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WO2007025127A3 - Boitiers de dispositifs microelectroniques, empilages de tels boitiers, et procedes de fabrication de ces dispositifs - Google Patents

Boitiers de dispositifs microelectroniques, empilages de tels boitiers, et procedes de fabrication de ces dispositifs Download PDF

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Publication number
WO2007025127A3
WO2007025127A3 PCT/US2006/033219 US2006033219W WO2007025127A3 WO 2007025127 A3 WO2007025127 A3 WO 2007025127A3 US 2006033219 W US2006033219 W US 2006033219W WO 2007025127 A3 WO2007025127 A3 WO 2007025127A3
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WO
WIPO (PCT)
Prior art keywords
microelectronic
package
device packages
die
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/033219
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English (en)
Other versions
WO2007025127A2 (fr
Inventor
Seng Kim Dalson Ye
Chin Hui Chong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Priority to EP06802317.5A priority Critical patent/EP1929524B1/fr
Priority to JP2008528182A priority patent/JP5522561B2/ja
Publication of WO2007025127A2 publication Critical patent/WO2007025127A2/fr
Publication of WO2007025127A3 publication Critical patent/WO2007025127A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Un boîtier microélectronique empilable comprend un premier microcircuit microélectronique mécaniquement et électriquement solidaire d'un premier substrat. Un deuxième microcircuit microélectronique est solidaire du premier microcircuit par une face et d'un deuxième substrat par l'autre face. Des connexions électriques sont réalisées entre le premier microcircuit et le premier substrat, entre le deuxième microcircuit et le deuxième substrat, et entre les deux substrats, par exemple par soudure de fils. Les éléments de connexion électrique sont avantageusement inclus dans un composé de moulage. Les contacts à nu des deux substrats, non recouverts par le composé de moulage, permettent les connexions électriques entre le boîtier et un autre boîtier empilé sur le premier. Ce boîtier, qui permet d'éviter les facteurs de coplanarité, se fabrique avec des équipements existants, permet les tests internes, et permet une hauteur de boîtier réduite.
PCT/US2006/033219 2005-08-26 2006-08-25 Boitiers de dispositifs microelectroniques, empilages de tels boitiers, et procedes de fabrication de ces dispositifs Ceased WO2007025127A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP06802317.5A EP1929524B1 (fr) 2005-08-26 2006-08-25 Boitiers de dispositifs microelectroniques, et empilages de tels boitiers
JP2008528182A JP5522561B2 (ja) 2005-08-31 2006-08-25 マイクロ電子デバイスパッケージ、積重ね型マイクロ電子デバイスパッケージ、およびマイクロ電子デバイスを製造する方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
SG200505523-1 2005-08-26
SG200505523-1A SG130066A1 (en) 2005-08-26 2005-08-26 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US11/218,028 US7504284B2 (en) 2005-08-26 2005-08-31 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US11/218,028 2005-08-31

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WO2007025127A2 WO2007025127A2 (fr) 2007-03-01
WO2007025127A3 true WO2007025127A3 (fr) 2007-05-18

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EP (1) EP1929524B1 (fr)
KR (1) KR101024424B1 (fr)
SG (1) SG130066A1 (fr)
TW (1) TWI309469B (fr)
WO (1) WO2007025127A2 (fr)

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KR20080031508A (ko) 2008-04-08
US20190096857A1 (en) 2019-03-28
US20130341805A1 (en) 2013-12-26
US10861824B2 (en) 2020-12-08
WO2007025127A2 (fr) 2007-03-01
US20160172349A1 (en) 2016-06-16
US20090127689A1 (en) 2009-05-21
US8519523B2 (en) 2013-08-27
US20070045803A1 (en) 2007-03-01
EP1929524A2 (fr) 2008-06-11

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