WO2006049330A1 - Exposure equipment - Google Patents

Abstract

A photosensitive film is provided by laminating a photosensitive layer and a supporting body. A board-shaped laminated body is provided by bonding the side of the photosensitive layer on a substrate. At the time of exposing a prescribed pattern on the photosensitive layer of the board-shaped laminated body, reaction with oxygen in the photosensitive layer of the board-shaped laminated body from which the supporting body is peeled is made as small as possible. A peeling apparatus (180) for peeling the supporting body from a photosensitive material (150) is provided in exposure equipment (1). After peeling the supporting body from the photosensitive material (150) by the peeling apparatus (180), pattern exposure is immediately performed to the photosensitive material (150) by a scanner (162).

Description

 Specification

 Technical field of exposure equipment

 The present invention provides an exposure for exposing a predetermined pattern such as a wiring pattern of a printed wiring board to a photosensitive layer of a plate-like laminate formed by laminating a photosensitive layer and a support by a light beam emitted from a laser light source. It relates to the device. Background art

 Conventionally, there has been known a photosensitive film in which a photosensitive layer such as a resist layer or a color filter layer is laminated on a support. Such a photosensitive film has a photosensitive layer side attached to, for example, a glass substrate. After forming a plate-like laminate, the support is peeled off from the plate-like laminate, and only the photosensitive layer is laminated on the glass substrate.

 For example, when the photosensitive film constituting the plate-like laminate is a laminate of a resist layer as a photosensitive layer, the support is peeled off from the plate-like laminate and only the resist layer is formed on the glass substrate. When the laminated film is put into the exposure process and the photosensitive film constituting the plate-like laminate is a laminate of a color filter layer as a photosensitive layer, the support is peeled off from the plate-like laminate. Then, only the color filter layer is laminated on the glass substrate, and it is put into the next exposure process. --Then, a photopolymerization reaction occurs in the exposed portion of the photosensitive layer by the exposure process, and the photosensitive layer is cured. Then, a pattern is formed on the substrate by development and etching.

 By the way, in the plate-like laminate in which the support (also called force per film or protective film) is laminated on the surface of the substrate as described above, the support is not necessary in the exposure process. It is necessary to peel the support from the body.

As a method of peeling the support from the plate-like laminate in this way, the support side of the plate-like laminate to be conveyed is adhered and peeled off with the outer peripheral surface of the adhesive mouthpiece, and the support is removed from the adhesive mouth. (See Japanese Laid-Open Patent Publication Nos. 2000-201 and 2005-6-28076). Conventionally, various exposure apparatuses that perform image exposure using a light beam modulated in accordance with image data using a spatial light modulator such as a digital 'micromirror' device (DMD) have been proposed. As one of the applications of such an exposure apparatus, use in a manufacturing process of a printed wiring board is known (see, for example, Japanese Patent Laid-Open No. 2000-0124 44).

 By the way, if the support is peeled off from the plate-like laminate, the photosensitive layer is exposed to the atmosphere, and the photosensitive layer reacts with oxygen, so that the photopolymerization reaction of the photosensitive layer is hindered in the exposure process. There is. For this reason, after peeling a support body with a peeling apparatus, it is necessary to convey a plate-shaped laminated body to an exposure process as soon as possible. However, since the plate-like laminate is exposed to the atmosphere even during transportation, the reaction of the photosensitive layer with oxygen could not be completely prevented. Disclosure of the invention

 The present invention has been made in view of the above circumstances, and an object of the present invention is to minimize the reaction of the photosensitive layer with oxygen in the plate-like laminate having the support peeled off.

 An exposure apparatus according to the present invention exposes a predetermined pattern to a photosensitive layer in a plate-like laminate formed by laminating a photosensitive film formed by laminating a photosensitive layer and a support on a substrate. Exposure means to perform,

 A transport unit that transports the plate-shaped laminate to the exposure unit along a predetermined transport path; and the support body that is provided on the upstream side of the exposure unit in the predetermined transport path. It has the peeling means which peels.

 The exposure apparatus according to the present invention further includes oxygen partial pressure reducing means for reducing the oxygen partial pressure in the vicinity of the photosensitive layer after peeling off the support to 80% or less of the atmospheric oxygen partial pressure. You may do it.

 In this case, the oxygen partial pressure reducing means may be means for reducing the pressure in the apparatus.

 Further, the oxygen partial pressure reducing means may be a means for ejecting an inert gas toward the plate-like laminate.

According to the present invention, since the peeling means for peeling the support from the plate-like laminate is provided upstream of the exposure means in the exposure apparatus, the plate-like laminate from which the support has been peeled is immediately transported to the exposure means. Will be. As a result, when the plate-like laminate with the support peeled off is exposed to the atmosphere. As a result, the reaction of the photosensitive layer with oxygen can be minimized. Therefore, the sensitivity of the photosensitive layer to light can be prevented from decreasing, and the pattern can be exposed satisfactorily.

 In particular, the reaction between the photosensitive layer and oxygen can be further reduced by setting the oxygen partial pressure in the vicinity of the photosensitive layer after peeling the support to 80% or less of the oxygen partial pressure at atmospheric pressure. Brief Description of Drawings

 FIG. 1 is a perspective view showing the appearance of an exposure apparatus according to an embodiment of the present invention.

 Figure 2 is an enlarged cross-sectional view of the photosensitive material.

 FIG. 3 is a diagram showing a configuration of a peeling portion of the peeling device.

 4A to 4D are diagrams showing a process of peeling a support with an adhesive roll.

 FIG. 5 is a perspective view showing a scanner used in the exposure apparatus of FIG.

 6A and 6B are a plan view A showing exposed areas formed on the photosensitive material, and a figure B showing the arrangement of exposure areas by each exposure head.

 FIG. 7 is a perspective view showing a schematic configuration of an exposure head in the exposure apparatus of FIG.

 FIG. 8 is a cross-sectional view along the optical axis showing the configuration of the exposure head shown in FIG. Fig. 9 is a partially enlarged view of a digital micromirror device (DMD).

 FIG. 10A and FIG. 10B are explanatory diagrams for explaining the operation of the DMD.

 Fig. 11 is a diagram showing the configuration of a scanner provided with nozzles that eject inert gas. -Preferred form for carrying out the invention

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the appearance of an exposure apparatus according to an embodiment of the present invention. As shown in FIG. 1, the exposure apparatus 1 according to the present embodiment includes a plate-like stage 15 2 that adsorbs and holds a sheet-like photosensitive material 150 on the surface. In addition, two guides 1 5 8 extending along the stage moving direction are installed on the upper surface of the thick plate-like installation table 1 5 6 supported by the four legs 15 4. The stage 15 2 is arranged so that the longitudinal direction thereof faces the stage moving direction, and is supported by the guide 15 8 so as to be reciprocally movable. The exposure apparatus 1 is provided with a drive device (not shown) for driving the stage 15 2 along the guide 15 8. A U-shaped gate 160 is provided at the center of the installation table 1556 so as to straddle the movement path of the stage 1552. Each of the ends of the U-shaped gate 160 is fixed to both side surfaces of the installation table 1556. A scanner 1 62 and a peeling device 1 80 are provided on one side of the gate 1 60 and a plurality of photosensitive materials 1 5 0 are detected on the other side. There are (for example, two) detection sensors 1 6 4. The scanner 1 6 2 and the detection sensor 1 6 4 are respectively attached to the gate 1 60 and fixedly arranged above the moving path of the stage 1 5 2. Further, the peeling device 1 80 is attached to the gate 1 60 via the scanner 1 6 2 and fixedly arranged above the moving path of the stage 1 5 2. The scanner 162, the detection sensor 1664, and the peeling apparatus 180 are connected to a controller (not shown) that controls them.

 A cover 120 for shielding the photosensitive material 150 and the atmosphere is provided above the installation table 1556. Stage 15 2, guide 1 5 8, part of gate 1 6 0, scanner 1 6 2, detection sensor 1 6 4 and peeling device 1 80 will be installed in cover 1 2 0 . Further, a vacuum pump 1 2 2 for reducing the pressure in the cover 1 2 0 is connected to the force par 1 2 0. The vacuum pump 1 2 2 uses a controller (not shown) to depressurize the space in the cover 1 2 0, and the oxygen partial pressure in the vicinity of the photosensitive material 1 5 0 after the support 4 3 is peeled off. It is controlled so that it is 80% or less.

 FIG. 2 is an enlarged cross-sectional view of the photosensitive material 150 used in this embodiment. As shown in FIG. 2, the photosensitive material 1 50 is composed of a resist film 4 2, which is a photosensitive layer that is cured by light irradiation, and a support 4 3. It is configured by sticking the side on the substrate 41. The substrate 41 is made of glass, and the support 4 3 is made of a PET resin film.

 Next, the peeling apparatus 180 will be described.

 FIG. 3 is a diagram showing the configuration of the peeling portion of the peeling apparatus 180, and FIG. 4 is a diagram showing the process of peeling the support with an adhesive roll.

Peeling device 1 80 is designed so that each of the adhesive rolls 2 3 with outer peripheral surface 2 4 made of adhesive material and each adhesive roll 2 3 can rotate around each axis 2 3 C The adhesive rolls 2 3 are arranged in a ferris wheel around the rotary shaft 3 5, and the adhesive roll rotation transfer unit 30 for rotating and transferring the adhesive rolls 2 3 around the rotary shaft 3 5 It has. Further, the peeling device 1 80 includes a support removing part 10 for removing the support 4 3 scraped off from the adhesive roll 23 after the peeling operation and the support 4 3 from the adhesive roll 23. And a cleaning section 15 for cleaning the removed adhesive roll 2 3.

 The adhesive roll rotation transfer unit 30 is disposed on the upper side of the conveyance path of the photosensitive material 15 50, and a pair of turret plates 3 4 disposed opposite to both sides in the width direction of the photosensitive material 15 50 to be conveyed. Equipped. The rotary shaft 35 supports the turret plate 34 in a rotatable manner by a rotary motor (not shown) through a bearing (not shown).

 Four leg portions 3 6 are projected at equal intervals on the peripheral portion of the turret plate 3 4, and the adhesive roll 2 3 is spaced between the opposite ends of the leg portions 3 6 and the photosensitive material 1 5 0, respectively. It is pivotally supported so as to be in contact with the direction.

 The support removing roll 1 1 constituting the support removing part 1 0 is formed by applying a highly adhesive material, for example, an outer peripheral surface coated with an adhesive having a high adhesive force, and transferring the adhesive roll. The feeding unit 30 is arranged directly above the rotating shaft 35 (support removal position H in FIG. 3) so that it can come into contact with each adhesive roll 23 from above. It is configured to rotate clockwise (in the direction of the arrow in the figure) by a drive unit (not shown). Therefore, the support body 4 3 peeled off by each adhesive roll 23 and wound around its peripheral surface is adhered to the support body removal position H shown in FIG. It is attached and peeled off from the peripheral surface of the adhesive roll 23.

 The cleaning roll 1 6 constituting the cleaning unit 15 is located directly beside the rotary shaft 3 5, that is, at the same level in the side view of FIG. 3, and more sensitive than the adhesive rolls 2 3. Arranged upstream in the conveying direction, that is, upstream of the separation execution position J, and rotated clockwise in FIG. 3 by a drive unit (not shown). The support 4 is supported by the support removing roll 11. The adhesive rolls 23 from which the 3 has been peeled off are interviewed from the horizontal direction to remove dust adhering to the surfaces of the adhesive rolls 23 and maintain and improve the degree of adhesion.

 Next, the configuration of the scanner 16 2 will be described.

As shown in FIG. 5 and FIG. 6B, the scanner 1 6 2 includes a plurality of (eg, 14) exposure heads 1 6 6 arranged in a matrix of m rows and n columns (eg, 3 rows and 5 columns). I have. In this example, four exposure heads 1 6 6 are arranged in the third row in relation to the width of the photosensitive material 150. Is placed. When individual exposure heads are arranged in the m-th row and the n-th column, they are expressed as exposure head 16 6 _mn .

The exposure area 1 6 8 by the exposure head 1 6 6 has a rectangular shape with the short side in the sub-scanning direction. Therefore, as the stage 15 2 moves, a strip-shaped exposed region 170 is formed in the photosensitive material 150 for each exposure head 16 6. In addition, when the exposure area by each exposure head arranged in the m-th row and the n-th column is indicated, it is expressed as an exposure area 1 ₆₈ 8 _mn .

Further, as shown in FIGS. 6A and 6B, each of the exposure heads of each row arranged in a line is arranged so that the strip-shaped exposed areas 170 are aligned without gaps in the direction orthogonal to the sub-scanning direction. They are arranged at predetermined intervals in the column direction (natural number times the long side of the exposure area, twice in this embodiment). For this reason, the portion between the exposure area 1 6 8 ^ in the first row and the exposure area 1 6 8 _{1 2} that cannot be exposed is the exposure area 1 6 8 _{2 1 in the} second row and the exposure area 1 6 in the third row. 8 _{3 1} and exposure is possible.

As shown in FIGS. 7 and 8, each of the exposure heads 1 6 6 ι ι to 1 6 6 _mn is a spatial light modulator that modulates the incident light beam for each pixel in accordance with image data. Equipped with a digital 'micromirror' device (DMD) 50. This DMD 50 is connected to a controller (not shown) having a data processing unit and a mirror drive control unit. The data processing section of this controller uses each input head 1 based on the input image data.

6 A control signal for driving and controlling each micromirror in the region to be controlled of DMD 50 is generated every 6th. The area to be controlled will be described later. In addition, the mirror drive control unit controls the angle of the reflection surface of each micromirror of the DMD 50 for each exposure head 16 6 based on the control signal generated by the image data processing unit. The control of the angle of the reflecting surface will be described later.

 On the light incident side of DM D 50, there is one mercury lamp 6 6 and a lens system 6 that collects the light emitted from this mercury lamp 6 6 on the DM D 50 after collecting the light intensity distribution. 7. A mirror 69 that reflects the light passing through the lens system 67 toward the DMD 50 is arranged in this order. In FIG. 7, the lens system 67 is schematically shown.

As shown in FIG. 8, the lens system 6 7 includes a collimator lens 7 1 that collimates the light emitted from the filament 6 6 a of the mercury lamp 6 6 and collected on the front side by the reflector 6 6 b. Micro-block inserted in the optical path of the light that passed through this collimator lens 71 Raiai lens 7 2, another micro fly's eye lens 7 3 arranged facing this micro fly's eye lens 72, and the front of this micro fly's eye lens 73, that is, the mirror 6 9 side Consists of a yield lens 7-4. Microphone mouth fly-eye lenses 7 2 and 7 3 have many microlens cells arranged vertically and horizontally.

Since the light that has passed through each of these micro lens cells is incident on the D MD 50 in a state where they overlap each other, the light quantity distribution of the light that irradiates the D MD 50 becomes uniform. On the light reflection side of D M D 50, a lens system 51 that images the light reflected by DMD 50 on the scanning surface (exposed surface) 56 of the photosensitive material 15 50 is disposed. The lens system 5 1 is arranged so that D M D 50 and the exposed surface 56 have a conjugate relationship. This lesbian 5 1

Although 0 is schematically shown in FIG. 7, as shown in detail in FIG. 8, the enlarged imaging optical system including two lenses 5 2 and 5 4 and two lenses 5 7 and 5 8 is composed of an image forming optical system, a microlens array 55 inserted between these optical systems, and an aperture array 59. The above-described microlens array 55 includes a large number of microphone opening lenses 55a corresponding to the respective pixels of the DMD 50. Aperture 7 "Ray 5 9

.5 is formed by forming a large number of 7 "notches 59a corresponding to the respective microphone mouth lenses 55a of the microphone mouth lens array 55.

 As shown in FIG. 9, the DMD 50 is formed by placing a minute mirror (micromirror) 6 2 on a SR AM cell (memory cell) 60 supported by a support. This is a mirror device configured by arranging a large number of (for example, 600 × 800) micro-mirrors constituting a pixel in a f-shape. Each pixel is provided with a microphone mirror 62 supported on a support column at the top, and a highly reflective material such as aluminum is deposited on the surface of the micromirror 62. The reflectivity of the micromirror 62 is 90% or more. Directly under the micromirror 62, a silicon gate CMOS SRAM cell 60 manufactured by a normal semiconductor memory manufacturing process is arranged via a pillar including a hinge and a yoke. It is structured monolithically (integrated).

When a digital signal is written in the SR AM cell 60 of the D MD 50, the micromirror 6 2 supported by the support column has a soil α degree (with respect to the substrate side on which the D MD 50 is placed centered on the diagonal line ( For example, it can be tilted within a range of ± 10 degrees. Fig. 10 0 Α shows a state tilted to + α degrees when the micro mirror 6 2 is on, and Fig. 10 B shows that the micro mirror 6 2 is off. It shows a state tilted at a certain α degree. Therefore, according to the image signal, the inclination of the micromirror 62 in each pixel of the DMD 50 is controlled as shown in FIG. 9. It is repelled in the tilt direction of the micro mirror 62. FIG. 9 shows an example in which a part of the DMD 50 is enlarged and the micromirror 6 ′ 2 is controlled to + α degrees or once. The on / off control of each micromirror 62 is performed by a controller (not shown) connected to the DMD 50. Note that a light absorber (not shown) is arranged in the direction in which the light beam is reflected by the off-state micromirror 62.

 Next, the operation of the exposure apparatus according to the present embodiment will be described. First, the peeling operation of the support 4 3 by the peeling device 1 80 will be described.

 By driving the vacuum pump i 2 2, the force component 1 is adjusted so that the oxygen partial pressure in the vicinity of the photosensitive material 1 5 0 after peeling the support 4 3 is 80% or less of the oxygen partial pressure of atmospheric pressure. 2 Depressurize the space inside O.

 The stage 1 5 2 having the photosensitive material 1 5 50 adsorbed on the surface is moved at a constant speed from the upstream side to the downstream side of the gate 1 6 6 along the guide 1 58 by a driving device I (not shown). Then, when the stage 15 2 passes under the peeling device 180, the support 4 3 is peeled off. As shown in FIGS. 4A to 4D, the adhesive roll 23 rotates in the direction of the arrow shown in the figure, and peels off the support 4 3 constituting the photosensitive material 1 5 50 that is adsorbed to the stage 1 5 2 and conveyed. (See Figure 4A). After that, 1 occupying port 2 3 continues to scrape off the support 4 3 peeled while pressing the photosensitive material 1 5 0 (see Fig. 4 4), and the upstream of the photosensitive material 1 5 0 in the transport direction When the photosensitive material 15 50 is conveyed to the end by the adhesive roll 23 (see FIG. 4C), the entire support 4 3 is peeled off from the photosensitive material 150. Note that FIG. In this way, the rear end of the support 4 3 that has been peeled off and peeled off by the adhesive roll 2 3 is in a state of hanging downward, and the terminal end that is suspended below the rear end of the support 4 3 is gripped. Then, the support 4 3 is removed from the adhesive roll 2 3 at the support removing part 10. Then, the surface of the adhesive roll 2 3 is cleaned at the cleaning part 15 5. The photosensitive material from which the support 4 3 has been peeled off. 1 5 0 is transported further toward scanner 1 6 2 while being attracted to stage 1 5 2 It is.

Next, the operation of the scanner 16 2 will be described. For example, the light in the wave 3 60 to 4 20 nm band emitted from the mercury lamp 66 shown in FIG. 7 and FIG. 8 passes through the lens system 67 as described above, and the light quantity distribution is made uniform. DMD 50 is irradiated. Image data corresponding to the exposure pattern is input to a controller (not shown) connected to the DMD 50 and stored in a frame memory in the controller. 5 This image data is the data representing the density of each pixel composing the image in binary (whether or not dots are recorded).

 Further, when the stage 1 5 2 that has adsorbed the photosensitive material 1 5 0 from which the support 4 3 has been peeled passes under the gate 1 60, the detection sensor 1 6 4 attached to the gate 1 6 When the leading edge of the material 150 is detected, the image data stored in the frame memory is sequentially read out for a plurality of lines, and each exposure is performed by the data processing unit based on the read image data. A control signal is generated for each head 1 6 6. Then, the mirror drive control unit performs on / off control of each of the micro mirrors of the DMD 50 for each exposure head 16 6 based on the generated control signal.

 When the light from the mercury lamp 6 6 is applied to the DMD 50, the light reflected by the micromirror in the DMD 50 ON state .5 is collected by the lens system 51 and is then photosensitive material 15 Focus on the exposed surface 5 6 of 0. In this way, the light emitted from the mercury lamp 6 6 power is turned on / off for each microphone opening mirror of the DMD 50, and the pixel unit is approximately the same number as the number of pixels used in the photosensitive material 15 500 DMD 50. The exposure is performed in (exposure area 1 6 8). In addition, the photosensitive material 1 5 0 is moved together with the stage 1 5 2 at a constant speed, so that the photosensitive material 1 5 Ό is sub-scanned in the direction opposite to the stage moving direction by the scanner 1 6 A strip-shaped exposed region 1 7 0 is formed every 1 6 6.

 When the scanning of the photosensitive material 1 5 0 by the scanner 1 6 2 is completed and the trailing edge of the photosensitive material 1 5 0 is detected by the detection sensor 1 6 4, the stage 1 5 2 is not shown in the figure. Returns to the origin on the most upstream side of the gate 1 6 0 along the guide 1 5 8 and is again moved at a constant speed from the upstream side to the downstream side of the gate 1 60 along the guide 1 5 8. The

 The exposed photosensitive material 150 is developed and further etched to form a wiring pattern.

Thus, in the present embodiment, the peeling device 1 80 is provided on the upstream side in the transport direction of the photosensitive material 1 50 of the scanner 1 6 2 in the exposure device 1, so The photosensitive material 1 5 0 is immediately exposed. As a result, it is possible to minimize the time during which the resist layer 42 of the photosensitive material 150 having the support 43 peeled off is exposed to the atmosphere, and as a result, the reaction of the resist layer 42 with oxygen can be minimized. Can be reduced. Therefore, the sensitivity of the resist layer 42 to light can be prevented from being lowered, and the pattern can be satisfactorily exposed by the scanner 16 2.

 In particular, by reducing the oxygen partial pressure in the vicinity of the photosensitive material 15 50 after peeling off the support 43 to 80% or less of the atmospheric oxygen partial pressure, the reaction between the resist layer and oxygen can be reduced. Is possible.

 In the above-described embodiment, the oxygen partial pressure in the vicinity of the photosensitive material 15 50 after the support 4 3 is peeled off by providing the vacuum pump 1 2 2 and reducing the space 0 in the cover 12 20. The oxygen partial pressure of atmospheric pressure is 80% or less. However, after peeling off the support 4 3 by blowing an inert gas such as nitrogen gas onto the photosensitive material 1 5 0 from which the support 4 3 was peeled off The oxygen partial pressure in the vicinity of the photosensitive material 150 may be 80% or less of the oxygen partial pressure at atmospheric pressure.

 In this case, as shown in FIG. 11, an inert gas supply device 1 90 and a nozzle 1 9 1 connected to the inert gas nozzle 5 for ejecting inert gas are provided, and an inert gas supply device is provided by a controller (not shown). The photosensitive material after the support 4 3 is peeled off by controlling the driving of the photosensitive material 1 5 0 from the nozzle 1 9 1 so that the oxygen partial pressure in the vicinity of 80 is equal to or less than 80% of the atmospheric oxygen partial pressure. Inert gas is spouted toward 1 5 0.

 In this way, the oxygen partial pressure in the vicinity of the photosensitive material 1 5 0 after peeling off the support body 0 4 3 can be reduced to atmospheric pressure oxygen by ejecting an inert gas toward the photosensitive material 1 5 0. The partial pressure can be reduced to 80% or less, whereby the reaction between the resist layer 42 and oxygen can be further reduced.

In the above embodiment, the photosensitive material 150 for producing a printed wiring board is used. However, for producing a color filter for a liquid crystal panel in which a glass substrate is laminated as a substrate and a color filter film is laminated as a photosensitive layer. Even in the case of a photosensitive material, a predetermined pattern can be exposed on the color filter film immediately after the support is peeled off, as in the above embodiment. In the above embodiment, the pattern is exposed using the light beam. However, the light emitted from the surface exposure light source using a mask having a transmissive portion corresponding to the pattern shape and the surface exposure light source is used. Is applied to the photosensitive material 1 5 0 through the mask to obtain the photosensitive material 1 5 The pattern may be exposed to zero.

 In the above embodiment, a mercury lamp is used as the light source of the exposure apparatus 1, but a laser light source may be used.

 In the above embodiment, an exposure apparatus that performs exposure on a printed wiring board has been described. However, the present invention is not limited to this, and color filters, pillar materials, rib materials, spacers, partition walls, and the like are not limited thereto. Of course, the exposure apparatus of the present invention can also be applied to the case of exposing a recording material for pattern formation such as a display material, a hologram, or a micromachine opto-proof.

 Further, the present invention is not limited to the above-described embodiment, and as an optical scanning optical system as disclosed in Japanese Patent Application Laid-Open No. 2 00 0-2 2 7 6 6 1, a laser light source, a laser light source Various modifications can be made without departing from the scope of the present invention, such as an exposure apparatus using an AOM that performs optical modulation and a polygon mirror.

Claims

The scope of the claims 1. Exposure means for exposing a predetermined pattern to the photosensitive layer of a plate-like laminate formed by laminating a photosensitive film formed by laminating a photosensitive layer and a support on the substrate side of the photosensitive layer; ,  A transport unit that transports the plate-shaped laminate to the exposure unit along a predetermined transport path; and the support body that is provided on the upstream side of the exposure unit in the predetermined transport path. An exposure apparatus comprising: a peeling means for peeling the film.  2. The apparatus further comprises oxygen partial pressure reducing means for reducing the oxygen partial pressure in the vicinity of the photosensitive layer after peeling off the support to 80% or less of the oxygen content IE at atmospheric pressure. The described exposure equipment.  3. The exposure apparatus according to claim 2, wherein the oxygen partial pressure reducing means is means for reducing the pressure in the apparatus.  4. The exposure apparatus according to claim 2, wherein the oxygen partial pressure reducing means is means for injecting an inert gas toward the plate-like laminate.