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WO2006136248A3 - Heat dissipating device - Google Patents

Heat dissipating device Download PDF

Info

Publication number
WO2006136248A3
WO2006136248A3 PCT/EP2006/004720 EP2006004720W WO2006136248A3 WO 2006136248 A3 WO2006136248 A3 WO 2006136248A3 EP 2006004720 W EP2006004720 W EP 2006004720W WO 2006136248 A3 WO2006136248 A3 WO 2006136248A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipating
substrate
dissipating device
heat
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2006/004720
Other languages
German (de)
French (fr)
Other versions
WO2006136248A2 (en
Inventor
Michael Born
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bosch Rexroth AG
Original Assignee
Bosch Rexroth AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Rexroth AG filed Critical Bosch Rexroth AG
Publication of WO2006136248A2 publication Critical patent/WO2006136248A2/en
Publication of WO2006136248A3 publication Critical patent/WO2006136248A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention relates to a heat dissipating device comprising a substrate (1) which comprises a receiving surface which is used to receive a heat generator and a heat dissipating surface which is used to dissipate a flow of heat. Mounting means (2) for the substrate (1) enable the substrate (1) to be mounted in a flexible manner on a substrate carrier (4). The flexible mounting of the heat dissipating device compensates possible inclinations between the cooling device surface and the heat dissipating surface, wherein the heat dissipating surface is adapted in a flexible manner to the irregularities.
PCT/EP2006/004720 2005-06-17 2006-05-18 Heat dissipating device Ceased WO2006136248A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510028431 DE102005028431A1 (en) 2005-06-17 2005-06-17 heat sink
DE102005028431.0 2005-06-17

Publications (2)

Publication Number Publication Date
WO2006136248A2 WO2006136248A2 (en) 2006-12-28
WO2006136248A3 true WO2006136248A3 (en) 2007-08-30

Family

ID=37489716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/004720 Ceased WO2006136248A2 (en) 2005-06-17 2006-05-18 Heat dissipating device

Country Status (2)

Country Link
DE (1) DE102005028431A1 (en)
WO (1) WO2006136248A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008063104A1 (en) * 2008-12-24 2010-07-01 Robert Bosch Gmbh Electronic controller i.e. static converter, has housing and control module that are formed such that housing and control module are connected with different cooling bodies and brought in thermal contact
DE102012111081A1 (en) * 2012-11-19 2014-05-22 Viessmann Werke Gmbh & Co Kg solar collector

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343362A (en) * 1994-01-07 1994-08-30 Zytec Corporation Heat sink assembly
US6331937B1 (en) * 1999-07-28 2001-12-18 Dell Usa, L.P. Apparatus and method for securing a heat sink to an electronic component in a computer system
US20030024688A1 (en) * 2001-07-31 2003-02-06 Dowdy James Glenn Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
US20040125525A1 (en) * 2002-12-27 2004-07-01 Liu Heben Cooling device and apparatus and method for making the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2278503B (en) * 1992-02-28 1995-08-23 Aavid Eng Inc Self-locking heat sinks for surface mount devices
DE9320574U1 (en) * 1993-12-22 1994-09-22 Siemens Nixdorf Informationssysteme AG, 33106 Paderborn Arrangement for improving the heat transfer between an electrical component and a heat sink
US5552961A (en) * 1995-05-18 1996-09-03 Northern Telecom Limited Electronic unit
JPH09246764A (en) * 1996-03-05 1997-09-19 Sony Corp Electronics
US5982620A (en) * 1998-06-01 1999-11-09 Asia Vital Components Co., Ltd. CPU casing structure with improved heat dissipator anchoring configuration
DE20200484U1 (en) * 2002-01-14 2002-06-20 Arnold Müller GmbH & Co. KG, 73230 Kirchheim Cooling device for components, in particular for electrical or electronic components, such as converters or the like.
DE10338469A1 (en) * 2003-08-21 2004-11-25 Siemens Ag Flow module has rear cool plate with cooling medium channels with inlet and outlet switching at least two channels with parallel flow

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343362A (en) * 1994-01-07 1994-08-30 Zytec Corporation Heat sink assembly
US6331937B1 (en) * 1999-07-28 2001-12-18 Dell Usa, L.P. Apparatus and method for securing a heat sink to an electronic component in a computer system
US20030024688A1 (en) * 2001-07-31 2003-02-06 Dowdy James Glenn Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
US20040125525A1 (en) * 2002-12-27 2004-07-01 Liu Heben Cooling device and apparatus and method for making the same

Also Published As

Publication number Publication date
DE102005028431A1 (en) 2006-12-21
WO2006136248A2 (en) 2006-12-28

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