WO2007040258A1 - 有機無機複合膜形成物品 - Google Patents
有機無機複合膜形成物品 Download PDFInfo
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- WO2007040258A1 WO2007040258A1 PCT/JP2006/319945 JP2006319945W WO2007040258A1 WO 2007040258 A1 WO2007040258 A1 WO 2007040258A1 JP 2006319945 W JP2006319945 W JP 2006319945W WO 2007040258 A1 WO2007040258 A1 WO 2007040258A1
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- Prior art keywords
- organic
- composite film
- inorganic composite
- film
- formed article
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
- C03C17/009—Mixtures of organic and inorganic materials, e.g. ormosils and ormocers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Definitions
- the present invention relates to an article on which an organic-inorganic composite film is formed.
- Glass materials are generally hard and are also used in the form of a film covering a substrate. However, if a glassy film is to be obtained, the melting method requires high-temperature treatment, which limits the materials that can be included in the substrate and the coating film.
- sol-gel method a solution of a metal organic or inorganic compound is used as a starting material, and the solution is converted into metal oxide or hydroxide fine particles by hydrolysis reaction and condensation polymerization reaction of the compound in the solution.
- This is a method in which a sol in which sol is dissolved, gelled and solidified, and this gel is heated to obtain an oxide solid.
- the sol-gel method makes it possible to produce a glassy film at a low temperature.
- a method for forming a silica-based film by the sol-gel method is disclosed in, for example, Japanese Patent Application Laid-Open No. 11-269657.
- a silica-based film formed by a sol-gel method is inferior in mechanical strength as compared to a glassy film obtained by a melting method.
- At least one of silicon alkoxide and its hydrolyzate is 0.0010 to 3% by weight in terms of silica, acid 0.001
- a method of forming a silica-based film by applying an alcohol solution containing 0 to 1.0 N and 0 to 10% by weight of water as a coating liquid to a substrate is disclosed.
- the silica-based film obtained by this method has a strength enough to withstand the dry cloth abrasion test, and although it is not sufficient, the film obtained by the sol-gel method has good mechanical properties. Has strength.
- a silica-based film that can be formed by the method disclosed in Japanese Patent Application Laid-Open No. 11-269657 is limited to a maximum thickness of 250 ⁇ m in order to ensure a practical appearance.
- the thickness of the silica-based film formed by the sol-gel method is usually about 100 to 20 Onm.
- a silica-based film is formed by applying a coating liquid a plurality of times to form a multilayer film. It can be thick. However, the adhesion at the interface of each layer is lowered, and the wear resistance of the silica-based film may be lowered. There is also a problem that the manufacturing process of the silica film is complicated.
- a technique for forming an organic-inorganic composite film in which an inorganic material and an organic material are combined by a sol-gel method has been proposed. Since the sol-gel method is characterized by film formation at a low temperature, a silica-based film containing an organic substance can be formed.
- the organic-inorganic composite film by the sol-gel method is disclosed, for example, in JP-A-3-212451, JP-A-3-56535, and JP-A-2002-338304.
- An object of the present invention is to provide a silica-based film excellent in mechanical strength while containing an organic substance.
- the present invention is an organic-inorganic composite film-forming article comprising a base material and an organic-inorganic composite film containing an organic material and an inorganic oxide formed on the surface of the base material,
- the organic / inorganic composite film includes silica as the inorganic oxide, the organic / inorganic composite film includes the silica as a main component, and an X-ray incident angle with respect to a film surface of the organic / inorganic composite film is fixed at 1 °.
- the value normalized by the intensity value of the halo pattern peak at 0 ° is (0.19A + 0.03) or less, and it is attributed to the Si—OH group in Fourier transform infrared spectroscopic analysis of the organic-inorganic composite film.
- the peak intensity value near 950 cm 1 is attributed to the Si—O—Si bond.
- an organic / inorganic composite film-formed article having a standardized value of the intensity value of a peak near 1100 cm 1 to which it belongs is 0.25 or less.
- the main component means that the content is the highest! The content is evaluated on a mass% basis.
- an organic-inorganic composite film excellent in mechanical strength of a film can be formed by a sol-gel method even if the film thickness is thicker than about 0.25 ⁇ m.
- the organic-inorganic composite film according to the present invention can have excellent abrasion resistance comparable to a glass plate obtained by a melting method.
- FIG. 1 is an example of an X-ray diffraction chart of an organic-inorganic composite film-formed article of the present invention.
- FIG. 2 is an example of an X-ray diffraction chart of a glass substrate.
- the X-ray incident angle (fixed angle) with respect to the film surface of the organic-inorganic composite film is fixed at 1 °
- the X-ray diffraction of the organic-inorganic composite film has a thickness of ⁇ ; ⁇ ⁇ ( (> 0), the intensity value of the peak at a diffraction angle of 3 ° to 10 ° is standardized with the intensity value of the halo pattern peak at a diffraction angle of 20 ° to 30 °. (0. 19A + 0.03)
- a film having a smaller value has a fine structure with fewer pores.
- FIG. 1 illustrates a chart obtained by X-ray diffraction of an organic-inorganic composite film-formed article according to the present invention.
- FIG. 2 is a chart obtained by X-ray diffraction for a glass plate on which no film is formed.
- a strong halo pattern peak appears at diffraction angles of 20 ° to 30 °. This is a peak due to the Si- ⁇ -Si bond forming the glass skeleton.
- Fig. 1 shows small peaks at diffraction angles of 3 ° to 10 °.
- the Si—O—Si bonds that form the skeleton of the membrane are not sufficiently developed, the mechanical strength of the membrane will not increase even if there are few pores. Therefore, in the present invention, in the Fourier transform infrared spectroscopic analysis of the organic-inorganic composite film, the peak intensity value (P3) near 950 cm 1 attributed to the Si—OH group is 1100 cm attributed to the Si—O—Si bond. Another condition is that the Si—O—Si bond has developed to some extent when the index (P3ZP4) specified by the intensity value of the peak near 1 (P 4) is 0.25 or less.
- the thickness of the organic-inorganic composite film is more than 0.25 m to 5 ⁇ m, further more than 0.3 ⁇ m to 5 ⁇ m, for example, excellent mechanical strength can be achieved even if the film is thicker to a certain extent in excess of 1 ⁇ m and below 5 ⁇ m.
- the organic-inorganic composite film is organic and inorganic to the extent that it does not peel off from the substrate cover.
- the mechanical strength of the composite membrane can be improved.
- the Taber abrasion test according to JIS R 3212 can be performed using a commercially available Taber abrasion tester. This test is a wear test at a rotation speed of 1000 times while applying a load of 500g as specified in the above 6JIS. According to the present invention, it is also possible to maintain the haze ratio of the portion to which the Taber abrasion test is applied, measured after the Taber abrasion test, at 4% or less.
- the film thickness A of the organic-inorganic composite film is the measured film thickness (A) when the film does not contain crystals (for example, indium stannate), and the film thickness A when the film contains crystals.
- Crystals for example, indium stannate
- a value obtained by multiplying the volume ratio in the measured film thickness of the organic-inorganic composite film (converted film thickness: A).
- the silicon alkoxide contained in the film-forming solution (coating solution) contains water and a catalyst (acid) in the coating solution. Or in the presence of an alkali), through a hydrolysis reaction and a condensation polymerization reaction, it becomes an oligomer via a siloxane bond, and the coating liquid becomes a sol state along with this.
- preparing the coating solution so that the average molecular weight of the oligomer derived from silicon alkoxide in the coating solution is not excessive is intended to improve the mechanical strength of the membrane. Very important.
- the average molecular weight of the silicon alkoxide-derived oligomer (condensate of silicon alkoxide hydrolyzate) in the coating solution is affected by factors such as the concentration of silicon alkoxide in the solution, the pH of the solution, and the stirring time of the solution.
- the mass average molecular weight of the condensate of the silicon alkoxide hydrolyzate in the coating solution when applied to the substrate is 20000 or less, more preferably 15000 or less, particularly 10000 or less, preferably 5000 or less, more preferably Is controlled to 3000 or less, more preferably 2000 or less, particularly preferably 1800 or less, and most preferably 1500 or less, whereby a film having good mechanical strength can be easily obtained.
- the average molecular weight of the oligomer derived from silicon alkoxide in the coating liquid becomes too large, secondary particles having a cyclic structure are likely to be generated in the coating liquid.
- the annular structure of secondary particles tends to cause pores in the membrane. For this reason, in order to obtain a film with V having few pores and good mechanical strength, it is preferable to suppress the formation of secondary particles in the coating liquid.
- the amount of the cyclic structure does not depend only on the average molecular weight of the oligomer, but to suppress the development of the cyclic structure, it is sufficient to control the average molecular weight of the oligomer in the coating solution.
- the film-forming solution is usually applied to a substrate with stirring for a long time.
- the average molecular weight of the oligomer derived from silicon alkoxide may be too large.
- the average molecular weight of the oligomer in the coating liquid is not determined only by the stirring time of the coating liquid, but the average molecular weight of the oligomer is often excessive at the stirring time normally applied.
- the pH of the coating solution may be controlled to about 1 to 3.
- the isoelectric point of silanol is 2. For this reason, when the pH of the coating solution is about 1 to 3, silanol is stably present in the solution, and the generation of secondary particles due to the progress of the dehydration condensation reaction can be suppressed.
- the proton of the strong acid is completely dissociated in the coating solution, the mass concentration of the proton (hereinafter sometimes simply referred to as "proton concentration") is about 0.001-0. ImolZkg.
- a strong acid is added so that the pH of the solution becomes about 3 to 1.
- the coating solution contains a mixed solvent of water and alcohol, and can be added with other solvents as necessary.
- a strong acid is used and the strong acid strength is also high.
- protons having an acid dissociation index of 1S 4 or higher in water of the acid used it is not necessary to consider protons having an acid dissociation index of 1S 4 or higher in water of the acid used. For example, since the acid dissociation index of acetic acid, which is a weak acid, in water is 4.8, even if acetic acid is included in the coating solution, the proton of acetic acid is not included in the above proton concentration.
- the dissociation stage of phosphoric acid is three stages, and there is a possibility of dissociating three protons per molecule.
- the first stage dissociation index is 2.15, which can be regarded as a strong acid
- the second stage dissociation index is 7.2
- the third stage dissociation index is even higher. Therefore, the above proton concentration premised on dissociation from a strong acid should be calculated assuming that only one proton dissociates from one molecule of phosphoric acid.
- Phosphoric acid after the dissociation of one proton is not a strong acid. It is not necessary to consider the second and subsequent proton dissociation.
- the strong acid specifically refers to an acid having protons having an acid dissociation exponential force in water.
- the reason for defining the proton concentration as the concentration when the proton of the strong acid is completely dissociated is that the degree of dissociation of the strong acid is accurately obtained in a mixture of an organic solvent such as alcohol and water. This is because it is difficult.
- the average molecular weight derived from silicon alkoxide is controlled so as not to become too large, and when this is applied to the substrate surface and dried, low polymerization occurs. Since the oligomers in the state are densely packed, the pores become small and a dense film can be obtained.
- This film is dense. Due to insufficient hydrolysis and polycondensation reaction of silicon alkoxide, even when heated at about 200 ° C, it does not exceed a certain hardness. For this reason, the hydrolysis and condensation polymerization reaction of silicon alkoxide is applied to the coating liquid. It is advisable to add water excessively to the silicon alkoxide so that it can proceed easily later. When the hydrolysis and polycondensation reactions are likely to proceed, the film tends to become hard without being heated to a high temperature. Specifically, the maximum number of moles required for hydrolysis, that is, four or more moles of water is added to the total number of moles of silicon atoms contained in the silicon alkoxide.
- the drying step water evaporates in parallel with the volatilization of the solvent.
- the number of moles of water is preferably more than 4 times the total number of moles of silicon atoms, for example, 4 to 20 times, more preferably 5 to 20 times.
- silicon alkoxides up to four alkoxyl groups can be bonded to one silicon atom.
- An alkoxide having a small number of alkoxyl groups reduces the number of moles of water required for hydrolysis.
- tetraalkoxysilane in which four alkoxyl groups are bonded to a silicon atom may be a polymer (for example, “Ethylsilicate manufactured by Colcoat”).
- the total number of moles of water required for hydrolysis is less than four times that of silicon atoms (assuming that the number of moles of Si in the polymer is n (n ⁇ 2))
- the stoichiometric amount of water required for hydrolysis is (2n + 2) moles).
- the silicon atom contained in the silicon alkoxide is adjusted according to the SiO concentration when converted to SiO so that the silicon alkoxide concentration is relatively high.
- a hydrophilic organic polymer may be further added to the coating solution.
- the hydrophilic organic polymer suppresses the occurrence of cracks that may occur as the liquid components contained in the applied coating liquid evaporate.
- the hydrophilic organic polymer is interposed between the silica particles generated in the liquid, and alleviates the influence of film shrinkage due to evaporation of the liquid component. If a hydrophilic organic polymer is added, the curing shrinkage of the film can be reduced, so the stress in the film is considered to be relaxed.
- the addition of an organic substance sometimes plays a role of maintaining the mechanical strength of the film while suppressing the shrinkage of the film.
- the hydrophilic organic polymer may be added to the coating solution in advance.
- organic-inorganic composite film formed from this coating solution it is considered that organic and inorganic substances are complexed at the molecular level.
- the hydrophilic organic polymer seems to suppress the growth of silica particles formed by the sol-gel reaction, and suppress the porosity of the film.
- hydrophilic organic polymer examples include polymers containing a polyoxyalkylene group (polyalkylene oxide structure).
- examples of the hydrophilic organic polymer containing a polyoxyalkylene group include polyethylene glycol, polyethylene oxide, a polyether-type dispersant, and a surfactant.
- hydrophilic organic polymer polybulur prolatatam, PVP (polybulurpyrrolidone) and a copolymer of burether may be used.
- the haze ratio of the portion to which the Taber abrasion test is applied can be 4% or less, further 3% or less. This is a mechanical strength corresponding to a vitreous film obtained by the melting method.
- the mass of the organic substance is 0.1 to 40%, particularly 2 to 40%, with respect to the total mass of the organic-inorganic composite film. If there is too much organic matter, the mechanical strength of the silica-based film may decrease.
- the organic-inorganic composite film according to the present invention may contain conductive fine particles.
- An example of the conductive fine particles is indium stannate (ITO).
- the organic-inorganic composite film according to the present invention is not limited to the above conductive fine particles, and may contain functional materials such as organic dyes and ultraviolet absorbers. Many organic substances that can be used as functional materials start to decompose at temperatures of 200 to 300 ° C. Even if it is an inorganic substance, the heat shielding ability of conductive fine particles typified by ITO is lowered by heating in a range exceeding 250 ° C.
- the organic-inorganic composite film can be sufficiently cured even when heated at about 200 ° C., so that these are not impaired in the organic-inorganic composite film without impairing the function of the functional material. Can be introduced.
- the hydrophilic organic polymer since the hydrophilic organic polymer is contained in the coating liquid, it is easy to uniformly disperse the functional material in the film.
- the phosphoric acid surfactant having a polyether group is particularly excellent in dispersibility.
- a dispersant may be further added to the coating liquid.
- Examples of the base material include a transparent substrate typified by a glass substrate or a resin substrate. If a substrate with a thickness exceeding 0.1 mm, further 0.3 mm or more, especially 0.5 mm or more is used, it is possible to more reliably prevent cracking and film peeling after the Taber abrasion test.
- the upper limit of the thickness is not particularly limited, but may be, for example, 20 mm or less, and further 10 mm or less.
- a coating solution containing silicon alkoxide, strong acid, water and alcohol, and further containing an organic substance is used.
- the coating liquid contains, for example, a hydrophilic organic polymer as an organic substance. Hydrophilic organic polymers are usually added as a separate component from strong acids.
- the polymer that functions as a strong acid such as a polymer containing a phosphate group, may be added as at least part of the strong acid.
- the method includes a step of applying an organic-inorganic composite film forming solution to the surface of the substrate, and a step of removing at least a part of the liquid component contained in the forming solution from the forming solution applied to the substrate.
- the forming solution contains silicon alkoxide, strong acid, water, alcohol, and organic matter. Concentration strength of silicon alkoxide SiO concentration when silicon atoms contained in the silicon alkoxide are converted to SiO
- the strong acid concentration is in the range of 0.001 to 0.2 molZkg, expressed by the molar concentration of protons assuming that the proton is completely dissociated from the strong acid.
- Yes more than 4 times the total number of moles of silicon atoms contained in the silicon alkoxide, and the mass average molecular weight of the condensate of silicon alkoxide hydrolyzate is less than 20000.
- the silicon alkoxide is preferably at least one selected from tetraethoxysilane and its polymer strength, and may contain a hydrolyzed alkoxyl group.
- the concentration of silicon alkoxide is expressed by the SiO concentration when the silicon atoms contained in the silicon alkoxide are converted to SiO, and it should be 3% by mass or more.
- silicon alkoxide concentration in the coating solution is too high, cracks may occur that cause the substrate to peel off.
- the concentration of organic matter is the same as the concentration of silicon alkoxide expressed as SiO concentration.
- the SiO content is 30% by mass or less.
- the concentration is set to B% by mass (5B-5).
- Concentration of organic substance is 0.1% by mass or more, especially 5% by mass with respect to the above SiO.
- the forming solution application step in the above-described method it is preferable to apply the organic-inorganic composite film forming solution onto the substrate while keeping the relative humidity of the atmosphere below 40%. phase
- the relative humidity By controlling the humidity to less than 40%, excessive suction of moisture in the atmosphere can be prevented more reliably, and the silica-based film after film formation tends to be a dense structure.
- the lower limit of the relative humidity of the atmosphere in the coating process is not particularly limited, but from the viewpoint of improving the handleability (coatability) of the formed solution, the relative humidity is controlled to, for example, 15% or more, and further 20% or more. It is preferable.
- Application of the forming solution under an atmosphere controlled so that the humidity is within the above range is important for achieving good wear resistance.
- the liquid component removing step in the above-described method is performed at a temperature of 400 ° C or lower, preferably 300 ° C or lower, more preferably 250 ° C or lower in consideration of the decomposition temperature of the organic matter.
- the lower limit temperature may be determined according to the required film hardness, and may be, for example, 100 ° C or higher, further 150 ° C or higher, and in some cases 180 ° C or higher.
- the removal process includes an air drying process at room temperature (25 ° C) and an atmosphere that is higher than room temperature and 400 ° C or less, for example, 100 ° C or more and 400 ° C or less, following the air drying process. It is good to carry out by the heat treatment process in the atmosphere of.
- the air drying step is preferably performed in an atmosphere in which the relative humidity is controlled to be less than 40%, and further to 30% or less. By controlling the relative humidity of the atmosphere within this range, the occurrence of film cracks can be more reliably prevented.
- the lower limit value of the relative humidity of the atmosphere in the air drying process is not particularly limited, but may be, for example, 15%, and 20%.
- the removing step at least a part, preferably substantially all, of the liquid components of the forming solution applied onto the substrate, such as water and alcohol, are removed.
- the film thickness exceeds, for example, 250 nm to 5 ⁇ m.
- An organic-inorganic composite film can be formed to a certain extent below.
- strong acids examples include hydrochloric acid, nitric acid, trichloroacetic acid, trifluoroacetic acid, sulfuric acid, phosphoric acid, methanesulfonic acid, paratoluenesulfonic acid, and oxalic acid.
- volatile acids can be preferably used because they do not volatilize when heated and remain in the cured film. If acid remains in the cured film, the inorganic components are prevented from binding and the film hardness decreases. May end up.
- the organic-inorganic composite film according to the present invention has a film hardness comparable to that of molten glass by heat treatment at a relatively low temperature. Even if this organic-inorganic composite film is applied to window glass for automobiles or buildings, it can withstand practical use.
- the substrate may be heated when removing the liquid component, if necessary.
- the heating temperature of the substrate should be adjusted appropriately according to the heat resistance of the functional material.
- the organic-inorganic composite film can be sufficiently cured even by heating at 100 to 300 ° C., or even 100 to 250 ° C.
- Ethyl alcohol made by Katayama Chemical 72. 20g, tetraethoxysilane (made by Shin-Etsu Chemical) 17.36g, pure water 10.19g, concentrated hydrochloric acid (35% by mass, manufactured by Kanto Chemical Co., Ltd.) 0.10g, poly 0.15 g of an ether phosphate ester polymer (Solsperse 41000 manufactured by Nippon Lubrizol) was added and stirred at 20 ° C. for 4 hours to obtain a forming solution.
- tetraethoxysilane made by Shin-Etsu Chemical
- pure water 10.19g
- concentrated hydrochloric acid (35% by mass, manufactured by Kanto Chemical Co., Ltd.
- poly 0.15 g of an ether phosphate ester polymer Solsperse 41000 manufactured by Nippon Lubrizol
- the content of silicon alkoxide (tetraethoxysilane) in this solution (in terms of silica), pourton concentration, and organic polymer concentration are as shown in Table 1.
- the organic polymer concentration is relative to the SiO when the silicon alkoxide concentration is expressed in terms of SiO concentration.
- the hardness of the film was evaluated by a wear test in accordance with JIS R 3212. That is, using a commercially available Taber abrasion tester (TABER INDUSTRIES 5150 ABRASER), the wear was performed 1000 times with a load of 500 g, and the haze ratio before and after the abrasion test was measured. Film thickness, presence or absence of film peeling after Taber test, and haze ratio before and after Taber test Are shown in Table 2. Table 2 also shows the haze ratio before and after the Taber test on a molten glass plate as a blank. The haze ratio was measured using HGM-2DP manufactured by Suga Test Instruments Co., Ltd.
- the X-ray diffraction measurement of the film was performed using an X-ray diffractometer (RAD-RC, manufactured by RIGAKU), using a sample formed on a glass substrate with a thickness of 2. lm, and the following system and conditions. It was measured.
- RAD-RC X-ray diffractometer
- Go meter Wide angle go meter
- Tube voltage 40kV
- tube current 150mA
- the knock ground removal was performed using the analysis software attached to the X-ray diffractometer described above.
- the infrared absorption spectrum was measured using a Fourier transform infrared spectrophotometer (JEOL Ltd. 3 ⁇ 4iIS— 5500), the reference was Si, and the film on the Si wafer was measured under the following conditions.
- Ethyl alcohol made by Katayama Chemical
- 51.52g tetraethoxysilane (made by Shin-Etsu Chemical Co., Ltd.) 25.OOg
- ethyl silicic acid 40 made by Colcoat
- 4.50g pure water 17.62g, concentrated hydrochloric acid (35% by mass) , Produced by Kanto Chemical Co., Ltd.
- 0.10 g polyether phosphate ester polymer (Solsperse 41000 manufactured by Nippon Lubrizol) 1. 26 g was added and stirred at 20 ° C. for 4 hours to obtain a forming solution.
- This ethyl silicate 40 is excellent in silica supply efficiency, viscosity, specific gravity, storage stability and product cost, and has features such as easy handling during use.
- Example 2 Thereafter, a film was formed on the glass substrate in the same manner as in Example 1.
- the obtained film was a highly transparent film without cracks having a measured film thickness (A) of 1240 nm.
- A measured film thickness
- Table 1 shows the composition of the forming solution and Table 2 shows the measured values.
- Ethyl alcohol made by Katayama Chemical
- 26.43g tetraethoxysilane (made by Shin-Etsu Chemical Co., Ltd.)
- 36. l lg ethyl silicate 40 (made by Colcoat) 6.50g, pure water 25. 66g, concentrated hydrochloric acid (35 mass) %, Manufactured by Kanto Chemical Co., Ltd.) 0.1 g, polyether phosphate ester polymer (Solsperse 41000 manufactured by Nippon Lubrizol) 5. 20 g was added and stirred at 20 ° C. for 4 hours to obtain a forming solution.
- Example 2 Thereafter, a film was formed on the glass substrate in the same manner as in Example 1.
- the obtained film had a measured film thickness (A) of 2880 nm and was a highly transparent film free from cracks.
- A measured film thickness
- Table 1 shows the composition of the forming solution and Table 2 shows the measured values.
- Comparative Example 1 is an example in which no organic polymer is added.
- Example 2 Thereafter, a film was formed on the glass substrate in the same manner as in Example 1.
- the obtained film was a highly transparent film without cracks having an actually measured film thickness (A) of 830 nm.
- A actually measured film thickness
- Example 1 The characteristics were measured in the same manner as in Example 1.
- the composition of the forming solution is shown in Table 1, and the measured values obtained are shown in Table 1.
- Comparative Example 3 is an example in which no heat treatment is performed.
- Example 2 Except for the lack of power (heating) using an oven after drying at room temperature! In the same manner as in Example 1, a film was formed on a glass substrate. [0091] The obtained film was a highly transparent film having a measured film thickness (A) of 770 nm without cracks.
- the characteristics of the obtained film were measured in the same manner as in Example 1.
- the composition of the forming solution is shown in Table 1, and the measured values obtained are shown in Table 2.
- Comparative Example 3 Although the number of pores was small, the Si—O—Si bond in the film was not sufficiently formed, and the mechanical strength was not high enough.
- Si-OH can be heat-treated. However, the film shrinks when heat treatment is performed. In particular, in the case of a thick film, the shrinkage of the film accompanying the heat treatment increases and cracks tend to occur in the film.
- the Si—OH group was successfully converted to the Si—O—Si bond while suppressing the shrinkage of the film, thereby achieving high mechanical strength.
- Comparative Example 4 is a commercially available sol-gel material HAS-10 (made by Colcoat)
- Example 2 Thereafter, a film was formed on the glass substrate in the same manner as in Example 1.
- the obtained film was a highly transparent film without cracks, having a measured film thickness (A) of 770 nm.
- A measured film thickness
- Tetraethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd.
- ethyl silicate 40 manufactured by Colcoat
- 10. OOg, polyether phosphate ester polymer (Solsperse 4 manufactured by Nippon Lubrizol) 1000) 0. 550 g, positive ethyleneglycol Honoré 200 (Katayama I ⁇ Ltd.) 0. 075g, concentrated hydrochloric acid (35 mass 0/0, Kanto Ltd. I ⁇ ) 0. 10 g, pure water 15. 980 g, Echinore Honoré 3—Nore (made by Katayama Igaku) 63. 5 73g, ITO fine particle dispersion (ethyl alcohol solution containing 40% by mass of ITO, Mitsubishi Materials) 6. Mix 250g and stir at 20 ° C for 4 hours A forming solution was obtained.
- Example 2 Thereafter, a film was formed on the glass substrate in the same manner as in Example 1.
- the obtained film was a highly transparent film without cracks having a measured film thickness (A) of 670 nm.
- A measured film thickness
- Example 2 The characteristics were measured in the same manner as in Example 1.
- the composition of the forming solution is shown in Table 5, and the measured values obtained are shown in Table 6.
- the calculated film thickness (A) was obtained by multiplying the volume ratio by the measured film thickness (A).
- the volume ratio is ITO, SiO
- the density ratio includes ITO crystal, SiO glass, source
- Tetraethoxysilane manufactured by Shin-Etsu Chemical Co., Ltd.
- Ethyl silicate 40 manufactured by Colcoat
- 10.00 g polyether phosphate ester polymer
- Solsperse 4 1000 from Nippon Lubrizol 1.
- 50 g positive ethylene glycol one Honoré 200 (manufactured by Katayama I ⁇ ) 0. 075g, concentrated hydrochloric acid (35 mass 0/0, Kanto Ltd. I ⁇ ) 0. 10 g, pure water 15. 980 g
- Echinore Honoré 3- Honoré (Katayama 62. 6 23g, ITO fine particle dispersion (ethyl alcohol solution containing 40% by mass of ITO, manufactured by Mitsubishi Materials) 6. Mix 250g and stir at 20 ° C for 4 hours to obtain a forming solution. It was.
- Example 2 Thereafter, a film was formed on the glass substrate in the same manner as in Example 1.
- the obtained film was a highly transparent film without cracks having an actually measured film thickness (A) of 880 nm.
- A actually measured film thickness
- IWlflSS ⁇ and liquid dripping time are both 200 ° C and 4 hours
- the present invention provides an article having a silica-based film excellent in mechanical strength while containing an organic substance. As provided, it has great utility value in various fields that use various functions of organic matter.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Geochemistry & Mineralogy (AREA)
- Composite Materials (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Laminated Bodies (AREA)
- Silicon Compounds (AREA)
- Surface Treatment Of Glass (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007538795A JPWO2007040258A1 (ja) | 2005-10-05 | 2006-10-05 | 有機無機複合膜形成物品 |
| US12/083,038 US8039111B2 (en) | 2005-10-05 | 2006-10-05 | Article with organic-inorganic composite film |
| EP20060811283 EP1941992A1 (en) | 2005-10-05 | 2006-10-05 | Article having organic-inorganic composite film formed therein |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005-292620 | 2005-10-05 | ||
| JP2005292620 | 2005-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2007040258A1 true WO2007040258A1 (ja) | 2007-04-12 |
Family
ID=37906300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2006/319945 Ceased WO2007040258A1 (ja) | 2005-10-05 | 2006-10-05 | 有機無機複合膜形成物品 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8039111B2 (ja) |
| EP (1) | EP1941992A1 (ja) |
| JP (1) | JPWO2007040258A1 (ja) |
| KR (1) | KR20080063325A (ja) |
| CN (1) | CN101277815A (ja) |
| WO (1) | WO2007040258A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102923967A (zh) * | 2012-10-25 | 2013-02-13 | 无锡市三力胶带厂 | 一种无机复合高分子增透膜材料 |
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- 2006-10-05 CN CNA2006800368290A patent/CN101277815A/zh active Pending
- 2006-10-05 EP EP20060811283 patent/EP1941992A1/en not_active Withdrawn
- 2006-10-05 KR KR1020087009346A patent/KR20080063325A/ko not_active Ceased
- 2006-10-05 US US12/083,038 patent/US8039111B2/en not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| US8039111B2 (en) | 2011-10-18 |
| CN101277815A (zh) | 2008-10-01 |
| KR20080063325A (ko) | 2008-07-03 |
| US20090246512A1 (en) | 2009-10-01 |
| EP1941992A1 (en) | 2008-07-09 |
| JPWO2007040258A1 (ja) | 2009-04-16 |
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