therefore, it becomes easy to synchronize both shafts, and it is effective in suppressing the tightening, loosening, and winding deviation of the recovered adhesive tape.

[0026] A thirteenth invention is the above first invention, wherein

 The pressure-sensitive adhesive tape is guided to the tip of the pressing member by the side walls erected on both side ends of the pressing member.

 A method for cleaning a workpiece.

[0027] According to this method invention, the adhesive tape can be accurately guided to the center of the tip of the pressing member. Therefore, the adhesive tape can be reliably guided to the foreign material transfer position. The invention's effect

[0028] As described above, according to the work cleaning method of the present invention, it adheres to the work. Foreign matter can be removed accurately and efficiently with a small amount of adhesive tape. Brief Description of Drawings

 FIG. 1 is a side view of a substrate cleaning apparatus.

 FIG. 2 is a plan view of the substrate cleaning apparatus.

 FIG. 3 is a vertical side view of the tape cartridge.

 FIG. 4 is a vertical side view of the tape cartridge.

 FIG. 5 is an aa cross-sectional view in FIG.

 FIG. 6 is a flowchart of a foreign matter removing process.

 FIG. 7 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 8 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 9 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 10 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 11 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 12 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 13 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 14 is an enlarged side view of the main part showing the foreign substance removal processing operation.

 FIG. 15 is a side view of a modified tape force cartridge.

 FIG. 16 is a side view showing a pressing member of a modified example.

 FIG. 17 is a side view showing a modified tape force cartridge.

 FIG. 18 is a side view of a modified tape force cartridge.

 FIG. 19 is an aa cross-sectional view in FIG.

 Explanation of symbols

 [0030] 16 · · · Tape cartridge

 20 ··· Bulkhead

 22 · · · Tape supply section

 23 ··· Separator recovery section

 24 ··· Tape recovery unit

26 36

 P · · · Foreign matter

 s ...

 T ... adhesive tape

 W · · · Board

 BEST MODE FOR CARRYING OUT THE INVENTION

 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present embodiment, a case where foreign matter is removed from a substrate which is a semiconductor wafer as a workpiece will be described as an example. In addition to the semiconductor wafer, the work of the present invention includes various substrates such as liquid crystal panels and multilayer substrates, lead frames, and the like.

FIG. 1 is a side view of a substrate cleaning apparatus used in one embodiment of the present invention, and FIG. 2 is a plan view of the substrate cleaning apparatus.

A basic configuration of a substrate cleaning apparatus that executes the substrate cleaning method according to the present invention is shown in FIG. This substrate cleaning apparatus includes a chuck table 1 for positioning and mounting a semiconductor wafer w, which is a substrate, and a cleaning unit 2.

 As shown in FIG. 1 and FIG. 2, the chuck table 1 is supported on a movable base 3 that can be moved back and forth through a guide rail 4 so as to be horizontally movable left and right, and has a servo function. Driven and moved by a feed screw 6 that is driven forward and backward by 5. The movable table 3 is supported on a base 7 so as to be horizontally movable back and forth via a guide rail 8 and is driven and moved by a feed screw 10 that is driven forward and backward by a motor 9 with a servo function.

[0035] The cleaning unit 2 includes a column 11 standing on a base 7, a boom 12 cantilevered forward from the upper end of the column 11, and a guide frame provided at the tip of the boom 12. 13. Lift platform 14 supported by guide frame 13 so as to be movable up and down, bracket 15 supported by lift platform 14 so as to be able to swing up and down around fulcrum X, tape cartridge 16 detachably connected to bracket 15 Etc. The elevator 14 is screw-driven up and down by a motor 17, and the bracket 15 is driven up and down by an air cylinder 18. As shown in FIGS. 3 to 5, the housing 19 of the tape cartridge 16 has a side surface formed in a substantially triangular shape. The interior is composed of three parts. In other words, the interior is separated into two chambers by the partition wall 20 in the tape width direction, and further partitioned by the partition wall 21 on the front side of the partition wall 20 into the tape supply unit 22, the separator collection unit 23, and the tape collection unit 24. It has been.

 In FIG. 3, the tape supply unit 22 located at the lower part is formed long in the front-rear direction, a tape supply shaft 25 is provided at the rear thereof, and a pressing member 26 is provided at the front end of the tape supply unit 22. . Further, a separator collection shaft 27 is provided in a separator collection unit 23 formed above the rear part of the tape supply unit 22. Further, a tape collection shaft 28 is provided in a tape collection unit 24 formed above the front portion of the tape supply unit 22.

 [0038] A supply reel 29 around which an adhesive tape T with a separator is wound is externally attached to the tape supply shaft 25. The separator collecting shaft 27 is mounted so as to be able to rotate integrally with the separator collecting shaft 27, which is a separator collecting reel 30 for winding the separator s peeled off from the adhesive tape T. Further, a tape recovery reel 31 for winding the adhesive tape T drawn from the supply reel 29 is mounted on the tape recovery shaft 28 so as to be rotatable together with the tape recovery shaft 28.

 In the supply linole 29, the separator s peeled off from the adhesive tape T is guided by the guide roll 32 and guided to the separator collection reel 30. The adhesive tape T from which the separator s has been peeled is guided by the guide roll 33, guided to the pressing member 26 with the adhesive surface facing downward, and received by the lower surface of the pressing member 26 and retracted in the diagonally upward traveling direction. The adhesive tape T is guided to the tape recovery line 31 via the guide roll 33 and is guided back and forth!

 [0040] The pressing member 26 is provided so as to slightly protrude from the opening 34 formed on the lower surface of the front end of the tape supply unit 22, and the downward pressing adhesive tape T received by the pressing member 26 from the non-adhesive surface side. The surface is exposed from the opening 34.

As shown in FIGS. 4 and 5, a drive chamber 35 that is completely isolated from the outside is formed on the back side of the partition wall 20. The drive chamber 35 is supported by a separator collection shaft 27, a tape collection shaft 28, and a drive shaft 36 that receives rotational power from the outside. A transmission mechanism 37 for driving the separator collection shaft 27 and the tape collection shaft 28 is accommodated.

 The transmission mechanism 37 has a structure in which gears 38 and 39 integrally connected to the separator recovery shaft 27 and the tape recovery shaft 28 are engaged with a pinion gear 40 integrally connected to the drive shaft 36. As shown in FIG. 5, one end of the drive shaft 36 is exposed to the outside of the rear surface of the housing 19, and a groove-like engagement portion 36a provided at the protruding end of the drive shaft 36 is attached to the bracket 15. The motor 41 is engaged and interlocked with the output shaft 42 of the motor 41.

 In this transmission mechanism 37, in FIG. 4, the pinion gear 40 is rotated clockwise by the motor 41, whereby the tape collecting shaft 28 is rotated counterclockwise, and the adhesive tape T is moved to the tape collecting reel 31. The adhesive tape T is pulled out from the tape supply reel 29. At the same time, the separator collection shaft 27 is also rotated in a counterclockwise direction so that the separator s is wound around the separator collection reel 30.

 Next, using the substrate cleaning apparatus having the above configuration, the foreign substance removal processing step will be described along the schematic flowchart shown in FIG.

 [0045] The substrate w is first loaded into a foreign object inspection device 44 (see Fig. 2) having specifications as appropriate (Step 1), and the entire surface of the substrate w is scanned (Step 2). The position information of the adhesion site is acquired, and the acquired information is transferred to the control device 43 (see FIG. 2) of the substrate cleaning device (step 3).

 The substrate w on which the adhesion of foreign matter is detected is transferred to the substrate cleaning device, positioned and placed on the chuck table 1 in a predetermined posture, and held by suction. In this case, the tape cartridge 16 in the cleaning unit 2 stands by at the upper position (step 4).

[0047] In the following, foreign matter removal processing based on the inspection information in step 5 is performed. The data related to the substrate w held in the chuck table 1 is read by the control device 43, and the motor is based on the signal in which the movement amount is changed to the rotation amount of the motors 5 and 9 to the foreign substance adhesion position included in this data. 5 and 9 are activated and the chuck table 1 is moved horizontally back and forth and left and right. That is, the substrate w is positioned so that the foreign matter adhesion site is located below the tape cartridge 16 waiting in the upper position. Next, the motor 17 is actuated, and the lifting platform 14 is lowered to the lower limit, and as shown in FIG. Be directed.

 Next, the air cylinder 18 is actuated to swing the tape cartridge 16 downward about the fulcrum X, and the pressing member 26 facing the opening 34 at the front end of the tape cartridge 16 applies a predetermined pressure to the substrate surface. Pressed with. That is, as shown in FIG. 8, the adhesive tape T wound around the pressing member 26 with the adhesive surface n facing downward is attached to a site where the foreign matter p is adhered in a small area.

 [0049] When the adhesion of foreign matter p is within the exposed tape sticking range when the adhesive tape T is in a stationary state, the tape cartridge 16 moves around the fulcrum X as shown in FIG. The adhesive tape T swung upward and peeled off is peeled off from the substrate w. As a result, the foreign matter on the substrate w is transferred to the adhesive surface of the adhesive tape T.

 [0050] When the tape cartridge 16 is lifted, the motor 41 operates, and as shown in FIG. 10, the adhesive tape T is wound around the tape collecting reel 31 by a predetermined amount, and a new adhesive tape is formed on the lower surface of the pressing member 26. T is supplied.

 [0051] As shown in FIG. 11, when the adhesion of the foreign matter p does not fall within the tape application range exposed in a stationary state, the foreign matter p with the adhesive tape T in the forefront as shown in FIG. As shown in FIG. 13, the chuck table 1 is moved forward, the substrate w is horizontally moved forward by an amount corresponding to the foreign matter adhesion range, and the motor 41 is activated. Then, the adhesive tape T is wound up. As the substrate w moves forward, the pressing member 26 moves rearward relative to the substrate w, and the adhesive tape T is attached to the surface of the substrate w below the pressing member 26, while the pressing member 26 It is peeled off from the substrate w successively as it turns up at the tip. The foreign matter p on the substrate w is sequentially transferred to the adhesive surface of the adhesive tape T.

 [0052] When the predetermined range of foreign matter p is transferred to the adhesive tape T, the forward movement of the chuck table 1 is stopped, and the tape cartridge 16 is swung upward around the fulcrum X as shown in FIG. The adhesive tape T is peeled from the substrate w.

[0053] In this case, the treated adhesive tape T that has been peeled off is fed into the tape collecting unit 24 with the adhesive surface facing upward, and is wound up with the adhesive surface facing inward. Do not spill from the tape cartridge 16 due to peeling or scattering from the adhesive surface. There is no.

 Next, the chuck table 1 is moved so that the next foreign matter adhesion site is located below the tape cartridge 16, and the above operation is repeated thereafter.

 [0055] When foreign matter removal at all foreign matter adhesion sites is completed, the lifting platform 14 is raised and returned to the standby position, and the processed substrate w is unloaded (step S6).

 Thus, the foreign substance removal processing for one substrate w is completed, and the next substrate w is prepared for loading.

 [0057] When the adhesive tape T on the tape supply reel 29 is consumed, the tape cartridge 16 is replaced with a new one. The collected tape cartridge 16 can be re-used for IJ by exchanging the reel and cleaning it.

 [0058] As described above, by using the tape cartridge 16, the adhesive tape T is attached only to the foreign matter p, and the substrate w Power to remove from S. Therefore, it is necessary to affix the adhesive tape to the entire surface of the substrate that cannot be cleaned! /. Therefore, the pressing force when applying adhesive tape T and the peeling stress when peeling adhesive tape T are minimized. Can be suppressed. In other words, damage to the substrate due to these effects can be suppressed.

 [0059] In addition, the peeled and collected adhesive tape T is wound around the tape collecting reel 31 with the adhesive surface on the inner side (reel center axis side), so that the separation and scattering of the foreign matter p are prevented. In addition, the tape collection unit 24 itself is isolated inside the tape cartridge 16 by the partition wall 21! /, So even if foreign matter falls off, the tape collection unit 24 is scattered to the tape supply unit 22 side and the adhesive tape T is applied. There is no contamination.

 [0060] In addition, since the drive chamber 35 is isolated by the partition wall 20 inside the tape cartridge 16, foreign matter such as abrasion powder or lubricating oil generated in the transmission mechanism 37 adheres to the adhesive tape T before use. It is possible to prevent contamination.

[0061] Furthermore, since the adhesive surface n of the adhesive tape T can be covered with the separator s until immediately before the affixing process, it can be supplied in a state where the adhesive performance does not deteriorate, and a good transfer of foreign matter p can be achieved. The ability to fi

[0062] The present invention can also be implemented in the following forms.

[0063] (1) One of the tape collection shaft 28 or the separator collection shaft 27 is linked to the motor 41. The pinion gear 40 can be configured as an idle gear and can be implemented.

[0064] (2) The tape collecting shaft 28 is! / Is configured so that one of the separator collecting shafts 27 can be linked to the motor 41, and the shafts 28 and 27 are wound around the belt and linked, The reel 31 and the separator collecting reel 30 can be rotated in the winding direction in synchronization.

 (3) In the above embodiment, the force that causes the substrate w to move horizontally by the chuck table 1 with respect to the fixed position of the tape cartridge 16 On the contrary, the tape cartridge with respect to the fixed position of the substrate w It can also be implemented in a form in which 16 is moved back and forth and left and right.

 [0066] (4) It is possible to drive the tape collecting shaft 28 and the separator collecting shaft 27 by using the pulling force of the adhesive tape T. For example, the tape supply shaft 25 rotatably supported and the separator collection shaft 27 are geared via an idle gear, and the separator collection shaft 27 is wound up by the rotation of the tape supply shaft 25 when the adhesive tape is pulled out. The separator recovery shaft 27 and the tape recovery shaft 28 are interlocked with each other via an idle gear and the separator recovery shaft 27 is rotated in the take-up direction. Can be rotated in the winding direction. According to this configuration, the motor 41 that supplies the winding driving force can be eliminated. However, in this configuration, the pressing member 26 and the substrate w must be moved relative to each other horizontally, so that it is necessary to remove the foreign matter by attaching and peeling while the substrate w is fixed. It becomes.

 [0067] (5) In the above embodiment, the separator s peeled off from the adhesive tape T is wound up and collected on the individual separator collection reel 30. You may comprise so that it may collect | recover. For example, as shown in FIG. 15, the tape supply reel force also feeds the adhesive tape T, and the peeled separator s is guided to the upper part in the drawing, and is guided to the tape collecting unit 24 through the gap of the partition wall 21. The separator s is further guided to the nip roller 50 and bonded to the adhesive tape T from which foreign matter has been transferred, and is wound around the tape collection reel 30.

[0068] According to this configuration, since the foreign matter transferred to the adhesive tape T is sealed by the adhesive tape T and the separator s, it does not scatter again in the tape cartridge. That is, the unused adhesive surface supplied from the tape supply reel 31 is not contaminated by foreign matter. It is the power to prevent.

 [0069] (6) In the above-described embodiment, a force that uses a block-like member for the pressing member 26 is provided with a side wall 45 that functions as a positioning and guide in the width direction of the adhesive tape T as shown in FIG. It may be configured. In this case, when the tape cartridge 16 is swung, it is preferable that the front end side of the side wall 45 is cut away so that the exposed surface of the adhesive tape T is easily attached to the substrate T.

 (7) In the above embodiment, the tape cartridge 16 is provided with the pressing member 26.

 Another configuration may be adopted in which the 1S pressing member 26 is driven individually. For example, as shown in FIG. 17, the tape cartridge 16A has a shape in which the supply side and the recovery side protrude downward, and the adhesive tape T is exposed in a bridge shape across both ends, and formed on the non-adhesive surface side. The pressing member 26A is configured to be disposed in the formed space. That is, by raising and lowering the pressing member 26A in the space, the adhesive surface n of the adhesive tape T can be locally attached to the foreign matter p on the substrate at its tip.

 (8) In the above-described embodiment, the operator manually uses only the force S and the tape cartridge 16 that have removed the foreign matter p from the substrate w by automatically mounting the tape cartridge 16 on the substrate cleaning device. You can also remove foreign matter p from the substrate w!

 [0072] (9) In the above embodiment, the adhesive tape T with the separator is used, and the force that peels and collects the separator s simultaneously with the feeding of the adhesive tape T with a force of 22 is replaced with this adhesive tape T. A separator-less adhesive tape T in which an adhesive layer is formed on a substrate may be wound in a reel shape. In this case, the tape cartridge 16 can be configured as follows, for example.

 As shown in FIGS. 18 and 19, the inside of the housing 19 is partitioned into a tape supply unit 22 and a tape collection unit 24 by a partition wall 21. The tape supply unit 22 is provided with a tape supply shaft 25. The tape supply shaft 25 is free to rotate or has an appropriate rotational resistance.

[0074] A pressing member 26 is provided so that the tip slightly protrudes from an opening formed in the lower surface of the front end of the tape supply unit 22. The pressure-sensitive adhesive tape T received by the pressing member 26 from the non-adhesive surface side exposes the downward-adhesive surface from the opening. Press member 2 Side walls 45 are provided at both ends of 6 to guide the tip of the tape while controlling the wobbling in the tape width direction when the adhesive tape is running.

In the tape collecting unit 24, the output shaft 42 of the motor 41 is directly connected to the tape collecting shaft 28. Therefore, it is configured to collect the adhesive tape T if it is wound in conjunction with the drive of the motor 41.

 By configuring in this way, the number of drive shafts can be two as compared with the above embodiment, and the output shaft 42 of the motor 41 can be directly connected to the tape recovery shaft 28. The drive mechanism can be simplified. In addition, using two drive shafts absorbs (adjusts) the difference in rotational speed between the two shafts when collecting and collecting the tape. Therefore, it is easy to suppress tape winding, loosening, and winding deviation.

 Industrial applicability

As described above, the present invention is suitable for removing foreign substances adhering to workpieces such as various substrates and lead frames using an adhesive tape.

Claims

The scope of the claims  [1] A work cleaning method for removing foreign matter adhering to a work,  Aiming at the foreign matter adhering to the workpiece, affixing the adhesive tape locally and peeling the adhesive tape to remove the foreign matter from the workpiece  A method for cleaning a workpiece.  [2] In the work cleaning method according to claim 1,! /,  The pressure-sensitive adhesive tape is pressed from the non-adhesive surface with a pressing member, and the pressure-sensitive adhesive tape is affixed to a place where foreign matter adheres to the workpiece, the pressure member is released, the pressure-sensitive adhesive tape is peeled off, and the peeled pressure-sensitive adhesive tape is collected.  A method for cleaning a workpiece. [3] In the work cleaning method according to claim 1,! /,  While pressing the adhesive tape from the non-adhesive surface with the pressing member, the pressing member is relatively moved along the surface of the work, and in conjunction with the relative movement of the pressing member, the adhesive tape is fed from the adhesive tape supply means to the work. Remove the adhesive tape and collect it  A method for cleaning a workpiece. [4] The work cleaning method according to claim 1! /,  The work cleaning method, wherein the adhesive tape peeled off from the work is wound up and collected with the adhesive surface inside. [5] The work cleaning method according to claim 1! /,  The foreign matter adhering to the workpiece is detected by the foreign matter inspection means, and the position information of the foreign matter attachment site is obtained. Based on the acquired information, the adhesive tape is attached to the foreign matter attachment portion of the workpiece. Peeling off  A method for cleaning a workpiece. [6] The work cleaning method according to claim 1! /, The pressure-sensitive adhesive tape is in the form of a reel in which a pressure-sensitive adhesive layer formed on one surface of a base material is wound with a pressure-sensitive adhesive tape bonded thereto, and is supplied while peeling the separator from the pressure-sensitive adhesive tape. While winding up and separating the peeled separator into a reel,  The adhesive tape from which the foreign matter has been transferred is reeled up and collected.  A method for cleaning a workpiece. [7] In the work cleaning method according to claim 6,  Synchronize the winding operation of the tape recovery shaft connected to the tape recovery reel that winds and collects the adhesive tape from which foreign matter has been transferred, and the separator recovery shaft connected to the separator recovery reel that winds and recovers the separator.  A method for cleaning a workpiece. [8] In the work cleaning method according to claim 6,  A work cleaning method, wherein a separator is attached to the adhesive tape from which foreign matter has been transferred and collected. [9] In the work cleaning method according to claim 8,  The separator to be bonded to the adhesive tape from which the foreign matter has been transferred is the separator that has been peeled off during the supply of the tape supply reel.  A method for cleaning a workpiece. [10] In the work cleaning method according to claim 8,  The separator to be bonded to the adhesive tape from which foreign matter has been transferred is a new separator.  A method for cleaning a workpiece. [11] In the work cleaning method according to claim 1,! /  The adhesive tape has a reel shape in which an adhesive tape having an adhesive layer formed on one surface of a substrate is wound, and the adhesive tape from which the foreign matter has been transferred while supplying the adhesive tape from the tape supply reel. Rewind and collect in reel form  A method for cleaning a workpiece. [12] The work cleaning method according to claim 11! /, Synchronize the feeding and winding operations of the tape supply shaft connected to the tape supply reel and the tape recovery shaft connected to the tape recovery reel that winds and collects the adhesive tape from which foreign matter has been transferred. A method for cleaning a workpiece. [13] In the work cleaning method according to claim 1,! /  The pressure-sensitive adhesive tape is guided to the tip of the pressing member by the side walls erected on both side ends of the pressing member.  A method for cleaning a workpiece.