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WO2007008992A3 - Procede et dispositif de depot continu de motif de materiau sur un substrat - Google Patents

Procede et dispositif de depot continu de motif de materiau sur un substrat Download PDF

Info

Publication number
WO2007008992A3
WO2007008992A3 PCT/US2006/027063 US2006027063W WO2007008992A3 WO 2007008992 A3 WO2007008992 A3 WO 2007008992A3 US 2006027063 W US2006027063 W US 2006027063W WO 2007008992 A3 WO2007008992 A3 WO 2007008992A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pattern
mask
order
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2006/027063
Other languages
English (en)
Other versions
WO2007008992A2 (fr
Inventor
Donald J Mcclure
Jeffrey H Tokie
Daniel H Carlson
James N Dobbs
John T Strand
Ronald P Swanson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2008521572A priority Critical patent/JP2009501280A/ja
Priority to EP06787025A priority patent/EP1902601A2/fr
Priority to CN200680025659A priority patent/CN100596256C/zh
Publication of WO2007008992A2 publication Critical patent/WO2007008992A2/fr
Publication of WO2007008992A3 publication Critical patent/WO2007008992A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0831—Machines for printing webs
    • B41F15/0836—Machines for printing webs by means of cylindrical screens or screens in the form of endless belts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/12—Screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Un motif de matériau est déposé en continu sur un substrat. Le substrat et un masque sont réunis en continu sur une partie de tambour où une source de dépôt éjecte le matériau. Des ouvertures ménagées sur le masque forment un motif, le matériau provenant de la source de dépôt traverse alors le motif du masque et s'accumule sur le substrat pour former le motif de matériau. A la fois l'allongement et la position transversale du substrat et du masque peuvent être contrôlés. Les éléments de motif du substrat et du masque peuvent être détectés de manière à ajuster l'allongement et/ou la position transversale du substrat et/ou du masque pour maintenir un alignement précis. Par ailleurs, les ouvertures peuvent présenter au moins une dimension de l'ordre de 100 microns maximum, ce qui permet de créer sur le substrat des caractéristiques dont les dimensions minimales sont égales ou inférieures à environ 100 microns.
PCT/US2006/027063 2005-07-12 2006-07-11 Procede et dispositif de depot continu de motif de materiau sur un substrat Ceased WO2007008992A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008521572A JP2009501280A (ja) 2005-07-12 2006-07-11 基材上に材料模様を連続的に付着させるための装置及び方法
EP06787025A EP1902601A2 (fr) 2005-07-12 2006-07-11 Procede et dispositif de depot continu de motif de materiau sur un substrat
CN200680025659A CN100596256C (zh) 2005-07-12 2006-07-11 将材料图样连续沉积在基底上的设备和方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17941805A 2005-07-12 2005-07-12
US11/179,418 2005-07-12

Publications (2)

Publication Number Publication Date
WO2007008992A2 WO2007008992A2 (fr) 2007-01-18
WO2007008992A3 true WO2007008992A3 (fr) 2007-05-24

Family

ID=37637931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/027063 Ceased WO2007008992A2 (fr) 2005-07-12 2006-07-11 Procede et dispositif de depot continu de motif de materiau sur un substrat

Country Status (4)

Country Link
EP (1) EP1902601A2 (fr)
JP (1) JP2009501280A (fr)
CN (1) CN100596256C (fr)
WO (1) WO2007008992A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080171422A1 (en) * 2007-01-11 2008-07-17 Tokie Jeffrey H Apparatus and methods for fabrication of thin film electronic devices and circuits
KR101504388B1 (ko) 2008-06-26 2015-03-19 가부시키가이샤 니콘 표시소자의 제조방법 및 제조장치
US8339573B2 (en) 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
US20110065282A1 (en) * 2009-09-11 2011-03-17 General Electric Company Apparatus and methods to form a patterned coating on an oled substrate
KR101201755B1 (ko) * 2010-11-02 2012-11-15 삼성에스디아이 주식회사 진공 증착 장치 및 이를 이용한 진공 증착 방법
JP5736857B2 (ja) * 2011-03-09 2015-06-17 凸版印刷株式会社 成膜装置
JP5733507B2 (ja) * 2011-03-17 2015-06-10 凸版印刷株式会社 成膜方法
JP5937876B2 (ja) * 2012-04-18 2016-06-22 名古屋メッキ工業株式会社 めっき繊維製造装置及び方法
CN103668047A (zh) * 2012-09-03 2014-03-26 香港纺织及成衣研发中心有限公司 真空镀膜图案生成装置及方法
EP3184140B1 (fr) * 2015-12-21 2021-10-06 Dentsply IH AB Cathéters avec trous de drainage biseautés ainsi que méthode et outil pour former ces trous
CN112226730A (zh) * 2020-09-30 2021-01-15 广州国显科技有限公司 柔性掩膜版和蒸镀装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2248039A (en) * 1990-08-31 1992-03-25 Ricoh Kk Printer using a stencil
US5395643A (en) * 1991-09-18 1995-03-07 International Business Machines Corporation Method of and apparatus for depositing solder on a printed circuit board
WO2001035703A1 (fr) * 1999-11-08 2001-05-17 Speedline Technologies, Inc. Imprimante a braser ameliorees
US20050109811A1 (en) * 2003-11-21 2005-05-26 Swanson Ronald P. Method and apparatus for controlling a moving web

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2248039A (en) * 1990-08-31 1992-03-25 Ricoh Kk Printer using a stencil
US5395643A (en) * 1991-09-18 1995-03-07 International Business Machines Corporation Method of and apparatus for depositing solder on a printed circuit board
WO2001035703A1 (fr) * 1999-11-08 2001-05-17 Speedline Technologies, Inc. Imprimante a braser ameliorees
US20050109811A1 (en) * 2003-11-21 2005-05-26 Swanson Ronald P. Method and apparatus for controlling a moving web

Also Published As

Publication number Publication date
EP1902601A2 (fr) 2008-03-26
WO2007008992A2 (fr) 2007-01-18
CN100596256C (zh) 2010-03-24
CN101223834A (zh) 2008-07-16
JP2009501280A (ja) 2009-01-15

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