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WO2006114082A3 - Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung - Google Patents

Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung Download PDF

Info

Publication number
WO2006114082A3
WO2006114082A3 PCT/DE2006/000673 DE2006000673W WO2006114082A3 WO 2006114082 A3 WO2006114082 A3 WO 2006114082A3 DE 2006000673 W DE2006000673 W DE 2006000673W WO 2006114082 A3 WO2006114082 A3 WO 2006114082A3
Authority
WO
WIPO (PCT)
Prior art keywords
production
optical element
optoelectronic component
thermoplastic
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2006/000673
Other languages
English (en)
French (fr)
Other versions
WO2006114082A2 (de
Inventor
Gertrud Kraeuter
Andreas Ploessl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to EP06742249A priority Critical patent/EP1875522A2/de
Priority to JP2008508070A priority patent/JP2008539567A/ja
Priority to CN2006800135892A priority patent/CN101164174B/zh
Priority to US11/912,831 priority patent/US20080224159A1/en
Publication of WO2006114082A2 publication Critical patent/WO2006114082A2/de
Publication of WO2006114082A3 publication Critical patent/WO2006114082A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Led Device Packages (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)

Abstract

Es wird ein optisches Bauteil (1, 25) vorgeschlagen, das eine bestimmte Form aufweist und einen Thermoplasten umfasst, der während oder nach der Formgebung zusätzlich weiter vernetzt worden ist. Derartige thermoplastische Materialien weisen eine erhöhte Temperaturformbeständigkeit auf, sind aber trotzdem vor der zusätzlichen Vernetzung aufgrund ihrer thermoplastischen Eigenschaften leicht und billig formbar.
PCT/DE2006/000673 2005-04-26 2006-04-18 Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung Ceased WO2006114082A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP06742249A EP1875522A2 (de) 2005-04-26 2006-04-18 Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung
JP2008508070A JP2008539567A (ja) 2005-04-26 2006-04-18 光学素子及び該光学素子を備えたオプトエレクトロニクスデバイス並びにその製造方法
CN2006800135892A CN101164174B (zh) 2005-04-26 2006-04-18 光学元件，含有该元件的光电器件及其制备
US11/912,831 US20080224159A1 (en) 2005-04-26 2006-04-18 Optical Element, Optoelectronic Component Comprising Said Element, and the Production Thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102005019374 2005-04-26
DE102005019374.9 2005-04-26
DE102005036520.5 2005-08-03
DE102005036520A DE102005036520A1 (de) 2005-04-26 2005-08-03 Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung

Publications (2)

Publication Number Publication Date
WO2006114082A2 WO2006114082A2 (de) 2006-11-02
WO2006114082A3 true WO2006114082A3 (de) 2007-03-15

Family

ID=37111572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2006/000673 Ceased WO2006114082A2 (de) 2005-04-26 2006-04-18 Optisches bauteil, optoelektronisches bauelement mit dem bauteil und dessen herstellung

Country Status (8)

Country Link
US (1) US20080224159A1 (de)
EP (1) EP1875522A2 (de)
JP (1) JP2008539567A (de)
KR (1) KR20080003768A (de)
CN (2) CN102683561B (de)
DE (1) DE102005036520A1 (de)
TW (1) TWI381935B (de)
WO (1) WO2006114082A2 (de)

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DE102006046301A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Optisches Element, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines optischen Elements
JP2008088303A (ja) 2006-10-02 2008-04-17 Sumitomo Electric Fine Polymer Inc 透明樹脂成形体並びに光学レンズ及び光学フィルム
DE102006059741A1 (de) * 2006-12-18 2008-07-03 Siemens Ag Modularer Sensorträgeraufbau
DE102006062066A1 (de) * 2006-12-29 2008-07-03 Osram Opto Semiconductors Gmbh Linsenanordnung und LED-Anzeigevorrichtung
DE102007001706A1 (de) 2007-01-11 2008-07-17 Osram Opto Semiconductors Gmbh Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse
KR100907823B1 (ko) * 2007-12-12 2009-07-14 한국전자통신연구원 테라헤르츠파 소자의 패키징 장치
CN101910872A (zh) * 2007-12-28 2010-12-08 住友电工超效能高分子股份有限公司 光学透镜
GB2464111B (en) * 2008-10-02 2011-06-15 Cambridge Display Tech Ltd Organic electroluminescent device
KR100974339B1 (ko) * 2008-11-21 2010-08-05 주식회사 루멘스 발광 다이오드 패키지
US20100207140A1 (en) * 2009-02-19 2010-08-19 Koninklijke Philips Electronics N.V. Compact molded led module
ATE522564T1 (de) * 2009-06-18 2011-09-15 Ems Patent Ag Photovoltaikmodul-monorückfolie, verfahren zu deren herstellung sowie deren verwendung bei der produktion photovoltaischer module
DE102009055786A1 (de) 2009-11-25 2011-05-26 Osram Opto Semiconductors Gmbh Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses
DE102010011428A1 (de) * 2010-03-15 2011-09-15 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102010013317B4 (de) 2010-03-30 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil, Gehäuse hierfür und Verfahren zur Herstellung des optoelektronischen Bauteils
DE102010045316A1 (de) * 2010-09-14 2012-03-15 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
DE102010046122A1 (de) 2010-09-21 2012-03-22 Osram Opto Semiconductors Gmbh Elektronisches Bauelement
CN202056570U (zh) * 2011-01-20 2011-11-30 木林森股份有限公司 一种带透镜的表面贴装式发光二极管
FI122809B (fi) * 2011-02-15 2012-07-13 Marimils Oy Valolähde ja valolähdenauha
DE102011018921B4 (de) * 2011-04-28 2023-05-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Träger, optoelektronisches Bauelement mit Träger und Verfahren zur Herstellung dieser
CN102779910A (zh) * 2011-05-10 2012-11-14 弘凯光电股份有限公司 发光二极管封装方法
KR101201387B1 (ko) * 2011-08-08 2012-11-14 주식회사 폴리사이언텍 낮은 열팽창계수를 갖는 환형올레핀계 수지 플렉시블 기판
JP5964132B2 (ja) * 2012-05-23 2016-08-03 船井電機株式会社 表示装置
US10316187B2 (en) * 2015-03-13 2019-06-11 Kyocera Corporation Resin composition, prepreg, metal-clad laminated plate, and wiring board
DE102018105731A1 (de) 2018-03-13 2019-09-19 Infineon Technologies Ag Vernetztes thermoplastisches Dielektrium für Chip-Package
EP3584775A1 (de) 2018-06-19 2019-12-25 Siemens Schweiz AG Lötfähiges, insbesondere einstückiges optisches lichtleitmodul zur streulichtrauchdetektion sowie rauchdetektionsblock, rauchdetektionsmodul und streulichtrauchmelder
ES2960434A1 (es) * 2022-08-03 2024-03-04 Quality Photonic Optics S L Metodo para la fabricacion de optica embebida en componentes fotonicos

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Also Published As

Publication number Publication date
CN102683561B (zh) 2015-04-01
EP1875522A2 (de) 2008-01-09
JP2008539567A (ja) 2008-11-13
TWI381935B (zh) 2013-01-11
CN101164174A (zh) 2008-04-16
WO2006114082A2 (de) 2006-11-02
DE102005036520A1 (de) 2006-11-09
CN101164174B (zh) 2012-07-04
CN102683561A (zh) 2012-09-19
KR20080003768A (ko) 2008-01-08
TW200702153A (en) 2007-01-16
US20080224159A1 (en) 2008-09-18

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