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WO2007148394A1 - Film polyimide et procédé de production de ce dernier - Google Patents

Film polyimide et procédé de production de ce dernier Download PDF

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Publication number
WO2007148394A1
WO2007148394A1 PCT/JP2006/312481 JP2006312481W WO2007148394A1 WO 2007148394 A1 WO2007148394 A1 WO 2007148394A1 JP 2006312481 W JP2006312481 W JP 2006312481W WO 2007148394 A1 WO2007148394 A1 WO 2007148394A1
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WO
WIPO (PCT)
Prior art keywords
polyimide film
film
abrasive
polishing
stripe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/312481
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English (en)
Japanese (ja)
Inventor
Koichi Sawasaki
Toshihiro Teshiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Du Pont Toray Co Ltd
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Priority to PCT/JP2006/312481 priority Critical patent/WO2007148394A1/fr
Publication of WO2007148394A1 publication Critical patent/WO2007148394A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C2059/027—Grinding; Polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0072—Roughness, e.g. anti-slip
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Definitions

  • the present invention relates to a slippery polyimide film that has streak-like irregularities and is excellent in slipperiness, and can improve the releasability of a hinge part that ties a multilayer substrate.
  • Polyimide films are excellent in insulating properties, heat resistance, electrical properties, and mechanical properties. Therefore, they are widely used in applications such as base films for flexible circuit boards laminated with metal foil such as copper foil. It's being used.
  • Patent Document 1 Japanese Patent Laid-Open No. 62-68852
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-256085
  • Patent Document 3 Japanese Patent Laid-Open No. 6-313055
  • an object of the present invention is to reduce adhesion between films at the hinge portion when a multilayer substrate is laminated by a hot press, and to eliminate a "sounding" trouble caused by rubbing the films. It is providing the polyimide film excellent in the slipperiness which can be performed. Means for solving the problem
  • the polyimide film of the present invention has streaky irregularities on the surface, and the coefficient of static friction between the film surfaces measured in accordance with JIS K-7125 (1999).
  • the polyimide film of the present invention preferably has the following (1) to (6).
  • the film surface roughness Rz measured according to DJIS B-0601 (2001) is 0.7 to 10 / ⁇ ⁇ .
  • the width of the stripe-shaped unevenness is in the range of 0.1 to 20 ⁇ m.
  • the stripe-shaped unevenness should be in the range of 0.1 to: LOOOO Zmm.
  • the height difference of the stripe-shaped unevenness is in the range of 0.05-: LO ⁇ m.
  • the maximum height difference Ry of the stripe-shaped unevenness is in the range of 4 to: LO m.
  • Haze cloudiness value measured according to JIS K-7105 (1981) is increased by 1 to 15 by applying irregularities to the surface, compared to before applying.
  • the method for producing the polyimide film of the present invention is a method in which a polyimide film surface is abraded with an abrasive roll or an abrasive tape to form streaks on the surface, in accordance with JI SK-7125 (1999).
  • the coefficient of static friction between the film surfaces measured by 0.1 to 0. 7 is a feature.
  • the method for producing the polyimide film of the present invention preferably includes the following (1) to (4).
  • the abrasive material is any one of particles of silicon carbide, acid aluminum, acid chromium, cerium oxide and diamond.
  • the grain size of the abrasive is 0.1 to: LOO / z m.
  • the polyimide film of the present invention has streak-like irregularities, thereby improving the slipperiness. As a result, there is no adhesion between the films, and there is no friction between the films at the time of folding. It can be suitably used.
  • FIG. 1 is an explanatory view showing a method of forming streaky irregularities on the film surface.
  • FIG. 2 is an explanatory view showing another method for forming streaky irregularities on the film surface.
  • FIG. 3 is an explanatory view showing still another method of forming streaky irregularities on the film surface.
  • FIG. 4 is an explanatory view showing still another method for forming streaky irregularities on the film surface.
  • FIG. 5 is a schematic diagram showing streaky irregularities on the film surface.
  • the polyimide film of the present invention has streaky irregularities on the surface, and the coefficient of static friction between the film surfaces measured in accordance with JIS K-7125 (1999) is 0.1 to 0.7. Necessary, 0.2-0.6 force preference! / ⁇ .
  • the static friction coefficient shown here is a value measured by superimposing the processed surfaces of two films on the basis of JIS K-7125 (1999), that is, a slip coefficient measuring device Slip Tester (Inc. This is the value measured using a Technone), with the processed surfaces overlapped, a 200 g weight placed on top, one side of the film fixed, and the other side pulled by lOOmmZ.
  • the film surface roughness Rz measured according to JIS B-0601 (2001) is preferably 0.7 to: LO m, more preferably 2 to 9 m, 3 More preferably, ⁇ 8 / ⁇ ⁇ .
  • the film surface roughness Rz shown here is a value measured by a laser microscope based on JIS B-0601 (2001) "Surface roughness", and is actually a scanning label manufactured by Lasertec Corporation.
  • the film surface was photographed in “SURFACE2” mode with the 1 microscope “1LM15W”, then Mitani Corporation ) Made with SALT, set the cut-off value when creating the roughness curve to 0.025 mm, analyze the area with an extended surface roughness of 0.01 mm 2 or more, and Rz (10-point average roughness) This is the value obtained by reading the value of.
  • the polyimide film is obtained by bringing a polishing tape into contact with the polyimide film and running it. be able to.
  • the polyimide film is fed from the winding roll 1, rotated in the direction opposite to the running direction, and wound around the winding roll 2 while rubbing the surface of the polishing roll 3.
  • the polyimide film that has come out of the winding roll 1 is wound around the winding roll 2 while rubbing between the polishing roll 3 and the pressing roll 4 rotating in the opposite direction.
  • the surface pressure at this time is preferably 1 to 10 kgZ500 mm.
  • the unrolling roll 1 is exited.
  • the polyimide film is wound around the scraping roll 2 while rubbing between the two polishing rolls 3 and 3 'rotating in opposite directions.
  • the polishing process is performed continuously twice or more, it is possible to arrange them as shown in FIG.
  • Fig. 1 When only one side of the film is processed, it can be processed by the method shown in Fig. 1 or Fig. 2, but Fig. 2 can control the pressure when the polishing roll is brought into contact with the film, and can improve efficiency. Therefore, it is preferable because unevenness can be imparted.
  • Fig. 3 When processing both sides of the film, it can be obtained by processing as shown in Fig. 3.
  • the tension applied to the film during these treatments is preferably adjusted in the range of 10-50 NZm, and the processing speed is preferably adjusted in the range of 5-40 mZmin! /.
  • the polishing roll is not particularly limited as long as the surface is hard and rough, but a polishing tape obtained by coating an abrasive on the tape may be used.
  • the polishing tape include a type in which a PET film is used as a base and an abrasive is coated thereon.
  • the thickness of the PET film as the base is preferably in the range of 25 to 75 ⁇ m because it is easy to handle.
  • Abrasive materials include silicon carbide, aluminum oxide, acid chrome, acid cerium, diamond, etc.
  • the particle size of the abrasive depends on the degree of roughening 0.1 to: LOO / zm More preferably, it is in the range of 1 to 50 ⁇ m, more preferably in the range of 5 to 40 ⁇ m.
  • the film may be excessively roughened and the mechanical properties such as strength may be impaired. If the particle size is smaller than this range, the effect of imparting the slipperiness of the film is lowered, which is not preferable. It is also possible to process with multiple abrasives. First, use abrasives with a particle size of less than 10 / zm, and then apply fine, streak-like irregularities on the entire surface, then the particle size is 10 / zm or more. There is also a method of using a polishing material of this type to create a stripe-shaped unevenness with a high height difference and a large width, and vice versa.
  • FIG. 5 shows a cross-sectional view of a film having streak-like irregularities having a typical shape.
  • 9 indicates the original surface position of the film
  • 8 is a concave portion
  • 7 is a convex portion.
  • the height difference 5 of the unevenness is a value obtained by measuring the length of the apex of the convex portion 7 and the apex of the concave portion 8.
  • the unevenness shown in FIG. 5 is drawn with the recesses shown as long.
  • the unevenness pattern is not limited to this, and the protrusions are extremely low and may not rise much from the film surface position 9.
  • the film of the present invention has a large number of such streaks on the surface.
  • a large number of stripe-shaped irregularities have a large difference in height !, a thing (groove is deep !,) and a small height difference !, a force (shallow groove, thing) exists. It is preferably in the range of 05-10 m.
  • the presence of a large number of stripes with a height difference of less than 0.05 m deteriorates the slipperiness of the film, and the presence of more than 10 ⁇ m deteriorates the mechanical properties of the film.
  • the maximum height Ry of the height difference of the stripe-shaped unevenness is in the range of 4 to 10 ⁇ m.
  • the maximum height Ry in this case is specifically measured by a scanning laser microscope “1LM15W” manufactured by Lasertec Co., Ltd. -Con 50x lens (CF Plan Apo 50 X / 0. 95 ⁇ / 0 E PI) This is the value confirmed by the maximum height Ry by the analysis with an extended surface roughness of 0.01 mm 2 or more in SALT after shooting in “SURFACE2” mode.
  • the width of the streak-like irregularities here is the value obtained by measuring 6 in Fig. 5. If it falls below this range, the slipperiness deteriorates, and if it exceeds, the mechanical properties of the film deteriorate, which is not preferable. In particular, it is preferable to adjust the stripe-shaped unevenness in the range of 0.1 to 10,000 Zmm. 10 to: L000 to adjust to Zmm, more preferably 100 to 500 Zmm. Is even more preferred. If it is below this range, the slipperiness will be poor, and if it exceeds this range, the mechanical properties of the film will be poor.
  • the haze representing the haze value of the film increases.
  • the haze changes depending on the degree of the stripe-shaped unevenness, it is preferable to adjust the haze increase value to 1 to 15 and more preferable to adjust to 3 to 10 than before the unevenness is imparted.
  • the haze described here is specifically 3 ⁇ 4JIS K-7105 (1981) “Optical characteristics test method for plastics” using a single beam type haze computer (HZ-1, manufactured by Suga Test Instruments Co., Ltd.) It was measured under such measurement conditions.
  • Standard of measurement value Standard plate issued by NPL (National Institute of Physical Sciences) Standard number of samples: 1
  • the direction of the stripe-shaped unevenness is given along the direction parallel to the machine feed direction (MD) of the film, given along the width direction (TD) of the film, although it may be applied in any way, such as applying along a slant, the method force applied along the machine feed direction (MD) of the film as shown in Figs. I like it because I can.
  • polishing tape For other polishing methods, use a disc-shaped disc tape as the polishing tape, and contact it while rotating it on the film surface. It can be generated.
  • Examples of the polyimide film used in the present invention include pyromellitic dianhydride and 4,4'-diaminodiphenyl ether strength, resulting polyamic acid strength, manufactured polyimide film, 3, 3 ', 4 , 4, Biphenyl tetracarboxylic dianhydride, pyromellitic dianhydride , P-Phenylenediamine, 4,4, -Diaminodiphenyl ether Polyimide film obtained from polyamic acid power, pyromellitic dianhydride, 4, 4'-Diaminodiphenyl ether, 3, 4 Polyamide acid obtained from three components of '-diaminodiphenyl ether, polyimide acid power, pyromellitic dianhydride, 4, 4, -diaminodiphenyl ether, and p-dirangeamine.
  • Polyimide film 3, 3, 4, 4, 4-biphenyltetracarboxylic dianhydride and p-phenolic amine force
  • Polyamic acid power obtained Polyimide film produced 3 3,, 4 Polyamides made from polyamic acid derived from 4,4'-biphenyltetracarboxylic dianhydride and 4,4 'oxydiline Irumu, and the like.
  • Polyamide acid The decyclization to polyimide may be either a chemical ring closure method or a thermal ring closure method. It is also possible to contain 10% by weight or less of inorganic or organic additives for the purpose of improving processability.
  • the thickness of the polyimide film of the present invention is preferably 3 to 200 ⁇ m. In other words, if the thickness is less than 3 ⁇ m, it will be difficult to maintain the shape, and if it exceeds 200 ⁇ m, it will not be flexible, so it is not suitable for flexible circuit board applications.
  • low heat shrinkage may be performed by annealing treatment, or plasma treatment may be performed to improve adhesion.
  • Standard of measurement value Standard plate issued by NPL (National Institute of Physical Sciences) Standard number of samples: 1
  • the resulting film had a coefficient of static friction of 0.46 and a surface roughness Rz of 1.14 / zm, and the height difference of the stripe-shaped irregularities imparted on the film surface was 0.54 ⁇ m, the maximum height Ry The maximum width of streaks was 1.5 m, and the number of streaks was 219 Zmm wide.
  • the haze of the film was 5.2 before polishing and 7.5 after treatment. For evaluation of peelability after pressing, the two sets of copper-clad laminates were released when the press force was taken out. The results are shown in Table 1.
  • the static friction coefficient of the obtained film was 0.45 and the surface roughness Rz was 1.75 m as in Example 1, except that the processing speed was 10mZmin and the processing surface pressure was 3kgZ500mm.
  • the height difference of the stripe-shaped irregularities applied on the film surface is 1.39 ⁇ m
  • the maximum height Ry is 2.58 ⁇ m
  • the maximum width of the stripe-shaped irregularities is 7.6 m
  • Number 204 The book was Zmm wide.
  • the haze of the film was 5.2 before polishing and 9.8 after treatment.
  • peelability evaluation after pressing the two copper clad laminates were in light contact with each other when the pressing force was taken out, but they were peeled when held and shaken lightly (peelability: NORMAL ( ⁇ )). The results are shown in Table 1.
  • Example 1 As a result of the same operation as in Example 1 except that a polyimide film having a thickness of 12.5 m was used, the resulting film had a coefficient of static friction of 0.52 and a surface roughness Rz of 1.18 m.
  • the height difference of streaks on the surface is 0. 64 ⁇ m
  • the maximum height Ry is 1. 32 / zm
  • the maximum width of streaks is 1.7 m
  • the number of streaks is 211.
  • the book was Zmm wide.
  • the haze of the film was 3.0 before the polishing treatment and 5.3 after the treatment.
  • the two sets of copper-clad laminates were released when the pressing force was removed. The results are shown in Table 1.
  • the static friction coefficient of the resulting film was the same as in Example 1 except that a polyimide film with a thickness of 12.5 / zm was used and the film was processed at a running speed of lOmZmin and a surface pressure of 3kgZ500mm as shown in Fig. 2. 0.45, the surface roughness Rz is 1.90 / zm, the height difference of the streaks on the film surface is 1.41 ⁇ m, the maximum height Ry is 2. m, streaks Concave The maximum convex width was 6.7 m, and the number of streaky irregularities was 214 Zmm wide. The haze of the film was 3.0 before the polishing treatment and 6.8 after the treatment. For evaluation of peelability after pressing, the two sets of copper-clad laminates were released when the press force was taken out. The results are shown in Table 1.
  • Example 1 Pyromellitic dianhydride 100 mole 0/0 and 4, 4, Jiaminojifue - ether 50 mole 0/0, 3, 4'Jiaminojifue - to ether 50 mole% and the force resulting polyamic acid average particle diameter 1 mu m-
  • Example 1 was carried out using an abrasive tape in which about 0.1% by weight of calcium hydrogen phosphate was mixed and a polyimide film having a thickness of 25 ⁇ m and a carbide carbide having a particle size of 20 m was used as an abrasive. The same processing as in Fig. 1 was applied.
  • the resulting film had a coefficient of static friction of 0.47, a surface roughness Rz of 1.20 / zm, and the difference in level of streaks formed on the film surface was 0.64 ⁇ m, the maximum height. Ry was 1.41 ⁇ m, the maximum width of streaks was 1.7 ⁇ m, and the number of streaks was 208 Zmm wide.
  • the haze of the film was 5.1 before polishing and 7.4 after treatment.
  • peelability For evaluation of peelability after pressing, the two sets of copper-clad laminates were released when they were taken out of the press, and they were peeled when they were held lightly and shaken lightly (peelability: NORMAL (A)). The results are shown in Table 1.
  • the resulting film had a static friction coefficient of 0.33 and a surface roughness Rz of 1.25 m.
  • the height difference of the streaks on the film surface was 0.72 ⁇ m, and the maximum height Ry was 1. 38 m, the maximum width of streaks was 1.7 m, and the number of streaks was 225 Zmm wide.
  • the haze of the film was 5.2 before polishing and 7.6 after treatment.
  • peelability For evaluation of peelability after pressing, the two copper clad laminates were in close contact with each other when the pressing force was taken out, but they peeled when held in hand and shaken lightly (peelability: NORMAL ( ⁇ )). Results in Table 1 Show.
  • the height difference of the streaks on the film surface was 0.66 ⁇ m, the maximum height Ry was 1.37 m, the maximum width of streaks was 1.4 m, and the number of streaks was 217 Zmm wide.
  • the haze of the film was 5.1 before polishing and 7.5 after treatment.
  • peelability the two copper clad laminates were peeled off when they were taken out of the press and shaken lightly with the hand that was lightly attached (peelability: NORMA L (A)). The results are shown in Table 2.
  • the resulting film had a coefficient of static friction of 0.38 and a surface roughness Rz of 4.56 / zm.
  • the height difference of the streaks on the film surface was 2.30 ⁇ m, and the maximum height Ry was 7. 49 ⁇ m, the maximum width of streaks was 17.4 m, and the number of streaks was 270 Zmm wide.
  • the haze of the film was 5.2 before polishing and 13.7 after treatment.
  • the two copper-clad laminates had already peeled when the pressing force was taken out! /, (Peelability: GOOD ( ⁇ )). The results are shown in Table 2.
  • Pyromellitic dianhydride and 4,4'-diaminodiphenyl ether strength Thickness produced by mixing approximately 0.1% by weight of calcium hydrogen phosphate with an average particle size of 1 ⁇ m into the resulting polyamic acid 12.5 ⁇ m
  • a polyimide tape of m was treated at a running speed of 10 mZmin and a treatment surface pressure of 3 kgZ500 mm in the manner shown in FIG. 1 using a polishing tape using a carbide carbide having a particle size of 40 ⁇ m as an abrasive.
  • the resulting film had a coefficient of static friction of 0.44 and a surface roughness Rz of 7.35 m.
  • the height difference of the streaks on the film surface was 2.38 ⁇ m, and the maximum height Ry was 8.
  • the maximum width of the line-shaped unevenness was 17.4 m, and the number of the line-shaped unevenness was 180 Zmm wide.
  • the haze of the film was 3.0 before the polishing treatment and 11.9 after the treatment.
  • the two copper-clad laminates had already peeled when the pressing force was taken out! /, (Peelability: GOOD ( ⁇ )). The results are shown in Table 2.
  • Pyromellitic dianhydride and 4,4'-diaminodiphenyl ether strength Thickness produced by mixing approximately 0.1% by weight of calcium hydrogenphosphate with an average particle size of 1 ⁇ m into the resulting polyamic acid 12.5 m thick
  • the polyimide film was processed using a polishing tape using a carbide carbide with a particle size of 5 ⁇ m as an abrasive at a travel speed of 10 mZmin, a processing surface pressure of 3 kgZ500 mm, and subsequently a particle size of 30 m. This was processed using a polishing tape using a carbonized silicon carbide as an abrasive.
  • the resulting film had a coefficient of static friction of 0.39 and a surface roughness Rz of 3.80 m.
  • the height difference of the streaks on the film surface was 1.64 ⁇ m and the maximum height Ry was 4. 24 ⁇ m, the maximum width of streaks was 8.8 m, and the number of streaks was 252 Zmm wide.
  • the haze of the film was 3.0 before the polishing treatment and 8.8 after the treatment. press Regarding the evaluation of the peelability later, when the pressing force was taken out, the two sets of copper clad laminate had already peeled off (peelability: GOOD ( ⁇ )). The results are shown in Table 2.
  • the resulting film had a coefficient of static friction of 0.35 and a surface roughness Rz of 5.34 m.
  • the height difference of the stripe-shaped irregularities on the film surface was 2.23 m, and the maximum height Ry was 6.
  • the maximum width of 67 m, streaky irregularities was 9.5 m, and the number of streaky irregularities was 268 Zmm wide.
  • the haze of the film was 3.0 before the polishing treatment and 11.2 after the treatment.
  • peelability For evaluation of peelability after pressing, the two copper clad laminates had already peeled when removed from the press (peelability: GOOD ( ⁇ )). The results are shown in Table 2.
  • the number of streaks was 225 Zmm wide.
  • the haze of the film is 3.
  • the polyimide film of the present invention has excellent insulating properties, heat resistance, electrical properties, mechanical properties, and excellent slipperiness, for example, a base film for a flexible circuit board laminated with a metal foil such as a copper foil. Can be preferably used.

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  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

L'invention concerne un film polyimide qui, lors de l'empilement de substrats multicouches au moyen d'une presse à chaud, réduit toute adhésion entre les films au niveau d'une partie charnière, présente d'excellentes propriétés de glissement facile permettant une résolution de la gêne de 'grincement' causée par frottement mutuel de films. L'invention concerne un film polyamide présentant une irrégularité striée sur sa surface et présentant un coefficient de frottement statique entre surfaces de films comprise entre 0,1 et 0,7, présentant de préférence une rugosité de surface de film (Rz) comprise entre 0,7 et 10 μm. L'invention concerne en outre un procédé de production d'un film polyimide, consistant à soumettre une surface de film polyimide à un traitement d'abrasion au moyen d'un cylindre d'abrasion ou d'une bande abrasive de manière à ainsi former une irrégularité striée sur sa surface.
PCT/JP2006/312481 2006-06-22 2006-06-22 Film polyimide et procédé de production de ce dernier Ceased WO2007148394A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/312481 WO2007148394A1 (fr) 2006-06-22 2006-06-22 Film polyimide et procédé de production de ce dernier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/312481 WO2007148394A1 (fr) 2006-06-22 2006-06-22 Film polyimide et procédé de production de ce dernier

Publications (1)

Publication Number Publication Date
WO2007148394A1 true WO2007148394A1 (fr) 2007-12-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/312481 Ceased WO2007148394A1 (fr) 2006-06-22 2006-06-22 Film polyimide et procédé de production de ce dernier

Country Status (1)

Country Link
WO (1) WO2007148394A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018034406A (ja) * 2016-08-31 2018-03-08 東レ株式会社 凹部を有するフィルム
CN110177825A (zh) * 2017-02-08 2019-08-27 Skc株式会社 聚酰亚胺膜及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198530A (ja) * 1984-10-22 1986-05-16 Teijin Ltd 基板用フイルム及び機能性積層体の製造方法
JPH01167341A (ja) * 1987-12-23 1989-07-03 Nitto Denko Corp 易滑性ポリイミドフィルム
JP2001233973A (ja) * 1999-12-15 2001-08-28 Du Pont Toray Co Ltd 粗面化芳香族ポリイミドフィルムおよびその製造方法
JP2002060512A (ja) * 2000-08-24 2002-02-26 Du Pont Toray Co Ltd 粗面化芳香族ポリイミドフィルムおよびその製造方法
JP2004231727A (ja) * 2003-01-29 2004-08-19 Toray Ind Inc 表面加工ポリエステルフィルムおよびそれを用いた転写箔
JP2006182842A (ja) * 2004-12-27 2006-07-13 Du Pont Toray Co Ltd ポリイミドフィルム
JP2006181780A (ja) * 2004-12-27 2006-07-13 Du Pont Toray Co Ltd 易滑性金属積層体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198530A (ja) * 1984-10-22 1986-05-16 Teijin Ltd 基板用フイルム及び機能性積層体の製造方法
JPH01167341A (ja) * 1987-12-23 1989-07-03 Nitto Denko Corp 易滑性ポリイミドフィルム
JP2001233973A (ja) * 1999-12-15 2001-08-28 Du Pont Toray Co Ltd 粗面化芳香族ポリイミドフィルムおよびその製造方法
JP2002060512A (ja) * 2000-08-24 2002-02-26 Du Pont Toray Co Ltd 粗面化芳香族ポリイミドフィルムおよびその製造方法
JP2004231727A (ja) * 2003-01-29 2004-08-19 Toray Ind Inc 表面加工ポリエステルフィルムおよびそれを用いた転写箔
JP2006182842A (ja) * 2004-12-27 2006-07-13 Du Pont Toray Co Ltd ポリイミドフィルム
JP2006181780A (ja) * 2004-12-27 2006-07-13 Du Pont Toray Co Ltd 易滑性金属積層体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018034406A (ja) * 2016-08-31 2018-03-08 東レ株式会社 凹部を有するフィルム
CN110177825A (zh) * 2017-02-08 2019-08-27 Skc株式会社 聚酰亚胺膜及其制备方法
CN110177825B (zh) * 2017-02-08 2022-05-10 Skc株式会社 聚酰亚胺膜及其制备方法

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