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WO2007043695A9 - Composition de résine thermoconductrice - Google Patents

Composition de résine thermoconductrice

Info

Publication number
WO2007043695A9
WO2007043695A9 PCT/JP2006/320792 JP2006320792W WO2007043695A9 WO 2007043695 A9 WO2007043695 A9 WO 2007043695A9 JP 2006320792 W JP2006320792 W JP 2006320792W WO 2007043695 A9 WO2007043695 A9 WO 2007043695A9
Authority
WO
WIPO (PCT)
Prior art keywords
parts
weight
resin composition
conductive resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/320792
Other languages
English (en)
Japanese (ja)
Other versions
WO2007043695A1 (fr
Inventor
Takayuki Miyashita
Takashi Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of WO2007043695A1 publication Critical patent/WO2007043695A1/fr
Publication of WO2007043695A9 publication Critical patent/WO2007043695A9/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Definitions

  • the present invention relates to a heat conductive resin composition excellent in injection moldability and extrusion moldability, and excellent in heat and moisture resistance and wear characteristics.
  • PPS Polyphenylene sulfide
  • PAS Polyarylene sulfide represented by resin
  • the present invention provides a material having high heat conductivity excellent in moldability, heat and humidity resistance and wear characteristics.
  • the present invention provides to polyarylene sulfide Huai de resin 100 parts by weight, and crystal water does not contain a formula MgC0 3 heat transfer conductive resin composition obtained by blending 50 to 500 parts by weight of Magunesai bets indicated by. Detailed Description of the Invention
  • the PAS resin used in the present invention is mainly composed of-(Ar-S)-(where Ar is an arylene group) as a repeating unit.
  • arylene groups include p-phenylene group, m-phenylene group, o-phenylene group, substituted phenyl group, p, p'-diphenylene sulfone group, p, p '— Biphenylene group, p' p '— diphenylene group, p, p' — diphenylene carbonyl group, naphthalene group, etc. can be used.
  • those having a p-phenylene sulfide group as a repeating unit and using a p-phenylene group as an arylene group are particularly preferably used.
  • the copolymer among the arylene sulfide groups composed of the above-mentioned arylene groups, two or more different combinations can be used. Among them, p-phenylene sulfide group and m-sulfide group can be used. ⁇ ⁇ ⁇ ⁇ Combinations containing nylene sulfide groups are particularly preferred. In this, 70 moles of p-phenylene sulfide group. / 0 or more, preferably 80 mol. /.
  • the above-mentioned materials are appropriate from the viewpoint of physical properties such as heat resistance, fluidity (formability), and mechanical properties.
  • a high molecular weight polymer having a substantially linear structure obtained by condensation polymerization from a monomer mainly composed of a bifunctional halogen aromatic compound can be particularly preferably used.
  • a small amount of a monomer such as a polyhaloaromatic compound having three or more halogen substituents is used to partially form a branched structure or a crosslinked structure.
  • Polymers can also be used, and relatively low molecular weight linear structure polymers are heated at high temperatures in the presence of oxygen or an oxidant to increase melt viscosity by oxidative crosslinking or thermal crosslinking, thereby improving molding processability. Polymers or mixtures thereof can also be used.
  • the PAS resin used in the present invention is mainly composed of the linear PAS resin (the viscosity at 310 ° C * slipping rate lOOOsec- 1 is 10 to 300 Pa ⁇ s), and a part thereof to 30 wt%, preferably 2 ⁇ 25 wt%) force ;, mixed system with branched or cross-linked PAS resin having relatively high viscosity (300 to 3000 Pa ⁇ s, preferably 500 to 2000 Pa ⁇ s).
  • the PAS resin used in the present invention is preferably obtained by purifying by-product impurities and the like by performing acid cleaning, hot water cleaning, organic solvent cleaning (or a combination thereof) after polymerization.
  • Magunesai preparative represented by the chemical formula MgC0 3 containing no crystal water used in the present invention is a material different from what is conventionally referred to as magnesium carbonate.
  • the substance conventionally called magnesium carbonate is (3-5) MgC0 3.
  • (3- 7) basic salt containing water of crystallization of H 2 0, is that arsenide Dorokishi magnesium carbonate.
  • This magnesium hydroxide carbonate releases its crystal water when heated at around 100 ° C and decomposes violently at around 330 ° C, the PAS resin kneading temperature, causing problems such as PAS resin foaming and decomposition. Generated and cannot be kneaded.
  • a synthetic product is obtained by treating the above-mentioned magnesium hydroxide carbonate under high temperature and high pressure, and does not cause trouble due to crystal water or impurities.
  • Magnesite produced by such a method is generally available as high-purity magnesi ⁇ M S L, M S HP (Makishima Chemical Co., Ltd.).
  • the amount of magnesi rice cake added is important. If the amount added is too small, the desired thermal conductivity will not be exhibited, and conversely if the amount added is too large, the moldability will deteriorate. Therefore, the added amount of magnetite is 50 to 500 parts by weight, preferably 100 to 400 parts by weight with respect to 100 parts by weight of the PAS resin.
  • the alkoxysilane compound used in the present invention may be at least one selected from the group consisting of an aminoalkoxysilane, a vinylenoalkoxysilane, an epoxyalkoxysilane, a mercaptoalkoxysilane, and an arylalkoxysilane.
  • Any aminoalkoxysilane may be used as long as it is a silane compound having one or more amino groups in one molecule and having two or three alkoxy groups.
  • ⁇ -butylaminopropyltrimethoxysilane, ⁇ —aminopropyltriethoxysilane, ⁇ —aminopropylmethyldimethoxysilane, ⁇ —aminopropylmesyl examples include tiljetoxysilane, N- (jS-aminoethyl) 1 ⁇ -aminomino trimethylsilane, N-phenyl 1 ⁇ -aminopropyl trimethoxysilane, and the like.
  • any silane compound having one or more bur groups in one molecule and having two or three alkoxy groups is effective.
  • any silane compound having one or more epoxy groups in one molecule and having two or three alkoxy groups is effective.
  • ⁇ -glycidoxypropyltrimethoxysilane ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyl ligatoxysilane, and the like.
  • any silane compound having one or more allyl groups and two or three alkoxy groups in one molecule is effective.
  • ⁇ -diaryl Examples include aminopropyltrimethoxysilane, ⁇ -arylaminopropyltrimethoxysilane, and ⁇ -arylthiopropyltrimethoxysilane.
  • the addition amount of the alkoxysilane compound is important. If the amount of the alkoxysilane compound is small, the mechanical properties after the PCT are remarkably deteriorated. Therefore, the addition amount of the alkoxysilane compound is 0.1 to 5 parts by weight, preferably 0.5 to 4 parts by weight with respect to 100 parts by weight of the PAS resin.
  • the thermally conductive resin composition of the present invention is within the scope of the present invention and is inorganic or organic for improving performance such as mechanical strength, heat resistance, dimensional stability (deformation resistance, warpage), and electrical properties. Machine fillers may be blended, and for this purpose, fibrous, powdery, or plate-like fillers are used.
  • fibrous filler examples include inorganic fibrous materials such as glass fiber, asbestos fiber, boron fiber, and titanic acid lithium fiber.
  • a particularly typical fibrous filler is glass fiber.
  • High melting point organic fiber materials such as polyamide, fluororesin, and acryl resin can also be used.
  • Magnesia ⁇ High purity magnesite MSK P, chemical formula MgC0 3 , average particle size 22 ⁇ , manufactured by Kamishima Chemical Co., Ltd.
  • Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Comparative Example 3 Weight part 100 100 100 100 100 100 100 100 F Q. Filler 1 65 65 300

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne un matériau présentant une conductivité thermique élevée ainsi qu’une aptitude au moulage, une résistance à la chaleur humide et des caractéristiques d’usure excellentes. Selon un aspect spécifique de l’invention, 50 à 500 parties en poids d’un magnésite ne contenant pas d’eau de cristallisation sont mélangées pour 100 parties en poids d’une résine de sulfure polyarylène.
PCT/JP2006/320792 2005-10-13 2006-10-12 Composition de résine thermoconductrice Ceased WO2007043695A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-298409 2005-10-13
JP2005298409A JP2007106854A (ja) 2005-10-13 2005-10-13 熱伝導性樹脂組成物

Publications (2)

Publication Number Publication Date
WO2007043695A1 WO2007043695A1 (fr) 2007-04-19
WO2007043695A9 true WO2007043695A9 (fr) 2007-06-07

Family

ID=37942909

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/320792 Ceased WO2007043695A1 (fr) 2005-10-13 2006-10-12 Composition de résine thermoconductrice

Country Status (3)

Country Link
JP (1) JP2007106854A (fr)
CN (1) CN101283049A (fr)
WO (1) WO2007043695A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810963B2 (ja) * 2005-10-17 2011-11-09 東ソー株式会社 ポリアリーレンスルフィド組成物
JP4929670B2 (ja) * 2005-10-17 2012-05-09 東ソー株式会社 ポリアリーレンスルフィド組成物
JP5435494B2 (ja) * 2010-07-12 2014-03-05 協和化学工業株式会社 増粘剤
EP4159812A4 (fr) * 2020-06-02 2024-06-26 DIC Corporation Composition de résine de sulfure de polyarylène, article moulé, et procédés de fabrication associés

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2925930B2 (ja) * 1994-07-04 1999-07-28 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物
JP5031175B2 (ja) * 2002-12-26 2012-09-19 ポリプラスチックス株式会社 ポリアリーレンサルファイド樹脂組成物
JP4455911B2 (ja) * 2004-03-26 2010-04-21 神島化学工業株式会社 無水炭酸マグネシウムフィラー及びその製造方法、樹脂組成物
JP2006160979A (ja) * 2004-12-10 2006-06-22 Konoshima Chemical Co Ltd フィラー及びその製造方法、樹脂組成物
JP4884691B2 (ja) * 2005-04-13 2012-02-29 神島化学工業株式会社 合成ゴム組成物

Also Published As

Publication number Publication date
WO2007043695A1 (fr) 2007-04-19
CN101283049A (zh) 2008-10-08
JP2007106854A (ja) 2007-04-26

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