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WO2006069256A3 - Unite thermique integree - Google Patents

Unite thermique integree Download PDF

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Publication number
WO2006069256A3
WO2006069256A3 PCT/US2005/046637 US2005046637W WO2006069256A3 WO 2006069256 A3 WO2006069256 A3 WO 2006069256A3 US 2005046637 W US2005046637 W US 2005046637W WO 2006069256 A3 WO2006069256 A3 WO 2006069256A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
plate
thermal unit
integrated thermal
bake plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2005/046637
Other languages
English (en)
Other versions
WO2006069256A2 (fr
Inventor
David H Quach
Martin Jeff Salinas
Tetsuya Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Semiconductor Solutions Co Ltd
Original Assignee
Screen Semiconductor Solutions Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/174,781 external-priority patent/US7297906B2/en
Priority claimed from US11/174,681 external-priority patent/US7274005B2/en
Priority claimed from US11/174,782 external-priority patent/US7288746B2/en
Priority claimed from US11/174,988 external-priority patent/US7282675B2/en
Application filed by Screen Semiconductor Solutions Co Ltd filed Critical Screen Semiconductor Solutions Co Ltd
Priority to CN2005800485660A priority Critical patent/CN101443131B/zh
Priority to JP2007548478A priority patent/JP2008526030A/ja
Publication of WO2006069256A2 publication Critical patent/WO2006069256A2/fr
Anticipated expiration legal-status Critical
Publication of WO2006069256A3 publication Critical patent/WO2006069256A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0233—Industrial applications for semiconductors manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne une unité thermique intégrée comprenant une plaque de cuisson permettant de chauffer un substrat supporté à la surface de la plaque de cuisson; une plaque de refroidissement configurée pour refroidir un substrat supporté sur une surface de la plaque de refroidissement; et un tunnel de transfert de substrat configuré pour transférer des substrats de la plaque de cuisson sur la plaque de refroidissement, le tunnel de transfert de substrat présentant une surface maintenant un substrat à une température commandée, qui est capable de refroidir un substrat chauffé par la plaque de cuisson.
PCT/US2005/046637 2004-12-22 2005-12-21 Unite thermique integree Ceased WO2006069256A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2005800485660A CN101443131B (zh) 2004-12-22 2005-12-21 集成热单元
JP2007548478A JP2008526030A (ja) 2004-12-22 2005-12-21 集積熱ユニット

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
US63910904P 2004-12-22 2004-12-22
US60/639,109 2004-12-22
US67401805P 2005-04-21 2005-04-21
US60/674,018 2005-04-21
US11/174,781 US7297906B2 (en) 2004-12-22 2005-07-05 Integrated thermal unit having a shuttle with two-axis movement
US11/174,782 2005-07-05
US11/174,988 2005-07-05
US11/174,781 2005-07-05
US11/174,681 US7274005B2 (en) 2004-12-22 2005-07-05 Bake plate having engageable thermal mass
US11/174,782 US7288746B2 (en) 2004-12-22 2005-07-05 Integrated thermal unit having laterally adjacent bake and chill plates on different planes
US11/174,988 US7282675B2 (en) 2004-12-22 2005-07-05 Integrated thermal unit having a shuttle with a temperature controlled surface
US11/174,681 2005-07-05

Publications (2)

Publication Number Publication Date
WO2006069256A2 WO2006069256A2 (fr) 2006-06-29
WO2006069256A3 true WO2006069256A3 (fr) 2009-04-09

Family

ID=36602334

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/046637 Ceased WO2006069256A2 (fr) 2004-12-22 2005-12-21 Unite thermique integree

Country Status (3)

Country Link
JP (3) JP2008526030A (fr)
KR (3) KR101071004B1 (fr)
WO (1) WO2006069256A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8636458B2 (en) 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
JP5220505B2 (ja) * 2008-07-28 2013-06-26 株式会社Ｓｏｋｕｄｏ 熱処理装置および基板処理装置
JP5220517B2 (ja) * 2008-08-27 2013-06-26 株式会社Ｓｏｋｕｄｏ 基板処理装置
US8127713B2 (en) * 2008-12-12 2012-03-06 Sokudo Co., Ltd. Multi-channel developer system
JP2012253171A (ja) * 2011-06-02 2012-12-20 Toppan Printing Co Ltd プリベーク装置およびプリベーク方法
TWI424541B (zh) * 2011-07-15 2014-01-21 Sokudo Co Ltd 溫度變更系統
NL2009533A (en) * 2011-10-27 2013-05-07 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
CN102645698B (zh) * 2012-01-09 2016-03-30 京东方科技集团股份有限公司 导光板网点、导光板制作方法及背光模组、显示装置
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
JP7403234B2 (ja) * 2019-04-25 2023-12-22 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
US20230161260A1 (en) * 2021-11-24 2023-05-25 Applied Materials, Inc. Chamber and methods of cooling a substrate after baking

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651823A (en) * 1993-07-16 1997-07-29 Semiconductor Systems, Inc. Clustered photolithography system
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
US6515731B1 (en) * 1999-05-06 2003-02-04 Tokyo Electron Limited Substrate processing apparatus and substrate processing method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3556882B2 (ja) * 2000-05-10 2004-08-25 東京エレクトロン株式会社 塗布現像処理システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5651823A (en) * 1993-07-16 1997-07-29 Semiconductor Systems, Inc. Clustered photolithography system
US6515731B1 (en) * 1999-05-06 2003-02-04 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

Also Published As

Publication number Publication date
KR101068328B1 (ko) 2011-09-28
JP2008526030A (ja) 2008-07-17
KR20070087682A (ko) 2007-08-28
JP2008141163A (ja) 2008-06-19
JP2008135702A (ja) 2008-06-12
KR20070092332A (ko) 2007-09-12
KR101071004B1 (ko) 2011-10-06
KR20070092331A (ko) 2007-09-12
WO2006069256A2 (fr) 2006-06-29

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