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WO2006038616A1 - Structure de refroidissement d’un moule métallique - Google Patents

Structure de refroidissement d’un moule métallique Download PDF

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Publication number
WO2006038616A1
WO2006038616A1 PCT/JP2005/018351 JP2005018351W WO2006038616A1 WO 2006038616 A1 WO2006038616 A1 WO 2006038616A1 JP 2005018351 W JP2005018351 W JP 2005018351W WO 2006038616 A1 WO2006038616 A1 WO 2006038616A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
cooling
cooling structure
cooling fluid
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/018351
Other languages
English (en)
Japanese (ja)
Inventor
Yasuhiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzuka Fuji Xerox Manufacturing Co Ltd
Original Assignee
Suzuka Fuji Xerox Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzuka Fuji Xerox Manufacturing Co Ltd filed Critical Suzuka Fuji Xerox Manufacturing Co Ltd
Publication of WO2006038616A1 publication Critical patent/WO2006038616A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam

Definitions

  • the present invention relates to the structure of a temperature control circuit (for example, a cooling circuit) of a mold used for molding a resin molded product.
  • a temperature control circuit for example, a cooling circuit
  • the quality of dimensions and the like of a molded resin product that is processed by cooling the molten resin depends on the cooling rate of the molten resin.
  • a resin molded product manufactured by extrusion molding affects the quality such as plate thickness due to the difference in die temperature.
  • molten resin is injected into a mold cavity formed by combining a fixed mold and a movable mold, and after cooling, the fixed mold and the movable mold are separated from the mold cavity. It is performed by taking out the solidified molded product.
  • the molten resin is cooled by cooling the mold and transferring the partial force of the mold in contact with the mold cavity surface and the heat of the molten resin to the mold.
  • the fixed mold and the movable mold are provided with a cooling circuit for controlling the temperature of the mold.
  • this cooling circuit (mold cooling structure) is formed with a plurality of holes 5, 6 by drilling a fixed mold 4 and a movable mold 3 constituting the mold. It is common to open and fill plugs 7 and 8 in unnecessary holes to form passages 5 and 6 through which cooling fluid (medium) such as water and air flows.
  • cooling fluid medium
  • Patent Document 1 Japanese Patent Laid-Open No. 09-308955
  • Patent Document 2 Japanese Patent Laid-Open No. 06-262295
  • Patent Document 3 Japanese Utility Model Publication No. 58-107227
  • the present invention has been made in order to solve the problem of power, and a mold cooling structure that easily and inexpensively takes a wide heat transfer area and enhances the cooling effect while maintaining the strength of the mold. Is provided.
  • the “mold” means a mold (movable mold / fixed mold) used for injection molding, an extrusion molding die, a blow molding mold, a vacuum 'pressure molding mold, a hot' mold. Runner hold, nozzles, and processing jigs for parts that require temperature control. Means for solving the problem
  • the mold cooling structure according to claim 1 divides the mold into a plurality of parts, cuts a predetermined portion of the divided surface of the parts, and joins the divided surfaces to each other. Since all or part of the cooling fluid is formed, it is possible to form a cooling fluid passage having a complicated shape at a low cost and to improve the cooling efficiency of the mold.
  • the mold cooling structure according to claim 2 maintains the strength of the mold in a part of the passage (in the cooling circuit) formed by joining the divided surfaces in claim 1. For this reason, support columns (such as a spacer block) are provided to receive the grease pressure, so that the mold cooling efficiency is improved, even if the passage through which the cooling fluid flows is large, even if the mold strength is not reduced. If you can make it V, it will have an effect.
  • the mold cooling structure according to claim 3 is the heat treatment of claim 1 or claim 2, in which the split surfaces are joined by sandwiching a metal having a melting point lower than that of the material constituting the movable mold or the fixed mold. Since they are joined, the divided surfaces can be joined easily, and the cooling efficiency of the mold can be improved at low cost.
  • the mold cooling structure according to claim 4 is characterized in that, in claim 1 or claim 2, since the joining of the split surfaces is electric fusion, it is easy to dissimilar and Z or the same kind of mold material strength. Therefore, it is possible to join the divided surfaces to each other and improve the cooling efficiency of the mold at a low cost.
  • the present invention makes it easy to lengthen the passage of the cooling fluid without lowering the strength of the mold, increase the capacity, and increase the heat transfer area. If the cooling efficiency can be improved, there will be an effect!
  • FIGS. 1 to 6 A first embodiment according to the present invention will be described with reference to FIGS. 1 to 6.
  • FIG. 1 is a side view of a fixed mold using a mold cooling structure according to the present invention
  • FIG. 6 is a side view of a conventional fixed mold. In both cases, the passage of the cooling fluid is indicated by a broken line.
  • the fixed mold 1 having the mold cooling structure 2 having a complicated shape shown in FIG. 6 is formed with the shape of the mold cooling structure 2 using, for example, copper, and a nickel plating (electron) is formed thereon.
  • the fixed mold 1 was manufactured by putting the fixed mold 1 in a nitric acid solution or the like and dissolving the copper. processing).
  • Such a method requires a lot of cost, and also requires a waste liquid treatment of nitric acid in which copper is dissolved.
  • the fixed mold 10 shown in FIG. 1 has the same mold cooling structure 14 as the mold cooling structure 2 shown in FIG. ! /
  • the upper mold 11 shown in the side view in FIG. 2 the bottom view in FIG. 3, the side view in FIG. 4, and the lower mold 12 shown in the plan view in FIG. Has been configured.
  • the upper die 11 and the lower die 12 are processed separately.
  • the upper mold 11 has a mold cooling structure for the upper half by cutting the dividing surface 13 by milling or the like. 14 is formed.
  • the lower die 12 forms the lower half mold cooling structure 15 by cutting the dividing surface 19, and the cooling fluid inlet 16 and outlet 17 are also cut and drilled using a drill or the like.
  • the cutting and drilling cover may be a discharge cover. Also, if necessary, you can combine the above-mentioned electronic cabinets.
  • a copper plate 18 is manufactured by hollowing out predetermined portions so as not to obstruct the mold cooling structure formed when the dividing surface 13 of the upper mold 11 and the dividing surface 19 of the lower mold 12 are joined. Then, the copper plate 18 is sandwiched between the dividing surface 13 of the upper mold 11 and the dividing surface 19 of the lower mold 12, and a weight (not shown) is put on the upper mold 11.
  • heat treatment is performed in the electric furnace at a temperature (for example, about 1200 degrees) lower than the melting temperature of iron (for example, NAK88) constituting the upper mold 11 and the lower mold 12 which is higher than the melting temperature of copper. Then, the copper melts and diffuses into the iron that constitutes the upper mold 11 and the lower mold 12, so that the upper mold 11 and the lower mold 12 can be joined with sufficient strength after cooling. Can be produced.
  • a temperature for example, about 1200 degrees
  • the melting temperature of iron for example, NAK88
  • the metal used for joining the upper mold 11 and the lower mold 12 sandwiched between the divided surface 13 and the divided surface 19 has a lower melting point than the metal constituting the upper mold 11 and the lower mold 12.
  • Any material that diffuses into the metal may be used. For example, for iron, nickel, silver, gold, manganese, lead, tin, zinc, solder and the like.
  • copper or nickel kneaded into a paste may be applied to the joint surface for heat treatment.
  • the upper mold 11 and the lower mold 12 are separately processed and joined to form a mold cooling structure 14 having a complicated shape. Can be manufactured easily, and the cooling efficiency of the mold can be improved at low cost.
  • Example 1 in the case where the upper die 11 and the lower die 12 are made of the same material, different forces, for example, when the upper die 11 is made of nickel and the lower die 12 is made of iron, Since the expansion rate of each metal is different, bonding may not be possible by heat treatment.
  • a pressurization type electric bonding method (elect mouth bonding), which is a bonding method using an electric current, is effective.
  • an iron plate or nickel plate 18 is sandwiched between the dividing surface 13 of the upper mold 11 and the dividing surface 19 of the lower mold 12, and a large current flows while applying vertical force pressure. Then, the iron plate or nickel plate 18 melts and diffuses into nickel and iron, so that the upper die 11 and the lower die 12 can be joined.
  • an adhesive such as epoxy may be applied before or after bonding to eliminate the gap between the bonding surfaces.
  • surface treatment for example, painting, coating, etc.
  • the joining instead of the iron plate or the nickel plate 18, a fine iron wire or a nickel wire may be used.
  • the upper die 11 and the lower die 12 may be directly overlapped and joined using a pressure type electric joining method without using the iron plate or the nickel plate 18. In this case, if the dividing surfaces to be overlapped are provided with irregularities that are not flat, and the current is concentrated on the convex portions, the joining is ensured.
  • Example 3
  • the mold cooling structure according to the present invention is used for a sprue 1 'runner.
  • the cooling of the sprue's runner controls the cooling in the molding cycle. Therefore, using the mold cooling structure according to the present invention for the sprue's runner shortens the molding cycle. This is an effective means.
  • the sprue 1 'runner using this invention is demonstrated in detail.
  • the sprue 'bush used in the sprue' runner is divided into two parts, a shaft part 20 and a cylindrical part 21, and the outer peripheral surface (split surface) of the shaft part 20 Grooves 22 are formed in a spiral shape.
  • the shaft portion 20 is inserted into the cylindrical portion 21 and bonded by the heat treatment or pressure type electric bonding method shown in Example 1 or Example 2, so that the mold cooling structure according to the present invention is used.
  • a spruce bush can be manufactured.
  • the holes 23 and 24 provided in the cylindrical portion 21 are an inlet and an outlet for the cooling fluid.
  • the sprue bush produced in this way was incorporated into an injection mold, and the surface temperature of a part of the sprue after 100 shot molding was measured.
  • the force was about 70 degrees.
  • the cooling fluid can flow into the groove 22 formed in a spiral shape. It was cooled to about 40 degrees. Note that air was used as the cooling fluid. After confirming that the molten resin was injected from the heating cylinder of the molding machine (that is, after receiving a signal indicating completion of the primary pressure), the cooling medium air was blown from the hole 24 to be cooled, and the air was discharged through the hole 23 to the atmosphere. Released into. After that, the mold opening signal of the injection molding machine was received and air blowing was stopped.
  • the mold cooling structure according to the present invention is used for a runner portion.
  • FIG. 10 shows a cross-sectional view of the runner portion provided on the PL surface of the movable mold 30 and the fixed mold 31.
  • the runner portion of the fixed die 31 is divided into two parts, an upper die 33 having a recess 32 through which molten resin flows, and a lower die 34. A plurality of grooves 36 are cut along the recess 32.
  • the upper die 33 is inserted into the recess of the lower die 34 and joined by the joining method shown in Example 1 or Example 2, thereby forming a runner portion with improved cooling efficiency in the lower die 34. can do.
  • the runner flowing portion and the main body portion of the fixed mold 31 are separate parts. There is a slight gap between the body parts. Since this gap acts as a heat insulating layer, the cooling fluid flowing in the groove 36 is a force that drastically reduces the temperature of the runner 32. Fixed temperature 31 The temperature of the main body is not lowered so much. Can be obtained.
  • a large-capacity cooling fluid passage is formed using the mold cooling structure according to the present invention.
  • FIG. 11 shows a side view of the fixed mold 50, in which a mold cooling structure 51 and a post 56 (to be described later) are indicated by broken lines.
  • the upper mold 52 and the lower mold 53 are bonded by using the bonding method shown in the first or second embodiment.
  • the large-capacity space 54 formed by cutting on the respective divided surfaces of the upper mold 52 and the lower mold 53 is formed close to the cavity surface 55. Yes.
  • the large-capacity space 54 is widely cut in the three directions of XYZ, and can flow a large amount of cooling fluid. In other words, large cuts are made in the direction perpendicular to the paper surface of Fig. 11 to form a large-capacity passage.
  • the large-capacity mold cooling structure 54 in the fixed mold 50 is provided with a plurality of cylindrical columns 56 for the purpose of reinforcing the strength. This column 56 is planted from the lower mold 53. It functions to support the upper mold 52.
  • the powerful configuration allows large volumes of cooling fluid to be sent to near the cavity surface without lowering the mold strength, so that the molten resin can be cooled in a short time, greatly increasing the molding cycle. Can be shortened.
  • Example 5 the force shown when the upper mold 52 and the lower mold 53 are divided in the horizontal direction, as shown in Fig. 13, when the large capacity portion 60 is formed in a part of the upper mold. In some cases, horizontal division alone is not possible! /.
  • the upper die 52 is divided into the vertical direction, the upper die 52 is composed of the parts 61 and 62, and the upper die 52 is formed with a portion 60 having a larger capacity. This is different from the example.
  • the fixed mold 50 is composed of a total of three parts: a lower mold 53 and an upper mold 52 composed of parts 61 and 62, and all of the divided surfaces thereof are the first embodiment or the second embodiment. It is joined by the joining method shown in.
  • the hot runner hold was divided into two parts and cut so that a flow path of molten resin was formed when the respective divided surfaces were joined. Also, the flow path of the molten resin and the curved portion of the flow path were cut so as to form a smooth curve.
  • the bonding is performed by applying paste-kneaded copper to the divided surfaces, heat-treating using an electric furnace at 1,200 ° C for 5 hours, chemically polishing with nitric acid, and then polishing the threaded portion of the nozzle. .
  • FIG. 14 is a front view of an extrusion molding die according to the present invention
  • FIG. 15 is a perspective view showing an assembled state of the die shown in FIG.
  • the die 70 is provided with a space 77 for extruding a U-shaped molded product.
  • a large-capacity space 76 for flowing a cooling fluid such as water is provided at a position close to the space 77 in order to cool the resin passing through the space 77.
  • This large-capacity space 76 is realized by configuring the die 70 with two parts 71 and 72 as shown in FIG. That is, the part 71 is cut deeply into the vicinity of the space 77, and the part 72 is cut into a substantially convex shape by cutting the plate material so that a sufficiently large space 76 is formed when the part 71 is joined to the part 71.
  • a plurality of support columns 75 are implanted in the part 72.
  • the divided surfaces can be joined to the component 71 and the component 72.
  • water as a cooling fluid is injected into the space 76 from the inlet 73, and the water that has absorbed the heat of the die is discharged from the outlet 74.
  • the force shown in the case where the mold cooling structure is formed on the fixed mold may be formed on the movable mold or the fixed mold and the movable mold. .
  • the insert may be divided into parts and covered, and each part may be joined by the joining method of the present invention to produce a insert having a complicated shape. .
  • the cooling fluid in addition to water and air, the heat of vaporization of oil or a vaporizable substance (for example, chlorofluorocarbon, halon, alcohol, ether) may be used.
  • a vaporizable substance for example, chlorofluorocarbon, halon, alcohol, ether
  • the valve When air is used as the cooling fluid, the valve is opened based on the information that the molten resin has been injected into the mold from the temperature sensor provided near the cavity surface, and air cooling is performed. It can be started when the mold is opened and the molded product is taken out, or air cooling can be performed continuously regardless of the process.
  • Trecell's MuCell and Asahi Kasei's AMOTEC the foam molding, the foam injection molding method and the gas-assisted molding method, and the Sumitomo Chemical SP mold, in-mold molding method and Also apply to the method that combines with the gas-assisted molding method.
  • the heat and cool developed and sold by Ono Sangyo, Cisco, and GE Plastics also include molds used for compression molding, injection compression molding, transfer molding, cast molding, vacuum molding, pneumatic molding, It can also be applied to processing jigs that require temperature control of extrusion dies.
  • the mold temperature is increased with heated steam before injection, the molten resin is injected with water and then cooled with water, or the surface of the mold is heated using high frequency induction heating.
  • the cooling structure of the present invention is also effective for cooling a molding method that aims to improve the appearance by similarly heating the mold surface using a halogen lamp according to the above.
  • the cooling effect can be further improved by using microbubble water as the cooling fluid.
  • microbubble water using air as the cooling fluid
  • an inert gas such as nitrogen is used instead of air
  • the inside of the mold cooling structure is surface-treated, and a multilayer structure such as iron and copper, iron and SUS, iron and silver, etc. It is possible to cope with this problem by using a medium other than water. It is also effective to use water with a fungicide Means.
  • the resin that can be used in the present invention includes ABS, HIPS and other styrenes, PE and PP, olefins, PVC and other burs, polyamides, amides, polyesters, ester, and ethers. All of the thermoplastic resins represented by fats, all of the thermosetting resins represented by urea and phenol, polymer blends and polymer alloys of the resins, and inorganic and Z or organic fibers in the resins. Examples include composites containing minerals.
  • the present invention relates to a mold used for injection molding, a die part for extrusion molding, a mold for blow molding, a cooling circuit for a mold for vacuum / compression molding, a hot runner manifold and a nozzle, Applicable to machining jigs for parts that require temperature control.
  • FIG. 1 is a sectional view of a fixed mold according to the present invention (Example 1).
  • FIG. 2 is a side view of an upper mold of a fixed mold according to the present invention (Example 1).
  • FIG. 3 is a bottom view of the upper mold of the fixed mold according to the present invention (Example 1).
  • FIG. 4 is a side view of the lower mold of the fixed mold according to the present invention (Example 1).
  • FIG. 5 is a plan view of the lower mold of the fixed mold according to the present invention (Example 1).
  • FIG. 6 is a side view for explaining a conventional fixed mold (Example 1).
  • FIG. 7 is a side view of a sprue bush according to the present invention (Example 3).
  • FIG. 8 is a side view of a shaft portion of a sprue bush according to the present invention (Example 3).
  • FIG. 9 is a side view of the cylindrical portion of the sprue bush according to the present invention (Example 3).
  • FIG. 10 is a side view of a runner according to the present invention (Example 4).
  • FIG. 11 is a side view of a fixed mold according to the present invention (Example 5).
  • FIG. 12 is a side view for explaining a conventional mold.
  • FIG. 13 is a side view of a fixed mold according to the present invention (Example 6).
  • FIG. 14 is a front view of an extrusion die according to the present invention (Example 8).
  • FIG. 15 is a perspective view showing an assembled state of an extrusion die according to the present invention (Example 8). Explanation of symbols 10 Fixed type 11 Upper type

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention décrit la division en deux d’un moule amovible et/ou d’un moule fixe dans le sens latéral, ainsi que la coupe de l’un ou des deux plans de divisions, et la jonction des plans de division dans le but de former tout ou partie du circuit d’un liquide de refroidissement, et ainsi de refroidir un moule métallique constitué du moule amovible et du moule fixe. Ainsi, le débit du liquide de refroidissement est augmenté tout en conservant la résistance du moule métallique, et l'effet de refroidissement est amélioré.
PCT/JP2005/018351 2004-10-05 2005-10-04 Structure de refroidissement d’un moule métallique Ceased WO2006038616A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004-292070 2004-10-05
JP2004292070 2004-10-05
JP2004-325622 2004-11-09
JP2004325622 2004-11-09

Publications (1)

Publication Number Publication Date
WO2006038616A1 true WO2006038616A1 (fr) 2006-04-13

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015131393A (ja) * 2014-01-09 2015-07-23 日本軽金属株式会社 樹脂射出成形用金型
JP2020105612A (ja) * 2018-12-28 2020-07-09 日本製鉄株式会社 冷却方法及び冷却装置
JP2024059521A (ja) * 2022-10-18 2024-05-01 パンチ工業株式会社 モールド金型部品の製造方法
JP2024059519A (ja) * 2022-10-18 2024-05-01 パンチ工業株式会社 モールド金型部品の製造方法
EP4420854A1 (fr) * 2023-02-21 2024-08-28 JSP International SARL Moule, en particulier moule pour jet de vapeur, pour le traitement de perles de polymère expansibles ou expansées pour former un composant de mousse particulaire

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427920A (en) * 1987-07-24 1989-01-30 Mitsubishi Heavy Ind Ltd Mold
JPH0524320U (ja) * 1991-09-03 1993-03-30 宇部興産株式会社 成形用金型
JPH09225998A (ja) * 1996-02-21 1997-09-02 Kao Corp ブロー成形用金型
JPH09308955A (ja) * 1996-05-21 1997-12-02 Ahresty Corp 金型の冷却構造
JP2002370265A (ja) * 2001-06-18 2002-12-24 Mitsubishi Materials Corp 成形用金型装置とその温度制御方法
JP2003103324A (ja) * 2001-09-26 2003-04-08 Suwa Netsukogyo Kk 金型の製造方法
JP2004174606A (ja) * 2003-12-24 2004-06-24 Suwa Netsukogyo Kk 流体の加熱、冷却回路を内蔵した金型とその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6427920A (en) * 1987-07-24 1989-01-30 Mitsubishi Heavy Ind Ltd Mold
JPH0524320U (ja) * 1991-09-03 1993-03-30 宇部興産株式会社 成形用金型
JPH09225998A (ja) * 1996-02-21 1997-09-02 Kao Corp ブロー成形用金型
JPH09308955A (ja) * 1996-05-21 1997-12-02 Ahresty Corp 金型の冷却構造
JP2002370265A (ja) * 2001-06-18 2002-12-24 Mitsubishi Materials Corp 成形用金型装置とその温度制御方法
JP2003103324A (ja) * 2001-09-26 2003-04-08 Suwa Netsukogyo Kk 金型の製造方法
JP2004174606A (ja) * 2003-12-24 2004-06-24 Suwa Netsukogyo Kk 流体の加熱、冷却回路を内蔵した金型とその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015131393A (ja) * 2014-01-09 2015-07-23 日本軽金属株式会社 樹脂射出成形用金型
JP2020105612A (ja) * 2018-12-28 2020-07-09 日本製鉄株式会社 冷却方法及び冷却装置
JP7265117B2 (ja) 2018-12-28 2023-04-26 日本製鉄株式会社 冷却方法及び冷却装置
JP2024059521A (ja) * 2022-10-18 2024-05-01 パンチ工業株式会社 モールド金型部品の製造方法
JP2024059519A (ja) * 2022-10-18 2024-05-01 パンチ工業株式会社 モールド金型部品の製造方法
EP4420854A1 (fr) * 2023-02-21 2024-08-28 JSP International SARL Moule, en particulier moule pour jet de vapeur, pour le traitement de perles de polymère expansibles ou expansées pour former un composant de mousse particulaire

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