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WO2007031609A1 - Support for communication assistance card - Google Patents

Support for communication assistance card Download PDF

Info

Publication number
WO2007031609A1
WO2007031609A1 PCT/FR2005/002240 FR2005002240W WO2007031609A1 WO 2007031609 A1 WO2007031609 A1 WO 2007031609A1 FR 2005002240 W FR2005002240 W FR 2005002240W WO 2007031609 A1 WO2007031609 A1 WO 2007031609A1
Authority
WO
WIPO (PCT)
Prior art keywords
support
card
electronic chip
fulfill
communication assistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR2005/002240
Other languages
French (fr)
Inventor
Richard Bado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/FR2005/002240 priority Critical patent/WO2007031609A1/en
Publication of WO2007031609A1 publication Critical patent/WO2007031609A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0276—Polyester fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Definitions

  • the subject of the present invention is a new card support of the Card or other type with an electronic chip.
  • This support is composed of a polyethylene terephthalate sheet-core also, but it is thermolated during its manufacture

Landscapes

  • Credit Cards Or The Like (AREA)

Abstract

The invention concerns a novel support for card such as a bank card or the like including a silicon chip. Said support consists of a polyethylene terephthalate core sheet, but thermobonded during its manufacture with a sheet of polyethylene terephthalate fibers thermobonded together.

Description

Titre Support pour carte d'aide à la communication.Title Support for communication support card.

5 La présente invention a pour objet un nouveau support pour carte du genre Carte Bancaire ou autre avec une puce électronique.The subject of the present invention is a new card support of the Card or other type with an electronic chip.

Ce support est composé d'une feuille-âme en polyéthylène téréphtalate lui aussi, mais elle est thermoliée lors de sa fabricationThis support is composed of a polyethylene terephthalate sheet-core also, but it is thermolated during its manufacture

10 d'une feuille de fibres de polyéthylène téréphtalate thermoliées entre- elles, comme ce qui compose le produit des établissements Du Pont de Nemours aux U.S. A. sous le nom de Tyvec® Brillion™, et qui accepte les encres courantes pour l'écriture ou celle d'appareils10 of a sheet of polyethylene terephthalate fibers thermolated between them, as what makes up the product Du Pont de Nemours institutions in the USA under the name of Tyvec® Brillion ™, and which accepts current inks for writing or that appliances

15 d'impression avec des procédés usuels.Printing with usual methods.

Un espace sera réservé dans la feuille de Tyvec® Brillion™ pour que la puce de notre nouvelle Carte à Puce Électronique n'ait à subir aucune déformation qui nuirait aux informations contenues.A space will be reserved in the sheet of Tyvec® Brillion ™ so that the chip of our new Electronic Chip Card has not suffered any deformation that would harm the information contained.

2o Ce support pour carte à puce se différencie encore de celui que nous avons l'habitude d'utiliser, par le fait que la face opposée de celle utilisée comme support pour la Puce Électronique pourra servir de support à étiquettes, pour les utilisations que le marché saura lui trouver grâce à ses aspects pratiques. 2o This support for smart card is still different from the one we are used to use, in that the opposite side of that used as a support for the electronic chip can serve as a label holder, for uses that the market will find him thanks to its practical aspects.

Claims

REVENDICATIONS l} Support pour Cartes à Puces aux multiples applications comme permettre d'avoir la signature sur Carte Bancaire plus visible.l} Support for smart cards with multiple applications like to have the signature on credit card more visible. 2 J Nouvelle Carte qui libérée de toute compromission avec des groupes bancaires pourrait faire s'épanouir les multiples possibilités de notre puce électronique Française :2 J New Card which freed from any compromise with banking groups could make flourish the many possibilities of our French chip: 3 J Sans code particulier notre Puce Électronique remplira toutes les fonctions que remplit l'ensemble de nos actuelles Cartes à qui encombrent nos portefeuilles.3 J Without any particular code, our Electronic Chip will fulfill all the functions that all our current Cards fulfill, which clutter our portfolios. 4} Avec ca contenance gigantesque, notre Puce Électronique pourra devenir sur ce support le futur principal véhicule de communications virtuelles comme en fut une approche la disquette en son temps, et l'est l'actuel CD. de nos jours. 4} With this gigantic capacity, our electronic chip will be able to become on this support the future main vehicle of virtual communications as it was a floppy approach in its time, and it is the current CD. Nowadays.
PCT/FR2005/002240 2005-09-09 2005-09-09 Support for communication assistance card Ceased WO2007031609A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/FR2005/002240 WO2007031609A1 (en) 2005-09-09 2005-09-09 Support for communication assistance card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FR2005/002240 WO2007031609A1 (en) 2005-09-09 2005-09-09 Support for communication assistance card

Publications (1)

Publication Number Publication Date
WO2007031609A1 true WO2007031609A1 (en) 2007-03-22

Family

ID=36273373

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2005/002240 Ceased WO2007031609A1 (en) 2005-09-09 2005-09-09 Support for communication assistance card

Country Status (1)

Country Link
WO (1) WO2007031609A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2255934A (en) * 1991-05-13 1992-11-25 Richelt George Williams Integrated circuit card with display.
US5443727A (en) * 1990-10-30 1995-08-22 Minnesota Mining And Manufacturing Company Articles having a polymeric shell and method for preparing same
EP0706152A2 (en) * 1994-11-03 1996-04-10 Fela Holding AG Chip card and method for fabricating it
JPH1071684A (en) * 1996-06-27 1998-03-17 Unitika Ltd Polyester resin laminate having built-in electronic part and its production
EP1057656A1 (en) * 1998-11-20 2000-12-06 Unitika Ltd. Three-layer polyester resin sheet for cards and polyester resin laminates made by using the same
WO2001003061A1 (en) * 1999-07-01 2001-01-11 Schlumberger Systemes S.A. Method for making laminated cards provided with an intermediate petg layer
WO2001018745A2 (en) * 1999-09-07 2001-03-15 American Express Travel Related Services Company, Inc. Transparent transaction card with infrared blocking layer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443727A (en) * 1990-10-30 1995-08-22 Minnesota Mining And Manufacturing Company Articles having a polymeric shell and method for preparing same
GB2255934A (en) * 1991-05-13 1992-11-25 Richelt George Williams Integrated circuit card with display.
EP0706152A2 (en) * 1994-11-03 1996-04-10 Fela Holding AG Chip card and method for fabricating it
JPH1071684A (en) * 1996-06-27 1998-03-17 Unitika Ltd Polyester resin laminate having built-in electronic part and its production
EP1057656A1 (en) * 1998-11-20 2000-12-06 Unitika Ltd. Three-layer polyester resin sheet for cards and polyester resin laminates made by using the same
WO2001003061A1 (en) * 1999-07-01 2001-01-11 Schlumberger Systemes S.A. Method for making laminated cards provided with an intermediate petg layer
WO2001018745A2 (en) * 1999-09-07 2001-03-15 American Express Travel Related Services Company, Inc. Transparent transaction card with infrared blocking layer

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EPSON: "Tyvek Brillion", INTERNET ARTICLE, 2001, XP002380991, Retrieved from the Internet <URL:http://www.hagadoneprinting.com/images/productServices/epsonPapers/Tyvek%20Brillion%20.pdf> [retrieved on 20060515] *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 08 30 June 1998 (1998-06-30) *

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