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WO2007132591A1 - Mélange, stabilisateur thermique utilisant le mélange et formule de résine halogénée - Google Patents

Mélange, stabilisateur thermique utilisant le mélange et formule de résine halogénée Download PDF

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Publication number
WO2007132591A1
WO2007132591A1 PCT/JP2007/055436 JP2007055436W WO2007132591A1 WO 2007132591 A1 WO2007132591 A1 WO 2007132591A1 JP 2007055436 W JP2007055436 W JP 2007055436W WO 2007132591 A1 WO2007132591 A1 WO 2007132591A1
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WIPO (PCT)
Prior art keywords
mixture
pentaerythritol
halogen
mass
acid
Prior art date
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Ceased
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PCT/JP2007/055436
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English (en)
Japanese (ja)
Inventor
Masashi Harada
Yosuke Ishima
Keiichi Odagiri
Akihiro Maruyama
Yasuhiro Kishimoto
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Adeka Corp
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Adeka Corp
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Publication of WO2007132591A1 publication Critical patent/WO2007132591A1/fr
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/053—Polyhydroxylic alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters

Definitions

  • the present invention relates to a mixture that can be used as a heat stabilizer, a heat stabilizer using the same, and a halogen-containing resin composition containing the heat stabilizer, and more specifically, a halogen excellent in heat resistance and coloring resistance.
  • a resin composition is provided.
  • halogen-containing resins vinyl chloride resins are difficult to stabilize against light and heat, and are known to cause decomposition mainly due to dehalogenated hydrogen during thermoforming and product use. ing. Therefore, various stabilizers such as metal salts of organic acids, organic tin compounds, organic phosphate compounds, epoxy compounds, ⁇ -diketone compounds, antioxidants, and UV absorbers are added to improve the stability of the vinyl chloride resin. Attempts have been made to improve.
  • the salty resin resin can be easily adjusted in hardness by using a plasticizer, so that it can be used in various applications such as agricultural sheets and building materials such as window frames.
  • a hard vinyl chloride resin composition containing no plasticizer or a semi-rigid vinyl chloride resin composition containing only a small amount of plasticizer is exposed to high temperature and high pressure during processing, and molded. Since high performance is required for the thermal stability of products, higher performance stabilization aids are required.
  • pentaerythritol condensates such as bentaerythritol and dipentaerythritol or tripentaerythritol (hereinafter referred to as these) are used as stabilizing aids.
  • This compound is sometimes referred to as “pentaerythritol compound.” It has been reported that) is added to a vinyl chloride resin in combination with a stabilizer (Patent Documents 1 and 2). However, the above pentaerythritol compound is heat resistant.
  • the melting point of the pentaerythritol compound is higher than the processing temperature of the vinyl chloride resin, it is not compatible with the salted resin resin. Therefore, the vinyl chloride system containing the pentaerythritol compound is poor. In a product obtained by molding and processing a resin composition (halogen-containing resin composition), plate-out due to poor dispersion of pentaerythritol compound may appear.
  • Patent Document 3 As a method for improving the above-mentioned dispersion failure, a method of pulverizing has been proposed (Patent Document 3), and pentaerythritol compound is pulverized to a particle size of 35 ⁇ m or less. Therefore, the above problem has a problem that the powder energy required for the fine powder that can be improved is large and the cost is high.
  • Patent Document 4 a method for improving the dispersibility of dipentaerythritol by melting a mixture of ditrimethylolpropane and dipentaerythritol has been disclosed (Patent Document 4).
  • ditrimethylolpropane does not have an effect as a stabilizing aid
  • dipentaerythritol which is the original active ingredient, is reduced in such a mixture, and is used in a large amount in order to achieve the desired performance. There is a need.
  • it if it is used in a large amount, there are problems that the physical property value of the molded product obtained by the molding process is lowered, and the plate-out appears on the surface.
  • Patent Document 5 a mixed ester obtained by esterification of pentaerythritol with stearic acid, adipic acid, or the like, or a partial ester obtained by esterification of pentaerythritol with a linear saturated fatty acid is converted into a halogen-containing resin.
  • Patent Document 6 a mixed ester obtained by esterification of pentaerythritol with stearic acid, adipic acid, or the like, or a partial ester obtained by esterification of pentaerythritol with a linear saturated fatty acid is converted into a halogen-containing resin.
  • Patent Document 1 Japanese Patent Laid-Open No. 6-248142
  • Patent Document 2 JP-A-8-143704
  • Patent Document 3 Japanese Patent Laid-Open No. 10-7859
  • Patent Document 4 Japanese Patent Laid-Open No. 9_268286
  • Patent Document 5 JP-A-11-222545
  • Patent Document 6 JP-A-7_97495
  • an object of the present invention is to provide a halogen-containing resin composition that exhibits sufficient thermal stability and color resistance even when blended without using a lead or cadmium stabilizer by improving the stabilizing aid. Is to provide.
  • the present inventors have obtained a mixture obtained by heating and melting pentaerythritol, dipentaerythritol, and a pentaerythritol condensate of a trimer or more, which is configured in a specific ratio.
  • the present inventors have found that a halogen-containing resin composition using can achieve the above object, and has completed the present invention.
  • the present invention relates to a mixture obtained by heating and melting pentaerythritol, dipentaerythritol, and a pentamer erythritol condensate of a trimer or more, and the total amount of the pentaerythritol and dipentaerythritol.
  • the sum of the content of erythritol is 20 to 80 mass 0/0
  • 3 content of dimer or more pentaerythritol condensate is mixed compound is 20 to 80 mass%.
  • the present invention achieves the above object by providing a heat stabilizer containing the above mixture.
  • the present invention achieves the above object by providing a halogen-containing resin composition containing the above mixture.
  • the mixture of the present invention comprises pentaerythritol, dipentaerythritol and a trimer or more. It is obtained by heating and melting a pentaerythritol condensate.
  • the total content of the pentaerythritol and the dipentaerythritol is 20 to 80% by mass with respect to the total amount of the mixture, and the content of the pentaerythritol condensate of the trimer or more is 20 to 20% by mass.
  • a 80 weight 0/0 the sum of the content of pentaerythritol, Jipentae Risuritoru and trimer or more pentaerythritol condensate is 100% by weight.
  • the mixture may be subjected to heat-melt treatment.
  • the effect of the present invention in which the melting point is high cannot be obtained.
  • Examples of the pentaerythritol condensate having a trimer or higher include tripentaerythritol, tetrapentaerythritol, pentapentaerythritol, hexapentaerythritol, and the like.
  • the content of the pentaerythritol condensate of the trimer or more is less than 20% by mass or more than 80% by mass with respect to the total amount of the mixture, the mixture is subjected to heat-melt treatment. Even if it goes, the effect of the present invention in which the melting point of the mixture is high cannot be obtained.
  • the total content of pentaerythritol and dipentaerythritol and the content of the pentaerythritol condensate of trimer or more are 30% by mass to 30% by mass relative to the total amount of the mixture.
  • Mixtures that satisfy the conditions in the range of 70% by weight are particularly preferably used.
  • the heat-melting treatment in the present invention involves melting a mixture of pentaerythritol, dipentaerythritol, and a penta-erythritol condensate of trimer or higher until it becomes transparent while stirring at 230 ° C, and after cooling and solidification.
  • a mixture of 150 mesh pass particle size of 100 ⁇ m or less is obtained.
  • the mixture of the present invention preferably has a melting point of 200 ° C or lower, more preferably a melting point of 185 ° C or lower.
  • the heat stabilizer of the present invention contains the above mixture.
  • the heat stabilizer of the present invention may contain other additives in addition to the above mixture.
  • Other supplementary caro When the agent is contained, the content of the mixture of the present invention in the heat stabilizer is preferably from:! To 70% by mass, more preferably from! To 50% by mass.
  • other additives that can be blended in the heat stabilizer of the present invention include additives that can be blended in the halogen-containing resin composition described later.
  • the halogen-containing resin composition of the present invention contains the above mixture.
  • the halogen-containing resin composition of the present invention preferably contains the above-mentioned mixture in an amount of 0.01 to 20 parts by mass with respect to 100 parts by mass of the halogen-containing resin. It is particularly preferable to contain part by mass.
  • At least one or more selected from ⁇ -diketone compounds, compounds, id mouth talcite compounds, and fatty acid zinc can be suitably used for the halogen-containing resin composition.
  • the halogen-containing resin used in the present invention is not particularly limited to the polymerization method such as bulk polymerization, solution polymerization, suspension polymerization, emulsion polymerization and the like, and is not limited to polychlorinated butyl, chlorinated polychlorinated vinyl.
  • addition of at least one ⁇ -diketone compound can suppress product coloring due to molding. preferable.
  • Examples of the ⁇ -diketone compound include acetylylacetone, triacetylmethane, 2,4,6-heptatrione, butanoylacetylmethyl, lauroylacetylmethane, nonremiacetylacetylmethane, stearoylbenzoate.
  • the metal species that can provide the metal salt of the above-mentioned diketone compound include Group Ia metals such as lithium, sodium and potassium; Group Ila metals such as magnesium, calcium, strontium and barium; Anoleminium, tin, alkyl tin and the like can be mentioned.
  • ⁇ -diketone compounds it is preferable to use dibenzoylmethane, stearoyl benzoinolemethane, acetylethylacetone metal salt, or calcium acetylethylacetonate because a product with suppressed coloring can be obtained.
  • the amount of the ⁇ -diketone compound used is 0.001 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the halogen-containing resin.
  • halogen-containing resin composition of the present invention it is preferable to add at least one kind of a no- and ido-talcite compound because heat resistance can be improved.
  • Hyde mouth talcite compound for example, magnesium and aluminum, or a double salt compound composed of zinc, magnesium and aluminum is preferably used, and the Hyde mouth talcite compound dehydrated crystal water. It may be a thing.
  • the above-mentioned hydride talcide compound may be a natural product or a synthetic product, and can be used without being limited by the crystal structure, crystal particle diameter, etc. of hydride talcite. It is.
  • the above-mentioned Hyde Tarusai compound has its surface coated with stearic acid.
  • Higher fatty acid metal salts such as higher fatty acid and alkali metal oleate, organic sulfonic acid metal salts such as alkali metal dodecylbenzene sulfonate, higher fatty acid amides, higher fatty acid esters or waxes may be used.
  • Hyde mouth talcite may be commercially available.
  • Al Power Mizer 1, Al Carmizer 2, Al Power Mizer 4, Al Power Mizer 5, Al Power Mizer 7, DHT -4A manufactured by Kyowa Chemical Co., Ltd.
  • Al force mizer 1 and DHT-4A can be suitably used.
  • the Hyde mouth talcite compound is used in an amount of preferably 0.001 to 10 parts by mass, more preferably 0.01 to 5 parts by mass, with respect to 100 parts by mass of the halogen-containing resin. If the above-mentioned hard mouth talcite compound is less than 0.001 part by mass, the effect of addition is hardly observed, and if it exceeds 10 parts by mass, the effect does not increase and the color resistance may be lowered.
  • the halogen-containing resin composition of the present invention is preferable because a product excellent in coloring resistance can be obtained by further blending at least one organic acid zinc salt.
  • Examples of the organic acid zinc salt include zinc salts of carboxylic acids, organic phosphoric acids, or phenols.
  • carboxylic acid include caproic acid, caplinoleic acid, pelargonic acid, 2-ethylhexylic acid, force puric acid, neodecanoic acid, undecylenic acid, lauric acid, myristic acid, palmitic acid, stearic acid.
  • organic phosphoric acid examples include mono or dioctyl phosphoric acid, mono or didodecyl phosphoric acid, mono or dioctadecyl phosphoric acid, mono or di- (noelphenyl) phosphoric acid, phosphonic acid nourphenyl ester, and phosphonic acid stearyl ester.
  • Etc examples of the phenols include phenol, cresol, ethylphenol, cyclohexylphenol, nonylphenol, dodecylphenol and the like. It is done.
  • the organic acid zinc salt may be any of a normal salt, an acidic salt, a basic salt, an overbased salt, and the like.
  • the amount of the organic acid zinc salt used is 0.
  • an organic acid metal salt other than an organic acid zinc salt can be used for the halogen-containing resin of the present invention.
  • the organic acid metal salt include metal (Li, Na, K, Ca, Mg, Ba, Sr, Cd, Al) salts of carboxylic acids, organic phosphoric acids or phenols.
  • examples of the carboxylic acid, organic phosphoric acid, and phenol include those exemplified as those used in the organic acid zinc salt.
  • These organic acid metal salts may be any of normal salts, acidic salts, basic salts, overbased salts, and the like.
  • organic acid metal salts it is particularly preferable to use organic acid salts of non-heavy metals (Li, Na, K, Ca, Mg, Al) because a low-toxic composition is obtained. It is preferable to use a calcium acid salt and the organic acid zinc salt in combination because a composition having excellent heat resistance and coloration resistance can be obtained in spite of low toxicity.
  • the amount of the organic acid metal salt used is 0.001 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the vinyl chloride resin.
  • the halogen-containing resin composition of the present invention further includes additives that are usually used as necessary, for example, plasticizers, organic phosphite compounds, phenol-based or sulfur-based antioxidants, epoxy A compound, an ultraviolet absorber, a hindered amine light stabilizer, a foaming agent, a filler, a polyol compound, and the like can also be blended.
  • additives that are usually used as necessary, for example, plasticizers, organic phosphite compounds, phenol-based or sulfur-based antioxidants, epoxy A compound, an ultraviolet absorber, a hindered amine light stabilizer, a foaming agent, a filler, a polyol compound, and the like can also be blended.
  • plasticizer examples include phthalate plasticizers such as diheptyl phthalate, dioctyl phthalate and diisononyl phthalate, dioctyl adipate, diisononyl adipate, di (butyl diglycol) adipate and the like.
  • Phosphate plasticizers such as adipate plastic lj, tricresyl phosphate, polyester plasticizer, chlorinated paraffin plasticizer, trimellitate plasticizer, pyromellitate plasticizer, biphenyl tetracarboxylate plasticizer, etc. Is mentioned.
  • organic phosphite compound examples include triphenyl phosphite and tris (2, 4
  • phenol-based antioxidant examples include 2,6-ditertiarybutyl _ ⁇ _creso-monole, 2,6-diphenyl_4-octadecyloxyphenol, stearyl (3,5-ditertiarybutyl_4— Hydroxyphenyl) propionate, distearyl (3,5-ditertiary butinole_4-hydroxybenzyl) phosphonate, thiojetylene bis [(3,5-ditertiary butinole_4-hydroxyphenyl) propionate], 4, 4'-thiobis (6-tert-butyl _m_ cresol), 2-octylthio-1,4-6-di (3,5-ditert-butyl _4-hydroxyphenoxy) s-triazine, 2, 2'- Methylenebis (4-methyl-6-tert-butylphenol), bis [3,3_bis (4-hydroxy-1-tertiarybutylphenyl) butyric acid]
  • sulfur-based antioxidant examples include dialkylthiodipropionates such as dilauryl, dimyristyl, myristinorestearinole and distearyl esters of thiodipropionic acid and pentaerythritol tetra ( ⁇ -dodecyl). And ⁇ -alkyl mercaptopropionic esters of polyols such as mercaptopropionate).
  • Examples of the epoxy compound include epoxidized soybean oil, epoxidized linseed oil, epoxidized tung oil, epoxidized fish oil, epoxidized beef tallow oil, epoxidized castor oil, epoxi cocoa flower oil, and the like.
  • Oil epoxy methyl stearate, monobutynore, _2-ethylhexyl, monostearyl ester, epoxidized polybutadiene, tris (epoxypropyl) isocyanurate, epoxidized tall oil fatty acid ester, epoxy amadi oil fatty acid ester, Examples thereof include bisphenol and diglycidyl ether, bullcyclohexene gepoxide, dicyclohexene gepoxide, 3,4-epoxycyclohexylmethylepoxycyclohexanecarboxylate, and the like.
  • an epoxy compound that is also used as a plasticizer such as epoxy soybean oil
  • Examples of the ultraviolet absorber include 2, 4-dihydroxybenzophenone, 2 hydro 2-hydroxybenzophenones such as xyl _4—methoxybenzophenone, 2-hydroxy _4—otatoxybenzophenone, 5, 5, monomethylenebis (2-hydroxy _4-methoxybenzophenone); 2- (2— Hydroxy-5_methylphenyl) benzotriazole, 2_ (2-hydroxy-5_tertiaryoctylphenyl) benzotriazole, 2_ (2-hydroxy-1,3,5-ditert-butylphenyl) _5_clobenzobenzotriazole, 2_ (2-hydroxy-1-tertiary butyl-5-methylphenyl) _5_ clobenzobenzotriazole, 2_ (2-hydroxy-1,5-dicumylphenyl) benzotriazole, 2, 2'-methylenebis (4-th Polyethylene of 3-otatilu-6 benzotriazolyl) phenol, 2- (2 hydroxy-3 xyl
  • hindered amine light stabilizer examples include 2, 2, 6, 6 tetramethyl-4 piperidyl stearate, 1, 2, 2, 6, 6 _pentamethyl _4-piperidyl stearate, 2, 2, 6, 6-tetramethylolate.
  • foaming agent examples include azodicarbonamide, azobisisobutylnitrile, diazoaminobenzene, jetylazodicarboxylate, diisopropyl azodicarboxylate, azobis (hexahydrobenzene).
  • N, N 'dinitro pentamethylenetetramine, N, ⁇ '-dimethyl-1-N, ⁇ '-dinitroterephthalamine, and other nitroso foaming agents benzenesulfonylhydrazide, ⁇ toluenesulfonyl Hydrazides such as hydrazide, 3, 3'-disulfone hydrazide phenyl sulfone, toluene disulfonyl hydrazone, thiobis (benzenesulfonyl hydrazide), toluene ether sulfonyl azide, toluenesulfonyl semicarbazide, ⁇ , ⁇ '-bis (benzenesulfonyl hydrazide) ether Series blowing agent, ⁇ -t Examples include strong rubazide foaming agents such as ruenesulfonyl semicarbazide and 4,4'-oxy
  • Examples of the filler include calcium carbonate, calcium oxide, calcium hydroxide, zinc oxide, zinc hydroxide, zinc carbonate, zinc sulfide, magnesium oxide, magnesium hydroxide, magnesium carbonate, aluminum oxide, and water.
  • the polyol compound may be a force containing a pentaerythritol compound or other polyol compounds.
  • ethylene glycol diethylene glycol, triethylene glycol, 1,2_propanediol, 1,3_propanediol, 1,2_butanediole, 1,3_butanediole, 1,4_butanediole, 1,6_
  • Low molecular weight polyol compounds such as xanthdiol, hydrogenated bisphenol A, glycerin, trimethylolpropane, 1,2,6_hexanetriol, diglycerin, dextrose, sorbitol, sucrose; alkylene oxide is added to the low molecular weight polyol compound
  • examples include the added Polio-Ruich compound.
  • stabilizing aids can be added to the halogen-containing resin composition of the present invention.
  • strong stabilizing aids include diphenylthiourea, anilinodithiotriazine, melamine, benzoic acid, keihic acid, p-tert-butylbenzoic acid, zeolite, perchlorate and the like.
  • the halogen-containing resin composition of the present invention includes a crosslinking agent, an antistatic agent, an antifogging agent, a plate-out preventing agent, a surface treatment agent, a lubricant, a flame retardant, and an antifogging agent as necessary. , Fluorescent agents, antifungal agents, bactericides, metal deactivators, mold release agents, pigments, processing aids, and the like.
  • the amount of each of the various additives used is the halogen-containing resin composition of the present invention. However, the total content is preferably 100 parts by mass or less based on 100 parts by mass of the halogen-containing resin.
  • the halogen-containing resin composition of the present invention can be used without being limited to a processing method, and includes, for example, a calendar process, a roll process, an extrusion molding process, an injection molding process method, It can be suitably used for melt casting, pressure molding, powder molding, and the like.
  • building materials such as wall materials, floor materials, window frames, wallpaper, etc .; automotive interior materials; wire covering materials; agricultural materials; food packaging materials; paints; It can be suitably used as miscellaneous goods such as pipes, sheets, and toys.
  • Polychlorinated bur resin (degree of polymerization 1000) 100 parts by mass, Ido, talcite (Al force Mizer 1; manufactured by Kyowa Chemical Industry Co., Ltd.) 0.5 part by mass, calcium stearate 0.5 part by mass, stearin
  • a halogen-containing resin composition was obtained by blending 1 part by mass of zinc oxide with 0.8 parts by mass of the mixture shown in Table 2 in addition to the powerful standard composition.
  • the halogen-containing resin composition is put into a lab plast mill (30C150 type; manufactured by Toyo Seiki Co., Ltd., 190 ° C, 50rpm, 65g / 60cc), and the resin is obtained by kneading the powerful halogen-containing resin composition. The decomposition time until decomposition and the kneading torque increased was measured.
  • the halogen-containing resin composition was put into a twin screw extruder, and the resin kneaded at an extrusion temperature of 180 ° C and a screw rotation speed of 20 rpm was immediately formed into a sheet shape having a width of 20 mm and a thickness of 2 mm with a roll processing machine.
  • the size of the plate-out was evaluated by visually observing the surface of the strong sheet (evaluation criteria; ⁇ : no deposit, ⁇ : slight deposit, X: large deposit).
  • the halogen-containing resin composition is put into a roll cage heated to 190 ° C., roll-kneaded for 3 minutes to form a sheet with a thickness of 0.5 mm, and the sheet is cut to a length of 20 mm.
  • a strip-shaped test piece 10 mm wide was produced.
  • the powerful strip-shaped test piece was placed in an oven at 190 ° C and removed every 15 minutes, and the time for the strip-shaped test piece to partially blacken was confirmed.
  • the mixture of Comparative Example 2-5 is 200 mesh pass (particle size is less than 75 m)
  • the sum of the contents of pentaerythritol and dipentaerythritol or the content of the pentaerythritol condensate is 20% by mass to 80% by mass with respect to the total amount of the mixture.
  • the melting point of the mixture is high (Comparative Example 1-11 and Comparative Example 1-1-2) even when the melting treatment is performed.
  • a halogen-containing resin composition containing such a mixture Example 2-2 and Comparative Example 2-3) have the problems of low dynamic thermal stability and static thermal stability and plate out on the surface.
  • the present invention relates to a mixture obtained by subjecting a melt-treated mixture in which the sum of the contents of pentaerythritol and dipentaerythritol and the content of the pentaerythritol condensate are both in the range of 20% by mass to 80% by mass.
  • a melt-treated mixture in which the sum of the contents of pentaerythritol and dipentaerythritol and the content of the pentaerythritol condensate are both in the range of 20% by mass to 80% by mass.
  • the halogen-containing resin composition of the present invention particularly when only a small amount of a plasticizer is blended or when it is not blended, excellent thermal stability and color resistance without using a heavy metal stabilizer. Is shown. Therefore, the halogen-containing resin composition of the present invention can be suitably used particularly for a building material application in which no plasticizer is used.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention porte sur une formule de résine halogénée comprenant un mélange qui peut être produit par fusion de pentaérythritol, de dipentaérythritol et d'un produit de condensation du pentaérythritol sous forme d'un trimère ou plus par chauffage. Dans le mélange, la somme des teneurs en pentaérythritol et dipentaérythritol est comprise entre 20 et 80 % en masse et la teneur en produit de condensation du pentaérythritol est comprise entre 20 et 80 % en masse, par rapport à la masse totale du mélange dans les deux cas (la somme des teneurs en pentaérythritol, dipentaérythritol et produit de condensation du pentaérythritol étant égale à 100 % en masse).
PCT/JP2007/055436 2006-05-12 2007-03-16 Mélange, stabilisateur thermique utilisant le mélange et formule de résine halogénée Ceased WO2007132591A1 (fr)

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JP2006134534A JP2007302833A (ja) 2006-05-12 2006-05-12 混合物、これを用いた熱安定剤及びハロゲン含有樹脂組成物
JP2006-134534 2006-05-12

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069491A1 (fr) * 2007-11-28 2009-06-04 Adeka Corporation Stabilisant pour résines contenant du chlore et compositions de résine contenant du chlore
JP2009132758A (ja) * 2007-11-28 2009-06-18 Adeka Corp 塩化ビニル樹脂組成物
JP2009132757A (ja) * 2007-11-28 2009-06-18 Adeka Corp 塩素含有樹脂用安定剤及び塩素含有樹脂用安定剤組成物
WO2012111240A1 (fr) * 2011-02-16 2012-08-23 株式会社Adeka Composition de résine chlorure de vinyle
WO2012160943A1 (fr) * 2011-05-20 2012-11-29 株式会社Adeka Composition de résine de chlorure de vinyle pour un moulage par injection

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998456A (fr) * 1972-11-13 1974-09-18
JPS53132052A (en) * 1977-04-22 1978-11-17 Koei Chemical Co Stabilizer for chlorineecontaining resins
JPS54154443A (en) * 1978-05-27 1979-12-05 Kureha Chem Ind Co Ltd Vinylidene chloride-vinyl chloride resin composition
JPS55161831A (en) * 1979-06-04 1980-12-16 Rexall Drug Chemical Low toxicity vinylhalide stabilizer composition
JPS6346248A (ja) * 1986-08-14 1988-02-27 Kyowa Chem Ind Co Ltd ポリ塩化ビニル系樹脂の安定化組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998456A (fr) * 1972-11-13 1974-09-18
JPS53132052A (en) * 1977-04-22 1978-11-17 Koei Chemical Co Stabilizer for chlorineecontaining resins
JPS54154443A (en) * 1978-05-27 1979-12-05 Kureha Chem Ind Co Ltd Vinylidene chloride-vinyl chloride resin composition
JPS55161831A (en) * 1979-06-04 1980-12-16 Rexall Drug Chemical Low toxicity vinylhalide stabilizer composition
JPS6346248A (ja) * 1986-08-14 1988-02-27 Kyowa Chem Ind Co Ltd ポリ塩化ビニル系樹脂の安定化組成物

Cited By (8)

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WO2009069491A1 (fr) * 2007-11-28 2009-06-04 Adeka Corporation Stabilisant pour résines contenant du chlore et compositions de résine contenant du chlore
JP2009132758A (ja) * 2007-11-28 2009-06-18 Adeka Corp 塩化ビニル樹脂組成物
JP2009132757A (ja) * 2007-11-28 2009-06-18 Adeka Corp 塩素含有樹脂用安定剤及び塩素含有樹脂用安定剤組成物
US8372907B2 (en) 2007-11-28 2013-02-12 Adeka Corporation Stabilizer for chlorine-containing resins and chlorine-containing resin composition
WO2012111240A1 (fr) * 2011-02-16 2012-08-23 株式会社Adeka Composition de résine chlorure de vinyle
JP2012167232A (ja) * 2011-02-16 2012-09-06 Adeka Corp 塩化ビニル系樹脂組成物
WO2012160943A1 (fr) * 2011-05-20 2012-11-29 株式会社Adeka Composition de résine de chlorure de vinyle pour un moulage par injection
JP2012241119A (ja) * 2011-05-20 2012-12-10 Adeka Corp 射出成形用塩化ビニル系樹脂組成物

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