WO2006073098A1 - Method and device for breaking work, method for scribing and breaking work, and scribing device with breaking function - Google Patents

Abstract

A method and a device for breaking a work, a method for scribing and breaking the work, and a scribing device with a breaking function. The method for breaking the work (5) capable of preventing chipping from occurring on the rear surface of the work due to rubbing when the work having a scribe line marked on the surface thereof is broken comprises a work adhering step for stamping the rear surface of the work (5) on an extensible sheet (9), a sheet pulling step for pulling the sheet (9) on which the work (5) is stamped, and a work parting step for moving the scribe line (5c) to the rear surface of the work (5) in the pulled state of the sheet (9). Since the work (5) is pulled off immediately after the work (5) is parted by the tensile force of the sheet (9), the rubbing of the parted work (5) is reduced and the chipping can be prevented from occurring on the rear surface of the work. Also, since the tensile force provided to the work (5) assists in parting the work, the work (5) can be parted with a smaller force.

Description

 Work breaking method and device, scribing and breaking method, and scribing device with break function

 Technical field

 [0001] The present invention relates to a work breaking method and apparatus for breaking a work made of a brittle material such as a semiconductor wafer and glass, a scribing and breaking method, and a scribing apparatus with a break function.

 Background art

 As a method for breaking (breaking) a work having brittle material strength such as a semiconductor wafer and glass into a predetermined shape, a dicing method has been employed in which the work is fed into a rotary blade and divided into dice. In this dicing method, the volume of the part sent to the rotary blade of the workpiece is removed.

 [0003] In recent years, instead of the dicing method, a method is used in which a scribe line is scribed on the surface of a workpiece by a scribe device, and then a crack is grown along the scribe line by a break device to break the workpiece. (See, for example, Patent Document 1, paragraphs [0001] to [00 04]).

 FIG. 29 shows a principle diagram of a conventional break method. In this breaking method, a work 2 is placed between two support points la and lb, and a pressure is applied between the support points la and lb by a break head 3 from above. The pressure force is applied from the side opposite to the side on which the scribe line is engraved. By applying pressure between the supporting points la and lb, a bending moment is generated in the work 2, and tensile stress is generated in the part where the scribe line is carved by this bending moment. Due to this bow I tension stress, the cracks on the scribe line propagate with the surface force toward the back surface (in FIG. 29, from bottom to top). When the crack reaches the back of the workpiece, the workpiece is divided.

However, in the conventional breaking method shown in FIG. 29, when breaking, the separated workpieces rub against each other on the back side of the workpiece, and chipping (thinning) is applied to the back side of the workpiece indicated by part A in the figure. A chipping phenomenon). Also, the pressurizing force from the break head increases. Then, it becomes a factor which gives distortion to a work.

 [0006] As a technique for solving this problem, as shown in FIG. 30, Patent Document 2 describes that “a glass substrate bonded body W formed by bonding a pair of glass substrates SI and S2 is provided for each liquid crystal cell. A glass substrate S1 with a cut-out groove formed along the dividing line S1 is placed on the spherical support head 71 with the surface facing upward, and a sufficiently flexible presser sheet 73 is mounted on this through the exhaust pipe 71b. By discharging the air in the space that accommodates the glass substrate assembly W surrounded by the presser sheet 73 and the support head surface 71a, the glass substrate assembly W is brought into close contact with the support head surface 71a that forms a spherical surface. A method of dividing the substrate SI along the notch groove is disclosed (see Patent Document 2 and Claim 1).

 [0007] Patent Document 1: Japanese Patent Laid-Open No. 9 202635

 Patent Document 2: Japanese Patent Laid-Open No. 2004-354836

 Disclosure of the invention

 Problems to be solved by the invention

[0008] However, in the breaking method described in Patent Document 2, since the presser sheet 73 is placed on the glass substrate assembly W, the elastic force of the presser sheet 73 is formed in the notch groove of the glass substrate S1. Prevent d from opening. Therefore, there is a possibility that chipping may occur due to the partial cross section of the glass substrate S1 being rubbed. Also, if the presser sheet 73 is removed, the glass substrate assembly W that has been cut apart will be separated, making it difficult to handle the glass substrate assembly W.

[0009] Accordingly, an object of the present invention is to provide a workpiece breaking method and apparatus capable of preventing occurrence of chipping due to rubbing on a divided section of a workpiece when a workpiece having a scribe line is cut. .

 Means for solving the problem

[0010] In order to solve the above-mentioned problem, the invention according to claim 1 is a work breaking method for dividing a work (5) having a scribe line on its surface along the scribe line (5c). A workpiece adhering step of attaching the back surface of the workpiece (5) to the extendable sheet (9), a sheet pulling step of pulling the sheet (9) to which the workpiece (5) is attached, and the sheet ( 9) Pull the scribe line (5c) to the back of the workpiece while pulling A dividing step, wherein the divided workpiece (5) is separated by a tensile force of the sheet (9).

 [0011] According to the present invention, since the workpiece is separated at the same time as being divided, the rubs between the divided workpieces are reduced, and the occurrence of chipping on the back surface can be prevented. In addition, by applying a tensile force to the single piece, the tensile force can assist in parting the workpiece, so it is possible to break with a smaller force. In addition, since the work is pasted on the sheet, after the work is broken, the divided work is not separated or rubbed. Therefore, handling of the workpiece becomes easy.

 [0012] The invention according to claim 2 is the workpiece breaking method according to claim 1, wherein in the workpiece dividing step, the surface side of the workpiece (5) is in a bay while the sheet (9) is pulled. The workpiece (5) is bent so as to be on the outer side of the tune, whereby the scribe line (5c) reaches the back surface of the workpiece (5).

 [0013] According to the present invention, a thick workpiece can be divided without causing chipping by using a bending moment and a tensile force in combination.

 [0014] The invention according to claim 3 is the work breaking method according to claim 1 or 2, wherein in the sheet pulling step, after the sheet (9) is pulled, around the work (5). The frame member (12) is attached to the sheet (9) with a gap, and the tension of the sheet (9) is confined in the frame member (12).

 [0015] According to the present invention, even if the tensile force is removed after the workpiece is pulled, the tensile force can be continuously applied to the workpiece.

 [0016] The invention according to claim 4 is a workpiece breaking device for cutting a workpiece (5) having a scribe line on its surface along the scribe line (5c), the workpiece (5) The sheet tension means (10, 11, 14a, 14b) that stretches the stretchable sheet (9) to which the back surface of the workpiece (9) is attached, and the surface of the workpiece (5) with the sheet (9) being pulled A workpiece dividing means (16) for bending the fork (5) so that the outer surface of the workpiece (5c) is outside the curve, thereby causing the scribe line (5c) to reach the back surface of the workpiece (5), The divided work (5) is separated by the tensile force of the sheet (9).

[0017] According to the present invention, since the workpiece is separated at the same time as being divided, It is possible to prevent the occurrence of chipping on the back surface. Also, by using bending moment and tensile force in combination, a thick workpiece can be divided without causing chipping. In addition, since the work is pasted on the sheet, after the work is broken, the divided work is not separated or rubbed. Therefore, handling of the workpiece becomes easy.

 [0018] The invention according to claim 5 is directed to the scribe and break of a work that divides the cake (5) along the scribe line (5c) while scribing the scribe line (5c) on the surface of the work (5). A method of bonding a workpiece (5) to a stretchable sheet (9); a sheet tensioning step of pulling the sheet (9) to which the workpiece (5) is bonded; and the sheet ( 9), the scribe line (5c) is inscribed on the surface of the work (5), and the scribe line (5c) on the surface of the work (5) is extended to the back surface of the work (5). And a workpiece dividing step to be reached, wherein the divided workpiece (5) is separated by a tensile force of the sheet (9).

 [0019] According to the present invention, since the work is separated at the same time as being divided, the friction between the divided works is reduced, and the occurrence of chipping on the back surface can be prevented. In addition, by applying a tensile force to the workpiece, the tensile force assists the workpiece division, so that the workpiece can be broken simultaneously with the scribe. In addition, since the workpiece is pasted on the sheet, after the workpiece is broken, the divided workpiece does not break apart or rub. Therefore, the handling of the workpiece becomes easy.

 [0020] The invention described in claim 6 is a scribing device with a break function that cuts the cake (5) along the scribe line while scoring the scribe line (5c) on the surface of the workpiece (5). A sheet pulling means (22) for pulling the stretchable sheet (9) to which the work (5) is attached, and a scribe line on the surface of the work (5) in a state where the sheet (9) is pulled. (5c) and a workpiece cutting means (20) for cutting the workpiece (5) by reaching the back surface of the workpiece (5) with the scribe line (5c) on the surface of the workpiece (5). ), And the separated workpiece (5) is separated by a tensile force of the sheet (9).

[0021] According to the present invention, since the workpiece is separated at the same time as being divided, the rubs between the divided workpieces are reduced, and the occurrence of chipping on the back surface can be prevented. Also ヮ By applying a tensile force to the workpiece, the tensile force assists the workpiece separation, so it is possible to break simultaneously with the scribe of the workpiece. In addition, since the workpiece is pasted on the sheet, after the workpiece is broken, the divided workpiece does not break apart or rub. Therefore, the handling of the workpiece becomes easy.

 [0022] The invention described in claim 7 is a method of breaking a work (51) in which a work (51) having a scribe line (52) engraved on a surface thereof is divided along the scribe line (52). A workpiece adhering step of attaching the back surface of the workpiece (51) to the sheet (53), and bringing the sheet (53) into close contact with the break table (55, 65), so that the surface of the workpiece (51) is curved. The workpiece (51) is bent so as to be on the outside, and thereby the scribe line (52) on the surface of the workpiece (51) reaches the back surface of the workpiece (51) to divide the workpiece (51). It is characterized by comprising a work dividing process.

 [0023] According to this invention, since the sheet is on the back side of the workpiece, the sheet does not prevent the workpiece from breaking by opening the scribe line on the front side of the workpiece. Therefore, it is possible to prevent the chipping from being generated by rubbing the work section. In addition, by attaching the workpiece to the sheet, the workpiece after splitting does not fall apart.

 [0024] The invention according to claim 8 is the workpiece breaking method according to claim 7, wherein in the workpiece dividing step, the workpiece (51) in which a plurality of scribe lines (52) are cut vertically and horizontally is used. A step of cutting along the semi-cylindrical break table (55) to divide the work (51) into a plurality of strips, and then the sheet (53) retracted from the break table (55). ) With respect to the break table (55), the relative rotation step of rotating 90 degrees in a plane including the sheet (53), and the work (51) divided into strips, A chip cutting step of bending again along the table (55) and cutting the workpiece (51) into a plurality of chips.

[0025] According to the present invention, a work in which scribe lines are engraved vertically and horizontally can be divided into chips that do not cause chipping. Then, the workpiece is divided in two steps using a semi-cylindrical break table. Therefore, the workpiece is curved along the break table as compared with the case where the workpiece is divided in one step using a spherical break table. At this time, the force along the scribe line becomes difficult to work, and the work section is not rubbed. [0026] The invention according to claim 9 is the workpiece breaking method according to claim 7 or 8, wherein in the workpiece dividing step, the workpiece (51) is provided by suction holes (56, 66) for sucking air. The workpiece (51) is bent along the break table (55, 65) by adsorbing the sheet (53) to which the workpiece is attached to the break table (55, 65).

 [0027] According to the present invention, the work can be curved along the break table by sucking the suction hole force air.

 [0028] The invention according to claim 10 is the workpiece breaking method according to claim 7 or 8, wherein in the workpiece dividing step, the workpiece (53) is perpendicular to the plane including the sheet (53). By moving the break table (55, 65) relative to the sheet (53) and pressing the break table (55, 65) against the sheet (53) to which the workpiece (51) is attached The workpiece (51) is curved along the break table (55, 65).

 [0029] According to the present invention, the work can be curved along the break table by pressing the sheet to which the work is attached to the break table. Also, since the tensile force is applied to each workpiece before dividing the workpiece, when the workpiece is divided, the divided workpieces tend to be separated from each other. Therefore, the work section is not rubbed.

 [0030] The invention according to claim 11 is a workpiece breaking device for cutting a workpiece (51) having a scribe line (52) engraved on a surface thereof along the scribe line (52), the workpiece (51) 51) and a work table (55, 65) to bend the sheet (53) to which the back surface of the work (51) is attached, is brought into close contact with the work table (55, 65). Sheet contact means (56, 66, 64) for bending the workpiece (51) so that the surface of the workpiece (51) is outside the curve, and the scribe line (52) on the surface of the workpiece (51) is provided. The workpiece (51) is made to reach the back surface to divide the workpiece (51).

 [0031] According to this invention, since the sheet is on the back side of the workpiece, the sheet does not prevent the workpiece from breaking by opening the scribe line on the front side of the workpiece. Therefore, it is possible to prevent the chipping from being generated by rubbing the work section. In addition, by attaching the workpiece to the sheet, the workpiece after splitting does not fall apart.

[0032] The invention described in claim 12 is the workpiece breaker according to claim 11, wherein the contact means (56, 66) is configured such that the break table (55, 65) is high, the positional force is low, Height difference in position And a plurality of suction holes (56, 66) for sucking air, and by sucking the sheet (53) through the suction holes (56, 66), the workpiece (51) is It is characterized by being in close contact with the break table (55, 65).

[0033] According to the present invention, the work can be brought into close contact with the break table in order toward the position where the high position force of the break table is low. Since the high position force of the work is divided in order toward the low position, it is possible to prevent the cross section of the work from rubbing and chipping.

 [0034] The invention described in claim 13 is the workpiece breaker according to claim 12, wherein the contact means further supplies air in order to the suction holes (56, 66) at a position with a high position force and a low position. A plurality of solenoid valves (63) for suction are provided.

 [0035] According to the present invention, the workpiece is high !, the position force is low !, and the workpiece can be securely brought into close contact with the brake table toward the position.

 [0036] The invention according to claim 14 is the workpiece breaker according to claim 11, wherein the contact means is disposed so as to sandwich the break table (55, 65), and the sheet (53) A seat fixing base (64) for holding the end of the sheet base, and the break base (55, 65) relative to the sheet fixing base (64) in a direction perpendicular to a plane including the seat (53). A pressing mechanism for moving the workpiece (51), and the workpiece (51) is pressed against the break table (55, 65) by pressing the sheet (53) to which the workpiece (51) is adhered. (55,65) characterized by a curve.

 [0037] According to the present invention, the work can be curved along the break table by pressing the sheet to which the work is attached to the break table. Also, since the tensile force is applied to each workpiece before dividing the workpiece, when the workpiece is divided, the divided workpieces tend to be separated from each other. Therefore, the work section is not rubbed.

[0038] The invention of claim 15 is the workpiece breaker according to any one of claims 11 to 14, wherein the breaker has a plurality of scribe lines carved vertically and horizontally. Is bent along a semi-cylindrical break table (55), the work (51) is divided into a plurality of strips, and then the sheet (53) retracted from the break table (55) Relative to the break table (55) by 90 degrees relative to the plane including the seat (53). Then, the work (51) divided into strips is bent again along the break table (55) to divide the work (51) into a plurality of chips.

[0039] According to the present invention, a work in which scribe lines are engraved vertically and horizontally can be divided into chips that do not cause chipping. Then, the workpiece is divided in two steps using a semi-cylindrical break table. Therefore, the workpiece is curved along the break table as compared with the case where the workpiece is divided in one step using a spherical break table. At this time, the force along the scribe line becomes difficult to work, and the work section is not rubbed.

 The invention's effect

 [0040] According to the inventions of the first to fifteenth aspects, when cutting a work on which a scribe line is cut, it is possible to prevent occurrence of chipping due to rubbing on a divided cross section of the work. Brief Description of Drawings

 [0041] FIG. 1 is a principle diagram of a work breaking method according to a first embodiment of the present invention.

 [Figure 2] Diagram showing bending stress generated by bending moment

 FIG. 3 is a principle diagram of a work breaking method according to a second embodiment of the present invention.

 [Fig.4] Schematic diagram of a method of applying tensile force to a workpiece using a sheet

 FIG. 5 is a perspective view showing the breaking device according to the first embodiment of the present invention.

 [Fig. 6] Perspective view showing a tensioning mechanism for applying a tensile force to the workpiece

 [Fig. 7] A diagram showing cracks generated by the break device ((A) in the figure shows the case where the break device of this embodiment is used, and (B) in the figure uses a conventional break device as a comparative example) Show the case)

 FIG. 8 is a perspective view showing a scribing device with a break function according to a second embodiment of the present invention.

 [Fig. 9] A diagram showing the scribing device with a break function shown in Fig. 8 ((A) shows a plan view and (B) shows a side view).

 FIG. 10 is a diagram showing cracks generated by the scribing device with a break function shown in FIG. 8 ((A) in the figure shows the case where the scribing device of this embodiment is used, and (B) in the figure is a conventional example as a comparative example) Shows the case of using the scribe device of

FIG. 11 is a perspective view showing a scribing device with a break function according to a third embodiment of the present invention. FIG. 12 is a diagram showing cracks generated by the scribe device with a break function shown in FIG. 11 ((A) in the figure shows the case where the scribe device with a break function of the present embodiment is used)

(B) shows the case where a conventional scribing device is used as a comparative example.)

 [Figure 14] Photograph showing the sheet tension using the prototype jig

圆 15] Photo showing silicon wafer splitting in the expanded state

 [Fig.16] Diagram of cross-scribing (D-650)

圆 17] Photograph showing the surface properties (D—675) of the workpiece after cutting

圆 18] Perspective view showing the breaking device in the fourth embodiment of the present invention

圆 19] Cross-sectional view showing a state where the workpiece is affixed to the sheet ((A) in the figure shows the state before the workpiece is bent, and (B) shows the state in which the workpiece is bent)

 [Figure 20] Plan view of semi-cylindrical break table

 [Fig.21] Bottom view of break table of Fig.20

[22] Perspective view showing an example in which a stretchable sheet is pulled in a state where a workpiece is attached to the sheet.

 FIG. 23 is a plan view showing another example of suction holes formed in the break table.

[24] Perspective view showing an example of a break table enclosed in a box

[25] Perspective view showing an example in which a solenoid valve is provided in the suction path

[26] Perspective view showing the breaking device in the fifth embodiment of the present invention ((A) in the figure shows the state before pushing up the sheet, and (B) in the figure shows the stage where the sheet is pushed up) 27] Side view showing spherical break table

[Fig.28] Plan view showing a spherical break table

[Fig.29] Principle of conventional break method

 FIG. 30 is a cross-sectional view showing a conventional break device ((A) in the figure shows before the workpiece is sucked, and (B) in the figure shows after the workpiece is sucked).

Explanation of symbols

5 ... Work 5c ... scribe line

 5d ... crack

 9 ... Sheet

 10, 11… Expanding jig with fixed and moving side force (sheet pulling means)

14a, 14b-- 'Tensioning mechanism that provides stage force (sheet pulling means)

 12 ... Ring (frame member)

 16 ··· Break head (work cutting means)

 20 ·· 'Scribe head (work cutting means)

 22 ··· Clamping jig (sheet pulling means)

 P: Tensile force

 M ... Bending moment

 51 Work

 52 .. scribe line

 53 ··· Sheet

 55, 65 ... Break table

 56, 66 ··· Suction hole (sheet contact means)

 63 ... Solenoid valve

 64 ··· Sheet fixing base (sheet contact means)

 BEST MODE FOR CARRYING OUT THE INVENTION

 FIG. 1 shows a principle diagram of a work breaking method according to the first embodiment of the present invention.

 On the surface of a plate-like workpiece such as a semiconductor wafer or glass, a scribe line is engraved by a scribing device. The scribing device presses a pointed point or a freely rotating thin disk (wheel) as a cutter against the surface of the workpiece, and moves the cutter along the surface of the workpiece to engrave the scribe line on the surface of the workpiece. .

 [0044] After scribing a scribe line on the surface of the workpiece, the workpiece 5 is set on the breaking device.

The breaking device gives a bending moment to the workpiece 5 so that the side 5a on which the scribe line is engraved is outside the curve. Specifically, a workpiece 5 is placed between two support points 6a and 6b (table), and an upward force and pressure are applied to the workpiece 5 between the support points 6a and 6b by the break head 7. Yeah. The pressure force is also applied to the opposite side of the scribe line 5a. By applying pressure between the support points 6a and 6b, a bending moment is generated in the workpiece 5, and tensile stress is generated as bending stress in the portion where the scribe line is engraved by this bending moment. Due to the tensile stress, the crack propagates from the surface force toward the back surface (in this figure, from bottom to top).

 [0045] At the same time that a bending moment is applied to the workpiece 5, a tensile force P is applied to the workpiece 5 in a direction perpendicular to the scribe line. By applying a pulling force P to the workpiece 5, the workpiece 5 is pulled away at the same time as being divided, so the friction between the divided workpieces 5 is reduced and chipping occurs on the back surface (opposite side of the scribe side). Can be suppressed. In addition, by applying a tensile force P to the workpiece 5, the tensile force P assists the workpiece division, so that the workpiece 5 can be broken with a smaller pressure of the break head 7.

 [0046] When the workpiece 5 can be broken only by applying a tensile force to the workpiece 5, the bending moment may not be applied to the workpiece 5. Even when a bending moment is applied to the workpiece 5, a break roller can be used instead of the break head 7, or a linearly extending projection is formed on the table, and suction is performed to suck the workpiece onto the tables on both sides of the projection. An apparatus may be provided, and the workpiece may be curved with the protrusion as a vertex.

 FIG. 2 shows the bending stress generated by the bending moment. When bending moment M is applied to workpiece 5, bending stress σ is generated in workpiece due to bending moment M. The distribution of the bending stress σ is shown in the figure, and tensile stress is generated below the neutral axis 5e, and compressive stress is generated above. The compressive stress σ generated on the upper side of the workpiece 5 causes the workpiece 5 to rub. Even if the tensile force Ρ applied to the workpiece is smaller than the compressive stress σ, the workpiece 5 can be pulled away at the same time as it is divided, so the friction of the workpiece 5 can be reduced. If the tensile force ワ ー ク of the workpiece 5 is increased above the compressive stress σ generated on the upper side of the workpiece 5 due to the bending moment Μ, the compressive stress is not generated in the workpiece 5, which causes the workpiece 5 to rub. Can be eliminated.

 FIG. 3 shows a principle diagram of a work breaking method according to the second embodiment of the present invention.

In this embodiment, the work 5 is broken by applying a tensile force に to the work 5 in a direction perpendicular to the scribe line while scribing a scribe line on the surface of the work 5. That is, this In this embodiment, the scribing process for marking a scribe line on the work 5 and the breaking process for dividing the work are performed simultaneously.

 [0049] By applying a tensile force P to the workpiece 5 while scribing a scribe line on the workpiece 5, the crack 5d advances in the thickness direction of the workpiece (from top to bottom in Fig. 3). When the crack 5d reaches the back surface 5b, the work 5 is broken. Also, by applying a tensile force to the workpiece 5, the workpiece 5 is pulled away at the same time as being divided, so that the divided workpiece 5 is less rubbed and it is possible to suppress the occurrence of chipping on the back surface 5b of the workpiece 5. .

 [0050] When the thickness of the workpiece 5 is large, the crack may not propagate to the back surface 5b only by applying a tensile force to the workpiece 5. In this case, a tensile force is applied, and a bending moment is applied to the workpiece 5 so that the side 5a on which the scribe line is engraved is outside the curve.

 FIG. 4 shows a principle diagram of a method for applying a tensile force to the workpiece 5 using the sheet 9. Figure 4

 As shown in (A), the workpiece 5 is attached to the extendable sheet 9. The sheet 9 has been previously given adhesiveness. Both ends of the sheet 9 are clamped to an expanding jig composed of, for example, a fixed side 10 and a movable side 11 movable with respect to the fixed side 10 as sheet pulling means. With the workpiece 5 attached to the sheet 9, the movable side 11 of the expanding jig is moved to pull the sheet 9 in a predetermined direction and apply a tensile force (tension) to the sheet 9. In this example, the force shown in the example in which the workpiece 5 is pulled only in the X direction is not limited to the X direction. The X direction and the Y direction perpendicular to the X direction may be pulled.

 Next, as shown in FIG. 4 (B), a ring 12 as a frame member is stuck around the work 5 while holding the tension, and the sheet outside the ring 12 is cut. Fig. 4 (C) shows a state in which the sheet outside the ring 12 is cut. There is a gap between the periphery of the workpiece 5 and the ring 12, and the tension is confined in the seat 9 between the workpiece 5 and the ring 12. On the other hand, since the workpiece 5 is stretched on the sheet 9 before the tension is applied, the portion of the sheet 9 to which the workpiece 5 is attached is not tensioned.

[0053] Next, the work 5 to which tension is applied is transferred to the break device or the scribe device with a break function, and the work 5 is broken by the break device or the scribe device with the break function as shown in Fig. 4 (D). To do. Since tension is applied to the workpiece 5, the workpieces 5 are separated from each other at the same time as the division, and a gap is left between the workpieces 5. Finally by UV irradiation etc. Then, the adhesiveness of the sheet 9 is removed, and the work 5 is peeled off from the sheet 9.

 The method for applying tension to the workpiece 5 by the sheet 9 as described above can be suitably used for a semiconductor wafer having a small size of the workpiece 5.

 [0055] A work 5 break method and break device for realizing the above break principle will be described. FIG. 5 shows a breaking device according to the first embodiment of the present invention. In the table 23 of the break device, the work 5 is set with the surface of the work 5 on which the scribe line 5c is engraved facing down. A bar-shaped break head 16 extending in the direction of the scribe line 5c is disposed immediately above the scribe line 5c as a work dividing means. The breaking device also presses the break head 16 with the upper surface force of the workpiece 5 to bend the workpiece 5 so that the side on which the scribe line is engraved is on the outside.

 [0056] (Work bonding process' Sheet pulling process)

 The workpiece 5 having the scribe line 5c engraved on the front surface is attached to a sheet 9 whose back surface can be expanded and contracted. Then, the sheet 9 to which the workpiece 5 is attached is pulled so that the tensile force P can be applied to the workpiece 5. FIG. 6 shows a tension applying mechanism as a sheet pulling means for applying a tensile force to the work 5. The workpiece 5 is attached to the sheet 9, and the sheet 9 is fixed to the pair of stages 14a and 14b by vacuum or the like. Thereafter, the stages 14a and 14b are moved in opposite directions, and the sheet 9 is pulled. Both stages 14a and 14b may be moved in opposite directions, or one stage 14a may be fixed and only the remaining one stage 14b may be moved. In addition to this, as shown in FIG. 9, the workpiece 5 may be attached to the sheet 9, and then the sheet 9 may be pulled with a clamping jig 22 that clamps both ends of the sheet 9. In addition, two sets of force tensioning mechanisms that apply tensile force only to the X direction of the workpiece may be provided, and tensile force may be applied in the X and Y directions perpendicular to each other. Of course, the ring 12 shown in Fig. 4 may be used.

 [0057] (Work cutting process)

As shown in FIG. 5, in a state where the sheet 9 is pulled, the workpiece 5 is bent so that the surface side of the workpiece 5 is outside the curve by the break head 16 as the workpiece dividing means. Then, the work 5 is bent so that the scribe line 5 c on the surface of the work 5 reaches the back surface of the work 5. Fig. 7 (A) shows the crack 5d generated in the workpiece 5. Pull on workpiece 5 Since the crack 5d can be developed by applying the force P, the work 5 can be broken with a small pressure from the break head 16. In addition, since the workpieces 5 are separated after being divided, it is possible to suppress the occurrence of chipping on the workpiece edge, and it is possible to break without applying an extra load (damage) to the divided section. Fig. 7 (B) shows a comparative example when no tensile force is applied to workpiece 5. If no tensile force is applied to workpiece 5, there is no escape in the horizontal direction, so when the break head 16 is pressed against workpiece 5, chipping occurs on part A on the back, and the sectional surface of workpiece 5 is also rubbed and damaged. I will receive it. If the workpiece is thin, it can be cut only with the pulling force P without applying a bending moment M. In this case, the break head 16 that gives the bending moment M becomes unnecessary.

 8 and 9 show a scribing device with a break function according to the second embodiment of the present invention. Fig. 8 shows a perspective view of the scribing device with a breaking function, Fig. 9 (A) shows a plan view of the scribing device with a breaking function, and Fig. 9 (B) shows a side view of the scribing device with a breaking function. This scribing device with a break function performs a scribing process and a breaking process at the same time. A scribing head 20 (work cutting means) having a table 18 for supporting the work 5, a cutter 19 in contact with the work 5, and a scribing head. And a moving mechanism 21 for moving 20 linearly. The scribe head 20 is provided with a vibrator such as a magnetostrictive vibrator or a piezoelectric element. The magnetostrictive vibrator is vibrated by the current of the transmitter force, and the cutter 19 is vibrated by this vibrator. When the cutter 19 is vibrated, an impact force is applied from the cutter 19 to the work 5, so that a crack develops in the thickness direction of the work 5. The moving mechanism 21 for moving the scribe head 20 is a known moving mechanism such as a ball screw mechanism. When the cutter 19 in contact with the workpiece is moved, the scribe wire 5c is cut on the surface of the workpiece 5.

 [0059] (Work bonding process' Sheet pulling process)

The workpiece 5 having the scribe line 5c engraved on the front surface is attached to a sheet 9 whose back surface can be expanded and contracted. Then, the sheet 9 to which the workpiece 5 is attached is pulled so that the tensile force P can be applied to the workpiece 5. That is, as shown in FIG. 9, the workpiece 5 is attached to the sheet 9, and then the sheet 9 is pulled with a clamping jig 22 that clamps both ends of the sheet 9. Of course, instead of the clamping jig 22, a tension applying mechanism shown in FIG. 9 may be pulled.

 [0060] (Work cutting process)

 As shown in Fig. 8, while the sheet 9 is pulled, the scribe line 5c is engraved on the surface of the work 5 by the scribe head 20 as a work dividing means, and the scribe line 5c on the surface of the work 5 is attached to the work 5 To reach the back of the. Figure 10 (A) shows the crack 5d. By applying a tensile force P to the workpiece 5, the vertical crack 5d generated by the cutter 19 of the scribe head 20 can be further grown, and finally a full cut is also possible. By applying a tensile force P to the workpiece 5, a large vertical crack 5d can be formed even when the load from the cutter 19 is low. In addition, since the escape space for the vertical crack 5d is created, no extra load (damage) is applied to the dividing plane. Fig. 10 (B) shows a comparative example in which tensile force P is not applied to workpiece 5. If the tensile force P is not applied to the workpiece 5, the vertical crack 5d is difficult to grow and there is no escape space for the vertical crack 5d, so an extra load (damage) is applied to the sectional surface of the workpiece 5. When the load of the cutter 19 is increased to form a long vertical crack 5d, a large load is applied to the divided section, and the quality of the divided product's fracture strength is reduced.

 FIG. 11 shows a scribing device with a break function according to the third embodiment of the present invention. A feature of this embodiment is that a bending moment M is applied to the workpiece in the scribing device with a break function of the second embodiment. The bending moment M is applied so that the side on which the scribe line 5c is engraved is outside the curve. When the thickness of the workpiece 5 is increased, the workpiece cannot be divided only by applying the tensile force P. Therefore, a bending moment M is also applied to the workpiece 5 to make it easy to divide the workpiece. The method of giving a bending moment to the workpiece includes a method of giving a bending moment by three-point bending, a method of tilting one of a pair of tables holding the workpiece with respect to the scribe line to the other by a predetermined angle, A system is used in which one of a pair of clamping devices that hold a workpiece with a scribe line as a boundary is inclined with respect to the other by a predetermined angle. Since the scribing head 20 and the moving mechanism 21 are the same as those of the scribing apparatus of the second embodiment, the same reference numerals are given and description thereof is omitted.

[0062] Fig. 12 (A) is generated when the scribing device with a break function of the third embodiment is used. Indicates a crack that is born. By applying a tensile force P and bending moment M to the workpiece 5, the vertical crack 5d generated by the scribing device can be further grown, and finally full cutting is also possible. Fig. 12 (B) shows a comparative example in which tensile force Ρ and bending moment M are not applied to workpiece 5. When the tensile force 'bending moment is not applied to the workpiece 5, the vertical crack 5d is difficult to grow and there is no escape space for the vertical crack 5d, so an extra load (damage) is applied to the dividing surface of the workpiece 5. Increasing the load of the force tutter 19 to form long vertical cracks also applies a large load to the section, which reduces the quality of the product that is broken.

 Example

[0063] (1) Device overview

 In order to investigate the effect of the expand, a test jig with only the expand mechanism was made (Fig. 13). External dimensions are 410mm x 450mm. With this test jig, it is possible to apply tension to the sheet only in the X direction and in the combined direction of the Χ and Υ directions. The sheet clamp is combined with a grooved plate and fixed with screws. This grooved plate can clamp the full width of the sheet. Adjust the tension with the “Tension” screw in the figure while observing the scale.

[0064] (2) Overview of expanding sheet

 The dicing tape used is D-650 and expanding tape D-675 (manufactured by Adwill, width 300m, thickness 80m), which are generally used when dicing silicon wafers. Cut to an appropriate length and used.

[0065] (3) Effects of expanding in the wake break

 Silicon wafer was affixed on dicing tape (D-675) and pulled 15mm each in X and Y directions. When the workpiece was pulled only in the sheet pulling direction (X direction), the sheet tensioned in the sheet pulling direction (X direction) and in the orthogonal direction (Y direction) (Fig. 14 (a)), but the same distance in the orthogonal direction. When expanded, no wrinkles were seen (Fig. 14 (b)).

When the work was divided (split), a gap was created where it was cut (Fig. 15). The gap was about 340 m. The gap that was divided and opened showed a tendency to gradually spread over time, and after several hours, when another part was newly divided, the gap was narrower than the previous opening width. It was confirmed that

 [0066] (4) In case of cross-scribe work

 The effect of the expansion was examined on the cross-scribed work. Both expansion distances are 15mm. As a result of splitting (hand splitting) in the X direction (Fig. 16), the scribe line was disconnected, but there was a gap at the split location. Similarly, there was a gap in the cross direction, and the width was wider than that of the first part. The order of expansion is considered to be affecting. When the ring was removed from the seat and left for several hours, the gap shrunk but never became zero.

 [0067] (5) Dicing tape D—675

 An expanding break test was conducted by changing the dicing tape material to D-675 for expanding. The expansion distance was 20 mm in both X and Y directions. As a result of the split, the tension was released at the split point in both directions, and a gap appeared. The width of the gap in the tension direction is slightly narrower in the Y direction, which is wider in the X direction as in the previous D-650 tape. Since vertical cracks due to scribing are shallow and the effect of splitting by hand is large, the score line is often out of position. When the score line position could be divided, it was divided in a straight line, no large chipping was seen at the edge, and no force was observed on the workpiece surface after the division (Fig. 17). The split surface properties are not good because of splitting, but the perpendicularity is almost good.

 [0068] (6) Summary

 The results obtained within this study are summarized below.

 It was confirmed that dicing tape that was used in the past could be expanded sufficiently. At the same time as the work was divided, a gap was created at the part where it was divided.

 When expanding with cloth, the tension seems to change in the order of pulling (X, Y), but the effect of expanding was seen in either direction.

 Since the workpieces were not rubbed immediately after the break and during the transfer, no chipping occurred, and no adhesion of particles to the silicon surface was observed.

In the scribe test, it is considered that the effect of the expand can be obtained sufficiently, so it is considered that a high-quality break is possible. [0069] Hereinafter, a breaking device according to a fourth embodiment of the present invention will be described. 18 to 21 show a breaking device according to a fourth embodiment of the present invention. As shown in FIG. 18, the thin plate semiconductor wafer as the work 51 is engraved with grid-like scribe lines 52 vertically and horizontally by a scriber. The scribe line 52 is formed by, for example, pressing a pointed pyramid tool (point) or a freely rotating thin disk (wheel) against the surface of the workpiece and moving these tools along the surface of the workpiece 51. A scribe line 52 is engraved on the surface of the work 51. When moving the tool along the workpiece 51, the tool may be vibrated.

 [0070] (Work bonding process)

 After engraving the scribe line 52 on the surface of the work 51, as shown in Fig. 19 (A), the side of the work 51 where the scribe line 52 is engraved is the front side, and the back side of the work 51 is sealed. Paste to G 53. The sheet 53 is made of an adhesive resin. For example, the same sheet as a transfer sheet to which a chip-shaped semiconductor wafer is attached during transfer is used. In the breaking device of the fourth embodiment, unlike the breaking device of the first embodiment, a tensile force may be applied to the sheet 53 or may not be applied.

 As shown in FIG. 18, the workpiece 51 attached to the sheet 53 is placed on the middle / high break table 55 with the sheet 53 on the back side. The break table 55 has a semi-cylindrical shape, and a plurality of suction holes 56 are formed on the surface as sheet contact means. The suction hole 56 is connected to a suction path 57, and the suction path 57 finally communicates with one suction port 58. In FIG. 18, the suction hole 56 in the central portion of the break table 55 is omitted. Actually, a plurality of suction holes 56 are provided in the circumferential direction of the break table 55. A vacuum pump (not shown) is connected to the suction port 58, and air is sucked from the suction port 58.

FIG. 20 shows a plan view of the semi-cylindrical break table 55, and FIG. 21 shows a back view. The plurality of suction holes 56 are arranged at the highest part of the break table 55 (on the line hi), and in addition to the highest part of the break table 55, the height is increased toward the position where the highest part force is low (line h2). Multiple columns are arranged with a difference. In FIG. 20, the horizontal rows are the suction holes 56 having the same height. In the figure, Wl and W2 indicate the planar shapes of circular workpieces of different sizes. The suction holes 56 are arranged so as to suck only the sheet 53 while avoiding the periphery of the work 51 or the lower surface of the work 51. The suction holes 56 in the lower row are arranged in a larger number than in the higher row. These suction holes 56 are connected to suction grooves 59 formed on the back surface of the break table 55. As shown in FIG. 21, the suction groove 59 extends in the vertical direction and the horizontal direction, and is finally connected to the suction port 58. The break table 55 is placed on a base having a flat surface (not shown), and a space between the surface of the base and the suction groove 59 of the break table serves as a passage for sucking air.

[0073] (Work cutting process)

 After placing the sheet 53 with the workpiece 51 on the break table 55 and sucking the air from the suction port 58, the suction hole 56 connected to the suction port 58 sucks air, and the sheet 53 is moved to the break table. Adheres to 55. The smaller the distance between the seat 53 and the break table 55, the easier the pressure slips. Therefore, the higher position force of the break table 55 naturally goes to the lower position, that is, from the center of the work 51 to both ends. The sheets 53 are in close contact with the break table 55 in order. When the sheet 53 comes into close contact with the break table 55, the workpiece 51 attached to the sheet 53 also moves along the break table 55 so that the scribe line 52 is outside the curve as shown in FIG. Bend. Then, a bending moment is generated in the workpiece 51, and tensile stress is generated on the side of the workpiece 51 where the scribe line 52 is engraved. Due to this tensile stress, the crack 54 advances toward the back surface force of the work 51 and the work 51 is divided. Here, the workpiece 51 is divided when the workpiece 51 is curved along the break table 55. Therefore, the workpiece 51 is gradually divided from the central portion toward the both ends (in FIG. 18, the maximum force of the semi-cylindrical break table 55 is also generated along the scribe line 52 from side to side. ).

 The reason why the sheet 53 is placed on the back side of the work 51 is to facilitate the progress of the crack 54 to the work 51 as shown in FIG. If the sheet 53 is pasted on the front side of the work 51, the sheet 53 prevents the groove of the scribe line 52 from being opened by its elastic force, so that it is difficult to break. Further, by making the break table 55 into a semi-cylindrical shape and arranging the scribe line 52 of the workpiece 51 in parallel with the center line 55a of the break table, stress acts in the normal direction of the curved workpiece 51. For this reason, it can be prevented that the cross section of the work 51 is rubbed and chipping occurs.

[0075] In the above dividing step, only the vertical direction of the scribe lines 52 in the vertical direction and the horizontal direction is cut. In other words, the work 51 is divided only by the scribe line 52 parallel to the center line 55a of the break table 55. The work 51 is divided into strips on the sheet 53 at the stage where the vertical and horizontal divisions are finished (the strip cutting process). Next, suction by the suction hole 56 is released, and the sheet 53 is retracted from the break table 55. Then, either the sheet 53 or the break table 55 is rotated 90 degrees in a plane including the sheet 53, for example, a horizontal plane (relative rotation process). Then, the remaining one of the vertical and horizontal scribe lines 52 becomes parallel to the center line 55a of the break table 55. Then, air is again sucked from the suction holes 56, and the workpiece 51 divided into strips is bent again along the break table 55 to divide the workpiece 51 into a plurality of chips (chip cutting step). By dividing the work cutting process into a strip cutting process and a chip cutting process, the work 51 in which scribe lines are engraved vertically and horizontally can be divided into chips that do not cause chipping.

 FIG. 22 shows an example in which the stretchable sheet 53 is pulled in a state where the workpiece 51 is attached to the sheet 53. If a tensile force is applied to the workpiece 51 when the workpiece 51 is divided, the workpieces 51 are separated at the same time as the workpiece 51 is divided, and a gap is left between the workpieces 51. Can be prevented. Therefore, as shown in FIG. 22, before the work 51 is divided, a tensile force may be applied to the stretchable sheet 53 with the work 51 attached to the sheet 53. Specifically, the periphery of the sheet 53 is pulled in the X direction and the Y direction, and a tensile force (tension t) is applied to the sheet 53 in the X direction and the Y direction. The frame member 60 is pasted around the work 51 while maintaining the tension t. A space is provided between the periphery of the work 51 and the frame member 60, and the tension is confined in the sheet 53 exposed around the work 51. When applying a tensile force to the work 51, it is desirable that the suction hole 56 be disposed at a position where only the sheet 53 is sucked away from the lower surface of the work 51. This is because if the suction holes 56 are arranged on the lower surface of the workpiece 51, the workpieces 51 that are separated by the tensile force of the sticking force sheet 53 are separated from each other, but the workpieces 51 are not easily separated by the suction of the suction holes 56. Because.

[0077] By the way, there has been no conventional breaker that can divide a semiconductor wafer in which vertical and horizontal scribe lines 52 are engraved into chips. This is because when the workpiece 51 is processed into a strip, the remaining scribe lines 52 do not line up on the straight line. In the division by the blade Alignment is indispensable, and accuracy is required for the positional relationship between the scribe line 52 and the blade and its receiving blade. However, when the work 51 is rotated 90 degrees, the blade cannot be dropped along the scribe line and chip formation is possible. It becomes impossible. However, in the present embodiment, the scribe line 52 is not required to be on a straight line, either in a strip cutting process in which the workpiece 51 is easily cut into strips, or in a chip cutting process in which the workpiece 51 is rotated by 90 degrees. Therefore, chipping is possible.

 FIG. 23 shows another example of the suction hole 56 formed in the break table 55. In this example, a groove 61 extending in a direction parallel to the center line 55 a of the break table 55 is formed on the surface of the break table 55. The suction holes 56 are connected to the grooves 61, and a row of suction holes 56 are grouped by the grooves 61. If the suction holes 56 are grouped by the grooves 61, the workpieces 51 can be sucked evenly in the direction of the center line of the break table 55. Further, as shown in FIG. 24, it is also effective to enclose the periphery of the break table 55 with a box 62 in order to make the adsorption of the sheet 53 to the break table 55 stronger.

 FIG. 25 shows an example in which a plurality of electromagnetic valves 63 are provided in the suction path 57 in order to suck air into the suction holes 56 in a position with a high position force and a low position in order. The plurality of suction holes 56 are arranged up to the lower left and right positions as well. A plurality of suction paths 57 are provided according to the height of the suction holes 56, and a plurality of suction holes 56 having the same height are connected to one suction path 57. Each suction path 57 is provided with an electromagnetic valve 63. The electromagnetic valve 63 is opened in order from the suction path 57 connected to the suction hole 56 at the higher position to the suction path connected to the suction hole 56 at the lower position. For example, as shown in FIG. 25, the solenoid valve 63 opens in order of 1, 2, 3,. When the solenoid valve 63 is provided, the work 51 can be brought into close contact with the break table 55 in the order that the central force of the work 51 is also directed outwardly and surely visually.

FIG. 26 shows a breaking device according to the fifth embodiment of the present invention. In this embodiment, the sheet contact means for bringing the sheet 53 into close contact with the break table 55 is composed of the sheet fixing table 14 and the sheet pressing mechanism. That is, as shown in FIG. 26 (A), a pair of sheet fixing bases 14 are arranged with the break base 55 interposed therebetween, and both ends of the sheet 53 are clamped by the sheet fixing bases 14. Then, as shown in FIG. 26 (B), the break table 55 is raised from below to the sheet 53 by the pressing mechanism, and the sheet 53 is brought into close contact with the break table 55. Push A known uniaxial moving mechanism such as a ball screw is used for the mechanism. Since the movement of the break table 55 relative to the seat 53 is relative, the seat fixing table 14 may be pushed down instead of lifting the break table 55.

 The sheet 53 is pressed against the break table 55 by the push-up of the break table 55, and is curved along the surface of the break table 55. When the sheet 53 is brought into close contact with the break table 55, the work 51 attached to the sheet 53 is also curved along the break table 55. Since the work 51 is divided when the work 51 is curved along the break table 55, the work 51 is gradually divided from the center toward both ends, and the divided work 51 is sequentially broken. Adhere closely. Thus, the work 51 is divided into strips. After dividing the work 51 into strips, the break table 55 is retracted downward from the sheet 53 and both ends of the sheet 53 are removed from the sheet fixing table 14. Next, after the sheet 53 is rotated 90 degrees in the horizontal plane, the sheet 53 is held on the seat fixing base 14 again. Of course, instead of replacing the seat 53 with the seat fixing base 14, a rotation mechanism for rotating the break base 55 90 degrees in the horizontal plane may be provided. Finally, the work table 51, which is divided into strips by raising the break table 55 again, is divided into chips.

 According to the breaking device of the fifth embodiment, the sheet 53 can be brought into close contact with the breaking table 55 without providing the suction holes 56 in the breaking table 55. Also, when the sheet 53 is pushed up by the break table 55, the tensile force acts naturally on the sheet 53, so that it is possible to prevent the divided sections of the divided workpieces 51 from rubbing.

 FIG. 27 and FIG. 28 show another example of the break table 65. 27 shows a side view of the break table 65, and FIG. 28 shows a side view of the break table 65, respectively. When the work 51 is uniformly divided into chips, the break table 65 may be formed on a part of a spherical surface as in this example. In this case, in the plan view of the break table shown in FIG. 28, the suction holes 66 are arranged on a concentric circle with the highest part C of the break table 65 as the center. The suction hole 66 is connected to a suction path 67, and the suction path 67 communicates with one suction port 68. When air is sucked from the suction holes 66, the central force of the work 51 is also directed toward the outer peripheral side, so that the work 51 can be brought into close contact with the break table 65 in order.

Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, a thin glass instead of a semiconductor wafer is used for the workpiece. A substrate may be used. Further, in the work bonding step, the work may be pasted on the sheet after the scribe line is cut on the work, or the scribe line may be cut on the work after the work is attached on the sheet. Further, the semi-cylindrical break table may be semi-cylindrical.

 This specification is based on Japanese Patent Application No. 2005-000554 filed on January 5, 2005, Japanese Patent Application No. 2005-146551 filed on May 19, 2005, and Japanese Patent Application No. 2005-373460 filed on December 26, 2005. All this content is included here.

Claims

The scope of the claims  [1] A work break method for dividing a work having a scribe line on its surface along the scribe line.  A workpiece bonding step of pasting the back surface of the workpiece on a stretchable sheet; and a sheet tensioning step of pulling the sheet on which the workpiece is pasted;  A workpiece dividing step of allowing the scribe line to reach the back surface of the workpiece while the sheet is pulled; and  A breaking method for a cake, wherein the divided work is separated by a tensile force of the sheet.  [2] In the workpiece dividing step,  2. The workpiece according to claim 1, wherein the workpiece is bent so that the surface side of the workpiece is outside the curve in a state where the sheet is pulled, thereby causing the scribe line to reach the back surface of the workpiece. How to break your work. [3] In the sheet pulling step,  The workpiece according to claim 1, wherein after pulling the sheet, a frame member is attached to the sheet with a gap around the workpiece, and the tension of the sheet is confined in the frame member. Break method. [4] A workpiece breaker for cutting a workpiece with a scribe line on the surface, along the scribe line.  Sheet pulling means for pulling the stretchable sheet to which the back surface of the workpiece is attached; and in a state where the sheet is pulled, the workpiece is bent so that the surface of the workpiece is outside the curve, thereby A hook dividing means for allowing the scribe line to reach the back surface of the workpiece,  The breaking device for a break, wherein the divided work is separated by a tensile force of the sheet.  [5] A method of scribing and breaking a workpiece, in which the workpiece is cut along the scribe line while scribing the scribe line on the surface of the workpiece, A work bonding process for attaching a work to an extendable sheet; A sheet pulling step of pulling the sheet to which the workpiece is attached; and a scribe line on the surface of the workpiece in a state where the sheet is pulled, and the scribe line on the surface of the workpiece is A workpiece dividing step for reaching the back surface,  A single scribing and breaking method, wherein the divided work is separated by a tensile force of the sheet.  [6] A break device with a scribe function that cuts a workpiece along a scribe line while scribing a scribe line on the surface of the workpiece.  A sheet pulling means for pulling the stretchable sheet to which the workpiece is attached; and a scribe line on the surface of the workpiece while the sheet is pulled, and the scribe line on the surface of the workpiece is A workpiece dividing means for dividing the workpiece by reaching the back surface of the workpiece,  A scribing device with a break function, wherein the divided work is separated by a tensile force of the sheet. [7] A method of breaking a work in which a work having a scribe line engraved on a surface is divided along the scribe line.  A workpiece bonding step of attaching the back surface of the workpiece to a sheet;  The sheet is brought into close contact with a break table, and the workpiece is bent so that the surface of the workpiece is outside the curve, thereby causing the scribe line on the surface of the workpiece to reach the back surface of the workpiece. A work breaking method comprising: a work dividing step for dividing a work. [8] The workpiece dividing step includes:  A strip cutting step of curving the workpiece, in which a plurality of scribe lines are engraved vertically and horizontally, along a semi-cylindrical break table, and dividing the workpiece into a plurality of strips, and then retracting from the break table. A relative rotation step of rotating the sheet relative to the break table by 90 degrees in a plane including the sheet; 8. A chip dividing step of bending the workpiece divided into strips along the break table again to divide the workpiece into a plurality of chips. Breaking method of work described in 2.  [9] In the work dividing step, the work is curved along the break table by sucking the sheet to which the work is attached to the break table through a suction hole for sucking air. The work breaking method according to claim 7 or 8.  [10] In the workpiece dividing step, the break table is moved relative to the sheet in a direction perpendicular to a plane including the sheet, and the workpiece is attached to the break table. 9. The work breaking method according to claim 7 or 8, wherein the work is bent along the break table by being pressed against the work piece.  [11] A work break device for cutting a work having a scribe line engraved on the surface along the scribe line,  A break table for bending the workpiece;  Sheet adhering means for adhering a sheet to which the back surface of the workpiece is attached to the break table, and curving the workpiece so that the surface of the workpiece is outside the curve,  A work breaking device, wherein the scribe line on the front surface of the work reaches the back surface of the work to divide the workpiece. [12] The contact means is arranged with a height difference in a high position force low position of the break table, and has a plurality of suction holes for sucking air,  12. The work breaking device according to claim 11, wherein the work is brought into close contact with the break table by sucking the sheet through the suction holes. [13] The contact means further includes  13. The workpiece breaking device according to claim 12, further comprising a plurality of solenoid valves for sucking air sequentially into the suction holes at a high position force and a low position. [14] The contact means includes: A sheet fixing table arranged so as to sandwich the break table and holding an end portion of the sheet; and relative to the sheet fixing table in a direction perpendicular to a plane including the sheet A pressing mechanism for moving the break table to  By pressing the sheet on which the workpiece is pasted against the break table 12. The work breaking device according to claim 11, wherein the work is bent along the break table.  The break device is configured to bend the work, in which a plurality of scribe lines are engraved vertically and horizontally, along a semi-cylindrical break table, divide the work into a plurality of strips, and then break the break table. The sheet evacuated from the sheet is rotated relative to the break table by 90 degrees in a plane including the sheet, and the cake divided into strips is then transferred to the break table. The workpiece breaking device according to claim 11, wherein the workpiece is bent again to divide the workpiece into a plurality of chips.