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WO2007074694A1 - Filtre de couleur, son procédé de fabrication et dispositif d’affichage à cristaux liquides - Google Patents

Filtre de couleur, son procédé de fabrication et dispositif d’affichage à cristaux liquides Download PDF

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Publication number
WO2007074694A1
WO2007074694A1 PCT/JP2006/325367 JP2006325367W WO2007074694A1 WO 2007074694 A1 WO2007074694 A1 WO 2007074694A1 JP 2006325367 W JP2006325367 W JP 2006325367W WO 2007074694 A1 WO2007074694 A1 WO 2007074694A1
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WO
WIPO (PCT)
Prior art keywords
color filter
exposure
alloy
photosensitive resin
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/325367
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English (en)
Japanese (ja)
Inventor
Shigeaki Ohtani
Akira Hatakeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2007551919A priority Critical patent/JPWO2007074694A1/ja
Priority to CN2006800491098A priority patent/CN101346646B/zh
Publication of WO2007074694A1 publication Critical patent/WO2007074694A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/206—Filters comprising particles embedded in a solid matrix
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00634—Production of filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/09—Ink jet technology used for manufacturing optical filters

Definitions

  • the present invention relates to a liquid crystal display device used for a small mopile device, a large display, etc., a color filter used for the liquid crystal display device, and a manufacturing method thereof.
  • Liquid crystal display devices and organic EL display devices are very compact and have performance equivalent to or higher than that of CRT displays, which have been the mainstream in the past, so in recent years they are replacing CRT display devices.
  • a color image displayed on such a display device light that has passed through a substrate made of a plurality of color filters is directly colored into each color constituting the color filter, and the plurality of colored lights are image-like. It is formed by being synthesized.
  • a color image is generally formed by pixels of three colors of red (R), green (G), and blue (B) constituting the color filter.
  • These pixels can be manufactured by a method in which a resin layer is formed on a substrate, and exposure and development are repeated for the number of colors.
  • the exposure has been performed by a method of forming a pattern by exposure using an exposure mask with a mercury lamp or the like.
  • maskless exposure using a laser or the like has been performed.
  • a laser such as a semiconductor laser
  • a method using a polygon mirror as a method of relative scanning while modulating light see, for example, Patent Document 1
  • DMD digital 'micromirror'
  • 'devices' see, for example, Patent Document 2
  • a black matrix for a display device having a high light-shielding property has been manufactured by using a metal.
  • the thin film has been used. This is done by applying a photoresist on a metal thin film such as chromium formed by vapor deposition or sputtering, and then exposing and developing the photoresist using a photomask having a light-shielding film pattern for a display device. This is due to a method in which the exposed metal thin film is etched and finally the photoresist remaining on the metal thin film is peeled and removed (see, for example, Non-Patent Document 1).
  • Patent Document 1 JP 2002-523905 A
  • Patent Document 2 Japanese Patent Laid-Open No. 2004-56080
  • Patent Document 3 Japanese Patent Application Laid-Open No. 62-9301
  • Patent Document 4 Japanese Patent Laid-Open No. 2004-240039
  • Patent Document 5 Japanese Unexamined Patent Application Publication No. 2005-17322
  • Non-Patent Document 1 "Color TFT LCD” p.218-p.220, published by Kyoritsu Publishing Co., Ltd. (April 1997, April 10)
  • the present invention has been made in view of the above-mentioned conventional drawbacks.
  • an object of the present invention is to increase the exposure sensitivity in this process by a method for producing a color filter including a step of curing a layer of a photosensitive resin composition by maskless exposure.
  • Another object of the present invention is to provide a color filter manufacturing method capable of widening the development latitude, a high-intensity color filter obtained by the manufacturing method, and a liquid crystal display device using the color filter.
  • the first aspect of the present invention includes at least one of a resin and a precursor thereof, particles made of metal or alloy power, and composite particles made of metal and alloy or alloy and alloy.
  • the two-dimensional layer of the photosensitive resin composition also contains two types of spatially modulated light based on the image data using a two-dimensional spatial light modulation device. image And a step of forming a dark color separation image wall by exposure for forming a color filter.
  • a second aspect of the present invention provides a color filter manufactured by the method for manufacturing a color filter according to the first aspect of the present invention.
  • a third aspect of the present invention provides a liquid crystal display device using the color filter according to the second aspect of the present invention.
  • a method for producing a color filter including a step of curing a layer of a photosensitive resin composition by maskless exposure, and increasing the exposure sensitivity in the step.
  • a color filter manufacturing method capable of widening the development latitude, a high-intensity color filter obtained by the manufacturing method, and a liquid crystal display device using the color filter can be provided.
  • FIG. 1 is a perspective view showing an appearance of an exposure unit according to the present invention.
  • FIG. 2 is a perspective view showing a configuration of a scanner of an exposure unit according to the present invention.
  • FIG. 3A is a plan view showing an exposed area formed on a photosensitive material.
  • FIG. 3B is a diagram showing an arrangement of exposure areas by each exposure head.
  • FIG. 4 is a perspective view showing a schematic configuration of an exposure head according to the present invention.
  • 5A is a cross-sectional view in the sub-scanning direction along the optical axis showing the configuration of the exposure head shown in FIG.
  • FIG. 5B is a side view of FIG. 5A.
  • FIG. 6 is a partially enlarged view showing the configuration of a digital micromirror device (DMD).
  • DMD digital micromirror device
  • FIG. 7A is an explanatory diagram for explaining the operation of DMD.
  • FIG. 7B is an explanatory diagram for explaining the operation of the DMD.
  • FIG. 8A is a diagram showing a scanning trajectory of a reflected light image (exposure beam) by each micromirror when the DMD is not tilted.
  • FIG. 8B is a diagram showing a scanning trajectory of the exposure beam when the DMD is tilted.
  • FIG. 9A is a perspective view showing a configuration of a fiber array light source.
  • FIG. 9B is a partially enlarged view of FIG. 9A.
  • FIG. 9C is a plan view showing an array of light emitting points in the laser emitting section.
  • FIG. 9D is a plan view showing an array of light emitting points in the laser emitting portion.
  • FIG. 10 is a diagram showing a configuration of a multimode optical fiber.
  • FIG. 11 is a plan view showing a configuration of a multiplexed laser light source.
  • FIG. 12 is a plan view showing a configuration of a laser module.
  • FIG. 13 is a side view showing the configuration of the laser module shown in FIG.
  • FIG. 14 is a partial side view showing the configuration of the laser module shown in FIG.
  • FIG. 15A is a sectional view showing the depth of focus in the exposure apparatus.
  • FIG. 15B is a cross-sectional view showing the depth of focus in the exposure apparatus.
  • FIG. 16A is a diagram showing an example of a DMD usage area.
  • FIG. 16B is a diagram showing an example of a DMD usage area.
  • FIG. 17A is a side view of the case where the DMD usage area is appropriate.
  • FIG. 17B is a sectional view in the sub-scanning direction along the optical axis in FIG. 17A.
  • FIG. 18 is a diagram for explaining the pattern forming apparatus used in the examples.
  • the method for producing a color filter of the present invention comprises at least one of a resin and a precursor thereof, particles made of a metal or an alloy, and at least one kind of composite particles made of a metal and an alloy or an alloy and an alloy (hereinafter simply referred to as a “particle”).
  • the layer of the photosensitive resin composition containing “metal particles, etc.”) may be used to emit light based on image data using a spatial light modulation device arranged in two dimensions.
  • a step of curing by exposure hereinafter also referred to as “maskless exposure” for forming a two-dimensional image by performing relative scanning while modulating.
  • the photosensitive resin composition instead of conventional carbon black, particles having a metal or alloy force and a composite comprising a metal and an alloy or an alloy and an alloy are used. At least one of the particles is contained. At the same time, pattern formation by maskless exposure is performed. As a result, compared with carbon black, the absorption of laser light with a short wavelength of, for example, 405 nm is reduced, and high sensitivity and a wide range of image latitude can be achieved.
  • the photosensitive resin composition according to the present invention will be described in detail below.
  • the photosensitive resin composition according to the present invention includes at least one of a resin and a precursor thereof, particles made of a metal or an alloy, and composite particles made of a metal and an alloy or an alloy and an alloy. And may contain other components according to the purpose, application and other needs. Each of these components will be specifically described.
  • the definition of metal is as described in Iwanami Physical and Chemical Dictionary, 4th edition (published by Iwanami Shoten in 1987).
  • the silver-tin alloy in the present invention is a mixture of silver and tin at the atomic level, and includes solid solutions, eutectics, compounds, intermetallic compounds, and the like. Alloys are described in, for example, Iwanami Physical and Chemical Dictionary, 4th edition (published by Iwanami Shoten in 1987).
  • the "metal particles and the like" are used in place of carbon black as a coloring material for the dark color separation wall, and those having a high black density are preferably used. From such a point of view, high concentration can be achieved, color-eutrality is high, and metal particles are preferred.
  • silver, tin, gold, copper, noradium, tungsten, titanium, etc. can be preferably used, among which metals of Group 3 to Group 14 of the long-period type periodic table are preferred.
  • Silver and tin are preferable in terms of safety, cost, and the like.
  • a silver-tin alloy is particularly preferable among the above-mentioned alloys of a plurality of types of metals.
  • carbon black having a high black density absorbs a lot of light at a short wavelength such as 405 nm. Sensitivity can be used.
  • silver tin composite particles that are particularly preferable among “metal particles and the like" will be described as an example.
  • the photosensitive resin composition according to the present invention not only contains one silver tin composite particle alone, but may also be composed of two or more silver tin composite particles having different Ag ratios. Good.
  • the silver-tin composite particles can be formed by being alloyed by a general method such as heating, melting and mixing in a crucible or the like.
  • the melting point of Ag is 900 ° C
  • the melting point of Sn is around 200 ° C, and there is a large difference between the melting points of the two, and an extra step of micronization after compounding (eg alloying) is required. Is preferred.
  • the Ag compound and Sn compound are mixed and reduced, and the metal Ag and the metal Sn are precipitated at the same close position to form a composite (for example, alloying) and fine particles. It is a method to achieve at the same time. Since Ag tends to be precipitated immediately before Sn as soon as it is reduced, it is preferable to control the precipitation timing by making Ag and Z or Sn into a complex salt.
  • Examples of the Ag compound include silver nitrate (AgNO), silver acetate (Ag (CHCOO)), and perchloric acid.
  • Silver (AgCIO ⁇ ⁇ 0), etc. are preferred. Of these, silver acetate is particularly preferred.
  • Sn compound examples include stannous chloride (SnCl), stannic chloride (SnCl), and stannous acetate.
  • a method using a reducing agent for the reduction, a method using a reducing agent, a method of reducing by electrolysis, and the like are preferable.
  • the former method using a reducing agent is preferable in that fine particles can be obtained.
  • the reducing agent include hydroquinone, catechol, noraminophenol, paraphenol-diamine, hydroxyacetone and the like.
  • hydroxyacetone is particularly preferable because it volatilizes and does not readily adversely affect the display device.
  • the silver-tin composite particles are preferably particles having the following physical properties, particle size, particle shape and the like!
  • the silver-tin composite particles according to the present invention are preferably particles having a melting point of 240 to 400 ° C as measured by differential scanning calorimetry (DSC). Since the melting point is within this range, it exhibits better thermal stability than metal Ag (melting point: 950 ° C) and metal Sn (melting point: 230 ° C).
  • the melting property (melting point) of AgSn alloy 20 mg of AgSn alloy as a sample was set in the measurement cell of DSC (SSC / 5200, manufactured by Seiko Instruments Inc.), and the temperature drop crystallization peak by DSC was measured. Measured by cooling from 200 ° C to room temperature at a temperature drop rate of 10 ° CZ.
  • the silver tin composite particles have a number average particle size of 20 to 700 nm, more preferably 30 to 200 nm, particularly preferably 40 to: LOOnm. Special number average particle size In the above range, unlike the metal Sn particles, any particle diameter has a black hue. If the number average particle size exceeds 700 nm, the surface shape may be deteriorated when the film is formed. If the number average particle size is less than 20 nm, the blackness may be reduced and yellowish.
  • the number average particle size is measured as follows using a photograph obtained by transmission electron microscopy [EM-2010 (manufactured by JEOL Ltd.)].
  • the particle shape of the "metal particles, etc.” may be any shape such as a cubic shape, a high aspect ratio, a medium aspect, and a needle shape without particular limitations.
  • salts, organic substances, and other elements may be included.
  • the amount of “metal particles and the like” in the photosensitive resin composition may be selected appropriately according to the purpose and application.
  • the viewpoint power to obtain a high light-shielding property is the total solid content of the composition. (Volume) is preferably 5 to 20% by volume, more preferably 7 to 15% by volume, and most preferably 8 to 15% by volume.
  • the amount of the silver-tin composite particles is particularly in the above range, the light reflectance is suppressed, and a high light-shielding property can be obtained with a thin film having a high black density. In particular, a vivid display image with high contrast can be obtained as a dark color separation wall of a color filter.
  • the amount of silver-tin composite particles is less than 5% by volume, the reflectivity is high and the display contrast may be impaired. When it exceeds 20% by volume, the film thickness when deposited is thicker than Lm. May be
  • the photosensitive resin composition according to the present invention contains at least one resin and its precursor.
  • the resin is a polymer component as a binder, and the precursor of the resin is polymerized Is a component constituting rosin and includes so-called monomers and oligomer components.
  • the photosensitive resin composition according to the present invention comprises one or two or more kinds selected from resin and its precursors, thereby constituting a photosensitive polymerizable composition, and having a photosensitive property. Granted.
  • the photosensitive resin composition contains a photopolymerization initiator and an ethylenically unsaturated double bond as components other than the above, and a monomer that undergoes addition polymerization with light (hereinafter referred to as "photopolymerizable monomer”). Etc.) may be contained.
  • the photosensitive resin composition can be developed with an aqueous alkaline solution and can be developed with an organic solvent. From the viewpoint of safety and the cost of the developer, those that can be developed with an alkaline aqueous solution are preferred.
  • the photosensitive resin composition may be a negative type in which a part that receives radiation such as light or electron beam is cured, or a positive type in which a radiation non-receptive part is cured.
  • Examples of the positive photosensitive resin composition include those using novolac-based resin.
  • novolac-based resin For example, an alkali-soluble novolac rosin system described in JP-A-7-43899 can be used.
  • a positive photosensitive resin described in JP-A-6-148888 that is, an alkali-soluble resin described in the publication, 1,2-naphthoquinone diazide sulfonic acid ester as a photosensitizer,
  • a photosensitive resin containing a mixture with the thermosetting agent described in the publication can be used. In this case, it is configured to be thermosetting.
  • the composition described in JP-A-5-262850 can also be used.
  • Examples of the negative photosensitive resin composition include a photosensitive resin comprising a negative diazo resin and a binder, a photopolymerizable composition, a photosensitive resin composition comprising an azide compound and a binder, cinnamon Examples include acid-type photosensitive resin compositions. Among them, particularly preferred is a photopolymerizable composition containing a photopolymerization initiator, a photopolymerizable monomer and a binder as basic constituent elements. As the photopolymerizable composition, “polymerizable compound B”, “polymerization initiator C”, “surfactant”, “adhesion aid” and other compositions described in JP-A-11-133600 can be used. .
  • a soluble binder an alkali-soluble thermoplastic resin such as an alkali-soluble thermoplastic resin
  • a soluble binder a photopolymerization initiator, and an ethylenically unsaturated double bond-containing monomer (photopolymerizable monomer) capable of addition polymerization by light irradiation.
  • alkali-soluble binder examples include polymers having a carboxylic acid group in the side chain, such as JP-A-59-44615, JP-B-54-34327, JP-B-58-12577, and JP-B Methacrylic acid copolymer, acrylic acid copolymer, itaconic acid copolymer, crotonic acid copolymer described in JP-A-54-25957, JP-A-59-53836, and JP-A-59-71048 Maleic acid copolymer, partially esterified maleic acid copolymer, and the like.
  • the cellulose derivative which has a carboxylic acid group in a side chain can also be mentioned.
  • a polymer obtained by adding a cyclic acid anhydride to a polymer having a hydroxyl group can also be preferably used.
  • the alkali-soluble binder is preferably selected from those having an acid value in the range of 30 to 400 mg KOHZg and a weight average molecular weight in the range of 1000 to 300,000! /.
  • an alkali-insoluble polymer may be added in a range that does not adversely affect developability and the like in order to improve various performances, for example, the strength of the cured film.
  • the alkali-insoluble polymer include alcohol-soluble nylon and epoxy resin.
  • the alkali-soluble binder is usually 10 to 95 mass%, more preferably 20 to 90 mass%, based on the total solid content of the photosensitive resin composition. In the range of 10 to 95% by mass, the adhesiveness of the photosensitive resin layer is not too high, and the strength and photosensitivity of the formed layer are not inferior.
  • Examples of the photopolymerization initiator include vicinal polycarbonate-Louis compound described in US Pat. No. 2,367,660, an acyloin ether compound described in US Pat. No. 2448828, and US Pat. No. 2,722,512.
  • Nzothiazole compound and trihalomethyl-s triazine compound, trihalomethyl-s triazine compound described in US Pat. No. 4,423,985, trihalomethyl oxadiazole compound described in US Pat. No. 4,212,976 Thing etc. are mentioned. Particularly preferred are trihalomethyl-s triazine, trihalomethyl oxadiazole, and triaryl imidazole dimer.
  • polymerization initiator C described in JP-A-11-133600 can also be mentioned as a preferable example.
  • the photopolymerization initiator may be used alone or in combination of two or more. It is particularly preferable to use two or more.
  • the content of the photopolymerization initiator with respect to the total solid content of the photosensitive resin composition is generally 0.5 to 20% by mass, preferably 1 to 15% by mass.
  • the exposure sensitivity is high, the discoloration such as yellowing is small, the display characteristics are good, and examples of combinations of photopolymerization initiators include a diazole photopolymerization initiator and a triazine photopolymerization initiator. Combinations are mentioned. Among them, 2 trichloromethyl 5- (p-styrylstyryl)-1, 3, 4-oxoxadiazole and 2, 4 bis (trichloromethyl) 6- [4'- (N, N bistokincarboromethyl) amino-3 ' —Bromophenol] The best combination with striazine.
  • the ratio of these photopolymerization initiators is a mass ratio of diazole-based Z-triazine-based, preferably 95/5 force, 20/80, more preferably 90/10 force, 30/70, and most. It is preferable that 80/20 force is 60 ⁇ 40.
  • photopolymerization initiators examples include those described in JP-A-1-152449, JP-A-1-254918, and JP-A-2-153353.
  • the ratio of "metal particles etc.” in the total solid content of the photosensitive resin composition according to the present invention is around 5 to 20% by volume
  • a coumarin compound is mixed with the photopolymerization initiator.
  • the effect of high exposure sensitivity, low discoloration such as yellowing, and good display characteristics can be obtained.
  • the coumarin-based compound 7- [2-[4- (3 hydroxymethylbiperidino) 6-jetylamino] triaziramino] -3-phenol-coumarin is the best.
  • the ratio of these photopolymerization initiators and coumarin compounds is the ratio between photopolymerization initiators and coumarin compounds.
  • the mass ratio of the compound is preferably 20Z80 force to 80Z20, more preferably 30 ⁇ 70 to 70 ⁇ 30, most preferably 40 ⁇ 60 force is also 60 ⁇ 40.
  • the photopolymerization initiator that can be used in the present invention is not limited to these and can be appropriately selected from known ones.
  • the photopolymerization initiator is generally 0.5 to 20% by mass, preferably 1 to 15% by mass, based on the total solid content of the photosensitive resin composition. When the content is within the above range, the photosensitivity and image strength can be prevented from being lowered, and the performance can be sufficiently improved.
  • Examples of the photopolymerizable monomer include compounds having a boiling point of 100 ° C or higher at normal pressure.
  • monofunctional (meth) acrylates such as polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate and funoxychetyl (meth) acrylate; polyethylene glycol di (meth) acrylate, polypropylene glycol di ( (Meth) attalylate, trimethylol ethane tritalylate, trimethylol propane triatalylate, trimethylol propane diatalylate, neopentyl glycol di (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (Meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, he
  • urethane acrylates disclosed in JP-B-48-41708, JP-A-50-6034, JP-A-51-37193, JP-A-48-64183, JP-B-49 4319 Polyfunctional talates and metatalates such as polyester acrylates and epoxy acrylates which are reaction products of epoxy resin and (meth) acrylic acid disclosed in each publication of No. 1 and 52-30490 Can be mentioned.
  • trimethylolpropane tri (meth) acrylate pentaerythritol tetra (meth) acrylate, dipentaerythritol hex (meth) acrylate, and dipentaerythritol penta (meth) acrylate are preferred. That's right.
  • the photopolymerizable monomer may be used alone or in combination of two or more.
  • the content of the photopolymerizable monomer with respect to the total solid content of the photosensitive resin composition is generally 5 to 50% by mass, and preferably 10 to 40% by mass. When the content is within the above range, the photosensitivity and image strength are not decreased, and the adhesive property of the photosensitive resin layer is not excessive.
  • the photosensitive resin composition further contains a thermal polymerization inhibitor in addition to the components.
  • the thermal polymerization inhibitor include hydroquinone, p-methoxyphenol, p-t-butylcatechol, 2,6-di-t-butyl-p-cresol, ⁇ -naphthol, pyrogallol and other aromatic hydroxy compounds, benzoquinone , Quinones such as ⁇ -toluquinone, naphthylamine, pyridine, amines such as ⁇ toluidine, phenothiazine, aluminum salt or ammonium salt of ⁇ ⁇ -troso-phenol hydroxylamine, chloranil, nitrobenzene, 4, 4 Examples include '-thiobis (3-methyl-6t-butylphenol), 2,2'-methylenebis (4-methyl-6t-butylphenol), and 2 mercaptobenzimidazole.
  • the photosensitive resin composition may further comprise known additives as necessary, such as plasticizers, surface active agents, adhesion promoters, dispersants, plasticizers, anti-sagging agents, and leveling agents. Antifoaming agents, flame retardants, brighteners, solvents and the like can be added.
  • adhesion promoter examples include alkylphenol Z formaldehyde novolak resin, polybutyl ether, polybutyl isobutyl ether, polybutyl butyral, polyisobutylene, styrene butadiene copolymer rubber, butyl rubber, vinyl chloride.
  • examples thereof include vinyl acetate copolymer, chlorinated rubber, acrylic resin-based adhesive, aromatic, aliphatic or alicyclic petroleum resin, and silane coupling agent.
  • an aqueous resin composition may be used as the photosensitive resin composition.
  • photosensitive resin composition include those described in paragraphs [0015] to [0023] of JP-A-8-271727, and those sold by the public are, for example, “Toyo Gosei Kogyo Co., Ltd.” SPP—M20 ”and the like.
  • the photosensitive resin composition according to the present invention can be suitably configured using a solvent.
  • the solvent is not particularly limited, for example, water, toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, acetone, methyl alcohol, n -propyl alcohol, 2-propyl alcohol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate.
  • Various compounds such as cyclohexanone, cyclohexanol, ethyl lactate, methyl lactate, and force prolatatam can be used.
  • two or more solvents may be used in combination.
  • the dark color separation wall is prepared by preparing the above photosensitive resin composition, applying the composition, and drying the resin layer (photosensitive resin layer). And a transfer material provided with a layer of the composition, and transferring the layer to form a photosensitive resin layer. It may be formed by any method of patterning this (transfer method). In the present invention, the patterning method employs maskless exposure, which will be described in detail later.
  • the resin layer (including the photosensitive resin layer) can be suitably formed by applying the photosensitive resin composition according to the present invention by a known coating method and drying it.
  • the coating is performed using a slit-like nozzle having a slit-like hole in a portion for discharging the liquid.
  • JP-A-2004-89851, JP-A-2004-17043, JP-A-2003-170098, JP-A-2003-164787, JP-A-2003-10767, Slit-shaped nozzles and slit coaters described in Kaikai 2002-79163 and JP-A-2001-310147 are preferably used.
  • the resin layer may be formed by applying a solution of the photosensitive resin composition according to the present invention to a coating machine such as a spinner, a wheeler, a roller coater, a curtain coater, a knife coater, a wire coater, or an Xestrada radar. It can be formed by applying 'drying.
  • the photosensitive resin layer of the present invention described later is used to transfer the photosensitive resin layer onto the substrate constituting the final support, whereby the photosensitive resin is transferred onto the substrate.
  • a fat layer can be formed.
  • the dark color separation wall can be prepared by patterning a layer formed using the photosensitive resin composition or a photosensitive transfer material described later. it can.
  • the film thickness of the dark color separation wall is preferably about 0.2 to about LO / z m, more preferably about 0.5 to 5 / ⁇ ⁇ or less.
  • the dark color separation wall according to the present invention is preferably a film in which, for example, when AgSn alloy particles are included, "metal particles or the like" in which the proportion of Ag is 30 to 80 mol% is dispersed. As a result, a high optical density (4.0 or higher) can be obtained with a thin film.
  • metal particles etc.” at the time of dispersion is not particularly limited! However, it is preferable that “metal particles etc.” exist in a stable dispersion state.
  • thiol group-containing compounds, polyethylene oxide group-containing compounds, amino acids or derivatives thereof, peptide compounds, polysaccharides and natural polymers derived from polysaccharides, synthetic polymers, and gels derived from these are used as dispersing agents. Can be used.
  • the photosensitive resin composition according to the present invention is applied to a substrate to form a photosensitive resin layer. Thereafter, the maskless exposure and development is performed to remove the photosensitive resin layer other than the pattern forming the black matrix, thereby forming a pattern to obtain a black matrix.
  • a protective layer can be formed by forming a layer having the same composition as an intermediate layer described later on the photosensitive resin layer. The application is preferably performed using a slit nozzle or a slit coater.
  • the second method is a method based on a transfer method using a photosensitive transfer material. That is, after at least the photosensitive resin layer is transferred onto the substrate (that is, the final support) using the photosensitive transfer material, and at least the photosensitive resin layer transferred onto the substrate is subjected to maskless exposure in a pattern. Then, the exposed photosensitive resin layer is developed to remove unnecessary portions (portions that do not constitute the black matrix that is the dark color separation wall), and at least the photosensitive resin layer after the development processing is heated. This is a method of performing a beta treatment.
  • the photosensitive transfer material in which the photosensitive resin layer according to the present invention is formed on a light-transmitting substrate is disposed so that the photosensitive resin layer of the photosensitive transfer material is in contact with the photosensitive transfer material. And paste them together.
  • the photosensitive resin layer is exposed, developed and patterned to form a black matrix. This method does not require a cumbersome process and is low in cost.
  • a substrate on which the black matrix (dark color separation wall) according to the present invention is formed can be obtained, and red (R), green (G), and blue (B) are formed on the substrate.
  • a color filter can be manufactured by providing the colored pixels.
  • (A) A method in which a photosensitive resin layer colored R, G or B is formed on a substrate with a light-shielding film, and the operation of exposing and developing the same is repeated for the number of desired colors. It can produce by a well-known method.
  • the colored pixels are formed by the step (B) of applying a colored liquid composition containing a pigment of any one of red, green, and blue by the inkjet method. Below, the said process is demonstrated.
  • the method (A) the same method as the following dark separation wall forming method can be used.
  • a colored liquid composition containing any one of red, green, and blue pigments is liquid-coated by an inkjet method. It is preferably formed by applying droplets.
  • the dark color separation wall is made high in order to prevent color mixing, the position accuracy of the dark color separation wall can be increased and high luminance can be maintained.
  • a colored liquid composition for example, RGB pixels
  • two or more colors for example, RGB pixels
  • the colored liquid composition is caused to enter the voids of the dark color separation wall to form a plurality of pixels having two or more colors.
  • the means for fixing the shape of the dark color separation wall before forming each pixel in this way is not particularly limited, and examples thereof include the following.
  • Heat treatment is performed at a relatively low temperature.
  • Heat treatment here has a dark color separation wall This means that the substrate to be heated is heated in an electric furnace or dryer, or is irradiated with an infrared lamp.
  • an ink jet system used in the present invention there are a method in which charged ink is continuously ejected and controlled by an electric field, a method in which ink is ejected intermittently using a piezoelectric element, and an ink is intermittently heated by using its foaming.
  • Various methods can be employed, such as a method of spraying on the surface.
  • the ink used can be oily or water-based.
  • the colorant contained in the ink can be used for both dyes and pigments, and the use of pigments is more preferable from the viewpoint of durability.
  • a coating-type colored ink colored resin composition, for example, described in JP-A-2005-3861 [0034] to [0063]) or JP-A-10-195358, which is used for producing a known color filter.
  • the inkjet composition described in [0009] to [0026] can also be used.
  • a component that is cured by heating or cured by energy rays such as ultraviolet rays may be added to the ink in the present invention.
  • Various thermosetting resins are widely used as components that cure by heating.
  • components that are cured by energy rays include those obtained by adding a photoinitiator to an attalylate derivative or a metatalylate derivative.
  • attalylate derivatives and metatalylate derivatives are preferably water-soluble, and even those that are sparingly soluble in water can be used by emulsion.
  • a photosensitive resin composition containing a colorant such as the following pigment can be preferably used.
  • thermosetting ink for a color filter containing at least a binder and a bifunctional to trifunctional epoxy group-containing monomer can also be suitably used.
  • a known pigment is used in combination with the above metal particles. Can be used.
  • the pigment is preferably uniformly dispersed in the photosensitive resin composition.
  • pigment used in the present invention include those having the color index (C.I.) number described in the pigment.
  • silica particles and the like are also included in this pigment.
  • the ratio of the pigment in the solid content of the photosensitive resin composition is preferably 10 to 70% by mass from the viewpoint of sufficiently shortening the development time. Is more preferably 20 to 55% by mass.
  • Examples of the known pigment include, for example, the pigment described in JP-A-2005-17716, paragraph No. 0038, et al. 0040, the pigment described in JP-A-2005-361447, paragraph No. 0068, et al., 0072, And the pigments described in JP-A-2005-17521, paragraphs 0080 to 0088 are preferable.
  • black pigment examples include carbon black, titanium black, iron oxide, titanium oxide, graphite, and the like. Among these, carbon black is preferable.
  • the pigment is preferably used as a dispersion.
  • This dispersion can be prepared by adding and dispersing a composition obtained by previously mixing the pigment and the pigment dispersant in an organic solvent (or vehicle).
  • the vehicle is a portion of a medium that disperses a pigment when the paint is in a liquid state, a portion that is liquid and binds to the pigment and hardens the coating film (binder), and dissolves and dilutes the medium.
  • Component (organic solvent) The disperser used for dispersing the pigment is not particularly limited. For example, it is described in Kazuzo Asakura, “Encyclopedia of Pigments”, first edition, Asakura Shoten, 2000, page 438.
  • Known dispersing machines such as Ronole Reminore, Atrider, Super Mill, Dizonoleva, Homomixer, Sand Mill and the like. Further, by mechanical grinding as described on page 310 of the document, a fine powder frame can be obtained using frictional force.
  • the pigment used in the present invention preferably has a number average particle size of 0.001 to 0.1 l ⁇ m and more preferably 0.01 to 0.08 m from the viewpoint of dispersion stability.
  • the number average particle diameter of the pigment is 0.1 ⁇ m or less, the polarization is not canceled by the pigment, so the contrast is improved, which is preferable.
  • the term “particle size” as used herein refers to the diameter when the electron micrograph image of a particle is a circle of the same area, and “number average particle size” refers to the above-mentioned particle size for a number of particles. This means the average value of 100 pieces.
  • a method for forming a photosensitive resin layer on a substrate in particular, (a) a method of applying the photosensitive resin composition of the present invention described above by a known application method (application method), (b) an already described method A method (transfer method) in which the photosensitive resin transfer material of the present invention is used and affixed and transferred using a laminator or the like is suitable.
  • a slit-shaped nozzle or a slit coater is used for applying the composition.
  • Preferable specific examples of the slit-shaped nozzle and the slit coater are as described later.
  • a photosensitive transfer material is used, and the photosensitive resin layer formed in a film shape is applied to the substrate surface by applying pressure or heat pressing with a heated or Z or pressurized roller or flat plate, and further peeling.
  • Specific examples include laminators and laminating methods described in JP-A-7-110575, JP-A-11-77942, JP-A-2000-334836, and JP-A-2002-148794. From the viewpoint, it is preferable to use the method described in JP-A-7-110575.
  • a transparent substrate is suitable.
  • the well-known glass plate of this, or a plastic film etc. can be mentioned.
  • the substrate is subjected to a coupling treatment in advance to improve the adhesion between the photosensitive resin composition of the present invention or the photosensitive resin layer of the photosensitive transfer material of the present invention. I can do it.
  • the coupling treatment a method described in JP-A-2000-39033 is preferably used.
  • an oxygen blocking film can be further provided on the photosensitive resin layer.
  • the exposure sensitivity can be increased, and the oxygen blocking film has the same structure as that of the intermediate layer of the photosensitive transfer material (resin transfer material) described later. can do.
  • photosensitive resin composition hereinafter sometimes simply referred to as “resin composition”.
  • the pattern forming method includes, for example, a resin layer forming step (a) for forming a layer of the photosensitive resin composition on a substrate, a pattern exposure step (b) for exposing with a laser, and development.
  • (a-1) a method of applying the resin composition with a known coating apparatus or the like; a-2) A method of applying a resin transfer material using a laminator.
  • a laminator A method of applying a resin transfer material using a laminator.
  • slit coating methods such as spin coating, curtain coating, slit coating, dip coating, air knife coating, roller coating, wire bar coating, and gravure coating are used.
  • a method such as an etching coating method using a hopper described in US Pat. No. 2,681,294 can be used.
  • a slit coating method in which coating is performed by a slit-like nozzle (slit coater) having a slit-like hole at a portion where liquid is discharged is preferably used.
  • Preferred examples of the slit-shaped nozzle are as follows: JP-A-2004-89851, JP-A-2004-17043, JP-A-2003-170098, JP-A-2003-164787, Slit nozzles and slit coaters described in Japanese Unexamined Patent Publication No. 2003-10767, Japanese Unexamined Patent Application Publication No. 2002-79163, Japanese Unexamined Patent Application Publication No. 2001-310147, and the like.
  • an oxygen barrier film can be further provided on the resin layer.
  • the oxygen-blocking film include the same ones as described in the section (intermediate layer) of the resin transfer material described later.
  • the film thickness of the oxygen blocking film is preferably 0.5 to 3. O / zm.
  • JP-A-7-110575 JP-A-11-77942, JP-A-2000-334836, and JP-A-2002-148794. From the viewpoint of foreign matter, it is preferable to use the method described in JP-A-7-110575.
  • the pattern exposure in the present invention is a maskless exposure using a laser as a light source, and by using a spatial light modulation device arranged in two dimensions, relative scanning is performed while modulating light based on image data. Form a two-dimensional image.
  • ⁇ mask '' that forms an image (pattern) with a material that does not transmit or weakens the exposure light is placed in the optical path of the exposure light, and the resin layer is formed in a pattern corresponding to the image.
  • the maskless exposure is an exposure method in which the resin layer is exposed in a pattern without using the “mask”.
  • a laser is used as a light source.
  • ⁇ ⁇ ' ⁇ is an acronym for Light Amplification Dy Stimulated Emission of Radiation in English.
  • Laser light is emitted by an oscillator and an amplifier that produce monochromatic light with stronger coherence and directivity by amplifying and oscillating light waves using the phenomenon of stimulated emission that occurs in materials with an inverted distribution.
  • excitation media include crystals, glass, liquids, dyes, and gases. These medium forces include solid-state lasers (YAG lasers), liquid lasers, and gas lasers (argon lasers, He-Ne lasers, and charcoal). It is possible to use a known laser such as an acid gas laser or an excimer laser) or a semiconductor laser.
  • the semiconductor laser induces coherent light at the pn junction when electrons and holes flow out to the junction by carrier injection, excitation by an electron beam, ionization by collision, photoexcitation, etc.
  • This laser uses a light emitting diode that emits light. The wavelength of the emitted interference light is determined by the semiconductor compound.
  • the wavelength of the laser used in the present invention is not particularly limited, but in particular, from the viewpoint of resolution, cost of the laser device, and availability, the semiconductor laser is selected from a wavelength range of 300 to 500 nm. It is preferable to use 340 to 450 nm force, especially 360 to 415 nm force! /.
  • the YAG-SHG solid-state laser of 532 nm is preferred. Furthermore, 532, 355, and 266 nm can be cited for semiconductor-pumped solid-state lasers. Among them, 355 nm is preferably selected in that the conventional photopolymerization initiator for resist has sensitivity.
  • the gas laser 249 nm of KrF laser and 193 ⁇ m of ArF laser are preferably used.
  • a light source having an exposure wavelength of 405 nm considering the case where the photosensitive material is exposed in the manufacturing process of the display device, it is preferable to select a light source having an exposure wavelength of 405 nm from the viewpoint of increasing the transmittance of the display region. .
  • the beam diameter of the laser is not particularly limited, but from the viewpoint of pattern resolution, 5-30 ⁇ m is preferable in terms of the 1 / e 2 value of the Gaussian beam, and 7-20 ⁇ m is more preferable.
  • the energy amount of the laser beam is not particularly limited, but from the viewpoint of exposure time and resolution, 1 to: LOOmj / cm 2 is preferable, and 5 to 20 mi / cm 2 is more preferable.
  • DMD digital 'micromirror' devices, for example, optical semiconductors developed by Dr. Hornbeck et al. In 1987 in Texas 'Instrumental'.
  • DMD digital 'micromirror' devices, for example, optical semiconductors developed by Dr. Hornbeck et al. In 1987 in Texas 'Instrumental'.
  • DMD digital 'micromirror' devices, for example, optical semiconductors developed by Dr. Hornbeck et al. In 1987 in Texas 'Instrumental'
  • Is a method using spatial modulation elements arranged in a row In this case, the light from the light source is irradiated onto the DMD by an appropriate optical system, and the reflected light from each mirror arranged two-dimensionally on the DMD passes through another optical system and the like on the resin layer. Form an image of light spots arranged in a dimension. In this state, the light spot is not exposed between the light spots!
  • the image of the light spots arranged in two dimensions is moved in a direction slightly inclined with respect to the two-dimensional arrangement direction, the light spot between the light spots in the first row is moved between the light spots in the rear row.
  • the entire surface of the resin layer can be exposed in the form that the light spot is exposed.
  • An image pattern can be formed by controlling the angle of each mirror of the DMD and turning the light spot on and off. By aligning and using such exposure heads having DMD, it is possible to cope with substrates of various widths.
  • the brightness of the light spot has only two gradations, ON or OFF, but exposure with 256 gradations can be performed using a mirror gradation spatial modulation element.
  • a polygon mirror is a rotating member that has a series of planar reflective surfaces around it.
  • Light having a light source power is reflected and irradiated on the resin layer, and the light spot of the reflected light is scanned by the rotation of the plane mirror.
  • An image pattern can be formed by controlling the light intensity of the light source to ON-OFF or halftone using an appropriate method.
  • the scanning time can be shortened by using a plurality of lights from the light source.
  • the exposure unit includes a flat plate-like stage 152 that holds the photosensitive material 150 by adsorbing to the surface.
  • Two guides 158 extending along the stage moving direction are installed on the upper surface of the thick and plate-shaped installation table 156 supported by the four legs 154.
  • the stage 152 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 158 so as to be reciprocally movable.
  • the exposure apparatus is provided with a drive device (not shown) for driving the stage 152 along the guide 158.
  • a U-shaped gate 160 is provided so as to straddle the movement path of the stage 152. Each end of the U-shaped gate 160 is fixed to both side surfaces of the installation table 156.
  • a scanner 162 is provided on one side of the gate 160, and a plurality of (for example, two) detection sensors 164 for detecting the front and rear ends of the photosensitive material 150 are provided on the other side. Yes.
  • the scanner 162 and the detection sensor 164 are respectively attached to the gate 160 and fixedly arranged above the moving path of the stage 152.
  • the scanner 162 and the detection sensor 164 are connected to a controller (not shown) that controls them.
  • the scanner 162 includes a plurality of (for example, 14) exposure heads 166 arranged in a substantially matrix of m rows and n columns (eg, 3 rows and 5 columns). I have. In this example, four exposure heads 166 are arranged in the third row in relation to the width of the photosensitive material 150. In addition, when showing each exposure head arranged in the mth row and the nth column, it is expressed as an exposure head 166 mn.
  • the exposure area 168 by the exposure head 166 has a rectangular shape with the short side in the sub-scanning direction.
  • a strip-shaped exposed region 170 is formed in the photosensitive material 150 for each exposure head 166.
  • the exposure area by each exposure head arranged in the m-th row and the n-th column is indicated, it is expressed as an exposure area 168.
  • the strip-shaped exposed region 170 is directly aligned with the sub-scanning direction.
  • Each of the exposure heads in each row arranged in a line so that there is no gap in the intersecting direction is
  • the exposure area is exposed using the exposure area 168 in the second row and the exposure area 168 in the third row.
  • Each of the exposure heads 166 to 166 was incident as shown in FIG. 4, FIG. 5A and FIG. 5B.
  • a digital 'micromirror' device (DMD) 50 is provided as a spatial light modulation element that modulates the light beam for each pixel in accordance with image data.
  • the DMD 50 is connected to a controller (not shown) having a data processing unit and a mirror drive control unit.
  • the data processing unit of this controller generates a control signal for driving and controlling each micromirror in the region to be controlled by the DMD 50 for each exposure head 166 based on the input image data.
  • the area to be controlled will be described later.
  • the mirror drive control unit controls the angle of the reflection surface of each micromirror of the DMD 50 for each exposure head 166 based on the control signal generated by the image data processing unit. The control of the angle of the reflecting surface will be described later.
  • a fiber array light source having a laser emitting portion in which the emitting end portion (light emitting point) of the optical fiber is arranged in a line along the direction corresponding to the long side direction of the exposure area 168 66, a lens system 67 for correcting the laser beam emitted from the fiber array light source 66 and condensing it on the DMD, and a mirror 69 for reflecting the laser beam transmitted through the lens system 67 toward the DMD 50 are arranged in this order.
  • the lens system 67 is a pair of combination lenses 71 that collimate the laser light emitted from the fiber array light source 66, and corrects so that the light quantity distribution of the collimated laser light is uniform 1
  • a pair of combination lenses 73 and a condensing lens 75 that condenses the laser light whose light intensity distribution is corrected on the DMD 50 are configured.
  • the portion close to the optical axis of the lens expands the light beam and the portion away from the optical axis force contracts the light beam, and the direction orthogonal to the arrangement direction.
  • the laser light reflected by the DMD 50 is used as a photosensitive material.
  • Lens systems 54 and 58 that form an image on a scanning surface (exposed surface) 56 of 0 are arranged.
  • the lens systems 54 and 58 are arranged so that the DMD 50 and the exposed surface 56 are in a conjugate relationship.
  • the DMD 50 includes a micromirror 62 supported by a support column on an SRAM cell (memory cell) 60, and constitutes a pixel.
  • This is a mirror device configured by arranging a large number (for example, 600 ⁇ 800) of micromirrors 62 in a lattice pattern.
  • Each pixel is provided with a micromirror 62 supported by a support at the top, and a material having high reflectivity such as aluminum is deposited on the surface of the micromirror 62.
  • the reflectance of the micromirror 62 is 90% or more.
  • a silicon gate CMOS SRAM cell 60 manufactured in a normal semiconductor memory manufacturing line is arranged directly below the micromirror 62 via a support including a hinge and a yoke. Is configured.
  • the microphone mirror 62 supported by the support column is ⁇ degrees (eg, ⁇ 10 °) with respect to the substrate side on which the DMD50 is placed with the diagonal line as the center. ) Tilted within the range.
  • FIG. 7A shows a state tilted to + ⁇ degrees when the micromirror 62 is on
  • FIG. 7B shows a state tilted to ⁇ degrees when the micromirror 62 is off. Therefore, by controlling the tilt of the micromirror 62 in each pixel of the DMD 50 according to the image signal as shown in FIG. 6, the light incident on the DMD 50 is reflected in the tilt direction of each micromirror 62. .
  • FIG. 6 shows an example of a state in which a part of the DMD 50 is enlarged and the micromirror 62 is controlled to + ⁇ degrees or ⁇ degrees.
  • On / off control of each micromirror 62 is performed by a controller (not shown) connected to the DMD 50.
  • a light absorber (not shown) is arranged in the direction in which the light beam is reflected by the micromirror 62 in the off state.
  • the DMD 50 is arranged with a slight inclination so that the short side forms a predetermined angle ⁇ (for example, 1 ° to 5 °) with the sub-scanning direction.
  • Figure 8 ⁇ shows the scanning trajectory of the reflected light image (exposure beam) 53 of each micromirror when the DMD50 is not tilted! / ⁇
  • Fig.8 ⁇ ⁇ shows the scanning trajectory of the exposure beam 53 when the DMD50 is tilted. Yes.
  • DMD50 has a matrix in which a number of micromirrors (for example, 800) are arranged in the longitudinal direction. Ikuguchi mirror line force Many sets (for example, 600 sets) are arranged in the short direction. As shown in Fig. 8B, by tilting the DMD50, the pitch P of the trajectory (scanning line) of the exposure beam 53 by each micromirror P force of the scanning line P when the DMD50 is not tilted
  • the combined scan width w is substantially the same.
  • the same scanning line is overlapped and exposed (multiple exposure) by different micromirror rows. In this way, by performing multiple exposure, it is possible to control a minute amount of the exposure position and realize high-definition exposure. Further, the joints between a plurality of exposure heads arranged in the main scanning direction can be connected without a step by controlling a very small amount of exposure position.
  • the fiber array light source 66 includes a plurality of (for example, six) laser modules 64, and one end of the multimode optical fiber 30 is coupled to each laser module 64. ing. The other end of the multimode optical fiber 30 is coupled with an optical fiber 31 having the same core diameter as the multimode optical fiber 30 and a cladding diameter smaller than the multimode optical fiber 30, as shown in FIG. 9C.
  • a laser emission portion 68 is configured by arranging the emission end portions (light emission points) of the fibers 31 in one row along the main scanning direction orthogonal to the sub-scanning direction. Note that, as shown in FIG. 9D, the light emission points are arranged in two rows along the main scanning direction.
  • the exit end of the optical fiber 31 is sandwiched and fixed between two support plates 65 having a flat surface.
  • a transparent protective plate 63 such as glass is disposed on the light emitting side of the optical fiber 31 in order to protect the end face of the optical fiber 31.
  • the protective plate 63 may be disposed so that the end face of the optical fiber 31 may be sealed in contact with the end face of the optical fiber 31.
  • the exit end portion of the optical fiber 31 has a high light density and is likely to collect dust and easily deteriorate. However, the protective plate 63 can prevent the dust from adhering to the end face and delay the deterioration.
  • a multimode optical fiber is interposed between two multimode optical fibers 30 adjacent to each other with a large cladding diameter. 30 are stacked, and the output end of the optical fiber 31 coupled to the stacked multimode optical fiber 30 is connected to the two multimode optical fibers 30 adjacent to each other at the portion where the cladding diameter is large. They are arranged so as to be sandwiched between the two exit ends.
  • such an optical fiber is a light with a small cladding diameter of 1 to 30 cm in length at the tip of the multimode optical fiber 30 having a large cladding diameter on the laser light emission side. It can be obtained by coupling the fibers 31 coaxially. In the two optical fibers, the incident end face of the optical fiber 31 is fused and joined to the outgoing end face of the multimode optical fiber 30 so that the central axes of both optical fibers coincide. As described above, the diameter of the core 31a of the optical fiber 31 is the same as the diameter of the core 30a of the multimode optical fiber 30.
  • a short optical fiber in which an optical fiber having a short length and a large cladding diameter is fused with a cladding diameter and an optical fiber is connected to the output end of the multimode optical fiber 30 via a ferrule or an optical connector. May be combined.
  • the tip portion can be easily replaced when the diameter of the clad or the optical fiber is broken, and the cost required for exposure head maintenance can be reduced.
  • the optical fiber 31 may be referred to as an emission end portion of the multimode optical fiber 30.
  • the multimode optical fiber 30 and the optical fiber 31 may be any of a step index type optical fiber, a graded index type optical fiber, and a composite type optical fiber.
  • a step index type optical fiber manufactured by Mitsubishi Cable Industries, Ltd. can be used.
  • the cladding thickness ⁇ (cladding diameter-core diameter) Z2 ⁇ is set to the wavelength of 800 nm. Even if it is about 1Z2 when propagating infrared light in the band and about 1Z4 when propagating infrared light in the 1.5m wavelength band for communication, propagation loss does not increase substantially. Therefore, the cladding diameter can be reduced to 60 m.
  • the cladding diameter of the optical fiber 31 is not limited to 60 m.
  • the clad diameter of the optical fiber used in the conventional fiber light source is 125 m.
  • the depth of focus becomes deeper as the clad diameter becomes smaller. Therefore, the clad diameter of the multimode optical fiber is preferably 80 m or less.
  • 60 m is preferably 40 m or less.
  • the cladding diameter of the optical fiber 31 is preferably 10 ⁇ m or more.
  • the laser module 64 includes a combined laser light source (fiber light source) shown in FIG.
  • This combined laser light source is composed of multiple (for example, 7) chip-shaped lateral multimode or single mode GaN-based semiconductor lasers LD1, LD2, LD3, LD4, LD5, LD6 arranged and fixed on the heat block 10.
  • the number of semiconductor lasers is not limited to seven.
  • the number of optical fibers can be further reduced.
  • the GaN semiconductor lasers LD1 to LD7 all have the same oscillation wavelength (for example, 405 nm), and all the maximum outputs are also common (for example, 100 mW for the multimode laser and 30 mW for the single mode laser).
  • As the GaN semiconductor lasers LD1 to LD7 lasers having an oscillation wavelength other than the above 405 nm in the wavelength range of 350 nm to 450 nm may be used.
  • the combined laser light source is housed in a box-shaped package 40 having an upper opening together with other optical elements.
  • Package 40 is opened It has a package lid 41 that is designed to close the mouth, introduces a sealing gas after deaeration, and closes the opening of the knock 40 with the package lid 41, so that the package 40 and the package lid 41
  • the combined laser light source is hermetically sealed in the formed closed space (sealed space).
  • a base plate 42 is fixed to the bottom surface of the package 40.
  • the heat block 10 On the upper surface of the base plate 42, the heat block 10, the condensing lens holder 45 for holding the condensing lens 20, and the multimode light.
  • a fiber holder 46 that holds the incident end of the fiber 30 is attached. The exit end of the multimode optical fiber 30 is drawn out of the package through an opening formed in the wall surface of the knock 40.
  • a collimator lens holder 44 is attached to the side surface of the heat block 10, and the collimator lenses 11 to 17 are held.
  • An opening is formed in the lateral wall surface of the package 40, and wiring 47 for supplying a driving current to the GaN semiconductor lasers LD1 to LD7 is drawn out of the package through the opening.
  • the GaN semiconductor laser LD7 is numbered out of the plurality of GaN semiconductor lasers, and one of the collimator lenses is a collimator lens. Only 17 is numbered.
  • FIG. 14 shows the front shape of the mounting portion of the collimator lenses 11-17.
  • Each of the collimator lenses 11 to 17 is formed in a shape obtained by cutting an area including the optical axis of a circular lens having an aspherical surface into an elongated shape with a parallel plane.
  • This elongated collimator lens can be formed, for example, by molding a resin or optical glass.
  • the collimator lenses 11 to 17 are closely arranged in the arrangement direction of the light emitting points so that the length direction is orthogonal to the arrangement direction of the light emitting points of the GaN-based semiconductor lasers LD1 to LD 7 (left and right direction in FIG. 14). Yes.
  • the GaN-based semiconductor lasers LD1 to LD7 have an active layer with an emission width of 2 ⁇ m, and the divergence angles in the direction parallel to and perpendicular to the active layer are, for example, 10 ° and 30 °, respectively. In this state, lasers that emit laser beams B1 to B7 are used. These GaN semiconductor lasers LD1 to LD7 are arranged so that their emission points are arranged in a line in a direction parallel to the active layer.
  • each collimator lens 11-17 has a width of 1. lmm and a length of 4.6 mm, and the laser beams incident on them are B1-: B7 has horizontal and vertical beam diameters of 0.9 mm each. 2.6 mm.
  • the condensing lens 20 is obtained by cutting a region including the optical axis of a circular lens having an aspherical surface into a thin plane in a parallel plane and perpendicular to the arrangement direction of the collimator lenses 11 to 17, that is, in the horizontal direction. It is formed in a shape that is short in the direction.
  • the condensing lens 20 is also formed, for example, by molding a resin or optical glass.
  • Laser beams Bl, B2, B3, B4, B5, B6 emitted from each of the GaN-based semiconductor lasers LD1 to LD7 constituting the combined laser light source of the fiber array light source 66 at each exposure head 166 of the scanner 162 , And B7 are collimated by corresponding collimator lenses 11-17.
  • the collimated laser beams B1 to B7 are condensed by the condenser lens 20 and converge on the incident end face of the core 30a of the multimode optical fiber 30.
  • a condensing optical system is configured by the collimator lenses 11 to 17 and the condensing lens 20, and a multiplexing optical system is configured by the condensing optical system and the multimode optical fiber 30. That is, the laser beam B1 to B7 force condensed as described above by the condensing lens 20 is incident on the core 30a of the multimode optical fiber 30 and propagates through the optical fiber, and is combined with one laser beam B. The light is emitted from the optical fiber 31 coupled to the output end of the multimode optical fiber 30.
  • the high-luminance light emitting points are arranged in a line along the main traveling direction as described above.
  • Conventional fiber light sources that combine laser light from a single semiconductor laser into a single optical fiber have a low output, so if multiple arrays are not used, the desired output cannot be obtained. Since the laser light source has high output, a desired output can be obtained even with a small number of rows, for example, one row.
  • a laser with an output of about 30 mW (milliwatt) is usually used as a semiconductor laser, and a core diameter is used as an optical fiber.
  • Multimode optical fiber with 50 m, clad diameter 125 m, NA (numerical aperture) 0.2 is used, so if you want to obtain an output of about 1 W (watt), you need 48
  • the book (8 X 6) must be bundled, and the area of the light emitting area is 0.62 mm 2 (0.675 mm X O. 925 mm), so the luminance at the laser emitting section 68 is 1.6 X 10 6 (WZm 2 )
  • the luminance per optical fiber is 3.2 X 10 6 (WZm 2 ).
  • an output of about 1 W can be obtained with six multimode optical fibers, and the area of the light emitting region at the laser emitting portion 68 is 0.0081 mm 2 (0.325 mm X 0. 025 mm), the luminance at the laser emitting portion 68 is 123 ⁇ 10 6 (WZm 2 ), which is about 80 times higher than before.
  • the luminance per optical fiber is 9 OX 10 6 (WZm 2 ), which is about 28 times higher than the conventional one.
  • the diameter in the sub-scanning direction of the light emitting region of the bundled fiber light source of the exposure head is 0.675 mm
  • the diameter of the light emitting region of the fiber array light source in the exposure head is 0. 025mm.
  • the angle of the light beam incident on the DMD 3 increases, and as a result, the angle of the light beam incident on the scanning surface 5 Becomes larger. For this reason, the beam diameter tends to increase with respect to the light condensing direction (shift in the focus direction).
  • lens systems 2, 4 and 6 in FIG. 15A are replaced with lens systems 67, 54 and 58 in FIG. Equivalent to.
  • the diameter of the light emission region of the fiber array light source 66 is extremely small in the sub-scanning direction, so that the light flux that passes through the lens system 67 and enters the DMD 50 is reduced. As a result, the angle of the light beam incident on the scanning surface 56 is reduced. That is, the depth of focus becomes deeper.
  • the diameter of the light emitting region in the sub-scanning direction is about 30 times that of the conventional one, and a depth of focus corresponding to the diffraction limit can be obtained. Therefore, it is suitable for exposure of minute spots. This effect on the depth of focus becomes more prominent and effective as the required amount of light from the exposure head increases.
  • the size of one pixel projected on the exposure surface is 10 ⁇ mXlO ⁇ m.
  • DMD is a reflective spatial modulation element, but FIGS. 15A and 15B are developed views for explaining the optical relationship.
  • Image data power corresponding to the exposure pattern is input to a controller (not shown) connected to the DMD 50, and stored in a frame memory in the controller.
  • This image data is data representing the density of each pixel constituting the image in binary (whether or not dots are recorded).
  • the stage 152 having the photosensitive material 150 adsorbed on the surface thereof is moved at a constant speed from the upstream side to the downstream side of the gate 160 along the guide 158 by a driving device (not shown).
  • a driving device not shown
  • the image data stored in the frame memory is stored for multiple lines.
  • a control signal is generated for each exposure head 166 based on the image data read out sequentially and read out by the data processing unit.
  • each of the micro mirrors of the DMD 50 is controlled on and off for each exposure head 166 based on the generated control signal by the mirror drive control unit.
  • the DMD 50 When the DMD 50 is irradiated with laser light from the fiber array light source 66, the laser light reflected when the micro mirror of the DMD 50 is on is reflected on the exposed surface 56 of the photosensitive material 150 by the lens systems 54 and 58. Is imaged. In this manner, the laser light emitted from the fiber array light source 66 is turned on / off for each pixel, and the photosensitive material 150 is exposed in pixel units (exposure area 168) that is approximately the same number as the number of pixels used in the DMD 50.
  • the photosensitive material 150 when the photosensitive material 150 is moved at a constant speed together with the stage 152, the photosensitive material 150 is sub-scanned in the direction opposite to the stage moving direction by the scanner 162, and a belt-like shape is formed for each exposure head 166. An exposed area 170 is formed.
  • the DMD 50 has a force in which 600 sets of micromirror arrays in which 800 micromirrors are arranged in the main scanning direction are arranged in the subscanning direction. Control so that only some micromirror rows (eg 800 x 100 rows) are driven.
  • FIG. 16A it is possible to use a micromirror array arranged at the center of the DMD50. As shown in FIG. 16B, using a micromirror array arranged at the end of the DMD50. Also good. Further, when a defect occurs in some of the micromirrors, the micromirror array to be used may be changed as appropriate depending on the situation, such as using a micromirror array in which no defect has occurred.
  • the modulation speed per line is determined in proportion to the number of pixels used, so one line can be obtained by using only a part of the micromirror array.
  • the modulation speed per hit is increased.
  • modulation can be performed twice as fast per line as compared to the case of using all 600 sets.
  • modulation can be performed three times faster per line than when all 600 sets are used.
  • a 500mm area can be exposed in 17 seconds in the sub-scanning direction.
  • modulation can be performed 6 times faster per line. That is, an area of 500 mm in the sub-scanning direction can be exposed in 9 seconds.
  • the number of micromirror rows to be used is preferably 10 or more and 200 or less, more preferably 10 or more and 100 or less. Since the area per micromirror equivalent to one pixel is 15 m X 15 m, when converted to the DMD 50 usage area, an area of 12 mm XI 50 m or more and 12 mm X 3 mm or less is preferred 12 mm XI A region of 50 / zm or more and 12 mm X I. 5 mm or less is more preferable.
  • the laser light emitted from the fiber array light source 66 is converted into substantially parallel light by the lens system 67 as shown in FIGS. 17A and 17B.
  • DMD50 can be irradiated.
  • the irradiation area where the DMD 50 irradiates laser light preferably matches the area where the DMD 50 is used.
  • the irradiation area is wider than the use area, and the utilization efficiency of the laser beam is reduced.
  • the diameter in the sub-scanning direction of the light beam condensed on the DMD 50 needs to be reduced according to the number of micromirrors arranged in the sub-scanning direction by the lens system 67. If the number of mirror rows is less than 10, the angle of the light beam incident on the DMD 50 becomes large and the depth of focus of the light beam on the scanning surface 56 becomes shallow, which is not preferable. Further, it is preferable that the number of micromirror rows to be used is 200 or less in terms of modulation speed. DMD is a reflection-type spatial modulation element.
  • Figures 17A and 17B are developed views to explain the optical relationship.
  • the stage 152 is moved along the guide 158 by the driving device (not shown). It returns to the origin on the uppermost stream side, and again moves along the guide 158 from the upstream side to the downstream side of the gate 160 at a constant speed.
  • the exposure unit includes a DMD in which 800 micromirror arrays in which 800 micromirrors are arranged in the main scanning direction are arranged in 600 pairs in the subscanning direction. Because only a part of the micromirror array is driven by
  • the modulation speed per line becomes faster. This enables high-speed exposure.
  • known developers such as those described in JP-A-5-72724 are not particularly limited.
  • the developer has a dissolution type development behavior of the resin layer.
  • organic solvents that are miscible with water include methanol, ethanol, 2-propanol, 1 propanol, butanol, diacetone alcohol, ethylene glycol monomethino ethenole, ethylene glycol monomethino enotenole, and ethylene glycol monomethanol.
  • n-Butyl ether benzyl alcohol, acetone, methyl ethyl ketone, cyclohexanone ⁇ - strength prolatatone, ⁇ butyroratatone , dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, ⁇ -strength prolatatum, ⁇ -methylpyrrolidone, and the like.
  • the concentration of the organic solvent is preferably 0.1% by mass to 30% by mass.
  • a known surfactant can be further added to the developer.
  • the concentration of the surfactant is preferably 0.01% by mass to 10% by mass.
  • a known method such as paddle development, shower development, shower & spin development, dip image, or the like can be used.
  • the uncured portion can be removed by spraying a developing solution onto the resin layer after the exposure.
  • a developing solution Prior to development, it is preferable to spray an alkaline solution having a low solubility of the resin layer with a shower or the like to remove the thermoplastic resin layer, the intermediate layer, and the like.
  • a cleaning agent or the like it is preferable to remove the development residue by spraying a cleaning agent or the like with a shutter and rubbing with a brush or the like.
  • the developer temperature is preferably 20 ° C to 40 ° C, and the developer pH is preferably 8 to 13.
  • a roller conveyor or the like is installed in the developing tank, and the substrate moves horizontally.
  • the photosensitive resin is preferably formed on the upper surface of the substrate in order to prevent damage to the single conveyor.
  • the inclination angle is preferably 5 ° force 30 °.
  • Post-exposure is preferably performed in order to further cure the resin layer developed by the development step.
  • the light source used for the post-exposure any light source capable of irradiating light in a wavelength region that can cure the resin layer (for example, 365 nm, 405 nm, etc.) can be appropriately selected and used.
  • an ultrahigh pressure mercury lamp, a high pressure mercury lamp, a metal lamp, a ride lamp, etc. are particularly preferably used.
  • Energy of exposure generally 10: a LOOOOmjZcm 2, preferably 100 ⁇ 1000mjZcm 2.
  • post-beta is performed as necessary.
  • the temperature of the post beta is preferably 180 ° C or higher, more preferably 180 to 260 ° C, and particularly preferably 200 to 240 ° C. Further, it is preferable to beta for 10 to 300 minutes while maintaining the above temperature, and further 15 to 200 minutes, particularly 20 to 150 minutes are preferable.
  • the photosensitive resin composition for forming the color filter is layered to form a base. It is preferable from the viewpoint of cost reduction to form a spacer by forming a transparent electrode thereon, and further superimposing divisional alignment projections.
  • the pattern according to the present invention is formed as described above. For example, K (black) 'R'G'B is applied to the resin composition in order to form a color filter consisting of four colors.
  • the film thickness may become thinner each time it is stacked due to the leveling of the coating solution. For this reason, it is preferable to further divide the divisional alignment protrusions on the pattern.
  • heat is possible
  • the thickness is preferably kept constant, so it is preferable to use 3 or 2 colors.
  • the size of the above base is preferably 25 m X 25 m or more, from the viewpoint of preventing deformation of the photosensitive resin layer when laminating transfer materials and laminating it, and maintaining a certain thickness 30 ⁇ m X Especially preferred is 30 m or more.
  • the photosensitive transfer material is preferably configured as a resin transfer material described in JP-A-5-72724, that is, an integrated film.
  • Examples of the structure of the integral film include temporary support Z thermoplastic resin layer Z intermediate layer Z photosensitive resin layer Z protective film, temporary support Z thermoplastic resin layer Z photosensitive resin layer Z A configuration in which protective films are laminated in this order is preferred.
  • the photosensitive transfer material is provided with a photosensitive resin layer of the photosensitive resin composition.
  • the temporary support for the above-mentioned resin transfer material needs to be flexible and not to cause significant deformation, shrinkage or elongation even under pressure or pressure and calorific heat.
  • a support include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, and a polycarbonate film, and among them, a biaxially stretched polyethylene terephthalate film is particularly preferable.
  • the thickness of the temporary support is not particularly limited, but the range of 5 to 200 / ⁇ ⁇ is general, and the range of 10 to 150 / zm is particularly advantageous from the viewpoint of ease of handling and versatility. preferable.
  • the temporary support may be transparent, or may contain dyed silicon, alumina sol, chromium salt, zirconium salt, or the like.
  • an organic polymer substance described in JP-A-5-72724 is preferred as a component used for the thermoplastic resin layer.
  • the Vicat method specifically, the American Material Testing Method, Est. Measures the soft soft spot according to ASTMD1235. It is particularly preferred to be selected from organic polymer substances having a temperature of 80 ° C or lower.
  • polyolefins such as polyethylene and polypropylene, ethylene copolymers such as ethylene and butyl acetate or saponified products thereof, ethylene and acrylic acid esters or saponified products thereof, polyvinyl chloride, and vinyl chloride.
  • Salt-vinyl copolymer such as butyl acetate and its ken hydrate, poly-salt vinylidene, vinylidene chloride copolymer, polystyrene, styrene and (meth) acrylic acid ester or saponified product thereof Styrene copolymer, polytoluene toluene, vinyl toluene and (meth) acrylic acid ester or saponified butyltoluene copolymer, poly (meth) acrylic acid ester, (meth) acrylic acid butyl and vinyl acetate
  • organic polymers such as polyamide resin such as dimethyl methyl nylon and N-dimethylaminolated nylon.
  • an intermediate layer for the purpose of preventing mixing of components during application of a plurality of application layers and during storage after application.
  • an oxygen-blocking membrane having an oxygen-blocking function which is described as “separation layer” in JP-A-5-72724. In this case, the sensitivity at the time of exposure is increased, the time load of the exposure machine is reduced, and the productivity is improved.
  • oxygen-blocking membrane As the oxygen-blocking membrane, a known medium force that exhibits low oxygen permeability and is preferably dispersed or dissolved in water or an aqueous alkali solution can be appropriately selected. Of these, a combination of polybulal alcohol and polybulurpyrrolidone is particularly preferred.
  • the protective film may have the same or similar material strength as the temporary support, but it must be easily separated from the resin layer.
  • silicone paper, polyolefin sheet or polytetrafluoroethylene sheet is suitable as the protective film material.
  • thermoplastic resin coating solution in which a thermoplastic resin layer additive is dissolved on a temporary support, followed by drying.
  • a solution of the intermediate layer material consisting of a solvent and dry it, and then use a solvent that does not dissolve the intermediate layer to sensitize it.
  • the photosensitive resin composition can be applied and dried to provide a photosensitive resin layer.
  • thermoplastic resin layer and the intermediate layer on the temporary support and a sheet provided with the photosensitive resin layer on the protective film are prepared, and the intermediate layer and the photosensitive resin layer are in contact with each other. It can also be produced by sticking together.
  • a sheet provided with a thermoplastic resin layer on the temporary support and a sheet provided with a photosensitive resin layer and an intermediate layer on a protective film are prepared, and the thermoplastic resin layer and the intermediate layer are prepared. It can also be produced by sticking together so as to be in contact with each other.
  • the film thickness of the photosensitive resin layer of the photosensitive resin composition is a force depending on the height of the dark color separation wall 0.2 to 10 m force S, preferably 0. 5 to 5.
  • O / zm is more preferable 1.0 to 3.
  • O / zm is particularly preferable.
  • preferred film thicknesses of the other layers are 2-30 m for the thermoplastic resin layer, 0.5-3.0 m for the intermediate layer, and 4-40 for the protective film. m force is preferable.
  • the application in the method for producing the photosensitive transfer material can be carried out by known coating apparatuses and the like listed in the description of the photosensitive resin composition, but in the present invention, in particular, It is preferable to use a coating device (slit coater) using a slit nozzle.
  • a coating device slit coater
  • a transparent substrate such as a soda glass plate having a surface of an oxide silicon film, a low expansion glass, a non-alkali glass, a quartz glass plate, etc.
  • a well-known glass plate or a plastic film etc. can be mentioned.
  • substrate carries out a coupling process beforehand, and a resin composition, or Adhesion with the resin transfer material can be improved.
  • a resin composition, or Adhesion with the resin transfer material can be improved.
  • the thickness of the substrate is generally preferably 700 to 1200 / ⁇ ⁇ .
  • the color filter of the present invention is produced by the above-described method for producing a color filter of the present invention.
  • the color filter of the present invention is a high-intensity color filter in which the dark color separation wall is formed with high sensitivity and a wide development latitude, and thus the position accuracy of the dark color separation wall is high.
  • the liquid crystal display device of the present invention is constructed using the color filter of the present invention described above.
  • the liquid crystal display device is described in, for example, “Next-generation liquid crystal display technology (edited by Tatsuo Uchida, side industry research committee, published in 1994)”.
  • the liquid crystal display device of the present invention is not particularly limited except that it includes the color filter of the present invention.
  • the liquid crystal display device of the various types described in the "next-generation liquid crystal display technology" is configured. Can do. In particular, it is effective in constructing a color TFT liquid crystal display device.
  • the color TFT liquid crystal display device is described, for example, in "Color TFT liquid crystal display (Kyoritsu Publishing Co., Ltd., issued in 1996)".
  • a liquid crystal display device with a wide viewing angle such as a horizontal electric field driving method such as IPS and a pixel division method such as MVA.
  • a horizontal electric field driving method such as IPS
  • a pixel division method such as MVA.
  • the liquid crystal display device of the present invention includes an electrode substrate, a polarizing film, a retardation film, a knock light, a spacer, a viewing angle compensation film, an antireflection film, except that the color filter of the present invention described above is provided. It can be generally constructed using various members such as a light diffusion film and an antiglare film. Regarding these materials, for example, “'94 Liquid Crystal Display Peripheral Materials' Chemicals Kaya (Kentaro Shima, CMC Co., Ltd., 1994)”, “2003 Current Status and Future Prospects of Liquid Crystal Related Kamaba (Vol. 2) ( Ryoyoshi Omotesaki, Fuji Chimera Research Institute, Inc., 2003, etc.) LCD types include STN, TN, VA, IPS, OCS, and R-OCB.
  • the liquid crystal display device of the present invention includes ECB (Electrically Controlled Birefringence), TN (Twisted Nematic), IPS (in- Plane Switching), FLC (Ferroelectric Liquid Crystal), OCB (Optically Compensatory Bend), STN (Supper T Various display modes such as wisted Nematic), VA (Vertically Aligned), HAN (Hybrid Aligned Nematic), and GH (Guest Host) can be adopted. Among these display modes, the VA (Vertically Aligned) display mode is preferred because it can provide a display device with particularly high display quality!
  • a photosensitive resin composition layer containing at least one of a resin and a precursor thereof, at least one of particles having a metal or alloy force, and composite particles made of a metal and an alloy or an alloy and an alloy.
  • ⁇ 2> The method for producing a color filter according to ⁇ 1>, wherein the metal is silver or tin, and the alloy is a silver-tin alloy.
  • ⁇ 3> The color according to ⁇ 1>, wherein at least one of the particles made of the metal or the alloy and the composite particles made of the metal and the alloy or the alloy and the alloy is a silver-tin composite particle. Manufacturing method of filter.
  • ⁇ 4> The method for producing a color filter according to ⁇ 3>, wherein the silver tin composite particles have a number average particle size of 20 to 700 nm.
  • ⁇ 5> The method for producing a color filter according to ⁇ 3>, wherein the amount of the silver-tin composite particles based on the total solid content of the photosensitive resin composition is 5 to 20% by volume.
  • ⁇ 6> The method for producing a color filter according to ⁇ 1>, wherein the film thickness of the dark color separation wall is 0.2 to: LO / zm.
  • a step of transferring a photosensitive transfer material in which at least one photosensitive resin layer comprising the photosensitive resin composition is formed on a temporary support to a substrate is included.
  • ⁇ 8> The method for producing a color filter according to claim 1, further comprising a step of applying a colored liquid composition containing a pigment of any one of red, green, and blue by an inkjet method.
  • silver acetate (1) 23. lg, tin acetate ( ⁇ ) 65. lg, dalconic acid 54 g, sodium pyrophosphate 45 g, polyethylene glycol (molecular weight 3,000) 2 g, and E735 (manufactured by ISP; A solution 1 was obtained by dissolving 5 g of a butylpyrrolidone / acetic acid butyl copolymer).
  • this liquid was further centrifuged to precipitate silver tin alloy particles again. Centrifugation was performed under the same conditions as described above. After centrifuging, the supernatant was discarded in the same manner as above, and 150 ml of the total liquid was added. To this, 850 ml of pure water and 500 ml of acetone were added, and stirred for 15 minutes to disperse the silver-tin alloy particles again.
  • Centrifugation was again performed in the same manner as described above to precipitate silver-tin alloy particles. Then, the supernatant was discarded as described above to make a liquid volume of 150 ml, and then 150 ml of pure water and 1200 ml of acetone were added thereto for another 15 minutes. Agitation was performed and silver tin alloy particles were dispersed again. Again, centrifugation was performed. The centrifugation conditions at this time are the same as described above except that the time is extended to 90 minutes. Thereafter, the supernatant was discarded and the total liquid volume was made 70 ml, and 30 ml of acetone was added thereto.
  • the numbers in Katsuko are the scattering angles of each (III) plane.
  • the dispersion average particle size was about 40 nm in terms of number average particle size.
  • the number average particle size was measured using a photograph obtained with a transmission electron microscope [EM-2010 (manufactured by JEOL Ltd.)] as follows.
  • the diameter of a circle having the same area as each particle image was defined as the particle diameter
  • the average of the particle diameters of 100 particles was defined as the number average particle size.
  • the following composition was mixed to prepare a photosensitive resin composition.
  • compositions were mixed to prepare a protective layer coating solution.
  • the photosensitive resin layer on the substrate is exposed to light having a wavelength of 405 nm and 80 mj Zcm 2 while relatively moving the photosensitive resin layer and the exposure head in the air atmosphere. Exposed in quantity.
  • FIG. 18 shows DMD50, DMD50 light irradiation means 144 for irradiating laser light, and lens system (imaging optical system) 454, 458, DMD50 for enlarging the laser light reflected by DMD50.
  • the aperture array 476 in which a large number of apertures 478 are provided corresponding to each microlens of the microlens array 472, and laser light that has passed through the aperture is covered.
  • An exposure head composed of lens systems (imaging optical systems) 480 and 482 that form an image on the exposure surface 56 is shown.
  • FIG. 18 a combined laser light source shown in FIGS.
  • the DMD50 has a micromirror column force with 800 micromirrors arranged in the main scanning direction shown in Fig. 16. Of the 600 light modulation means arranged in the subscanning direction, only 800 X of the number of rows in the used area is used. A DMD controlled to drive was used.
  • the aperture array 476 disposed in the vicinity of the condensing position of the microlens array 472 is disposed so that only light that has passed through the corresponding microlens 474 is incident on each aperture 478.
  • pure water is sprayed with a shower nozzle to uniformly wet the surface of the photosensitive resin layer K1, and then a KOH-based developer (containing KOH, a nonionic surfactant, Product name: CDK—1, Fuji Film Elect Mouth-Pix Material Co., Ltd. (diluted 100 times with pure water) at 23 ° C for 80 seconds and flat nozzle pressure 0.04 MPa. Obtained.
  • a KOH-based developer containing KOH, a nonionic surfactant, Product name: CDK—1, Fuji Film Elect Mouth-Pix Material Co., Ltd. (diluted 100 times with pure water) at 23 ° C for 80 seconds and flat nozzle pressure 0.04 MPa. Obtained.
  • ultrapure water was sprayed at a pressure of 9.8 MPa with an ultrahigh pressure washing nozzle to remove the residue and form a concentration separation wall.
  • heat treatment was performed at 220 ° C. for 30 minutes.
  • the dark color separation wall pattern had a pixel size of 10 inches and a pixel count of 480 X 640.
  • the black matrix width is 24 ⁇ m and the aperture of the pixel area is 86 m x 304 m.
  • the exposure amount in the exposure step and 40MjZcm 2, developed in the developing step is a 35 seconds at 35 ° C
  • Beta process was set to 20 minutes 220 ° C.
  • the photosensitive layer R1 has a thickness of 2. O / zm, and CI pigment 'red (CIPR) 254 and CIPR 177 are applied respectively. . 0. 22gZm was 2.
  • the exposure dose in the exposure process was 40 mjZcm 2
  • the development process in the development process was 45 ° C. for 45 seconds
  • the beta process was 220 ° C. for 20 minutes.
  • the photosensitive layer G1 has a thickness of 2. O / zm.
  • the application amount of CI pigment 'Green (CIPG) 36 and CI pigment' Yellow (CIPY) 150 is 1.
  • the exposure amount in the exposure process was 30 mjZcm 2 and the development process in the development process was 36 ° C. for 40 seconds.
  • the photosensitive layer B1 had a thickness of 2.
  • the coating amounts of CI pigment 'blue (CIPB) 15: 6 and CI pigment' violet (CIPV) 23 were 0.63 g 0.07 gZm 2 , respectively.
  • Phenothiazine 0.01 0 0.005 0.020
  • Surfactant 1 0.060 0.070 0.060
  • the colored photosensitive resin composition R1 was first ripened with R pigment dispersion 1, R pigment dispersion 2, and propylene glycol monomethyl ether acetate in the amounts shown in Table 2 at a temperature of 24. C 2 ° C) and stirred at 150 RPM for 10 minutes, then the amount of methyl ethyl ketone, binder 2, DPHA solution, 2 trichloromethyl mono 5- (p-styrylstyryl) mono 1, 3, 4— Oxadiazole, 2, 4 Bis (trichloromethyl) 6— [4 '— (N, N Bisoxycarboromethylmethylamino) -3′-bromophenol] — s Triazine and phenothiazine are removed, and the temperature is 24 ° C ( ⁇ 2 ° C) in this order and stirred at 150 RPM for 30 minutes, and then the amount of Surfactant 1 listed in Table 2 is removed and added at a temperature of 24 ° C ( ⁇ 2 ° C). Obtained by stirring at 30 RPM for
  • composition of R pigment dispersion 2 was as follows. • CIPR 177 (Product name: Cromophtal Red A2B,
  • composition of the DPHA solution was as follows.
  • Colored photosensitive resin composition Gl is first made up of G pigment dispersion 1, Y pigment dispersion 1, and propylene glycol monomethyl ether acetate in the amounts shown in Table 2.
  • G pigment dispersion 1 “trade name: GT 2” manufactured by Fuji Film Elect Kokuku Materials Co., Ltd. was used.
  • Y pigment dispersion 1 “trade name: CF Yellow EX3393” manufactured by Mikuni Color Co., Ltd. was used.
  • the composition of Norder 1 was:
  • Colored photosensitive resin composition B1 was first weighed in amounts of B pigment dispersion 1, B pigment dispersion 2, and propylene glycol monomethyl ether acetate in the amounts shown in Table 2, and the temperature was 24 ° C (2 ° C).
  • B pigment dispersion 1 “trade name: CF Blue EX3357” manufactured by Mikuni Color Co., Ltd. was used.
  • B pigment dispersion 2 “trade name: CF Blue EX3383” manufactured by Mikuni Color Co., Ltd. was used.
  • the composition of binder 3 is
  • a transparent electrode of ITO Indium Tin Oxide
  • ITO Indium Tin Oxide
  • a glass substrate was prepared as a counter substrate, patterned on the transparent electrode of the color filter substrate and the counter substrate for the PVA mode, respectively, and an alignment film made of polyimide was further provided thereon.
  • an epoxy resin sealant is printed at a position corresponding to the black matrix outer frame provided around the pixel group of the color filter, and a liquid crystal for PVA mode is dropped on the opposite substrate and lOkg. After bonding at a pressure of / cm 2 , the bonded substrate was heat treated to cure the sealant. A polarizing plate HLC2-2518 made by Sanritz Co., Ltd. was attached to both surfaces of the liquid crystal cell thus obtained.
  • red (R) LED FR 1112H (chip type LED manufactured by Stanley Electric Co., Ltd.)
  • green (G) LED DG 1112H (chip type LED manufactured by Stanley Electric Co., Ltd.)
  • blue (B) LED DB1112H Chip-type LED manufactured by Stanley Ichi Electric Co., Ltd.
  • a color filter was formed in the same manner as in Example 1 except that the formulation of the photosensitive resin composition 2 shown in Table 1 was changed.
  • Ultrasonic disperser Ultrasonic generator model US-6600 ccvp, manufactured by nissei
  • composition The following composition was mixed to prepare a photosensitive resin composition. ⁇ composition ⁇
  • the obtained photosensitive resin composition was applied onto a glass substrate using a spin coater and dried at 100 ° C. for 5 minutes to form a photosensitive resin layer.
  • the protective layer coating solution obtained in Example 1 was applied onto this photosensitive layer using a spin coater so that the dry film thickness was 1.5; ⁇ ⁇ , and dried at 100 ° C. for 5 minutes.
  • a protective layer was formed, and a substrate on which a coating film serving as a dark color separation wall was formed was produced.
  • RGB pixels were formed in the same manner as in Example 1 to produce a color filter and a liquid crystal display device.
  • Example 3 a color filter and a liquid crystal display device were produced in the same manner as in Example 3 except that the photosensitive resin composition was changed to the following formulation.
  • a substrate having a dark color separation wall formed thereon was produced as follows.
  • the alkali-free glass substrate was cleaned with a UV cleaning device, then brush-cleaned with a cleaning agent, and further ultrasonically cleaned with ultrapure water.
  • This substrate was heat treated at 120 ° C for 3 minutes to stabilize the surface state. Thereafter, the substrate was cooled, adjusted to 23 ° C., and then coated with a glass substrate coater MH-1600 (manufactured by FAS Asia Co., Ltd.) having slit-shaped nozzles according to the composition shown in Table 3 below.
  • the resulting colored photosensitive resin composition K1 was applied onto this substrate.
  • VCD vacuum dryer
  • a KOH developer (KOH, containing a non-ionic surfactant, product name: CDK— 1.Fuji Film Elect Mouth-X Materials Co., Ltd. diluted 100 times with pure water) is spray-developed with a flat nozzle force of 23 ° C and a nozzle pressure of 0.04 MPa for 80 seconds. I got a black pattern. Subsequently, ultrapure water was sprayed onto the glass substrate on which the black pattern was formed with an ultrahigh pressure washing nozzle at a pressure of 9.8 MPa to remove the residue, thereby forming a black matrix on the alkali-free glass substrate. Then heat treatment (beta) at 220 ° C for 30 minutes, A substrate on which a dark color separation wall was formed was produced.
  • KOH containing a non-ionic surfactant, product name: CDK— 1.Fuji Film Elect Mouth-X Materials Co., Ltd. diluted 100 times with pure water
  • compositions of DPHA solution and surfactant 1 in Table 3 are the same as in Example 1.
  • RGB pixels were formed on the produced substrate on which the dark color separation wall was formed, and a color filter and a liquid crystal display device were produced.
  • Comparative Example 1 a color filter and a liquid crystal display device were produced in the same manner as in Comparative Example 1, except that the colored photosensitive resin composition K1 was changed to the formulation K2 in Table 3.
  • Comparative Example 1 a color filter was produced in the same manner as in Comparative Example 1 except that the substrate on which the photosensitive resin layer K1 was formed was subjected to maskless exposure as in Example 1 to form a pattern.
  • Comparative Example 2 a color filter was produced in the same manner as in Comparative Example 2, except that the substrate on which the photosensitive resin layer K2 was formed was subjected to maskless exposure as in Example 1 to form a pattern.
  • Example 1 a color filter was prepared in the same manner as in Example 1 except that the substrate on which the coating film to be the dark color separation wall was formed was subjected to the exposure performed in Comparative Example 1 to form a pattern. did.
  • Example 2 a color filter was prepared in the same manner as in Example 2, except that the substrate on which the coating film to be the dark color separation wall was formed was subjected to the exposure performed in Comparative Example 1 to form a pattern. did.
  • the black matrix was formed by the transfer method using the photosensitive transfer material prepared as follows, not by the coating method using the photosensitive resin composition 1 listed in Table 1.
  • a substrate on which a dark color separation wall was formed was produced in the same manner as in Example 1, and then RGB pixels were formed in the same manner as in Example 1 to produce a color filter.
  • the silver-tin alloy particles are a composite of AgSn alloy and Ag metal by X-ray scattering. It was confirmed that they were coalesced.
  • thermoplastic resin layer consisting of the following formulation HI using a slit nozzle.
  • thermoplastic resin layer It was dried at ° C for 3 minutes to form a thermoplastic resin layer.
  • thermoplastic resin layer On this thermoplastic resin layer, an intermediate layer coating solution having the following formulation P1 was applied using a slit coater so that the dry film thickness was 1.5 / zm, and 100 ° The intermediate layer was laminated by drying for 3 minutes at C.
  • the obtained photosensitive resin composition 1 was further applied onto the above intermediate layer using a slit-shaped nozzle, and dried at 100 ° C for 5 minutes, to form a photosensitive resin. A fat layer was formed.
  • a 12 m thick polypropylene film was pressure-bonded on the photosensitive layer, and a protective film was provided.
  • a photosensitive transfer material having a laminated structure of the PET temporary support Z, the thermoplastic resin layer, the Z intermediate layer, the Z photosensitive layer, and the Z protective film was produced.
  • thermoplastic resin layer HI Various components of the following formulation HI were mixed to prepare a coating solution for a thermoplastic resin layer. Prescription of coating solution for thermoplastic resin layer HI—
  • the exposed photosensitive layer is overlaid so that it is in contact with the surface of the glass substrate (thickness: 1.1 mm) that is the transfer target.
  • the rubber roller was bonded at a temperature of 130 ° C, a linear pressure of 100 NZcm, and a conveying speed of 2.2 mZ.
  • the PET temporary support was peeled off and transferred so that the photosensitive resin layer Z intermediate layer Z thermoplastic resin layer was laminated in this order on the glass substrate (transfer process).
  • the glass substrate on which the dark color separation wall is formed is heated to 220 ° C by the substrate preheating device. After heating at 60 ° C for 60 minutes, it was further heated at 240 ° C for 50 minutes for beta treatment (beta process).
  • RGB pixels were formed in the same manner as in Example 1 to produce a color filter.
  • the optical density of the black matrix after beta was measured by the following method.
  • the transmitted optical density (OD) of the substrate with the light shielding film was measured at a wavelength of 555 nm, and the glass used for each of the substrates with the light shielding film.
  • a three-wavelength cold-cathode tube light source (FWL18EX-N manufactured by Toshiba Lighting & Technology Co., Ltd.) was used, and a color was placed between two polarizing plates (G1220DUN manufactured by Nitto Denko Corporation).
  • the Y value of the chromaticity of the light that passes when the filter is installed and installed in parallel coll is used as the luminance.
  • a color luminance meter (BM-5 manufactured by Topcon Co., Ltd.) was used for chromaticity measurement.
  • Two polarizing plates, a color filter, and a color luminance meter are installed at a position 13 mm from the knocklight, a polarizing plate at a position 40 mm to 60 mm, and a cylinder 11 mm in diameter and 20 mm in length.
  • the measured light was irradiated to a measurement sample installed at a position of 65 mm, and the transmitted light was measured with a color luminance meter installed at a position of 400 mm through a polarizing plate installed at a position of 100 mm.
  • the measurement angle of the color luminance meter was set to 2 °.
  • the amount of light from the backlight was set so that the brightness was 1280 cdZm 2 when two polarizing plates were installed in a parallel coll with no sample installed.
  • the evaluation is A when 1.05 or higher, B when 1.0 and lower than 1.05, and C when 1.0 or lower. .
  • Line width variation rate is less than 2%
  • Line width variation rate is 2% or more and less than 5%
  • Line width fluctuation rate is 5% or more and less than 8%
  • a three-wavelength cold-cathode tube light source (FWL18EX-N manufactured by Toshiba Lighting & Technology Co., Ltd.) was used, and a color was placed between two polarizing plates (G1220DUN manufactured by Nitto Denko Corporation). Set the filter by dividing the Y value of the chromaticity of the light that passes when the polarizing plate is installed in parallel-col by the Y value of the chromaticity of the light that passes when installed in the cross-col. Asked. A color luminance meter (BM-5 manufactured by Topcon Co., Ltd.) was used for chromaticity measurement.
  • BM-5 manufactured by Topcon Co., Ltd.
  • Two polarizing plates, a color filter, and a color luminance meter are installed at a position 13 mm from the knocklight, a polarizing plate at a position 40 mm to 60 mm, and a cylinder 11 mm in diameter and 20 mm in length.
  • the measured light was irradiated to a measurement sample installed at a position of 65 mm, and the transmitted light was measured with a color luminance meter installed at a position of 400 mm through a polarizing plate installed at a position of 100 mm.
  • the measurement angle of the color luminance meter was set to 2 °.
  • the amount of light from the backlight was set so that the brightness was 1280 cdZm 2 when two polarizing plates were installed in a parallel coll with no sample installed.
  • the case of 3000 or more was evaluated as A, and the case of less than 3000 was evaluated as B.
  • a dark color separation wall was formed by the same formulation and method as in Example 2.
  • a color filter and a liquid crystal display device were produced in the same manner as in Example 2 except that the formation method of the colored pixels was changed to the following method.
  • each of R, G, and B inks (colored liquid composition) was applied to the gaps of the dark color separation walls and colored.
  • a pigment, a polymer dispersant and a solvent are mixed, and a pigment dispersion is obtained using a three roll and a bead mill, while the pigment dispersion is sufficiently stirred with a dissolver, etc.
  • R (red) ink was prepared by adding small amounts of the above materials.
  • G (green) ink was prepared in the same manner as in the case of R ink except that the same amount of CI pigment green 36 was used instead of CI pigment red 254 in the above-described yarn.
  • a B (blue) ink was prepared in the same manner as for the R ink except that the same amount of CI pigment blue 15: 6 was used instead of CI pigment red 254 in the following composition.
  • the color filter after pixel coloring was beta-cured in an oven at 230 ° C for 30 minutes to completely cure the dark color separation wall (black matrix) and each pixel to obtain a color filter.
  • Example 1 the formation of the dark color separation wall on the substrate by the application of the coating is performed in the same manner as in Example 1 except that the film thickness of the dark color separation wall is formed as follows. After forming the wall, colored pixels were formed in the same manner as in Example 6, and then a color filter was manufactured.
  • Example 1 the formation of the dark color separation wall on the substrate by the application of the coating is performed in the same manner as in Example 1 except that the film thickness of the dark color separation wall is formed as follows. After forming the wall, colored pixels were formed in the same manner as in Example 6, and then a color filter was manufactured.
  • Example 3 the formation of a dark color separation wall on the substrate by applying the coating in the same manner as in Example 3 except that the film thickness of the dark color separation wall is 2 m. After the separation wall was formed, colored pixels were formed in the same manner as in Example 6, and then a color filter was manufactured.
  • Example 3 the formation of the dark color separation wall on the substrate by applying the coating in the same manner as in Example 3 except that the film thickness of the dark color separation wall is 3 m. After the separation wall was formed, colored pixels were formed in the same manner as in Example 6, and then a color filter was manufactured.
  • a dark color separation wall was formed by the same formulation and method as in Comparative Example 2.
  • Comparative Example 2 the same procedure as in Comparative Example 2 was performed, except that the film thickness of the dark color separation wall was 2 m, and the method for forming the colored pixels was changed to the same inkjet method as in Example 6. A color filter was prepared.
  • Comparative Example 2 the film thickness of the dark color separation wall was set to 3 m, and the coloring pixel forming method was changed to the same inkjet method as in Example 6, and was the same as Comparative Example 2. A color filter was prepared.
  • a dark color separation wall was formed by the same formulation and method as in Comparative Example 4.
  • a color filter and a liquid crystal display device were produced in the same manner as in Comparative Example 4 except that the colored pixel forming method was changed to the same inkjet method as in Example 6.
  • Comparative Example 4 is the same as Comparative Example 4 except that the film thickness of the dark color separation wall is 2 m and the formation method of the colored pixels is changed to the inkjet method similar to Method Example 6 below. A color filter was produced in the same manner as described above.
  • Comparative Example 4 a color filter was produced in the same manner as in Comparative Example 4 except that the film thickness of the dark color separation wall was 3 m.
  • a dark color separation wall was formed by the same formulation and method as in Comparative Example 6.
  • a color filter and a liquid crystal display device were produced in the same manner as in Comparative Example 6 except that the color pixel forming method was changed to the same inkjet method as in Example 6.
  • a color filter was prepared in the same manner as in Comparative Example 6 except that the film thickness of the dark color separation wall was 2 m in Comparative Example 6.
  • Comparative Example 6 except that the film thickness of the dark color separation wall is 3 m. A color filter was produced in the same manner as in Comparative Example 6.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ophthalmology & Optometry (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Liquid Crystal (AREA)
  • Mechanical Optical Scanning Systems (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un filtre de couleur, caractérisé en ce qu'il comprend une étape consistant à balayer relativement une couche de composition de résine photosensible contenant une résine et/ou son précurseur, et des particules d’un métal ou d'un alliage et/ou des particules composites d’un métal et d'un alliage et/ou des particules composites d’un alliage et d'un alliage, en utilisant un dispositif de modulation de lumière spatial disposé en deux dimensions, tout en modulant la lumière sur la base de données d'image pour constituer une image bidimensionnelle par exposition et ainsi former des parois de pixel de couleur profonde. L’invention concerne également un filtre de couleur produit par ce procédé de production et un dispositif d'affichage à cristaux liquides utilisant le filtre de couleur.
PCT/JP2006/325367 2005-12-28 2006-12-20 Filtre de couleur, son procédé de fabrication et dispositif d’affichage à cristaux liquides Ceased WO2007074694A1 (fr)

Priority Applications (2)

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JP2007551919A JPWO2007074694A1 (ja) 2005-12-28 2006-12-20 カラーフィルタ及びその製造方法、並びに液晶表示装置
CN2006800491098A CN101346646B (zh) 2005-12-28 2006-12-20 滤色器及其制造方法、及液晶显示装置

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JP2005380201 2005-12-28

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105898113A (zh) * 2014-05-07 2016-08-24 光宝科技股份有限公司 图像获取模块及其组装方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010134550A1 (fr) * 2009-05-20 2010-11-25 旭硝子株式会社 Procédé de fabrication d'éléments optiques
CN112415673A (zh) 2019-01-17 2021-02-26 苏州旭创科技有限公司 一种光学组件
CN210605074U (zh) 2019-11-27 2020-05-22 苏州旭创科技有限公司 一种光学组件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004240039A (ja) * 2003-02-04 2004-08-26 Fuji Photo Film Co Ltd ブラックマトリックス作製用着色組成物及び感光性転写材料、ブラックマトリックス及びその製造方法、カラーフィルター、液晶表示素子並びにブラックマトリックス基板
JP2005215149A (ja) * 2004-01-28 2005-08-11 Fuji Photo Film Co Ltd 感光性転写材料、画像の形成方法及びブラックマトリックス
WO2005116775A1 (fr) * 2004-05-31 2005-12-08 Fuji Photo Film Co., Ltd. Procédé de formation de motif, procédé de fabrication de filtre couleur, filtre couleur, et affichage à cristaux liquides

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004240039A (ja) * 2003-02-04 2004-08-26 Fuji Photo Film Co Ltd ブラックマトリックス作製用着色組成物及び感光性転写材料、ブラックマトリックス及びその製造方法、カラーフィルター、液晶表示素子並びにブラックマトリックス基板
JP2005215149A (ja) * 2004-01-28 2005-08-11 Fuji Photo Film Co Ltd 感光性転写材料、画像の形成方法及びブラックマトリックス
WO2005116775A1 (fr) * 2004-05-31 2005-12-08 Fuji Photo Film Co., Ltd. Procédé de formation de motif, procédé de fabrication de filtre couleur, filtre couleur, et affichage à cristaux liquides

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105898113A (zh) * 2014-05-07 2016-08-24 光宝科技股份有限公司 图像获取模块及其组装方法

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CN101346646A (zh) 2009-01-14
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KR20080080187A (ko) 2008-09-02
CN101346646B (zh) 2011-04-13

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