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WO2006003133A1 - Composant electronique a encapsulement - Google Patents

Composant electronique a encapsulement Download PDF

Info

Publication number
WO2006003133A1
WO2006003133A1 PCT/EP2005/053009 EP2005053009W WO2006003133A1 WO 2006003133 A1 WO2006003133 A1 WO 2006003133A1 EP 2005053009 W EP2005053009 W EP 2005053009W WO 2006003133 A1 WO2006003133 A1 WO 2006003133A1
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulation
electronic component
metal
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/053009
Other languages
German (de)
English (en)
Inventor
Christoph Brabec
Jens Hauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to EP05769610A priority Critical patent/EP1763895A1/fr
Publication of WO2006003133A1 publication Critical patent/WO2006003133A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to an electronic component, in particular one with at least one organic functional layer and a novel encapsulation.
  • Electronic components in particular those with at least one organic functional layer, are as a rule sensitive to environmental influences.
  • components In order to protect them from damage, components, generally comprising at least one substrate, a lower electrode, at least one organic functional layer and an upper electrode, are completely encased or encapsulated.
  • Many methods of encapsulation are known, both complete, inherently dimensionally stable caps are placed on the component as well as coatings of films applied over the component and sealingly connected to the substrate.
  • the material of these encapsulations is usually a plastic or a glass, wherein barrier properties respek ⁇ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material.
  • barrier properties respek ⁇ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material.
  • barrier properties respek ⁇ tive tightness to moisture and / or air and mechanical stability are the essential requirements of the material.
  • there are still no optimal solutions to this problem with regard to the material of the encapsulation because materials with increased impermeability generally have poor mechanical stability and vice versa. Be ⁇ but critical in terms of tightness on the one hand, the transition from the encapsulation to the substrate, this being
  • the object of the invention is to provide an electronic component with an encapsulation which combines mechanical stability with impermeability and nevertheless can be produced easily and in mass production.
  • the invention relates to an electronic component, an encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode and the ent speaking contacts comprising, wherein the encapsulation comprises at least one layer of a metal composite material.
  • the subject matter of the invention is a method for producing an electronic component, a encapsulation, a substrate, a lower electrode, at least one functional layer and an upper electrode and the corresponding contacts comprising at least the following method steps:
  • the encapsulation with the substrate is either welded, glued and / or soldered.
  • the encapsulation is sealed, for example, by cost-effective welding of the metal foil to the substrate.
  • the plastic layer of the encapsulation can be connected to the substrate.
  • the contact for the electrodes to a voltage and / or current source can be made via the contacting by the Verkapse ⁇ ment, either by welding or by using a low-temperature solder.
  • a partial area of the foil will have an exposed metal area for contacting, so that a low contact resistance is guaranteed.
  • At least one of the plated-through holes of the component is produced by the metal parts of the metal composite material.
  • the good barrier properties, the high mechanical stability and the electrical conductivity of the metal are optimally utilized for the encapsulation.
  • Metal composite is a plastic or a glass that contains metal in any form. It may be a polymer filled with metal fibers, metal platelets and / or other metal particles, but it may also be a layer structure with alternating metal and plastic or
  • the metal may be in plastic or glass or a laminate layer or • in the form of fusible alloys, ie in the form of low-melting metal alloys.
  • an electrically insulating member must be present within the metal composite forming the encapsulant to keep the two leads electrically separated.
  • the term line is arbitrarily broad and not on a continuous metallic Limited line, because even with metal particles filled plastics can form the lines.
  • photovoltaic elements photodetectors, electrochromic color elements, diodes, light-emitting diodes, in which the large-area light-emitting diodes can benefit from the invention
  • transistors, capacitors are used as electronic component with at least one functional layer made of organic material. Rectifier and others.
  • the encapsulations are preferably in the range of thin and thinnest films, ie, for example, with a thickness of 200 .mu.m, preferably of 75 .mu.m and particularly preferably of 30 .mu.m before.
  • an encapsulation is produced by a layer structure, wherein plastic layers alternate with metal layers in a film composite and form a flexible encapsulation.
  • plastic layers alternate with metal layers in a film composite and form a flexible encapsulation.
  • Metal layers of the vias contribute to the tightness and mechanical stability of the encapsulation.
  • the following layers are applied to one another: flexible film, which can also be used as a substrate, metal foil, flexible foil.
  • This film composite has high barrier properties to oxygen and water vapor and it is possible to lay the contacts through the encapsulation in the metal layers of the encapsulation film composite.
  • a partial region of the foil has an exposed metal region for contacting, so that a low contact resistance results.
  • the encapsulation on an active functional layer of the component can be connected to the component.
  • the encapsulation may be connected directly to the lower and / or the upper electrode instead of to the substrate.
  • a substrate 1 which may be both a flexible film or a rigid carrier, such as a glass or quartz or the like. It is the bottom electrode 2, which is transparent at the photodetectors, the e- lektrochromen color elements and the light-emitting diodes, so that the radiation (s) through it to the active functional layer 1 (s) may take.
  • At least one active organic functional layer 3 which, depending on the component, can be made of very different materials.
  • the upper end forms the upper electrode 4.
  • a so-called TopCoat be placed over the component, that is a
  • the TopCoat can be made of organic (parylene), inorganic (silicon dioxide, aluminum oxide, silicon nitride (SiN x ), etc.) as well as of a film composite with a hybrid structure (organic / inorganic.
  • the encapsulation 5 comprising a metal composite.
  • the encapsulation leads via its Me ⁇ tallanteil the two contacts of the component to au ⁇ Shen.
  • the encapsulation 5 comprises a plastic component 6, which in particular is also present at the point 8 at which the two current-carrying metal components 7, coming from opposite poles, overlap.
  • the metal parts 7 lead the contacts of the two electrodes through the encapsulation to the outside.
  • the encapsulating film and the element between ⁇ getter materials used are materials that react very strongly with water molecules and oxygen atoms and bind and / or chemically neutralize them when they penetrate the element.
  • getter materials are zeolite and calcium oxide for water molecules and iron oxide for oxygen.
  • getter materials are incorporated directly into the film.
  • the invention discloses the packaging of organic solar cells with a cost-effective film composite which comprises a metal component.
  • the packaging meets high standards, especially with regard to high barrier properties against oxygen and water vapor
  • Encapsulation without or only with minimal adhesive joint, because the encapsulation can be welded / soldered to the substrate or the lower electrode, integrated feedthrough of electrical connections, also for glued, soldered and / or welded connections.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un composant électronique muni d'un encapsulement d'un nouveau type, proposant pour la première fois un conditionnement de composants électroniques à l'aide d'un film composite bon marché qui présente une part métallique. Le conditionnement remplit des exigences élevées, notamment en présentant des propriétés barrières élevées contre l'oxygène et la vapeur d'eau, en permettant une encapsulation sans joint de collage ou avec un joint de collage minime, car l'encapsulement peut être soudé ou brasé au substrat ou à l'électrode inférieure, et en assurant le passage intégré de connexions électriques, également pour des connexions collées, brasées et/ou soudées.
PCT/EP2005/053009 2004-07-02 2005-06-27 Composant electronique a encapsulement Ceased WO2006003133A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05769610A EP1763895A1 (fr) 2004-07-02 2005-06-27 Composant electronique a encapsulement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004032207.4 2004-07-02
DE102004032207 2004-07-02

Publications (1)

Publication Number Publication Date
WO2006003133A1 true WO2006003133A1 (fr) 2006-01-12

Family

ID=34973056

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/053009 Ceased WO2006003133A1 (fr) 2004-07-02 2005-06-27 Composant electronique a encapsulement

Country Status (2)

Country Link
EP (1) EP1763895A1 (fr)
WO (1) WO2006003133A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006019285A (ja) * 2004-07-02 2006-01-19 Konarka Technologies Inc 包封材を有する有機光起電性コンポーネント
DE102007046730A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Organisches elektronisches Bauelement, Herstellungsverfahren dazu sowie Verwendung
DE102008050332A1 (de) * 2008-10-07 2010-04-22 Leonhard Kurz Stiftung & Co. Kg Photovoltaische Zellen sowie Mehrschichtfolie
WO2014076132A1 (fr) * 2012-11-14 2014-05-22 Osram Opto Semiconductors Gmbh Composant optoélectronique
US9607301B2 (en) 2000-04-27 2017-03-28 Merck Patent Gmbh Photovoltaic sensor facilities in a home environment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0468440A2 (fr) * 1990-07-26 1992-01-29 Eastman Kodak Company Dispositif organique électroluminescent avec cathode stabilisée
EP0566736A1 (fr) * 1990-11-30 1993-10-27 Idemitsu Kosan Company Limited Dispositif a electroluminescence organique
US5998733A (en) * 1997-10-06 1999-12-07 Northrop Grumman Corporation Graphite aluminum metal matrix composite microelectronic package
US6198217B1 (en) * 1997-05-12 2001-03-06 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent device having a protective covering comprising organic and inorganic layers
US20040033375A1 (en) * 2002-08-19 2004-02-19 Hiroshi Mori Thin-film layer, method for forming a thin-film layer, thin-film layer fabrication apparatus and thin-film device
US20040046497A1 (en) * 2002-09-11 2004-03-11 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0468440A2 (fr) * 1990-07-26 1992-01-29 Eastman Kodak Company Dispositif organique électroluminescent avec cathode stabilisée
EP0566736A1 (fr) * 1990-11-30 1993-10-27 Idemitsu Kosan Company Limited Dispositif a electroluminescence organique
US6198217B1 (en) * 1997-05-12 2001-03-06 Matsushita Electric Industrial Co., Ltd. Organic electroluminescent device having a protective covering comprising organic and inorganic layers
US5998733A (en) * 1997-10-06 1999-12-07 Northrop Grumman Corporation Graphite aluminum metal matrix composite microelectronic package
US20040033375A1 (en) * 2002-08-19 2004-02-19 Hiroshi Mori Thin-film layer, method for forming a thin-film layer, thin-film layer fabrication apparatus and thin-film device
US20040046497A1 (en) * 2002-09-11 2004-03-11 General Electric Company Diffusion barrier coatings having graded compositions and devices incorporating the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9607301B2 (en) 2000-04-27 2017-03-28 Merck Patent Gmbh Photovoltaic sensor facilities in a home environment
JP2006019285A (ja) * 2004-07-02 2006-01-19 Konarka Technologies Inc 包封材を有する有機光起電性コンポーネント
EP1617494A3 (fr) * 2004-07-02 2007-12-19 Konarka Technologies, Inc. Dispositf organique photovoltaïque avec encapsulation
US7781670B2 (en) 2004-07-02 2010-08-24 Konarka Technologies, Inc. Organic photovoltaic component with encapsulation
DE102007046730A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Organisches elektronisches Bauelement, Herstellungsverfahren dazu sowie Verwendung
DE102008050332A1 (de) * 2008-10-07 2010-04-22 Leonhard Kurz Stiftung & Co. Kg Photovoltaische Zellen sowie Mehrschichtfolie
WO2014076132A1 (fr) * 2012-11-14 2014-05-22 Osram Opto Semiconductors Gmbh Composant optoélectronique
CN104813501A (zh) * 2012-11-14 2015-07-29 欧司朗Oled有限责任公司 光电器件
US9502682B2 (en) 2012-11-14 2016-11-22 Osram Oled Gmbh Optoelectronic device
DE102012220724B4 (de) 2012-11-14 2022-05-25 Pictiva Displays International Limited Optoelektronisches Bauelement

Also Published As

Publication number Publication date
EP1763895A1 (fr) 2007-03-21

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