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WO2007103887A3 - Semiconductor manufacturing process modules - Google Patents

Semiconductor manufacturing process modules Download PDF

Info

Publication number
WO2007103887A3
WO2007103887A3 PCT/US2007/063333 US2007063333W WO2007103887A3 WO 2007103887 A3 WO2007103887 A3 WO 2007103887A3 US 2007063333 W US2007063333 W US 2007063333W WO 2007103887 A3 WO2007103887 A3 WO 2007103887A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor manufacturing
manufacturing process
process modules
modules
variety
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/063333
Other languages
French (fr)
Other versions
WO2007103887A2 (en
Inventor
Der Meulen Peter Van
Chris Kiley
Patrick D Pannese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blueshift Technologies Inc
Original Assignee
Blueshift Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blueshift Technologies Inc filed Critical Blueshift Technologies Inc
Publication of WO2007103887A2 publication Critical patent/WO2007103887A2/en
Publication of WO2007103887A3 publication Critical patent/WO2007103887A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

A variety of process modules are described for use in semiconductor manufacturing processes.
PCT/US2007/063333 2006-03-05 2007-03-05 Semiconductor manufacturing process modules Ceased WO2007103887A2 (en)

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
US77946306P 2006-03-05 2006-03-05
US77960906P 2006-03-05 2006-03-05
US77968406P 2006-03-05 2006-03-05
US77970706P 2006-03-05 2006-03-05
US77947806P 2006-03-05 2006-03-05
US60/779,463 2006-03-05
US60/779,478 2006-03-05
US60/779,609 2006-03-05
US60/779,707 2006-03-05
US60/779,684 2006-03-05
US78483206P 2006-03-21 2006-03-21
US60/784,832 2006-03-21
US74616306P 2006-05-01 2006-05-01
US60/746,163 2006-05-01
US80718906P 2006-07-12 2006-07-12
US60/807,189 2006-07-12
US82345406P 2006-08-24 2006-08-24
US60/823,454 2006-08-24

Publications (2)

Publication Number Publication Date
WO2007103887A2 WO2007103887A2 (en) 2007-09-13
WO2007103887A3 true WO2007103887A3 (en) 2008-06-12

Family

ID=39494162

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2007/063311 Ceased WO2007103870A2 (en) 2006-03-05 2007-03-05 Bypass thermal adjuster for vacuum semiconductor processing
PCT/US2007/063333 Ceased WO2007103887A2 (en) 2006-03-05 2007-03-05 Semiconductor manufacturing process modules
PCT/US2007/063345 Ceased WO2007103896A2 (en) 2006-03-05 2007-03-05 Wafer center finding

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2007/063311 Ceased WO2007103870A2 (en) 2006-03-05 2007-03-05 Bypass thermal adjuster for vacuum semiconductor processing

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2007/063345 Ceased WO2007103896A2 (en) 2006-03-05 2007-03-05 Wafer center finding

Country Status (4)

Country Link
JP (2) JP5959138B2 (en)
KR (2) KR20080111036A (en)
SG (1) SG172675A1 (en)
WO (3) WO2007103870A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7988399B2 (en) 2003-11-10 2011-08-02 Brooks Automation, Inc. Mid-entry load lock for semiconductor handling system
US8500388B2 (en) 2003-11-10 2013-08-06 Brooks Automation, Inc. Semiconductor wafer handling and transport

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US8064070B2 (en) 2008-01-25 2011-11-22 Applied Materials, Inc. Methods and apparatus for an integral local substrate center finder for I/O and chamber slit valves
CN102598130A (en) * 2009-08-26 2012-07-18 威科仪器股份有限公司 System for fabricating a pattern on magnetic recording media
US8406918B2 (en) * 2009-12-21 2013-03-26 WD Media, LLC Master teaching jig
US11587813B2 (en) 2013-12-17 2023-02-21 Brooks Automation Us, Llc Substrate transport apparatus
US10134621B2 (en) * 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus
JP7409800B2 (en) * 2019-08-09 2024-01-09 川崎重工業株式会社 Robot control device, robot, and robot control method
CN110767587B (en) * 2019-10-21 2022-04-01 西安奕斯伟材料科技有限公司 Wafer processing device and loading and unloading method
KR102289382B1 (en) * 2019-12-31 2021-08-12 한국기술교육대학교 산학협력단 Position calibrating method for semiconductor factory
US11813757B2 (en) 2020-10-13 2023-11-14 Applied Materials, Inc. Centerfinding for a process kit or process kit carrier at a manufacturing system
KR102850689B1 (en) 2020-12-02 2025-08-26 에스케이실트론 주식회사 Apparatus and method for adjusting position of polishing block
CN113658901B (en) * 2021-10-21 2022-01-21 西安奕斯伟材料科技有限公司 Method and system for positioning center of V-shaped notch of wafer and computer storage medium

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US3740617A (en) * 1968-11-20 1973-06-19 Matsushita Electronics Corp Semiconductor structure and method of manufacturing same
US20050111938A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US6962644B2 (en) * 2002-03-18 2005-11-08 Applied Materials, Inc. Tandem etch chamber plasma processing system

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US6530732B1 (en) * 1997-08-12 2003-03-11 Brooks Automation, Inc. Single substrate load lock with offset cool module and buffer chamber
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KR20060028643A (en) * 2003-06-24 2006-03-30 코닌클리케 필립스 일렉트로닉스 엔.브이. A method of moving a device provided with a camera to a desired position through a control system, and such a system
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US3740617A (en) * 1968-11-20 1973-06-19 Matsushita Electronics Corp Semiconductor structure and method of manufacturing same
US6962644B2 (en) * 2002-03-18 2005-11-08 Applied Materials, Inc. Tandem etch chamber plasma processing system
US20050111938A1 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7988399B2 (en) 2003-11-10 2011-08-02 Brooks Automation, Inc. Mid-entry load lock for semiconductor handling system
US8500388B2 (en) 2003-11-10 2013-08-06 Brooks Automation, Inc. Semiconductor wafer handling and transport

Also Published As

Publication number Publication date
KR101570626B1 (en) 2015-11-19
JP5959138B2 (en) 2016-08-02
WO2007103896A2 (en) 2007-09-13
KR20080111036A (en) 2008-12-22
JP2013231726A (en) 2013-11-14
SG172675A1 (en) 2011-07-28
WO2007103870A3 (en) 2008-11-27
WO2007103896A3 (en) 2008-07-10
WO2007103887A2 (en) 2007-09-13
WO2007103870A2 (en) 2007-09-13
KR20140042925A (en) 2014-04-07
JP2009529248A (en) 2009-08-13
JP5689920B2 (en) 2015-03-25

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