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WO2006093264A1 - Dispositif et procede de chauffage par laser - Google Patents

Dispositif et procede de chauffage par laser Download PDF

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Publication number
WO2006093264A1
WO2006093264A1 PCT/JP2006/304074 JP2006304074W WO2006093264A1 WO 2006093264 A1 WO2006093264 A1 WO 2006093264A1 JP 2006304074 W JP2006304074 W JP 2006304074W WO 2006093264 A1 WO2006093264 A1 WO 2006093264A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
light
infrared sensor
heating apparatus
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/304074
Other languages
English (en)
Japanese (ja)
Inventor
Tutomu Sakurai
Koji Funami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to CN2006800028693A priority Critical patent/CN101107501B/zh
Priority to JP2007506018A priority patent/JP5042013B2/ja
Publication of WO2006093264A1 publication Critical patent/WO2006093264A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0037—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the heat emitted by liquids
    • G01J5/004—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the heat emitted by liquids by molten metals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/025—Interfacing a pyrometer to an external device or network; User interface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/07—Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G01J5/0802—Optical filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/084—Adjustable or slidable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0859—Sighting arrangements, e.g. cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
    • G01J5/602—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature using selective, monochromatic or bandpass filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0014—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation from gases, flames
    • G01J5/0018—Flames, plasma or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Definitions

  • Patent application title Laser heating apparatus and laser heating method
  • the present invention relates to a laser heating apparatus and a laser heating method for performing heating and processing such as soldering, resin bonding, and welding with a laser beam emitted from, for example, a semiconductor laser.
  • a laser heating apparatus that performs non-contact heating and processing by laser light
  • a laser diode module semiconductor laser array
  • a lens composed of a collimating lens for collimating the emitted laser light (parallel light) and a condenser lens for condensing the collimated laser light (for example, , JP2002-9388A).
  • the conventional laser heating apparatus can perform heating / processing on the object to be heated placed at the focal position of the condenser lens.
  • the present invention detects abnormal heat generation that is a sign of the occurrence of temperature changes or burns at the time of melting of solder or resin at a processing point, and soldering that does not cause burns in the peripheral part.
  • Another object of the present invention is to provide a laser heating apparatus and a laser heating method that enable resin bonding that does not cause resin to be damaged.
  • the present invention provides an infrared sensor that generates a signal based on an integrated value of infrared spectral radiance emitted from an object to be heated such as solder or resin.
  • an object to be heated such as solder or resin.
  • the output signal of the infrared sensor and the The relational expression of the calibration value with the measured temperature of the heated object of the star is obtained in advance.
  • the temperature of the object to be heated is calculated based on the output signal of the infrared sensor and the relational expression.
  • the laser heating device outputs a signal based on an integrated value of a laser emitting portion that emits laser light to irradiate an object to be heated and spectral radiance of infrared rays received by the light receiving surface.
  • the laser heating device according to claim 2 is the laser heating device according to claim 1, wherein the laser emitting unit emits a laser beam having a wavelength of 1.6 ⁇ or less. Let's say.
  • the laser heating device according to claim 3 is the laser heating device according to claim 1, wherein the infrared sensor has a peak sensitivity at a wavelength of 1.2 xm or more. To do.
  • the laser heating apparatus is the laser heating apparatus according to claim 1, wherein the optical system receives infrared light having a wavelength longer than the wavelength of the laser light. It is characterized by leading to the surface.
  • the laser heating apparatus according to claim 5 is the laser heating apparatus according to claim 2, wherein the optical system transmits only infrared rays in a specific wavelength range.
  • the laser heating apparatus is the laser heating apparatus according to claim 1, further comprising an imaging device that images visible light from the object to be heated and its peripheral portion. It is characterized by.
  • the laser heating device according to claim 7 is the laser heating device according to claim 1, characterized in that an aperture for specifying a region for temperature measurement is provided.
  • the laser heating device according to claim 8 is the laser heating device according to claim 1, wherein the infrared sensor has a relative sensitivity of 10% or more for a wavelength of 1.2 ⁇ or more. Yes, and characterized by generating a Motodzure was signals totalized value of infrared 10- 5 W / (cm 2 ' sr' / m) or more spectral radiance received by the light receiving surface.
  • the laser heating device according to claim 9 is the laser heating device according to claim 1, wherein the infrared sensor is an InGaAs PIN photodiode.
  • the laser heating device according to claim 10 is the laser heating device according to claim 1, characterized in that the laser irradiation range at the processing point is spot-like.
  • the laser heating device according to claim 11 is the laser heating device according to claim 1, further comprising an optical system for making the laser irradiation range on the processed surface rectangular or elliptical. It is characterized by.
  • the laser heating device is the laser heating device according to claim 1, wherein the laser beam emitted from the laser emitting unit is reflected and is reflected on a processing surface. It is characterized by further comprising at least one scan mirror for performing a line scan irradiation or a two-dimensional scan irradiation to make the laser irradiation range on the processing surface rectangular or elliptical.
  • the laser heating apparatus is the laser heating apparatus according to claim 1, wherein the laser emitting section includes two or more laser diodes that emit the laser light, An optical system is further provided for suppressing the spread of each laser beam emitted from the laser diode in the FAST direction and making the laser irradiation range on the processing surface rectangular or elliptical with each laser beam suppressing the spread. It is characterized by that.
  • the laser heating apparatus is the laser heating apparatus according to claim 1, wherein the laser emitting unit includes two or more laser diodes that emit the laser light, and the lasers.
  • the laser irradiation range on the processing surface is made rectangular or elliptical by each laser beam from the lens.
  • the laser heating apparatus is the laser heating apparatus according to claim 1, wherein when the amount of change in the output signal level of the infrared sensor reaches a set amount of change, the laser emission is performed.
  • a control unit that stops the emission of the laser beam by the unit or intermittently emits the laser beam with a predetermined laser pattern.
  • the laser heating method according to claim 16 is a laser heating method in which a heating target object is irradiated with a laser beam to heat the heating target object, and the laser beam is applied to the heating target object. While irradiating, it is radiated or reflected from the object to be heated and its surroundings to the light receiving surface of the infrared sensor that generates a signal based on the integrated value of the infrared spectral radiance received by the light receiving surface. Infrared light other than the light having the wavelength of the laser light is guided, the signal generated by the infrared sensor, the actually measured temperature of the object to be heated and the signal generated by the infrared sensor are obtained in advance. The temperature of the object to be heated is calculated based on a relational expression of the calibration value with the level.
  • the laser heating method according to claim 17 is the laser heating method according to claim 16, wherein the laser beam is irradiated on the processing surface by line scan irradiation or two-dimensional scan irradiation, and the laser irradiation range on the processing surface is measured. It is characterized by having a rectangular or elliptical shape.
  • the laser heating method according to claim 18 is the laser heating method according to claim 16, wherein when the change amount of the output signal level of the infrared sensor reaches a set change amount, the laser beam is emitted. Or the laser light is intermittently emitted with a predetermined laser power.
  • the temperature change at the processing point, the rapid temperature change before and after the melting change of the solder or resin, and the rapid temperature change before and after the occurrence of kogation in the periphery of the solder or the resin are detected. It is possible to detect that a desired processing such as soldering or resin bonding has been performed, detect the occurrence of kogation, prevent the occurrence of kogation, and the like. Furthermore, the processing state can be observed with an imaging device. In addition, the aperture detects a minute specific position around the object to be heated and a minute specific position on the object to be heated to detect temperature changes at that specific position and prevent the occurrence of kogation. And so on.
  • FIG. 1 is a diagram showing a configuration of a laser heating apparatus according to Embodiment 1 of the present invention.
  • FIG. 2 is a diagram showing a spectral sensitivity characteristic of the InGaAsPIN photodiode according to the first embodiment of the present invention.
  • FIG. 3 is a diagram showing infrared absorption characteristics of optical component materials.
  • FIG. 4 is a diagram showing the spectral radiance characteristics of infrared rays emitted from a black body.
  • FIG. 5 is a diagram showing practical radiance detected by the InGaAsPIN photodiode according to the first embodiment of the present invention (when the processing point temperature is 227 ° C.).
  • FIG. 6 is a diagram showing practical radiance detected by the InGaAsPIN photodiode according to the first embodiment of the present invention (when the processing point temperature is 127 ° C.).
  • FIG. 7 is a diagram showing practical radiance detected by the InGaAsPIN photodiode according to the first embodiment of the present invention (when the processing point temperature is 327 ° C.).
  • FIG. 8 is a diagram showing a configuration of a laser heating apparatus according to Embodiment 2 of the present invention.
  • FIG. 9 is a diagram showing a configuration of a laser heating apparatus according to Embodiment 3 of the present invention.
  • FIG. 10 is a diagram showing a configuration of a laser heating apparatus according to Embodiment 4 of the present invention.
  • FIG. 11 is a diagram showing a configuration of a laser heating apparatus in a fifth embodiment of the present invention.
  • FIG. 12 is a diagram showing a configuration of a laser heating apparatus according to Embodiment 6 of the present invention.
  • FIG. 13 is a diagram showing a configuration of a laser heating device according to a seventh embodiment of the present invention.
  • FIG. 14 is a diagram showing a configuration of a laser heating apparatus in an eighth embodiment of the present invention.
  • FIG. 15 is a diagram showing a configuration of a laser heating apparatus according to Embodiment 9 of the present invention.
  • FIG. 16 is a diagram for explaining the shape (laser irradiation range) of laser light formed on the processing surface by the laser heating device according to Embodiment 9 of the present invention.
  • FIG. 17 shows an example of a laser emission unit provided in the laser heating apparatus according to Embodiment 10 of the present invention. It is a block diagram which shows a specific example.
  • FIG. 18 is a diagram for explaining laser power control of the laser heating apparatus according to Embodiment 11 of the present invention.
  • FIG. 19 is a diagram for explaining laser power control of the laser heating apparatus according to Embodiment 11 of the present invention.
  • an infrared sensor that generates a signal based on the integrated value of the infrared spectral radiance received by the light receiving surface. Then, before performing laser heating and processing, a relational expression of the calibration value between the output signal of the infrared sensor and the measured temperature of the object to be heated of the master is obtained in advance. Then, at the time of actual laser heating 'processing, infrared rays other than the light having the wavelength of the laser light out of the light emitted or reflected from the object to be heated and its peripheral part are used as the infrared sensor. The temperature of the object to be heated is calculated based on the signal generated by the infrared sensor and the relational expression obtained in advance.
  • FIG. 1 shows the configuration of the laser heating apparatus according to the first embodiment.
  • Laser heating device
  • the object to be heated is irradiated with laser light to heat the object to be heated.
  • a laser emitting unit 1 emits laser light having a constant wavelength.
  • the laser emitting unit includes, for example, a semiconductor laser or a semiconductor excitation laser.
  • a laser diode that oscillates laser light having a wavelength of 920 nm is provided as an example.
  • the wavelength of laser light is not limited to 920 nm. In general, the wavelength of laser light from a laser diode is 1.6 x m or less.
  • the condensing lens 2 condenses the laser light from the laser emitting unit 1 and heats the solder 3 that is an object to be heated placed at the condensing position.
  • Solder 3 is applied on land 5 of printed circuit board 4.
  • solder will be described as an example.
  • the solder 3 When the solder 3 is heated by laser irradiation, the solder 3 and its peripheral lands 5 and the printed circuit board are printed. Infrared radiation is emitted from the plate 4. Also, the irradiated laser light and visible light are reflected from the solder 3 and its peripheral part.
  • the laser light cut filter 6 receives light radiated or reflected from the solder 3 or the like and cuts light having a wavelength of laser light (920 nm). Visible light cut The FINOLETA 7 receives the light transmitted through the laser light cut filter 6 and cuts visible light.
  • the incident light S is incident on the condenser lens 8 with infrared rays other than the light (infrared rays) having the wavelength of the laser light out of the infrared rays emitted from the solder 3 or the like.
  • the condensing lens 8 condenses the light transmitted through the visible light cut filter 7 and makes the infrared light other than the light having the wavelength of the laser light enter the light receiving surface 10 of the infrared sensor 9 placed at the condensing position. To do. As described above, in the laser heating apparatus according to the first embodiment, light emitted or reflected from the solder 3 or its peripheral part is received, and infrared light other than the light having the wavelength of the laser light (920 nm) is received.
  • An optical system that leads to the light is composed of a laser light cut filter 6, a visible light cut filter 7, and a condenser lens 8.
  • the arrangement order of the condenser lens 8, the laser light cut filter 6, and the visible light cut filter 7 is arbitrary. Further, for example, a filter that transmits light having a wavelength longer than the wavelength of the laser light may be used instead of the laser light cut filter.
  • the infrared sensor 9 generates a signal based on the integrated value of the infrared spectral radiance received by the light receiving surface 10.
  • an infrared sensor an InGaAsPIN photodiode having a predetermined sensitivity range in which the sensitivity reaches a peak at a wavelength of 2.3 / im will be described as an example.
  • the laser heating apparatus includes a storage unit that stores in advance a relational expression of a calibration value (calibration value) between the level of the signal generated by the infrared sensor 9 and the measured temperature of the solder 3;
  • a microcomputer is provided as a temperature measuring unit for calculating the temperature of the solder 3 based on the signal generated by the infrared sensor 9 and the relational expression.
  • FIG. 2 shows the spectral sensitivity characteristics of an InGaAs PIN PIN photodiode with a predetermined sensitivity range where the sensitivity peaks at a wavelength of 2.3 zm.
  • this InGaAs' PIN photodiode has a relative sensitivity of 10% or more for wavelengths of 1.2 x m-2.
  • Fig. 3 shows the transmittance (infrared ray) of B K7 (borosilicate crown optical glass), which is an optical component material used for a condensing lens, a half mirror described later, synthetic quartz, and anhydrous synthetic quartz. Absorption characteristics).
  • B K7 borosilicate crown optical glass
  • the solid line shows the transmittance of BK7
  • the alternate long and short dash line shows the transmittance of synthetic quartz
  • the broken line shows the transmittance of anhydrous synthetic quartz.
  • Fig. 4 is a so-called Planck radiation law, and shows the spectral radiance characteristics of infrared rays emitted from a black body.
  • 0 ° C (273K) near the lower limit of measurement temperature
  • 227 ° C (50 OK) near the melting point of lead-free solder
  • the graph shows the power from radiance 10_ 8 W / (cm2 'sr' m) to the top.In practical use, it should be 10_ 5 W / (cm2 'sr- xm) or more to avoid the effects of noise. Treat as a practical area.
  • FIGS. 5 to 7 show that the infrared sensor (InGaAs' PIN photodiode) 9 detects when the processing point (object to be heated) is 227 ° C, 127 ° C, and 327 ° C. Indicates radiance.
  • the broken line indicates a graph of the infrared spectral radiance emitted from the processing point
  • the alternate long and short dash line indicates the infrared spectral radiance after passing through BK7, which is an optical component material such as a condenser lens.
  • the solid line shows a graph of the practical infrared radiance detected by the infrared sensor 9.
  • the infrared sensor 9 is actually shown in FIGS. 5 to 7 in which the spectral sensitivity characteristic shown in FIG. 2 is multiplied by the infrared ray absorption characteristic shown in FIG. 3 and the spectral radiance characteristic shown in FIG. Detect solid lines.
  • the infrared sensor 9, the solid line and 10 _5 W / (cm2 'sr ' / m) of 10_ 5 / the area range (IR received by the light receiving surface 10 which is surrounded by line ( ⁇ 112 '31:' / 1 111) Generate a signal level signal based on the above (integrated value of spectral radiance).
  • the output signal level of the infrared sensor 9 is slight at 127 ° C, but increases to 5 times or more at 227 ° C, and more than 10 times at 327 ° C. Monotonically increasing.
  • an optical bandpass filter (hereinafter referred to as BPF) that can transmit only light in a specific wavelength range longer than the wavelength of the laser light may be used.
  • BPF optical bandpass filter
  • a BPF is placed on the light receiving surface 10 of the infrared sensor 9.
  • an infrared sensor that has practical sensitivity to light in a specific wavelength range transmitted by the BPF is used as an infrared sensor that receives the transmitted light of the BPF.
  • This configuration makes it possible to detect that the processing point (object to be heated) has reached a specific temperature.
  • the output signal level of the infrared sensor 9 rapidly increases when the processing point reaches a specific temperature, so BPF is effective in detecting the specific temperature.
  • a BPF that transmits only narrow-band infrared light having a wavelength of 1064 nm and a half-value width of 10 ⁇ m has a processing point of about 200 degrees (temperature near the melting point of solder). It is useful for detection, and by keeping this temperature, it is possible to realize soldering that reliably melts and the peripheral portion is not damaged.
  • an infrared sensor in order to measure the temperature of an object to be heated at 400 K or higher, has a sensitivity power S at a wavelength of 1.2 / im or higher. It is desirable to have a predetermined sensitivity range that peaks.
  • the output signal level of the infrared sensor that rapidly increases when the processing point (object to be heated) reaches a temperature of 100 degrees or higher is captured, and laser irradiation is performed. It is possible to measure the temperature of the heated object that rises rapidly at 400K or higher almost accurately.
  • the temperature change at the processing point (object to be heated), the rapid temperature change before and after the melting change of the solder or resin, the rapid temperature before and after the formation of kogation around the solder or the resin By detecting the change and detecting that the desired processing such as soldering or resin bonding has been completed, the occurrence of kogation can be detected and the occurrence of kogation can be prevented.
  • FIG. 8 shows the configuration of the laser heating apparatus according to the second embodiment. However, the same members as those described with reference to FIG. 8 are identical.
  • an optical fiber 11 emits laser light from the laser emitting unit 1 into the air.
  • the collimating lens 12 collimates the laser light from the optical fiber 11 (hereinafter referred to as collimated light).
  • the half mirror 13 is provided with a thin film filter that reflects collimated light and transmits light emitted or reflected from the solder 3 and the land 5 or printed circuit board 4 in the periphery thereof.
  • a half mirror with a thin film coating that reflects only 920 nm (light with the wavelength of the laser beam) may be used.
  • a folded BPF capable of transmitting only infrared rays having a longer wavelength than the laser beam and having a specific wavelength range may be arranged.
  • the second embodiment light that is emitted or reflected from the solder 3 or its peripheral part is received, and infrared light other than light having a wavelength of laser light (920 nm) is guided to the light receiving surface 10 of the infrared sensor 9.
  • the academic system consists of a half mirror 13, a laser light cut filter 6, a visible light cut filter 7, and a condensing lens 8. The arrangement order of the condenser lens 8, the laser light cut filter 6 and the visible light cut filter 7 is arbitrary.
  • the preamplifier 14 amplifies the output signal from the infrared sensor 9.
  • the laser heating device includes a storage unit that stores in advance a relational expression of a calibration value between the output signal level of the preamplifier 14 and the actually measured temperature of the solder 3.
  • the meter 15 includes a microcomputer that calculates the temperature of the solder 3 based on the output signal of the preamplifier 14 and the relational expression as a temperature measurement unit. Meter 15 displays the measured temperature calculated by the micro computer.
  • the laser heating apparatus is configured to output a detection signal from the meter 15 to the laser emitting unit 1.
  • a detection signal for example, when a rapid temperature change before and after the melting change of the solder 3 is detected, the laser power is reduced, or a rapid temperature change before and after the kogation occurs around the solder 3. It is possible to stop the laser oscillation when a laser beam is detected, and it is possible to complete automatic soldering and prevent the occurrence of kogation.
  • a BPF that can transmit only infrared rays in a specific wavelength range longer than the laser beam may be disposed on the light receiving surface 10 of the infrared sensor 9.
  • the case where the laser beam is collimated has been described. However, even if the F value of the collimator lens is adjusted to make it non-collimated, the optical fiber The same effect can be obtained by shortening the distance between the light exit and the half mirror.
  • FIG. 9 shows the configuration of the laser heating apparatus according to the third embodiment.
  • the same members as those described with reference to FIGS. 1 and 8 are denoted by the same reference numerals, and description thereof is omitted.
  • the hot mirror 16 receives the transmitted light of the half mirror 13 through the condenser lens 8, reflects the infrared light, guides it to the light receiving surface 10 of the infrared sensor 9, and transmits visible light.
  • the light is guided to the second laser light cut filter 17.
  • a camera (imaging device) 18 that receives visible light through the laser light cut filter 17 images the solder 3 and its peripheral part.
  • an optical system that guides visible light to the camera 18 includes a half mirror 13, a condenser lens 8, two laser light cut filters 6, 17, and a hot mirror 16.
  • a filter or a BPF that transmits light having a wavelength longer than the wavelength of the laser light may be used in place of the laser light cut filter 6.
  • the BPF is disposed on the light receiving surface 10 of the infrared sensor 9.
  • an aperture 19 for specifying a position for temperature measurement is attached in the vicinity of the optical path axis 20 to the light receiving surface 10 of the infrared ray sensor 9. Therefore, by changing the size, shape, and arrangement position of the adapter 19 and changing the processing point detection visual field 21, temperature abnormalities around the solder 3 can be detected, or the temperature of a specific part of the laser irradiation range can be detected. It is possible to measure the degree.
  • the infrared sensor 9 and the camera 18 by providing the infrared sensor 9 and the camera 18, it is possible to observe the change in the appearance of the processing point simultaneously with the temperature change of the processing point during laser irradiation.
  • the field of view of the machining point can be changed by changing the position and size of the aperture 19, it is necessary to detect the occurrence of kogation in the periphery, the detection of minute temperature fluctuations at specific locations, and the prevention of kogation. Can do.
  • a cold mirror may be used in place of the hot mirror by reversing the arrangement positions of the infrared sensor 9 and the camera 18. Further, the arrangement position of the infrared sensor 9 and the camera 18 may be reversed, and a folded BPF that can transmit only infrared rays having a specific wavelength range longer than the laser beam may be arranged instead of the hot mirror.
  • a BPF is placed instead of a hot mirror, Visible light after being reflected by the BPF and transmitted through the laser light cut filter 17 enters the camera 18. Therefore, the camera 18 can image the processing point. According to the third embodiment, it is possible to realize soldering that is surely melted and has a strong force and a peripheral portion while monitoring with a camera.
  • Infrared sensors that use InGaAs PIN photodiodes can be infrared sensors that have peak sensitivity at wavelengths of 1.2 zm or more, such as compound semiconductors.
  • the force crown described using BK7 that absorbs infrared rays with a wavelength of 1.7 xm or more without an AR coating is used as an optical component such as each condenser lens and mirror. Even glass or achromatic lenses.
  • anhydrous synthetic quartz is suitable because it can improve the SZN ratio without causing a decrease in transmittance even at around 2.7 ⁇ m, which is the sensitivity limit of InGaAs PIN photodiodes.
  • AR coating may be applied to the wavelength of the sensitivity range of the infrared sensor.
  • the shape of the laser beam (laser irradiation range) formed at the processing point is limited to a spot shape (perfect circle shape). Therefore, in the laser heating apparatus in each of the above embodiments:! To 3, the land and the resin substrate are lined up together such as FPIC (field programmable interconnector component) and FPC (flexible nore print tif spring plate). The response to the surface is not enough.
  • FPIC field programmable interconnector component
  • FPC flexible nore print tif spring plate
  • the shape of the laser beam formed on the processed surface is made rectangular or elliptical (hereinafter referred to as a rectangular shape or the like). Respond sufficiently to soldering to the processed surface on which resin substrates are arranged.
  • a wide range including the rectangular laser irradiation range and its periphery is set as a detection range (temperature observation range) of the infrared sensor.
  • Infrared radiant energy increases in proportion to the fourth power of the temperature according to Stefan's Bolman's law, so by increasing the temperature observation area of the infrared sensor, the temperature rises when abnormal heat generation occurs in that temperature observation area The infrared sensor will be able to detect it quickly, and control such as reducing the laser power can be performed quickly.
  • FIG. 10 (a) shows the configuration of the laser heating apparatus according to the fourth embodiment.
  • the same members as those described with reference to FIGS. 1, 8, and 9 are denoted by the same reference numerals, and description thereof is omitted.
  • the laser heating apparatus is a condensing lens between the half mirror 13 and the processing surface as an optical system for making the shape of the laser light formed on the processing surface a rectangular shape or the like.
  • a cylindrical lens is disposed instead of the third embodiment.
  • a cylindrical lens 22 receives the laser light reflected by the half mirror 13 that is a folding mirror, and forms a rectangular or other laser light on the processed surface.
  • the solder applied to each land of FPIC23 is explained as an example of the object to be heated.
  • FIG. 10 (b) is a side view of the laser heating device viewed from the y direction, and shows a collimating lens.
  • FIG. 10 (c) is a top view showing the shape of the laser beam formed on the processed surface.
  • the cylindrical lens 22 has a rectangular or elliptical shape (laser irradiation range 24) on the surface of the received spot-like (true round) laser beam. Make it.
  • the size of the laser irradiation range 24 in the X direction can be adjusted by changing the distance to the processing surface of the cylindrical lens 22.
  • the temperature observation region 25 is wider than the laser irradiation range 24.
  • the divergence angle of the laser light can be adjusted by adjusting the distance from the collimating lens 12 to the optical fiber 11.
  • the spread angle of the laser beam can be adjusted by adjusting the distance of the cylindrical lens to the optical fiber 11.
  • the folding mirror 26 is provided with a thin film coat or thin film filter that transmits visible light and reflects infrared rays in the vicinity of 2 ⁇ m.
  • the folding mirror 26 receives the transmitted light of the half mirror 13 through the collecting lens 8 (a convex lens having a spherical aberration corrected such as an achromatic lens) and reflects the infrared light in the vicinity of 2 xm to receive the light receiving surface of the infrared sensor 9.
  • the visible light is guided to the camera (for example, the CCD surface of the CCD camera) 18.
  • the camera 18 that receives visible light through the second laser light cut filter 17 expands the processed surface without distortion. Big observation is possible.
  • the preamplifier (amplifier circuit) 14 is a high gain amplifier, and amplifies the output signal level of the infrared sensor 9 several hundred times or more.
  • an optical system that guides the visible light to the surface 10 and also guides the visible light to the camera 18 includes a half mirror 13, a condenser lens 8, a folding mirror 26, and two laser light cut filters 6 and 17.
  • the laser control device 27 for controlling the laser power so that the temperature of the object to be heated becomes a preset temperature Ts
  • the laser emitting unit 1 the object to be heated
  • Temperature level conversion circuit (temperature measurement unit) 28 that calculates the temperature
  • volume 29 for setting the set temperature Ts the control unit 30 that controls the current supplied to the laser diode (LD element) included in the laser emission unit 1 With.
  • the laser control device 27 is not shown in the figure, and the output signal level of the preamplifier 14 and the measured temperature of the solder applied to each land of the FPIC 23 (for example, the average value of the measured temperature of the solder applied to each land or a specific land)
  • a storage unit for storing in advance a relational expression of the calibration value (calibration value) with the actual temperature of the solder applied to the solder.
  • the temperature level conversion circuit 28 calculates the temperature of the object to be heated based on the output signal of the preamplifier 14 and the relational expression, and generates a signal indicating the temperature.
  • the preset temperature Ts is set in advance in the volume 29, and the control unit 30 outputs the output signal of the temperature level conversion circuit 28 (corresponding to the temperature of the object to be heated) and the signal generated by the volume 29 ( Current corresponding to the set temperature Ts) is controlled so that the temperature of the object to be heated becomes the set temperature Ts.
  • the cylindrical lens can make the shape of the laser beam formed on the processed surface rectangular or the like, and the land and resin like FPIC or FPC. It can sufficiently handle soldering on the processed surface where the boards are lined up and resin bonding in rectangular or elliptical areas.
  • the shape of the laser beam formed on the processed surface can be arbitrarily enlarged / reduced by moving the focal position and the fixed position of the collimating lens 12 and the cylindrical lens 22 back and forth.
  • the aspect ratio of the shape can be arbitrarily changed.
  • a cylindrical lens may be disposed in place of the collimating lens 12, and a convex lens having a spherical aberration corrected such as an achromatic lens may be disposed in place of the cylindrical lens 22. That is, after changing the aspect ratio of the laser light with a cylindrical lens, the laser light with the changed aspect ratio is condensed with a convex lens so that the shape of the laser light formed on the processed surface is rectangular or the like. Also good. In this case as well, the shape of the laser beam formed on the processing surface can be arbitrarily enlarged / reduced by moving the focal position and fixed position of the cylindrical lens and convex lens back and forth, and the aspect of the shape of the laser beam can be reduced. The ratio can be changed arbitrarily.
  • FIG. 11 shows the configuration of the laser heating apparatus according to the fifth embodiment.
  • the same members as those described with reference to FIGS. 1, 8, 9, and 10 are denoted by the same reference numerals, and description thereof is omitted.
  • the laser heating apparatus returns the infrared ray radiated or reflected from the temperature observation region 25 to the optical fiber, and removes the light having the wavelength of the laser beam emitted from the temperature observation region 25 (infrared ray).
  • infrared rays are detected by an infrared sensor built in laser emitting section 1.
  • the optical fiber 11 has a core portion 31 and a cladding portion 32. Laser light is emitted from the core portion 31 of the optical fiber 11.
  • the folding mirror 33 is provided with a thin film coat or a thin film filter that reflects infrared rays and transmits visible light.
  • the folding mirror 33 receives the light emitted or reflected from the temperature observation region 25 via the cylindrical lens 22, reflects the infrared light and guides it to the collimating lens 12 and transmits the visible light to collect the light. Lead to.
  • the collimating lens 12 guides the infrared light reflected by the folding mirror 33 to the clad portion 32 of the optical fiber 11.
  • the laser emitting unit 1 includes an LD element 34, a condenser lens 35, a folding mirror 36, an infrared sensor 9, and a preamplifier 14.
  • the folding mirror 36 is provided with a thin film filter or a thin film coat that transmits infrared light but reflects light having a wavelength of laser light.
  • the folding mirror 36 reflects the laser light emitted from the LD element 34 and guides it to the condenser lens 35.
  • the condenser lens 35 guides the laser beam having the force of the folding mirror 36 to the core portion 31. In this way, the laser light emitted from the LD element 34 is coupled to the optical fiber 11.
  • the folding mirror 36 separates the infrared light having the wavelength of the laser light from the infrared light returned through the cladding portion 32 and guides the infrared light except the infrared light having the wavelength of the laser light to the light receiving surface 10 of the infrared sensor 9. .
  • an optical system that receives light emitted or reflected from the temperature observation region 25 and guides infrared light other than light having the wavelength of the laser light to the light receiving surface 10 of the infrared sensor 9 is 2 It consists of two folding mirrors 33 and 36 and a condenser lens 35.
  • a laser light cut filter may be installed between the folding mirror 36 and the light receiving surface 10 of the infrared sensor 9.
  • a cylindrical lens may be arranged instead of the collimating lens 12 and a convex lens may be arranged instead of the cylindrical lens 22.
  • FIG. 12 shows the configuration of the laser heating apparatus according to the sixth embodiment.
  • the same members as those described based on FIGS. 1 and 8 to 11 are denoted by the same reference numerals, and description thereof is omitted.
  • the laser heating apparatus in the sixth embodiment is different from the above-described fifth embodiment in that the shape of the laser light formed on the processed surface is made a rectangular shape by a scan mirror.
  • the processing surface is irradiated with laser light by line scanning or two-dimensional scanning to make the laser irradiation range on the processing surface rectangular or elliptical.
  • the scan mirror 37 is provided with a thin film coat or thin film filter that reflects infrared light and transmits visible light. Further, the scan mirror 37 can swing around the rotation shaft 38.
  • the scan mirror 37 reflects the laser light from the collimating lens 12 while reciprocating by a predetermined angle about the rotation shaft 38.
  • the laser beam reflected by the reciprocally oscillating scan mirror 37 is condensed by a condensing lens (a convex lens with a spherical aberration corrected such as an achromatic lens) 2 and the processed surface is irradiated with a line scan laser beam. Or 2D scan irradiation.
  • This line scan is a laser, and the area to be scanned in two dimensions is laser.
  • the irradiation range is 24.
  • two or more scan mirrors may be provided, and the processing surface may be irradiated with a line scan or a two-dimensional scan with a laser beam by reciprocating oscillation of each scan mirror.
  • the scan mirror 37 reflects the reflected infrared rays that are emitted from the temperature observation region 25 while reciprocating, and returns to the cladding portion 33 of the optical fiber 11 via the scan mirror 37.
  • an optical system that receives light emitted or reflected from the temperature observation region 25 and guides infrared light except the light having the wavelength of the laser light to the light receiving surface 10 of the infrared sensor 9 is a scanner.
  • FIG. 13 shows the configuration of the laser heating apparatus according to the seventh embodiment.
  • the same members as those described based on FIGS. 1 and 8 to 12 are denoted by the same reference numerals, and the description thereof is omitted.
  • the scan mirror 39 is provided with a thin film filter or thin film coat that transmits infrared rays but reflects light having the wavelength of the laser beam. Similarly to the sixth embodiment, the scan mirror 39 reflects the laser light from the collimating lens 12 while reciprocally swinging by a predetermined angle about the rotation shaft 38.
  • Infrared rays except for the laser light having the wavelength emitted from the temperature observation region 25 pass through the scan mirror 39, and the laser light cut filter 6 is collected by the condenser lens 8 in the same manner as in the second embodiment. Then, the light is guided to the light receiving surface 10 of the infrared sensor 9 through the visible light cut filter 7.
  • an optical system that receives light emitted or reflected from the temperature observation region 25 and guides infrared light other than light having the wavelength of the laser light to the light receiving surface 10 of the infrared sensor 9 is a scanner.
  • the laser heating apparatus can continuously monitor the amount of infrared rays emitted from the entire temperature observation region 25.
  • the laser heating apparatus is such that the surface to be irradiated is irradiated with a laser beam itself emitted from an LD element (laser diode) provided in a laser emitting section without using an optical fiber. Different from ⁇ 7.
  • FIG. 14 shows the configuration of the laser heating apparatus according to the eighth embodiment.
  • Fig. 14 (a) is a side view when the laser heating device is viewed from the SLOW direction of the laser beam
  • Fig. 14 (b) is a side view when the laser heating device is viewed from the direction orthogonal to the SLOW direction of the laser beam. It is a figure.
  • the same members as those described with reference to FIGS. 1 and 8 to 13 are denoted by the same reference numerals, and description thereof is omitted.
  • the LD element 40 emits a laser beam having a constant wavelength.
  • the laser light emitted from the LD element 40 is arranged in a direction that suppresses the spread in the FAST direction.
  • the cylindrical lens 41 makes the FAST direction of the laser light emitted from the LD element 40 parallel and low.
  • the half mirror 13 reflects the laser light 42 from the cylindrical lens 41.
  • the condensing lens 2 condenses the laser light from the half mirror 13. Due to the cylindrical lens 41 and the condensing lens, the shape of the laser beam formed on the processed surface becomes a rectangular shape or the like.
  • the eighth embodiment includes the cylindrical lens 41 and the condensing lens 2 as an optical system for making the laser irradiation range on the processed surface rectangular or elliptical.
  • the spread of the laser light emitted from the LD element 40 in the FAST direction is suppressed by the cylindrical lens 41, and then condensed by the condenser lens 2, so that the shape of the laser light formed on the processed surface is rectangular, etc.
  • the laser heating device has the above-mentioned point that the shape of the laser beam formed on the processed surface is rectangular or the like by using two LD elements (laser diodes) without using a condenser lens.
  • LD elements laser diodes
  • the laser heating apparatus according to the ninth embodiment, parts different from the above embodiments:! To 8 will be described. However, the description of the same parts as those in the first to eighth embodiments is omitted.
  • FIG. 15 shows the configuration of the laser heating apparatus according to the ninth embodiment.
  • Fig. 15 (a) is a side view of the laser heating device viewed from the SLOW direction of the laser beam.
  • FIG. 15 (b) is a side view of the laser heating device viewed from the direction orthogonal to the SLOW direction of the laser light, and shows the half mirror 13 and the collimating lens 43 extracted.
  • the same members as those described based on FIGS. 1 and 8 to 13 are denoted by the same reference numerals, and description thereof is omitted.
  • the laser emitting section includes two LD elements 40 and a heat sink 45.
  • the heat sink 45 is made of, for example, copper.
  • the two LD elements 40 are joined to the heat sink 45.
  • the two LD elements 40 are the same at a predetermined interval d so that the laser light is emitted from the end face of the heat sink 45 in the same direction and parallel to the optical axis. Arranged on a plane.
  • the collimating lens 43 is arranged in a direction to suppress the spread of the laser light emitted from the LD element 40 in the FAST direction.
  • the collimating lens 43 makes the FAST direction of the laser light emitted from the LD element 40 parallel or low spread.
  • the half mirror 13 reflects the laser beam 44 from the collimating lens 43.
  • LD element 40 (collimating lens 43
  • the laser power density distribution in the SLOW direction on the processed surface 46 can be made trapezoidal by adjusting the distance from the emission end) to the processed surface 46.
  • the temperature distribution in the SLOW direction on the processed surface 46 can be trapezoidal. This is due to the following reason.
  • the distance from the exit end of the collimating lens 43 to the processed surface 46 when the workpiece surface 46 is at each of the forces SA, B, and C is WDA, WDB, and WDC.
  • the half-value laser density in the SLOW direction on the machined surface 46 when the machined surface 46 is at positions A, B, and C is PA, PB, and PC, respectively.
  • the temperature distribution in the SLOW direction on the machined surface 46 when it is at the positions of SA, B, and C, respectively, is TA, TB, and TC.
  • Fig. 16 (a) two lasers are arranged in the same optical axis direction from the end face of the heat sink 45. Light is emitted in the SLOW direction (X direction) with a predetermined spread angle.
  • the FAST direction of the laser light (perpendicular to the paper surface in FIG. 16) is made parallel or low spread by the collimating lens 43.
  • the laser power density distribution is two trapezoidal power distributions at position A as shown in Fig. 16 (b). Position B Then some interference. As a result, at position B, the power at the center is low, but the temperature density distribution is uniform.
  • TOP HAT shape trapezoidal shape
  • the laser power density distribution becomes trapezoidal (TOP HAT shape) as shown in Fig. 16 (c).
  • TOP HAT shape trapezoidal
  • the temperature gradient during heating increases at the center.
  • uniform heating can be achieved without being affected by the difference in temperature gradient.
  • the laser beam is irradiated with two laser beams that suppress the spread in the FAST direction of the two laser beams that are also emitted by the power of the two LD elements (laser diodes).
  • An optical system for making the range rectangular or the like is configured by a collimating lens.
  • a cylindrical lens may be used instead of the collimating lens 43. It is also possible to provide two or more collimating lenses 43. Also, the number of LD elements may be two or more.
  • the laser heating apparatus is different from the above-described ninth embodiment in that the laser emission unit includes a collimator lens, an infrared sensor, a laser light cut filter, and a condenser lens.
  • the laser emission part of the laser heating apparatus according to the tenth embodiment will be described with reference to the drawings.
  • FIG. 17 (a) shows a top view of the laser emitting section in the tenth embodiment.
  • FIG. 17 (b) shows a front view of the laser emitting section in the tenth embodiment.
  • FIG. 17 (c) shows a top view of the laser emitting unit in Embodiment 10 with the top cover removed.
  • FIG. 17 (d) shows the shape of the laser beam formed on the processed surface in the tenth embodiment.
  • FIG. 17 (e) shows a transparent side view of the laser emitting section in the tenth embodiment.
  • FIG. 17 (f) shows the shape of the laser beam formed on the processed surface in the tenth embodiment.
  • the same members as those described based on FIGS. 1 and 8 to 16 are denoted by the same reference numerals, and description thereof is omitted.
  • the laser emitting unit 1 includes a holder 47 and an upper lid 48 of the holder 47. Inside the holder 47, a heat sink 45 in which two LD elements 40 are joined is installed.
  • the heat sink 45 includes a laser light cut filter 6, a condenser lens 8, an infrared sensor 9, and the like.
  • movable bodies 50 and 51 are installed inside the honoreda 47.
  • support portions for supporting the upper movable body 50 are provided on both side surfaces inside the holder 47.
  • the lower movable body 51 On the lower surface side of the upper movable body 50, the lower movable body 51 having a length and width smaller than those of the upper movable body 50 is fixed by two screws 49.
  • the lower movable body 51 moves in a seesaw shape with the protrusion 52 as a fulcrum by the tightening amount of the two screws 49.
  • a collimator lens 43 is joined to the lower movable body 51 so as to be positioned in front of the laser emission end face of the LD element 40.
  • the laser emitting unit 1 is configured so that the fixing position of the collimating lens 43 can be adjusted in the vertical direction with respect to the laser emitting end face of the LD element 40. Therefore, according to the laser emitting unit 1, the position of the laser irradiation range 24 can be arbitrarily changed.
  • the protrusion 52 may be provided on either the upper movable body 50 or the lower movable body 51.
  • the length of the upper movable body 50 in the front-rear direction is shorter than the length of the holder 47 in the front-rear direction.
  • Three screws 52 protruding from the front and rear end surfaces inside the holder 47 abut on the front and rear end surfaces of the upper movable body 50. Therefore, the upper movable body 50 moves in the front-rear direction of the holder 47 by the tightening amount of the three screws 52. Therefore, the fixing position of the collimating lens 43 can be adjusted in the front-rear direction of the holder 47 with the three screws 52.
  • the laser emitting section 1 has a configuration in which the fixing position of the collimating lens 43 can be adjusted in the front-rear direction with respect to the laser emitting end face of the LD element 40.
  • the number of screws 52 is not limited to three.
  • the aspect ratio of the shape (laser irradiation range) of the laser light formed on the processed surface 46 can be arbitrarily changed.
  • Figure 17 (f ) The aspect ratio of the laser irradiation range 24 can be changed to the laser irradiation range 24 indicated by the broken line.
  • the output end force of the collimating lens 43 can be adjusted to the machining surface 46, and the laser power density distribution in the SLOW direction on the machining surface 46 can be trapezoidal. can do.
  • the temperature distribution in the SLOW direction on the machined surface 46 can be trapezoidal.
  • the laser emitting section 1 includes a laser light cut filter 6, a condensing lens 8, and an infrared sensor 9, and can detect infrared rays emitted from the temperature observation region. It has become.
  • the condenser lens 8 is joined to a lens holder whose distance to the light receiving surface 10 of the infrared sensor 9 can be adjusted. Therefore, according to the laser emitting unit 1, the size of the temperature observation area can be arbitrarily changed. For example, as shown in Fig. 17 (f), it is possible to change the temperature observation area 25 from the temperature observation area 25 indicated by the solid line to the temperature observation area 25 indicated by the broken line.
  • a collimating lens 43 is provided as a lens for suppressing the spread of the laser light emitted from the LD element in the FAST direction.
  • a screw 49, movable bodies 50 and 51, a protrusion 52, and a screw 52 are provided as an adjustment mechanism that can be connected to the collimating lens 43 and can adjust the position of the collimating lens 43 with respect to the laser emission end face of the LD element.
  • a cylindrical lens may be used instead of the collimating lens 43. It is also possible to provide two or more collimating lenses 43. Also, the number of LD elements may be two or more.
  • a high gain amplifier is required as a preamplifier for amplifying the output signal level of the infrared sensor.
  • a high-grade operational amplifier is used as a high-gain amplifier or an operational amplifier with a temperature compensation function, the amplifier output changes drastically.
  • the laser beam itself is infrared, and the power of the laser beam for processing such as soldering is as strong as the W class. Therefore, even if a laser beam cut filter is provided, the weak infrared ray of the nW class is provided. Laser light is influenced as disturbance light in the infrared sensor that can be detected.
  • the amount of change in the output signal level of the infrared sensor immediately after laser irradiation is monitored, and whether or not the amount of change is greater than a preset amount of change.
  • the change amount of the output signal level of the infrared sensor reaches the set change amount, the emission of the laser beam is stopped or the laser beam is emitted intermittently with a predetermined laser power.
  • the configuration of the laser heating apparatus in the eleventh embodiment is the same as that in the fourth to tenth embodiments.
  • the configuration of the laser heating device in Embodiment 4 will be described as an example (see FIG. 10).
  • FIG. 18 (a) shows a graph of laser power P of laser light and elapsed time t.
  • FIG. 18 (b) shows a graph of the output signal level of the preamplifier 14 and the elapsed time t.
  • FIG. 18 (c) shows the difference between the output signal level of the preamplifier 14 and the elapsed time t with respect to the output signal level of the preamplifier 14 at time tO after the lapse of At from the laser irradiation start time ts.
  • a graph is shown.
  • the solid line shows the actual output signal level of the preamplifier 14 including the temperature draft and the amount of laser beam leakage detected.
  • the dotted line indicates the ideal output signal level of the preamplifier 14 that does not include the temperature draft and the leak detection of the laser beam.
  • tl represents the time required for the actual output signal level of the preamplifier 14 to reach the level PDs (corresponding to the set temperature Ts).
  • T2 indicates the time required for the output signal level of the ideal preamplifier 14 to reach the level PDs.
  • the output signal level of the preamplifier 14 at the laser irradiation start time ts has a temperature drift component.
  • ⁇ PD and laser light leakage detection ⁇ PDL are included, and the output signal of the ideal preamplifier 14 Greater than issue level. Therefore, even if the laser light oscillation is stopped when the output signal level of the preamplifier 14 reaches the level PDs (time tl), the time tl is the time t2 when the output signal level of the preamplifier 14 reaches the level PDs. It is off.
  • the control unit 30 outputs the output signal of the preamplifier 14 at time tO after At has elapsed from the laser irradiation start time ts.
  • the difference level ⁇ PD of the output signal level of the preamplifier 14 with respect to the level reaches the set change amount ⁇ PDs, the laser beam is stopped.
  • the control unit 30 sets the set change amount ⁇ PDs based on the signal level generated by the volume 29.
  • the difference level A PD is not affected by temperature drift, laser light leak detection, or the difference in the level of the laser power P s, and the difference level ⁇ PD changes from the 0 level to the set amount of change ⁇ PDs. Since the period until reaching (time t3) is a fixed time, the laser irradiation can be stably stopped.
  • the laser heating apparatus can detect the leak of the laser beam and cancel the temperature drift of the infrared sensor or the preamplifier, and can operate stably and with good reproducibility.
  • the PIN photodiode has a large dynamic range, an infrared signal that does not contain errors such as temperature drift can be monitored by monitoring the amount of change in the output signal level of the preamplifier even when there is a large amount of disturbance light from the laser beam.
  • a detection signal preamplifier output signal
  • the laser heating device can stably control the temperature of the object to be heated.
  • the laser heating apparatus and laser heating method according to the present invention detects temperature changes at the time of melting, such as solder resin at the processing point, and abnormal heat generation that is a sign of the occurrence of kogation, and the peripheral part is kogation.
  • soldering, resin bonding, resin marking, and soldering can be performed by laser light emitted from a semiconductor laser. Useful for laser heating and processing such as contact.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Human Computer Interaction (AREA)
  • Laser Beam Processing (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

La présente invention concerne un dispositif et un procédé de chauffage par laser, permettant la soudure, et qui ne brûle pas la périphérie, et une liaison en résine qui ne brûle pas la résine en détectant un changement de température lorsque la soudure ou la résine au point de traitement est fondue ; une chaleur anormale peut indiquer une brûlure potentielle. Un capteur IR (9) génère un signal basé sur la valeur intégrée de la luminance de radiation spectrale d'un rayon IR rayonné par la soudure à chauffer. Avant la soudure en elle-même, une expression relationnelle entre les valeurs de calibrage d'un signal de sortie du capteur IR (9) et une température de mesure de la soudure principale réelle est déterminée à l'avance. Sur une soudure réelle, un rayon IR rayonné de la soudure (3) est reçu par le capteur IR (9) et la température de la soudure (3) est calculée en fonction d'un signal de sortie du capteur IR (9) et de l'expression relationnelle qui précède.
PCT/JP2006/304074 2005-03-04 2006-03-03 Dispositif et procede de chauffage par laser Ceased WO2006093264A1 (fr)

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EP2361714A1 (fr) * 2010-02-26 2011-08-31 Reis Group Holding GmbH & Co. KG Procédé et agencement pour brasage au laser
JP2013246133A (ja) * 2012-05-29 2013-12-09 Micronics Japan Co Ltd 接合パッド、プローブ組立体及び接合パッドの製造方法
JP2014155932A (ja) * 2013-02-14 2014-08-28 Toyota Motor Corp レーザ照射装置及びレーザ照射方法
JP2015530251A (ja) * 2012-08-09 2015-10-15 ロフィン−ラザーク アクチエンゲゼルシャフトＲｏｆｉｎ−Ｌａｓａｇａｇ レーザビームを用いた被加工物の加工装置
WO2019176753A1 (fr) * 2018-03-13 2019-09-19 住友重機械工業株式会社 Dispositif de commande de puissance laser, dispositif de traitement par laser et procédé de commande de puissance laser
CN110702689A (zh) * 2019-10-29 2020-01-17 中国电子科技集团公司第十一研究所 一种对固体激光器的激光板条和热沉焊接面的检测系统
JP2021168344A (ja) * 2020-04-10 2021-10-21 株式会社ジャパンユニックス レーザーリフローハンダ付け方法及び装置
DE102020116394A1 (de) 2020-06-22 2021-12-23 Pac Tech - Packaging Technologies Gmbh Verfahren zur Überwachung eines Laserlötprozesses und Laserlötsystem
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EP2361714A1 (fr) * 2010-02-26 2011-08-31 Reis Group Holding GmbH & Co. KG Procédé et agencement pour brasage au laser
US8698039B2 (en) 2010-02-26 2014-04-15 Reis Group Holding Gmbh & Co. Kg Method and arrangement for firm bonding of materials
JP2013246133A (ja) * 2012-05-29 2013-12-09 Micronics Japan Co Ltd 接合パッド、プローブ組立体及び接合パッドの製造方法
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JP2014155932A (ja) * 2013-02-14 2014-08-28 Toyota Motor Corp レーザ照射装置及びレーザ照射方法
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JP7746344B2 (ja) 2018-03-13 2025-09-30 住友重機械工業株式会社 レーザパワー制御装置、レーザ加工装置及びレーザパワー制御方法
JP2024001046A (ja) * 2018-03-13 2024-01-09 住友重機械工業株式会社 レーザパワー制御装置、レーザ加工装置及びレーザパワー制御方法
WO2019176753A1 (fr) * 2018-03-13 2019-09-19 住友重機械工業株式会社 Dispositif de commande de puissance laser, dispositif de traitement par laser et procédé de commande de puissance laser
CN110702689A (zh) * 2019-10-29 2020-01-17 中国电子科技集团公司第十一研究所 一种对固体激光器的激光板条和热沉焊接面的检测系统
JP7075675B2 (ja) 2020-04-10 2022-05-26 株式会社ジャパンユニックス レーザーリフローハンダ付け方法及び装置
JP2021168344A (ja) * 2020-04-10 2021-10-21 株式会社ジャパンユニックス レーザーリフローハンダ付け方法及び装置
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US12485500B2 (en) 2020-06-22 2025-12-02 PAC Tech—Packaging Technologies GmbH Method for monitoring a laser soldering process, and laser soldering system using a spectroscope device
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JP7644328B2 (ja) 2020-07-14 2025-03-12 株式会社東京精密 レーザ加工装置、ウェーハ加工システム及びレーザ加工装置の制御方法
WO2022014382A1 (fr) * 2020-07-14 2022-01-20 株式会社東京精密 Dispositif d'usinage laser, système de traitement de plaquette et procédé de commande de dispositif d'usinage laser

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