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WO2007043267A1 - Dispositif et procédé de retrait d'une feuille - Google Patents

Dispositif et procédé de retrait d'une feuille Download PDF

Info

Publication number
WO2007043267A1
WO2007043267A1 PCT/JP2006/318007 JP2006318007W WO2007043267A1 WO 2007043267 A1 WO2007043267 A1 WO 2007043267A1 JP 2006318007 W JP2006318007 W JP 2006318007W WO 2007043267 A1 WO2007043267 A1 WO 2007043267A1
Authority
WO
WIPO (PCT)
Prior art keywords
peeling
sheet
ring frame
adhesive sheet
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/318007
Other languages
English (en)
Japanese (ja)
Inventor
Masahisa Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2007539834A priority Critical patent/JP4851466B2/ja
Publication of WO2007043267A1 publication Critical patent/WO2007043267A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a sheet peeling apparatus and a peeling method for peeling a plate-like member force adhesive sheet such as a semiconductor wafer integrated with a ring frame via an adhesive sheet.
  • a semiconductor wafer (hereinafter simply referred to as “wafer”) is integrated with an adhesive sheet stretched on an inner peripheral region of a ring frame when performing back surface grinding or the like. Generally done. This adhesive sheet finally peels and removes the wafer and ring frame force.
  • Patent Document 1 discloses such an adhesive sheet peeling apparatus.
  • Patent Document 1 Japanese Patent Laid-Open No. 11 16862
  • Patent Document 1 has a configuration in which a peeling sheet or tape is attached to an adhesive sheet, and the adhesive sheet is peeled by pulling the peeling sheet. There is an inconvenience that a separate seat is required and the running cost is high. In addition, a device for supplying a peeling sheet and a sheet cutting device are also required, which causes inconvenience that the device is complicated.
  • the present invention has been devised by paying attention to such inconveniences, and the object thereof is to eliminate the need for a sheet or tape for peeling, and to reduce the force and the structure of the apparatus. It is providing the peeling apparatus and the peeling method.
  • the present invention provides an adhesive from the ring frame and the plate-like member in a state where the plate-like member integrated with the inner peripheral region of the ring frame via an adhesive sheet is supported.
  • a peeling means for peeling the sheet with a ring frame force
  • the peeling tacking portion forming means includes a peeling force applying member that displaces a part of the adhesive sheet in a direction to lift the ring frame force at a position along the inner peripheral edge portion of the ring frame.
  • the peeling force applying member is constituted by a piece member that is attached to a rotating shaft positioned along a radial direction of the ring frame and lifts a part of the adhesive sheet,
  • a configuration including an arc-shaped end edge along the inner peripheral edge of the ring frame can be adopted.
  • the peeling force applying member can be constituted by a nozzle that blows gas to a part of the sheet.
  • the peeling force applying member is configured by a piece member attached to a rotating shaft positioned along a radial direction of the ring frame, and a nozzle that blows gas to a part of the sheet. You may take the structure of.
  • a sensor for detecting the presence or absence of the peeling hooking portion is provided in the vicinity of the formation region of the peeling hooking portion, and when the sensor does not detect the peeling hooking portion, the ring frame is moved in a plane. Rotating the peeling tacking portion forming means by a predetermined angle and re-operating;
  • the present invention provides a plate-like member force supported on the inner peripheral region of the ring frame via an adhesive sheet, in a sheet peeling method for peeling the adhesive sheet,
  • a peeling force application member for forming a peeling tacking portion is positioned at a position along the inner peripheral edge of the ring frame,
  • the adhesive sheet is partially lifted to form a peeling tacking portion.
  • the sheet-like member force supported on the inner peripheral region of the ring frame via an adhesive sheet, the sheet peeling method for peeling the adhesive sheet,
  • a piece member for forming a peeling tacking portion is positioned substantially parallel to the adhesive sheet at a position along the inner peripheral edge of the ring frame, and one end side of the piece member is rotated. Rotate the other end side as the center to partially lift the adhesive sheet with the ring frame force to form a peeling tacking part,
  • the sheet-like member force supported on the inner peripheral region of the ring frame via the adhesive sheet is a sheet peeling method for peeling the adhesive sheet.
  • a nozzle that ejects a gas for forming a peeling tacking portion is positioned at a position along the inner peripheral edge of the ring frame, and the nozzle force gas is supplied to a part of the sheet.
  • the adhesive sheet causes the ring frame force to partially lift to form a peeling tack portion
  • the present invention provides a plate-like member force supported on the inner peripheral region of the ring frame via an adhesive sheet, in a sheet peeling method for peeling the adhesive sheet,
  • a piece member for forming a peeling tacking portion and a nozzle for jetting gas are positioned at a position along the inner peripheral edge of the ring frame, and one end side of the piece member is rotated. Simultaneously, the other end side is rotated around the center to cause the adhesive sheet to partially lift the ring frame force and the force to blow the gas to the adhesive sheet to cause the adhesive sheet to partially lift the ring frame force.
  • a peeling tacking portion it is preferable to take a method in which the adhesive sheet is peeled by grasping the peeling tacking portion.
  • the peeling force applying member is used, and the peeling force applying member is displaced in a direction in which the adhesive sheet is lifted at a position along the inner peripheral edge portion of the ring frame. Therefore, the necessity of using a separate sheet or tape for performing initial peeling can be eliminated, and the configuration of the peeling apparatus can be simplified.
  • the peeling force applying member is constituted by a piece member and / or a nozzle, and the piece member partially includes an arcuate edge along the inner peripheral edge of the ring frame. Since the gas is blown to the part, the peeling force can be applied at the position closest to the outer edge of the adhesive sheet, so that the peeling force can be effectively applied.
  • the load on each member can be reduced, and a strong peeling force can be exerted.
  • a sensor for detecting the presence or absence of the peeling tacking portion is provided, and when the peeling tacking portion is not detected even though the peeling force applying member rotates and the peeling operation is completed, the ring frame Since the position can be changed and the peeling tacking part can be formed again
  • FIG. 1 is a schematic perspective view of a sheet peeling apparatus according to the present embodiment.
  • FIG. 2 The schematic plan view of FIG.
  • FIG. 3 is a right side view of FIG.
  • FIG. 4 A schematic perspective view similar to FIG. 1 with some components omitted.
  • FIG. 5 is a side view of an essential part showing an initial state where sheet peeling is performed.
  • FIG. 6 is a side view of the main part showing an intermediate stage of sheet peeling.
  • FIG. 7 is a schematic perspective view similar to FIG. 4 showing a modification.
  • FIG. 8 is a side view of an essential part similar to FIG. 5, showing a modification.
  • left and right is the direction along the X axis in FIG. 2
  • front and back is used for the Y axis
  • up and down is used for the direction along the Z axis.
  • FIG. 1 shows a schematic perspective view of a sheet peeling apparatus according to the present embodiment
  • FIG. 2 shows a schematic plan view
  • FIG. 3 shows a schematic side view of FIG. Yes.
  • FIG. 3 is shown in a state where some components in the vertical direction are separated from each other in order to avoid complication of the drawing.
  • the sheet peeling apparatus 10 includes a holding means 11 for holding the wafer W as a plate-like member integrated with the ring frame RF via the adhesive sheet S, and a part of the adhesive sheet S for the ring frame RF.
  • Peeling part forming means 12 that also peels off force
  • peeling means 15 that peels off the holding part S1 (see FIG. 5) formed by the peeling part forming part 12, and the peeling part S1 Sensor for detecting the presence or absence of 16 (Fig. 5 Reference) and comprising.
  • the adhesive sheet S is configured to include an ultraviolet curable adhesive layer on the support surface (the lower surface in FIG. 1) side of the wafer W. It comes to be irradiated with ultraviolet rays through the irradiation device!
  • the holding means 11 is rotatable in a plane via a base 20 having a substantially square shape in plan view and a motor M located at the center of the base 20.
  • a suction table 22 provided with a suction surface that is provided at the center of the table 21 and sucks the lower surface side of the wafer W, and a pair of front and rear columns 23 on the left and right upper surfaces of the table 21;
  • a pair of cylinders 27 that are positioned and support the upper pressing plate 26 so as to be movable up and down are provided.
  • the cylinder 27 is fixed to the table 21 and is supported by a frame (not shown).
  • the peeling tacking portion forming means 12 has a pair structure in this embodiment. Specifically, a pair of motors Ml that are supported via an eaves support member (not shown) around the table 21, a rotary shaft 30 connected to the output shaft of these motors Ml, and each rotary shaft 30 And a single member 32 as a peeling force applying member fixed to the free end side. As shown in FIG.
  • the single member 32 has an arcuate edge 32A having an outer edge shape along the inner peripheral edge of the ring frame RF, a linear portion 32B connected to the tip of the arcuate edge 32A, and the straight line 2B is provided with a curved edge portion 32C positioned between the end portion 32B and the tip end portion of the rotary shaft 30, and the linear portions 32B of the single members 32 face each other and are arranged symmetrically in FIG. ing. Accordingly, the piece member 32 is displaced symmetrically so that the ring frame RF force also rises when the linear portion 32B side is rotationally displaced about the rotating shaft 30.
  • the peeling means 15 includes a pair of front and rear chuck members 40 disposed above the piece members 32. These chuck members 40 are provided so as to be spaced apart from each other and accessible, and supported by a guide member (not shown) disposed at a position above the ring frame RF via a frame or the like, in the Y-axis direction, that is, the ring frame. RF radial direction It is provided so that it can move along and can be moved up and down.
  • the sensor 16 detects the presence or absence of the peeling tacking portion S1 of the adhesive sheet S, and is configured by an optical sensor.
  • the single member 32 rotates, it moves to the position shown in FIG. 5, while when the peeling tacking portion S1 is detected, it is moved to a predetermined guide member so as to retreat to a position that does not interfere with the subsequent peeling operation. It is supported.
  • the sheet peeling operation in the present embodiment will be described with reference to FIG. 5 and FIG.
  • the adhesive force is lowered by pre-irradiating the adhesive region between the ring frame RF and the adhesive sheet S and the adhesive region between the adhesive sheet S and Ueno and W with ultraviolet rays.
  • the ring frame RF in which the wafer W is integrated through the adhesive sheet S is taken out from a predetermined stock force via a transfer robot, not shown!
  • the transfer robot transfers the outer peripheral portion of the ring frame RF so as to ride on the lower presser plate 24.
  • the upper pressing plate 26 is lowered by the operation of the cylinder 27, and the ring frame RF is sandwiched between the lower pressing plate 24.
  • the suction table 22 sucks the wafer W, and the strip member 32 of the peeling hooking portion forming means 12 is positioned on the lower surface side of the adhesive sheet S in a substantially horizontal posture.
  • the arcuate edge 32A waits at a position along the inner periphery of the ring frame RF.
  • the sensor 16 is positioned on both sides of the peeling hooking portion S1, and when the sensor 16 detects the peeling hooking portion S1, the sensor 16 moves backward, while the chuck 16
  • the member 40 approaches the position indicated by the solid line from the position indicated by the two-dot chain line in FIG. 5 and grasps the peeling tacking portion S1. Thereafter, the chuck member 40 moves to the left side as shown in FIG.
  • Lame RF force Adhesive sheet S is collected in a collection box (not shown) after it has been peeled off and completely peeled off.
  • the table 21 is The motor M is driven to rotate at a predetermined angle in the horizontal plane to change the formation region of the peeling tacking portion, and the peeling member forming operation is performed again by the single member 32, and the sensor 16 is moved to the peeling tacking portion. The same operation is repeated until S1 is detected. Note that it is also possible to determine that there is a separation failure by giving a limit to the number of operations and to notify the operator.
  • the peeling tacking portion S1 can be formed only by rotating the piece member 32, so that the running cost is minimized and the adhesive sheet S is attached to the ring frame RF force. It can be reliably peeled off.
  • a configuration in which a nozzle 50 as a peeling force applying member is provided below the pair of piece members 32 can be employed.
  • a gas supply source (not shown) is connected to the nozzle 50, and the gas discharged from the tip end of the nozzle is blown to the formation region of the peeling tacking portion, thereby giving a peeling force together with the piece member 32.
  • the peeling tacking portion S1 can be formed more reliably.
  • the present invention does not prevent the single member 32 from being omitted and a structure in which gas is blown from the nozzle 50 to the adhesive sheet S to apply a peeling force.
  • the gas to be blown may be not only air but also inert gas such as nitrogen gas or other gas.
  • the chuck member 40 is moved in the Y-axis direction, that is, the ring frame R.
  • the force base 20 is configured to be peeled by moving along the radial direction of F.
  • the base 20 is supported on an appropriate guide rail so that it can run, and the table side is moved along the guide rail in the Y-axis direction. As well.
  • the plate-like member is a wafer
  • other plate-shaped electronic components glass, a resin substrate, a metal plate, and the like may be used.
  • the peeling tacking portion forming means 12 has a pair structure, but may have a single structure.
  • one piece member may be configured to be rotatable about the rotation axis.
  • the present invention only needs to be provided so as to impart a lifting force to the adhesive sheet S.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Le dispositif de retrait de feuille (10) selon l'invention comporte un moyen de support (11) servant à tenir une plaquette (W) intégrée dans une aire de circonférence interne d'une structure annulaire (RF) au moyen d'un adhésif (S) ; un moyen de création d'une portion de démarrage du retrait (12) de la feuille d'adhésif (S) ; et un moyen de retrait (15) qui se déplace dans une direction de retrait en maintenant une portion de démarrage du retrait (S1). Le moyen de création d'une portion de démarrage du retrait (12) comporte un élément de pièce (32) qui se déplace en tournant dans une direction permettant à une partie de la feuille d’adhésif (S) de s’élever depuis la structure annulaire (RF) jusqu’à une position le long de l’extrémité de la circonférence interne de la structure annulaire (RF). Le retrait est effectué en permettant à un dispositif de serrage (40), qui constitue le moyen de retrait (15), de maintenir la portion de démarrage du retrait (S1) retirée par l'élément de pièce (32).
PCT/JP2006/318007 2005-10-13 2006-09-12 Dispositif et procédé de retrait d'une feuille Ceased WO2007043267A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007539834A JP4851466B2 (ja) 2005-10-13 2006-09-12 シート剥離装置及び剥離方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005299291 2005-10-13
JP2005-299291 2005-10-13

Publications (1)

Publication Number Publication Date
WO2007043267A1 true WO2007043267A1 (fr) 2007-04-19

Family

ID=37942522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/318007 Ceased WO2007043267A1 (fr) 2005-10-13 2006-09-12 Dispositif et procédé de retrait d'une feuille

Country Status (3)

Country Link
JP (1) JP4851466B2 (fr)
TW (1) TW200717591A (fr)
WO (1) WO2007043267A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165901A (ja) * 2009-01-16 2010-07-29 Lintec Corp シート剥離装置および剥離方法
JP2013504888A (ja) * 2009-09-15 2013-02-07 イーアールエス エレクトロニック ゲーエムベーハー 除去ローラ、ディスク状のワークピースからフィルムを分離させるための装置及び方法
KR101798769B1 (ko) 2016-06-15 2017-12-12 강제원 반도체 스트립의 보호필름 디테이핑 시스템, 및 이 디테이핑 시스템을 이용한 보호필름 제거방법

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4729003B2 (ja) * 2007-06-08 2011-07-20 リンテック株式会社 脆質部材の処理方法
JP1651622S (fr) 2019-07-17 2020-01-27

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211184A (ja) * 1991-12-10 1993-08-20 Nec Corp ダイボンディング装置
JPH0697264A (ja) * 1992-09-11 1994-04-08 Nitto Denko Corp ダイシングテープからの不良チップ剥離装置
JP2003273196A (ja) * 2002-03-19 2003-09-26 Sanken Electric Co Ltd 半導体素子ピックアップ装置用突き上げ部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211184A (ja) * 1991-12-10 1993-08-20 Nec Corp ダイボンディング装置
JPH0697264A (ja) * 1992-09-11 1994-04-08 Nitto Denko Corp ダイシングテープからの不良チップ剥離装置
JP2003273196A (ja) * 2002-03-19 2003-09-26 Sanken Electric Co Ltd 半導体素子ピックアップ装置用突き上げ部材

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165901A (ja) * 2009-01-16 2010-07-29 Lintec Corp シート剥離装置および剥離方法
JP2013504888A (ja) * 2009-09-15 2013-02-07 イーアールエス エレクトロニック ゲーエムベーハー 除去ローラ、ディスク状のワークピースからフィルムを分離させるための装置及び方法
KR101798769B1 (ko) 2016-06-15 2017-12-12 강제원 반도체 스트립의 보호필름 디테이핑 시스템, 및 이 디테이핑 시스템을 이용한 보호필름 제거방법

Also Published As

Publication number Publication date
TW200717591A (en) 2007-05-01
JP4851466B2 (ja) 2012-01-11
JPWO2007043267A1 (ja) 2009-04-16

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