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WO2006061081A3 - Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques - Google Patents

Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques Download PDF

Info

Publication number
WO2006061081A3
WO2006061081A3 PCT/EP2005/012180 EP2005012180W WO2006061081A3 WO 2006061081 A3 WO2006061081 A3 WO 2006061081A3 EP 2005012180 W EP2005012180 W EP 2005012180W WO 2006061081 A3 WO2006061081 A3 WO 2006061081A3
Authority
WO
WIPO (PCT)
Prior art keywords
tantalum
copper
electrochemical deposition
hydroxyalkyl
ionic liquids
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/012180
Other languages
German (de)
English (en)
Other versions
WO2006061081A2 (fr
Inventor
Urs Welz-Biermann
Frank Endres
El Abedin Sherif Zein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Priority to EP05813986A priority Critical patent/EP1831433A2/fr
Priority to CA002590080A priority patent/CA2590080A1/fr
Priority to US11/721,277 priority patent/US20090242414A1/en
Priority to JP2007544757A priority patent/JP2008523242A/ja
Publication of WO2006061081A2 publication Critical patent/WO2006061081A2/fr
Anticipated expiration legal-status Critical
Publication of WO2006061081A3 publication Critical patent/WO2006061081A3/fr
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/54Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/66Electroplating: Baths therefor from melts
    • C25D3/665Electroplating: Baths therefor from melts from ionic liquids
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/615Microstructure of the layers, e.g. mixed structure
    • C25D5/617Crystalline layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Secondary Cells (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

L'invention concerne un procédé de dépôt électrochimique de tantale et/ou de cuivre sur un substrat dans un liquide ionique contenant au moins un cation tétraalkylammonium, tétraalkylphosphonium, 1,1-dialkylpyrrolidinium, 1-hydroxyalkyl-1-alkylpyrrolidinium, 1-hydroxyalkyl-3-alkylimidazolium ou bis(1-hydroxyalkyl)imidazolium, les groupes alkyle ou la chaîne alkylène dans le groupe 1-hydroxyalkyle pouvant présenter chacun indépendamment 1 à 10 atomes de carbone.
PCT/EP2005/012180 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques Ceased WO2006061081A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP05813986A EP1831433A2 (fr) 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques
CA002590080A CA2590080A1 (fr) 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques
US11/721,277 US20090242414A1 (en) 2004-12-10 2005-11-15 Electronchemical deposition of tantalum and/or copper in ionic liquids
JP2007544757A JP2008523242A (ja) 2004-12-10 2005-11-15 イオン性液体中でのタンタルおよび/または銅の電気化学的沈着

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004059520A DE102004059520A1 (de) 2004-12-10 2004-12-10 Elektrochemische Abscheidung von Tantal und/oder Kupfer in ionischen Flüssigkeiten
DE102004059520.8 2004-12-10

Publications (2)

Publication Number Publication Date
WO2006061081A2 WO2006061081A2 (fr) 2006-06-15
WO2006061081A3 true WO2006061081A3 (fr) 2007-08-02

Family

ID=35976745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/012180 Ceased WO2006061081A2 (fr) 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques

Country Status (10)

Country Link
US (1) US20090242414A1 (fr)
EP (1) EP1831433A2 (fr)
JP (1) JP2008523242A (fr)
KR (1) KR20070085936A (fr)
CN (1) CN101076617A (fr)
CA (1) CA2590080A1 (fr)
DE (1) DE102004059520A1 (fr)
RU (1) RU2007125776A (fr)
TW (1) TW200626755A (fr)
WO (1) WO2006061081A2 (fr)

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EP1983079A1 (fr) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Couche barrière et son procédé de fabrication
CA2695488A1 (fr) * 2007-08-02 2009-02-05 Akzo Nobel N.V. Procede pour electrodeposer des metaux a l'aide de liquides ioniques en presence d'un additif
GB0715258D0 (en) * 2007-08-06 2007-09-12 Univ Leuven Kath Deposition from ionic liquids
EP2080972A1 (fr) * 2008-01-08 2009-07-22 L'AIR LIQUIDE, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Bruleur combiné et appareil lance pour four a arc électrique
CA2726126C (fr) 2008-06-17 2018-07-17 Wisconsin Alumni Research Foundation Transformation chimique de biomasse lignocellulosique en combustibles et produits chimiques
DE102008030988B4 (de) * 2008-06-27 2010-04-01 Siemens Aktiengesellschaft Bauteil mit einer Schicht, in die CNT (Carbon Nanotubes) eingebaut sind und Verfahren zu dessen Herstellung
DE102008031003B4 (de) 2008-06-30 2010-04-15 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit
WO2011002660A1 (fr) * 2009-07-01 2011-01-06 Wisconsin Alumni Research Foundation Hydrolyse de biomasse
DE102009043594B4 (de) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht
DE102009060937A1 (de) 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Verfahren zum elektrochemischen Beschichten
CN101828958B (zh) * 2010-05-19 2011-12-28 瞿东滨 高骨整合性的接骨钉
CN102912384B (zh) * 2012-10-31 2015-03-04 南京工业大学 一种由电沉积Cu-Al-Mg-Li合金制备多孔铜粉的方法
DE102013202254A1 (de) 2013-02-12 2014-08-14 Siemens Aktiengesellschaft Verfahren zur Herstellung von Hochenergiemagneten
US20140262800A1 (en) * 2013-03-12 2014-09-18 Taiwan Semiconductor Manufacturing Company, Ltd. Electroplating Chemical Leveler
ES2689668T3 (es) * 2013-03-13 2018-11-15 Nantenergy, Inc. Aditivos sinérgicos para celdas electroquímicas con combustible electrodepositado
US10006141B2 (en) * 2013-06-20 2018-06-26 Baker Hughes, A Ge Company, Llc Method to produce metal matrix nanocomposite
WO2015157441A1 (fr) * 2014-04-09 2015-10-15 Nulwala Hunaid B Solvant liquide ionique pour procédé de placage électrolytique
CN104141151A (zh) * 2014-08-06 2014-11-12 哈尔滨工业大学 离子液体电沉积金属单质的方法
US10669635B2 (en) * 2014-09-18 2020-06-02 Baker Hughes, A Ge Company, Llc Methods of coating substrates with composite coatings of diamond nanoparticles and metal
US9702219B2 (en) 2014-10-01 2017-07-11 Halliburton Energy Services, Inc. Polymerizable ionic liquids for use in subterranean formation operations
US9873827B2 (en) 2014-10-21 2018-01-23 Baker Hughes Incorporated Methods of recovering hydrocarbons using suspensions for enhanced hydrocarbon recovery
US10167392B2 (en) 2014-10-31 2019-01-01 Baker Hughes Incorporated Compositions of coated diamond nanoparticles, methods of forming coated diamond nanoparticles, and methods of forming coatings
JP6413751B2 (ja) * 2014-12-22 2018-10-31 日清紡ホールディングス株式会社 めっき液
US10155899B2 (en) 2015-06-19 2018-12-18 Baker Hughes Incorporated Methods of forming suspensions and methods for recovery of hydrocarbon material from subterranean formations
CN105463532A (zh) * 2015-12-29 2016-04-06 沈阳师范大学 一种新型的镀镍铁用电镀液
CN105780069A (zh) * 2015-12-29 2016-07-20 沈阳师范大学 氯化1-己基-3-甲基咪唑/氯化铁体系电镀液
US9834850B1 (en) 2016-08-08 2017-12-05 Seagate Technology Llc Method of forming one or more metal and/or metal alloy layers in processes for making transducers in sliders, and related sliders
US11424484B2 (en) 2019-01-24 2022-08-23 Octet Scientific, Inc. Zinc battery electrolyte additive
CN111826691B (zh) * 2020-08-21 2021-09-21 东北大学 一种溶剂化离子液体制备锌钽合金的方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4624753A (en) * 1985-06-05 1986-11-25 Mcmanis Iii George E Method for electrodeposition of metals
WO2001013379A1 (fr) * 1999-08-18 2001-02-22 British Nuclear Fuels Plc Procede de separation de metaux
JP2001279486A (ja) * 2000-03-30 2001-10-10 Japan Science & Technology Corp タンタルのめっき法
US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte

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US6862125B2 (en) * 2003-05-05 2005-03-01 The Regents Of The University Of California Reversible electro-optic device employing aprotic molten salts and method
TW200526587A (en) * 2003-09-05 2005-08-16 Univ Alabama Ionic liquids containing secondary hydroxyl-groups and a method for their preparation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624753A (en) * 1985-06-05 1986-11-25 Mcmanis Iii George E Method for electrodeposition of metals
WO2001013379A1 (fr) * 1999-08-18 2001-02-22 British Nuclear Fuels Plc Procede de separation de metaux
JP2001279486A (ja) * 2000-03-30 2001-10-10 Japan Science & Technology Corp タンタルのめっき法
US6936155B1 (en) * 2000-03-30 2005-08-30 Japan Science And Technology Agency Method for electroplating of tantalum
US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
FORSYTH S ET AL: "N-methyl-N-alkylpyrrolidinium tetrafluoroborate salts: ionic solvents and solid electrolytes", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 46, no. 10-11, 15 March 2001 (2001-03-15), pages 1753 - 1757, XP004231593, ISSN: 0013-4686 *
MURASE K ET AL: "Electrochemical behaviour of copper in trimethyl-n-hexylammonium bis((trifluoromethyl)sulfonyl)amide, an ammonium imide-type room temperature molten salt", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 31, 2001, pages 1089 - 1094, XP002383238, ISSN: 0021-891X *
S. ZEIN EL ABEDIN, H. K. FARAG, E. M. MOUSTAFA, U. WELZ-BIERMANN, F. ENDRES: "Electroreduction of tantalum fluoride in a room temperature ionic liquid at variable temperatures", PHYS. CHEM. CHEM. PHYS., no. 7, 27 April 2005 (2005-04-27), pages 2333 - 2339, XP002435793 *
S. ZEIN EL ABEDIN, U. WELZ-BIERMANN, F. ENDRES: "A study of the electrodeposition of tantalum on NiTi alloy in an ionic liquid and corrosion behaviour of the coated alloy", ELECTROCHEMISTRY COMMNUICATIONS, no. 7, 8 August 2005 (2005-08-08), pages 941 - 946, XP002435792 *
SUN J ET AL: "A new family of ionic liquids based on the 1-alkyl-2-methyl pyrrolinium cation", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 48, no. 12, 30 May 2003 (2003-05-30), pages 1707 - 1711, XP004422987, ISSN: 0013-4686 *

Also Published As

Publication number Publication date
WO2006061081A2 (fr) 2006-06-15
TW200626755A (en) 2006-08-01
DE102004059520A1 (de) 2006-06-14
CA2590080A1 (fr) 2006-06-15
US20090242414A1 (en) 2009-10-01
JP2008523242A (ja) 2008-07-03
KR20070085936A (ko) 2007-08-27
RU2007125776A (ru) 2009-01-20
EP1831433A2 (fr) 2007-09-12
CN101076617A (zh) 2007-11-21

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