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WO2007126767A3 - Chucking system comprising an array of fluid chambers - Google Patents

Chucking system comprising an array of fluid chambers Download PDF

Info

Publication number
WO2007126767A3
WO2007126767A3 PCT/US2007/007487 US2007007487W WO2007126767A3 WO 2007126767 A3 WO2007126767 A3 WO 2007126767A3 US 2007007487 W US2007007487 W US 2007007487W WO 2007126767 A3 WO2007126767 A3 WO 2007126767A3
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
chambers
substrate
array
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/007487
Other languages
French (fr)
Other versions
WO2007126767A2 (en
Inventor
Anshuman Cherala
Byung-Jin Choi
Pankaj B Lad
Steven C Shackleton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Nanotechnologies Inc
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Priority to JP2009504203A priority Critical patent/JP4667524B2/en
Priority to EP07754062A priority patent/EP2007566A4/en
Publication of WO2007126767A2 publication Critical patent/WO2007126767A2/en
Publication of WO2007126767A3 publication Critical patent/WO2007126767A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention is directed towards a chucking system to hold a substrate (12), said system including, inter alia, a chuck body (60) having first and second opposed sides, said first side including an array of fluid chambers (68a, 68b, 68c) arranged in rows and columns, said fluid chambers (68a, 68b, 68c) each comprising first and second spaced-apart recesses (70, 72) defining first and second spaced-apart support regions, with said first support region cincturing said second support region and said first and second recesses (70, 72), and said second support region cincturing said second recess (72), with said substrate (12) resting against said first and second support regions, with said first recess (70) and a portion of said substrate (12) in superimposition therewith defining a first chamber and said second recess (72) and a portion of said substrate in superimposition therewith defining a second chamber, with each column of said first chambers and each row of said second chambers being in fluid communication with a differing source of fluid to control a flow of fluid in said array of fluid chambers (68).
PCT/US2007/007487 2006-04-03 2007-03-26 Chucking system comprising an array of fluid chambers Ceased WO2007126767A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009504203A JP4667524B2 (en) 2006-04-03 2007-03-26 Chuck system with an array of fluid chambers
EP07754062A EP2007566A4 (en) 2006-04-03 2007-03-26 Chucking system comprising an array of fluid chambers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78877706P 2006-04-03 2006-04-03
US60/788,777 2006-04-03

Publications (2)

Publication Number Publication Date
WO2007126767A2 WO2007126767A2 (en) 2007-11-08
WO2007126767A3 true WO2007126767A3 (en) 2008-07-31

Family

ID=38656006

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/007487 Ceased WO2007126767A2 (en) 2006-04-03 2007-03-26 Chucking system comprising an array of fluid chambers

Country Status (6)

Country Link
EP (1) EP2007566A4 (en)
JP (2) JP4667524B2 (en)
KR (1) KR20090004910A (en)
CN (1) CN101415535A (en)
TW (1) TWI352874B (en)
WO (1) WO2007126767A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4854383B2 (en) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 Imprint method and nano-imprint apparatus
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
US8913230B2 (en) * 2009-07-02 2014-12-16 Canon Nanotechnologies, Inc. Chucking system with recessed support feature
JP5875250B2 (en) * 2011-04-28 2016-03-02 キヤノン株式会社 Imprint apparatus, imprint method, and device manufacturing method
JP5893303B2 (en) * 2011-09-07 2016-03-23 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same
EP3078462A1 (en) * 2013-12-03 2016-10-12 Harmotec Co., Ltd. Holding device, holding system, control method, and conveyance device
JP6333031B2 (en) * 2014-04-09 2018-05-30 キヤノン株式会社 Imprint apparatus and article manufacturing method
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6647027B2 (en) 2015-12-03 2020-02-14 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6940944B2 (en) * 2016-12-06 2021-09-29 キヤノン株式会社 Imprint device and article manufacturing method
JP7132739B2 (en) 2018-04-06 2022-09-07 キヤノン株式会社 Imprinting apparatus, imprinting method and article manufacturing method
JP7710350B2 (en) 2021-09-28 2025-07-18 キヤノン株式会社 Imprint method, imprint apparatus, and article manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
US6762826B2 (en) * 1999-08-19 2004-07-13 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195927A (en) 1998-12-28 2000-07-14 Sony Corp Vacuum chuck device
JP2001127145A (en) * 1999-08-19 2001-05-11 Canon Inc Substrate suction holding method, substrate suction holding apparatus, exposure apparatus and device manufacturing method using the substrate suction holding apparatus
JP2001127144A (en) * 1999-08-19 2001-05-11 Canon Inc Substrate suction holding method, substrate suction holding apparatus, exposure apparatus and device manufacturing method using the substrate suction holding apparatus
DE60328626D1 (en) * 2002-11-13 2009-09-10 Molecular Imprints Inc A MOUNTING SYSTEM AND METHOD FOR MODULATING SUBSTRATE SHAPES

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
US6762826B2 (en) * 1999-08-19 2004-07-13 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2007566A4 *

Also Published As

Publication number Publication date
JP4667524B2 (en) 2011-04-13
EP2007566A2 (en) 2008-12-31
WO2007126767A2 (en) 2007-11-08
CN101415535A (en) 2009-04-22
TWI352874B (en) 2011-11-21
EP2007566A4 (en) 2010-10-13
JP2011077529A (en) 2011-04-14
KR20090004910A (en) 2009-01-12
JP2009532899A (en) 2009-09-10
TW200813619A (en) 2008-03-16

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