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WO2007042101A1 - Procede permettant de retirer d'un emballage des colles fusibles autoadhesives - Google Patents

Procede permettant de retirer d'un emballage des colles fusibles autoadhesives Download PDF

Info

Publication number
WO2007042101A1
WO2007042101A1 PCT/EP2006/008107 EP2006008107W WO2007042101A1 WO 2007042101 A1 WO2007042101 A1 WO 2007042101A1 EP 2006008107 W EP2006008107 W EP 2006008107W WO 2007042101 A1 WO2007042101 A1 WO 2007042101A1
Authority
WO
WIPO (PCT)
Prior art keywords
packaging
adhesive
hot melt
cooled
packaging material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2006/008107
Other languages
German (de)
English (en)
Inventor
Holger TÖNNIESSEN
Thomas Möller
Ralf Grauel
Rafael Serrano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Priority to EP06776912A priority Critical patent/EP1943149B1/fr
Priority to DE502006003129T priority patent/DE502006003129D1/de
Publication of WO2007042101A1 publication Critical patent/WO2007042101A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B69/00Unpacking of articles or materials, not otherwise provided for

Definitions

  • the invention relates to a method for removing the packaging of permanently tacky hot melt adhesives, so-called hot melt adhesives.
  • a process is described for quickly and easily separating such hot-melt pressure-sensitive adhesives from the packaging.
  • Hot melt pressure sensitive adhesives are known in the literature.
  • WO 2004/013244 A1 describes hot-melt pressure-sensitive adhesives based on radiation-crosslinkable binders. A field of application for such hot-melt pressure-sensitive adhesives is described as applying to self-adhesive labels.
  • hot melt pressure sensitive adhesives are described in US 5,204,390 consisting of a thermoplastic resin together with a plasticizer and a tackifier resin.
  • hot melt pressure sensitive adhesives are also disclosed in WO 01/98427 A1. As a use, the use as an adhesive for self-adhesive labels is described.
  • the object of the invention is therefore to provide a method to allow a cheap and simple packaging of strongly permanent adhesive hot melt adhesives and at the same time to allow easy and easy unpacking of the hot melt adhesives often present in block form.
  • the object is achieved by a method for unpacking hotmelt adhesives, in which the hotmelt PSA is present as a shaped body and these shaped bodies are enclosed with a packaging material, wherein the packaging material on the side facing the hotmelt adhesive adhesive has an adhesion-reducing surface, and the hot melt adhesive before removing the enveloping Packaging material is cooled to a temperature at which the hot melt adhesive with reduced pressure tack is present.
  • An embodiment of the present invention employs flexible packaging materials. These are intended to envelop the hot-melt pressure-sensitive adhesive, can adapt to the shape of the adhesive and can be removed from the hotmelt adhesive molding according to the method of the invention. Another embodiment of the invention works with solid containers. In this, the hotmelt adhesive can be filled. Such packages should have a shape that has an at least straight shape from an openable side, but preferably a slightly conical tapered shape. After the cooling according to the invention, the hot melt pressure-sensitive molded articles can be easily removed from the solid packaging.
  • the particularly flexible packaging materials which are suitable for a preferred procedure according to the invention are known to the person skilled in the art. It is usual paper, cardboard or foil material. This should be so flexible that they can assume the particular shape of the hot-melt pressure-sensitive adhesive to be packaged. For example, round or square shaped bodies are to be enveloped can.
  • the packaging should also be able to adapt to a possibly uneven surface. Furthermore, the material should be removed during removal.
  • the packaging material suitable according to the invention should be resistant to tearing, ie the tensile strength or tensile strength of the flexible material should be so great that it is higher than the force required to overcome the separation of flexible packaging material and hot-melt adhesive at a temperature corresponding to the process of the invention.
  • the tensile strength should be so high in practice that film or paper in large pieces or preferably in the whole can be deducted. Possibly.
  • predetermined breaking points may be predetermined, for example on edges, to allow a quick removal.
  • cardboard packaging these should also be in pieces, eg. B. entire sides, can be removed.
  • the tear strength must be present at the temperatures of the unpacking, for example from +10 ° C to -200 ° C, preferably from 0 ° C to -100 ° C.
  • Suitable films may for example be made of polyethylene, polypropylene, polyamide or other commercially available polymer films. The polymer films may by themselves have a low adhesion to the hot-melt pressure-sensitive adhesive.
  • Suitable paper materials are also known. These should be provided with an adhesion-reducing coating at least on the side facing the hot-melt adhesive.
  • Such films, paper, cardboard can consist of one layer, preferably they should be composed of at least two different layers. These are therefore two-layered or multi-layered materials, wherein the coating should contain adhesion-reducing substances. Examples of such substances are known to the person skilled in the art.
  • the coatings may be silicone compounds or siliconized materials. However, it is also possible to apply perfluorinated coating materials. These coatings should adhere firmly to the packaging material, only the adhesion to the adhesive should be reduced.
  • the surfaces facing the hot melt adhesive are smooth, but it is also possible to use surfaces having an adhesion-reducing structure.
  • Such papers are commercially available under the name Laufenberg, NSA 1350/56 BF from B. Laufenberg GmbH.
  • Suitable coated paperboard materials are also known, e.g. B. under the name Packomelt 86946, silicon coated the company Pacomelt GmbH.
  • the shape of the hotmelt adhesive bodies to be packaged in this embodiment is variable. They should only have a sufficient size and shape, so that the removal of the packaging from the surface of the moldings is made possible cost.
  • the shaped bodies can be cuboid, cubic, cylindrical or in the form of a strand or block, for example. There are also irregular shapes possible. In principle, strand-like or angular packaging forms are particularly favorable for dense storage.
  • these hot-melt adhesive moldings must be enveloped on the contacting sides with a packaging material suitable according to the invention. Possibly. it is expedient to wrap these coated adhesive moldings individually or in a plurality with another outer packaging.
  • suitable films or paper first in an additional external form.
  • These may be tubular structures or barrel-shaped or square outer packaging. These are designed on the inner surface with the packaging material suitable according to the invention, after which, if appropriate, the still flowable, hot melt adhesive can be introduced.
  • the hotmelt adhesive it is also possible to allow the hotmelt adhesive to solidify into molds and then to coat it in the cold with a packaging material suitable according to the invention.
  • the hot melt pressure sensitive adhesives are filled into solid containers. These are generally on the inside with an adhesion-reducing coating, for. B. a silicone coating or a plastic coating provided. Furthermore, it is necessary that the packages are open at least on one side.
  • the opening must have a size that corresponds to the maximum cross section of the package Holhl stresses. This can be, for example, the opening of a barrel lid. It is also possible for smaller containers to provide a tear line on the container on which a part of the container can be separated.
  • the container itself may preferably be made of metal or plastic, but it is also possible to use dimensionally stable, preferably multi-layer cardboard packaging.
  • the inside of the solid packaging materials should be substantially smooth. There should be no protrusions, dents, beads or the like on the wall of the packaging body.
  • the side surfaces should be smooth, so that a removal of the hot melt adhesive molded article is easily possible.
  • the side walls with respect to the intended opening of the packaging means should be at least straight, cylindrical in rotationally symmetrical bodies. Preferably, however, it is also expedient that the side walls are slightly tapered away from the surface to be opened. This is si cherograph that the molding can be removed without mechanical interference or entanglement of the packaging material.
  • Such packaging materials are already known. These may be conventional drums, barrels, hobbocks or canisters made of coated metal, plastic or cardboard materials, the side walls being smooth, cylindrical or slightly conical. Another possibility is, for example, an embodiment of pyramidally shaped round or rectangular shaped bodies, wherein the large bottom side is to be provided as the opening side.
  • Typical hot melt pressure sensitive adhesives are composed of base polymers, tackifying resins, optionally plasticizers, waxes, oils and various additives. The adhesives should be solid at room temperature and melt at elevated temperatures, for example from 80 0 C. However, they should have a high adhesion to the substrate at room temperature, ie a high surface tack.
  • base polymers are elastomeric or thermoplastic polymers.
  • elastomers are acrylate, polyester urethane, ethylene acrylate, butyl rubber; Natural rubber; Ethylene-propylene copolymers; Ethylene-vinyl acetate copolymers or styrene copolymers such as styrene-isoprene-styrene (SIS), styrene-butadiene-styrene (SBS), SEBS or SIBS block copolymers;
  • thermoplastic binders are ethylene-vinyl acetate (EVA) polymers, amorphous poly- ⁇ -olefins (APAO), polyurethanes, polyether esters and polyether amides. Particularly suitable are also the thermoplastic elastomers.
  • the resin is said to increase the tackiness of the base polymer and to improve the compatibility of the hot melt adhesive components.
  • these are, for example, hydroabietyl alcohol and its esters; modified natural resins of balsam resin, tall resin, root resin, partially hydrogenated rosin; Acrylic acid copolymers, preferably styrene-acrylic acid copolymers or resins based on functional hydrocarbon resins.
  • Waxes may also be included in the hot melt pressure sensitive adhesive.
  • the wax used may be natural, chemically modified or synthetic origin. Vegetable waxes, animal waxes can be used as natural waxes, mineral waxes or petrochemical waxes as synthetic waxes. Also chemically modified waxes are known.
  • hotmelt adhesives often contain plasticizers. These may be, for example, monohydric or polyhydric alcohols, in particular Polyalkylene glycols, mineral oils or esters of organic carboxylic acids, such as liquid polyesters, glycerol esters or esters of aromatic dicarboxylic acids.
  • hot melt adhesive customary auxiliaries and additives can be added. These are, for example, stabilizers, color pigments, fillers, adhesion promoters, catalysts or initiators.
  • the hot melt pressure sensitive adhesives used in the present invention have a glass transition temperature (Tg) of about -100 0 C to about 50 0 C (measured by DSC).
  • Tg glass transition temperature
  • M N average molecular weight of the base polymers is about 5,000 to about 500,000 g / mol (as determined by GPC).
  • the hot-melt pressure sensitive adhesives can build up the adhesion due to their melting behavior, but they can also be reactive hot melt pressure sensitive adhesives.
  • Hot-melt adhesives based on, for example, styrene-isoprene-styrene block copolymers are described in EP 0 451 920; those based on polyacrylate copolymers are described, for example, in WO 02/10307.
  • Adhesives of the type mentioned are generally known to the person skilled in the art.
  • the hot melt pressure sensitive adhesives can be prepared by known methods.
  • the components are melted individually or successively, homogenized and then discharged from the mixing unit. They can be discharged, for example in the form of strands on, for example, a cooled base, in the case of non-reactive hot melt adhesives, for example, in a cooling liquid. After the hot melt adhesives have solidified, they can be packaged and packaged. Furthermore, it is possible to pour the liquid hot melt pressure sensitive adhesives into molds. If necessary, the molds can be cooled from the outside in order to allow rapid solidification of the hot-melt adhesives.
  • suitable flexible paper, cardboard or foil materials can be done in different ways. For example, it is possible to coat the discharged and solid adhesive moldings with a flexible material. This can be done at usual temperatures. However, it is also possible to cool the adhesive blocks in advance and pack in the cold with less surface adhesion in appropriate flexible packaging materials.
  • the molds in which the hotmelt adhesive is intended to solidify are lined with packaging materials suitable according to the invention before the hotmelt adhesive is introduced. Then it is possible to remove these packaged directly from the molds after solidification, in which case possibly the top is still covered and packaged.
  • the adhesive is filled directly into stable packaging.
  • This package may be provided on the inside with a suitable surface coating. It is in this way so the packaging later removed from the hot melt adhesive.
  • the hotmelt adhesives are additionally packed in stable containers as outer packaging. Also in this case it is necessary to pack the hotmelt PSA in accordance with the invention suitable, non-adhesive, flexible tear-resistant materials. These shaped bodies can then remain in the outer packaging for transport and storage.
  • the hot-melt adhesive molded bodies packaged according to the invention can have any desired shape. They are provided on parts of the surface or on all surfaces with a paper, cardboard or foil packaging according to the invention and then do not adhere to each other. They can therefore be stacked or individually or packaged in several additional packaging.
  • Hot melt adhesive tablets packaged in accordance with the invention can be transported and stored at normal temperatures to the user. This can be done at room temperature. However, it is also possible that the hot-melt pressure sensitive adhesives already transported cooled to the user at low temperature. At the latest at the user, the hot-melt adhesive moldings are cooled and brought to a low temperature, so that the pressure-sensitive adhesive is significantly reduced or no longer present. Depending on the property profile of the hotmelt PSA, temperatures below 10 ° C.
  • the temperature above -200 0 C should, preferably about - 100 ° C, especially preferably above -35 0 C.
  • the force can be measured by known test methods for release liners, for example according to Pritt K 7476 (Henkel KGaA). The force should be below 5 N / 20mm, in particular below 2 N / 20 mm.
  • the cooling can be done by immersion in liquid materials, for example, cooled organic liquids, cooled aqueous solutions or liquid gases, eg. As liquid nitrogen. It can be provided solid coolant, for. As solid CO 2 , ice, or it is possible to store the hot melt adhesive blocks in refrigerators or cold rooms, at least in the short term. Also a flat contact with cooled, good heat conducting surfaces is possible.
  • the cooling of the molding can be done continuously. However, it is sufficient and preferred according to the invention if only the surface of the moldings is cooled from all sides to a suitable temperature. The cooled layer on the surface can be up to 1 cm. But it is also sufficient if only the surface of the hot melt pressure sensitive adhesive up to 0.5 mm is cooled to such a temperature. This can also be achieved by only briefly applied coolant.
  • the packaged hot-melt adhesive moldings can be unpacked. This should generally be done immediately after the cooling phase to prevent significant surface tack from being generated again by external heating.
  • these claddings can be unfolded and removed at possible abutting edges or folds. Due to the tear-resistant design of the flexible packaging material can be easily deduct the packaging materials in large pieces of the hot melt adhesive. Adhesion on the surface of the hot-melt pressure-sensitive adhesive is reduced by the cold and possibly also by the surface coating. Possibly. it is possible, by cutting with knives, scissors and similar objects, to produce corresponding edges and cuts on the packaging in order to remove the flexible covering from there. Another embodiment of the invention uses pre-embossed tear edges or tearing lines on the flexible package, which are designed as predetermined break points to tear the package there and remove it from the packaged hot melt pressure sensitive adhesive.
  • the corresponding container can have break lines or tear edges.
  • cylindrical containers can be made from spirally wound flexible materials that open when unpacked along this tear edge and can be removed in one piece.
  • the packages can be cooled with the hot-melt pressure-sensitive adhesive. In this case, before or after the openings for removing the hot melt pressure sensitive adhesive be exposed. After cooling, the containers are rotated so that the opening points downwards or diagonally downwards. Due to the reduced adhesion of the hot melt adhesive body, supported by its own weight and possibly by mechanical measures, the hot melt adhesive molded article can slide out of the container and be introduced directly into the melting device. Since the packaging material is inherently strong, there will be no contamination of the surface of the hot-melt pressure-sensitive adhesive, so that a further after-treatment is not necessary.
  • the hot-melt adhesive moldings are placed in the melting aggregates present for melting.
  • the temperature is to be selected so that during the storage time no sticking or no sticking of the hotmelt PSA can occur with each other or each other.
  • the inventive method for packaging and unpacking permanently tacky hot-melt pressure sensitive adhesives at low temperature it is possible to store such adhesives in larger quantities and to unpack shortly before use. By reducing the tack, it is possible to remove the corresponding packaging materials over a large area. This also prevents, if necessary, that corresponding packaging residues, which are melted with, must be removed by filtration.
  • Another advantage of the procedure according to the invention is that the removed packages generally have no residues of hotmelt adhesives and can be disposed of immediately or that they are reusable. Furthermore, a simplified procedure in the unpacking is possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Wrappers (AREA)

Abstract

L'invention concerne un procédé d'emballage, de transport et de déballage de colles fusibles autoadhésives d'adhésion longue durée. L'emballage est constitué de papier et/ou matières feuilles flexibles ou de corps creux indéformables. Avant le déballage, la colle fusible autoadhésive est refroidie au moins sur la surface en étant ramenée à des températures telles que l'adhésion soit réduite lors de l'enlèvement des matières emballages.
PCT/EP2006/008107 2005-10-14 2006-08-17 Procede permettant de retirer d'un emballage des colles fusibles autoadhesives Ceased WO2007042101A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP06776912A EP1943149B1 (fr) 2005-10-14 2006-08-17 Procede permettant de retirer d'un emballage des colles fusibles autoadhesives
DE502006003129T DE502006003129D1 (de) 2005-10-14 2006-08-17 Verfahren zum entfernen der verpackung von schmelzhaftklebstoffen

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005049680A DE102005049680B3 (de) 2005-10-14 2005-10-14 Verfahren zum Entfernen der Verpackung von Schmelzhaftklebstoffen
DE102005049680.6 2005-10-14

Publications (1)

Publication Number Publication Date
WO2007042101A1 true WO2007042101A1 (fr) 2007-04-19

Family

ID=37037473

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/008107 Ceased WO2007042101A1 (fr) 2005-10-14 2006-08-17 Procede permettant de retirer d'un emballage des colles fusibles autoadhesives

Country Status (4)

Country Link
EP (1) EP1943149B1 (fr)
AT (1) ATE425089T1 (fr)
DE (2) DE102005049680B3 (fr)
WO (1) WO2007042101A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008051223A1 (de) 2008-10-14 2010-04-15 Rehatec Dieter Frank Gmbh Vorrichtung zum Sitzen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333439A (en) * 1992-09-22 1994-08-02 Croda Apex Adhesives, Inc. Hot-melt pressure sensitive adhesive packaging, preform, and method
WO2001040058A2 (fr) * 1999-12-03 2001-06-07 Pu-Dosen-Recycling Gmbh + Co. Betriebs Kg Procede et dispositif pour evacuer de maniere controlee au moins un constituant du contenu d'un emballage contenant du gaz comprime

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3314536A (en) * 1962-12-10 1967-04-18 Swift & Co Packaging adhesives in casings
US5204390A (en) * 1989-09-08 1993-04-20 H.B. Fuller Company Hot melt adhesive resistant to ultraviolet light-induced degradation and to plasticizer migration
DE4009686C2 (de) * 1990-03-26 1996-07-18 Bayerische Motoren Werke Ag Vorrichtung zum Entleeren eines mit pastösen Medien gefüllten Foliensackes
US5118762A (en) * 1990-04-11 1992-06-02 Shell Oil Company Styrene-isoprene-styrene block copolymer composition for low viscosity low temperature hot melt adhesives
ES2068793T3 (es) * 1992-05-18 1998-12-16 Nat Starch Chem Invest Metodo para envasar adhesivos de fusion en caliente.
DE10128061A1 (de) * 2000-06-23 2002-01-24 Henkel Kgaa UV-beständiger Schmelzhaftklebstoff, Verfahren zu dessen Herstellung sowie daraus hergestellte, haftklebrige Gegenstände
DE10036804A1 (de) * 2000-07-28 2002-02-07 Tesa Ag Haftklebemassen auf Basis von Blockcopolymeren der Struktur P(B)-P(A/C)-P(B)
DE10234369A1 (de) * 2002-07-27 2004-02-12 Henkel Kgaa Strahlungsvernetzbare Schmelzhaftklebstoffe

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5333439A (en) * 1992-09-22 1994-08-02 Croda Apex Adhesives, Inc. Hot-melt pressure sensitive adhesive packaging, preform, and method
WO2001040058A2 (fr) * 1999-12-03 2001-06-07 Pu-Dosen-Recycling Gmbh + Co. Betriebs Kg Procede et dispositif pour evacuer de maniere controlee au moins un constituant du contenu d'un emballage contenant du gaz comprime

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008051223A1 (de) 2008-10-14 2010-04-15 Rehatec Dieter Frank Gmbh Vorrichtung zum Sitzen

Also Published As

Publication number Publication date
DE102005049680B3 (de) 2007-03-08
ATE425089T1 (de) 2009-03-15
EP1943149A1 (fr) 2008-07-16
EP1943149B1 (fr) 2009-03-11
DE502006003129D1 (de) 2009-04-23

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