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WO2006088051A1 - Module caméra - Google Patents

Module caméra Download PDF

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Publication number
WO2006088051A1
WO2006088051A1 PCT/JP2006/302640 JP2006302640W WO2006088051A1 WO 2006088051 A1 WO2006088051 A1 WO 2006088051A1 JP 2006302640 W JP2006302640 W JP 2006302640W WO 2006088051 A1 WO2006088051 A1 WO 2006088051A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
camera module
imaging
module according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2006/302640
Other languages
English (en)
Japanese (ja)
Inventor
Kunio Nakano
Kenji Watanabe
Yusuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Opto Inc
Original Assignee
Konica Minolta Opto Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Opto Inc filed Critical Konica Minolta Opto Inc
Priority to JP2007503678A priority Critical patent/JPWO2006088051A1/ja
Publication of WO2006088051A1 publication Critical patent/WO2006088051A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention relates to a camera module.
  • a camera module includes an optical system that forms an image of the outside world as an optical image on an image sensor, a circuit that converts the optical image on the image sensor into a predetermined image data signal, and the image data signal as a main body.
  • the circuit board includes a circuit board that includes terminals that output to the unit.
  • Patent Document 1 discloses a technique of an imaging device (camera module) that can be made smaller, thinner, and lighter.
  • Patent Document 1 Japanese Patent Laid-Open No. 2002-223378
  • an object of the present invention is to provide a power camera module for mounting an optical lens system and a circuit board more efficiently.
  • Solid-state imaging devices such as CCD (Charge Coupled Device) type image sensors and CMOS (Complementary Metal-Oxide Semiconductor) type image sensors are used as imaging devices used in these imaging devices!
  • CCD Charge Coupled Device
  • CMOS Complementary Metal-Oxide Semiconductor
  • imaging devices include an imaging device, an imaging optical system that forms an optical image on the imaging device, a circuit that converts a photoelectric conversion output signal from the imaging device into a predetermined image data signal, and the image.
  • a circuit board having a terminal for outputting a data signal to the main body is provided.
  • Such an image sensor is also desired to be smaller, thinner, and lighter in order to be incorporated in the above-described small and thin electronic device.
  • an imaging element is mounted on the surface of a first circuit board, a driving IC for driving the imaging element is mounted on the back surface, and the surface of the second circuit board
  • the image signal output signal processing IC is mounted on the back side, and the semiconductor element chip is mounted on the back side.
  • the first circuit board and the second circuit board are connected by a flexible printed circuit board and arranged in the direction perpendicular to the optical axis. Is disclosed.
  • the imaging device described in the above Japanese Patent Application Laid-Open No. 2000-270272 relates to substrate arrangement, and is divided into two circuit boards and arranged in the direction perpendicular to the optical axis. It does not describe how to fix the circuit board in the imaging device, or positioning (focus adjustment) between the imaging device mounted on the circuit board and the imaging optical system. This does not solve the problem of tilting between the image sensor on the circuit board and the imaging optical system.
  • the present invention relates to an imaging apparatus in which two circuit boards are electrically connected and arranged in a direction perpendicular to the optical axis, and no tilting occurs with the imaging optical system.
  • An object of the present invention is to obtain an image pickup apparatus that can perform accurate positioning.
  • the present invention relates to an imaging device in which two circuit boards are electrically connected and arranged in a direction perpendicular to the optical axis, and the fixing of the circuit board is viewed from the optical axis direction at low cost. Another object is to obtain an imaging device capable of reducing the front area.
  • the imaging device built in the portable terminal has a very short focal length of the imaging optical system and a Fno. Power of about ⁇ 4, the focal depth on the image side is very high. As the depth becomes shallower, strict accuracy is required for positioning the imaging optical system with respect to the imaging surface in the optical axis direction. For this reason, various proposals have been made regarding the position setting method of the imaging optical system of the imaging apparatus.
  • Japanese Patent Laid-Open No. 2002-325193 discloses that a leg portion formed integrally with an optical member that does not require focus adjustment at the time of manufacturing an image pickup device is brought into contact with the image pickup element, and an elastic member is used.
  • a device that positions the image sensor and the optical member in the optical axis direction by urging the optical member toward the image sensor is disclosed.
  • the imaging device mounted on the above-described portable terminal is also required to have high image quality and multi-functionality as the penetration rate increases, and the lens is moved according to the subject distance that is not fixed focus, and is accurately pinned. There is a need for an imaging device capable of taking pictures.
  • the image pickup apparatus described in the above Japanese Patent Application Laid-Open No. 2002-325193 is a simple and effective method that does not require an adjustment step for positioning the image pickup element and the optical member in the optical axis direction.
  • an imaging apparatus that can perform imaging by moving the imaging optical system position in accordance with the subject distance.
  • the present invention has a simple configuration, does not cause tilting of the imaging element surface, can accurately position the imaging element and the imaging optical system in the direction of the optical axis, and depends on the subject distance. It is another object of the present invention to obtain an image pickup apparatus capable of taking an image by moving the position of the image pickup optical system and a portable terminal including the image pickup apparatus.
  • the conventional imaging apparatus includes an imaging device, an imaging optical system that forms an optical image on the imaging device, and a circuit that converts a photoelectric conversion output signal from the imaging device into a predetermined image data signal.
  • a circuit board having a terminal for outputting the image data signal to the main body is provided.
  • the imaging device is also shielded.
  • Japanese Patent Application Laid-Open No. 2005-12327 discloses an apparatus in which a conductive member is disposed between a lens barrel and an imaging element for shielding.
  • Japanese Patent Application Laid-Open No. 11-239288 discloses a video camera housing structure in which an imaging device using a solid-state imaging device prevents mutual electromagnetic interference between a camera unit and an external device on which the camera is mounted.
  • the camera unit and the circuit unit including the imaging element are sealed with a conductive plate and a conductive case, and a subject glass incident window is provided with conductive glass.
  • the electromagnetic waves generated from the imaging device must not interfere with the communication function, and the electromagnetic waves generated for communication affect the imaging device and perform imaging.
  • the image must not be defective.
  • the imaging device described in the above Japanese Patent Application Laid-Open No. 2005-12327 has a sufficient shielding effect for the imaging device. However, it is preferable to shield the entire imaging device including the imaging device for those having an actuator for moving the imaging optical system corresponding to the subject distance.
  • the shield structure described in the above-mentioned Japanese Patent Application Laid-Open No. 11-239288 has a conductive plate and a conductive material so as to enclose them independently outside the circuit portion related to the camera portion and the camera portion.
  • the case is shielded by using conductive glass, and its outer shape is enlarged, so that it is unsuitable for incorporation into a small and thin portable terminal.
  • the electromagnetic wave generated from the imaging device without increasing the size of the imaging device does not hinder the communication function, and the electromagnetic wave generated for communication affects the imaging device.
  • Another object of the present invention is to obtain a small and thin imaging device suitable for being incorporated in a portable terminal.
  • an imaging optical unit having a lens that forms an incident light beam and a lens frame that holds the lens;
  • connection cable connecting the first circuit board and the second circuit board
  • a cylindrical housing that houses the imaging optical unit, the first circuit board, and the second circuit board from the light incident side in this order;
  • a camera module comprising a pressing locking member that presses and locks the first circuit board in the optical axis direction so that the position of the first circuit board can be adjusted with respect to the imaging optical unit.
  • the optical lens system and the circuit board can be more efficiently mounted.
  • FIG. 1 is an external perspective view of a camera module 1 according to the present invention.
  • FIG. 2 is an external perspective view of the camera module 1 shown in FIG. 1 rotated 180 degrees around the Y—Y axis.
  • FIG. 3 is a longitudinal sectional view of the camera module 1 cut along a plane including a Z—Z axis and a Y—Y axis.
  • FIG. 4 is a longitudinal sectional view of the camera module 1 cut along a plane including the Z—Z axis and the X—X axis.
  • FIG. 5 is an external view of a mobile phone that is an example of a mobile terminal that includes the imaging device according to the present embodiment.
  • FIG. 6 is an external perspective view of the imaging apparatus according to the present embodiment.
  • FIG. 7 is a cross-sectional view of the imaging device 1 shown in FIG. 6 cut along a plane including the Z axis and the X axis.
  • FIG. 8 is a cross-sectional view of the imaging device 1 shown in FIG. 6 cut along a plane including the Z axis and the Y axis.
  • FIG. 9 is a diagram showing an attachment state of the second substrate to the housing and an exploded perspective view of the shield member.
  • the imaging lens adjusts an angle of field of an external image formed as an optical image on the imaging device, and Z or imaging Focus adjustment means for adjusting the focus of the optical image to be provided is provided, and a connection cable for transmitting a control signal to the focus adjustment means is provided on the other axial end side of the cylindrical casing on the other circuit board. It is characterized in that it is performed by a connecting portion provided at a position communicating with the opened portion.
  • the circuit boards can be arranged in a multiplex manner along the axial direction of the housing, so that the imaging lens and the assembly with the circuit board force are not affected by the size of the circuit board. Therefore, the camera module can be made compact.
  • the adhesive injection hole is formed in the portion corresponding to the position of the locking portion, accurate fixing of the substrate on which the image sensor is mounted can be easily performed.
  • connection of a cable for transmitting a control signal to the focus adjustment means by the actuator or the like communicates with an opening portion of a housing on another circuit board. Since the connection is made at the connection portion provided on the surface, it is possible to easily connect the cable at the time of manufacture.
  • a portable terminal comprising the imaging device according to any one of (4) to (6).
  • a cylindrical housing provided with an opening for light incidence on one end side in the axial direction, an imaging optical system disposed facing the opening for light incidence, and the imaging optical
  • the imaging device has a surface other than the photoelectric conversion surface.
  • An imaging device comprising: a cover member having an abutting portion that is in contact with the housing so as to cover the imaging device; and the cover member is brought into contact with the housing to perform positioning in the optical axis direction. apparatus.
  • a cylindrical casing provided with an opening for light incidence on one end side in the axial direction, an imaging optical system disposed facing the opening for light incidence, and the imaging optical
  • An actuator for moving the system in the optical axis direction; a position detection member for photoelectrically detecting the position of the imaging optical system; and a circuit board on which an imaging element is mounted behind the imaging optical system in the optical axis direction.
  • a cover member that covers the imaging element is assembled to the circuit board, and an adhesive having a characteristic that does not transmit light emitted from the position detection member is applied around the cover member.
  • Imaging device [0048] (10) The imaging device according to (8) or (9), wherein the circuit board on which the imaging element is mounted is biased toward the object side by an elastic member.
  • a mobile terminal comprising the imaging device according to any one of (8) to (10).
  • the lens corresponding to the subject distance can be accurately positioned in the optical axis direction of the imaging element and the imaging optical system without tilting the imaging element surface with a simple configuration. It is possible to obtain an imaging device that can be moved and photographed and a portable terminal equipped with the imaging device.
  • An imaging optical system is disposed in a substantially rectangular parallelepiped housing provided with an opening for light incidence on one end side in the axial direction so as to face the opening for light incidence.
  • the imaging apparatus in which the first circuit board on which the imaging element is mounted on the rear side of the optical axis direction of the optical system and the second circuit board is arranged behind the first circuit board, one side of the housing A nail portion having flexibility is formed on one of two surfaces adjacent to the surface on which the hole is formed and on a surface opposite to the surface on which the hole is formed.
  • a mobile terminal including the imaging device according to any one of (12) to (14).
  • the front area of the imaging device and the size of the second circuit board can be made equal, and the area for bonding and the number of bonding steps are not required, and the size and cost can be reduced.
  • An imaging device can be obtained.
  • the second circuit board is held by the surface on which the hole is formed, the surface adjacent to the surface on which the hole is formed, and the surface opposite to the surface on which the hole is formed. It is possible to prevent the dropout and to obtain an imaging device with high reliability.
  • a cylindrical housing provided with an opening for light incidence on one end side in the axial direction, an imaging optical system disposed facing the opening for light incidence, and the imaging optical
  • an imaging apparatus having an actuator for moving the system in the optical axis direction and a circuit board on which an imaging element is mounted on the rear side in the optical axis direction of the imaging optical system, at least a part of the side surface of the housing is electrically conductive.
  • the shield member is configured to cover, and an engaging portion is formed on a part of the shield member, An image pickup apparatus, wherein the engaging member is engaged with the housing to fix the shield member.
  • a portable terminal comprising any one of the imaging devices of (16) to (20).
  • the imaging device can be downsized by fixing without a space such as a screw and a fixing member such as a screw, and has a simple structure and a low cost due to a reduction in man-hours, and has a good shielding property Can be obtained.
  • FIGS. 1 to 4 an embodiment of the camera module having the configurations (1) to (3) will be described.
  • the present invention is not limited to this embodiment.
  • the embodiment of the present invention shows the most preferable mode of the invention, and the terminology of the invention is not limited to this.
  • FIG. 1 is an external perspective view of the camera module 1 of the present invention
  • FIG. 2 is an external perspective view of the camera module 1 shown in FIG. 1 rotated 180 degrees around the Y—Y axis
  • Fig. 3 is a longitudinal sectional view of the camera module 1 shown in Fig. 1 cut along a plane including the Z-Z axis and the Y-Y axis.
  • Fig. 4 shows the camera shown in Fig. 1.
  • FIG. 3 is a longitudinal sectional view when module 1 is cut along a plane including the Z-Z axis and the X-X axis.
  • the surfaces including the adhesive injection hole 412 shown in FIGS. 1 and 2 are the same as each other. As shown in Fig. 3, the position of the adhesive injection hole 412 is the same as the surface on the back side of this surface from the Y-Y axis direction. Suppose that.
  • the camera module 1 includes a first board 421 (first circuit board) and a second board 422 (second circuit board) inside a substantially rectangular parallelepiped casing 410. ), And a lens unit 431 (imaging optical unit).
  • the camera module Although the shape of 1 is a substantially rectangular parallelepiped, other shapes such as a substantially cylindrical shape may be used as long as they do not contradict the spirit of the present invention.
  • the casing 410 is a lens that has a light incident opening on one surface (upper surface in FIG. 1) in the axial direction of the Z-axis and takes outside light into the lens portion 431.
  • the hole 411 and the surrounding surface are provided with an adhesive injection hole 412 and a vent hole 13, and the opposite surface (upper surface in FIG. 2) is opened to insert each member provided in the housing. It is formed.
  • the adhesive injection hole 412 and the vent hole 413 provided on the peripheral surface described above do not have the vent hole 413, but only the adhesive injection hole 412 or the adhesive injection into all the surrounding surfaces.
  • a configuration in which the hole 412 is provided may be adopted.
  • the lens unit 431 includes a plurality of optical lens groups (imaging lenses) made of plastic or glass (not shown), and is arranged inside the housing unit 410 as shown in FIGS. It also has a lens ⁇ 431 ⁇ , as shown in Fig. 4 [shown here, lens frame 4311, cutout 4312, lens drive unit 4313, and connection cable 4314. Connected to the second substrate 422 by the connection connector 4315, which will be described later. 4 314 A lens frame 4311 interlocked with the lens drive unit 4313 which is moved by an actuator 4312 which is a focus adjusting means according to the driving current of 314 force.
  • the optical lens group supported by the lens is movably held in the axial direction of the force axis.
  • the lens drive unit 4313 is moved by the actuator 4312 by using, for example, a piezo element that deforms when a voltage is applied, and oscillating the piezo element with different speeds of expansion and contraction according to the drive voltage.
  • the optical lens group in the lens unit 431 includes, for example, a lens group (focus) for focus adjustment from the subject side to the first group, and a lens group (variety adjustment) for zooming (field angle adjustment) to the second group. 1), the third group consists of a lens group (compensator) that corrects the image accompanying zooming, and the fourth group consists of an imaging lens group (relay). In this case, by moving the lens frame 4311, it is possible to adjust the angle of view by adjusting the position of the variator and adjusting the image focus by adjusting the position of the compensator.
  • the lens unit 431 does not have a configuration for performing only the focus adjustment of the image or a configuration for moving the lens group and the lens group described above, and may be a simple fixed focus method.
  • the first substrate 421 as one circuit board and the second substrate 422 as another circuit board have circuit patterns formed on, for example, a ceramic substrate, a glass-epoxy substrate, a flexible substrate, and the like, and the electronic member is soldered.
  • the printed circuit boards are arranged in the interior of the casing 410 and are electrically connected to each other by the FPC boards 423.
  • the first substrate 421 is a CCD element 4211 (Charge-Coupled) that converts an optical image into an electrical signal.
  • the cover member 416 is a bowl-shaped member in which a glass material IR filter is attached to a hollow inner portion, and as shown in FIGS. After being arranged at the position of, it is screwed with a portion in contact with the inner wall of the housing portion 410 so that light from the lens portion 431 strikes the CCD element 4211 through a hollow inner portion provided with an IR filter. Fixed.
  • the first substrate 421 and the cover member 416 are fixed to each other at a joint portion 4 222 at a portion where the first substrate 421 and the cover member 416 are in contact with each other.
  • the adhesive is poured into the adhesive injection hole 412.
  • an adhesive injection hole 412 through which an adhesive is poured into the joint 4222 from the outside is an outer peripheral surface of the casing 410, specifically in the vicinity of the cover member 416. Is near the upper portion of the surface of the first substrate 421 fixed to the cover member 416, and is opened at a location where the outside of the housing portion 410 and the connection portion 4222 can communicate with each other. For this reason, the camera module 1 realizes an improvement in work efficiency when fixing the first substrate 421, and an improvement in cooling efficiency of elements provided in the housing 410, particularly on the first substrate 421 when used. it can.
  • the second substrate 422 is a substrate to which the connection connector terminal portion 4221, the connection connector 4315, and a DSP (Digital Signal Processor) not shown are soldered.
  • Second board 42 2 to 4 as shown in FIGS. 2 to 4, the first substrate 421 and the first substrate 421 are placed in the housing with the surface including the connection connector terminal portion 4221 and the connection connector 4315 facing the opening portion of the housing portion 410 in the outward direction. It is arranged with a gap, and is fixed by the connecting connector terminal portion 4221 and the locking portion 14 and the fastener 415 that are in contact with the outer surface.
  • the fixing by the locking portion 414 may be configured to be locked and fixed by the connection connector terminal portion 4221 provided on the substrate as shown in FIGS. It may be configured to be in direct contact with the second substrate 422 as fixed.
  • connection connector terminal portion 4221 has a socket shape with a metal terminal connected to a circuit of a board generally called a female, and is extended from an external device.
  • the connector is electrically connected to the external device by fitting a male connector (not shown) called a male provided at one end of the communication cable.
  • the connection connector terminal portion 4221 may be female or male, and the dimensions and signals that flow through the metal terminals are not determined, but more preferably, it is predetermined in order to improve versatility. This is in conformity with the above standards, and is configured in a shape that does not protrude from the edge of the opening portion of the casing 410.
  • connection connector 4315 as a connection portion is a connection connector similar to the connection connector terminal portion 4221 described above, and is electrically connected to the connection cable 4314.
  • the lens position of the lens unit 431 can be controlled on the basis of a control signal from an external device connected to the DSP or the connection connector terminal unit 4221 provided on the second substrate 422.
  • the connection between the connection cable 4314 and the connection connector 4315 is a position communicating with the opening on the second substrate 422, it is easy to perform the connection work.
  • the FPC board 423 which is an elastic connection cable for connecting the first board 421 and the second board 422, is a flexible board having elasticity provided with wiring, for example, a flexible bra Flexible 'printed circuit board (FFC: Flexible Printed Circuit) with conductor pattern formed on stick film (polyimide, polyester). This flexible printed circuit board can be bent, bent and moved. Partial wiring is possible.
  • FFC Flexible 'printed circuit board
  • stick film polyimide, polyester
  • the FPC board 423 is disposed in the gap between the first board 421 and the second board 422.
  • the first substrate 421 is pressed together with the cover member 416 in the direction of the locking portion 410h and the second substrate 422 is pressed in the direction of the locking portion 414 and locked by elastic biasing.
  • the cover member 416 and the first substrate 421 at the joint 4222 may be fixed to each other by using the elasticity of the FPC substrate 423 as compared with the configuration using the adhesive described above.
  • the FPC board 423 is uniformly biased to the first board 421 and the second board 422 only by being configured in a U shape near the ends of the first board 421 and the second board 422.
  • a configuration provided at a plurality of locations or a configuration in which the first substrate 421 and the second substrate 422 are connected to the central portion of the first substrate 421 in a S shape, for example, may be used.
  • the camera module 1 includes the lens unit 431 that images the image of the outside world, the first substrate 421 that is fixed at the imaging position, and the first substrate 421 inside the housing unit 410. And a FPC board 423, and a second connector 422 in which a connection connector 4 terminal part 4221 for connecting to the outside at a position having a gap with the first board 421 is arranged outside the housing part 410.
  • a connection connector 4 terminal part 4221 for connecting to the outside at a position having a gap with the first board 421 is arranged outside the housing part 410.
  • a configuration may be employed in which a substrate is further provided between the first substrate 421 and the second substrate 422, and the first substrate 421 is connected and stacked in order from the first substrate 421.
  • FIG. 5 is an external view of a mobile phone 100 that is an example of a mobile terminal provided with the imaging device 1 (camera module) according to the present embodiment.
  • an upper case 71 as a case having display screens D1 and D2 and a lower case 72 having an operation button 60 as an input unit are connected via a hinge 73. It is connected.
  • the imaging device 1 is built below the display screen D2 in the upper casing 71, and the imaging device 1 is arranged so that the outer surface side force of the upper casing 71 can also capture light.
  • this imaging device may be arranged above or on the side of the display screen D2 in the upper casing 71.
  • the mobile phone is not limited to a folding type.
  • FIG. 6 is an external perspective view of imaging device 1 according to the present embodiment.
  • the imaging device 1 has a substantially rectangular parallelepiped appearance and is formed of a conductive member.
  • the outer periphery of the shield members 12a and 12b is covered.
  • the shield member 12a is formed with a light incident opening, and the light incident opening 11 is similarly formed in a housing (not shown) disposed inside the shield member.
  • An imaging optical system 31 is arranged facing the light entrance opening 11.
  • the appearance of the imaging device 1 is a substantially rectangular parallelepiped shape, other shapes such as a cylindrical shape may be used as long as they do not contradict the spirit of the present invention.
  • FIG. 7 is a cross-sectional view of the imaging device 1 shown in FIG. 6 cut along a plane including the Z axis and the X axis.
  • FIG. 8 is a cross-sectional view of the imaging device 1 shown in FIG. 6 cut along a plane including the Z axis and the Y axis.
  • the same reference numerals are given to the same members to avoid duplication of explanation.
  • the housing 10 is disposed inside the shield members 12a and 12b, and the imaging optical system is disposed facing the opening 11.
  • the imaging optical system is composed of a plurality of plastic or glass lens groups and is assembled in a lens frame 311.
  • the housing 10 is assembled with an actuator 312 for adjusting the focus by moving the lens frame 311 in the optical axis direction (Z direction in the drawing).
  • This actuator 312 uses, for example, a piezoelectric element that deforms when a voltage as shown in the figure is applied, and vibrates in the direction of the optical axis so that the expansion and contraction speeds of the piezoelectric element are different.
  • the shaft portion of the actuator 312 is engaged with an arm portion 311m integrally formed with the lens frame 311 so that the coil panel 32 generates a predetermined friction between the shaft portion and the arm portion 311m of the actuator 312. It is summer.
  • the guide portion 311g formed integrally with the lens frame 311 is formed in a U shape with a groove formed in the optical axis direction, and the plate-like guide portion formed in the housing 10 is formed by this guide portion 311g. By engaging with the groove, a rectilinear guide part is formed, and as a result, the lens frame 311 moves straight in the optical axis direction.
  • a first substrate 21 as a first circuit board and a second substrate 22 as a second circuit board are arranged behind the first substrate 21 behind the imaging optical system.
  • the first substrate 21 and the second substrate 22 are electrically connected by a flexible printed circuit board 23.
  • the first substrate 21 and the second substrate 22 are, for example, ceramic substrates, glass epoxy substrates, paper phenol substrates, etc.
  • a substrate on which a circuit pattern is formed and an electronic component is mounted with solder or the like.
  • the above-described actuator 312 is connected to the second substrate 22 by a flexible printed circuit board 314.
  • a photo reflector for example, is mounted on the first substrate 21 as a position detection member, detects the position of the lens frame 311, and controls the drive of the actuator 312 based on the detection result. It has come to be.
  • a photo interrupter may be used to detect the position of the lens frame 311, but the following will be described using a photo reflector.
  • An image sensor 211 is mounted on the first substrate 21. Further, a sensor cover 16 is assembled so as to cover the image sensor 211.
  • the sensor cover 16 includes a contact portion 16t that contacts a surface other than the photoelectric conversion surface of the image sensor 211.
  • the sensor cover 16 is bonded and fixed to the first substrate 21 with an adhesive 212A around the periphery formed to have a minute gap with the first substrate 21 as shown.
  • an adhesive 212A for example, an ultraviolet curable adhesive, a thermosetting adhesive, a heat / ultraviolet combined adhesive, or the like is used. Further, an upper portion of the sensor cover 16 above the image sensor 211 is opened, and an infrared light cut filter 17 is adhered and sealed in this opening.
  • the space of the image sensor 211 is sealed to prevent dust and the like from adhering to the image sensor 211.
  • the sensor cover 16 whose periphery is bonded and fixed to the first substrate 21 with the adhesive 212A is further provided with a position detection for photoelectrically detecting the position of the lens frame 311 on the adhesive 212A.
  • An adhesive 212B having a property of not transmitting the light emitted from the photo reflector as the intelligent member is applied.
  • light emitted from a photoreflector is light in the infrared region.
  • a photoreflector for position detection that enters through a minute gap between the sensor cover 16 and the first substrate 21 by applying the adhesive 212B having the characteristic of not transmitting infrared light.
  • the light emitted from can be blocked. Thereby, the influence of the light emitted from the position detection member on the captured image obtained by the image sensor 211 can be eliminated.
  • An elastic member 18 is inserted between the first substrate 21 and the second substrate 22, and a biasing force is applied in a direction separating the first substrate 21 and the second substrate 22.
  • a urethane sponge-like member is used for the elastic member 18.
  • the elastic member 18 preferably has a quadrilateral, cylindrical or rod-like front shape. Also, the relative relationship between the first substrate 21 and the second substrate 22 It is preferable that the electronic parts on the surface to be mounted are inserted and inserted into the parts. Instead of inserting the elastic member 18, the elastic connecting cable 23 may be used as an urging force.
  • a connector 221 for connecting to the control board on the main body side of the mobile terminal is mounted on the second board 22, and the board surface on the connector side has claw portions 10t formed on the housing 10 and It is fixed by an engaging portion (not shown). Therefore, the first substrate 21 is urged toward the lens frame 311 side, that is, the object side, and the upper surface side of the sensor cover 16 is brought into contact with the abutting portion 10h formed integrally with the housing 10 as illustrated. .
  • the sensor cover 16 is flush with the surface of the abutting portion 10h (locking portion) of the housing 10, and is in contact with the contact portion 16t formed on the sensor cover 16.
  • the surface of the image sensor 211 is also determined in parallel with the abutting portion 10h. As a result, the imaging surface force of the imaging element 211 is accurately maintained perpendicular to the optical axis of the imaging optical system 31.
  • the urging force to the first substrate 21 can be evenly applied, and the imaging on the first substrate 21 is performed.
  • the sensor force bar 16 that contacts the element 211 to abut against the abutting portion 10h of the housing 10 with an equal urging force, the imaging surface of the imaging element 211 is at a desired position on the optical axis. It becomes possible to keep it perpendicular to the optical axis. Further, by pressing with the urging force of the elastic member, it is possible to reduce the cost by reducing the number of man-hours without requiring the sensor cover 16 and the first substrate 21 to be bonded and fixed.
  • the first substrate 21 itself is held in a suspended state without coming into contact with other members. For this reason, even when an impact is applied to the image pickup apparatus 1, it is possible to improve the reliability with which it is difficult for a direct impact to be transmitted to the image sensor. Since the structure is such that stress is not easily transmitted when the imaging device is assembled to a portable terminal, it is possible to prevent the occurrence of a failure when unexpected stress is applied when incorporating it into the portable terminal. become able to.
  • the elastic member 18 may be a plastic panel, a panel panel, or the like that is not limited to the sponge-like force described above.
  • a rubber member with a gold wire or a rubber member in which conductive portions and insulating portions are alternately arranged is used as the elastic member 18, and the first substrate 21 and the second substrate 22 are connected by the elastic member 18. It may be electrically connected. In this case, the flexible printed circuit board 23 can be omitted, and the cost can be reduced.
  • attachment of the second substrate 22 and the shield members 12a and 12b will be described.
  • FIG. 9 is a view showing a state in which the second substrate 22 is attached to the housing 10 and an exploded perspective view of the shield members 12a and 12b.
  • a hole 10k is formed on one side of the housing 10, one surface adjacent to the surface on which the hole 10k is formed, and the surface on which the hole 10k is formed.
  • a claw portion 10t having flexibility is formed on the surface facing each other.
  • the second substrate 22 is inserted into the hole 10k and hung on the claw 10t, and fixed as shown. Further, a receiving portion 10c for receiving the second substrate 22 is formed on the surface having the claw portion 10t at a position different from that of the claw portion 10t, and the receiving portion 10d is also formed on the surface having the hole portion 10k. It has been.
  • one surface of the second substrate 22 is sandwiched between the hole 10k and the claw 10t, and the other surface is sandwiched between the receiving portions 10c and 10d.
  • the front area of the image pickup device and the size of the second substrate can be made equal, and no area or man-hour for bonding is required, and the image pickup device can be reduced in size and cost. It becomes possible.
  • the second substrate is held by the surface on which the hole is formed, the surface adjacent to the surface on which the hole is formed, and the surface opposite to the surface on which the hole is formed, thereby preventing the substrate from falling off due to an impact. You can stop.
  • the shield member 12a is assembled to the opening side of the casing 10, and the shield member 12b is also assembled with a reverse force so as to partially overlap the shield member 12a.
  • the shield member 12b is formed with a tongue 12s, a contact piece 12g, and a U-shaped portion 12k bent in a U-shape, as shown in the figure.
  • the shield member 12b is notched in the vicinity of the shape portion 12k.
  • the tongue 12s is connected to the ground pattern of the control board on the main body side of the mobile terminal connected by the connector 221, and the contact piece 12g is a ground pattern formed on the second board 22. Connected to ground.
  • the U-shaped portion 12k bent into a U-shape is hung on the housing 10 as shown by the broken arrow in the figure. And assembled. (Refer to FIG. 8) By engaging the U-shaped portion 12k with the casing 10, the shield member 12b is not opened or lowered in spite of being cut out, and the casing 10 and the shield member 12a It can be fixed along the outer periphery.
  • the region indicated by the alternate long and short dash line of the shield member 12b is printed.
  • the serial number and date of manufacture are printed on this print.
  • press, ink jet, laser marker, or the like is used.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

L’invention concerne un module caméra possédant une section optique d’imagerie équipée d’une lentille permettant de focaliser le flux de lumière incidente pour constituer une image et d’un barillet à lentille pour maintenir la lentille ; une première carte à circuit imprimé et une seconde carte à circuit imprimé sur lesquelles est monté un élément d’imagerie servant à l’imagerie de l’image formée ; un câble de connexion assurant le branchement de la première carte à circuit imprimé et de la seconde carte à circuit imprimé ; un logement tubulaire permettant de recevoir la section optique d’imagerie, la première carte à circuit imprimé, et la seconde carte à circuit imprimé, dans cet ordre en partant du côté d’incidence de lumière ; et un élément d’engagement à pression afin de peser sur la première carte à circuit imprimé dans la direction de l’axe optique pour ajuster la position de la première carte à circuit imprimé par rapport à la section optique d’imagerie et la bloquer dans cette position.
PCT/JP2006/302640 2005-02-16 2006-02-15 Module caméra Ceased WO2006088051A1 (fr)

Priority Applications (1)

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JP2007503678A JPWO2006088051A1 (ja) 2005-02-16 2006-02-15 カメラモジュール

Applications Claiming Priority (10)

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JP2005039358 2005-02-16
JP2005-039358 2005-02-16
JP2005-075093 2005-03-16
JP2005075093 2005-03-16
JP2005075094 2005-03-16
JP2005-075094 2005-03-16
JP2005-079217 2005-03-18
JP2005079218 2005-03-18
JP2005-079218 2005-03-18
JP2005079217 2005-03-18

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WO2006088051A1 true WO2006088051A1 (fr) 2006-08-24

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PCT/JP2006/302640 Ceased WO2006088051A1 (fr) 2005-02-16 2006-02-15 Module caméra

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JP (1) JPWO2006088051A1 (fr)
WO (1) WO2006088051A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008075596A1 (fr) * 2006-12-21 2008-06-26 Seiko Precision Inc. Dispositif d'imagerie
JP2008191622A (ja) * 2007-02-08 2008-08-21 Matsushita Electric Ind Co Ltd 複合体
JP2008203284A (ja) * 2007-02-16 2008-09-04 Shicoh Eng Co Ltd レンズ駆動装置、カメラ及びカメラ付き携帯電話
JP2008203283A (ja) * 2007-02-16 2008-09-04 Shicoh Eng Co Ltd レンズ駆動装置、カメラ及びカメラ付き携帯電話
JP2009105771A (ja) * 2007-10-24 2009-05-14 Sharp Corp ケース部材、センサモジュールおよび電子情報機器
JP2009204676A (ja) * 2008-02-26 2009-09-10 Tdk Taiwan Corp マイクロレンズの電磁干渉防御機構
JP2009267756A (ja) * 2008-04-25 2009-11-12 Hitachi Ltd カメラ装置
JP2010200008A (ja) * 2009-02-25 2010-09-09 Ricoh Co Ltd カメラモジュール
JP2012053161A (ja) * 2010-08-31 2012-03-15 Konica Minolta Opto Inc レンズ鏡筒
EP2124432A4 (fr) * 2007-02-21 2012-03-21 Konica Minolta Opto Inc Dispositif d'imagerie et son procédé de fabrication
JP2018200423A (ja) * 2017-05-29 2018-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
US11309344B2 (en) 2017-05-29 2022-04-19 Sony Semiconductor Solutions Corporation Imaging device, solid state image sensor, and electronic device
EP3961300A4 (fr) * 2019-04-22 2023-01-25 Kyocera Corporation Instrument électronique, dispositif d'imagerie, et corps mobile
JP7441759B2 (ja) 2020-09-01 2024-03-01 アルプスアルパイン株式会社 レンズ駆動装置及びカメラモジュール

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0777648A (ja) * 1993-06-30 1995-03-20 Canon Inc レンズ制御装置
JP2004214788A (ja) * 2002-12-27 2004-07-29 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
JP2004221876A (ja) * 2003-01-14 2004-08-05 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0777648A (ja) * 1993-06-30 1995-03-20 Canon Inc レンズ制御装置
JP2004214788A (ja) * 2002-12-27 2004-07-29 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
JP2004221876A (ja) * 2003-01-14 2004-08-05 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314878B2 (en) 2006-12-21 2012-11-20 Seiko Precision Inc. Image pickup apparatus with impact resistance
WO2008075596A1 (fr) * 2006-12-21 2008-06-26 Seiko Precision Inc. Dispositif d'imagerie
CN101512407B (zh) * 2006-12-21 2012-05-30 精工精密株式会社 摄像装置
JP2008191622A (ja) * 2007-02-08 2008-08-21 Matsushita Electric Ind Co Ltd 複合体
JP2008203284A (ja) * 2007-02-16 2008-09-04 Shicoh Eng Co Ltd レンズ駆動装置、カメラ及びカメラ付き携帯電話
JP2008203283A (ja) * 2007-02-16 2008-09-04 Shicoh Eng Co Ltd レンズ駆動装置、カメラ及びカメラ付き携帯電話
EP2124432A4 (fr) * 2007-02-21 2012-03-21 Konica Minolta Opto Inc Dispositif d'imagerie et son procédé de fabrication
JP2009105771A (ja) * 2007-10-24 2009-05-14 Sharp Corp ケース部材、センサモジュールおよび電子情報機器
JP2009204676A (ja) * 2008-02-26 2009-09-10 Tdk Taiwan Corp マイクロレンズの電磁干渉防御機構
JP2009267756A (ja) * 2008-04-25 2009-11-12 Hitachi Ltd カメラ装置
JP2010200008A (ja) * 2009-02-25 2010-09-09 Ricoh Co Ltd カメラモジュール
JP2012053161A (ja) * 2010-08-31 2012-03-15 Konica Minolta Opto Inc レンズ鏡筒
JP2018200423A (ja) * 2017-05-29 2018-12-20 ソニーセミコンダクタソリューションズ株式会社 撮像装置、および電子機器
CN110431453A (zh) * 2017-05-29 2019-11-08 索尼半导体解决方案公司 摄像装置和电子设备
US11309344B2 (en) 2017-05-29 2022-04-19 Sony Semiconductor Solutions Corporation Imaging device, solid state image sensor, and electronic device
US11810935B2 (en) 2017-05-29 2023-11-07 Sony Semiconductor Solutions Corporation Imaging device, solid state image sensor, and electronic device
EP3961300A4 (fr) * 2019-04-22 2023-01-25 Kyocera Corporation Instrument électronique, dispositif d'imagerie, et corps mobile
US12088896B2 (en) 2019-04-22 2024-09-10 Kyocera Corporation Electronic device, imaging device, and mobile body
JP7441759B2 (ja) 2020-09-01 2024-03-01 アルプスアルパイン株式会社 レンズ駆動装置及びカメラモジュール

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