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WO2006098182A1 - Substrat, panneau d’affichage, affichage, et procédé de fabrication d’un tel substrat - Google Patents

Substrat, panneau d’affichage, affichage, et procédé de fabrication d’un tel substrat Download PDF

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Publication number
WO2006098182A1
WO2006098182A1 PCT/JP2006/304291 JP2006304291W WO2006098182A1 WO 2006098182 A1 WO2006098182 A1 WO 2006098182A1 JP 2006304291 W JP2006304291 W JP 2006304291W WO 2006098182 A1 WO2006098182 A1 WO 2006098182A1
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WO
WIPO (PCT)
Prior art keywords
layer
substrate
area
patterned
spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/304291
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English (en)
Japanese (ja)
Inventor
Kohji Matsuoka
Tsuyoshi Tokuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
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Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2006098182A1 publication Critical patent/WO2006098182A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G02F1/13396—Spacers having different sizes

Definitions

  • Substrate, display panel, display device, and method for manufacturing the substrate are Substrate, display panel, display device, and method for manufacturing the substrate
  • the present invention relates to a substrate provided with a spacer that is patterned by an exposure process, and a display panel using the same, in order to maintain a predetermined interval from another substrate that is provided facing the substrate.
  • the present invention relates to a display device and a method for manufacturing the substrate.
  • a liquid crystal display device includes a display panel in which a liquid crystal layer in which a liquid crystal material is sealed is sandwiched between two opposing substrates.
  • a spacer is provided between the substrates in order to maintain a gap between the substrates in the display panel.
  • This spacer is generally transparent beads (spherical particles) such as glass or synthetic resin, and these gaps are dispersed between the two substrates to maintain the gap.
  • the above bead type spacer may be a factor that adversely affects display quality.
  • the transparent spacer when used, light leaks through the spacer.
  • the presence of the spacer in the liquid crystal layer regardless of whether it is transparent or not may disturb the alignment state of the liquid crystal molecules in the vicinity of the spacer.
  • photospacer As a technique for solving such problems, a technique called "photospacer” has been proposed.
  • a photosensitive material is exposed and developed to form projections at the position of the light-shielding layer between pixels on the display panel, and these projections are used as spacers (photo spacers). Use.
  • Patent Document 1 includes an excessive amount of a first columnar spacer having a height and a cross-sectional area corresponding to deformation due to load during panel assembly and deformation following liquid crystal shrinkage at low temperatures. Describes a technology for forming two types of columnar spacers: a second columnar spacer that has a height and cross-sectional area that maintains a gap between substrates when subjected to a load and when the liquid crystal shrinks in a low-temperature environment. Speak.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2003-121857 (Publication Date: April 23, 2003)
  • the gap between the substrates (cell gap) is not sufficient. There is a problem that the problem is likely to occur.
  • the cross-sectional area or bottom area of the photospacer may change from shot to shot at the seam portion of each shot due to various factors in the process.
  • the cross-sectional area or the bottom area refers to a cross section parallel to the substrate surface of the photo spacer or the area of the bottom surface (upper bottom surface or lower bottom surface).
  • the above factors include, for example, (1) non-uniform gap between the substrate and mask in each shot, and (2) difference in the amount of light caused by the orientation of the exposure lamp (intensity distribution of exposure light amount with respect to the substrate surface direction) (3)
  • the surface step difference of the substrate is different for each substrate.
  • the exposure areas of the shots in the divided exposure process are arranged adjacent to each other so as not to overlap each other, and the boundary lines of the areas are arranged in a straight line.
  • a sharp change in the cross-sectional area or bottom area of the photospacer occurred.
  • a photospacer with a small cross-sectional area or bottom area is easily deformed (easy to be crushed), and a photospacer with a large cross-sectional area or bottom area is difficult to deform (hard to be crushed).
  • Photospacers with different amounts of deformation in the normal direction of the substrate surface for the same load are formed with the joint as the boundary.
  • FIG. 18A and FIG. 18B are perspective views showing an example of a divided exposure process in a conventional proximity exposure apparatus.
  • the photosensitive material 102 is patterned by applying the photosensitive material 102 to the surface of a substrate (for example, a color filter (CF) substrate) 101 and exposing the force on the substrate 101 through the mask 104.
  • a substrate for example, a color filter (CF) substrate
  • CF color filter
  • a light shielding shutter 103 having an opening is disposed on the substrate 101, and a mask 104 is disposed in the opening of the light shielding shutter 103 to generate upward force exposure light.
  • the photosensitive material 102 is exposed by irradiating UV (ultraviolet) light or the like.
  • a first shot exposure process is performed on a part of the substrate 101 (the left area in the figure).
  • the second shot exposure process is performed on an area different from the area where the first shot exposure process is performed on the substrate 101 (the right area in the figure).
  • the exposure process may be performed in a state where the distance between the mask 104 and the substrate 101 is not uniform.
  • FIG. 19A shows a case where the gap between the substrate 101 and the mask 104 is larger at the center of the substrate 101 than at the left end of the substrate 101 in the first shot exposure.
  • (b) shows a case where the gap between the substrate 101 and the mask 104 is larger at the center of the substrate 101 than at the right end of the substrate 101 in the drawing when the second shot is exposed.
  • the inclination angle of the mask 104 is made larger than the actual angle in order to make the difference in gap easy to be divided.
  • FIG. 20 is a plan view schematically showing the cross-sectional area or the bottom area of the photo spacer formed on the substrate 101 in this case.
  • FIGS. 19 (a) and 19 (b) an exposure process is performed in a state where the mask 104 is tilted. As a result, the photo spacer is patterned. As shown in FIG. 20, the cross-sectional area or the bottom area of the photo spacer is reduced toward the left end and the right end of the substrate 101 where the central portion of the substrate 101 is large. Also, PS1 is the photo spacer formed in the first shot at the center of the substrate 101, and it is formed in the second shot.
  • the photospacer is PS2
  • the adjacent PS1 and PS2 at the boundary between the first and second shots due to differences in the tilt angle of the mask 104 with respect to the substrate 101 in the first and second shots
  • Each cross-sectional area or bottom area is different from each other. For this reason, gap unevenness occurs near the boundary between the first shot and the second shot.
  • the photospacers PS1 and PS2 patterned in each shot are located near the boundary between the first shot area and the second shot area.
  • the difference in cross-sectional area or bottom area is relatively small.
  • the gap unevenness is also relatively small.
  • the difference between the cross-sectional areas or bottom areas of the photospacers PS1 and PS2 is large, when the substrate 101 is bonded to the counter substrate (not shown), it becomes more easily recognized as a gap unevenness. .
  • FIG. 21 (a) shows a case where the gap between the substrate 101 and the mask 104 is larger at the center of the substrate 101 than at the left end of the substrate 101 in the first shot exposure.
  • (b) shows a case where the gap between the substrate 101 and the mask 104 is larger at the center of the substrate 101 than at the right end of the substrate 101 in the drawing when the second shot is exposed.
  • the inclination angle of the mask 104 is made larger than the actual one in order to make it easy to separate the gap difference for convenience of explanation.
  • FIG. 22 is a plan view schematically showing the area of the photo spacer formed on the substrate 101 in this case.
  • Fig. 21 (a) and Fig. 21 (b) when the exposure process is performed with the mask 104 tilted, and the photo spacer is patterned by this, the formation is performed. As shown in FIG. 22, the cross-sectional area or the upper bottom area of the photo spacer is reduced toward the left end of the substrate 101 where the central portion of the substrate 101 is larger in the first shot region. Further, in the second shot region, the right end direction force of the substrate 101 becomes larger as the central portion of the substrate 101 is smaller.
  • FIGS. 23 (a) and 23 (b) there is a case where the exposure light quantity varies within the exposure light irradiation area in each shot.
  • the exposure process step For example, depending on the light intensity setting, as shown in FIG. 23 (a), during the first shot exposure, the exposure light at the center of the substrate 101 where the light intensity of the exposure light at the left end of the substrate 101 in the figure is relatively small. The amount of light becomes relatively large. Thereafter, as shown in FIG. 23 (b), during the second shot exposure, the variation in the exposure light of the first shot is shifted, and the amount of exposure light at the center of the substrate 101 is relatively small. The amount of exposure light at the right end of the figure 101 is relatively large.
  • the cross-sectional area or upper bottom area of the photospacer is the same as that shown in FIG.
  • the central portion of the substrate 101 becomes smaller toward the left end of the larger substrate 101
  • the central portion of the substrate 101 becomes smaller toward the right end of the smaller substrate 101. If the difference in the amount of exposure light and the difference in the gap between the mask 104 and the surface of the substrate 101 overlap, the change in the cross-sectional area or bottom area of the photospacer becomes larger at the boundary of each shot.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a substrate including a photospacer formed by performing a divided exposure process in the direction parallel to the substrate surface. Another object of the present invention is to provide a substrate with reduced gap unevenness at the joint portion of each shot, and a display panel and a display device provided with the substrate.
  • the substrate of the present invention has a plurality of spacers that are patterned by exposure processing to keep a predetermined interval from another substrate that is provided facing the substrate.
  • the above-described spacer patterned in different shots in the above-described divided exposure process is mixed and has the following structure.
  • the spacer includes a divided exposure layer patterned by a divided exposure process, and the overlapping region includes the divided exposure layer patterned by a different shot. As a composition that is mixed.
  • the area including the spacers including the divided exposure layers patterned with different shots is provided. That is, at least a part of the spacer is patterned by the division exposure process, and the substrate is a mixture of spacers including layers patterned in different shots in the division exposure process. It has an area to do.
  • the substrate includes a functional layer patterned by an exposure process in a region that does not overlap with the spacer when viewed from the normal direction of the substrate surface of the substrate. At least a part of the substrate may be made of the same material cover as the functional layer patterned by the exposure process.
  • the substrate may include a color filter layer patterned by an exposure process as the functional layer, and the spacer may have the same material force as the color filter layer.
  • the spacer is patterned by the exposure process.
  • the functional layer is formed of a common material. For this reason, since it is not necessary to prepare the material for the spacer separately, the manufacturing cost can be reduced. Further, by performing the exposure process of the functional layer and the exposure process of the spacer by a common process, the manufacturing process can be simplified and the manufacturing cost can be further reduced.
  • the spacer has a laminated structure of a plurality of layers, and among the layers constituting the laminated structure, the shape of the layer is high in the normal direction of the substrate surface of the spacer.
  • the deformation amount determination layer which is the layer that most affects the deformation amount when a load in the normal direction of the substrate surface is applied to the spacer, is patterned by the division exposure process.
  • the overlapping region may include a spacer including the deformation amount determining layer patterned with different shots.
  • the deformation amount determining layer is patterned by the division exposure process, and the overlapping region includes the deformation amount determining layer patterned by different shots.
  • the overlapping region includes the deformation amount determining layer patterned by different shots.
  • the deformation amount determining layer may be a layer that affects the shape of the uppermost layer of the spacer.
  • the uppermost layer of the spacer is the layer farthest from the substrate surface force of the substrate on which the spacer is formed.
  • the layer affecting the shape of the uppermost layer of the spacer is a layer having a different shape of the uppermost layer of the spacer having the layer when the shape of the layer is different.
  • the shape of the upper bottom surface in each layer of the spacer having the laminated structure is not particularly limited, and may be, for example, a circular shape or a polygonal shape.
  • the layer that affects the shape of the uppermost layer of the spacer is patterned by the divided exposure process, and the overlapping region is patterned with different shots. Spacers including the corresponding layer are mixed. For this reason, different shots Even when the shapes of the layers patterned at the top and bottom are different, it is possible to prevent the gap between the plates provided facing each other from changing sharply at the seam portion of different shots.
  • the deformation amount determining layer may be a minimum area layer having a minimum upper base area among the respective layers constituting the stacked structure.
  • the minimum area layer greatly affects the upper bottom area of the spacer. In addition, it greatly affects the height and deformation amount of the spacer in the normal direction of the substrate surface. For this reason
  • the bottom area of the minimum area layer patterned in different shots is patterned in each shot. Even if the spacers are different, gap unevenness at the joint portion of each shot can be reduced.
  • the spacer further includes a minimum area determining layer that affects an upper bottom area of the minimum area layer, and the overlapping area includes the minimum area patterned in different shots.
  • a minimum area determining layer that affects the top bottom area of the minimum area layer is a layer having a different top bottom area when the top bottom area is different.
  • the minimum area determining layer may be a layer in which a difference in diameter between an upper bottom surface and a diameter circle of a circumscribed circle on the upper bottom surface is not less than 0 ⁇ m and less than 20 ⁇ m.
  • the difference between the diameter of the upper bottom surface or the circumscribed circle of the upper bottom surface in the minimum area layer and the diameter of the upper bottom surface or the circumscribed circle of the upper bottom surface in the minimum area determining layer is O / zm or more.
  • the minimum area determining layer greatly affects the upper bottom area of the minimum area layer.
  • it greatly affects the height and deformation amount of the spacer having the minimum area layer in the normal direction of the substrate surface.
  • the width of the overlapping region may be not less than 5 mm and not more than 200 mm.
  • the width of the overlapping region is too narrow, gap unevenness at the boundary portion of each shot may not be sufficiently reduced. However, if the width of the overlapping region is 5 mm or more, the gap Unevenness can be reduced.
  • the spacers patterned in different shots in the divided exposure process or a layer constituting the spacer are combined with the light-shielding layer. It is preferable to be provided in the overlapping region. This makes it possible to provide a spacer that does not affect the display of the image.
  • the display panel of the present invention is characterized by comprising any of the above-mentioned substrates!
  • the display device of the present invention has the above-described display panel in order to solve the above-described problems.
  • the substrate can be suitably used for a liquid crystal panel. Therefore, the above-described display panel or display device is preferable. As an example, a liquid crystal panel or a liquid crystal display device can be given.
  • the substrate manufacturing method of the present invention includes a plurality of patterns patterned by an exposure process for maintaining a predetermined distance from another substrate provided oppositely.
  • a method of manufacturing a substrate provided with a spacer comprising: a divided exposure processing step in which the spacer is subjected to exposure processing with different shots for each of a plurality of regions in a direction parallel to the substrate surface. In the processing step, a part of the region is overlapped with a part of another adjacent region, and a spacer patterned with different shots is mixed in the overlapped region.
  • a part of the area to be subjected to the divided exposure process is overlapped with a part of another area adjacent thereto, and the area to be overlapped differs.
  • a mask in the divided exposure processing step, may be used for patterning a plurality of spacers. It has a standard area with a turn and a mixed area corresponding area that has a complementary pattern that overlaps with each other to form the same regular pattern as the standard area. On the other hand, the area other than both ends is a standard area.
  • the spacer of the substrate of the present invention is patterned by the division exposure process in which the exposure process is performed with different shots for each of the plurality of regions in the direction parallel to the substrate surface. And a part of another area adjacent to each other, and the overlapping area includes the spacers patterned with different shots in the divided exposure process.
  • the display panel of the present invention may include any of the substrates described above.
  • the display device of the present invention includes the display panel.
  • each of the above-described divided exposure processes is performed. It is possible to prevent gap gaps from occurring at the seam portion of shots and seeing them as cell gap irregularities.
  • the divided exposure processing step a part of the area is overlapped with a part of another adjacent area, and the overlapping area is differently shot. Batter A mixed spacer is mixed.
  • FIG. 1 is a plan view of a substrate on which a photospacer that is useful in one embodiment of the present invention is formed.
  • FIG. 2 (a) is a cross-sectional view of a display panel according to an embodiment of the present invention.
  • FIG. 2 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 2 (a).
  • FIG. 3 is a block diagram showing a schematic configuration of a display device including a display panel that is useful for one embodiment of the present invention.
  • FIG. 4 is a schematic diagram showing a schematic configuration around each pixel in the display panel according to one embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a configuration example of a switching element provided in a display panel according to an embodiment of the present invention.
  • FIG. 6 (a) is a perspective view showing an exposure process for patterning a photospacer of a substrate, which is useful in one embodiment of the present invention.
  • FIG. 6 (b) is a perspective view showing an exposure process for patterning a photospacer of a substrate that is effective in one embodiment of the present invention.
  • FIG. 7 (a) is a cross-sectional view of a display panel when a photospacer is provided on an array-side substrate in one embodiment of the present invention.
  • FIG. 7 (b) is a plan view of the counter substrate in the case of FIG. 7 (a) in the embodiment of the present invention.
  • FIG. 8 is a cross-sectional view showing a configuration example in the case where a light shielding layer is further provided on the array-side substrate including the switching element shown in FIG.
  • Fig. 9 (a) shows the display panel shown in Fig. 2 (a) with rivets instead of ribs. It is sectional drawing which shows the structural example of the display panel in the case of obtaining.
  • FIG. 9 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 9 (a).
  • FIG. 10 (a) is a cross-sectional view showing a configuration example of a display panel in the case where the display panel shown in FIG. 7 (a) is provided with rivets instead of ribs.
  • FIG. 10 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 10 (a).
  • FIG. 11 (a) is a cross-sectional view showing a schematic configuration of a display panel including a substrate provided with a photo spacer that also has a laminated structural force, according to another embodiment of the present invention. .
  • FIG. 11 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 11 (a).
  • FIG. 12 is a flowchart showing a flow of manufacturing steps of the counter substrate shown in FIGS. 11 (a) and 11 (b).
  • FIG. 13 (a) is a cross-sectional view showing a modification of the display panel which is useful in another embodiment of the present invention.
  • FIG. 13 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 13 (a).
  • FIG. 14 (a) is a cross-sectional view showing a modification of the display panel according to another embodiment of the present invention.
  • FIG. 14 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 14 (a).
  • FIG. 15 (a) is a cross-sectional view showing a configuration example of a display panel in the case where the display panel shown in FIG. 11 (a) includes a rivet instead of a rib.
  • FIG. 15 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 15 (a).
  • FIG. 16 (a) is a cross-sectional view showing a configuration example of the display panel in the case where the display panel shown in FIG. 13 (a) includes a rivet instead of the rib.
  • FIG. 16 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 16 (a). It is.
  • FIG. 17 (a) is a cross-sectional view showing a configuration example of the display panel in the case where the display panel shown in FIG. 14 (a) includes a rivet instead of the rib.
  • FIG. 17 (b) is a plan view of the counter substrate provided in the display panel shown in FIG. 17 (a).
  • FIG. 18 (a) is a perspective view showing a divided exposure process for patterning a photospacer in the prior art.
  • FIG. 18 (b) is a perspective view showing a divided exposure process for patterning a photospacer in the prior art.
  • FIG. 19 (a) is a perspective view showing an example in the case where the distance between the substrate and the mask is non-uniform in the divided exposure process for patterning the photospacer in the prior art. is there.
  • FIG. 19 (b) is a perspective view showing an example in the case where the distance between the substrate and the mask is non-uniform in the divided exposure process for patterning the photospacer in the prior art. is there.
  • FIG. 20 is a plan view showing a photospacer patterned by the divided exposure process shown in FIGS. 19 (a) and 19 (b).
  • FIG. 21 (a) shows another process in the case of a non-uniform spacing between the substrate and the mask in the conventional exposure process for patterning a photospacer! It is a perspective view showing an example.
  • FIG. 21 (b) is a diagram showing another example in the case where the distance between the substrate and the mask is non-uniform in the divided exposure process for patterning the photospacer in the prior art. It is a perspective view showing an example.
  • FIG. 22 is a plan view showing a photo spacer patterned by the divided exposure process shown in FIGS. 21 (a) and 21 (b).
  • FIG. 23 (a) shows an example in the case where the exposure amount varies in the exposure area of each shot in the divided exposure process for patterning the photospacer in the prior art. It is a perspective view.
  • FIG. 23 (b) shows an example in the case where the exposure amount varies in the exposure area of each shot in the divided exposure process for patterning the photospacer in the prior art. It is a perspective view.
  • FIG. 24 is a schematic plan view schematically showing an example of a mask used to form the photospacer having the arrangement shown in FIG. 1 and an example of a divided exposure process using the mask. It is.
  • L3 layer (division exposure layer, deformation amount determination layer, minimum area layer)
  • FIG. 2A is a cross-sectional view showing a schematic configuration of a counter substrate (substrate) 1 on which a photo spacer is formed and a display panel 10 including the counter substrate 1 according to the present embodiment.
  • FIG. 2 (b) is a plan view of the counter substrate 1 in which the array side substrate (substrate) 2 side force is also viewed.
  • the counter substrate 1 is provided on a supporting substrate such as glass (not shown) with three color filter layers CF1, CF2, CF3, and a light shielding layer (BM; Black Matrix) 3 And an electrode (counter electrode) 4, a rib 5, an alignment film 6, and a photospacer (PS) 7.
  • a supporting substrate such as glass (not shown) with three color filter layers CF1, CF2, CF3, and a light shielding layer (BM; Black Matrix) 3
  • BM Black Matrix
  • an electrode (counter electrode) 4 a rib 5, an alignment film 6, and a photospacer (PS) 7.
  • Each color filter layer CF1, CF2, CF3 is formed in a different area on the support substrate.
  • a light shielding layer 3 is formed between the color filter layers. Further, a part of each color filter layer and a part of the light shielding layer 3 may overlap in the normal direction of the substrate surface.
  • the colors of the color filter layers CF1, CF2, and CF3 are not particularly limited and may be set arbitrarily. In addition, it is not limited to the configuration having the three color filter layers. For example, it may be a single color, two colors, or more than four colors! /.
  • the light shielding layer 3 is formed at a position facing a switching element or the like formed on the array side substrate 2.
  • the material of the light shielding layer 3 is not particularly limited, but is made of a metal film such as chromium.
  • the electrode 4 is formed to cover the color filter layers CF1, CF2, CF3 and the light shielding layer 3.
  • the material of the electrode 4 is not particularly limited.
  • ITO indium Stannic acid salt
  • ITO indium Stannic acid salt
  • the ribs 5 are arranged so that the longitudinal direction extends in two different directions within the substrate surface.
  • the liquid crystal material sealed in the liquid crystal layer 11 can be aligned in four directions.
  • the formation conditions such as the specific shape and size of rib 5 (for example, the extending direction, the width of rib 5 and the number of ribs 5 per predetermined area, etc.). If you can be oriented in the desired direction within.
  • the photo spacer (columnar spacer) 7 is formed on the electrode 4 in a region overlapping with the light shielding layer 3 when viewed from the direction perpendicular to the substrate surface of the counter substrate 1.
  • the force photospacer 7 described later in detail is formed by performing exposure processing, development processing, and the like on the photosensitive material.
  • the alignment film 6 is formed so as to cover the electrode 4, the rib 5, and the photospacer 7!
  • the material of the alignment film 6 is not particularly limited.
  • polyimide (PI) or the like is formed on the support substrate on which the light shielding layer 3, the color filter layers CF 1, CF 2, CF 3, electrodes 4, and ribs 5 are formed.
  • those transferred by printing can be used.
  • the alignment film 6 may be omitted depending on the use of the substrate or the display panel 10 that does not necessarily include the alignment film 6.
  • the array-side substrate 2 includes an electrode (array-side electrode, pixel electrode) 8 and an alignment film 9 on a support substrate 2a that also has glass isotropic force.
  • the electrode 8 and the alignment film 9 those similar to the electrode 4 and the alignment film 6 can be used.
  • the alignment films 6 and 9 are applied to the counter substrate 1 on which the color filter layers CF1, CF2, CF3, the light shielding layer 3, the electrode 4, the rib 5, and the photospacer 7 are formed, and the array side substrate 2 by a transfer method. It is printed.
  • the counter substrate 1 and the array side substrate 2 are opposed to each other in a state where a predetermined distance is maintained by the photospacer 7.
  • a liquid crystal material is sealed in the liquid crystal layer 11 which is a region between the two substrates.
  • the liquid crystal material is not particularly limited, and may be, for example, a negative liquid crystal material or a positive liquid crystal material.
  • the liquid crystal material is injected after the alignment films 6 and 9 are formed, the counter substrate 1 and the array side substrate 2 are bonded together via the photospacer 7, and the liquid crystal material is injected between both substrates (vacuum injection). Is done by doing.
  • the method of forming the liquid crystal layer 11 is not limited to this, for example, an ODF (One Drop Fill) process in which the liquid crystal material is dropped in a vacuum before the two substrates are bonded together. May be used.
  • the arrangement of the electrode 4 and the electrode 8 is not particularly limited.
  • the arrangement may be an arrangement in which an electric field is generated in the in-plane direction of the substrate or an electric field in the normal direction of the substrate surface. .
  • FIG. 3 is a block diagram showing a schematic configuration of a main part of the display device 20 including the display panel 10, and FIG. 4 shows each pixel in the display panel 10 used in the display device shown in FIG. It is a schematic diagram which shows the surrounding schematic structure.
  • the display device 20 includes a display panel 10 in which pixels 21... Are arranged in a matrix, a source driver 22 and a gate driver 23 as drive circuits. Power supply circuit 24 and the like.
  • Each pixel 21 is provided with a pixel capacitor 25 and a switching element 26 as shown in FIG.
  • a plurality of data signal lines SL1 to SLn (n represents an arbitrary integer of 2 or more) and each data signal line SLl to SLn are crossed.
  • a plurality of scanning signal lines GLl to GLm (m represents an arbitrary integer of 2 or more) are provided. For each combination of the data signal lines SL1 to SLn and the scanning signal lines GL1 to GLm, the pixel 21 ⁇
  • the power supply circuit 24 supplies the source driver 22 and the gate driver 23 with a voltage for performing display on the display panel 10, whereby the source driver 22 causes the data signal lines SL1 to SLn of the display panel 10 to be displayed.
  • the gate driver 23 drives the scanning signal lines GL 1 to GLm of the display panel 10.
  • FIG. 5 is a cross-sectional view showing a configuration example of the switching element 26.
  • the switching element 26 includes, for example, a gate electrode 27 formed on the support substrate la, a non-conductive film 111 having the same power as SiO, an i layer 114, N
  • a non-conductive film 115 and an electrode 8 are provided.
  • the formation method of each of these members is not particularly limited, but usually, vapor deposition, resist coating, exposure, development, etching, etc. It is formed through the process.
  • the non-conductive film 115 is provided. However, it is not always necessary to provide the non-conductive film 115.
  • the electrode 8 may be provided on the non-conductive film 112. Good.
  • the gate electrode 27 of the switching element 26 is connected to the scanning signal line GLi, the source electrode 28 is connected to the data signal line SLi, and the drain electrode 29 is connected to one end (electrode 8) of the pixel capacitor 25. .
  • the other end of the pixel capacitor 25 (the electrode 4 formed on the counter substrate 1 side) is connected to a common electrode line (not shown) common to all the pixels 21.
  • the signal voltage is determined, and this signal voltage is applied to the pixel capacitor 25 by the source driver 22 via the data signal line SLi (i is an arbitrary integer of 1 or more). Ideally, the pixel capacitor 25 continues to hold the voltage at the time of shutoff while the selection period of the scanning signal line GLi ends and the switching element 26 is shut off.
  • a photosensitive material to be a photospacer 7 is applied on the support substrate on which the color filter layers CF1, CF2, CF3, the light shielding layer 3, and the electrode 4 are formed.
  • the material of the photosensitive material is not particularly limited as long as it has an appropriate strength as a spacer after exposure / development processing.
  • acrylic resin can be suitably used.
  • the photosensitive material 7 ′ applied to the counter substrate 1 is disposed in the light shielding shutter 12 having an opening and the opening of the light shielding shutter 12.
  • exposure light light
  • the photosensitive material 7 ′ applied on the support substrate la is patterned into a predetermined shape.
  • an area on the substrate surface is divided into a plurality of areas, and an exposure process is performed for each divided area (divided exposure).
  • Fig. 6 (a) shows the exposure process for the first shot (first time) in this divided exposure process.
  • the position of the mask 13 is moved in the direction parallel to the substrate surface, and the exposure process for the second shot is performed. At this time, a part of the region (first shot region) irradiated with the exposure light of the first shot on the substrate and a region (second shot region) irradiated with the exposure light of the second shot Set the exposure area of each shot so that it partially overlaps.
  • a mixed region (a one-shot two-shot mixed region) in which a part of the first shot region and a part of the second shot region overlap is formed.
  • the photo spacer 7 (photo spacer 7 ) patterned in the first shot exposure process and the second shot exposure process are patterned.
  • the photospacer 7 that is patterned in the first shot and the pattern 7 that is patterned in the second shot are equal.
  • FIG. 24 is a schematic diagram showing an example of the mask 13 used for forming the overlapping mixed region shown in FIG. 1 and an example of an exposure process using the mask 13.
  • the mask 13 has a rectangular shape, for example, and a circular pattern 37 corresponding to the photospacer 7 is provided on the entire surface.
  • Most of the mask 13 is regularly arranged so that the adjacent circular patterns 37 are equidistant from each other, but in order to form the mixed region at both ends in the longitudinal direction, the circular patterns 37a and 37 37b is arranged in a zigzag.
  • both end portions thereof are mixed region corresponding regions 13a'13b (for convenience of explanation, simply referred to as corresponding regions), and most of the center is a standard region 13c.
  • the corresponding region 13a '13b is a band-like region that spreads at a constant width in the direction orthogonal to the longitudinal direction of the mask 13 at each end, and the other part is a standard region 13c.
  • circular patterns 37a are zigzag at positions on the left side, right side, left side, right side, and left side from the top to the bottom in the figure. Is arranged.
  • circular patterns 37a are arranged in a zigzag at the positions on the right side, left side, right side, left side, and right side from the top to the bottom of the figure. .
  • Circular patterns 37a '37b are arranged so that these corresponding regions 13a' 13b are complementary to each other, and when the corresponding regions 13a '13b are overlapped with each other, the circular patterns 37a' 37b as a whole do not overlap, Like the standard area 37c, they will be equally spaced from each other.
  • Topspacer 7 and photospacer 7 are mixed, and each other's photospacer 7
  • the photospacers 7 are arranged at equal intervals.
  • a mask having a desired pattern may be used.
  • a standard area having a regular pattern occupies an area other than both ends. Both end portions are preferably mixed region corresponding regions having a complementary pattern that is the same regular pattern as the standard region by overlapping each other. As a result, it is possible to form a photospacer that is patterned with different shots in the overlapping mixed region by using only one type of mask.
  • the exposure process for patterning the photospacer is performed by divided exposure, and a part of the exposure area of the first shot and 2 A part of the exposure area of the shot overlaps. For this reason, in the area where the exposure area of the first shot and the exposure area of the second shot overlap (overlapping mixed area), the photo spacers patterned by the exposure processing of each shot are mixed.
  • the cross section or bottom surface parallel to the substrate surface in the photo spacer patterned in both shots. Even if there is a difference in the area of the bottom surface), when the counter substrate 1 is bonded to the array side substrate 2, the photo spacer for each shot is mixed in the overlapping mixed region. Therefore, it is possible to prevent the deformation amount of the photospacer in the normal direction of the substrate surface from changing sharply. Therefore, it is possible to prevent gap unevenness from occurring after the counter substrate 1 and the array side substrate 2 are bonded together.
  • the number of areas to be divided is particularly limited.
  • the exposure process may be performed by dividing into a larger number of regions. In this case, a part of the exposure area of each shot may be overlapped with a part of another adjacent exposure area.
  • Patterned 7 alternates in two orthogonal directions parallel to the substrate surface
  • the photo spacer patterned in each shot is mixed in the area where the first shot area and the second shot area overlap.
  • the photo spacer patterned in the first shot and the photo spacer patterned in the second shot may be randomly dispersed and mixed in a mosaic pattern.
  • the mask 13 may be a mask corresponding to a pattern in which photospacers are mixed in the overlap region.
  • the masks 13 used in each may be common or different.
  • the width of the mixed area of each shot is not particularly limited, and may be arbitrarily set within a range of 0 or more and mask size or less. However, in order to reduce gap unevenness, the wider the mixed region of each shot, the better. In addition, if the width of the mixed area is too narrow, gap unevenness in the vicinity of the mixed area may not be sufficiently reduced. In order to sufficiently reduce gap unevenness, the width of the mixed area should be 10 mm or more. Is preferred. On the other hand, in order to increase the efficiency of the exposure process and improve the productivity, it is preferable to narrow the width of the mixed area of each shot. Therefore, from the viewpoint of productivity, the width of the mixing zone is preferably 200 mm or less! /.
  • Fig. 7 (a) is a cross-sectional view showing a part of the display panel 10 when the photospacer 7 is provided on the array side substrate 2
  • Fig. 7 (b) shows the counter substrate 1 in this case as the array side substrate. It is the top view seen from the 2 side.
  • the electrode 8 is formed on the support substrate 2a, and the region without the electrode 8 on the substrate surface (the array-side substrate 2
  • the photo spacer 7 is formed in a region overlapping the light shielding layer 3 of the counter substrate 1 when the counter substrate 1 and the counter substrate 1 are bonded together.
  • the step of forming the photospacer 7 is preferable because the height of the photospacer 7 to be performed after the step of forming the electrode 8 can be stabilized.
  • the method for forming the photo spacer 7 may be the same as that for forming on the counter substrate 1.
  • the counter substrate 1 is provided with the light shielding layer 3.
  • the array side substrate 2 may be provided with the light shielding layer.
  • FIG. 8 is a cross-sectional view showing a configuration example in the case where a light shielding layer 3b is further provided on the array side substrate 2 provided with the switching element 26 shown in FIG. As shown in this figure, when the light shielding layer 3b is provided on the array side substrate 2, the light shielding layer 3b may be disposed so as to cover the switching element 26. In the example shown in this figure, the light shielding layer 3b is formed between the non-conductive film 112 and the non-conductive film 115.
  • the present invention is not limited to this, and it may be formed in a different layer.
  • the non-conductive film 115 is provided.
  • the non-conductive film 115 is not necessarily provided.
  • the light shielding layer 3b is formed on the non-conductive film 112, and the non-conductive film 112 is formed.
  • the electrode 8 may be formed on the light shielding layer 3b.
  • an electrode 8 is formed in a region overlapping with the light shielding layer as viewed from the substrate surface normal direction or from the substrate surface normal direction. It is preferable to form a photospacer 7 in the region. In addition, the direction of forming the photospacer 7 after forming the switching element 26 and the electrode 8 is preferable because the height of the photospacer 7 can be stabilized.
  • the force for providing the rib 5 as a member for aligning liquid crystal molecules on the counter substrate 1 is not limited to this.
  • the rib 5 may be omitted.
  • the photospacer 7 may be provided on the counter substrate 1 side or on the array side substrate 2 side. That is, the rib 5 is removed from the configuration shown in FIGS. 2 (a) and 2 (b).
  • the configuration shown in FIG. 7 (a) and FIG. 7 (b) may be the configuration in which the rib 5 is deleted.
  • FIGS. 10 (a) and 10 (b) are cross-sectional views showing a configuration example when the rib 5 is replaced with the rivet 5b in the configuration shown in FIGS. 7 (a) and 7 (b).
  • FIG. 10 (a) and 10 (b) are cross-sectional views showing a configuration example when the rib 5 is replaced with the rivet 5b in the configuration shown in FIGS. 7 (a) and 7 (b).
  • rivets 5b having a circular cross section in the in-plane direction of the substrate are used to align liquid crystal molecules in all directions. It can be made. It should be noted that the formation conditions such as the specific shape and size of the rivet 5b (for example, the diameter of the rivet 5b, the number of the rivets 5b per predetermined area, etc.) are not particularly limited, and a liquid crystal material is desired in the liquid crystal layer 11. If you can orient in the direction!
  • the setting of the position where the photospacer 7 is provided may be associated with the position of the rib 5.
  • the ribs 5 when the ribs 5 are viewed as a set of two, one end is close and the other end is open, in other words, a pair of ribs. It can be seen that 5 ⁇ 5 is provided to open at an arbitrary angle.
  • the photospacer 7 is provided at a position close to the end of the ribs 5 and 5 on the adjacent side. In this case, the photospacer 7 is more preferably provided at a position that supports the alignment of the liquid crystal molecules by the rib 5.
  • the photospacer 7 is provided so as to correspond to the position of the force rivet 5b in which the rivet 5b is provided instead of the rib 5, so that the rivet 5b This is preferable because it supports omnidirectional alignment of liquid crystal molecules.
  • the liquid crystal aligning member for aligning a liquid crystal molecule it is preferable to make the position where the photospacer 7 is provided correspond to the aligning member.
  • the photosensitive material for forming the photospacer 7 is a force that uses a material different from the material of other layers formed on the substrate. Absent.
  • the same material as that for forming any color filter layer (functional layer) for example, acrylic resin
  • rib 5 or rivet 5b may be formed.
  • the same material as the layer (functional layer) for example, Microposit (registered trademark) resin
  • the shape of the photospacer is not limited to this, and is not limited to a columnar shape.
  • the shape may be, for example, a cone shape or a trapezoidal shape lacking the upper part of the cone. That is, the cross section parallel to the substrate surface may be circular, polygonal, or other shapes. Further, the cross-section perpendicular to the substrate surface may be a polygonal shape, or a part of the cross-sectional shape perpendicular to the substrate surface may be a curved line.
  • FIG. 11 (a) shows a schematic configuration of a part of the counter substrate 1 on which the photospacer 7b having a laminated structural force is formed and a part of the display panel 10 including the counter substrate 1 according to the present embodiment.
  • FIG. 11 (b) is a sectional view of the counter substrate 1 as viewed from the array side substrate 2 side.
  • the counter substrate 1 is provided on a supporting substrate such as glass (not shown) on three color color layers CF1, CF2, CF3, a light shielding layer 3, an electrode 4, and a rib. 5 with a self-directing membrane 6 and a photospacer 7b!
  • Each color filter layer CF1, CF2, CF3 is formed in a different area on the support substrate.
  • a light shielding layer 3 is formed between the color filter layers. Further, the light shielding layer 3 is disposed at a position facing the switching elements and the like formed on the array side substrate 2.
  • the electrode 4 is formed so as to cover the color filter layers CF1, CF2, CF3 and the light shielding layer 3.
  • the material of the electrode 4 is not particularly limited. For example, ITO (indium stannate) can be used.
  • the rib 5 is arranged so that the longitudinal direction extends in two different directions in the substrate surface (see Embodiment 1 and Fig. 2 (b)). .
  • the photo spacer (multilayer photo spacer) 7b is formed in a region overlapping with the light shielding layer 3 in view of the direction force perpendicular to the substrate surface of the counter substrate 1.
  • the photospacer 7b is formed by laminating the same materials as those used for the color filter layers (functional layers) CF1, CF2, CF3, and ribs 5, respectively.
  • the photospacer 7b is made of the same material as the color filter layer CF3 on the light shielding layer 3, the layer Ll having the same material force as the color filter layer CF1, the layer L2 made of the same material as the color filter layer CF2, and the color filter layer CF3. It has a laminated structure including a layer L4 made of the same material as the layer (functional layer) constituting the layer L3, the electrode 4, and the rib 5.
  • the alignment film 6 is formed so as to cover the electrode 4, the rib 5, and the photospacer 7b (see Embodiment 1 and FIG. 2 (b)).
  • the light shielding layer 3 is formed on the support substrate (Sl). More specifically, the material used for the light shielding layer 3 (Sl).
  • BM resist is coated on the support substrate, and exposure, development, beta (baking), etc. are performed to form the light shielding layer 3.
  • the lowermost layer (first layer) L1 constituting the color filter layer CF1 and the photospacer 7b is formed (S2). More specifically, the color filter layer CF1 and the material to be the layer L1 (first color material) are applied so as to cover the support substrate la and the light-shielding layer 3, and are subjected to exposure, development, etching treatment, etc. The filter layer CF2 and the layer L1 are formed at predetermined positions.
  • the exposure process in this process is a batch exposure process in which exposure is performed on the entire area of the substrate surface, even if it is a divided exposure process in which the exposure is divided into areas on the substrate surface. There may be.
  • a layer L2 (second layer from the bottom, second layer) constituting the color filter layer CF2 and the photospacer 7b is formed (S3). More specifically, the color filter layer CF2 and the material to be the layer L2 (second color material) are applied so as to cover the support substrate la, the light shielding layer 3, the color filter layer CF1, and the layer L1, and are exposed and developed. Etc. to form the color filter layer CF2 and the layer L1 at predetermined positions. For the exposure process when forming these layers, the same method as that for the power filter layer CF1 and the layer L1 can be used.
  • division exposure processing is performed so as to form a region where the layer L3 exposed and patterned in different shots is mixed, and the color filter layer CF3 and the layer L3 are patterned (S5). .
  • an electrode 4 is formed so as to cover each layer formed on the support substrate (S7).
  • the uppermost layer L4 (fourth layer) constituting the rib 5 and the photospacer 7b is formed (S8). More specifically, a material (rib material) for forming rib 5 and layer L4 is applied so as to cover each layer formed on the support substrate, exposed to light, developed, and the like, so that rib 5 and layer L4 are formed in a predetermined manner. Form in position.
  • the shape of the layer L4 is not particularly limited, but here, as shown in FIG. 11 (a), the layer L4 is formed to have a conical shape covering the layers L2 and L3.
  • the counter substrate 1 having the three color filter layers CF1, CF2, and CF3, the light shielding layer 3, the electrode 4, the rib 5, and the photo spacer (PS) 7b is formed. Complete.
  • the alignment films 6 and 9 are printed on the counter substrate 1 and the array side substrate 2 formed in this way by a transfer method. Thereafter, the counter substrate 1 and the array side substrate 2 are bonded together via a photospacer 7b, and a liquid crystal material is injected between both substrates (vacuum injection) to form the display panel 10.
  • the ODF process where the liquid crystal material is dropped in a vacuum before bonding the two substrates together.
  • the display panel 10 may be formed by using it. Note that the alignment films 6 and 9 are not necessarily provided, and the alignment films 6 and 9 may be omitted.
  • the counter substrate 1 that is effective in the present embodiment is exposed with different shots when the third layer L3 from the bottom is formed in the formation process of the photospacer 7b that also has a lamination structure force.
  • the divided exposure processing is performed so as to form a region where the patterned layer L3 is mixed, and the photospacer 7b includes such a layer L3.
  • the photospacer 7b having the constituent force shown in FIG. 11 (a) the upper base area of the array side substrate 1 side (far from the substrate surface, on the side substrate surface) of each layer constituting the photospacer 7b.
  • Layer (minimum area layer) with the smallest surface area (substantially parallel surface) L3 is the upper base area (shape) of the array side substrate 1 side (top layer) of the photospacer 7b and the substrate surface of the photospacer 7b It is the layer that most affects the height in the normal direction and the amount of deformation (deformation amount determining layer). That is, when the shape of the layer L3 is different, the shape of the uppermost layer of the spacer including the layer L3 is affected.
  • the photo spacer is different due to the difference in the area of the photo spacer patterned in each shot at the boundary between the exposure regions of different shots. It is possible to prevent the amount of deformation in the normal direction of one substrate from changing sharply. Therefore, it is possible to prevent gap unevenness from occurring after the counter substrate 1 and the array side substrate 2 are bonded together.
  • the divided exposure processing for patterning the layer L3 is performed so as to form a region in which the photospacers 7b including the layer L3 exposed in different shots are mixed.
  • the photospacers 7b including the layer L3 exposed in different shots are mixed.
  • the other layers LI, L2, and L4 constituting the photospacer 7b similarly to the layer L3, a region where the photospacers 7b including the layers LI, L2, and L4 exposed in different shots are mixed is formed. You can also perform split exposure processing and pattern!
  • the layer L3 is patterned by a normal exposure process, and the other layers L1, L2, and L4 different from the layer L3 are exposed to different shots.
  • the photospacer 7b includes the layers LI, L2, and L4. It is possible to perform split exposure processing and patterning so as to form a mixed area! ⁇ . In other words, in the photospacer 7b, which also has a layered structural force, at least one layer force is different. Divided exposure processing may be performed so as to form a region in which layers exposed in the first layer are mixed. As a result, the obtained photospacer 7b has a region in which different shots are mixed, as in the first embodiment, and can reduce gap unevenness.
  • the division exposure process so as to form a region where a photo spacer including the layer exposed in different shots is mixed.
  • a photo spacer including the layer exposed in different shots For example, when the shape of the layer (top bottom area, etc.) is different, different shots are used as described above for the layer that affects the shape of the top layer (top bottom area, etc.) of the photospacer. It is preferable to perform the division exposure process so as to form a region where the deformation amount determining layer exposed in step 1 is mixed. Thereby, gap unevenness in the obtained photo spacer can be effectively reduced.
  • the shape of the cross section parallel to the top and bottom surfaces or the substrate surface of each layer constituting the photospacer 7b is not particularly limited.
  • it may be a substantially circular shape or a polygonal shape. Good.
  • the contribution to the deformation amount in the normal direction of the substrate surface of the photospacer is large. Therefore, as described above, it is preferable to perform the divided exposure process so as to form a region where the layers exposed in different shots are mixed.
  • a layer (minimum area determination layer) that affects the area of the layer having the smallest upper base area (minimum area layer) among the layers constituting the photospacer 7b is exposed with different shots. It is preferable that the divided exposure processing is performed so as to form a region where the photo spacer including the layer is mixed. In other words, when the upper base area of the layer is different, the layer exposed to the different shots is mixed for the layer (minimum area determination layer) that affects the upper base area of the minimum area layer. It is preferable to carry out a division exposure process so as to form a film.
  • a minimum area determining layer for example, the upper bottom area of the layer, the photospace, Among the layers constituting the sir 7b, there are layers whose differential force is within a predetermined value with respect to the top bottom area of the layer having the smallest top bottom area.
  • each layer when the shape of the upper bottom surface of each layer is circular, a layer having a diameter difference of 0 ⁇ m or more and 20 ⁇ m or less with respect to the layer having the smallest upper bottom area is shot with different shots. Divided exposure processing may be performed so as to form a region where the exposed layers are mixed.
  • the diameter differential force of the circumscribed circle of the upper bottom surface with respect to the layer with the smallest upper bottom area ⁇ m or more and 20 m or less May be divided and exposed so as to form a region where the layers exposed in different shots are mixed.
  • each layer is formed so that the upper base area force of the layers LI, L2, and L3 in the direction parallel to the substrate surface decreases in this order. It is not limited to configuration.
  • the layer L3 ′ may be formed so as to cover the layer L2 ′.
  • the layer L2 ′ is the layer having the smallest top base area (minimum area layer) among the layers constituting the photospacer. This contributes most to the upper base area of the photospacer 7b (the upper base area of the uppermost layer) and the deformation amount of the photospacer 7b in the direction perpendicular to the substrate surface. Therefore, in this case, it is preferable to perform the division exposure process so as to form a region where the layer L2 ′ exposed in different shots is mixed with the layer (deformation amount determining layer, minimum area layer) L2 ′. .
  • any layer may be omitted in the photospacer 7b shown in Figs. 11 (a) and 11 (b).
  • the layer L2 is omitted, and the photospacer 7b is replaced with the layer L 1 and the color filter layer CF3 made of the same material as the color filter layer CF1.
  • a laminated structure including a layer L3 made of the same material, a layer L4 made of the same material as the electrode 4 and the rib 5 may be used.
  • the layers to be omitted may be arbitrarily selected, and not limited to one layer, two or more layers may be omitted.
  • the specific configuration of the laminated photospacer 7b in the present embodiment is not particularly limited, and may be a four-layer structure of layers L1 to L4, or a two-layer structure or It can be a three-layer structure, or it can be a five-layer structure or more.
  • a configuration including a rivet 5b may be adopted instead of the rib 5, a configuration including a rivet 5b may be adopted.
  • FIGS. 15 (a) and 15 (b) are a cross-sectional view and a plan view showing a configuration example when the rib 5 is replaced with a rivet 5b in the configuration shown in FIGS. 11 (a) and 11 (b). is there.
  • FIGS. 15 (a) and 15 (b) are a cross-sectional view and a plan view showing a configuration example when the rib 5 is replaced with a rivet 5b in the configuration shown in FIGS. 11 (a) and 11 (b). is there.
  • FIGS. 16 (a) and 16 (b) are a cross-sectional view and a plan view showing a configuration example when the rib 5 is replaced with a rivet 5b in the configuration shown in FIGS. 13 (a) and 13 (b).
  • FIG. FIGS. 17 (a) and 17 (b) are cross-sectional views showing a configuration example in the case where the rib 5 is replaced with a rivet 5b in the configuration shown in FIGS. 14 (a) and 14 (b). It is a top view.
  • the rivet 5b having a circular cross section in the in-plane direction of the substrate is used in place of the ribs 5 in which the cross section in the in-plane direction of the substrate is formed in a straight line. Can be oriented.
  • the photospacer 7b is formed on the counter substrate 1 mainly described.
  • the present invention is not limited to this.
  • a photospacer 7b may be provided on the array side substrate 2.
  • a part of the photospacer 7b may be formed using the same material as any of the layers constituting the switching element 26.
  • the color filter layer may be provided not on the counter substrate 1 but on the array side substrate 2, and a part of the photospacer 7b may be formed using the same material as the color filter layer.
  • the color filter layer and the photospacer 7b may be disposed on the surface on the non-conductive film 115 and the electrode 8 side.
  • a color filter layer and a photospacer 7b may be disposed between the support substrate 2a and the non-conductive film 111 or between the non-conductive film 112 and the non-conductive film 115.
  • the height of the photospacer 7b is relaxed if a non-conductive film such as a resin is formed on the photospacer 7b (the distance between the substrates in the vicinity of the photospacer 7b is influenced by the photospacer 7b). Therefore, it is preferable that the photospacer 7b is disposed closer to the counter substrate 1 than the non-conductive film 111. In order to stabilize the height of the photospacer 7b, it is preferable to form the photospacer 7b after the electrode 8 is formed.
  • the non-conductive film 115 is omitted, and a color is formed between the non-conductive film 11 2 (in FIG. 8, the non-conductive film 112 and the light shielding layer 8b) and the electrode 8.
  • a filter layer may be formed.
  • Sarakuko forms the photospacer 7b on the array-side substrate 2 thus formed
  • the electrode 8 is It may be formed in the same layer as the color filter layer (on the non-conductive film 112 or on the light shielding layer 3b) in a region that is not formed and overlaps with the light shielding layer 3 or the light shielding layer 3a.
  • the light shielding layer 3b may be provided on the array side substrate 2. Further, when the light shielding layer 3b is provided on the array side substrate 2, it is preferable to form the photospacer 7b in a region overlapping with the light shielding layer 3b when viewed from the normal direction of the substrate surface.
  • the configuration may be such that the orientation regulating member such as the rib 5 and the rivet 5b is not provided.
  • the photospacer 7b may be provided on the counter substrate 1 side or on the array side substrate 2 side.
  • CF color filter
  • the photospacer 7b including a layer that is divided and exposed in different shots is mixed.
  • the width of the region is preferably 10 mm or more.
  • the upper limit of the width of the mixed region is not particularly limited, but is preferably within 200 mm in order to improve productivity.
  • the photospacer 7b of the present embodiment can be said to have a substantially conical shape, a trapezoidal shape lacking the top of the cone, or a shape in which the cross section perpendicular to the substrate surface is a polygon. Force Of course, it is not limited to this shape. From the viewpoint of ease of formation and durability as a spacer, the photospacer 7b (or the photospacer 7 in the first embodiment) has a circular cross section parallel to the substrate surface, that is, a conical shape. A circular trapezoidal shape (a shape lacking the upper part of a cone) or a cylindrical shape is preferable.
  • the present invention it is necessary to keep a distance from another substrate provided opposite to a predetermined distance. Applicable to all substrates. For example, it can be applied to substrates used in display panels such as liquid crystal panels, EL panels, and plasma display panels. Further, the present invention is particularly suitable for a large-sized substrate in which the exposure processing for patterning the photo spacer needs to be divided exposure processing.

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Abstract

Selon l’invention une entretoise photographique est formée sur un substrat en réalisant un traitement d’exposition divisée dans la direction parallèle à la surface du substrat. Une partie d’une région d'exposition de première prise et une partie d’une région d'exposition de seconde prise se chevauchent. Dans la région de chevauchement, une entretoise photographique (7S1) mise en motifs par un traitement d'exposition de première prise et une entretoise photographique (7S2) mise en motifs par un traitement d'exposition de seconde prise vont coexister et se combiner. Dans un substrat pourvu des entretoises photographiques, on peut réduire l’irrégularité de l’espace entre les cellules à la jonction des prises respectives.
PCT/JP2006/304291 2005-03-16 2006-03-06 Substrat, panneau d’affichage, affichage, et procédé de fabrication d’un tel substrat Ceased WO2006098182A1 (fr)

Applications Claiming Priority (2)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9664681B2 (en) 2006-08-04 2017-05-30 Ajinomoto Co., Inc. Lung cancer evaluating apparatus, method, system, and program and recording medium therefor

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000111925A (ja) * 1998-10-08 2000-04-21 Denso Corp 液晶セル及びその製造方法
JP2000221512A (ja) * 1999-02-02 2000-08-11 Toshiba Corp 液晶表示装置及びその製造方法
JP2001209053A (ja) * 2000-01-24 2001-08-03 Hitachi Ltd 液晶表示装置
JP2001242467A (ja) * 2000-02-29 2001-09-07 Sanyo Electric Co Ltd 液晶表示装置及びその製造方法
JP2002214624A (ja) * 2001-01-23 2002-07-31 Sharp Corp 液晶表示装置
JP2003057660A (ja) * 2001-06-05 2003-02-26 Sharp Corp 液晶表示素子及びそれを用いた液晶表示装置
JP2006003456A (ja) * 2004-06-15 2006-01-05 Nec Lcd Technologies Ltd 液晶表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000111925A (ja) * 1998-10-08 2000-04-21 Denso Corp 液晶セル及びその製造方法
JP2000221512A (ja) * 1999-02-02 2000-08-11 Toshiba Corp 液晶表示装置及びその製造方法
JP2001209053A (ja) * 2000-01-24 2001-08-03 Hitachi Ltd 液晶表示装置
JP2001242467A (ja) * 2000-02-29 2001-09-07 Sanyo Electric Co Ltd 液晶表示装置及びその製造方法
JP2002214624A (ja) * 2001-01-23 2002-07-31 Sharp Corp 液晶表示装置
JP2003057660A (ja) * 2001-06-05 2003-02-26 Sharp Corp 液晶表示素子及びそれを用いた液晶表示装置
JP2006003456A (ja) * 2004-06-15 2006-01-05 Nec Lcd Technologies Ltd 液晶表示装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9664681B2 (en) 2006-08-04 2017-05-30 Ajinomoto Co., Inc. Lung cancer evaluating apparatus, method, system, and program and recording medium therefor

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