WO2007026877A1 - Circuit board inspecting apparatus and circuit board inspecting method - Google Patents

Abstract

Provided is a circuit board inspecting apparatus, which can perform high reliability electrical inspection even when a circuit board to be inspected has fine pitch electrodes, and smoothly perform inspecting operation even for continuous circuit board inspection. The circuit board inspecting apparatus is provided with an auxiliary connecting circuit unit. The auxiliary connecting circuit unit is provided with a first auxiliary relay pin unit, which has a plurality of conducting pins arranged at a prescribed pitch and a pair of separated insulating plates for supporting the conducting pins between a connector board of a first inspecting jig and a connector board of a second inspecting jig and is arranged on the connector substrate side of the first inspecting jig; a second auxiliary relay pin unit having a plurality of conducting pins arranged at a prescribed pitch and a pair of separated insulating plates for supporting the conducting pins; and an auxiliary anisotropic conducting sheet for electrically connecting the first auxiliary relay pin unit with the second auxiliary relay pin unit. When the electrodes of one tester side connector lack in number, the circuit board inspecting apparatus is permitted to go around through the auxiliary connecting circuit unit and electrically connected with the electrodes of the other tester side connector.

Description

 Specification

 Circuit board inspection apparatus and circuit board inspection method

 Technical field

 [0001] The present invention provides a circuit board (hereinafter referred to as "circuit board to be inspected") to be inspected for electrical inspection by sandwiching both sides with an upper inspection jig and a lower inspection jig. The present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting the electrical characteristics of a circuit board to be inspected with electrodes formed on both sides of the circuit board to be inspected being electrically connected to a tester.

 Background art

 [0002] Prior to mounting an integrated circuit or the like, a printed circuit board for mounting an integrated circuit or the like is inspected for electrical characteristics to confirm that the wiring pattern of the circuit board has a predetermined performance.

 [0003] In this electrical inspection, for example, an inspection head is incorporated into an inspection tester having a circuit board transport mechanism, and different circuit boards are inspected by exchanging the inspection head portion.

 [0004] For example, as disclosed in Patent Document 1 (Japanese Patent Laid-Open No. 6-94768), a metal inspection pin that is in electrical contact with an inspection electrode of a circuit board to be inspected is implanted on the substrate. A method of using an inspection jig with a set structure has been proposed! RU

 [0005] Further, as disclosed in Patent Document 2 (Japanese Patent Application Laid-Open No. 5-159821), an inspection head having a conductive pin, a circuit board for pitch conversion called an off-grid adapter, and anisotropic conductivity A method of using an inspection jig combined with a sheet is known.

 However, as described in Patent Document 1 (Japanese Patent Laid-Open No. 6-94768), a method using an inspection jig that directly contacts a metal inspection pin with an inspection electrode of a circuit board to be inspected, There is a possibility that the electrode of the circuit board to be inspected may be damaged by the contact with the conductive pin which is a metal force.

[0007] Especially in recent years. Circuits on a circuit board are becoming finer and higher in density, and when inspecting such a printed circuit board, a high pressure is required in order to bring a large number of conductive pins into conductive contact with the inspected electrodes of the inspected circuit board at the same time. It is necessary to pressurize the inspection jig with The electrode to be inspected is easily damaged.

 [0008] With such an inspection jig for inspecting a miniaturized and high-density printed circuit board, it becomes technically difficult to implant a large number of metal pins at a high density on the board. There is one. In addition, the manufacturing cost is high, and it is difficult to repair or replace some of the metal pins when they are damaged.

 On the other hand, as in Patent Document 2 (Japanese Patent Laid-Open No. 5-159821), in an inspection jig using an anisotropic conductive sheet, the electrode to be inspected on the circuit board to be inspected has an anisotropic conductive sheet. Therefore, there is an advantage that the electrode to be inspected of the circuit board to be inspected is hardly damaged. In addition, since a board that performs pitch conversion is used, the inspection pins to be implanted on the board can be implanted at a pitch that is wider than the pitch of the electrodes to be inspected on the circuit board to be inspected. This also has the advantage of saving manufacturing costs for inspection fixtures that do not require the installation of inspection pins.

 [0010] However, with this inspection jig, it is necessary to create a pitch conversion board and an inspection jig in which an inspection pin is implanted for each circuit board to be inspected. The same number of inspection jigs as the printed circuit board that is the circuit board to be inspected are required.

 [0011] For this reason, when a plurality of printed circuit boards are produced, there is a problem that a plurality of inspection jigs must be held correspondingly. In particular, in recent years, the product cycle of electronic equipment has been shortened, and the production period of printed circuit boards used in products has been shortened. With this, inspection jigs cannot be used for a long time, The problem arises that inspection jigs must be produced each time printed circuit board production switches.

 [0012] As countermeasures against such problems, for example, relays such as Patent Documents 3 to 5 (Publications of JP-A-7-248350, JP-A-8-271569, JP-A-8-338858) An inspection device that uses a pin unit and a V, a universal universal inspection jig has been proposed.

 FIG. 33 is a cross-sectional view of an inspection apparatus using such a universal type inspection jig.

[0014] This inspection apparatus includes an upper inspection jig 11 la and a lower inspection jig 11 lb. The scissors jig includes circuit board side connectors 121a and 121b, relay pin units 131a and 131b, and tester side connectors 141a and 141b.

 [0015] The circuit board side connectors 121a and 121b include pitch conversion boards 123a and 123b, and anisotropic conductive sheets 122a, 122b, 126a, and 126b arranged on both sides thereof.

 [0016] The relay pin units 131a and 131b include conductive pins 132a and 132b arranged in large numbers (for example, 5000 pins) on a lattice point at a constant pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b are moved up and down. Insulating plates 134a and 134b that are movably supported.

 [0017] The tester-side connectors 141a and 141b are connectors that electrically connect the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 11 la and 11 lb. , 143b, anisotropic conductive sheets 142a, 142b placed on the conductive pins 132a, 132bftlJ of the connector boards 143a, 143b, and base plates 146a, 146b.

 [0018] In this inspection jig using the relay pin unit, when inspecting a printed circuit board which is a different object to be inspected, the circuit board side connectors 121a and 121b are replaced with ones corresponding to the circuit board 101 under inspection. The relay pin unit 13 la, 13 lb and the tester side connectors 141a, 141b can be used in common.

 However, in such a conventional universal type inspection jig, a plurality of conductive paths extending in the thickness direction are formed as the anisotropic conductive sheets 122a and 122b constituting the circuit board side connectors 121a and 121b. And the insulating part that insulates these conductive path forming parts from each other, and the conductive particles are contained only in the conductive path forming part and dispersed unevenly in the surface direction, and the conductive path forming part is formed on one side of the sheet. Are used, and unevenly distributed anisotropic conductive sheets 122a and 122b are used.

 [0020] For this reason, the anisotropic conductive sheets 122a and 122b frequently deteriorate in the conductive path forming portion (the resistance value increases) due to repeated use in the inspection, and the service life is short. Therefore, the anisotropic conductive sheets 122a and 122b are frequently used. , 122b every time the anisotropic conductive sheets 122a, 122b and pitch conversion boards 123a, 123b are aligned, and circuit board side connectors 121a, 121b and relay pin units 13 la, 13 lb Therefore, it is necessary to align the position of the sensor and the replacement work is complicated, and the inspection efficiency is lowered.

[0021] Further, the electrode force of the circuit board 101 to be inspected, for example, at a very small pitch of 200 m or less. Then, when using the unevenly distributed anisotropic conductive sheets 122a and 122b as described above, it is difficult to align the anisotropic conductive sheets 122a and 122b with the pitch conversion substrates 123a and 123b. When a plurality of circuit boards 101 to be inspected are continuously inspected, the anisotropic conductive sheets 122a and 122b are likely to be displaced due to repeated contact with the circuit boards 101 to be inspected.

[0022] As a result, the conductive path forming portions of the anisotropic conductive sheets 122a and 122b and the electrode positions of the circuit board 101 to be inspected do not match, and a good electrical connection cannot be obtained. A resistance value is measured, and a printed circuit board that should be judged as a non-defective product is likely to be mistaken for a defective product.

 [0023] On the other hand, for example, when a connector in which an anisotropic conductive sheet and a pitch conversion board are combined as described in Patent Document 6 (Japanese Patent Laid-Open No. 6-82531) is used. However, when the anisotropic conductive sheet portion deteriorates, it must be replaced with a pitch conversion substrate, and a large number of pitch conversion substrates are required, which increases the inspection cost.

 [0024] For this reason, the present applicant has already disclosed in Patent Document 7 (Japanese Patent Application No. 2004-058282) that, as shown in FIG. 34, the anisotropic conductive sheets 122a and 122b are unevenly distributed anisotropic conductive materials. Universal type inspection jig using dispersed anisotropic conductive sheet in which insulating particles with insulating properties are arranged in the thickness direction and uniformly dispersed in the surface direction instead of using the conductive sheet Proposed.

 [0025] By the way, the printed wiring board which is the circuit board 101 to be inspected has been multilayered and densified. Actually, in the thickness direction, for example, according to the electrodes 102 and 103 to be inspected such as solder ball electrodes such as BGA. There are height variations and warping of the substrate itself. Therefore, in order to achieve electrical connection to the electrodes 102 and 103 to be inspected on the circuit board 101 to be inspected, the upper inspection jig 11 la and the lower inspection jig 11 lb are connected at a high pressure. The circuit board 101 to be inspected is deformed flat by applying pressure, and the upper inspection jig 11 la and the lower inspection jig 11 lb are inspected for variations in the height of the electrodes 102 and 103 to be inspected. Followability to the height of 102, 103 is required.

[0026] In such a conventional universal type inspection jig, the height of the electrodes 102 and 103 to be inspected is high. The force that was followed by the movement of the conductive pins 132a and 132b in the axial direction in order to ensure the followability to the height is limited in the amount of movement of the conductive pins 132a and 132b in the axial direction. The followability with respect to the heights of 102 and 103 may not be good, and a continuity failure occurs and accurate inspection cannot be performed.

 Further, in such a universal type inspection jig, the pressing pressure when the circuit board 101 to be inspected is clamped by the upper inspection jig 11 la and the lower inspection jig 11 lb is shown in FIG. As shown in FIG. 6, pressure absorption is performed by the anisotropic conductive sheets 122a, 122b, 126a, 126b, 142a, 142b above and below the upper and lower anisotropic conductive sheets.

 Therefore, in such a universal type inspection jig, it is necessary to dispose the conductive pins 132a and 132b at regular intervals in order to support the pitch conversion substrates 123a and 123b and disperse the press pressure.

 [0029] Further, in the conventional universal type inspection jig, since the press pressure is received by the conductive pins 132a and 132b, it is necessary to arrange a large number of conductive pins 132a and 132b at regular intervals.

 [0030] Therefore, in response to the miniaturization of the electrodes of the circuit board 101 to be inspected, for example, when the insulating plates 134a and 134b having 10,000 or more through holes are formed with a 0.75 mm pitch, the insulating plate 134 If the substrate thickness of a and 134b is thin, the strength will be low and it may crack when bent. Therefore, it was necessary to make the insulation plates 134a and 134b thicker.

 For this reason, the present applicant has already proposed a universal type inspection jig as shown in FIG. 35 in Patent Document 8 (Japanese Patent Application No. 2005-126431).

 In other words, in this inspection jig, the relay pin unit 131 includes the first insulating plates 134a and 134b disposed on the circuit board 1 side to be inspected that support the conductive pins 132a and 132b, and the circuit to be inspected. Two insulating plates, second insulating plates 135a and 135b, arranged on the side opposite to the substrate 101 side are provided. The two insulating plates 134 are held so that the conductive pins 132 can move up and down.

 [0033] Further, the relay pin unit 131 includes first insulating plates 134a, 134b and second insulating plates 135a,

Intermediate holding plates 136a and 136b are disposed between 135b.

[0034] Between the first insulating plates 134a and 134b and the intermediate holding plates 136a and 136b, Support pins 133a and 133b are arranged to fix between the first insulating plates 134a and 134b and the intermediate holding plates 136a and 136b.

[0035] Similarly, second support pins 137a and 137b are arranged between the second insulating plates 135a and 135b and the intermediate holding plates 136a and 136b, whereby the second insulating plate 135a , 135b and intermediate holding plate 136a, 136b are fixed.

[0036] Then, as shown in FIG. 35, the first contact support position 138A of the first support pin 133 with the intermediate holding plate 136 and the second support pin 137 with the intermediate holding plate 136 The second abutting support position 138B is arranged at a different position on the intermediate holding plate projection surface A where the inspection device 110 is projected in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 35). The

 [0037] With this configuration, pressure is applied when electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig. In the initial stage, the compression of the conductive pins of the relay pin unit, and the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet are performed. By absorbing the pressure, it is possible to absorb some variation in the height of the electrodes to be inspected on the circuit board to be inspected.

 [0038] The first holding support position of the first support pin with the intermediate holding plate and the second contact support position of the second support pin with the intermediate holding plate are the intermediate holding plate. Projected in the thickness direction of the intermediate holding plate

 Since they are arranged at different positions on the shadow plane, when the circuit board to be inspected is further pressed between the first inspection jig and the second inspection jig, the first anisotropic In addition to the rubber elastic compression of the conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet, the first insulating plate and the second insulating plate of the relay pin unit Due to the panel elasticity of the intermediate holding plate disposed between the first insulating plate and the second insulating plate, the height of the inspected electrode on the circuit board to be inspected, for example, the height variation of the solder ball electrode Thus, the pressure concentration can be dispersed to avoid local stress concentration.

[0039] Accordingly, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and stress concentration is further reduced. Local damage to the door is suppressed. As a result, repeated use of anisotropic conductive sheets To improve durability

 Therefore, the number of times of anisotropic conductive sheet replacement is reduced, and the inspection work efficiency is improved.

[0040] However, in each of the conventional universal type inspection jigs described above, the number of tester side electrodes of the tester side connector in each of the upper and lower tester side connectors 141a and 141b is, for example, 6000 points. If the following pattern occurs in the relation between the number of electrodes to be inspected 102 on the upper side of the circuit board 101 to be inspected and the number of electrodes 103 to be inspected on the lower side of the circuit board 101 to be inspected, There were cases where it was difficult to execute. In other words, (tester side)

 Number of electrodes on upper tester side connector 141a = 6000 points

 Lower tester side connector 14 lb electrode count = 6000 points

 (Inspected circuit board side)

 Number of electrodes of upper electrode 102 to be inspected = 8000 points

 Number of electrodes 103 in the lower electrode to be inspected = 4000 points

 That is, when the number of electrodes of the tester side electrode 144a of the upper tester side connector 141a is 6000 and the number of electrodes of the tester side electrode 144b of the lower tester side connector 141b is 6000, If the electrode force of the electrode to be inspected 102 above 101 is 8000 points and the electrode force of the electrode to be inspected 103 below circuit board 101 is 4000 points, it may be difficult to perform the inspection. there were.

 That is, the electrode force of the tester side electrode 144a of the upper tester side connector 141a corresponding to the upper electrode 102 to be inspected is 6000 points 8000 points = 2000 point forces S shortage.

 In this state, however, the force of the tester side electrode 144b of the lower tester side connector 141b corresponding to the lower test target electrode 103 of the circuit board 101 to be inspected is 600 0 points. 4000 points = + 2000 points remain as surplus!

Accordingly, the present inventors have thus established an electrical connection circuit for the upper electrode 102 to be inspected, which has a shortage of 2000 points, and the lower tester-side connector 1 41b with 2000 points remaining as surplus. In this case, the present invention has been completed by knowing that it is possible to perform inspection even in the above case by bypassing to the tester side electrode 144b. is there.

 By the way, in the inspection apparatus using the universal type inspection jig, as shown in FIG. 36, in the pitch conversion substrates 123a and 123b, each of the electrodes 102 to be inspected on the circuit board 101 to be inspected, The terminal electrodes 125a and 125b of the circuit board 101 to be inspected on one pitch conversion substrate 123a and 123b are arranged so as to be electrically connected to 103, respectively.

 [0045] Thereby, the pin side electrodes 145a and 145b of the connector boards 143a and 143b, the anisotropic conductive sheets 142a and 142b, the conductive pins 132a and 132b of the relay pin units 131a and 131b, the anisotropic conductive sheets 126a and 126b , Terminal electrodes 124a, 124b on the relay pin unit side of the pitch conversion boards 123a, 123b, terminal electrodes 125a, 125b on the circuit board 101 side of the pitch conversion boards 123a, 123b, anisotropic conductive sheet 122a, A conductive path extending from 122b to the electrodes 102 and 103 for the test board of the circuit board 101 to be tested is formed.

 Then, as shown in FIG. 36, a pair of upper and lower pin-side electrodes 145a and 145b on the connector boards 143a and 143b are also applied with voltages to the electrodes 102 and 103 to be inspected on the circuit board 101 to be inspected. By applying voltage, current is measured by a tester through the same pair of upper and lower pin-side electrodes 145a and 145b, thereby determining whether the wiring pattern of the circuit board 101 to be inspected has a predetermined performance. The electrical characteristics have been confirmed! /

However, using the pair of upper and lower pin-side electrodes 145a and 145b in this way, a voltage is applied to each of the electrodes 102 and 103 to be inspected of the circuit board 101 to be inspected, and the same. In the method of measuring both voltage and current via the pair of upper and lower pin-side electrodes 145a and 145b, the electrical characteristics of the circuit board 101 to be tested are accurately confirmed as to whether or not the wiring pattern has a predetermined performance. The test cannot be performed, and the time required for the confirmation test is hard.

 Patent Document 1: JP-A-6-94768

 Patent Document 2: JP-A-5-159821

 Patent Document 3: Japanese Patent Laid-Open No. 7-248350

Patent Document 4: JP-A-8-271569 Patent Document 5: JP-A-8-338858

 Patent Document 6: Japanese Patent Laid-Open No. 6-82531

 Patent Document 7: Japanese Patent Application No. 2004-058282

 Patent Document 8: Japanese Patent Application No. 2005-126431

 Disclosure of the invention

 Problems to be solved by the invention

[0048] In view of the current situation, the present invention can perform an accurate confirmation test according to the electrical characteristics depending on whether or not the wiring pattern of the circuit board to be inspected has a predetermined performance. An object of the present invention is to provide an inspection apparatus for circuit boards that can be carried out in a short time in terms of force and time required for a confirmation test.

[0049] Further, the present invention provides a circuit board capable of performing a highly reliable electrical inspection of a circuit board even when the circuit board to be inspected has microelectrodes with a fine pitch. It aims at providing the inspection apparatus of a board.

 It is in.

 [0050] In addition, the present invention provides a circuit with good inspection workability that requires less correction of misalignment of the anisotropic conductive sheet when repeatedly inspecting a circuit board to be inspected. An object of the present invention is to provide a substrate inspection apparatus.

[0051] Further, the present invention provides an inspection of a circuit board that facilitates replacement work of an anisotropic conductive sheet when the anisotropic conductive sheet deteriorates in repeated continuous inspection of a circuit board to be inspected. An object is to provide an apparatus.

[0052] Further, according to the present invention, even if the circuit board to be inspected is changed, all that is required is to change the inspection circuit board without separately manufacturing the entire inspection apparatus (entire inspection jig). An object of the present invention is to provide a circuit board inspection apparatus capable of inspecting a circuit board to be inspected.

 [0053] Further, according to the present invention, even when the circuit board to be inspected is a circuit board having microelectrodes with a fine pitch, the electrical inspection of the circuit board to be inspected can be performed with high reliability. An object of the present invention is to provide an inspection method using a circuit board inspection apparatus that can be used.

[0054] Further, according to the present invention, the number of electrodes to be inspected on one surface of the circuit board to be inspected is 電 気 Even if the number of electrodes to be inspected on the other surface of the circuit board is larger than the number of electrodes that can be inspected by the tester side connector, electrical inspection of the circuit board to be inspected is reliable. An object of the present invention is to provide an inspection method using a circuit board inspection apparatus that can be carried out at a high level.

Means for solving the problem

 The present invention was invented in order to achieve the above-described problems and objects in the prior art, and the circuit board inspection apparatus of the present invention comprises:

 A circuit board inspection apparatus for performing an electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jig and a second inspection jig. ,

 The first inspection jig and the second inspection jig are respectively

 A pitch converting substrate for converting an electrode pitch between one surface side and the other surface side of the substrate; a first anisotropic conductive sheet disposed on the circuit board to be inspected side of the pitch converting substrate;

 A second anisotropic conductive sheet disposed on the opposite side to the circuit board to be inspected of the pitch conversion board;

A circuit board side connector with

 A plurality of conductive pins arranged at a predetermined pitch;

 A pair of spaced apart insulation plates that support the conductive pins;

«I-pin unit with

 A third anisotropic conductive sheet disposed opposite to the second anisotropic conductive sheet of the relay pin unit;

With a connection circuit unit for inspection with

 A connector board for electrically connecting a tester and the relay pin unit; a base plate disposed on the opposite side of the connector board from the relay pin unit; and a tester side connector comprising:

Between the connector board of the first inspection jig and the connector board of the second inspection jig An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

 Further, the circuit board inspection apparatus of the present invention comprises:

 A circuit board inspection apparatus for performing an electrical inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jig and a second inspection jig. ,

 The first inspection jig and the second inspection jig are respectively

 A pitch converting substrate for converting an electrode pitch between one surface side and the other surface side of the substrate; a first anisotropic conductive sheet disposed on the circuit board to be inspected side of the pitch converting substrate;

 A second anisotropic conductive sheet disposed on the opposite side to the circuit board to be inspected of the pitch conversion board;

A circuit board side connector with

 A plurality of conductive pins arranged at a predetermined pitch;

 A pair of spaced apart insulation plates that support the conductive pins;

«I-pin unit with

 A third anisotropic conductive sheet disposed opposite to the second anisotropic conductive sheet of the relay pin unit;

With a connection circuit unit for inspection with

 A connector board for electrically connecting a tester and the relay pin unit; a base plate disposed on the opposite side of the connector board from the relay pin unit; and a tester side connector comprising:

 Between the connector board of the first inspection jig and the connector board of the second inspection jig,

Auxiliary connection circuit unit that electrically connects from one tester side connector to the electrode of the tester connected to the other tester side connector is provided, bypassing the inspection connection circuit unit. . [0057] Further, in the circuit board inspection apparatus of the present invention, the auxiliary connection circuit unit is provided between the connector board of the first inspection jig and the connector board of the second inspection jig.

 A first auxiliary relay unit having a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins, and arranged on the connector board side of the first inspection jig;

 A second auxiliary relay unit provided on the connector board side of the second inspection jig, comprising a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins;

 An auxiliary anisotropically conductive sheet electrically connecting the first auxiliary relay pin unit and the second auxiliary relay pin unit to each other;

 Auxiliary connection circuit unit with

 The test connection circuit unit is bypassed and electrically connected from one tester side connector to the electrode of the other tester side connector.

With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. One tester-side connector that is larger than the number of electrodes that can be inspected by the tester-side connector Even if the number of one electrode is insufficient, the connector board of the first inspection jig and the connector of the second inspection jig A connection circuit unit for inspection via an auxiliary connection circuit unit provided with a first auxiliary relay pin unit, a second auxiliary relay pin unit, and an auxiliary anisotropic conductive sheet disposed between the circuit board and the substrate. Can be electrically connected from one tester side connector to the electrode of the other tester side connector, and the circuit board under test can be electrically tested with high reliability. .

[0059] Further, the circuit board inspection apparatus of the present invention includes:

 The auxiliary connection circuit unit is

Between the connector board of the first inspection jig and the connector board of the second inspection jig A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates that support the conductive pins, and an auxiliary relay pin switch arranged on the connector board side of one inspection jig;

 An auxiliary relay board body provided with an insulating substrate and a plurality of conductive portions formed on the insulating substrate; an urging device for urging the auxiliary relay board body toward the auxiliary relay pin unit; and a base end portion of the conductive portion; An auxiliary relay board device disposed on the connector board side of the other inspection jig, and a connection wiring for electrically connecting a tester electrode connected to the other tester side connector;

 An auxiliary anisotropic conductive sheet for electrically connecting the auxiliary relay pin unit and the auxiliary relay board device to each other;

 Auxiliary connection circuit unit with

 Auxiliary connection circuit unit that electrically connects from one tester side connector to the electrode of the tester connected to the other tester side connector is provided, bypassing the inspection connection circuit unit. .

 With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. One tester side connector that is larger than the number of electrodes that can be inspected by the tester side connector Even if the number of one electrode is insufficient, the auxiliary relay pin unit arranged on the connector board side of one inspection jig , Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit having the auxiliary relay board device arranged on the connector board side of the other inspection jig and the auxiliary anisotropic conductive sheet, The tester side connector can be electrically connected to the electrode of the tester connected to the other tester side connector, and the circuit board under test must be electrically tested with high reliability. It can be.

[0061] Shika also has different sizes and thicknesses depending on the type of circuit board to be inspected. However, as described above, the first auxiliary relay pin unit, the second auxiliary relay pin unit, In the auxiliary connection circuit unit equipped with an anisotropic conductive sheet, when the type of circuit board to be inspected is changed, the thickness of the auxiliary anisotropic conductive sheet is changed for each type of circuit board to be inspected. Have to be prepared and replaced, costly, intricate inspection work, continuous Electrical inspection cannot be performed, and inspection efficiency is reduced.

 [0062] Further, when the type of the circuit board to be inspected is changed and the thickness of the circuit board to be inspected greatly changes, the first auxiliary relay pin unit and the second auxiliary relay pin unit themselves are also large. It must be replaced with a modified one, etc., and the cost becomes high, the inspection work is complicated, the continuous electrical inspection cannot be performed, and the inspection efficiency is lowered.

 [0063] While the force is applied, the auxiliary relay board body having a plurality of conductive portions is formed by the biasing device of the auxiliary relay board device arranged on the connector board side of the other inspection jig as described above. Since it is biased toward the auxiliary relay pin unit, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, the biasing force of this biasing device absorbs the change in thickness. Thus, electrical conduction of the auxiliary connection circuit unit can be ensured.

 [0064] Further, the circuit board inspection apparatus of the present invention comprises:

 The auxiliary connection circuit unit is

 Between the connector board of the first inspection jig and the connector board of the second inspection jig,

 A first auxiliary relay unit having a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins, and arranged on the connector board side of the first inspection jig;

 An auxiliary relay board body provided with an insulating substrate and a plurality of conductive portions formed on the insulating substrate; an urging device for biasing the auxiliary relay board body toward the first auxiliary relay pin unit; and a base of the conductive portion A second auxiliary relay board disposed on the connector board side of the second inspection jig, and having a connection wiring for electrically connecting the end and the electrode of the tester connected to the second tester side connector Equipment,

 An auxiliary anisotropic conductive sheet electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other;

 Auxiliary connection circuit unit with

Auxiliary connection circuit unit that electrically connects from the first tester side connector to the tester electrode connected to the second tester side connector is provided, bypassing the inspection connection circuit unit. To do. With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. 1st tester-side connector that is larger than the predetermined number of electrodes that can be inspected on the connector on the side of the tester. Inspection is performed via an auxiliary connection circuit unit including a relay pin unit, a second auxiliary relay board device arranged on the connector board side of the second inspection jig, and an auxiliary anisotropic conductive sheet. By bypassing the connection circuit unit, the first tester side connector can be electrically connected to the electrode of the tester connected to the second tester side connector. Implement with high reliability It is possible.

 [0066] As described above, the auxiliary relay board body having a plurality of conductive portions is also formed by the urging device of the second auxiliary relay board device arranged on the connector board side of the second inspection jig as described above. Therefore, even if the type of the circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, the biasing force of this biasing device The change in length can be absorbed and electrical connection of the auxiliary connection circuit unit can be ensured.

 [0067] Further, the circuit board inspection apparatus of the present invention includes:

 The auxiliary connection circuit unit is

 Between the connector board of the first inspection jig and the connector board of the second inspection jig,

 A second auxiliary relay unit provided on the connector board side of the second inspection jig, comprising a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins;

 An auxiliary relay board body provided with an insulating substrate and a plurality of conductive portions formed on the insulating substrate; an urging device for biasing the auxiliary relay board body toward the second auxiliary relay pin unit; and a base of the conductive portion A first auxiliary relay board disposed on the connector board side of the first inspection jig, and having a connection wiring for electrically connecting the end and the electrode of the tester connected to the first tester side connector Equipment,

An auxiliary anisotropic conductive sheet that electrically connects the second auxiliary relay pin unit and the first auxiliary relay board device to each other; Auxiliary connection circuit unit with

 Auxiliary connection circuit unit that electrically connects from the second tester side connector to the electrode of the tester connected to the first tester side connector is provided, bypassing the inspection connection circuit unit. It is characterized by doing.

 With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. 2nd tester side connector that is larger than the number of electrodes that can be inspected on the connector on the side of the tester Even if the number of electrodes on one side is insufficient, the 2nd auxiliary placed on the connector board side of the 2nd inspection jig Inspection is performed via an auxiliary connection circuit unit including a relay pin unit, a first auxiliary relay board device arranged on the connector board side of the first inspection jig, and an auxiliary anisotropic conductive sheet. By bypassing the connection circuit unit, the second tester side connector can be electrically connected to the electrode of the tester connected to the first tester side connector. Implement with high reliability It is possible.

 [0069] As described above, the auxiliary relay board body having a plurality of conductive portions is also formed by the biasing device of the first auxiliary relay board device arranged on the connector board side of the first inspection jig as described above. Therefore, even if the type of the circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, the biasing force of this biasing device The change in length can be absorbed and electrical connection of the auxiliary connection circuit unit can be ensured.

 [0070] Further, the circuit board inspection apparatus of the present invention comprises:

 The auxiliary connection circuit unit is

 Between the connector board of the first inspection jig and the connector board of the second inspection jig,

 A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates that support the conductive pins, and an auxiliary relay pin switch arranged on the connector board side of one inspection jig;

 A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;

An urging device for urging the pair of auxiliary relay substrate bodies in a direction away from each other; An auxiliary relay board device disposed on the connector board side of the other inspection jig, and the auxiliary relay pin, the connecting wiring electrically connecting base ends of the conductive parts of the pair of auxiliary relay board bodies An auxiliary anisotropic conductive sheet for electrically connecting the unit and the auxiliary relay board device to each other;

 Auxiliary connection circuit unit with

 An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

 With this configuration, the number of electrodes of the test electrode on one surface of the circuit board to be tested is larger than the number of electrodes of the test electrode on the other surface of the circuit board to be tested. One tester-side connector that is larger than the number of electrodes that can be inspected by the tester-side connector Even if the number of one electrode is insufficient, the auxiliary relay pin unit disposed on the connector board side of one inspection jig , Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit having the auxiliary relay board device arranged on the connector board side of the other inspection jig and the auxiliary anisotropic conductive sheet, The tester side connector can be electrically connected to the electrode of the other tester side connector, and the electrical inspection of the circuit board to be inspected can be performed with high reliability.

 [0072] As described above, the force is also applied by the biasing device that biases the pair of auxiliary relay board bodies of the auxiliary relay board device arranged on the connector board side of the other inspection jig in a direction away from each other. Since the pair of auxiliary relay board bodies having a plurality of conductive portions are biased toward the auxiliary relay pin unit side and the electrode side of the other tester side connector, the type of circuit board to be inspected is changed, Even if the thickness of the circuit board to be inspected changes, the urging force of the urging device can absorb the change in the thickness and ensure the electrical connection of the auxiliary connection circuit unit.

 [0073] Further, the circuit board inspection apparatus of the present invention includes:

 The auxiliary connection circuit unit is

Between the connector board of the first inspection jig and the connector board of the second inspection jig In

 A first auxiliary relay unit having a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins, and arranged on the connector board side of the first inspection jig;

 A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;

 An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A second auxiliary relay board device disposed on the connector board side of the second inspection jig;

 An auxiliary anisotropic conductive sheet electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other;

 Auxiliary connection circuit unit with

 An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

 With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. One tester-side connector that is larger than the number of electrodes that can be inspected by the tester-side connector Even if the number of one electrode is insufficient, the first auxiliary relay arranged on the connector board side of the first inspection jig For inspection through an auxiliary connection circuit unit comprising a pin unit, a second auxiliary relay board device arranged on the connector board side of the second inspection jig, and an auxiliary anisotropic conductive sheet By bypassing the connection circuit unit, electrical connection can be made from one tester side connector to the electrode of the other tester side connector, and electrical inspection of the circuit board under test must be performed with high reliability. Can do.

[0075] As described above, the biasing force is also applied to bias the pair of auxiliary relay board bodies of the second auxiliary relay board device arranged on the connector board side of the second inspection jig in a direction away from each other. The pair of auxiliary relay substrate bodies having a plurality of conductive portions is transformed into the first auxiliary relay pin by the biasing device. Since it is biased to the unit side and the electrode side of the second tester side connector, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected is changed, The biasing force can absorb the change in thickness and ensure the electrical connection of the auxiliary connection circuit unit.

[0076] Further, the circuit board inspection apparatus of the present invention includes:

 The auxiliary connection circuit unit is

 Between the connector board of the first inspection jig and the connector board of the second inspection jig,

 A second auxiliary relay unit provided on the connector board side of the second inspection jig, comprising a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins;

 A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;

 An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A first auxiliary relay board device disposed on the connector board side of the first inspection jig;

 An auxiliary anisotropic conductive sheet that electrically connects the second auxiliary relay pin unit and the first auxiliary relay board device to each other;

 Auxiliary connection circuit unit with

 An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. The second auxiliary relay located on the connector board side of the second inspection jig even if one tester side connector is larger than the predetermined number of electrodes that can be inspected. Placed on the connector unit side of the pin unit and the first inspection jig The test connection circuit unit is bypassed through the auxiliary connection circuit unit including the first auxiliary relay board device and the auxiliary anisotropic conductive sheet, and is connected from one tester side connector to the other. It can be electrically connected to the electrode of the tester side connector, and the electrical inspection of the circuit board to be inspected can be carried out with high reliability.

 As described above, the force is also applied to bias the pair of auxiliary relay board bodies of the first auxiliary relay board device arranged on the connector board side of the first inspection jig in a direction away from each other. The pair of auxiliary relay board bodies having a plurality of conductive portions are biased by the biasing device toward the second auxiliary relay pin unit side and the electrode side of the first tester side connector, so that Even if the type of circuit board is changed and the thickness of the circuit board to be inspected changes, the biasing force of this biasing device absorbs the change in thickness and allows electrical connection of the auxiliary connection circuit unit. Can be secured.

 [0079] Further, the circuit board inspection apparatus of the present invention includes:

 The auxiliary connection circuit unit is

 Between the connector board of the first inspection jig and the connector board of the second inspection jig,

 A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;

 An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A first auxiliary relay board device disposed on the connector board side of the first inspection jig;

 A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;

 An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A second auxiliary relay board device disposed on the connector board side of the second inspection jig;

The first auxiliary relay board device and the second auxiliary relay board device are electrically connected to each other. An auxiliary anisotropic conductive sheet to be continued;

 Auxiliary connection circuit unit with

 An auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the other tester side connector.

 With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. One tester-side connector that is larger than the number of electrodes that can be inspected by the tester-side connector Even if the number of one electrode is insufficient, the first auxiliary relay arranged on the connector board side of the first inspection jig For inspection through an auxiliary connection circuit module comprising a board device, a second auxiliary relay board device arranged on the connector board side of the second inspection jig, and an auxiliary anisotropic conductive sheet. By bypassing the connection circuit unit, electrical connection can be made from one tester side connector to the electrode of the other tester side connector, and electrical inspection of the circuit board under test is performed with high reliability. be able to.

[0081] As described above, the biasing force is also applied to bias the pair of auxiliary relay board bodies of the first auxiliary relay board device arranged on the connector board side of the first inspection jig in a direction away from each other. The pair of auxiliary relay substrate bodies having a plurality of conductive portions are urged by the biasing device toward the second auxiliary relay pin unit side and the electrode side of the first tester side connector. The pair of auxiliary relay board devices of the second auxiliary relay board device arranged on the connector board side of the inspection jig is biased to bias the pair of auxiliary relay board bodies away from each other. Since the auxiliary relay board body is biased toward the first auxiliary relay pin unit side and the electrode side of the second tester side connector, the type of circuit board to be inspected is changed and the circuit board to be inspected is changed. The biasing force of this biasing device Therefore, it is possible to secure the electrical connection of the auxiliary connection circuit unit by absorbing the change in thickness.

 [0082] Further, the circuit board inspection apparatus of the present invention is characterized in that the conductive portion of the auxiliary relay board device is a conductive pin implanted in an insulating board.

[0083] As described above, the conductive portion of the auxiliary relay board device may be a conductive pin implanted in the insulating board. For example, the electrical connection of the auxiliary connection circuit unit is made when the electrical inspection is performed by clamping both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig. It can be done reliably.

 [0084] Further, in the circuit board inspection device of the present invention, the relay pin unit includes a plurality of conductive pins arranged at a predetermined pitch,

 And a pair of spaced apart insulating plates that support the conductive pins so as to be movable in the axial direction.

[0085] With this configuration, when conducting electrical inspection by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, the conductive pin Can move in the axial direction, so that it is possible to absorb some variation in the height of the electrodes to be inspected on the circuit board to be inspected.

 [0086] Further, in the circuit board inspection apparatus of the present invention, the auxiliary relay pin unit includes a plurality of conductive pins arranged with a predetermined pitch,

 And a pair of spaced apart insulating plates that support the conductive pins so as to be movable in the axial direction.

[0087] With this configuration, when conducting electrical inspection by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig, the conductive pin Can move in the axial direction, so that impact can be absorbed and durability of the auxiliary anisotropic conductive sheet can be improved.

[0088] Further, in the circuit board inspection apparatus of the present invention, the relay pin unit includes:

 An intermediate holding plate disposed between the first insulating plate and the second insulating plate;

 A first support pin disposed between the first insulating plate and the intermediate holding plate, and a second support pin disposed between the second insulating plate and the intermediate holding plate, and

 The first abutting support position of the first support pin with respect to the intermediate holding plate and the second abutting support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. It is characterized by being arranged at different positions on the projected intermediate holding plate projection surface.

[0089] By configuring in this way, an inspection object is provided between the first inspection jig and the second inspection jig. When electrical inspection is performed by clamping both sides of the circuit board to be inspected, the relay pin unit is moved in the thickness direction by the conductive pins and the first anisotropic conductive sheet is applied at the initial stage of pressurization. The pressure is absorbed by the rubber elastic compression of the second anisotropic conductive sheet and the third anisotropic conductive sheet, and the height variation of the inspected electrode of the circuit board to be inspected can be absorbed to some extent. it can.

 [0090] The first contact support position of the first support pin with respect to the intermediate support plate and the second contact support position of the second support pin with respect to the intermediate support plate are the thickness of the intermediate support plate. They are arranged at different positions on the intermediate holding plate projection surface projected in the vertical direction.

 [0091] Therefore, when the circuit board to be inspected is further pressed between the first inspection jig and the second inspection jig, the first anisotropic conductive sheet and the second In addition to the rubber elastic compression of the anisotropic conductive sheet and the third anisotropic conductive sheet, the first insulating plate, the second insulating plate, the first insulating plate and the second insulating pin of the relay pin unit Due to the panel elasticity of the intermediate holding plate placed between the insulating plates, the pressure concentration is distributed to the height variation of the inspected electrode of the circuit board to be inspected, for example, the height variation of the solder ball electrode, and the local concentration is distributed. It is possible to avoid stress concentration.

 [0092] Accordingly, stable electrical contact is ensured for each of the electrodes to be inspected on the circuit board to be inspected having a height variation, and stress concentration is further reduced, so that the anisotropic conductive sheet Local damage is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

 Further, the circuit board inspection apparatus of the present invention includes:

 The auxiliary relay pin unit is

 An intermediate holding plate disposed between the first insulating plate and the second insulating plate;

 A first support pin disposed between the first insulating plate and the intermediate holding plate, and a second support pin disposed between the second insulating plate and the intermediate holding plate, and

The first abutting support position of the first support pin with respect to the intermediate holding plate and the second abutting support position of the second support pin with respect to the intermediate holding plate are in the thickness direction of the intermediate holding plate. Throw It is characterized by being arranged at different positions on the projected intermediate holding plate projection surface.

 [0094] With this configuration, pressure is applied when electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig. In the initial stage, the impact force can be absorbed to some extent by the movement of the relay pin unit in the thickness direction by the conductive pins and the auxiliary anisotropic conductive sheet.

 [0095] The first abutment support position of the first support pin with respect to the intermediate holding plate and the second abutment support position of the second support pin with respect to the intermediate holding plate are the thickness of the intermediate holding plate. They are arranged at different positions on the intermediate holding plate projection surface projected in the vertical direction.

 [0096] Therefore, when the circuit board to be inspected is further pressed between the first inspection jig and the second inspection jig, in addition to the rubber elastic compression of the auxiliary anisotropic conductive sheet, The pressure concentration is dispersed by the panel elasticity of the intermediate insulating plate arranged between the first insulating plate, the second insulating plate, and the first insulating plate and the second insulating plate of the relay pin unit, Local stress concentration can be avoided.

 [0097] Thereby, stable electrical contact is ensured and stress concentration is further reduced, so that local breakage of the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so that the number of replacement of the auxiliary anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

 [0098] Further, the circuit board inspection apparatus of the present invention uses a pair of the first inspection jig and the second inspection jig to cover both surfaces of the circuit board to be inspected between the inspection jigs. When pinching,

 Centering on the first contact support position with the intermediate holding plate of the first support pin, the intermediate holding plate is sandwiched in the direction of the second insulating plate,

 The intermediate holding plate is configured to be sandwiched in the direction of the first insulating plate with a second contact support position with the intermediate holding plate of the second support pin as a center.

[0099] With this configuration, the intermediate holding plate is sandwiched in directions opposite to each other around the first contact support position and the second contact support position. Between the jig and the second inspection jig

The panel elastic force of the intermediate holding plate when the circuit board to be inspected is further pressurized Force S will be further exerted, and it is possible to avoid localized stress concentration by dispersing pressure concentration against the height variation of the inspected electrode of the circuit board to be inspected. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacement of the anisotropic conductive sheet is reduced and the inspection work efficiency is improved.

 [0100] Even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

 Further, in the circuit board inspection apparatus of the present invention, the first contact support position of the first support pin with the intermediate holding plate is arranged in a grid pattern on the intermediate holding plate projection surface, Second contact and support positions of the second support pins with the intermediate holding plate are arranged in a grid pattern on the intermediate holding plate projection surface,

 On the intermediate holding plate projection surface, one second abutment support position is disposed in a unit cell region composed of the four adjacent first abutment support position groups, and

 On the intermediate holding plate projection surface, one first abutment support position is arranged in a unit lattice region composed of the four adjacent second abutment support position groups. It is characterized by.

 [0102] With this configuration, the first contact support position and the second contact support position are arranged in a lattice shape, and the first contact support position and the second contact support position are arranged in a lattice shape. The grid point positions of the support positions are all shifted.

[0103] Accordingly, the intermediate holding plate is pinched in opposite directions around the first contact support position and the second contact support position, and the first inspection jig and the second inspection plate When the circuit board to be inspected is pressed between the inspection jigs, the panel elastic force of the intermediate holding plate is further exerted, resulting in variations in the height of the electrodes to be inspected on the circuit board to be inspected. On the other hand, the concentration of pressure can be dispersed to further avoid local stress concentration, and local breakage of the anisotropic conductive sheet can be suppressed. As a result, the anisotropic conductive sheet can be used repeatedly. Since durability is improved, the number of times of anisotropic conductive sheet replacement is reduced and inspection work efficiency is improved. [0104] Even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

 [0105] Further, in the circuit board inspection apparatus of the present invention, a plurality of intermediate holding plates are arranged at a predetermined interval between the first insulating plate and the second insulating plate,

 A holding plate support pin is arranged between these adjacent intermediate holding plates.

 [0106] With this configuration, panel elasticity is further exerted by the plurality of intermediate holding plates, and pressure concentration is reduced with respect to height variations of the electrodes to be inspected on the circuit board to be inspected. Dispersion can further avoid local stress concentration, and local damage of the anisotropic conductive sheet can be suppressed.As a result, the durability of repeated use of the anisotropic conductive sheet is improved. This reduces the number of times the conductive sheet is replaced and improves inspection work efficiency.

 [0107] Even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

 [0108] Further, in the circuit board inspection apparatus of the present invention, the contact support position of the support plate support pin with the intermediate support plate is between adjacent intermediate support plates, and the contact support position is the intermediate support plate projection. It is characterized by being arranged at different positions on the shadow plane.

[0109] Accordingly, since the contact support position of the holding plate support pin with the intermediate holding plate is shifted between the adjacent intermediate holding plates, the panel elasticities of the plurality of intermediate holding plates are elastic. The anisotropic conductive sheet can further avoid the local stress concentration by distributing the pressure concentration against the height variation of the inspected electrode of the circuit board to be inspected. As a result, the repeated use durability of the anisotropic conductive sheet is improved, so that the number of times the anisotropic conductive sheet is replaced is reduced, and the inspection work efficiency is improved. [0110] Further, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local breakage of the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

 [0111] Further, the circuit board inspection apparatus of the present invention includes a first contact support position with the intermediate holding plate of the first support pin and a second position of the intermediate holding plate with the second support pin. The abutting support position and the abutting support position of the holding plate support pin with the intermediate holding plate are arranged at different positions on the intermediate holding plate projection surface.

 [0112] As described above, the first contact support position, the second contact support position, and the contact support position of the holding plate support pin are arranged at positions shifted from each other. The insulating plate, the second insulating plate, and the intermediate holding plate are further exerted with elasticity, and the pressure concentration is distributed to the height variation of the electrode to be inspected on the circuit board to be inspected. Stress concentration can be further avoided, and local breakage of the anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved. The number of replacements is reduced and inspection work efficiency is improved.

 [0113] Also, even when the auxiliary relay pin unit is configured in this way, local stress concentration can be avoided, and local damage to the auxiliary anisotropic conductive sheet is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so the number of replacements of the auxiliary anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

 [0114] Further, the circuit board inspection apparatus of the present invention includes a pair of current terminal electrodes and voltage terminal electrode caps for each of the electrodes to be inspected of the circuit board to be inspected in the pitch conversion substrate. It is arranged so that the connecting electrode that will be connected is electrically connected,

 In the connector board, the current pin side electrode and the voltage pin side electrode are arranged so as to be electrically connected to the current terminal electrode and the voltage terminal electrode of the pitch conversion board, respectively. Features.

[0115] With this configuration, when an electrical inspection is performed by sandwiching both surfaces of a circuit board to be inspected between the first inspection jig and the second inspection jig, For pitch conversion via the first anisotropic conductive sheet for each electrode to be inspected on the circuit board Both the current terminal electrode and the voltage terminal electrode of the connection electrode of the substrate are electrically connected.

 [0116] Then, the current terminal electrode of the pitch conversion board is connected to the current pin of the connector board via the second anisotropic conductive sheet, the conductive pin of the relay pin unit, and the third anisotropic conductive sheet. In addition to being electrically connected to the side electrode, the voltage terminal electrode of the pitch conversion board is now electrically connected to the voltage terminal electrode of the connector board! / Speak.

 Thus, a current supply path is configured via the current terminal electrodes of one upper and lower pitch conversion substrate for each of the electrodes to be inspected of the circuit board to be inspected. Thus, a voltage measurement path is configured for each of the electrodes to be inspected on the circuit board to be inspected via the voltage terminal electrodes of the upper and lower ones for pitch conversion.

 [0118] Therefore, for each of the electrodes to be inspected on the circuit board to be inspected, the current supply electrode is connected to the current supply path using, for example, a constant current supply device via the current terminal electrodes of the upper and lower pitch conversion boards. By measuring the voltage from each electrode to be inspected on the circuit board to be inspected by the voltmeter through the voltage terminal electrode on the upper and lower pitch conversion boards while supplying a constant current. In addition, it is possible to carry out a confirmation test of electrical characteristics as to whether or not the wiring pattern of the circuit board to be inspected has a predetermined performance.

 [0119] Conversely, for each of the electrodes to be inspected on the circuit board to be inspected, the voltage measuring path is connected to the voltage measuring path by using, for example, a constant voltage device through the voltage terminal electrodes of the upper and lower pitch conversion boards. On the other hand, while applying a constant voltage, the current from each electrode to be inspected on the circuit board to be inspected is measured by an ammeter through the current supply electrode on the upper and lower ones of the pitch conversion boards. Thus, it is possible to perform a test for confirming the electrical characteristics as to whether or not the wiring pattern of the circuit board to be inspected has a predetermined performance.

 [0120] In this way, the voltage and current can be separately measured via the separate voltage measurement path and current supply path for each electrode to be inspected of the circuit board to be inspected. Depending on whether or not the wiring pattern has a predetermined performance, an accurate confirmation test can be performed according to the electrical characteristics, and the time required for the confirmation test can be shortened. It can be done.

[0121] Further, in the circuit board inspection apparatus of the present invention, the first anisotropic conductive sheet is an anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction. It is characterized by being.

 [0122] As described above, since the anisotropic conductive sheet in which the conductive particles are arranged in the thickness direction and dispersed in the plane direction is used as the first anisotropic conductive sheet, the lateral direction of the sheet is slightly increased. Even if the position is shifted, good electrical connection between the circuit board to be inspected and the first anisotropic conductive sheet is ensured.

 [0123] Further, in the circuit board inspection apparatus of the present invention, the second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulation for insulating the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are unevenly dispersed in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. It is characterized by that.

 [0124] Further, in the circuit board inspection apparatus of the present invention, the third anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulation for insulating the conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are unevenly dispersed in the surface direction, and the conductive path forming portion protrudes on one side of the sheet. It is characterized by that.

 [0125] Thus, the second anisotropic conductive sheet and the third anisotropic conductive sheet are composed of the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion. By using an unevenly anisotropic anisotropic conductive sheet that is unevenly distributed in the surface direction and the conductive path forming part protrudes on one side of the sheet, the applied pressure and impact due to the pressing of the inspection jig are applied to these sheets. This suppresses the deterioration of the first anisotropic conductive sheet.

 [0126] The circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,

 The electrical inspection is performed by sandwiching both surfaces of the circuit board to be inspected between the inspection jigs by the pair of the first inspection jig and the second inspection jig.

With this configuration, the voltage and current can be separately measured for each electrode to be inspected on the circuit board to be inspected via a separate voltage measurement path and current supply path. Therefore, it is possible to conduct an accurate confirmation test on the electrical characteristics depending on whether or not the wiring pattern of the inspection circuit board has a predetermined performance. Can be carried out in a short time.

 The invention's effect

 [0128] According to the present invention, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. Even if the number of electrodes on one of the tester side connectors is larger than the predetermined number of electrodes that can be inspected, the connector board of the first inspection jig and the connector board of the second inspection jig The inspection connection circuit unit is connected via an auxiliary connection circuit unit having a first auxiliary relay pin unit, a second auxiliary relay pin unit, and an auxiliary anisotropic conductive sheet disposed between By bypassing, electrical connection can be made from one tester side connector to the electrode of the other tester side connector, and electrical inspection of the circuit board to be inspected can be performed with high reliability.

 [0129] Further, according to the present invention, it is possible to perform a highly reliable electrical inspection of a circuit board even if the circuit board to be inspected has a microelectrode with a fine pitch. It is.

 [0130] In addition, when performing repeated continuous inspections on the circuit board to be inspected, the inspection workability is less required to correct the misalignment of the anisotropic conductive sheet.

Furthermore, in the repeated continuous inspection of the circuit board to be inspected, the anisotropic conductive sheet can be easily replaced when the anisotropic conductive sheet deteriorates.

[0132] Even if the circuit board to be inspected is changed, the circuit board for inspection can be applied to any circuit board to be inspected only by changing the circuit board for inspection without separately manufacturing the entire inspection apparatus.

It is possible to cope with the inspection.

[0133] Furthermore, since there is no need to arrange the conductive pins at regular intervals, the number of through-holes formed in the insulating plate is small because drilling of the through-holes in the insulating plate holding the conductive pins is less. Therefore, the thickness of the insulating plate is thin and can withstand the force, and the squeezing force that causes a defect can also reduce the cost.

[0134] Furthermore, the voltage and current can be separately measured for each electrode to be inspected on the circuit board to be inspected via the separate voltage measurement path and current supply path. Whether the wiring pattern has a predetermined performance or not, it is possible to perform an accurate confirmation test according to the electrical characteristics, and the force and time required for the confirmation test can be performed in a short time. .

 [0135] Since the voltage can be measured while supplying current to the circuit to be inspected on the circuit board to be inspected, at a setting voltage lower than the setting voltage for determining whether the conduction resistance value is good or not in the conventional inspection apparatus. This makes it possible to stably measure the conduction resistance value of the circuit under test on the circuit board under test.

 That is, as a requirement for high-precision inspection, the power required to judge the quality of a circuit at a low set voltage According to the present invention, there is a potential for having an electrical defect as compared with a conventional inspection apparatus. Since the inspection circuit board can be judged and removed as a defective product with high probability, it is possible to carry out a highly reliable circuit board confirmation test.

 Brief Description of Drawings

FIG. 1 is a cross-sectional view for explaining an embodiment of an inspection apparatus of the present invention.

 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection.

[FIG. 3] FIG. 3 is a diagram showing a surface of a pitch conversion board on the circuit board side.

 FIG. 4 is a view showing a pin side surface of a pitch conversion substrate.

 FIG. 5 is a partial cross-sectional view of a first anisotropic conductive sheet.

 FIG. 6 is a partial cross-sectional view of a second anisotropic conductive sheet.

 FIG. 7 is a cross-sectional view showing a state in which a first anisotropic conductive sheet is laminated on a pitch conversion substrate.

 [FIG. 8] FIG. 8 is a partially enlarged sectional view for explaining a use state of the embodiment of the inspection apparatus of the present invention.

 FIG. 9 is a cross-sectional view showing a part of a conductive pin, an intermediate holding plate, and an insulating plate of a relay pin unit.

 FIG. 10 is a cross-sectional view for explaining another embodiment of the inspection apparatus of the present invention.

[FIG. 11] FIG. 11 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 10 is used for inspection. FIG. 12 is a cross-sectional view of the relay pin unit.

[13] FIG. 13 is a partially enlarged view of the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit.

 FIG. 14 is a partially enlarged sectional view for explaining an embodiment of the inspection apparatus of the present invention.

FIG. 15 is a partially enlarged cross-sectional view for explaining the usage state of the embodiment of the inspection apparatus of the present invention.

 FIG. 16 is a partially enlarged cross-sectional view for explaining the usage state of the relay pin unit of the inspection apparatus of the present invention.

 FIG. 17 is a partially enlarged cross-sectional view for explaining the usage state of the embodiment of the inspection apparatus of the present invention.

 FIG. 18 is a cross-sectional view similar to FIG. 14 for explaining another embodiment of the inspection apparatus of the present invention.

 FIG. 19 is an enlarged cross-sectional view of the relay pin unit in the embodiment of FIG.

FIG. 20 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

 FIG. 21 is a cross-sectional view similar to FIG. 2, showing a stacked state when the inspection apparatus of FIG. 20 is used for inspection.

 FIG. 22 is a partially enlarged view of the inside of the auxiliary relay board body 302. FIG.

[23] FIG. 23 is a partial enlarged view showing an example of a connection state between the base end portion of the conductive pin of the auxiliary relay substrate body and the wiring.

 FIG. 24 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

 FIG. 25 is a cross-sectional view similar to FIG. 2, showing a stacked state when the inspection apparatus of FIG. 24 is used for inspection.

 FIG. 26 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

FIG. 27 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention. FIG. 28 is a sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

 FIG. 29 is a sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

 FIG. 30 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

 FIG. 31 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

 FIG. 32 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

 FIG. 33 is a cross-sectional view of a conventional circuit board inspection apparatus.

FIG. 34 is a cross-sectional view of a conventional circuit board inspection apparatus.

FIG. 35 is a cross-sectional view of a conventional circuit board inspection apparatus.

FIG. 36 is a partially enlarged cross-sectional view for explaining a use state of a conventional inspection apparatus. Explanation of symbols

10 Inspection equipment

 11a First inspection jig

l ib Second inspection jig

 21a, 21b Circuit board connector

 22a, 22b First anisotropic conductive sheet

 23a, 23b Pitch conversion board

 24 terminal electrode

 25 Connection electrode

 26a, 26b Second anisotropic conductive sheet

27a, 27b Current terminal electrode

28a, 28b Voltage terminal electrode

31a, 31b Relay pin unit

32a, 32b Conductive pin a, 34b Insulating plate (first insulating plate) a, 35b Second insulating plate

a Intermediate holding plate

a, 37b Second support pin

A First abutment support position

B Second contact support position

 Holding plate support pin

A Contact support position

a, 41b Tester side connector a, 42b Third anisotropic conductive sheet a, 43b Connector board a, 44b Tester side electrode a, 45b Pin side electrode

a, 46b Base plate

a, 47b Current pin side electrode a, 48b Voltage pin side electrode Insulation substrate

 Wiring

 Internal wiring

 Insulation layer

 Insulation layer

a, 56b Inspection connection circuit unit Sheet base material

 Conductive particles

 Insulation

 Conductive path forming part

 Protrusion

a, 81b end 82 Central

 83 Through hole

 101 Circuit board under test

 102 Inspected electrode

 111a Upper inspection jig

 111b Lower inspection jig

 121a Circuit board side connector

 122a anisotropic conductive sheet

 123a Pitch conversion board

 131a Relay pin unit

 132a Conductive pin

 134a Insulation plate

 141a Tester side connector

 142a Anisotropic conductive sheet

 143a connector board

 146a base plate

 200 Auxiliary connection circuit unit

 222 Auxiliary anisotropic conductive sheet

 231a First auxiliary relay pin unit

231b Second auxiliary relay pin unit

232a, 232b conductive pin

 233a, 233b 1st support pin

 234a, 234b Insulation plate (first insulation plate)

235a, 235b Second insulation plate

 236a, 236b Intermediate holding plate

 237a, 237b Second support pin

 300a First auxiliary relay board device

300b Second auxiliary relay board device 302a First auxiliary relay substrate

 302b Second auxiliary relay substrate

 304a 304b Energizing device

 306a 306b Lower frame

 308a, 308b Slide guide member

 310a 310b Elastic member

 312a, 312b Insulation substrate

 314a 314b Base insulation board

 316a 316b Planting hole

 320a, 320b conductive pin

 322a, 322b Retaining flange

 324a 324b Retaining hole

 326a, 326b Base end

 328a, 328b Connection wiring

 330a, 330b Connection opening

 340a, 340b Second auxiliary relay substrate

 342a 342b Connection wiring

 A Intermediate holding plate projection surface

 L1 distance

 L2 distance

 Q1 diagonal

 Q2 Diagonal

 R1 unit cell region

 R2 unit cell region

 BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.

[0140] In the following description, a pair of identical components in the first inspection jig and the second inspection jig (for example, the circuit board connector 21a and the circuit board connector 21b, the first difference) Symbolic conductive sheet 22a and first anisotropic conductive sheet 22b, etc.), the symbols “a” and “b” may be omitted (for example, the first anisotropic conductive sheet 22a). And the first anisotropic conductive sheet 22b may be collectively referred to as “first anisotropic conductive sheet 22”.

[0141] FIG. 1 is a cross-sectional view illustrating an embodiment of the inspection apparatus of the present invention, FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection, and FIG. FIG. 4 is a diagram showing the surface of the substrate to be inspected on the circuit board side, and FIG. 4 is a diagram showing the surface of the pitch conversion substrate on the pin unit side.

 [0142] This inspection apparatus 10 is a circuit board to be inspected by measuring an electrical resistance between electrodes to be inspected in a circuit board 1 to be inspected, such as a printed circuit board for mounting an integrated circuit or the like. The electrical inspection is performed.

 Then, as shown in FIGS. 1 and 2, the inspection apparatus 10 includes a first inspection jig 11a arranged on the upper surface side of the circuit board 1 to be inspected and a second inspection jig arranged on the lower surface side. The inspection jig l ib is arranged so as to face each other vertically.

 [0144] The first inspection jig 11a includes a circuit board side connector 21a including anisotropic conductive sheets 22a and 26a on both sides thereof, and a relay pin unit 31a. The first inspection jig 11a includes a connector substrate 43a on which the third anisotropic conductive sheet 42a is disposed on the relay pin unit 3la side, and a tester side connector 41a including a base plate 46a. .

 [0145] The second inspection jig l ib is also configured in the same manner as the first inspection jig 11a, and has a circuit board-side connector 21b having anisotropic conductive sheets 22b and 26b on both sides thereof, and a relay pin. Unit 31b is provided. The second inspection jig ib includes a connector substrate 43b on which the anisotropic conductive sheet 42b is disposed on the relay pin unit 31b side, and a tester-side connector 41b including a base plate 46b.

 [0146] An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof, which are electrically connected to each other. Talk!

 [0147] The circuit board side connectors 21a and 21b are composed of the pitch conversion boards 23a and 23b, the first anisotropic conductive sheets 22a and 22b, and the second anisotropic conductive sheets 26a and 26b arranged on both sides thereof. 26b.

[0148] The pitch conversion substrates 23a and 23b, the first anisotropic conductive sheets 22a and 22b, Inspection from circuit board side connectors 21a, 21b composed of second anisotropic conductive sheets 26a, 26b, relay pin units 3 la, 3 lb, and third anisotropic conductive sheets 42a, 42b Connection circuit units 56a and 56b are configured.

[0149] Also, the connector board 4 for electrically connecting the tester and the relay pin unit 3 la, 3 lb.

Base plates 46a and 46b arranged on the opposite side of 3a and 43b and the relay pin units 3la and 3 lb of the connector boards 43a and 43b and the tester side connectors 41a and 41b are configured.

FIG. 3 is a view showing a surface of the pitch conversion board 23 on the circuit board 1 side to be inspected, and FIG. 4 is a view showing a surface of the relay pin unit 31 side.

[0151] On one surface of the pitch conversion substrate 23, that is, on the circuit board 1 side to be inspected, a plurality of electrodes electrically connected to the electrodes 2 and 3 of the circuit board 1 to be inspected as shown in FIG. Connection electrode

25 is formed. These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected.

 Further, as shown in FIG. 3, FIG. 7, and FIG. 8, this connection electrode 25 is paired with one of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected. The current terminal electrode 27 and the voltage terminal electrode 28 are spaced apart from each other by a predetermined distance.

 In this case, the current terminal electrode 27 and the voltage terminal electrode 28 have a rectangular shape in FIG. 3, but this shape is not particularly limited, and various shapes such as a circular shape and a triangular shape are available. Can be scooped. The area occupied by the pair of current terminal electrode 27 and voltage terminal electrode 28 is substantially the same area as the area occupied by one of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected. It is desirable to reduce the measurement error.

 In this case, in the pitch conversion substrate 23, the separation distance L1 between the current terminal electrode 27 and the voltage terminal electrode 28 is preferably 10 m or more. If the separation distance L 1 is smaller than 10 / zm, the current flowing between the current terminal electrode 27 and the voltage terminal electrode 28 via the first anisotropic conductive sheets 22a and 22b becomes large. This is because it may be difficult to measure electrical resistance with high accuracy, and accurate electrical property inspection cannot be performed.

On the other hand, the upper limit of the separation distance L1 between the current terminal electrode 27 and the voltage terminal electrode 28 is the size and pitch of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected, and the current end. Although it is determined by the dimensions of the child electrode 27 and the voltage terminal electrode 28 and is not particularly limited, it is usually 500 / zm or less. If this separation distance L1 is too large, both the current terminal electrode 27 and the voltage terminal electrode 28 are appropriate for one of the test electrodes 2 and 3 on the circuit board 1 having a small size. This is because it becomes difficult to place the device on the screen.

 On the other hand, on the other surface of the pitch conversion board 23, that is, on the side opposite to the circuit board 1 to be inspected, as shown in FIG. 4, the conductive pins 32a and 32b of the relay pin unit 31 are electrically connected. A plurality of terminal electrodes 24 connected to each other are formed. These terminal electrodes 24 are, for example, a constant of 54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, 0.3 mm or 0.2 mm. It is arranged on the lattice point of the pitch, and the pitch is the same as the arrangement pitch of the conductive pins 32a and 32b of the relay pin unit.

 [0157] In this case, in Fig. 4, a plurality of terminal electrodes 24 are arranged on lattice points with a constant pitch on a part of the surface of the pitch conversion substrate 23. It is possible to arrange a plurality of terminal electrodes 24 on lattice points with a constant pitch over the entire surface of the substrate 23.

 [0158] Each connection electrode 25 in FIG. 3, that is, the current terminal electrode 27 and the voltage terminal electrode 28, corresponds to the separate wiring 52 and the internal wiring 53 passing through the insulating substrate 51 in the thickness direction, respectively. As shown in FIGS. 7 and 8, the terminal electrode 24 of FIG. 4 is electrically connected.

 [0159] For example, as shown in FIG. 7, the insulating portion on the surface of the pitch conversion substrate 23 includes an insulating layer 54 formed on the surface of the insulating substrate 51 so that the connection electrodes 25 are exposed. The thickness of the insulating layer 54 is preferably 5 to: L00 m, more preferably 10 to 60 m. This is because if the thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if this thickness is excessive, there is also a force that may make it difficult to electrically connect the connection electrode 25 and the anisotropic conductive sheet.

[0160] As a material for forming the insulating substrate 51 of the pitch conversion substrate, a material generally used as a substrate of a printed circuit board can be used. Specifically, for example, polyimide resin, glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced resin. A strong bismaleimide triazine resin can be used.

 [0161] As a material for forming the insulating layers 54 and 55 in FIG. 7, a polymer material that can be formed into a thin film can be used. Specifically, for example, epoxy resin, acrylic resin, phenol resin And polyimide resin, polyamide resin, a mixture thereof, and resist material.

 [0162] The pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material is prepared by laminating thin metal layers on both sides of a flat insulating substrate, and the laminated material penetrates in the thickness direction of the laminated material corresponding to the pattern corresponding to the terminal electrode to be formed. A plurality of through holes to be formed are formed by a numerically controlled drilling apparatus, a photo etching process, a laser processing process, or the like.

 [0163] Next, electroless plating and electrolytic plating are performed in the through-holes formed in the laminated material to form a no-hole connected to the thin metal layers on both sides of the substrate. Thereafter, the metal thin layer is subjected to a photo-etching process to form wiring patterns and connection electrodes on the surface of the insulating substrate, and terminal electrodes on the opposite surface.

 Then, as shown in FIG. 7, an insulating layer 54 is formed on the surface of the insulating substrate 51 so that each connection electrode 25 is exposed, and each terminal electrode 2 is formed on the opposite surface. The pitch conversion substrate 23 is obtained by forming the insulating layer 55 so that 4 is exposed. O The thickness of the insulating layer 55 is preferably 5 to: LOO m, more preferably 10 to 60 m. .

 [0165] The first anisotropic conductive sheet 22 constituting the circuit board side connector 21 and laminated with the circuit board 23 for pitch conversion is a sheet having an insulating elastic polymer force as shown in FIG. A large number of conductive particles 62 are dispersed in the surface direction and arranged in the thickness direction in the base material 61.

[0166] The thickness of the first anisotropic conductive sheet 22 is preferably 0.03 to 0.5 mm, more preferably 0.05 to 0.2 mm. If the minimum thickness is less than 0.03 mm, the mechanical strength of the first anisotropic conductive sheet 22 becomes low, and the required durability may not be obtained immediately. On the other hand, when the thickness of the first anisotropic conductive sheet 22 exceeds 0.5 mm, the electric resistance in the thickness direction becomes large and the electric power to be connected is immediately changed. If the pitch of the poles is small, the required insulation between the conductive paths formed by the pressurization cannot be obtained, and an electrical short circuit occurs between the electrodes to be inspected, resulting in the electrical circuit board being inspected. Inspection may be difficult.

 [0167] The elastic polymer material constituting the sheet base 61 of the first anisotropic conductive sheet 22 has a durometer hardness of 30 to 90, preferably 35 to 80, More preferably after 40-70.

 In the present invention, “durometer hardness” means a value measured with a type A durometer based on the JIS K6253 durometer hardness test. If the durometer hardness of the elastic polymer material is less than 30, the anisotropic conductive sheet will generate large permanent strains that cause large compression and deformation when pressed in the thickness direction. The sheet deteriorates early, making it difficult to use for inspection, making it less durable and easy to use!

 [0169] On the other hand, if the durometer hardness of the elastic polymer material exceeds 90, the amount of deformation in the thickness direction becomes insufficient when the anisotropic conductive sheet is pressed in the thickness direction. Therefore, good connection reliability cannot be obtained, and connection failure tends to occur.

 [0170] The elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it exhibits the above-mentioned durometer hardness. From this point of view, it is preferable to use silicone rubber.

 [0171] When magnetic conductive particles are used as the conductive particles 62 constituting the first anisotropic conductive sheet 22, it is preferable that the number average particle diameter D force is ~ 50 m. A thickness of 5 to 30 μm is preferred. A thickness of 8 to 20 μm is particularly preferred.

 [0172] Here, "number average particle diameter of magnetic conductive particles" means that measured by a laser diffraction scattering method.

 [0173] The anisotropic conductivity obtained when the number average particle diameter D of the magnetic conductive particles is 3 μm or more.

 1

In the manufacturing process, when the magnetic conductive particles are oriented by the magnetic field orientation treatment in the manufacturing process, the portion where the magnetic conductive particles are contained is easily deformed under pressure. As a result, the anisotropic conductive sheet obtained has a high anisotropy, and the resolution of the anisotropic conductive sheet (between the electrodes facing the thickness method by pressing the anisotropic conductive sheet) Adjacent to the lateral method while achieving electrical continuity The ability to maintain electrical insulation between the electrodes is good.

 On the other hand, the number average particle diameter D of the magnetic conductive particles is 50 μm or less.

 1

 The anisotropic conductive sheet has a good elasticity and is easily deformed under pressure, and has a good resolution even for fine and fine pitch electrodes.

 [0175] Then, in the first anisotropic conductive sheet 22, the thickness W m) and the magnetic conductivity

 1

 The ratio W ZD to the number average particle diameter D m) of the conductive particles is preferably 1.1 to 10.

 1 1 1

 Yes.

 [0176] When the ratio W ZD is less than 1.1, the ratio is magnetic to the thickness of the anisotropic conductive sheet.

 1 1

 Since the diameter of the conductive particles is the same or larger, the anisotropic conductive sheet has low elasticity. Therefore, the anisotropic conductive sheet is used as an object to be inspected (inspected circuit such as a printed wiring board). The object to be inspected is easily damaged when it is placed between the substrate 1) and the inspection electrode and pressure is applied to achieve the contact conduction state.

 [0177] On the other hand, if the ratio W / Ό exceeds 10, an anisotropic conductive sheet is printed on the printed wiring board.

 1 1

 When a contact conduction state is achieved by applying pressure between the inspection object such as the inspection electrode and the inspection electrode, a large number of conductive particles are arranged between the inspection object and the inspection electrode to form a chain. For this reason, since there are contacts between a large number of conductive particles, the electrical resistance value becomes high and the use of electrical inspection tends to be difficult.

[0178] As the magnetic conductive particles, the magnetic conductive particles are easily moved by the action of a magnetic field in a sheet molding material for forming an anisotropic conductive sheet by a manufacturing method described later. From the viewpoint that the saturation magnetic field is 0.1 lWb / m ² or more can be preferably used, more preferably 0.3 Wb / m ² or more, and particularly preferably 0.5 Wb / m or more. It is.

[0179] Since the saturation magnetic field is 0.1 lWbZm ² or more, the magnetically conductive particles can be reliably moved by the action of a magnetic field in the production process to obtain a desired orientation state. When a conductive sheet is used, a chain of magnetic conductive particles can be formed.

[0180] Specific examples of the magnetic conductive particles include particles of metals such as iron, nickel, cobalt, etc., particles of alloys thereof, particles containing these metals, or the like. These particles are used as core particles, and the core particles are coated with a highly conductive metal, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles are used as core particles. Composite particles with a highly conductive metal coating on the surface of the particles, or composite particles with core particles coated with both conductive magnetic materials such as ferrite and intermetallic compounds and highly conductive metals. Can be mentioned.

[0181] Here, "high conductivity metal" refers to a metal having an electrical conductivity at 0 ° C of 5 X 10 ⁶ Ω — — ¹ or more.

 [0182] As such a highly conductive metal, specifically, gold, silver, rhodium, platinum, chromium, and the like can be used, and among these, it is chemically stable and has high conductivity. It is preferable to use gold.

[0183] Among these magnetic conductive particles, composite particles in which nickel particles are used as core particles and the surface thereof is plated with a highly conductive metal such as gold or silver are preferable.

[0184] The means for coating the surface of the core particles with the highly conductive metal is not particularly limited, and for example, an electroless plating method can be used.

[0185] The magnetic conductive particles preferably have a coefficient of variation of the number average particle diameter of 50% or less, more preferably 40% or less, still more preferably 30% or less, and particularly preferably 20

% Or less.

 [0186] Here, the "coefficient of variation of the number average particle size" is the formula: (σ ZDn) X 100 (where σ is the value of the standard deviation of the particle size, and Dn is the number average particle size) It indicates the diameter.

 [0187] When the coefficient of variation of the number average particle diameter of the magnetic conductive particles is 50% or less, the degree of unevenness of the particle diameter is reduced, so that the partial conductivity of the obtained anisotropic conductive sheet is reduced. Variations can be reduced.

[0188] Such magnetic conductive particles can be obtained by making a metal material into particles by a conventional method, or preparing commercially available metal particles and classifying the particles.

[0189] The particle classification treatment can be performed by, for example, a classification device such as an air classification device or a sonic sieving device.

[0190] Further, the specific conditions of the classification treatment are the number average particle diameter of the target conductive metal particles, It is set as appropriate according to the type of classification device.

 [0191] The specific shape of the magnetic conductive particles is not particularly limited. The shape is a force, a secondary particle force formed by integrally connecting a plurality of spherical primary particles. Are preferred and can be mentioned as shaped particles.

 [0192] Composite particles in which the surface of the core particles is coated with a highly conductive metal as magnetic conductive particles

 (Hereinafter also referred to as “conductive composite metal particles”), from the viewpoint of obtaining good conductivity, the coverage of the highly conductive metal on the surface of the conductive composite metal particles (core particles) The ratio of the coating area of the highly conductive metal to the surface area of the metal is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

 [0193] The coating amount of the highly conductive metal is preferably 2.5 to 50% by mass, more preferably 3 to 45% by mass, and still more preferably 3.5 to 40% by weight of the core particles. % By mass, particularly preferably 5 to 30% by mass.

 [0194] Such an anisotropic conductive sheet in which a large number of conductive particles 62 are dispersed in the surface direction and arranged in the thickness direction in the insulating elastic polymer material is disclosed in, for example, As shown in Japanese Laid-Open Patent Publication No. 20 03-77560, a fluid molding material is prepared in which conductive particles exhibiting magnetism are contained in a polymer material that is cured to become an elastic polymer material. A molding material layer made of a molding material is formed between one side molding member in contact with one side of the molding material layer and another side molding member in contact with the other side of the molding material layer. On the other hand, it can be produced by a method of applying a magnetic field in the thickness direction and curing the molding material layer.

 [0195] As shown in Fig. 6, the second anisotropic conductive sheet 26 arranged on the side of the relay pin unit 31 of the pitch conversion substrate 23 has a large number of conductive layers in the insulating elastic polymer material. The conductive path forming section 72 is formed by arranging the conductive particles 62 in the thickness direction, and the insulating section 71 separates the conductive path forming sections 72. As described above, the conductive particles 62 are nonuniformly dispersed in the plane direction only in the conductive path forming portion 72.

 [0196] The thickness W of the conductive path forming portion 72 is preferably 0.1 to 2 mm, more preferably 0.2 to

 2

 1. 5mm. When this thickness W is less than 0.1 mm,

 2

When the absorption capacity is low, the absorption of the applied pressure by the inspection jig is reduced, and the circuit The effect of reducing the impact on the board-side connector 21 is reduced. For this reason, the deterioration of the first anisotropic conductive sheet 22 is suppressed, and as a result, the number of replacements of the first anisotropic conductive sheet 22 during repeated inspection of the circuit board 1 to be inspected is increased! ] And the inspection efficiency is reduced. On the other hand, if this thickness exceeds W force S2mm, the electrical resistance in the thickness direction increases.

 2

 It is easy to make electrical inspection difficult.

[0197] The thickness of the insulating portion 71 is preferably substantially the same as the thickness of the conductive path forming portion 72, and smaller than that. As shown in FIG. 6, the thickness of the insulating portion 71 is made smaller than the thickness of the conductive path forming portion 72 so that the conductive path forming portion 72 forms a protruding portion 73 protruding from the insulating portion 71. Because the deformation of the conductive path forming part 72 becomes easier and the absorption capacity of the applied pressure is increased due to the pressure in the direction, the applied pressure of the inspection jig is absorbed at the time of inspection, and ₂丄 is supplied to the circuit board side connector. Can reduce the impact.

[0198] When magnetic conductive particles are used as the conductive particles 62 constituting the second anisotropic conductive sheet 26, the number average particle diameter thereof is preferably 5 to 200 μm, more preferably 5 to 150. μm, more preferably 10: LOO / zm. Here, the “number average particle diameter of the magnetic conductive particles” means that measured by a laser diffraction scattering method. When the number average particle diameter of the magnetic conductive particles is 5 μm or more, the pressure deformation of the conductive path forming portion of the anisotropic conductive sheet becomes easy. Further, when the magnetic conductive particles are oriented by a magnetic field orientation process in the manufacturing process, the magnetic conductive particles are easily oriented. When the number average particle diameter of the magnetic conductive particles is 200 m or less, the elasticity of the conductive path forming portion 72 of the anisotropic conductive sheet is good and pressure deformation is easy.

 [0199] The thickness W m) of the conductive path forming portion 72 and the number average particle diameter D (μm) of the magnetic conductive particles

 The ratio W ZD to 2 2 is preferably 1.1 to 10.

 twenty two

 [0200] When the ratio W ZD is less than 1.1, the magnetic conduction with respect to the thickness of the conductive path forming part 72

 twenty two

Since the diameter of the conductive particles is equal to or larger than that, the elasticity of the conductive path forming portion 72 is lowered, and the ability to absorb the applied pressure in the thickness direction is reduced. In order to suppress the deterioration of the first anisotropic conductive sheet 22, the absorption of the pressurizing pressure of the inspection tool at the time of inspection is reduced and the effect of reducing the impact on the circuit board connector 21 is reduced. As a result, the first anisotropic conductive sheet 22 is replaced during the repeated inspection of the circuit board 1 to be inspected. As the number of times increases, inspection efficiency tends to decrease.

[0201] On the other hand, when the ratio W ZD exceeds 10, a large number of conductive particles are present in the conductive path forming portion 72.

 twenty two

 As a result of the arrangement, a chain is formed, and there are a large number of contacts between the conductive particles, so that the electrical resistance value tends to be high.

 [0202] The elastic polymer (elastomer) that is the base material of the conductive path forming portion 72 preferably has a durometer hardness of 15 to 60, more preferably 20 to 50, as measured by its type A durometer. More preferably, it is 25-45.

 [0203] When the durometer hardness of the elastic polymer is less than 15, the sheet is deformed at an early stage due to large permanent distortion that causes large compression and deformation of the sheet when pressed in the thickness direction. The electrical connection is likely to be difficult. If the durometer hardness of the elastic polymer is greater than 60, the deformation force when pressed in the thickness direction becomes small, so the ability to absorb pressure in the thickness direction becomes small. As a result, the deterioration of the first anisotropic conductive sheet 22 is suppressed, and as a result, the number of replacements of the first anisotropic conductive sheet 22 is increased during the repeated inspection of the circuit board 1 to be inspected. !] And inspection efficiency is likely to decrease.

 [0204] The elastic polymer serving as the base material of the conductive path forming portion 72 is not particularly limited as long as it exhibits the durometer hardness described above, but silicone rubber may be used from the viewpoint of workability and electrical characteristics. preferable.

 [0205] The insulating portion 71 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles. As the insulating material, for example, an insulating polymer material, an inorganic material, a metal material whose surface is insulated, etc. can be used, but the same material as the elastic polymer used for the conductive path forming portion is used. When used, production is easy. When an elastic polymer is used as the material for the insulating portion, it is preferable to use a material having a durometer hardness in the above range.

 [0206] As the magnetic conductive particles, the conductive particles used in the first anisotropic conductive sheet described above can be used.

 [0207] The second anisotropic conductive sheet 26 of the present invention can be manufactured as follows.

[0208] For example, the overall shape is substantially a flat plate shape, each of which includes an upper mold and a lower mold that correspond to each other, and a magnetic field is applied to the material layer filled in the molding space between the upper mold and the lower mold. Let it work Then, an anisotropic conductive sheet molding die having a configuration capable of heat-curing the material layer is prepared.

 [0209] This anisotropic conductive sheet-molding die is formed by applying a magnetic field to the material layer to form a conductive part at an appropriate position. On a substrate made of a ferromagnetic material such as nickel, a ferromagnetic material portion made of iron, nickel or the like for generating an intensity distribution in the magnetic field in the mold, and a non-magnetic metal such as copper or non-coating made of resin. The magnetic material portion has a mosaic layer alternately arranged so as to be adjacent to each other, and the ferromagnetic material portion is arranged according to a pattern corresponding to the pattern of the conductive path forming portion to be formed. Has been.

 [0210] Here, the molding surface of the upper mold is flat, and the molding surface of the lower mold has a slight unevenness corresponding to the conductive path forming portion of the anisotropic conductive sheet to be formed.

 [0211] Then, the anisotropic conductive sheet is manufactured as follows using the anisotropic conductive sheet molding die.

 [0212] First, a molding material in which conductive particles exhibiting magnetism are contained in a polymer material that is cured to become an elastic polymer material is formed in a molding space of an anisotropic conductive sheet molding die. The molding material layer is formed by pouring.

 [0213] Next, using the ferromagnetic part and the non-magnetic part in each of the upper mold and the lower mold, a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer. Due to the action of the magnetic force, the conductive particles are aggregated between the ferromagnetic part in the upper mold and the ferromagnetic part in the lower mold located immediately below it, and the conductive particles are further thickened. Orient to align in the direction. Then, by curing the molding material layer in this state, an anisotropic conductive sheet having a configuration in which a plurality of columnar conductive path forming portions are isolated from each other by an insulating portion is manufactured.

[0214] On the other hand, as shown in Fig. 1, the tester side connectors 41a and 41b include third anisotropic conductive single terminals 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b. /! The third anisotropic conductive sheets 42a and 42b are the same as the second anisotropic conductive sheet 26 described above, and many of them are in an insulating elastic polymer material as shown in FIG. The conductive path forming portions formed by arranging the conductive particles in the thickness direction are separated from each conductive path forming portion. It is composed of an insulating part.

 [0215] The connector substrates 43a and 43b are made of an insulating substrate, and pin-side electrodes 45a and 45b are formed on the surface of the connector pins 43a and 43b, as shown in FIGS.

 [0216] As shown in Fig. 8, these pin-side electrodes 45 are separately connected to the connection electrodes 25 of the pitch conversion substrate 23, that is, the current terminal electrodes 27 and the voltage terminal electrodes 28, respectively. Each pin is composed of a current pin side electrode 47 and a voltage pin side electrode 48 so as to be electrically connected, and is arranged at a position corresponding to a conductive pin 32 of a relay pin unit 31 described later.

 [0217] In this case, these pin-side electrodes 45 have a constant pitch, for example, 2.54 mm, 1.8 mm, 1.2 / mm, 1. Oomm, 0.8 mm, 0.5 mm, 0.5 mm, 0 45mm, 0.dmm or 7 ί or 0

It is arranged on grid points with a constant pitch of 2 mm, and the arrangement pitch is the same as the arrangement pitch of the conductive pins 32 of the relay pin 31.

[0218] Each pin-side electrode 45 is electrically connected to the tester-side electrodes 44a, 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.

 [0219] In this embodiment, the pin side electrode 45 has a pin-shaped force. This shape is not limited to the pin shape, and various modifications such as a flat electrode are possible.

[0220] As shown in FIGS. 1 and 2, the relay pin unit 31 includes a large number of conductive pins 32a and 32b provided in parallel at a predetermined pitch so as to face in the vertical direction. Further, the relay pin 31 is provided on both ends of the conductive pins 32a and 32b, and is provided with insulating plates 34a and 34b disposed on the circuit board 1 side to be inspected to support the conductive pins 32a and 32b. It is provided with two (a pair of) insulating plates 34a and 34b arranged on the opposite side of the circuit board 1 to be inspected!

 [0221] For example, as shown in FIG. 9, the conductive pin 32 also has a force with a central portion 82 having a large diameter and end portions 8 la and 8 lb having a smaller diameter.

[0222] The pair of insulating plates 34a and 34b are formed with through holes 83 into which the end portions 81 of the conductive pins 32 are inserted. The diameter of the through hole 83 is formed larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby preventing the conductive pin 32 from falling off. It is held as it is.

 [0223] The two insulating plates 34 are fixed by the support pins 33a and 33b so that the distance between them is longer than the length of the central portion 82 of the conductive pin 32, so that the conductive pin 32 can move up and down. Is held in.

 [0224] The length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plate 34, whereby the conductive pin 32 protrudes from at least one of the insulating plates 34. Yes.

 [0225] The relay pin unit has a large number of conductive pin forces at a constant pitch, for example, 2.54mm, 1.8mm, 1.27mm, 1.06mm, 0.8mm, 0 / 5mm, 0.5mm, 0.45mm. 0.3 mm to 7 mm are arranged on grid points with a pitch of 0.2 mm.

 [0226] By making the arrangement pitch of the conductive pins 32 of the relay pin unit 31 the same as the arrangement pitch of the terminal electrodes 24 provided on the pitch conversion board 23, the pitch conversion board via the conductive pins 32 is provided. 23 is electrically connected to the tester side.

 [0227] The distance between the two insulating plates 34 is not particularly limited, but is desirably 20 mm or more, preferably 40 mm or more.

[0228] Specifically, as the material of the insulating plate 34, an insulating material having a specific resistance of 1 X 10 ¹⁰ Ω 'cm or more, such as polyimide resin, polyester resin, polyamide resin, phenol resin, polyimide resin, and the like. Setar resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic 'polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether-tolyl resin, polyether High mechanical strength resin materials such as sulfone resin, polyarylate resin, polyamideimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyester resin , Glass fiber reinforced phenolic resin, glass fiber reinforced fluorocarbon resin, etc. Type epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluorine resin, etc., carbon fiber type composite resin, epoxy resin, A composite resin material in which an inorganic material such as silica, alumina, or boron nitride is filled in phenol resin, an epoxy resin, a composite resin material containing a mesh in phenol resin, or the like is used. Also, a composite board constructed by laminating a plurality of plates made of these materials Materials can be used.

 [0229] The thickness of each of the insulating plates 34 is appropriately selected according to the type of material constituting the insulating plate 34, and is preferably 1 to: LOmm, for example.

 [0230] Specifically, the insulating plate 34 is made of glass fiber reinforced epoxy resin and has a thickness of 2 to 5 mm.

 In the inspection apparatus 10 configured as described above, as shown in FIG. 2, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, and the pitch conversion. Circuit board 23a, 23 b, second anisotropic conductive sheet 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheet 42a, 42b, connector board 43a, 43b The base plates 46a and 46b thus pressed are electrically connected to a tester (not shown) by pressing them with a specified pressure by a tester pressurizing mechanism, and electrical resistance such as electrical resistance measurement between the electrodes of the circuit board 1 to be inspected. Inspection is performed.

 [0232] The pressure pressed from the upper and lower first inspection jigs 11a and the second inspection jig l ib with respect to the substrate to be inspected during measurement is, for example, 100 to 250 kgf.

 In this case, as shown in FIG. 8, one of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected is interposed via the first anisotropic conductive sheet 22. The pair of current terminal electrodes 27 and the voltage terminal electrodes 28 on the test circuit board 1 side of the pitch conversion board 23 are electrically connected.

 [0234] From the pair of current terminal electrode 27 and voltage terminal electrode 28 on the circuit board 1 side of the pitch conversion board 23, the terminal on the opposite side of the circuit board 1 to be inspected 1 of the pitch conversion board 23 The current terminal electrode 27 of the pitch conversion board 23 is connected to the connector via the electrode 24, the second anisotropic conductive sheet 26, the conductive pin 32 of the relay pin unit 31, and the third anisotropic conductive sheet 42. It is electrically connected to the current pin side electrode 47 of one substrate 43, and the voltage terminal electrode 28 of the pitch conversion substrate 23 is electrically connected to the voltage terminal electrode 48 of the connector substrate 43. Become.

Thus, as shown in FIG. 8, for each of the electrodes to be inspected 2 and 3 of the circuit board 1 to be inspected, the current terminal electrode 27a of the upper and lower pitch conversion substrates 23a and 23b, The current measurement path I is configured via 27b, while each circuit board 1 to be inspected is inspected. The voltage measurement path V is configured through the voltage terminal electrodes 28a and 28b of the upper and lower pitch conversion substrates 2 and 3 with respect to the saddle electrodes 2 and 3, respectively.

 [0236] Therefore, the voltage measurement path V is connected to the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected via the voltage terminal electrodes 28a and 28b of the upper and lower pitch conversion substrates 23a and 23b. The voltage is applied to the circuit board 1 to be inspected by the current measurement path I through the current terminal electrodes 27a and 27b of the one pitch conversion board 23 on the upper and lower sides. On the other hand, it is possible to perform a test for confirming the electrical characteristics as to whether or not the wiring pattern of the circuit board 1 to be inspected has a predetermined performance by measuring the current.

 [0237] On the contrary, for each of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected, the current measurement path I passes through the current terminal electrodes 27a and 27b of the upper and lower pitch conversion substrates 23a and 23b. While supplying current to each of the electrodes to be inspected 2 and 3 of the circuit board 1 to be inspected by the voltage measuring path V through the voltage terminal electrodes 28a and 28b of the upper and lower pitch conversion substrates 23a and 23b. On the other hand, it is possible to perform a confirmation test of electrical characteristics as to whether or not the wiring pattern of the circuit board 1 to be inspected has a predetermined performance by measuring the voltage.

 [0238] In this way, the voltage and current can be separately measured via the separate voltage measurement path V and current measurement path I for each of the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected. As a result, it is possible to perform an accurate confirmation test on the electrical characteristics of whether or not the wiring pattern of the inspection circuit board has a predetermined performance, and the time required for the confirmation test can be shortened. Can be implemented.

 [0239] Further, since the voltage can be measured while supplying current to the circuit to be inspected on the circuit board 1 to be inspected, the set voltage is lower than the set voltage for determining whether the conduction resistance value is good or not in the conventional inspection apparatus. Thus, stable measurement of the conduction resistance value of the circuit under test on the circuit board 1 under test becomes possible.

 [0240] That is, as a requirement for high-precision inspection, the power required to judge the quality of a circuit at a low set voltage According to the present invention, there is a potential electrical defect that is higher than that of a conventional inspection apparatus. Since the inspection circuit board can be judged and removed as a defective product with high probability, it is possible to carry out a highly reliable circuit board confirmation test.

[0241] It should be noted that one pitch change is made for each of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected For example, a constant voltage device is used to apply a constant voltage to the voltage measurement path V via the voltage terminal electrodes 28a and 28b of the circuit boards 23a and 23b. Circuit board 1 to be inspected by measuring the current from each of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected by the ammeter through the current supply path I through the current terminal electrodes 27a and 27b of Depending on whether or not the wiring pattern has a predetermined performance, a test for confirming the electrical characteristics can be performed.

[0242] By the way, as described in the section of the prior art above, in the conventional inspection jigs as shown in FIGS. 33 to 35, the tester side connectors 141a and 141b in the upper and lower sides respectively For example, when the number of electrodes on the tester side electrode of the connector is 6000, the number of electrodes of the electrode to be inspected 102 on the upper side of the circuit board 101 to be inspected and the number of electrodes 103 to be inspected on the lower side of the circuit board 101 to be inspected In the relationship, if the following pattern occurs, it may be difficult to execute the inspection. That is,

 (Tester side)

 Number of electrodes on upper tester side connector 141a = 6000 points

 Lower tester side connector 14 lb electrode count = 6000 points

 (Inspected circuit board side)

 Number of electrodes of upper electrode 102 to be inspected = 8000 points

 Number of electrodes 103 in the lower electrode to be inspected = 4000 points

 That is, when the number of electrodes of the tester side electrode 144a of the upper tester side connector 141a is 6000 and the number of electrodes of the tester side electrode 144b of the lower tester side connector 141b is 6000, If the electrode force of the electrode to be inspected 102 above 101 is 8000 points and the electrode force of the electrode to be inspected 103 below circuit board 101 is 4000 points, it may be difficult to perform the inspection. there were.

 That is, the electrode force of the tester side electrode 144a of the upper tester side connector 141a corresponding to the upper electrode 102 to be inspected is 6000 points 8000 points = 2000 point forces S shortage.

[0244] However, in this state, the electrode force of the tester side electrode 144b of the lower tester side connector 141b corresponding to the lower test target electrode 103 of the circuit board 101 to be inspected 600 0 points One 4000 points = + 2000 points remain as surplus! [0245] Therefore, the present inventors, as described above, have left the electrical connection circuit for the upper electrode 102 to be inspected, in which 2000 points are insufficient, and the lower tester side connector 1 41b with 2000 points remaining as surplus. It has been found that inspection can be made possible even in the above case by bypassing to the tester side electrode 144b.

 Therefore, in the present invention, as shown in FIG. 1, an inspection is performed between the connector board 43 3a of the first inspection jig 11a and the connector board 43b of the second inspection jig l ib. Auxiliary connection circuit unit 200 is provided separately from the connection circuit units 56a and 56b.

 [0247] The auxiliary connection circuit unit 200 includes a first auxiliary relay pin unit 231a. The first auxiliary relay pin unit 231a includes a plurality of conductive pins 232a arranged at a predetermined pitch, It is composed of a pair of spaced apart insulating plates 234a that support the conductive pins 232a.

 [0248] The auxiliary connection circuit unit 200 includes a second auxiliary relay pin unit 23 lb. The second auxiliary relay pin unit 23 lb includes a plurality of conductive pins arranged at a predetermined pitch. 232b and a pair of spaced apart insulating plates 234b that support the conductive pins 232b.

 [0249] Furthermore, the auxiliary connection circuit unit 200 includes a first auxiliary relay pin unit 231a and a second auxiliary relay pin unit 231a.

 The auxiliary relay pin unit 231b is provided with an auxiliary anisotropic conductive sheet 222 that is electrically connected to each other.

 [0250] In this case, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b have the same configuration as the relay pin unit 31 described above, and can also have the same material force.

 [0251] That is, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b are provided in parallel at a predetermined pitch so as to face in the vertical direction as shown in FIGS. A large number of conductive pins 232a and 232b are provided.

[0252] The relay pin unit 231 is provided on both ends of the conductive pins 232a and 232b, and is provided with insulating plates 234a, 234b and two (a pair of) insulating plates 234a and 234b disposed on the opposite side of the circuit board 1 to be inspected! Similarly to the conductive pin 32 shown in FIG. 9, the conductive pin 232 includes a central portion 82 having a large diameter and end portions 8 la and 8 lb having a smaller diameter.

 [0254] Through holes 83 into which end portions 81 of the conductive pins 232 are inserted are formed in the pair of insulating plates 234a and 234b. The diameter of the through hole 83 is formed larger than the diameter of the end portion 81 of the conductive pin 32 and smaller than the diameter of the central portion 82, so that the conductive pin 232 does not fall off. !

 [0255] The two insulating plates 234 are fixed by the support pins 233a and 233b so that the distance between them is longer than the length of the central portion 82 of the conductive pin 232, so that the conductive pin 232 can be moved up and down. Is held in.

 Further, the auxiliary anisotropic conductive sheet 222 is an anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, like the first anisotropic conductive sheet 22. In addition, similar to the second anisotropic conductive sheet 22 and the third second anisotropic conductive sheet 42, a plurality of conductive path forming portions extending in the thickness direction, It is composed of an insulating part that insulates the path forming part from each other, and the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are unevenly dispersed in the surface direction, and are formed on both sides of the sheet. Although the conductive path forming portion protrudes and has a configuration, deviation can be used.

 In FIG. 1 and FIG. 2, for convenience of explanation, the auxiliary anisotropic conductive sheet 222 includes a plurality of conductive path forming portions extending in the thickness direction and insulating portions that insulate these conductive path forming portions from each other. The conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are unevenly dispersed in the surface direction, and the conductive path forming portions protrude on both sides of the sheet. Show what the configuration is.

[0258] With this configuration, as shown in FIG. 2, in the inspection apparatus 10, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a, 22b, Pitch conversion boards 23a, 23b, second anisotropic conductive sheet 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheet 42a, 42b, connector boards 43a, 43b, outermost By pressing the base plates 46a and 46b arranged at a predetermined pressure by the pressurizing mechanism of the tester, the electrical resistance between the electrodes of the circuit board 1 to be inspected is electrically connected to the tester (not shown). Electrical tests such as measurements are performed (see arrow A and arrow B in Figure 2). [0259] When the number of electrodes of one of the tester side connectors is insufficient due to the auxiliary connection circuit unit 200, the test connection circuit units 56a and 56b are bypassed via the auxiliary connection circuit unit 200. Then, electrical connection is made from one tester side connector to the electrode of the other tester side connector (see arrow C in FIG. 2).

 That is, as shown in FIG. 2, for example, the number of electrodes to be inspected on one surface of the circuit board 1 to be inspected, in this embodiment, the number of electrodes (8000 points) of the upper inspected electrode 2 is 8,000. The number of electrodes to be inspected on the other surface of the inspection circuit board 1, which in this embodiment is larger than the number of electrodes (6000 points) of the lower inspection electrode 3 (6000 points) 6000 points).

 [0261] As a result, the number of tester side electrodes 44a of the tester side connector 41a of one tester side connector, in this embodiment, the tester side connector 41a of the first inspection jig 11a is insufficient (8000—60 00 = 2000 points). Foot

 [0262] In this case, the first auxiliary relay pin unit 231a disposed between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 1lb As shown by the arrow C in FIG. 2, the connection circuit for inspection is connected through the auxiliary connection circuit unit 200 having the second auxiliary relay pin unit 231b and the auxiliary anisotropic conductive sheet 222. It is configured to bypass 56a and 56b.

 [0263] That is, one of the tester side connectors, in this embodiment, from the tester side connector 41a of the first inspection jig 11a so as to bypass the inspection connection circuit units 56a and 56b, the first auxiliary relay pin Through the unit 231a, the auxiliary anisotropic conductive sheet 222, the second auxiliary relay pin unit 23 lb, the other tester side connector, in this embodiment, the tester side connector 41b of the second inspection jig l ib It can be electrically connected to the tester-side electrode 44a, and the circuit board under test can be electrically inspected! /

[0264] It should be noted that, in this example, the force described for one tester side connector, in this example, the number of electrodes of the tester side electrode 44a of the tester side connector 41a of the first inspection jig 11a is insufficient. Second inspection jig l ib tester side connector 41b tester side electrode When the number of electrodes on 44b is insufficient, auxiliary connection as shown by arrow D in Fig. 2 Via the circuit unit 200, the test connection circuit units 56a and 56b are bypassed and electrically connected to the tester-side electrode 44a of the tester-side connector 41a of the first inspection jig 11a.

FIG. 10 is a cross-sectional view for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 11 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 10 is used for inspection.

The inspection apparatus 10 of this embodiment has basically the same configuration as shown in FIG. 1, and the same reference numerals are assigned to the same structural members, and detailed description thereof is omitted.

In the inspection apparatus 10 of this embodiment, as shown in FIGS. 10 and 11, the relay pin unit 31 is disposed between the first insulating plates 34a and 34b and the second insulating plates 35a and 35b. Intermediate holding plates 36a and 36b are arranged.

 [0268] Then, between the first insulating plates 34a, 34b and the intermediate holding plates 36a, 36b, the first support pins 33a, 33b are arranged, whereby the first insulating plates 34a , 34b and intermediate holding plates 36a, 36b are fixed.

 [0269] Similarly, second support pins 37a and 37b are arranged between the second insulating plates 35a and 35b and the intermediate holding plates 36a and 36b, whereby the second insulating plate The space between 35a, 35b and the intermediate holding plates 36a, 36b is fixed.

 [0270] In this case, the material of the first support pin 33 and the second support pin 37 is not particularly limited, and is made of metal such as brass or stainless steel.

 [0271] The distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 are not particularly limited. However, as will be described later, due to the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, the absorbability of height variation of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected In view of the above, it is desirable that the thickness is 2 mm or more, preferably 2.5 mm or more.

 [0272] Then, as shown in FIG. 11, the first abutment support position 38A of the first support pin 33 with the intermediate holding plate 36 and the intermediate holding plate 36 of the second support pin 37 The second abutting support position 38B is different from the second abutting support position 38B on the intermediate holding plate projection surface A obtained by projecting the inspection apparatus 10 in the thickness direction of the intermediate holding plate (from the upper side to the lower side in FIG. 10). Arranged! RU

[0273] In this case, the different positions are not particularly limited, but the first contact support position. As shown in FIG. 12, the device 38A and the second contact support position 38B are preferably formed on the grid on the intermediate holding plate projection surface A.

 [0274] Specifically, as shown in FIG. 12, on the intermediate holding plate projection surface A, one of the four adjacent first contact support positions 38A has one unit lattice region R1 having a group force. A second contact support position 38B is disposed. Further, on the intermediate holding plate projection surface A, one first abutment support position 38A is arranged in a unit lattice region R2 composed of four adjacent second abutment support position groups 38B. Has been. In FIG. 12, the first contact support position 38A is indicated by a black circle, and the second contact support position group 38B is indicated by a white circle.

 [0275] In this case, in this embodiment, one second abutment support position 38B is arranged at the center of the diagonal Q1 of the unit lattice region R1 of the first abutment support position 38A, and One first abutment support position 38A is arranged in the center of the diagonal Q2 of the unit cell region R2 at the second contact support position 38B. However, these relative positions are not particularly limited, and as described above, different positions on the intermediate holding plate projection surface A obtained by projecting the inspection apparatus 10 in the thickness direction of the intermediate holding plate. It suffices if they are arranged. That is, when not arranged in a grid pattern, the inspection apparatus 10 is projected on the intermediate holding plate projection surface A as projected in the thickness direction of the intermediate holding plate, as described above. If it is placed in a different position! /.

 [0276] In this case, the separation distance between the first contact support positions 38A adjacent to each other and the separation distance between the second contact support positions 38B are not particularly limited. More preferably, it is 12 to 70 mm, and particularly preferably 15 to 50 mm.

 [0277] As the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, those having flexibility are used.

 The degree of flexibility required for the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is as follows.

[0279] When both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are horizontally arranged with a distance of 10 cm between them, a pressure of 50 kgf from above is applied. It is less than 0.02% of the width of these insulating plates and It is preferable that neither destruction nor permanent deformation occurs even by pressurizing at a pressure of 200 kgf.

[0280] Specifically, the first insulating plate 34, the intermediate holding plate 36, as the material of the second insulating plate 35, unique resistance 1 X 1Ο ¹⁰ Ω 'cm or more insulating materials, such as polyimide榭Fat, polyester resin, polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic 'polystyrene resin, poly-lene sulfide resin, polyetherethyl Ketone resin, fluorine resin, polyether nitrile resin, polyethersulfone resin, polyarylate resin, polyamideimide resin, and other high mechanical strength resin materials, glass fiber reinforced epoxy resin, Glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenol resin, glass fiber reinforced fluorine resin, etc. Fiber type composite resin material, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenol resin, carbon fiber reinforced fluorine resin, etc. Carbon fiber type composite resin, epoxy resin, phenol resin, etc. filled with inorganic materials such as silica, alumina, pollon nitride, etc., composite containing epoxy resin, phenol resin, etc. with mesh A resin material or the like is used. Further, a composite plate material formed by laminating a plurality of plate materials having such material strength can be used.

[0281] The thickness of each of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 is the same as the thickness of the material constituting the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Force appropriately selected according to the type For example, 1 to: LOmm is desirable.

[0282] Specifically, the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are made of glass fiber reinforced epoxy resin and have a thickness of 2 to 5 mm. .

In the inspection apparatus 10 configured as described above, as shown in FIG. 11, the electrode 2 and the electrode 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a and 22b, and for pitch conversion. Boards 23a, 23b, second anisotropic conductive sheets 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheets 42a, 42b, connector boards 43a, 43b, arranged on the outermost side The measured base plates 46a and 46b are electrically connected to a tester (not shown) by pressing them with a tester's pressurizing mechanism, and the electrical resistance between the electrodes of the circuit board 1 to be inspected is measured. Electrical inspection is performed.

 [0284] The pressure pressed from the upper and lower first inspection jigs 11a and the second inspection jig l ib with respect to the substrate to be inspected at the time of measurement is, for example, 100 to 250 kgf.

 In this case, as shown in FIG. 15, electrical inspection is performed by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig l ib. In the initial stage of pressurization, the conductive pin 32 of the relay pin unit 31 is compressed, the first anisotropic conductive sheet 22, the second anisotropic conductive sheet 26, and the third The anisotropic elastic sheet 42 absorbs pressure by rubber elastic compression, and absorbs to some extent the height variation of the inspected electrode of the circuit board 1 to be inspected.

 [0286] Then, the first contact support position with the intermediate support plate of the first support pin and the second contact support position with the intermediate support plate of the second support pin are the intermediate support plate. As shown by the arrows in Fig. 16, the force acts in the vertical direction as shown in Fig. 17 because the intermediate holding plate projection surface projected in the thickness direction of 1st inspection tool 11a and 2nd

 When the circuit board 1 to be inspected is further pressed between the inspection jigs l ib, the first anisotropic conductive sheet 22, the second anisotropic conductive sheet 26, and the third In addition to the rubber elastic compression of the anisotropic conductive sheet 42, the first insulating plate 34, the second insulating plate 35, the first insulating plate 34 and the second insulating plate 35 of the relay pin unit 31 Due to the spring property of the intermediate holding plate 36 disposed between, the pressure concentration is dispersed with respect to the height variation of the inspected electrode of the circuit board 1 to be inspected, for example, the height variation of the solder ball electrode, It avoids local stress concentration.

That is, as shown in FIGS. 16 and 17, the intermediate holding plate 36 has the second support plate 33 centered on the first contact support position 38A with the intermediate holding plate 36, and the second holding plate 36 Hold in the direction of the insulating plate 35 (refer to the part E surrounded by the one-dot chain line in FIG. 17), and hold the second support pin 37 in the middle, centering on the second contact support position 38B with the plate 36 The plate 36 is sandwiched in the direction of the first insulating plate 34 (see the portion D surrounded by the one-dot chain line in FIG. 17). In the following description, “squeeze” and “stagnation direction” refer to squeezing so that the intermediate holding plate 36 protrudes in a convex direction and the protruding direction. [0288] In this way, since the intermediate holding plate 36 is sandwiched in opposite directions around the first contact support position 38A and the second contact support position 38B, the first inspection jig When the circuit board 1 to be inspected is further pressurized between 11a and the second inspection jig l ib, the panel elastic force of the intermediate holding plate 36 is further exerted.

 [0289] Also, as indicated by the portion B surrounded by the alternate long and short dash line in FIG. 17, the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion of the second anisotropic conductive sheet 26. However, the pressure force that cannot be absorbed by the compression of this protrusion is applied to the first insulating plate 34b.

[0290] Accordingly, as shown by the portion C surrounded by the alternate long and short dash line in FIG. 17, the first insulating plate 34 and the second insulating plate 35 are also, to some extent, the first support pin 33 and the second insulating plate 35, respectively. 2 is pinched in opposite directions at the contact position with the support pin 37, so that the circuit board 1 to be inspected is to be inspected between the first inspection jig 11a and the second inspection jig l ib. When the pressure is further increased, the panel elastic force of the first insulating plate 34 and the second insulating plate 35 is further exerted.

 As a result, stable electrical contact is secured to each of the electrodes to be inspected of the circuit board 1 to be inspected having variations in height, and the stress concentration is further reduced, so that the anisotropic conductive sheet Local damage is suppressed. As a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of replacements of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.

 [0292] Also in this embodiment, as shown in FIG. 10, between the connector one substrate 43a of the first inspection jig 11a and the connector substrate 43b of the second inspection jig l ib, In addition to the inspection connection circuit units 56a and 56b, an auxiliary connection circuit unit 200 is provided.

 The auxiliary connection circuit unit 200 includes a first auxiliary relay pin unit 231a. The first auxiliary relay pin unit 231a includes a plurality of conductive pins 232a arranged at a predetermined pitch, It is composed of a pair of spaced apart insulating plates 234a that support the conductive pins 232a.

[0294] The auxiliary connection circuit unit 200 includes a second auxiliary relay pin unit 23 lb. The second auxiliary relay pin unit 23 lb includes a plurality of conductive pins arranged at a predetermined pitch. 232b and a pair of spaced apart insulating plates 234b that support the conductive pin 232b. It is.

 [0295] Furthermore, the auxiliary connection circuit unit 200 includes an auxiliary anisotropic conductive sheet 222 that electrically connects the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b to each other. Yes.

 [0296] In this case, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b have the same configuration as the relay pin unit 31 described above, and can also have the same material force.

 That is, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b are connected to the first insulating plates 234a and 234b in the same manner as the relay pin unit 31 shown in FIGS. The intermediate holding plates 236a and 236b are placed between the second insulating plates 235a and 235b.

 [0298] Then, the first support pins 233a and 233b are arranged between the first insulating plates 234a and 234b and the intermediate holding plates 236a and 236b, whereby the first insulating plates 234a, 234b and intermediate holding plates 236a and 236b are fixed.

 Similarly, second support pins 237a and 237b are arranged between the second insulating plates 235a and 235b and the intermediate holding plates 236a and 236b, and thereby the second insulating plate 235a. , 235b and the intermediate holding plate 236a, 236b are fixed.

 [0300] Then, similarly to the relay pin unit 31 shown in FIG. 11, the first contact support position 238A of the first support pin 233 with the intermediate holding plate 236 and the intermediate of the second support pin 237. The second abutting support position 238B with the holding plate 236 is an intermediate holding plate projection surface A obtained by projecting the inspection apparatus 10 in the thickness direction of the intermediate holding plate (directing downward from above in FIG. 10). They are located at different positions on the top.

 [0301] With this configuration, when performing electrical inspection by sandwiching both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig l ib In addition, at the initial stage of pressurization, the impact force can be absorbed to some extent by the movement of the relay pin unit 231 in the thickness direction by the conductive pins 232 and the auxiliary anisotropic conductive sheet 222.

[0302] Then, a first contact support position 238A of the first support pin 233 with respect to the intermediate holding plate 236, and a second contact support position 238B of the second support pin 237 with respect to the intermediate holding plate 236, In the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate 236, Has been placed.

 [0303] Therefore, when the circuit board 1 to be inspected is further pressed between the first inspection jig 11a and the second inspection jig l ib, the rubber of the auxiliary anisotropic conductive sheet 222 In addition to elastic compression, the first insulating plate 234, the second insulating plate 235, and the intermediate holding plate 236 disposed between the first insulating plate 234 and the second insulating plate 235 of the relay pin unit 231. Due to the elasticity of the panel, the concentration of pressure can be dispersed and local stress concentration can be avoided.

 [0304] This ensures stable electrical contact and further reduces stress concentration, so that local breakage of the auxiliary anisotropic conductive sheet 222 is suppressed. As a result, the durability of repeated use of the auxiliary anisotropic conductive sheet is improved, so that the number of replacements of the auxiliary anisotropic conductive sheet 222 is reduced, and the inspection work efficiency is improved.

 [0305] With this configuration, as shown in FIG. 11, in the inspection apparatus 10, the electrodes 2 and 3 of the circuit board 1 to be inspected are the first anisotropic conductive sheets 22a, 22b, Pitch conversion boards 23a, 23b, second anisotropic conductive sheet 26a, 26b, conductive pins 32a, 32b, third anisotropic conductive sheet 42a, 42b, connector boards 43a, 43b, outermost By pressing the base plates 46a and 46b arranged at a predetermined pressure by the pressurizing mechanism of the tester, the electrical resistance between the electrodes of the circuit board 1 to be inspected is electrically connected to the tester (not shown). Electrical tests such as measurements are performed (see arrow A and arrow B in Figure 11).

 [0306] When the number of electrodes of one of the tester-side connectors is insufficient due to the auxiliary connection circuit unit 200, the test connection circuit units 56a and 56b are bypassed via the auxiliary connection circuit unit 200. Then, electrical connection is made from one tester side connector to the electrode of the other tester side connector (see arrow C in FIG. 2).

 That is, as shown in FIG. 11, for example, the number of electrodes to be inspected on one surface of the circuit board 1 to be inspected, in this example, the number of electrodes (8000 points) of the upper inspected electrode 2 is 8000 Inspected electrodes on the other surface of the circuit board 1 to be inspected. In this embodiment, the number of electrodes to be inspected on the tester side connector is larger than the number of electrodes (6000 points) of the lower inspected electrode 3 (6000 points) ( 6000 points).

Thus, the number of tester side electrodes 44a of one tester side connector, that is, the tester side connector 41a of the first inspection jig 11a is insufficient in this embodiment (8000-60). 00 = 2000 points

 [0309] In this case, the first auxiliary relay pin unit 231a disposed between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig 1lb As shown by the arrow C in FIG. 11, the connection circuit unit for inspection is passed through the auxiliary connection circuit unit 200 having the second auxiliary relay pin unit 231b and the auxiliary anisotropic conductive sheet 222. It is configured to bypass 56a and 56b.

 [0310] That is, from the tester side connector, in this embodiment, to bypass the test connection circuit units 56a and 56b, in this embodiment, from the tester side connector 41a of the first test jig 11a, the first auxiliary relay pin Through the unit 231a, the auxiliary anisotropic conductive sheet 222, the second auxiliary relay pin unit 23 lb, the other tester side connector, in this embodiment, the tester side connector 41b of the second inspection jig l ib It can be electrically connected to the tester-side electrode 44a, and the circuit board under test can be electrically inspected! /

[0311] In this example, the force described for one tester side connector, in this example, the number of electrodes of the tester side electrode 44a of the tester side connector 41a of the first inspection jig 11a is insufficient. Second test jig l ib tester side connector 41b tester side electrode When the number of electrodes 44b is insufficient, as shown by arrow D in Fig. 11, the auxiliary connection circuit unit 200 is used for inspection. It bypasses the connection circuit units 56a and 56b and is electrically connected to the tester side electrode 44a of the tester side connector 41a of the first detection jig 11a.

FIG. 18 is a sectional view similar to FIG. 10 for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 19 is an enlarged sectional view of the relay pin unit.

[0313] The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in Fig. 10, and the same reference numerals are assigned to the same components.

In the inspection apparatus 10 of this embodiment, as shown in FIGS. 18 and 19, the first insulating plate 34 and the first insulating plate 34

A plurality (three in this embodiment) of intermediate holding plates 36 are arranged between the two insulating plates 35 with a predetermined interval between them, and are held between these adjacent intermediate holding plates 36. The plate support pins 39 are arranged! [0315] In this case, the contact support position 39A of the holding plate support pin 39 with the intermediate holding plate 36 is between the adjacent intermediate holding plates 36, and the contact support position 39A is on the intermediate holding plate projection surface A. It is desirable to place them in different positions.

 [0316] Furthermore, although not shown, the second contact between the first abutting support position 38A of the first support pin 33 with the intermediate holding plate 36 and the intermediate holding plate 36 of the second support pin 37 is second. It is desirable that the abutting support position 38B of 2 and the abutting support position 39A of the holding plate support pin 39 with the intermediate holding plate 36 are arranged at different positions on the intermediate holding plate projection surface A. U ,.

 [0317] In this case, although not described in detail, the "different position" refers to the first contact support position 38A of the first support pin 33 with the intermediate holding plate 36, as in the above-described embodiment, An arrangement similar to the relative positional relationship described in relation to the relationship between the second holding pin 37 and the second holding support position 38B of the intermediate holding plate 36 can be made.

 [0318] With this configuration, the spring property is further exhibited by the plurality of intermediate holding plates 36, and with respect to the variation in the height of the electrode to be inspected of the circuit board 1 to be inspected, Dispersion of pressure concentration can further avoid local stress concentration, and local breakage of the anisotropic conductive sheet can be suppressed. As a result, the repeated use durability of the anisotropic conductive sheet can be reduced. As a result, the number of times of anisotropic conductive sheet replacement is reduced and inspection work efficiency is improved.

 [0319] In this case, the number of intermediate holding plates 36 is not particularly limited as long as it is plural.

 [0320] Although not shown, the first auxiliary relay pin unit 23 la and the second auxiliary relay pin unit 231b of the auxiliary connection circuit unit 200 are also the same as the relay pin unit 31 shown in Figs. Between the first insulating plate 234 and the second insulating plate 235, a plurality (three in this embodiment) of intermediate holding plates 236 are arranged at a predetermined interval, and these adjacent intermediate holding plates are arranged. A holding plate support pin 139 may be arranged between the holding plates 236.

[0321] FIG. 20 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 21 is the same as FIG. 2 showing the layered state during inspection use of the inspection apparatus of FIG. 22 is a partially enlarged view of the inside of the auxiliary relay board body 302, and FIG. 23 is a partial enlarged view showing an example of a connection state between the base end of the conductive pin and the wiring of the auxiliary relay board body. . [0322] The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in Fig. 1, and the same reference numerals are assigned to the same components.

 In the inspection apparatus 10 of this embodiment, the connection circuit units for inspection 56a, 56b are provided between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig l ib. Auxiliary connection circuit unit 200 that electrically connects from one tester side connector to the electrode of the tester connected to the other tester side connector is provided.

 That is, in the inspection apparatus 10 of this embodiment, as shown in the embodiment of FIG. 1, the connector board 43a of the first inspection jig 1 la and the connector board 43b of the second inspection jig l ib In the meantime, instead of the second auxiliary relay pin unit 2 3 lb disposed on the connector board 43b side of the second inspection jig l ib, the second inspection jig l ib is connected to the second side of the connector board 43b side. The auxiliary relay board device 300b is arranged!

 The second auxiliary relay board device 300b includes an auxiliary relay board body 302b as shown in FIGS. 20 and 21. Further, an urging device 304b for urging the auxiliary relay board body 302b toward the first auxiliary relay pin unit is provided.

 That is, the urging device 304b includes a lower frame 306b, a plurality of slide guide members 308b erected on the lower frame 306b, and between the auxiliary relay board 302b and the lower frame 306b. For example, it is composed of an elastic member 310b formed of a coil spring, for example. Thus, the auxiliary relay board body 302b is guided along the slide guide member 308b and urged toward the first auxiliary relay pin unit 231a by the urging force of the elastic member 310b.

 [0327] The elastic member 310b is not particularly limited as long as it urges the auxiliary relay board body 302b toward the first auxiliary relay pin unit 23la as described above. In addition to coil springs, dish panels and elastic rubber can be changed as appropriate.

 [0328] Although not shown, the slide guide member 308b is provided with a stopper member so as not to move upward beyond the upper limit position of the auxiliary relay substrate 302b.

Further, as shown in FIG. 22, the auxiliary relay substrate 302b is provided with an insulating substrate 312b and a base insulating substrate 314b inside, and formed on these insulating substrates 312b and 314b. In the implanted holes 316b and 318b, conductive pins 320b constituting the conductive portion are implanted. [0330] A retaining flange 322b is formed in the middle of the conductive pin 320b.

The retaining flange 322b is fitted into a retaining hole 324b formed in the insulating substrate 312b, so that the conductive pin 320b is prevented from falling off.

[0331] In this case, the number and arrangement positions of the conductive pins 320b are the same as the number and arrangement positions of the conductive pins 232a of the first auxiliary relay pin unit 231a! RU

[0332] Further, the material of the conductive pin 320b is not particularly limited as long as it has conductivity, but it also has the same material force as that of the conductive pin 232a of the first auxiliary relay pin unit 231a. Is desirable.

[0333] Then, the base end portion 326b of the conductive pin 320b is electrically connected to the electrode of a tester (not shown) connected to the second tester side connector 41b via the connection wiring 328b. It has become.

 [0334] The connection wiring 328b is not particularly limited. For example, an enameled wire in which the surface of a copper wire is covered with an insulating member can be used.

 [0335] Also, the method of connecting the base end portion 326b of the conductive pin 320b and the connection wiring 328b is, for example, as shown in FIG. 23, the connection opening 330b of the base end portion 326b of the conductive pin 320b. It is only necessary to electrically fix the inner portion of the wiring wiring 328b by crimping (crushing) 332b with one end of the connection wiring 328b inserted. However, the method of connecting the base end portion 326b of the conductive pin 320b and the connection wiring 328b is not limited to such a fixing method using a cash mechanism, and other connection methods such as welding are employed. There is no particular limitation.

With this configuration, the number of electrodes of the test electrode on one surface of the circuit board to be inspected is larger than the number of electrodes of the test electrode on the other surface of the circuit board to be tested. One tester-side connector that is larger than the number of electrodes that can be inspected by the tester-side connector Even if the number of one electrode is insufficient, the auxiliary relay pin unit disposed on the connector board side of one inspection jig , Bypassing the inspection connection circuit unit via the auxiliary connection circuit unit having the auxiliary relay board device arranged on the connector board side of the other inspection jig and the auxiliary anisotropic conductive sheet, Can be electrically connected from the tester side connector to the tester electrode connected to the other tester side connector, The electrical inspection of the circuit board to be inspected can be performed with high reliability.

 That is, according to the inspection apparatus 10 of this embodiment, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. Even if the number of electrodes of the first tester-side connector 41a, which is large and larger than the predetermined number of testable electrodes of the tester-side connector, is insufficient, the test connection circuit is connected via the auxiliary connection circuit unit 200. By bypassing the units 56a and 56b, electrical connection can be made from the first tester side connector 41a to the electrode of the tester connected to the second tester side connector 41b.

 That is, as indicated by arrow C in FIG. 21, the first auxiliary relay pin unit 231a, the auxiliary anisotropic conductive sheet 222 disposed on the connector board side 43a of the first inspection jig 11a, The second test jig l ib is connected to the first tester side connector by bypassing the test connection circuit units 56a and 56b via the second auxiliary relay board device 300b arranged on the connector board 43b side of the ib. 41a can be electrically connected to an electrode of a tester (not shown) connected to the second tester side connector 41b, and the electrical inspection of the circuit board 1 to be inspected can be performed with high reliability. It becomes like that and speaks.

 [0339] Shika also has different sizes and thicknesses depending on the type of circuit board 1 to be inspected, but as described above, as in the embodiment shown in FIG. 1, the first auxiliary relay pin unit 231a In the auxiliary connection circuit unit 200 including the second auxiliary relay pin unit 231b and the auxiliary anisotropic conductive sheet 222, the auxiliary difference circuit board 1 is changed when the type of the circuit board 1 to be inspected is changed. For each type of circuit board 1 to be inspected, a modified conductive sheet 222 with a different thickness must be prepared and replaced, resulting in high costs, complicated inspection work, and continuous electrical inspection. However, inspection efficiency will be reduced.

 [0340] Furthermore, when the type of the circuit board 1 to be inspected is changed and the thickness of the circuit board to be inspected changes greatly, the first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b themselves Must be replaced with one that has a different size, etc., resulting in high costs, complicated inspection work, inability to perform continuous electrical inspection, and reduced inspection efficiency.

[0341] As described above, the auxiliary element arranged on the connector board side of the other inspection jig as described above. Since the auxiliary relay board body having a plurality of conductive parts is biased toward the auxiliary relay pin unit by the biasing device of the auxiliary relay board device, the type of the circuit board to be inspected is changed, and the circuit board to be inspected is changed. Even if the thickness of the auxiliary connection circuit unit changes, the urging force of the urging device can absorb the change in thickness and ensure electrical continuity of the auxiliary connection circuit unit.

 That is, according to the inspection apparatus 10 of this embodiment, as described above, the urging device for the second auxiliary relay board apparatus 300b disposed on the connector board 43b side of the second inspection jig l ib 30 4b urges the auxiliary relay board body 302b with the conductive pins 320b, which are a plurality of conductive parts, toward the first auxiliary relay pin unit 231a, so the type of circuit board 1 to be tested is changed. Even if the thickness of the circuit board to be inspected changes, the biasing force of the biasing device 304b can absorb the change in thickness and ensure the electrical connection of the auxiliary connection circuit unit 200.

 FIG. 24 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention, and FIG. 25 is a cross-sectional view of FIG. FIG.

 [0344] The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in Fig. 20, and the same reference numerals are assigned to the same components.

 [0345] Also in the inspection apparatus 10 of this embodiment, the connection circuit units for inspection 56a, 56b are provided between the connector board 43a of the first inspection jig 11a and the connector board 43b of the second inspection jig l ib. Auxiliary connection circuit unit 200 that electrically connects from one tester side connector to the electrode of the tester connected to the other tester side connector is provided.

 That is, in the inspection apparatus 10 of this embodiment, as in the embodiment of FIG. 1, the connector board 43a of the first inspection jig 1 la and the connector board 43b of the second inspection jig l ib In the meantime, instead of the first auxiliary relay pin unit 231a arranged on the connector board 43a side of the first inspection jig 11a, the implementation of FIG. 20 is performed on the connector board 43a side of the first inspection jig 11a. The first auxiliary relay board device 300a having the same configuration as the second auxiliary relay board device 300b in the example is arranged.

[0347] According to the inspection apparatus 10 of this embodiment, the number of electrodes to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. , Even when the number of electrodes of the second tester-side connector 41b, which is larger than the predetermined number of testable electrodes of the tester-side connector, is insufficient, the inspection connection circuit unit 56a, By bypassing 56b, the second tester side connector 41b can be electrically connected to the electrode of the tester connected to the first tester side connector 41a! /.

 That is, as indicated by an arrow D in FIG. 25, the second auxiliary relay pin unit 231b and the auxiliary anisotropic conductive sheet 222 arranged on the connector board side 43b of the second inspection jig l ib The second tester-side connector bypasses the inspection connection circuit units 56a and 56b via the first auxiliary relay board device 30Oa arranged on the connector board 43a side of the first inspection jig 11a. 41b can be electrically connected to the electrode of a tester (not shown) connected to the first tester side connector 41a, and the electrical inspection of the circuit board 1 to be inspected can be performed with high reliability. I can do it.

 [0349] Also, according to the inspection apparatus 10 of this embodiment, as described above, the urging device of the first auxiliary relay board apparatus 300a arranged on the connector board 43a side of the first inspection jig 11a Since the auxiliary relay board body 302a provided with the conductive pins 320a, which are a plurality of conductive parts, is biased to the second auxiliary relay pin unit 231b side by 304a, the type of the circuit board 1 to be inspected is changed, Even if the thickness of the circuit board to be inspected changes, the urging force of the urging device 304a can absorb the change in thickness and ensure the electrical connection of the auxiliary connection circuit unit 200.

 [0350] The first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b in the embodiment shown in Figs. 20 and 24 have the first insulating plate as described in Figs. Intermediate holding plates 236a and 236b are placed between 234a and 234b and the second insulating plates 235a and 235b, and the first support pins 233a, 233b and the second support pins are interposed between these insulating plates. As a configuration in which 237a and 237b are arranged, it is of course possible to adopt a configuration in which the pressure concentration is dispersed by the panel elasticity of the intermediate holding plate 236 to avoid local stress concentration.

For example, FIG. 26 shows a configuration in which the first auxiliary relay pin unit 231a is changed to the first auxiliary relay pin unit 231a of the embodiment shown in FIG. 10 in the inspection apparatus 10 of the embodiment of FIG. FIG. 27 shows a second auxiliary relay pin unit 23 lb in the inspection apparatus 10 of the embodiment of FIG. Is a second auxiliary relay pin unit of 23 lb in the embodiment shown in FIG.

20 and 24, in addition to the force conductive pin 320 described for the auxiliary relay substrate 302 using the conductive pin 320 as the conductive portion, for example, a pogo pin (registered) It is also possible to use a conductive part such as a spring pin probe such as a trademark.

 FIG. 28 is a cross-sectional view similar to FIG. 1, illustrating another embodiment of the inspection apparatus of the present invention.

[0354] The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in Fig. 20, and the same reference numerals are assigned to the same components.

In the inspection apparatus 10 of this embodiment, the second auxiliary relay board apparatus 300b is similar to the first auxiliary relay board body 302b as a pair instead of the lower frame body 306b of the embodiment of FIG. Another second auxiliary relay board body 340b having a configuration and spaced apart from the auxiliary relay board body 302b may be provided. The second auxiliary relay substrate 340b is also provided with conductive pins 320b constituting a conductive portion.

 [0356] Further, an urging device 304b that urges the pair of auxiliary relay substrate bodies 302b and 340b in a direction away from each other is provided.

[0357] Further, a connection wiring 342b for electrically connecting the base end portions of the conductive pins 320b, which are conductive portions of the pair of auxiliary relay substrate bodies 302b and 340b, is provided.

With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes of the electrode to be inspected on the other surface of the circuit board to be inspected. Even if the number of electrodes on one tester side connector that is larger than the predetermined number of testable electrodes on the connector on the connector side is insufficient, the first test jig 1 la placed on the connector board side 43a Auxiliary connection comprising 1 auxiliary relay pin unit 231a, second inspection jig l ib second auxiliary relay board device 300b arranged on the connector board 43b side, and auxiliary anisotropic conductive sheet 222 The circuit unit 200 can be electrically connected from one tester side connector to the electrode of the other tester side connector, bypassing the test connection circuit units 56a and 56b via the circuit unit 200. Reliable electrical inspection (Similar to the route indicated by arrows A to D in Fig. 2). [0359] As described above, the pair of auxiliary relay board bodies 302b and 340b of the second auxiliary relay board device 300b arranged on the connector board 43b side of the second inspection jig l ib are separated from each other as described above. The pair of auxiliary relay board bodies 302b and 340b having the conductive pins 320b as the conductive portions are moved to the first auxiliary relay pin unit 231a side and the second Since the tester side connector 41b is biased to the electrode side, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, It is possible to secure the electrical continuity of the auxiliary connection circuit unit by absorbing the change of the above.

 FIG. 29 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

[0361] The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in Fig. 24, and the same reference numerals are assigned to the same components.

In the inspection apparatus 10 of this embodiment, the first auxiliary relay board device 300a is similar to the first auxiliary relay board body 302a as a pair instead of the lower frame body 306a of the embodiment of FIG. A second auxiliary relay board body 340a having a configuration and spaced apart from the auxiliary relay board body 302a may be provided. The second auxiliary relay board body 340a is also provided with conductive pins 320a constituting the conductive portion.

 [0363] The pair of auxiliary relay substrate bodies 302a and 340a are provided with a biasing device 304a that biases them in a direction away from each other.

[0364] Furthermore, a connection wiring 342a for electrically connecting the base end portions of the conductive pins 320a that are the conductive portions of the pair of auxiliary relay substrate bodies 302a and 340a is provided.

 With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. Even if the number of electrodes on one tester side connector that is larger than the predetermined number of testable electrodes on the connector on the connector side is insufficient, the second test jig is placed on the connector board side 43b of 1 lb. 2 auxiliary relay pin unit 231b, the first auxiliary relay board device 300a arranged on the connector board 43a side of the first inspection jig 11a, and the auxiliary anisotropic conductive sheet 2

22 through the auxiliary connection circuit unit 200, bypassing the inspection connection circuit units 56a and 56b, and from one tester side connector to the other tester side connector electrode. Therefore, the circuit board to be inspected can be electrically tested with high reliability (similar to the routes indicated by arrows A to D in FIG. 2).

[0366] As described above, the pair of auxiliary relay board bodies 302a and 340a of the first auxiliary relay board device 300a arranged on the connector board 43a side of the first inspection jig 11a is also separated from each other as described above. The biasing device 304a biasing in the direction causes the pair of auxiliary relay board bodies 302a and 340a having the conductive pins 320a as the conductive portions to be connected to the second auxiliary relay pin unit 23 lb side and the first Since the tester side connector 41a is biased to the electrode side, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, It is possible to secure the electrical continuity of the auxiliary connection circuit unit by absorbing the change of the above.

 FIG. 30 is a cross-sectional view similar to FIG. 1 for explaining another embodiment of the inspection apparatus of the present invention.

[0368] The inspection apparatus 10 of this embodiment has basically the same configuration as the inspection apparatus shown in Figs. 20 and 24, and the same reference numerals are assigned to the same components.

[0369] The inspection apparatus 10 of this embodiment is configured to include the first auxiliary relay board device 300a of Fig. 24 and the second auxiliary relay board device 300b of Fig. 20.

 With this configuration, the number of electrodes of the electrode to be inspected on one surface of the circuit board to be inspected is larger than the number of electrodes to be inspected on the other surface of the circuit board to be inspected. Even if the number of electrodes on one tester side connector that is larger than the predetermined number of testable electrodes on the connector on the connector side is insufficient, the first test jig 1 la placed on the connector board side 43a Auxiliary connection with 1 auxiliary relay board device 300a, 2nd inspection jig l ib connector board 43b second auxiliary relay board device 300b arranged on the side and auxiliary anisotropic conductive sheet 222 The circuit unit 200 can be electrically connected from one tester side connector to the electrode of the other tester side connector, bypassing the test connection circuit units 56a and 56b via the circuit unit 200. The electrical inspection is reliable Highly implemented (similar to the route of arrows A to D in Fig. 2).

[0371] As described above, the pair of auxiliary relay board bodies 302a and 340a of the first auxiliary relay board device 300a arranged on the connector board side 43a of the first inspection jig 11a are also separated from each other as described above. A pair of auxiliary units with a plurality of conductive parts by means of a biasing device 304a biasing in the direction Joint board body 302a, 340a force is urged toward the second auxiliary relay pin unit 23 lb side and the electrode side of the first tester side connector 41a,

 Biasing device 304b for biasing the pair of auxiliary relay board bodies 302b and 340b of the second auxiliary relay board device 300b arranged on the connector board 43b side of the second inspection jig l ib in a direction away from each other The pair of auxiliary relay board bodies 302b having the conductive pins 320b, which are conductive portions, are biased toward the first auxiliary relay pin unit 231a side and the electrode side of the second tester side connector 41b by 340b force. Therefore, even if the type of circuit board to be inspected is changed and the thickness of the circuit board to be inspected changes, the biasing force of this biasing device absorbs the change in thickness and Continuity can be ensured.

 [0372] The first auxiliary relay pin unit 231a and the second auxiliary relay pin unit 231b in the embodiment shown in Figs. Intermediate holding plates 236a and 236b are placed between 234a and 234b and the second insulating plates 235a and 235b, and the first support pins 233a, 233b and the second support pins are interposed between these insulating plates. As a configuration in which 237a and 237b are arranged, it is of course possible to adopt a configuration in which the pressure concentration is dispersed by the panel elasticity of the intermediate holding plate 236 to avoid local stress concentration.

 For example, FIG. 31 shows a configuration in which the first auxiliary relay pin unit 231a in the inspection apparatus 10 of the embodiment of FIG. 28 is replaced with the first auxiliary relay pin unit 231a of the embodiment shown in FIG. FIG. 32 shows a configuration in which the second auxiliary relay pin unit 23 lb is replaced with the second auxiliary relay pin unit 23 lb of the embodiment shown in FIG. 10 in the inspection apparatus 10 of the embodiment of FIG.

[0374] While the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications, changes, and modifications can be made without departing from the scope of the present invention.

 [0375] For example, the circuit board 1 to be inspected may be a semiconductor integrated circuit device such as a knock IC, MCM, or CSP, or a circuit device formed on a wafer, in addition to a printed circuit board. The printed circuit board may be a single-sided printed circuit board as well as a double-sided printed circuit board.

[0376] The first inspection jig 11a and the second inspection jig must be used in the materials used, the member structure, etc. These need not be the same, but they may be different. In the above-described embodiment, the first inspection jig 11a and the second inspection jig l ib are arranged vertically, but it is also possible to adopt a horizontal type that is arranged in a so-called lateral direction. .

 [0377] Further, the tester-side connector may be configured by stacking a plurality of circuit boards such as connector boards and anisotropic conductive sheets.

 Furthermore, in the above embodiment, the first anisotropic conductive sheet 22 is an anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction, and the second anisotropic conductive sheet 22 is used. The conductive sheet 26 and the third anisotropic conductive sheet 42 are composed of a plurality of conductive path forming parts extending in the thickness direction and insulating parts that insulate these conductive path forming parts from each other. Is contained only in the conductive path forming part, and the conductive particles are dispersed non-uniformly in the surface direction and the conductive path forming part protrudes on one side of the sheet. There is no particular limitation.

 Further, as shown in FIGS. 10, 11, 14, 15, 15, 17 and 19, support pins 49 are provided between the connector board 43 and the base plate 46 in the tester side connector 41. May be arranged. These support pins 49 have the same effect as the first support pin 33 and the second support pin 37 (in FIG. 16, the first support pin 33, the second support pin 37 and the holding plate support pin 39). It is also possible to give an effect of dispersing the surface pressure.

 [0380] In order to provide this surface pressure dispersion action, the position of the support pin 49 and the position of the second support pin 37 are different from each other in the surface direction (ie, the position of the support pin 49a is different from the position of the support pin 49a). The positions of the second support pins 37a and the positions of the support pins 49b and the second support pins 37b are preferably arranged so that they are shifted from each other in the surface direction.

 [0381] According to the inspection apparatus of the present invention having such a configuration, the minimum press pressure is different according to the inspection apparatus of the present invention compared to the conventional inspection apparatus compared to the conventional inspection apparatus. The durability of the directionally conductive sheet was also greatly improved.

[0382] Further, as compared with the conventional inspection apparatus, according to the inspection apparatus of the present invention, the voltage can be measured while supplying the current to the circuit of the circuit board to be inspected through the dedicated current terminal. As a result, the quality of the conduction resistance at a low set voltage can be judged stably, so that the electrical characteristic test of the circuit board to be inspected can be performed accurately. [0383] In other words, in the case of 4-terminal inspection, if the set voltage for pass / fail judgment is lowered, a circuit board having a potential defect can be detected. On the other hand, if the set voltage is lowered, the current is supplied and the inspection is performed, so that a substrate with a larger defect can be detected.

 [0384] On the other hand, in the case of the 2-terminal inspection, for example, if the set voltage is about 100 Ω, the pass / fail judgment can be made to the same degree as the 4-terminal inspection. It will not be stable and will not be reproducible. That is, it becomes difficult to detect a circuit board having a minute electrical defect.

 [0385] Conventionally, there is a burn-in test (accelerated test) as a method for detecting a circuit board (a board that is used as a product and becomes a defective product in a short period of time) having a small potential defect with high accuracy. Apart from that, the 4-terminal inspection of the present invention can be used effectively as a method of finding defects with high detection accuracy.

 [0386] This greatly improves the detection rate of potential defects in the circuit board to be inspected, so that a circuit board to be inspected that is prone to defects or that has defects early can be regarded as a defective product with high accuracy. This makes it possible to determine whether the circuit board to be inspected is good or defective with high accuracy.

 Industrial applicability

[0387] A printed circuit board for mounting an integrated circuit or the like is applied to an inspection of electrical characteristics to confirm that the wiring pattern of the circuit board has a predetermined performance before mounting the integrated circuit or the like. be able to.

Claims

The scope of the claims  [1] A circuit board inspection apparatus for performing an electric inspection by sandwiching both surfaces of a circuit board to be inspected between a pair of first inspection jig and a second inspection jig between a pair of inspection jigs Because  The first inspection jig and the second inspection jig are respectively  A pitch converting substrate for converting an electrode pitch between one surface side and the other surface side of the substrate; a first anisotropic conductive sheet disposed on the circuit board to be inspected side of the pitch converting substrate;  A second anisotropic conductive sheet disposed on the opposite side to the circuit board to be inspected of the pitch conversion board;  A circuit board side connector with  A plurality of conductive pins arranged at a predetermined pitch;  A pair of spaced apart insulation plates that support the conductive pins;  «I-pin unit with  A third anisotropic conductive sheet disposed opposite to the second anisotropic conductive sheet of the relay pin unit;  With a connection circuit unit for inspection with  A connector board for electrically connecting a tester and the relay pin unit; a base plate disposed on the opposite side of the connector board from the relay pin unit; and a tester side connector comprising:  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A circuit board inspection apparatus comprising an auxiliary connection circuit unit that bypasses the inspection connection circuit unit and electrically connects from one tester side connector to an electrode of the other tester side connector. [2] Circuit board inspection apparatus that performs electrical inspection by sandwiching both surfaces of the circuit board to be inspected between the two inspection jigs by a pair of first inspection jig and second inspection jig Because The first inspection jig and the second inspection jig are respectively  A pitch converting substrate for converting an electrode pitch between one surface side and the other surface side of the substrate; a first anisotropic conductive sheet disposed on the circuit board to be inspected side of the pitch converting substrate;  A second anisotropic conductive sheet disposed on the opposite side to the circuit board to be inspected of the pitch conversion board; A circuit board side connector with  A plurality of conductive pins arranged at a predetermined pitch;  A pair of spaced apart insulation plates that support the conductive pins; «I-pin unit with  A third anisotropic conductive sheet disposed opposite to the second anisotropic conductive sheet of the relay pin unit; With a connection circuit unit for inspection with  A connector board for electrically connecting a tester and the relay pin unit; a base plate disposed on the opposite side of the connector board from the relay pin unit; and a tester side connector comprising:  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  Auxiliary connection circuit unit that electrically connects from one tester side connector to the electrode of the tester connected to the other tester side connector is provided, bypassing the inspection connection circuit unit. Circuit board inspection equipment.  The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A first auxiliary relay unit having a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins, and arranged on the connector board side of the first inspection jig; A plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart supporting conductive pins A second auxiliary relay pin provided on the connector board side of the second inspection jig, and an insulating plate;  An auxiliary anisotropically conductive sheet electrically connecting the first auxiliary relay pin unit and the second auxiliary relay pin unit to each other;  Auxiliary connection circuit unit with  2. The circuit board according to claim 1, wherein the circuit board is configured to be electrically connected from one tester side connector to an electrode of the other tester side connector, bypassing the inspection connection circuit unit. Inspection device. [4] The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates that support the conductive pins, and an auxiliary relay pin switch arranged on the connector board side of one inspection jig;  An auxiliary relay board body provided with an insulating substrate and a plurality of conductive portions formed on the insulating substrate; an urging device for urging the auxiliary relay board body toward the auxiliary relay pin unit; and a base end portion of the conductive portion; An auxiliary relay board device disposed on the connector board side of the other inspection jig, and a connection wiring for electrically connecting a tester electrode connected to the other tester side connector;  An auxiliary anisotropic conductive sheet for electrically connecting the auxiliary relay pin unit and the auxiliary relay board device to each other;  Auxiliary connection circuit unit with  Auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and electrically connect from one tester side connector to the electrode of the tester connected to the second tester side connector. The circuit board inspection apparatus according to claim 2. [5] The auxiliary connection circuit unit is Between the connector board of the first inspection jig and the connector board of the second inspection jig A first auxiliary relay unit having a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins, and arranged on the connector board side of the first inspection jig;  An auxiliary relay board body provided with an insulating substrate and a plurality of conductive portions formed on the insulating substrate; an urging device for biasing the auxiliary relay board body toward the first auxiliary relay pin unit; and a base of the conductive portion A second auxiliary relay board disposed on the connector board side of the second inspection jig, and having a connection wiring for electrically connecting the end and the electrode of the tester connected to the second tester side connector Equipment,  An auxiliary anisotropic conductive sheet electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other; Auxiliary connection circuit unit with  Auxiliary connection circuit unit that electrically connects from the first tester side connector to the tester electrode connected to the second tester side connector is provided, bypassing the inspection connection circuit unit. The circuit board inspection device according to claim 4. The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A second auxiliary relay unit provided on the connector board side of the second inspection jig, comprising a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins;  An auxiliary relay board body provided with an insulating substrate and a plurality of conductive portions formed on the insulating substrate; an urging device for biasing the auxiliary relay board body toward the second auxiliary relay pin unit; and a base of the conductive portion A first auxiliary relay board disposed on the connector board side of the first inspection jig, and having a connection wiring for electrically connecting the end and the electrode of the tester connected to the first tester side connector Equipment,  An auxiliary anisotropic conductive sheet that electrically connects the second auxiliary relay pin unit and the first auxiliary relay board device to each other; Auxiliary connection circuit unit with Auxiliary connection circuit unit that electrically connects from the second tester side connector to the electrode of the tester connected to the first tester side connector is provided, bypassing the inspection connection circuit unit. The circuit board inspection device according to claim 4. [7] The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A plurality of conductive pins arranged at a predetermined pitch, and a pair of spaced apart insulating plates that support the conductive pins, and an auxiliary relay pin switch arranged on the connector board side of one inspection jig;  A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;  An urging device that urges the pair of auxiliary relay substrate bodies in a direction away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, An auxiliary relay board device disposed on the connector board side of the other inspection jig; an auxiliary anisotropic conductive sheet that electrically connects the auxiliary relay pin unit and the auxiliary relay board device; and  Auxiliary connection circuit unit with  2. The auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and to electrically connect from one tester side connector to the electrode of the other tester side connector. Circuit board inspection equipment. [8] The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A first auxiliary relay unit having a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins, and arranged on the connector board side of the first inspection jig; A pair of spaced auxiliary relays having an insulating substrate and a plurality of conductive portions formed on the insulating substrate A substrate body;  An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A second auxiliary relay board device disposed on the connector board side of the second inspection jig;  An auxiliary anisotropic conductive sheet electrically connecting the first auxiliary relay pin unit and the second auxiliary relay board device to each other; Auxiliary connection circuit unit with  8. The auxiliary connection circuit unit that bypasses the connection circuit unit for inspection and electrically connects from one tester side connector to the electrode of the other tester side connector is provided. Circuit board inspection equipment.  The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A second auxiliary relay unit provided on the connector board side of the second inspection jig, comprising a plurality of conductive pins arranged at a predetermined pitch and a pair of spaced apart insulating plates supporting the conductive pins;  A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;  An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A first auxiliary relay board device disposed on the connector board side of the first inspection jig;  An auxiliary anisotropic conductive sheet that electrically connects the second auxiliary relay pin unit and the first auxiliary relay board device to each other; Auxiliary connection circuit unit with Auxiliary connection circuit unit that electrically connects from one tester side connector to the electrode of the other tester side connector is provided, bypassing the inspection connection circuit unit. The circuit board inspection device according to claim 7, wherein [10] The auxiliary connection circuit unit is  Between the connector board of the first inspection jig and the connector board of the second inspection jig,  A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;  An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A first auxiliary relay board device disposed on the connector board side of the first inspection jig;  A pair of spaced-apart auxiliary relay substrate bodies each having an insulating substrate and a plurality of conductive portions formed on the insulating substrate;  An urging device that urges the pair of auxiliary relay substrate bodies in directions away from each other; and a connection wiring that electrically connects the base ends of the conductive portions of the pair of auxiliary relay substrate bodies, A second auxiliary relay board device disposed on the connector board side of the second inspection jig;  An auxiliary anisotropic conductive sheet for electrically connecting the first auxiliary relay board device and the second auxiliary relay board device to each other;  Auxiliary connection circuit unit with  2. The auxiliary connection circuit unit is provided to bypass the inspection connection circuit unit and to electrically connect from one tester side connector to the electrode of the other tester side connector. Circuit board inspection equipment. 11. The circuit board inspection device according to claim 4, wherein the conductive portion of the auxiliary relay board device is a conductive pin implanted in an insulating board. [12] A circuit board inspection method using the circuit board inspection apparatus according to any one of claims 1 to 11, A circuit board comprising: a pair of a first inspection jig and a second inspection jig, wherein both sides of the circuit board to be inspected are sandwiched between the inspection jigs to perform an electrical inspection. Inspection method.