WO2007111355A1 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- WO2007111355A1 WO2007111355A1 PCT/JP2007/056722 JP2007056722W WO2007111355A1 WO 2007111355 A1 WO2007111355 A1 WO 2007111355A1 JP 2007056722 W JP2007056722 W JP 2007056722W WO 2007111355 A1 WO2007111355 A1 WO 2007111355A1
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- WIPO (PCT)
- Prior art keywords
- light
- light emitting
- emitting device
- emitting element
- translucent
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
- F21V13/04—Combinations of only two kinds of elements the elements being reflectors and refractors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83909—Post-treatment of the layer connector or bonding area
- H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
Definitions
- the present invention relates to a light emitting device using a light source such as a light emitting diode element.
- a light-emitting diode lamp or the like has been developed as a light-emitting device such as a lighting fixture.
- a light-emitting device using this light-emitting diode lamp generates light such as white light by converting light generated by a light-emitting diode element or the like into light having a different wavelength by a fluorescent material or the like.
- light-emitting diode element or the like In lighting fixtures using such light emitting diode elements, lower power consumption and longer life are expected.
- Patent Document 1 Japanese Patent Laid-Open No. 2003-282955
- the present invention has been devised in view of such a problem, and an object thereof is to improve the light emission luminance of a light emitting device.
- a light-emitting device of the present invention includes a base body having an opening composed of a light reflecting surface and a bottom surface, a light-emitting element mounted on the bottom surface of the opening, a translucent member covering the light-emitting element, and a transparent member. And an optical member provided on the optical member.
- the translucent member is provided on the bottom surface of the opening so as to be separated from the light reflecting surface of the opening.
- the present invention provides a translucent light provided on the bottom surface of the opening by being separated from the light reflecting surface force of the opening.
- the efficiency of guiding the light generated by the light emitting element in the light emitting direction can be improved, and the luminance of the light emitting device can be increased.
- FIG. 1 is a perspective view showing the configuration of the light emitting device according to the first embodiment.
- FIG. 2 is a plan perspective view from the wavelength conversion member side of the light emitting device shown in FIG. In Fig. 2, the configuration that can be seen through is shown by dotted lines.
- FIG. 3 is a cross-sectional view taken along line AA ′ of the light emitting device shown in FIG.
- the light emitting device of the present embodiment includes a base 1, a light emitting element (light source) 2 mounted on the base 1, a translucent member 3 covering the light emitting element 2, and a translucent member 3. And an optical member 4 provided thereon.
- the light emitting device according to the present embodiment further includes a wavelength conversion member (wavelength conversion means) 5 covering the optical member 4.
- covering the optical member 4 means that the wavelength converting member 5 is provided at a position where the light emitted by the force of the optical member 4 can reach.
- the substrate 1 has an opening lp composed of a light reflecting surface lr and a bottom surface lu.
- the light reflecting surface lr of the substrate 1 reflects at least part of the light generated by the light emitting element 2 in the light emitting direction D.
- the light emission direction D is the traveling direction of the light output from the light emitting device, and is upward in FIG. 1 (the positive direction of the z axis in the virtual xyz coordinates).
- the light emitting device is shown mounted on the xy plane in a virtual xyz coordinate.
- the front surface (bottom lu) of the substrate 1 corresponds to the plurality of electrodes formed on the light emitting element 2, and first and second connection pads electrically connected to the plurality of electrodes are provided. Yes.
- the light emitting element 2 is a light emitting diode having an upper end 2t and a side surface 2s as shown in FIG. 4, and is provided at the bottom lb of the opening lp of the base 1.
- the light emitting element 2 is mounted on the bottom surface lu of the opening lp of the base 1, and emits light from at least the side surface 2s.
- Light-emitting element 2 emits light having at least a part of wavelengths of 210 nm to 470 nm. To be born.
- light-emitting element 2 is a light-emitting diode that includes a substrate, an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer.
- An n-side electrode and a p-side electrode are provided on the n-type semiconductor layer and the p-type semiconductor layer of the light emitting element 2, respectively.
- the light emitting element 2 is configured to emit light at least in the lateral direction (direction perpendicular to the stacking direction).
- the stacking direction of the light-emitting elements 2 is the z-axis direction in the virtual coordinates
- the lateral sides of the light-emitting elements 2 are the X-axis direction and the y-axis direction in the virtual coordinates.
- the light-emitting element 2 is, for example, a ZnO-based oxide semiconductor light-emitting diode, 230 ⁇ ! A first light having a peak wavelength in a wavelength range of ⁇ 450 nm is generated.
- Other examples of the light-emitting element 2 include compound semiconductors such as silicon carbide (SiC) compound semiconductors, diamond compound semiconductors, and boron nitride compound semiconductors.
- the translucent member 3 covers the light emitting element 2, and is provided on the bottom surface lu of the opening lp so as to be separated from the light reflecting surface lr of the opening lp.
- covering the light emitting element 2 means covering at least a part of the side surface 2s of the light emitting element 2.
- the translucent member 3 surrounds the side surface Is and the upper end It of the light emitting element 2.
- the translucent member 3 has a side surface 3s and an upper surface 3u attached to the optical member 4, and has a function of guiding light emitted from the side surface 2s of the light emitting element 2 in the light emitting direction D.
- the side surface 3s of the translucent member 3 is a light reflecting means having a function of guiding the light emitted from the side surface 2s of the light emitting element 2 in the light emitting direction D by total reflection.
- the translucent member 3 is made of a translucent material such as silicone resin, epoxy resin, and organic-inorganic hybrid resin, and covers the light emitting element 2, and the bottom portion lp of the opening lp of the substrate 1 Is partially provided.
- translucency means that at least a part of wavelengths of light generated by the light emitting element 2 can be transmitted.
- the translucent member 3 is preferably made of silicone resin. Since the silicone resin has better heat resistance than epoxy resin, the influence of heat generated by the light emitting element 2 is reduced. By using the translucent member 3 having excellent heat resistance, thermal modification (discoloration, etc.) of the optical member 4 is reduced.
- the translucent member 3 is provided in contact with the side surface 2s of the light emitting element 2 and the lower surface of the optical member 4 at the bottom lb of the opening lp. That is, the translucent member 3 is formed in the opening lp of the base 1.
- the inner peripheral surface force is provided so as to be separated from each other, and covers the lower surface of the optical member 4 and the side surface 2s of the light emitting element 2.
- Such a translucent member 3 has a function of guiding the light emitted from the side surface 2s of the light emitting element 2 to the optical member 4.
- the refractive index of the translucent member 3 is nl, and the refractive index of the layer (the air layer in FIG.
- translucent member 3 is attached to both the lower surface of optical member 4 and the bottom surface lu of base 1, and between optical member 4 and translucent member 3.
- the side surface 3 s of the translucent member 3 is formed over the surface force of the optical member 4 and the surface of the substrate 1.
- the light emitting device according to the present embodiment has such a configuration to reduce energy loss when light emitted laterally from the light emitting element 2 is guided upward (light emission direction d).
- the reflection of light on the side surface 3s of the translucent member 3 will be described.
- the light emitted from the side surface 2s of the light emitting element 2 is reflected by the side surface 3a of the translucent member 3, and the lower surface of the optical member 4 (the surface of the optical member 4 on the light emitting element 2 side). ).
- the light traveling inside the optical member 4 travels from the upper surface 4u of the optical member 4 (the surface on the light emission direction D side of the optical member 4) to the upper portion of the opening lp, and is emitted to the outside of the light emitting device. .
- the light that is absorbed on the light reflecting surface when reflected on the light reflecting surface is In this case, the light is reflected at the interface 3s between the translucent member 3 and the outside of the translucent member 3 as described above.
- the optical loss on the side surface 3s of the conductive member 3 is smaller. Therefore, the light output of the light-emitting device in this embodiment is enhanced.
- the light loss on the light reflecting surface of the conventional light-emitting device is larger than when the first light is visible light.
- the light emitting device of this embodiment even when a light emitting element that emits ultraviolet light is used, the light emission luminance is increased.
- the side surface 3s of the translucent member 3 has a concave shape.
- the light emitted from the light emitting element 2 to the side is easily totally reflected on the side surface 3s of the translucent member 3, and the light emitting element 2 to the optical member 4 have the above structure. The efficiency of light extraction to the has been improved.
- the translucent member 3 is provided between the upper end 2t of the light emitting element 2 and the lower surface of the optical member 4. As shown in FIG. 6, the thickness X of the translucent member 3 provided on the side surface 2s of the light emitting element 2 is greater than the thickness Y of the translucent member 3 provided between the light emitting element 2 and the optical member 4. Also thick. With such a configuration, the bonding area between the translucent member 3 and the optical member 4 is larger than the area of the side surface 3s of the translucent member 3, and the translucency of the light emitted from the light emitting element 2 is increased. The amount of light (primary light) directly incident on the optical member 4 is larger than the amount of light reflected by the side surface 3s of the member 3.
- the light emitted from the light emitting element 2 is efficiently guided in the light emitting direction D of the light emitting device, and the luminance of the light emitting device is improved.
- the thickness X is twice or more the thickness Y
- the joint area of the translucent member 3 and the optical member 4 is larger than the area of the side surface 3s of the translucent member 3.
- the optical member 4 is disposed above the light-emitting element 2 (light emission direction D of the light-emitting device), and also has a light-transmitting material force such as resin or glass.
- translucency means that at least a part of the wavelength of light generated by the light emitting element 2 can be transmitted.
- the optical member 4 and the translucent member 3 are 380 ⁇ ! ⁇ Transparent or translucent to 830nm light.
- Transparent to light of 380 nm to 830 nm means that the transmittance of light of 380 nm to 830 nm is 80 to 100%, and translucent to light of 380 nm to 830 nm is 3 to 80 nm to 830 nm.
- the light transmittance is 50-80%.
- the optical member 4 has a function of diffusing and emitting the light emitted from the light emitting element 2 and guided by the translucent member 3 in the light emitting direction D.
- the optical member 4 has a flat plate shape, and diffuses light emitted from the light emitting element 2 and guided by the translucent member 3 upward (in the direction of the wavelength converting member 5). It radiates.
- Another configuration example of the optical member 4 has a convex upper surface, and radiates light emitted by the light emitting element 2 and guided by the light transmissive member 3 upward (in the direction of the wavelength converting member 5). There is something to do.
- the optical member 4 diffuses the light generated by the light emitting element 2 and guides it in the light emitting direction D, so that the point light emission by the light emitting element 2 becomes surface light emission, and uneven light emission on the light emitting surface of the light emitting device. Has been reduced.
- the wavelength conversion member 5 has a sheet shape.
- the wavelength converting member 5 (wavelength converting means) converts the wavelength of the light generated by the light emitting element 2 and emits it.
- the wavelength conversion member 5 is disposed above the light emitting element 2 and closes the opening lp of the substrate 1.
- the wavelength conversion member 5 is made by mixing a fluorescent substance into the resin, and the first light emitted from the light emitting element 2 is peaked in a second wavelength range different from the wavelength range of the first light. It has a function of converting to a second light having a light and outputting it.
- the light emitting device of the present invention outputs white light, and there are the following combinations of the light emitting element 2 and the fluorescent material.
- the fluorescent material When the light-emitting element 2 generates the first light having at least a part of the wavelength of 440 nm to 470 nm (blue), the fluorescent material has a relationship of 565 ⁇ ! A material that emits a second light having at least a part of wavelengths of ⁇ 590 nm (yellow) is used.
- This fluorescent material is (Y, Gd) (Al, Ga) O: C
- the light emitting device is a mixed light of the blue light generated by the light emitting element 2 and transmitted through the wavelength conversion member 5 and the yellow light emitted from the wavelength conversion member 5. White light is emitted.
- the light-emitting element 2 As another combination of the light-emitting element 2 and the fluorescent material, the light-emitting element 2 generates the first light having at least a part of the wavelength of 40 nm to 470 nm (blue). One that emits second light having at least a part of wavelengths of ⁇ 565 nm (green) and third light having at least a part of wavelengths of 625 nm to 74 Onm (red) is used.
- the light-emitting device is a mixture of the blue light generated by the light-emitting element 2 and transmitted through the wavelength conversion member 5 and the green light and red light emitted from the wavelength conversion member 5. White light that is light is emitted.
- the light-emitting element 2 when the light-emitting element 2 generates the first light having at least a part of wavelengths of 210 nm to 400 nm (ultraviolet light), A second light having at least a portion of wavelengths between 440 nm and 470 nm (blue); and 520 nm A material that emits third light having at least a part of wavelengths of ⁇ 565 nm (green) and fourth light having at least a part of wavelengths of 625 nm to 740 nm (red) is used.
- the light emitting device In the case of the combination of the light emitting element 2 and the fluorescent material, the light emitting device emits white light which is a mixed light of blue, green light and red light emitted from the wavelength conversion member 5.
- the light emitting surface of the light emitting device (the upper surface of the wavelength conversion member 5) is disposed in parallel to the surface located on the light emitting surface side of the optical member 4.
- the light emitting device of the present embodiment is configured to guide light generated by the light emitting element 2 upward by total light reflection on the side surface 3s of the translucent member 3, so that the optical axis of the light emitting surface 5u is (Center axis) It has a half-value angle ⁇ of 30 to 70 degrees with respect to C.
- the half-value angle ⁇ is a point A on the optical axis C where the emission intensity peaks in the virtual illumination region R, and the emission intensity half of the peak value in the virtual illumination region R. This is the point ⁇ that is also the force of point B and point O on the optical axis C on the light emitting surface 5u.
- the manufacturing method of the light emitting device of the present embodiment includes the following steps (a) to (. Steps (a) to (e) shown in FIG. 8 are steps (a) to (e )
- the light emitting element 2 is mounted on the bottom surface lu of the opening lp of the substrate 1.
- the wavelength conversion member 5 is provided in the opening lp of the substrate 1.
- a frame member for molding the translucent member 3 into a desired shape is formed on the bottom surface lu. It is also possible to fill the inside of the frame member with the melted translucent member 3.
- FIG. 9 is a perspective view showing the configuration of the light emitting device according to the second embodiment.
- FIG. 10 is a cross-sectional view showing the configuration of the light emitting device of this embodiment.
- FIG. 11 is a perspective view showing the configuration of the base 21 in the present embodiment.
- FIG. 12 is a perspective view showing the configuration of the translucent member 23 in the present embodiment.
- FIG. 13 is a perspective view showing the configuration of the optical member 24 in the present embodiment.
- the light emitting device of the present embodiment includes a base 21, a light emitting element (light source) 22 mounted on the base 21, a translucent member 23 covering the light emitting element 22, and a translucent member 23. And an optical member 24 provided thereon.
- the light emitting device according to the present embodiment further includes a wavelength conversion member (wavelength conversion means) 25 covering the optical member 24.
- covering the optical member 24 means that the wavelength converting member 25 is provided at a position where the light emitted from the optical member 24 reaches.
- the base 21 has an opening 21p including a light reflecting surface 21r and a bottom surface lu.
- the light reflecting surface 21r of the base 21 reflects light of at least a part of the light generated by the light emitting element 22 in the light emitting direction D.
- the light emission direction D is the traveling direction of the light output from the light emitting device, and is upward in FIG. 9 (the positive direction of the z axis in the virtual X yz coordinates).
- the light emitting device is shown mounted on the xy plane in the virtual xyz coordinates.
- the light emitting element 22 is mounted on the bottom surface 21u of the opening 21p of the base body 21 as in the configuration of the first embodiment, and at least the side force radiates light.
- the translucent member 23 covers the light emitting element 22 as in the configuration of the first embodiment, and is spaced apart from the light reflecting surface 21r of the opening 21p. It is provided on the bottom 21u.
- covering the light emitting element 22 means covering at least a part of the side surface of the light emitting element 22.
- the translucent member 23 surrounds the side surface and the upper end of the light emitting element 22.
- the translucent member 23 has a side surface and an upper surface attached to the optical member 24, and has a function of guiding the light emitted by the side force of the light emitting element 22 in the light emitting direction D.
- the side surface of the translucent member 23 is light emitted from the side surface of the light emitting element 22. Is a light reflecting means having a function of guiding the light in the light emitting direction D by total reflection.
- the side surface of the translucent member 23 is in contact with a space (air layer) having a refractive index smaller than that of the translucent member 23.
- the optical member 24 is disposed above the light emitting element 22 (light emission direction D of the light emitting device), as in the configuration of the first embodiment.
- translucency means that at least part of the wavelength of light generated by the light emitting element 2 can be transmitted.
- the optical member 24 has a function of diffusing and radiating light emitted from the light emitting element 22 and guided by the translucent member 23 in the light emitting direction D.
- the optical member 24 has a dome-shaped upper surface, and radiates the light emitted from the light emitting element 22 and guided by the translucent member 23 to the wavelength conversion member 25. There is something.
- the optical member 24 is attached to the translucent member 23 and placed on the surface of the base 21. The optical member 24 diffuses the light generated by the light emitting element 22 and guides it to the wavelength conversion member 25, so that the point emission by the light emitting element 22 is surface emission, and uneven light emission on the light emitting surface of the light emitting device. Reduced.
- the wavelength conversion member 25 has a dome shape and is attached to the upper surface of the translucent member 24.
- the wavelength conversion member 25 is attached on the base 21 so as to cover the translucent member 24.
- the wavelength converting member 25 converts the wavelength of the light generated by the light emitting element 22 and guided by the translucent member 24 and emits the converted light.
- the optical characteristics of the light emitting element 22 and the example of the fluorescent material of the wavelength conversion member 25 are the same as those in the first embodiment.
- the light emitted also from the side force of the light emitting element 22 is totally reflected on the side surface of the translucent member 23 and guided to the optical member 24.
- the light guided to the optical member 24 is emitted to the wavelength conversion member 25 by the optical member 24.
- the light emitted to the wavelength conversion member 25 is converted to a different wavelength by the wavelength conversion member 25 and emitted to the outside of the light emitting device.
- the light generated by the light emitting element 22 is converted into the optical member 2 by the total reflection of light caused by the difference in refractive index between the inside and the outside of the translucent member 23. 4 to improve the light extraction efficiency from the light emitting element 22 to the wavelength conversion member 25.
- the emission brightness is increased.
- the optical member 24 since the optical member 24 has a dome-shaped upper surface, unevenness in the amount of light guided to the wavelength conversion member 25 is reduced, and unevenness in emission color is caused. Has been reduced.
- FIG. 15 is a perspective view showing the configuration of the light emitting device of the third embodiment.
- FIG. 16 is a cross-sectional view showing the configuration of the light-emitting device of the present embodiment.
- FIG. 17 is a perspective view showing the configuration of the translucent member 33 of the present embodiment.
- FIG. 18 is a perspective view showing the configuration of the optical member 34 in the present embodiment.
- the light emitting device of the present embodiment includes a base 31, a light emitting element (light source) 32 mounted on the base 31, a translucent member 34 covering the light emitting element 32, and a translucent member 34. And an optical member 35 provided thereon.
- the light emitting device in the present embodiment further includes a wavelength conversion member 35 that covers the translucent member 33 and the optical member 34.
- covering the translucent member 33 means that the wavelength conversion member 35 is provided at a position where the light generated by the light emitting element 32 and transmitted through the translucent member 33 reaches.
- Covering the optical member 34 means that the wavelength conversion member 35 is provided at a position where the light emitted from the optical member 34 reaches.
- the configuration of the present embodiment is different from the configuration of the second embodiment in that the wavelength conversion member 35 is the same surface as the surface (upper surface 31u) of the substrate 31 on which the light emitting element 32 is mounted. It is provided above. Other configurations in the present embodiment are the same as those in the second embodiment.
- the light transmissive member 33 is provided on the upper surface 31 u of the base 31 so as to cover the light emitting element 32.
- covering the light emitting element 32 means covering at least part of the side surface of the light emitting element 32.
- the translucent member 33 surrounds the side surface and the upper end of the light emitting element 32.
- the translucent member 33 has a side surface that guides the light emitted from the side surface of the light emitting element 32 to the optical member 34 by total reflection, and an upper surface attached to the optical member 34.
- the optical member 34 is lifted from the upper surface 31u of the base 31 by the thickness H of the translucent member 33. Is attached to the upper surface of the translucent member 33.
- the optical member 34 has a dome-shaped upper surface.
- the wavelength conversion member 35 surrounds the translucent member 33 with a translucent layer 36 having a refractive index smaller than the refractive index of the translucent member 33 between the wavelength conversion member 35 and the translucent member 33.
- surrounding the translucent member 33 means that the wavelength conversion member 35 is provided at a position where the light generated by the light emitting element 32 and transmitted through the translucent member 33 reaches.
- the translucent layer 36 is an air layer.
- the translucency of the layer 36 means that at least part of the wavelength of the light generated by the light emitting element 32 can be transmitted.
- Another example of the translucent layer 36 is a layer made of a resin material having a refractive index smaller than that of the translucent member 33.
- the light-emitting device of the present embodiment reflects light emitted from the light-emitting element on the side surface of the light-emitting member 33 and guides it to the optical member 34. Further, the light extraction efficiency to the wavelength conversion member 35 is improved, and the light emission luminance is improved.
- the light generated by the light emitting element 32 is guided to the optical member 34 through the translucent member 33 and is emitted from the optical member 34 to the wavelength conversion member 35.
- the uneven color of the emitted light is reduced as compared with the configuration in which the light generated by the light emitting element directly reaches the wavelength conversion member.
- FIG. 20 (a) is a cross-sectional view showing the configuration of the optical member in the fourth embodiment of the light emitting device of the present invention.
- This light-emitting device is different from that shown in the first embodiment in that the outer peripheral portion of the optical member 44 is located outside the translucent member 3. That is, the outer edge of the optical member 44 is located outside the outer edge of the translucent member 3 in the planar see-through of the light-emitting device shown in FIG. 20B (see-through from the light-emitting surface side of the light-emitting device). .
- FIG. 20 is a perspective view showing an optical member in the fifth embodiment of the light emitting device of the present invention.
- This light-emitting device differs from that shown in the first embodiment in that a protrusion 57 is provided at the center of the upper surface of the optical member 54. That is, in the light emitting device according to the present embodiment, the thickness of the central region of the optical member 54 is thicker than the thickness of the outer peripheral region.
- Other configurations are the same as those of the first embodiment.
- the projecting portion 57 which is the light emitting surface of the optical member 54, has a translucent member. 3 is hard to deposit. Therefore, light absorption due to the light-transmitting member 3 adhering to the light exit surface of the optical member 54 is reduced, and the light emission luminance is improved.
- FIG. 22 is a cross-sectional view showing an optical member in the fourth embodiment of the light-emitting device of the present invention.
- a translucent protective film 68 is formed on the surface of the optical member 64 on the light emitting element 2 side (the lower surface of the optical member 64 in FIG. 22).
- a protective film 68 an inorganic insulating film (SiN film, SiNO film, etc.), a carbon-based thin film (DLC film, CN film, amorphous carbon film), metal oxide film (W02) , CaF2, A1203, etc.).
- SiN film an inorganic insulating film
- DLC film a carbon-based thin film
- CN film amorphous carbon film
- W02 metal oxide film
- CaF2, A1203 CaF2, A1203, etc.
- FIG. 22 shows a structure in which only the lower surface of the optical member 64 is covered with the protective film 68, but as another configuration, as shown in FIG. There is a structure that covers the lower surface of the transparent member and the side of the translucent member 3. With such a structure, the influence of moisture on the light emitting element 2 is further reduced.
- the protective film 68 used in FIG. 23 is made of a material that totally reflects the light emitted from the side surface of the light-emitting element 2 on the side surface of the translucent member 3 or the surface of the protective film 68.
- FIG. 24 is a diagram showing a configuration of the base 71 in the seventh embodiment of the light-emitting device of the present invention.
- a recess 73 is provided in a region of the base 71 where the translucent member 3 is provided.
- a recess 73 is formed on the surface of the base 71 located on the outer periphery of the region to which the translucent member 3 is joined. With such a configuration, the wet spreading force S of the translucent member 3 on the surface of the base 71 is reduced. For this reason, the shape of the translucent member 3 can be changed to a desired shape, and the light emission luminance is improved.
- the cross-sectional shape of the recess 73 is rectangular.
- Another example of the cross-sectional shape of the recess 73 is a curved surface shape.
- the translucent member 3 flowing into the recess 73 is filled along the inner surface of the recess 73, and the amount of bubbles (gas) to be entrained is reduced. This makes it difficult for the base 71 and the translucent member 3 to peel off.
- FIG. 25 is a diagram showing the configuration of the light emitting device according to the tenth embodiment of the present invention.
- the side surface of the first translucent member 3 is covered between the inner peripheral surface of the opening of the substrate 1 and the first translucent member 3, and the refractive index is higher than that of the first translucent member 3.
- the second translucent member 86 is provided at a low level.
- the refractive index of the first translucent member 3 is nl
- the refractive index of the second translucent member 86 is n3
- the inner periphery of the second translucent member 86 and the opening is n2
- the refractive indexes nl, n2, and n3 satisfy the relationship nl> n3> n2.
- the light-emitting device of the present embodiment has the first The light transmitted through the first light transmissive member 3 without being reflected by the side surface of the light transmissive member 3 is reflected by the side surface of the second light transmissive member 86 and guided to the optical member 4.
- FIG. 1 is a perspective view showing a configuration of a first embodiment.
- FIG. 2 is a plan perspective view showing the configuration of the first embodiment.
- FIG. 3 is a cross-sectional view showing the configuration of the first embodiment.
- FIG. 4 is a perspective view showing a configuration of translucent member 3 in the first embodiment.
- FIG. 5 is a sectional view showing an optical function in the first embodiment.
- FIG. 6 is a cross-sectional view showing a configuration of translucent member 3 in the first embodiment.
- FIG. 7 is a cross-sectional view showing optical characteristics in the first embodiment.
- FIG. 8 is a perspective view showing the manufacturing method of the first embodiment.
- FIG. 9 is a perspective view showing the configuration of the second embodiment.
- ⁇ 10 A cross-sectional view showing the configuration of the second embodiment.
- FIG. 11 is a perspective view showing a configuration of the base 21 in the second embodiment.
- FIG. 12 A perspective view showing a configuration of a translucent member 23 in the second embodiment.
- FIG. 13 A perspective view showing the configuration of the optical member 24 in the second embodiment.
- 14 A sectional view showing an optical function in the second embodiment.
- FIG. 15 is a perspective view showing the configuration of the third embodiment.
- FIG. 16 is a cross-sectional view showing the configuration of the third embodiment.
- FIG. 17 It is a perspective view showing a configuration of a translucent member 33 in the third embodiment.
- ⁇ 18 A perspective view showing a configuration of an optical member 34 in the third embodiment.
- FIG. 19 is a sectional view showing an optical function in the third embodiment.
- FIG. 20 is a diagram showing a configuration of a fourth embodiment.
- ⁇ 21 It is a perspective view showing the configuration of the fifth embodiment.
- FIG. 22 is a cross-sectional view showing the configuration of the sixth embodiment.
- FIG. 23 is a cross-sectional view showing another configuration of the sixth embodiment.
- ⁇ 24 It is a perspective view showing the configuration of the seventh embodiment.
- Wavelength conversion member D Light exit direction
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Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE112007000775T DE112007000775B4 (de) | 2006-03-28 | 2007-03-28 | Lichtemittierende Vorrichtung |
| JP2008507521A JP5025636B2 (ja) | 2006-03-28 | 2007-03-28 | 発光装置 |
| CN2007800106752A CN101410993B (zh) | 2006-03-28 | 2007-03-28 | 发光装置 |
| US12/294,850 US8710737B2 (en) | 2006-03-28 | 2007-03-28 | Light-emitting device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006089446 | 2006-03-28 | ||
| JP2006-089446 | 2006-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007111355A1 true WO2007111355A1 (ja) | 2007-10-04 |
Family
ID=38541271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/056722 Ceased WO2007111355A1 (ja) | 2006-03-28 | 2007-03-28 | 発光装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8710737B2 (ja) |
| JP (1) | JP5025636B2 (ja) |
| CN (1) | CN101410993B (ja) |
| DE (1) | DE112007000775B4 (ja) |
| WO (1) | WO2007111355A1 (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012011460A1 (ja) * | 2010-07-22 | 2012-01-26 | 京セラ株式会社 | 発光装置 |
| EP2482346A1 (en) * | 2011-01-28 | 2012-08-01 | Nichia Corporation | Light emitting device |
| JP2013522838A (ja) * | 2010-03-16 | 2013-06-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明装置 |
| JP2013235854A (ja) * | 2007-10-17 | 2013-11-21 | Xicato Inc | 発光ダイオードを備えた照明装置 |
| EP2740995A4 (en) * | 2011-08-01 | 2015-03-11 | Civilight Shenzhen Semiconductor Lighting Co Ltd | LED LAMP AND METHOD FOR IMPROVED LIGHTING EFFECTS THEREWITH |
| WO2018008064A1 (ja) * | 2016-07-04 | 2018-01-11 | 堺ディスプレイプロダクト株式会社 | 光源装置及び表示装置 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101994991B (zh) * | 2009-08-27 | 2012-02-29 | 杨璨源 | 节能灯 |
| US20120161186A1 (en) * | 2009-10-29 | 2012-06-28 | Kyocera Corporation | Light-emitting device |
| JP6275399B2 (ja) * | 2012-06-18 | 2018-02-07 | エルジー イノテック カンパニー リミテッド | 照明装置 |
| US9507204B2 (en) * | 2013-06-26 | 2016-11-29 | Seoul Semiconductor Co., Ltd. | Baffled micro-optical elements for thin liquid crystal display backlight units |
| JP6484982B2 (ja) * | 2014-09-30 | 2019-03-20 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| KR20170105312A (ko) * | 2016-03-09 | 2017-09-19 | (주)아이투에이시스템즈 | 다축 힘센서 및 이를 이용한 장치 |
| TWI869735B (zh) * | 2022-12-06 | 2025-01-11 | 葳天科技股份有限公司 | 發光結構 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127186A (ja) * | 1984-11-22 | 1986-06-14 | Sharp Corp | 逆円錐型発光素子ランプ |
| JP2001036147A (ja) * | 1999-07-22 | 2001-02-09 | Nichia Chem Ind Ltd | 発光ダイオード |
| JP2002314142A (ja) * | 2001-04-09 | 2002-10-25 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2003303999A (ja) * | 2002-04-05 | 2003-10-24 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
| JP2005109172A (ja) * | 2003-09-30 | 2005-04-21 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP2005158949A (ja) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | 発光装置 |
| JP2006013198A (ja) * | 2004-06-28 | 2006-01-12 | Kyocera Corp | 発光素子収納用パッケージ、発光装置および照明装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| DE19918370B4 (de) * | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
| JP2001203392A (ja) * | 2000-01-19 | 2001-07-27 | Matsushita Electric Works Ltd | 発光ダイオード |
| JP2002050797A (ja) | 2000-07-31 | 2002-02-15 | Toshiba Corp | 半導体励起蛍光体発光装置およびその製造方法 |
| AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| JP2003282955A (ja) | 2001-07-19 | 2003-10-03 | Rohm Co Ltd | 反射ケース付半導体発光装置 |
| US6670648B2 (en) | 2001-07-19 | 2003-12-30 | Rohm Co., Ltd. | Semiconductor light-emitting device having a reflective case |
| TW591990B (en) * | 2001-07-25 | 2004-06-11 | Sanyo Electric Co | Method for making an illumination device |
| WO2005053041A1 (ja) | 2003-11-25 | 2005-06-09 | Matsushita Electric Works, Ltd. | 発光ダイオードチップを用いた発光装置 |
| WO2005104247A1 (ja) | 2004-04-19 | 2005-11-03 | Matsushita Electric Industrial Co., Ltd. | Led照明光源の製造方法およびled照明光源 |
| WO2005107420A2 (en) * | 2004-05-05 | 2005-11-17 | Rensselaer Polytechnic Institute | High efficiency light source using solid-state emitter and down-conversion material |
-
2007
- 2007-03-28 JP JP2008507521A patent/JP5025636B2/ja not_active Expired - Fee Related
- 2007-03-28 WO PCT/JP2007/056722 patent/WO2007111355A1/ja not_active Ceased
- 2007-03-28 DE DE112007000775T patent/DE112007000775B4/de not_active Expired - Fee Related
- 2007-03-28 US US12/294,850 patent/US8710737B2/en not_active Expired - Fee Related
- 2007-03-28 CN CN2007800106752A patent/CN101410993B/zh not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127186A (ja) * | 1984-11-22 | 1986-06-14 | Sharp Corp | 逆円錐型発光素子ランプ |
| JP2001036147A (ja) * | 1999-07-22 | 2001-02-09 | Nichia Chem Ind Ltd | 発光ダイオード |
| JP2002314142A (ja) * | 2001-04-09 | 2002-10-25 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2003303999A (ja) * | 2002-04-05 | 2003-10-24 | Citizen Electronics Co Ltd | 表面実装型発光ダイオード |
| JP2005109172A (ja) * | 2003-09-30 | 2005-04-21 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP2005158949A (ja) * | 2003-11-25 | 2005-06-16 | Matsushita Electric Works Ltd | 発光装置 |
| JP2006013198A (ja) * | 2004-06-28 | 2006-01-12 | Kyocera Corp | 発光素子収納用パッケージ、発光装置および照明装置 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013235854A (ja) * | 2007-10-17 | 2013-11-21 | Xicato Inc | 発光ダイオードを備えた照明装置 |
| US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
| JP2013522838A (ja) * | 2010-03-16 | 2013-06-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 照明装置 |
| WO2012011460A1 (ja) * | 2010-07-22 | 2012-01-26 | 京セラ株式会社 | 発光装置 |
| CN102918666A (zh) * | 2010-07-22 | 2013-02-06 | 京瓷株式会社 | 发光装置 |
| US8624491B2 (en) | 2010-07-22 | 2014-01-07 | Kyocera Corporation | Light emitting device |
| JP5634519B2 (ja) * | 2010-07-22 | 2014-12-03 | 京セラ株式会社 | 発光装置 |
| CN102918666B (zh) * | 2010-07-22 | 2015-09-09 | 京瓷株式会社 | 发光装置 |
| EP2482346A1 (en) * | 2011-01-28 | 2012-08-01 | Nichia Corporation | Light emitting device |
| US9123867B2 (en) | 2011-01-28 | 2015-09-01 | Nichia Corporation | Light emitting device |
| EP2740995A4 (en) * | 2011-08-01 | 2015-03-11 | Civilight Shenzhen Semiconductor Lighting Co Ltd | LED LAMP AND METHOD FOR IMPROVED LIGHTING EFFECTS THEREWITH |
| WO2018008064A1 (ja) * | 2016-07-04 | 2018-01-11 | 堺ディスプレイプロダクト株式会社 | 光源装置及び表示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112007000775B4 (de) | 2012-12-06 |
| CN101410993A (zh) | 2009-04-15 |
| CN101410993B (zh) | 2011-04-13 |
| US8710737B2 (en) | 2014-04-29 |
| US20130200784A1 (en) | 2013-08-08 |
| JPWO2007111355A1 (ja) | 2009-08-13 |
| DE112007000775T5 (de) | 2009-01-15 |
| JP5025636B2 (ja) | 2012-09-12 |
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