[go: up one dir, main page]

WO2007011068A1 - Light-emitting diode light source - Google Patents

Light-emitting diode light source Download PDF

Info

Publication number
WO2007011068A1
WO2007011068A1 PCT/JP2006/314938 JP2006314938W WO2007011068A1 WO 2007011068 A1 WO2007011068 A1 WO 2007011068A1 JP 2006314938 W JP2006314938 W JP 2006314938W WO 2007011068 A1 WO2007011068 A1 WO 2007011068A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting diode
light source
molding resin
diode elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/314938
Other languages
French (fr)
Inventor
Shuji Gomi
Kenji Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of WO2007011068A1 publication Critical patent/WO2007011068A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F21V7/0033—Combination of two or more reflectors for a single light source with successive reflections from one reflector to the next or following
    • F21V7/0041—Combination of two or more reflectors for a single light source with successive reflections from one reflector to the next or following for avoiding direct view of the light source or to prevent dazzling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Definitions

  • the present invention relates to a light source using a light emitting diode (LED) , which is useful as a lighting equipment and a backlight for a liquid crystal display.
  • LED light emitting diode
  • a light emitting diode element has been improved remarkably in terms of light emitting efficiency and advance to the practical stage for use in illumination and lighting.
  • using a light emitting diode as a backlight for a liquid crystal display can realize good color reproducibility and fast response, which enables to expect the achievement of better image quality.
  • a light emitting diode is environmentalIy-friendly, and has grown in use for interior light of automobiles and for a light source of headlights.
  • a light emitting diode As a light source for a lighting equipment or a backlight for a liquid crystal display, it is necessary to mount numerous light-emitting diode elements on the same plane substrate in order to produce a planate light source.
  • a planate light source has been produced by arranging bullet-type or top-view type LED lamps in a matrix on a plane.
  • this method is disadvantageous from a cost viewpoint since a light emitting diode element is individually mounted in a separate package.
  • Patent Document 1 JP-A-2000-329940
  • Patent Document 2 JP-A-2000-329940
  • a light-emitting diode element (1) is directly placed in an opening (4) of a circuit board (2) on the heatsink plate (3) .
  • Plural light-emitting diode elements (1) are individually covered with molding resin (5) , and reflector plate pieces (6) the surface of which is plated with nickel are provided at positions on the plate surrounding the molding resin. In such a method, heat dissipation is improved since heat generated by the light-emitting diode elements (1) is directly transmitted to the heatsink plate (3) .
  • the light distribution of the emitted light has not been improved, which is no different from that of the planar light source wherein the above-mentioned bullet-type or top-view type LED lamps are arranged in a matrix in a plane.
  • a so-called high efficacy power LED having a power consumption of IW or more is used for the light source of direct backlight units for an LCD television, which requires large luminance. Due to high heat generation of a high efficacy power LED, it is necessary to keep at least 5mm interval between the chips, preferably 10mm or more. However, there has been a problem that unevenness in brightness increases when the distance between the chips is 5mm or more.
  • LEDs of three primary colors that is, red, green and blue are generally used for a backlight unit for a liquid crystal display, and arrangement of high efficacy power LEDs with an interval of 5mm or more has a problem as a white light source due to insufficient mixing of the three primary colors as well as unevenness in brightness (see, for example, "Assembly of High- Brightness LEDs/Exhaustive Study on Mounting Technology", Electronic Journal 97 th Technical Symposium, page 73, February 2005 (Non-patent Document I)).
  • An object of the present invention is to solve these problems and to provide an LED light source which has high front-luminance and is excellent in evenness in brightness and chromaticity, and enables thin profile of a back light unit.
  • the present inventors have found the following: providing molding resin extending over plural LED elements to cover them instead of forming the resin molding respectively per LED element enables to make the brightness distribution more even in a light source wherein LED elements are arranged in a matrix on a plane with an interval of 5mm or more between each other, and to facilitate mixing colors using light sources with different colors .
  • the present invention has been achieved based on this finding. That is, the present invention relates to, for example, the following items:
  • a light-emitting diode light source having plural light- emitting diode elements mounted on the same circuit board, wherein molding resin is provided extending over plurality of the light- emitting diode elements to cover them. 2. The light-emitting diode light source as described in above 1, wherein the light-emitting diode elements are arranged with an interval of 5mm or more.
  • the light-emitting diode light source as described in above 8 wherein the base of the square pyramid is 2 mm or less and the height of which is half or less of the base. 10. The light-emitting diode light source as described in above 6, wherein the total area of base of protrusions on the surface of the molding resin is from 10 to 100% of the molding resin surface.
  • a method for producing the light-emitting diode light source as described in above 1, comprising providing a molding frame on the circuit board so that the plural light-emitting diode elements are located in the molding frame, and providing molding resin extending over the' plural light-emitting diode elements to cover them by filling molding resin in the molding frame.
  • a liquid crystal display provided with the lighting equipment as described in 13 above.
  • the LED light source of the present invention enables to make the brightness distribution more even in a light source wherein LED elements are arranged two-dimensionally with an interval of 5mm or more between each other, and to facilitate mixing colors using light sources with different colors. Furthermore, since the LED light source of the present invention is excellent in terms of front-luminance, evenness in brightness and chromaticity, it is useful for use in a display device or a lighting equipment.
  • the LED light source of the present invention is a light source having plural light-emitting diode elements mounted on the same circuit board wherein molding resin is provided extending over plurality of light-emitting diode elements to cover them.
  • the light-emitting LED diode elements used for the present invention may be selected according to purposes.
  • LED which has a high degree of color reproducibility is desirable to be used for a light source for a backlight of a liquid crystal display.
  • One of the preferable examples is the one wherein plural blue, green and red light-emitting diode elements are arranged on the same board.
  • a white light source it is preferable to provide light-emitting diode elements of intermediate colors such as yellow and orange besides the above-mentioned blue, green and red ones on the same board or to use a white light source comprising a combination of light-emitting diode elements of blue or near- ultraviolet and fluorescent substance.
  • the distance between the light-emitting diode elements to be arranged is not specifically limited, but when high efficacy power devices having a power consumption of IW or more are used, heat generated from the devices is extremely high and arranging the devices too close to each other will damage devices and substrates. Therefore, the distance between the elements is preferably 5mm or more.
  • the board on which plural light- emitting diode elements are provided is composed of a circuit board and a heatsink plate.
  • the circuit board is a substrate on which a circuit is formed in order to apply electricity to the light- emitting diode elements, and to which the cathode and anode of the light-emitting diode element are connected.
  • the methods for obtaining the circuit board include a method of laminating an insulating resin substrate and a copper foil and etching the copper foil in a circuit pattern. Examples of the insulating resin substrates include a so-called glass epoxy substrate.
  • a light-emitting diode element is placed in an opening at which a through-hole is provided in the circuit board to expose a heatsink plate.
  • the light- emitting part of the light-emitting diode element appears to be protruded from the surface of the circuit board. Therefore, though it may vary depending on the size of the light-emitting diode element, the thickness of the circuit board is preferably 0.1mm or less, particularly preferably 50um or less.
  • the heatsink plate is laminated on a side of the circuit board where the circuit is not formed and intended for dissipating the heat generated from the light-emitting diode elements.
  • Preferable materials for the heatsink plate include metal and highly heat-conductive ceramics.
  • the metal is preferably aluminum, copper, stainless or the like.
  • the highly heat-conductive ceramics is preferably aluminum nitride.
  • the light-emitting diode element As a method for placing plural light-emitting diode elements on a circuit board, it is preferable from the viewpoint of heatsinking performance to place the light-emitting diode element directly on the heatsink plate in the form of a so-called bare chip instead of mounting a light-emitting diode element in a package.
  • through-holes are provided in the circuit board where the light-emitting diode elements are to be placed so that the heatsink plate becomes exposed at the through-hole when the heatsink plate is bonded on the circuit board, and the light-emitting diode elements are placed on the heatsink plate in the opening.
  • means having lower thermal resistance is preferable and includes, for example, silver paste and thermal conductive silicone grease.
  • Molding resin is preferably a thermosetting transparent resin, particularly preferably a transparent epoxy resin.
  • transparent epoxy resin include epoxy resin such as bisphenol-A diglycidyl ether, 2, 2-bis (4-glycidyloxycyclohexyl) propane, 3,4- epoxycyclohexylmethyl-3, 4-epoxyhexane carboxylate, vinylcyclohexene dioxide, 2- (3, 4-epoxycyclohexane) -5, 5-spiro (3,4- epoxycyclohexane) - 1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1 / 2- cyclopropanedicarboxylic acid bisglycidyl ester, triglycidyl isocyanurate, monoallyldiglycidylisocyanurate and diallylmonoglycidyl isocyanurate cured by acid anhydride such as hexahydrophthalic anhydride, methyl
  • the methods for providing molding resin extending over plural bare chips in order to cover them include a method of applying the resin by a dispenser or printing; or providing a molding frame around the circuit board, filling the molding frame with resin, smoothing the resin using a doctor blade or the like and then curing it.
  • the other methods include a method of shaping and bonding the resin onto the substrate using a mold.
  • the above-mentioned molding resin is provided extending over plural light-emitting diode elements on the substrate to cover them.
  • ⁇ to provide molding resin extending over plural light-emitting diode elements to cover them means to form plural light-emitting diode elements integrally by covering plural light-emitting diode elements in a state that the molding resin which covers each of light-emitting diode elements is integrally formed in a consecutive fashion.
  • the color may be varied by adding fluorescent substance to the molding resin for wavelength conversion.
  • the examples of the fluorescent substances include an inorganic fluorescent substance such as so-called yttrium aluminum garnet (YAG) cerium fluorescent substance and an organic fluorescent substance such as rhodamine and coumarin.
  • the molding resin layer of the present invention has a higher refractive index than that of air, it also has a function of a light guide at the same time. That is, since a certain proportion of the light radiated from the plural LED elements is transmitted by total reflection through the inside of the molding resin layer, the brightness becomes more even and mixing colors is facilitated using light sources with different colors. Accordingly, in the case where a diffuser plate for making the brightness even is provided, it enables to reduce the distance between the LED elements and diffuser plates to about 10mm thereby to obtain a thin-profile backlight unit.
  • the LED light source of the present invention it is preferable to provide a reflector immediately above the light- emitting diode elements .
  • the reflectors include a direct reflector or a diffuse reflector having a reflectance of 95% or more, preferably 97% or more.
  • the shape of a reflector may be determined according to the shape of a light-emitting diode element but it is preferably in a disc shape having a diameter of from 1 to 10 times, more preferably 2 to 5 times of one side of the light-emitting diode elements.
  • Examples of the materials for the reflectors include a metal foil such as an aluminum foil, a thin film of metal such as aluminum, gold, silver and platinum and white ink.
  • a metal foil such as an aluminum foil can be bonded using a transparent adhesive agent.
  • a thin film of metal such as aluminum, gold, silver and platinum can be formed according to a metal mask pattern by a method such as vapor deposition, sputtering and electroless plating.
  • white ink (such as acrylic resin containing titanium dioxide) can be applied by a dispenser or by a printing method. Among these, applying white ink is preferable because it is simple and easy.
  • protrusions on the surface of the molding resin examples include a semisphere, cuboid, circular cone and polyangular pyramid. Preferred is a polyangular pyramid, specifically a square pyramid.
  • the square pyramid preferably has a base side of 2mm or less and a height which is half or less of the base side.
  • Convex portions such as a square pyramid are preferably formed adjacently to each other.
  • the area of base of the convex portions is preferably at least 10% or more, more preferable 50% or more of the surface area on which the convex portions are formed.
  • a method of forming protrusions may be a method of constructing the protrusions on the molding resin itself or a method of laminating a resin film on which protrusions are formed onto the molding resin.
  • the LED light source of the present invention can be suitably used as a light source for a lighting equipment or a backlight of a liquid crystal display.
  • a blue LED the wavelength of which is in a range of 420 to 480nm and to add to the molding resin an appropriate amount of fluorescent substance which absorbs part of the blue light and emits fluorescence having a longer wavelength, and thereby to make the light source a white light source having high color rendering properties.
  • diodes emitting at least three-color lights of red, green and blue.
  • FIG. 1 A schematic plan view showing an example of the present invention
  • FIG. 2 A cross-sectional view along the line A-A of Fig. 1
  • FIG. 3 A schematic plan view of a backlight using the light source of the present invention
  • FIG. 4 A plan view showing the locations of measurement
  • FIG. 5 A schematic cross-sectional view of an LED light source showing another embodiment of the present invention
  • FIG. 6 A schematic cross-sectional view of a conventional LED light source
  • Example 1
  • an aluminum substrate having a size of 80 x 120mm and thickness of 1.2mm was used as a heatsink plate (3) and a film comprising a copper foil having a thickness of 18 ⁇ m on one side of which an insulating adhesive resin film having a thickness of 20um was bonded onto the heatsink plate to produce a circuit board (2) having a thickness of about 30um.
  • a circuit pattern was formed by etching the copper part. Also, six through openings of 5mm square (3 openings x 2 rows) were perforated at the positions where LED chips (I) ' were to be placed.
  • the light-emitting diode element (1) having a size of lmm square were placed in two rows in the order of red (TOA- 1000, produced by SHOWA DENKO K. K.), green (produced by ITSWELL Co., Ltd.) and blue one (produced by ITSWELL Co., Ltd.) from the left to the right.
  • a molding frame comprising a polypropylene sheet having a thickness of 2mm (70mm x 90mm in the opening) having the same outline of the LED board was placed on the LED board, and a transparent epoxy resin (5) (NLD-L-645, produced by Sanyu Rec Co., Ltd.) was placed dropwise into the molding frame by a dispenser and then cured at 130°C to thereby form molding resin (5) . Then, a metal mask was placed on the LED board which has openings having a
  • the obtained four LED light sources was bonded to the bottom surface of a box-type container for a backlight having an outside dimension of 270 x 200mm and a depth of 30mm using a high thermal conductive silicone grease (oil compound G-751, produced by Shin- Etsu Chemical Co., Ltd.) as shown in the schematic plan view (Fig. 3) .
  • a high thermal conductive silicone grease oil compound G-751, produced by Shin- Etsu Chemical Co., Ltd.
  • a reflection film Limirror, produced by Toray Industries, Inc.
  • a polycarbonate diffuser Panlite, produced by Teijin Chemicals Ltd.
  • a polycarbonate diffuser Panlite, produced by Teijin Chemicals Ltd.
  • 30OmA current was applied to all the blue light-emitting diode elements and and 35OmA to all the green and red light-emitting diode elements to turn them on, and the brightness and chromatic!ty coordinates at nine points shown in Fig. 4 were measured using spectroradiometer CS-IOOOS (spectroscopy type) produced by Konica Minolta Holdings, Inc.
  • the average brightness was about 6000cd/m 2 and the brightness dispersion ( ⁇ (maximum brightness - minimum brightness)/ average brightness ⁇ x 100%) was 13%.
  • a backlight unit was produced in the same manner as in Example 1 except that a gloss ink (MIR-9100, produced by Teikoku Printing Inks Manufacturing Co., Ltd.) was applied in a thickness of 30um as a reflector (7) .
  • the reflectance of the reflector (7) measured in the same way as in Example 1 was 97%.
  • the average brightness was about 11000cd/m 2 and the brightness dispersion was 13%.
  • Example 2 An acrylic resin board (dimension: 70mm x 90mm, thickness: lmm) on the whole surface of which convex portions each in a shape of a square pyramid having a base side of ,2ram and height of lmm were formed was bonded on the molding resin of each of the four LED light sources produced in Example 1.
  • the average brightness was about 15600cd/m 2 and the brightness dispersion was 15%.
  • resin molding portions (5) are formed so that they may protrude on the surface of the LED board.
  • the resin molding portions (5) may be formed at the same level of the thickness of reflector plate pieces (6) provided on the outer ends of the surface of the LED board, that is, the surfaces of the reflector plate pieces (6) and resin molding (5) may be formed almost on the same level.
  • reflectors (7) may be provided appropriately at positions immediately above light-emitting diode elements (LED chips) similarly to Examples 1 and 2.
  • recesses may be formed in the heatsink plate (3) in which recesses LED chips are mounted and resin molding portion (5) is formed to cover the LED chips so as to make the surfaces of the resin molding portion (5) and the heatsink plate (3) almost at the same level.
  • the interval between adjacent light-emitting diode elements is preferably 5mm or more.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light-emitting diode light source having plural light-emitting diode elements mounted on the same circuit board, wherein molding resin is provided extending over plurality of the light-emitting diode elements to cover them; a production method thereof; a display device, lighting equipment and a backlight for a liquid crystal display using the light source. Since the LED light source of the present invention is excellent in terms of front-luminance, evenness in brightness and chromaticity, it is useful for use in a display device, a lighting equipment or a backlight for a liquid crystal display.

Description

DESCRIPTION
Light-Emitting Diode Light Source
CROSS-REFERENCE TO RELATED APPLICATIONS
This is an application filed pursuant to 35 U.S.C. Section 111 (a) with claiming the benefit of U.S. provisional application Serial No. 60/703,508 filed July 29, 2005 under the provision of 35 U.S.C. lll(b), pursuant to 35 U.S.C. Section 119(e) (1).
TECHNICAL FIELD
The present invention relates to a light source using a light emitting diode (LED) , which is useful as a lighting equipment and a backlight for a liquid crystal display.
BACKGROUND ART
Recently, light emitting diode elements have been improved remarkably in terms of light emitting efficiency and advance to the practical stage for use in illumination and lighting. Specifically, using a light emitting diode as a backlight for a liquid crystal display can realize good color reproducibility and fast response, which enables to expect the achievement of better image quality. Also, as being free from mercury, a light emitting diode is environmentalIy-friendly, and has grown in use for interior light of automobiles and for a light source of headlights.
When using a light emitting diode as a light source for a lighting equipment or a backlight for a liquid crystal display, it is necessary to mount numerous light-emitting diode elements on the same plane substrate in order to produce a planate light source. Conventionally, a planate light source has been produced by arranging bullet-type or top-view type LED lamps in a matrix on a plane. However, this method is disadvantageous from a cost viewpoint since a light emitting diode element is individually mounted in a separate package. Also, there is a problem of difficulties in dissipating heat generated by a light emitting diode element due to high thermal resistance of the package.
In the case that bullet-type or top-view type LED lamps are arranged on a plane at a certain interval, the positions immediately above the lamp are bright while areas between the lamps are relatively dark. Consequently, in order to make the brightness even, it was necessary to provide a diffuser as well as providing a distance of 30mm or more between the diffuser and a lamp (JP-A-2004-
233957 (Patent Document 1) and JP-A-2000-329940 (Patent Document 2)). Therefore, there are problems of lowering in brightness and difficulties in reducing the thickness of a backlight unit.
As a method to solve the former problem among the above- mentioned problems, a method has been developed in which a highly thermal conductive material such as aluminum is bonded as a heatsink plate on the back of the backlight unit and light-emitting diode elements are directly placed on the heatsink plate. An example is shown in Fig. 6.
In the example in Fig. 6, a light-emitting diode element (1) is directly placed in an opening (4) of a circuit board (2) on the heatsink plate (3) . Plural light-emitting diode elements (1) are individually covered with molding resin (5) , and reflector plate pieces (6) the surface of which is plated with nickel are provided at positions on the plate surrounding the molding resin. In such a method, heat dissipation is improved since heat generated by the light-emitting diode elements (1) is directly transmitted to the heatsink plate (3) .
However, the light distribution of the emitted light has not been improved, which is no different from that of the planar light source wherein the above-mentioned bullet-type or top-view type LED lamps are arranged in a matrix in a plane.
Meanwhile, a so-called high efficacy power LED having a power consumption of IW or more is used for the light source of direct backlight units for an LCD television, which requires large luminance. Due to high heat generation of a high efficacy power LED, it is necessary to keep at least 5mm interval between the chips, preferably 10mm or more. However, there has been a problem that unevenness in brightness increases when the distance between the chips is 5mm or more. Furthermore, LEDs of three primary colors, that is, red, green and blue are generally used for a backlight unit for a liquid crystal display, and arrangement of high efficacy power LEDs with an interval of 5mm or more has a problem as a white light source due to insufficient mixing of the three primary colors as well as unevenness in brightness (see, for example, "Assembly of High- Brightness LEDs/Exhaustive Study on Mounting Technology", Electronic Journal 97th Technical Symposium, page 73, February 2005 (Non-patent Document I)).
DISCLOSURE OF INVENTION
An object of the present invention is to solve these problems and to provide an LED light source which has high front-luminance and is excellent in evenness in brightness and chromaticity, and enables thin profile of a back light unit. As a result of intensive studies, the present inventors have found the following: providing molding resin extending over plural LED elements to cover them instead of forming the resin molding respectively per LED element enables to make the brightness distribution more even in a light source wherein LED elements are arranged in a matrix on a plane with an interval of 5mm or more between each other, and to facilitate mixing colors using light sources with different colors . The present invention has been achieved based on this finding. That is, the present invention relates to, for example, the following items:
1. A light-emitting diode light source having plural light- emitting diode elements mounted on the same circuit board, wherein molding resin is provided extending over plurality of the light- emitting diode elements to cover them. 2. The light-emitting diode light source as described in above 1, wherein the light-emitting diode elements are arranged with an interval of 5mm or more.
3. The light-emitting diode light source as described in above 1 or 2, wherein a reflector is formed immediately above the light-emitting diode elements.
4. The light-emitting diode light source as described in above 3, wherein the reflector is one of a metal foil, metal film or white ink.
5. The light-emitting diode light source as described in above 4, wherein the metal film is formed by any one of the methods of vapor deposition, sputtering or plating.
6. The light-emitting diode light source as described in above 1, wherein protrusions are formed on the surface of molding resin. 7. The light-emitting diode light source as described in above 1, wherein a resin film on the surface of which protrusions are formed is laminated onto the molding resin.
8. The light-emitting diode light source as described in above 6 or I1 wherein the protrusions are in a shape of square pyramid.
9. The light-emitting diode light source as described in above 8, wherein the base of the square pyramid is 2 mm or less and the height of which is half or less of the base. 10. The light-emitting diode light source as described in above 6, wherein the total area of base of protrusions on the surface of the molding resin is from 10 to 100% of the molding resin surface.
11. A method for producing the light-emitting diode light source as described in above 1, comprising providing a molding frame on the circuit board so that the plural light-emitting diode elements are located in the molding frame, and providing molding resin extending over the' plural light-emitting diode elements to cover them by filling molding resin in the molding frame. 12. A display unit using the light-emitting diode light source as described in any one of 1 to 10 above.
13. A lighting equipment using the light-emitting diode light source as described in any one of 1 to 10 above.
14. A liquid crystal display provided with the lighting equipment as described in 13 above.
EFFECTS OF INVENTION
The LED light source of the present invention enables to make the brightness distribution more even in a light source wherein LED elements are arranged two-dimensionally with an interval of 5mm or more between each other, and to facilitate mixing colors using light sources with different colors. Furthermore, since the LED light source of the present invention is excellent in terms of front-luminance, evenness in brightness and chromaticity, it is useful for use in a display device or a lighting equipment.
The LED light source of the present invention is a light source having plural light-emitting diode elements mounted on the same circuit board wherein molding resin is provided extending over plurality of light-emitting diode elements to cover them.
The light-emitting LED diode elements used for the present invention may be selected according to purposes. For example, LED which has a high degree of color reproducibility is desirable to be used for a light source for a backlight of a liquid crystal display. One of the preferable examples is the one wherein plural blue, green and red light-emitting diode elements are arranged on the same board.
Also, for a white light source, it is preferable to provide light-emitting diode elements of intermediate colors such as yellow and orange besides the above-mentioned blue, green and red ones on the same board or to use a white light source comprising a combination of light-emitting diode elements of blue or near- ultraviolet and fluorescent substance.
The distance between the light-emitting diode elements to be arranged is not specifically limited, but when high efficacy power devices having a power consumption of IW or more are used, heat generated from the devices is extremely high and arranging the devices too close to each other will damage devices and substrates. Therefore, the distance between the elements is preferably 5mm or more. It is preferable that the board on which plural light- emitting diode elements are provided is composed of a circuit board and a heatsink plate. The circuit board is a substrate on which a circuit is formed in order to apply electricity to the light- emitting diode elements, and to which the cathode and anode of the light-emitting diode element are connected. The methods for obtaining the circuit board include a method of laminating an insulating resin substrate and a copper foil and etching the copper foil in a circuit pattern. Examples of the insulating resin substrates include a so-called glass epoxy substrate.
A light-emitting diode element is placed in an opening at which a through-hole is provided in the circuit board to expose a heatsink plate. In this case, it is preferable that the light- emitting part of the light-emitting diode element appears to be protruded from the surface of the circuit board. Therefore, though it may vary depending on the size of the light-emitting diode element, the thickness of the circuit board is preferably 0.1mm or less, particularly preferably 50um or less.
The heatsink plate is laminated on a side of the circuit board where the circuit is not formed and intended for dissipating the heat generated from the light-emitting diode elements. Preferable materials for the heatsink plate include metal and highly heat-conductive ceramics. The metal is preferably aluminum, copper, stainless or the like. The highly heat-conductive ceramics is preferably aluminum nitride.
As a method for placing plural light-emitting diode elements on a circuit board, it is preferable from the viewpoint of heatsinking performance to place the light-emitting diode element directly on the heatsink plate in the form of a so-called bare chip instead of mounting a light-emitting diode element in a package. Specifically, through-holes are provided in the circuit board where the light-emitting diode elements are to be placed so that the heatsink plate becomes exposed at the through-hole when the heatsink plate is bonded on the circuit board, and the light-emitting diode elements are placed on the heatsink plate in the opening. For the bonding, means having lower thermal resistance is preferable and includes, for example, silver paste and thermal conductive silicone grease. Molding resin is preferably a thermosetting transparent resin, particularly preferably a transparent epoxy resin. Examples of transparent epoxy resin include epoxy resin such as bisphenol-A diglycidyl ether, 2, 2-bis (4-glycidyloxycyclohexyl) propane, 3,4- epoxycyclohexylmethyl-3, 4-epoxyhexane carboxylate, vinylcyclohexene dioxide, 2- (3, 4-epoxycyclohexane) -5, 5-spiro (3,4- epoxycyclohexane) - 1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1/2- cyclopropanedicarboxylic acid bisglycidyl ester, triglycidyl isocyanurate, monoallyldiglycidylisocyanurate and diallylmonoglycidyl isocyanurate cured by acid anhydride such as hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride and hydrogenated methylnadic acid anhydride. These epoxy resins and curing agents may be used as a single agent or in combination of two or more thereof.
The methods for providing molding resin extending over plural bare chips in order to cover them include a method of applying the resin by a dispenser or printing; or providing a molding frame around the circuit board, filling the molding frame with resin, smoothing the resin using a doctor blade or the like and then curing it. The other methods include a method of shaping and bonding the resin onto the substrate using a mold.
The above-mentioned molding resin is provided extending over plural light-emitting diode elements on the substrate to cover them. Here, Λλto provide molding resin extending over plural light-emitting diode elements to cover them" means to form plural light-emitting diode elements integrally by covering plural light-emitting diode elements in a state that the molding resin which covers each of light-emitting diode elements is integrally formed in a consecutive fashion. Depending on the usage of a light source, the color may be varied by adding fluorescent substance to the molding resin for wavelength conversion. The examples of the fluorescent substances include an inorganic fluorescent substance such as so-called yttrium aluminum garnet (YAG) cerium fluorescent substance and an organic fluorescent substance such as rhodamine and coumarin.
In order to improve the evenness in brightness and chromaticity, scatterers may be added to the molding resin. Examples of the scatterers include acrylic beads and alumina powder. Furthermore, since the molding resin layer of the present invention has a higher refractive index than that of air, it also has a function of a light guide at the same time. That is, since a certain proportion of the light radiated from the plural LED elements is transmitted by total reflection through the inside of the molding resin layer, the brightness becomes more even and mixing colors is facilitated using light sources with different colors. Accordingly, in the case where a diffuser plate for making the brightness even is provided, it enables to reduce the distance between the LED elements and diffuser plates to about 10mm thereby to obtain a thin-profile backlight unit. Also, forming protrusions and scatterers on the surface of the molding resin is preferable since it allows the light having been improved in evenness in brightness or having undergone mixing colors to emit from the resin more efficiently. With respect to the LED light source of the present invention, it is preferable to provide a reflector immediately above the light- emitting diode elements . Examples of the reflectors (measured using, for example, portable reflectometer CM-53P produced by Murakami Color Research Laboratory) include a direct reflector or a diffuse reflector having a reflectance of 95% or more, preferably 97% or more.
The shape of a reflector may be determined according to the shape of a light-emitting diode element but it is preferably in a disc shape having a diameter of from 1 to 10 times, more preferably 2 to 5 times of one side of the light-emitting diode elements.
Examples of the materials for the reflectors include a metal foil such as an aluminum foil, a thin film of metal such as aluminum, gold, silver and platinum and white ink. A metal foil such as an aluminum foil can be bonded using a transparent adhesive agent. A thin film of metal such as aluminum, gold, silver and platinum can be formed according to a metal mask pattern by a method such as vapor deposition, sputtering and electroless plating. White ink
(such as acrylic resin containing titanium dioxide) can be applied by a dispenser or by a printing method. Among these, applying white ink is preferable because it is simple and easy.
Furthermore, in the LED light source of the present invention, it is preferable to form protrusions on the surface of the molding resin. Examples of the shape of protrusions on the surface of the molding resin include a semisphere, cuboid, circular cone and polyangular pyramid. Preferred is a polyangular pyramid, specifically a square pyramid. The square pyramid preferably has a base side of 2mm or less and a height which is half or less of the base side. Forming protrusions on the surface of the molding resin enables to enhance the light extraction efficiency from the molding resin and thereby the brightness of the light source can be expected to improve.
Convex portions such as a square pyramid are preferably formed adjacently to each other. The area of base of the convex portions is preferably at least 10% or more, more preferable 50% or more of the surface area on which the convex portions are formed.
A method of forming protrusions may be a method of constructing the protrusions on the molding resin itself or a method of laminating a resin film on which protrusions are formed onto the molding resin.
The LED light source of the present invention can be suitably used as a light source for a lighting equipment or a backlight of a liquid crystal display. When it is used as a light source for a lighting equipment, it is preferable to use a blue LED the wavelength of which is in a range of 420 to 480nm and to add to the molding resin an appropriate amount of fluorescent substance which absorbs part of the blue light and emits fluorescence having a longer wavelength, and thereby to make the light source a white light source having high color rendering properties. As a light source for a backlight of a liquid crystal display, it is preferable to use diodes emitting at least three-color lights of red, green and blue. BRIEF DESCRIPTION OF DRAWINGS
[Fig. 1] A schematic plan view showing an example of the present invention
[Fig. 2] A cross-sectional view along the line A-A of Fig. 1 [Fig. 3] A schematic plan view of a backlight using the light source of the present invention
[Fig. 4] A plan view showing the locations of measurement [Fig. 5] A schematic cross-sectional view of an LED light source showing another embodiment of the present invention [Fig. 6] A schematic cross-sectional view of a conventional LED light source
EXAMPLES
Hereinafter, the present invention will be described in more detail by examples. However, the present invention should not be construed as being limited thereto. Example 1:
As shown in the schematic plan view (Fig. 1) and the cross- sectional view (Fig. 2) along the line A-A of Fig. 1, an aluminum substrate having a size of 80 x 120mm and thickness of 1.2mm was used as a heatsink plate (3) and a film comprising a copper foil having a thickness of 18μm on one side of which an insulating adhesive resin film having a thickness of 20um was bonded onto the heatsink plate to produce a circuit board (2) having a thickness of about 30um. A circuit pattern was formed by etching the copper part. Also, six through openings of 5mm square (3 openings x 2 rows) were perforated at the positions where LED chips (I)' were to be placed.
Subsequently, six light-emitting diode elements (1) were mounted in the openings perforated in the circuit board using silver paste (TC-3600, produced by Hitachi Chemical Co., Ltd.) to thereby obtain an LED board. The light-emitting diode element (1) having a size of lmm square were placed in two rows in the order of red (TOA- 1000, produced by SHOWA DENKO K. K.), green (produced by ITSWELL Co., Ltd.) and blue one (produced by ITSWELL Co., Ltd.) from the left to the right. Next, a molding frame comprising a polypropylene sheet having a thickness of 2mm (70mm x 90mm in the opening) having the same outline of the LED board was placed on the LED board, and a transparent epoxy resin (5) (NLD-L-645, produced by Sanyu Rec Co., Ltd.) was placed dropwise into the molding frame by a dispenser and then cured at 130°C to thereby form molding resin (5) . Then, a metal mask was placed on the LED board which has openings having a
2mm diameter immediately above the light-emitting diode elements
(LED chips) , and platinum film of lOnm thickness was formed using a ion coater (I-B3, produced by EIKO Engineering Co., Ltd.) to form a reflector (7) and to complete an LED light source. The reflectance of the reflector (7) measured using portable reflectometer CM-53P produced by Murakami Color Research Laboratory (measuring system: vertically (0°) illuminated, circumferentially measured at 45°, tungsten light source lamp) was 95%.
The obtained four LED light sources was bonded to the bottom surface of a box-type container for a backlight having an outside dimension of 270 x 200mm and a depth of 30mm using a high thermal conductive silicone grease (oil compound G-751, produced by Shin- Etsu Chemical Co., Ltd.) as shown in the schematic plan view (Fig. 3) . Subsequently, the inside of the backlight container was lined with a reflection film (Lumirror, produced by Toray Industries, Inc.) leaving no space except the resin molding portion (5) of the
LED board. Then, a polycarbonate diffuser (Panlite, produced by Teijin Chemicals Ltd.) having the same outer dimension as the backlight container was placed 10mm above the LED board to cover it so as to produce a backlight unit. 30OmA current was applied to all the blue light-emitting diode elements and and 35OmA to all the green and red light-emitting diode elements to turn them on, and the brightness and chromatic!ty coordinates at nine points shown in Fig. 4 were measured using spectroradiometer CS-IOOOS (spectroscopy type) produced by Konica Minolta Holdings, Inc. The average brightness was about 6000cd/m2 and the brightness dispersion ({(maximum brightness - minimum brightness)/ average brightness} x 100%) was 13%. The average chromaticity coordinates were x = 0.31, y = 0.30 and the chromaticity dispersion (difference between the maximum and minimum values in the chromaticity coordinate of the uniform chromaticity scale diagram) was Δu = 0.005 and Δv = 0.005.
Example 2:
A backlight unit was produced in the same manner as in Example 1 except that a gloss ink (MIR-9100, produced by Teikoku Printing Inks Manufacturing Co., Ltd.) was applied in a thickness of 30um as a reflector (7) . The reflectance of the reflector (7) measured in the same way as in Example 1 was 97%.
As a result of the same lighting test as in Example 1, the average brightness was about 11000cd/m2 and the brightness dispersion was 13%. The average chromaticity coordinates were x = 0.31, y = 0.30 and the chromaticity dispersion was Δu = 0.005 and Δv = 0.004.
Example 3:
An acrylic resin board (dimension: 70mm x 90mm, thickness: lmm) on the whole surface of which convex portions each in a shape of a square pyramid having a base side of ,2ram and height of lmm were formed was bonded on the molding resin of each of the four LED light sources produced in Example 1. As a result of the same lighting test as in Example 1, the average brightness was about 15600cd/m2 and the brightness dispersion was 15%. The average chromaticity coordinates were x = 0.31, y = 0.30 and the chromaticity dispersion was Δu = 0.005 and Δv = 0.004.
In each of Examples 1 to 3 above, resin molding portions (5) are formed so that they may protrude on the surface of the LED board. However, as another embodiment, the resin molding portions (5) may be formed at the same level of the thickness of reflector plate pieces (6) provided on the outer ends of the surface of the LED board, that is, the surfaces of the reflector plate pieces (6) and resin molding (5) may be formed almost on the same level. Here, reflectors (7) may be provided appropriately at positions immediately above light-emitting diode elements (LED chips) similarly to Examples 1 and 2. Also, as still another embodiment (not shown in a figure) , recesses may be formed in the heatsink plate (3) in which recesses LED chips are mounted and resin molding portion (5) is formed to cover the LED chips so as to make the surfaces of the resin molding portion (5) and the heatsink plate (3) almost at the same level. In these cases, the interval between adjacent light-emitting diode elements is preferably 5mm or more.

Claims

CLAEMS
1. A light-emitting diode light source having plural light- emitting diode elements mounted on the same circuit board, wherein molding resin is provided extending over plurality of the light- emitting diode elements to cover them.
2. The light-emitting diode light source as claimed in claim 1, wherein the light-emitting diode elements are arranged with a distance of 5mm or more.
3. The light-emitting diode light source as claimed in claim 1 or 2, wherein a reflector is formed immediately above the light- emitting diode elements .
4. The light-emitting diode light source as claimed in claim
3, wherein the reflector is one of a metal foil, metal film or white ink.
5. The light-emitting diode light source as claimed in claim
4, wherein the metal film is formed by any one of the methods of vapor deposition, sputtering or plating.
6. The light-emitting diode light source as claimed in claim 1, wherein protrusions are formed on the surface of molding resin.
7. The light-emitting diode light source as claimed in claim 1, wherein a resin film on the surface of which protrusions are formed is laminated onto molding resin.
8. The light-emitting diode light source as claimed in claim 6 or 7, wherein the protrusions are in a shape of square pyramid.
9. The light-emitting diode light source as claimed in claim 8, wherein the base the square pyramid is 2 mm or less and the height of which is half or less of the base.
10. The light-emitting diode light source as claimed in claim 6, wherein the total area of base of protrusions on the surface where the protrusions are formed is from 10 to 100% of the molding resin surface.
11. A method for producing the light-emitting diode light source as claimed in claim 1, comprising providing a molding frame on the circuit board so that the plural light-emitting diode elements are located in the molding frame, and providing molding resin extending over the plural light-emitting diode elements to cover them by filling molding resin in the molding frame.
12. A display unit using the light-emitting diode light source as claimed in any one of claims 1 to 10.
13. A lighting equipment using the light-emitting diode light source as claimed in any one of claims 1 to 10.
14. A liquid crystal display provided with the lighting equipment as claimed in claim 13.
PCT/JP2006/314938 2005-07-22 2006-07-21 Light-emitting diode light source Ceased WO2007011068A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005212247 2005-07-22
JP2005-212247 2005-07-22
US70350805P 2005-07-29 2005-07-29
US60/703,508 2005-07-29

Publications (1)

Publication Number Publication Date
WO2007011068A1 true WO2007011068A1 (en) 2007-01-25

Family

ID=37668935

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/314938 Ceased WO2007011068A1 (en) 2005-07-22 2006-07-21 Light-emitting diode light source

Country Status (1)

Country Link
WO (1) WO2007011068A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008043352A3 (en) * 2006-10-13 2008-12-04 Osram Gmbh Optoelectronic module, and method for the production thereof
WO2017161330A1 (en) * 2015-03-20 2017-09-21 Rohinni, LLC Method and apparatus for light diffusion
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
EP3540504A4 (en) * 2016-11-14 2020-07-15 Seoul Semiconductor Co., Ltd. DISPLAY DEVICE AND BACKLIGHT UNIT THEREFOR
CN111863785A (en) * 2019-04-26 2020-10-30 夏普株式会社 LED light source substrate and lighting device
US11043620B2 (en) 2016-12-26 2021-06-22 Nichia Corporation Light emitting device
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
EP4063716A4 (en) * 2019-12-31 2023-07-05 Suzhou Opple Lighting Co., Ltd. LIGHT EMITTING ARRANGEMENT AND LAMP

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324858U (en) * 1986-08-01 1988-02-18
JPS6359356U (en) * 1986-10-06 1988-04-20
JPS6371559U (en) * 1986-10-29 1988-05-13
JPH10294498A (en) * 1997-04-18 1998-11-04 Stanley Electric Co Ltd Method of manufacturing LED display
JP2002333847A (en) * 2001-05-10 2002-11-22 Mitsubishi Electric Engineering Co Ltd LED display
JP2003124528A (en) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd LED lighting device and card type LED lighting light source
JP2003294910A (en) * 2002-04-08 2003-10-15 Sanyo Electric Co Ltd Optical element and light source device
JP2004273122A (en) * 2003-03-04 2004-09-30 Abel Systems Inc Surface light emitting device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324858U (en) * 1986-08-01 1988-02-18
JPS6359356U (en) * 1986-10-06 1988-04-20
JPS6371559U (en) * 1986-10-29 1988-05-13
JPH10294498A (en) * 1997-04-18 1998-11-04 Stanley Electric Co Ltd Method of manufacturing LED display
JP2002333847A (en) * 2001-05-10 2002-11-22 Mitsubishi Electric Engineering Co Ltd LED display
JP2003124528A (en) * 2001-08-09 2003-04-25 Matsushita Electric Ind Co Ltd LED lighting device and card type LED lighting light source
JP2003294910A (en) * 2002-04-08 2003-10-15 Sanyo Electric Co Ltd Optical element and light source device
JP2004273122A (en) * 2003-03-04 2004-09-30 Abel Systems Inc Surface light emitting device

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008043352A3 (en) * 2006-10-13 2008-12-04 Osram Gmbh Optoelectronic module, and method for the production thereof
US10910354B2 (en) 2015-03-20 2021-02-02 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
US10566319B2 (en) 2015-03-20 2020-02-18 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
WO2017161330A1 (en) * 2015-03-20 2017-09-21 Rohinni, LLC Method and apparatus for light diffusion
US11152339B2 (en) 2015-03-20 2021-10-19 Rohinni, LLC Method for improved transfer of semiconductor die
US10157896B2 (en) 2015-03-20 2018-12-18 Rohinni, LLC Method and apparatus for light diffusion
US10170454B2 (en) 2015-03-20 2019-01-01 Rohinni, LLC Method and apparatus for direct transfer of semiconductor device die from a mapped wafer
US10242971B2 (en) 2015-03-20 2019-03-26 Rohinni, LLC Apparatus for direct transfer of semiconductor devices with needle retraction support
US10290615B2 (en) 2015-03-20 2019-05-14 Rohinni, LLC Method and apparatus for improved direct transfer of semiconductor die
US10325885B2 (en) 2015-03-20 2019-06-18 Rohinni, LLC Semiconductor device on string circuit and method of making the same
US11488940B2 (en) 2015-03-20 2022-11-01 Rohinni, Inc. Method for transfer of semiconductor devices onto glass substrates
US10361176B2 (en) 2015-03-20 2019-07-23 Rohinni, LLC Substrate with array of LEDs for backlighting a display device
US10373937B2 (en) 2015-03-20 2019-08-06 Rohinni, LLC Apparatus for multi-direct transfer of semiconductors
US11515293B2 (en) 2015-03-20 2022-11-29 Rohinni, LLC Direct transfer of semiconductor devices from a substrate
US11562990B2 (en) 2015-03-20 2023-01-24 Rohinni, Inc. Systems for direct transfer of semiconductor device die
US9985003B2 (en) 2015-03-20 2018-05-29 Rohinni, LLC Substrate with array of LEDs for backlighting a display device
US10490532B2 (en) 2015-03-20 2019-11-26 Rohinni, LLC Apparatus and method for direct transfer of semiconductor devices
US10615152B2 (en) 2015-03-20 2020-04-07 Rohinni, LLC Semiconductor device on glass substrate
US10615153B2 (en) 2015-03-20 2020-04-07 Rohinni, LLC Apparatus for direct transfer of semiconductor device die
US10636770B2 (en) 2015-03-20 2020-04-28 Rohinni, LLC Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other
US10622337B2 (en) 2015-03-20 2020-04-14 Rohinni, LLC Method and apparatus for transfer of semiconductor devices
US11069551B2 (en) 2016-11-03 2021-07-20 Rohinni, LLC Method of dampening a force applied to an electrically-actuatable element
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
EP3540504A4 (en) * 2016-11-14 2020-07-15 Seoul Semiconductor Co., Ltd. DISPLAY DEVICE AND BACKLIGHT UNIT THEREFOR
US11675229B2 (en) 2016-11-14 2023-06-13 Seoul Semiconductor Co., Ltd. Display apparatus and backlight unit thereof
US12078886B2 (en) 2016-11-14 2024-09-03 Seoul Semiconductor Co., Ltd. Display apparatus and backlight unit thereof
US11143913B2 (en) 2016-11-14 2021-10-12 Seoul Semiconductor Co., Ltd. Display apparatus and backlight unit thereof
US12449695B2 (en) 2016-11-14 2025-10-21 Seoul Semiconductor Co., Ltd. Display apparatus and backlight unit thereof
US11300830B2 (en) 2016-11-14 2022-04-12 Seoul Semiconductor Co., Ltd. Display apparatus and backlight unit thereof
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US11462433B2 (en) 2016-11-23 2022-10-04 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US11211532B2 (en) 2016-12-26 2021-12-28 Nichia Corporation Light emitting device
US11043620B2 (en) 2016-12-26 2021-06-22 Nichia Corporation Light emitting device
US10354895B2 (en) 2017-01-18 2019-07-16 Rohinni, LLC Support substrate for transfer of semiconductor devices
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11728195B2 (en) 2018-09-28 2023-08-15 Rohinni, Inc. Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate
US11367814B2 (en) 2019-04-26 2022-06-21 Sharp Kabushiki Kaisha LED light-source substrate and illumination device
CN111863785A (en) * 2019-04-26 2020-10-30 夏普株式会社 LED light source substrate and lighting device
EP4063716A4 (en) * 2019-12-31 2023-07-05 Suzhou Opple Lighting Co., Ltd. LIGHT EMITTING ARRANGEMENT AND LAMP

Similar Documents

Publication Publication Date Title
US7740373B2 (en) LED module for illumination
US7566912B2 (en) Light emitting diode package
KR101209759B1 (en) Semiconductor light emitting module and method for manufacturing the same
KR100819883B1 (en) Light emitting device package and its manufacturing method
US9859259B2 (en) Light emitting apparatus
EP2312656B1 (en) Light emitting apparatus and lighting system
CN101365907B (en) Illumination system and display device
EP2492983B1 (en) Light emitting device
JP6616088B2 (en) LED assembly and LED bulb using the LED assembly
EP2197048B1 (en) Light-emitting device
WO2007011068A1 (en) Light-emitting diode light source
US8476662B2 (en) Light emitting device, method for manufacturing the same, and backlight unit
KR20110108147A (en) Light emitting device package and light unit having same
JP2007053352A (en) Light emitting diode light source
US20110182054A1 (en) Light source module
JP2010129923A (en) Light-emitting member, light-emitting device, illumination device, backlight device and method for manufacturing light-emitting member
JP2007059894A (en) Light source with light emitting diode element
KR20120047061A (en) Light emitting device array, and backlight unit and display having the same
KR20110128693A (en) Light emitting device package and light unit having same
KR101082924B1 (en) Traffic light using led lighting source
TWI390762B (en) Light emitting diode light source
KR101468696B1 (en) Light emitting element
KR101006658B1 (en) Light emitting device mounting substrate, light emitting device mounting package and surface light source device
KR20150133499A (en) Led module
TWI440207B (en) The light emitting diode element is equipped with a light source

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06768372

Country of ref document: EP

Kind code of ref document: A1