WO2007100538A3 - Procédé de fabrication de contacts segmentés pour détecteurs de rayonnement par photolithographie directe - Google Patents
Procédé de fabrication de contacts segmentés pour détecteurs de rayonnement par photolithographie directe Download PDFInfo
- Publication number
- WO2007100538A3 WO2007100538A3 PCT/US2007/004319 US2007004319W WO2007100538A3 WO 2007100538 A3 WO2007100538 A3 WO 2007100538A3 US 2007004319 W US2007004319 W US 2007004319W WO 2007100538 A3 WO2007100538 A3 WO 2007100538A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation detectors
- direct photolithography
- making segmented
- segmented contacts
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/022—Manufacture or treatment of image sensors covered by group H10F39/12 of image sensors having active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/191—Photoconductor image sensors
- H10F39/195—X-ray, gamma-ray or corpuscular radiation imagers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Light Receiving Elements (AREA)
- Measurement Of Radiation (AREA)
Abstract
Cette invention concerne un procédé de fabrication de contacts sur des substrats semi-conducteurs par lithographie directe qui permet d'obtenir une adhérence durable des électrodes, une plus grande résistance interpixel, ainsi que les électrodes servant de contact de blocage, ce qui améliore la résolution énergétique dans le détecteur de rayonnement ainsi produit.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008556380A JP2009527922A (ja) | 2006-02-22 | 2007-02-21 | ダイレクトフォトリソグラフィーを用いた、放射線検出器のためのセグメント化接触子の製造方法 |
| EP07751102.0A EP1996961A4 (fr) | 2006-02-22 | 2007-02-21 | Procédé de fabrication de contacts segmentés pour détecteurs de rayonnement par photolithographie directe |
| IL193577A IL193577A0 (en) | 2006-02-22 | 2008-08-20 | Method of making segmented contacts for radiation detectors using direct photolitography |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2,541,256 | 2006-02-22 | ||
| CA 2541256 CA2541256A1 (fr) | 2006-02-22 | 2006-02-22 | Electrode de protection pour detecteur monolithique de rayonnement |
| US11/527,707 US7223982B1 (en) | 2006-02-22 | 2006-09-27 | Segmented radiation detector with side shielding cathode |
| US11/527,707 | 2006-09-27 | ||
| US11/633,091 | 2006-12-04 | ||
| US11/633,091 US7728304B2 (en) | 2006-02-22 | 2006-12-04 | Method of making segmented contacts for radiation detectors using direct photolithography |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2007100538A2 WO2007100538A2 (fr) | 2007-09-07 |
| WO2007100538A3 true WO2007100538A3 (fr) | 2008-04-24 |
Family
ID=38459512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/004319 Ceased WO2007100538A2 (fr) | 2006-02-22 | 2007-02-21 | Procédé de fabrication de contacts segmentés pour détecteurs de rayonnement par photolithographie directe |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2007100538A2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103097913A (zh) * | 2010-09-13 | 2013-05-08 | 皇家飞利浦电子股份有限公司 | 具有操纵电极的辐射探测器 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8614423B2 (en) * | 2009-02-02 | 2013-12-24 | Redlen Technologies, Inc. | Solid-state radiation detector with improved sensitivity |
| JP5297907B2 (ja) * | 2009-06-18 | 2013-09-25 | 浜松ホトニクス株式会社 | 光検出装置 |
| US20130049151A1 (en) * | 2011-08-31 | 2013-02-28 | General Electric Company | Anode-illuminated radiation detector |
| WO2016002455A1 (fr) | 2014-07-03 | 2016-01-07 | Jx日鉱日石金属株式会社 | Corps de structure d'électrode ubm de détecteur de rayonnement, détecteur de rayonnement, et procédé de fabrication associé |
| CN108027448B (zh) * | 2015-10-09 | 2022-02-11 | 深圳帧观德芯科技有限公司 | 半导体x射线检测器的封装方法 |
| CN116666405B (zh) * | 2023-07-31 | 2023-09-26 | 山西创芯光电科技有限公司 | 用于测试表面漏电流的器件结构及其制备方法和测试方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4144090A (en) * | 1977-10-25 | 1979-03-13 | Ppg Industries, Inc. | Non-oxidative removal of gold films |
| US5677539A (en) * | 1995-10-13 | 1997-10-14 | Digirad | Semiconductor radiation detector with enhanced charge collection |
| US5905624A (en) * | 1998-05-29 | 1999-05-18 | Northwest Magnet, Inc. | Electromagnet control system having printed circuit board variable voltage selection array |
| US6212093B1 (en) * | 2000-01-14 | 2001-04-03 | North Carolina State University | High-density non-volatile memory devices incorporating sandwich coordination compounds |
| US20020158207A1 (en) * | 1996-11-26 | 2002-10-31 | Simage, Oy. | Forming contacts on semiconductor substrates for radiation detectors and imaging devices |
| US20040052456A1 (en) * | 2000-05-26 | 2004-03-18 | Pierpaolo Boffi | Cdznte eletro-optical switch |
| US20050167606A1 (en) * | 2003-08-20 | 2005-08-04 | Harrison Fiona A. | Cadmium-zinc-telluride detectors |
-
2007
- 2007-02-21 WO PCT/US2007/004319 patent/WO2007100538A2/fr not_active Ceased
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4144090A (en) * | 1977-10-25 | 1979-03-13 | Ppg Industries, Inc. | Non-oxidative removal of gold films |
| US5677539A (en) * | 1995-10-13 | 1997-10-14 | Digirad | Semiconductor radiation detector with enhanced charge collection |
| US20020158207A1 (en) * | 1996-11-26 | 2002-10-31 | Simage, Oy. | Forming contacts on semiconductor substrates for radiation detectors and imaging devices |
| US5905624A (en) * | 1998-05-29 | 1999-05-18 | Northwest Magnet, Inc. | Electromagnet control system having printed circuit board variable voltage selection array |
| US6212093B1 (en) * | 2000-01-14 | 2001-04-03 | North Carolina State University | High-density non-volatile memory devices incorporating sandwich coordination compounds |
| US20040052456A1 (en) * | 2000-05-26 | 2004-03-18 | Pierpaolo Boffi | Cdznte eletro-optical switch |
| US20050167606A1 (en) * | 2003-08-20 | 2005-08-04 | Harrison Fiona A. | Cadmium-zinc-telluride detectors |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103097913A (zh) * | 2010-09-13 | 2013-05-08 | 皇家飞利浦电子股份有限公司 | 具有操纵电极的辐射探测器 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007100538A2 (fr) | 2007-09-07 |
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| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
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