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WO2006045705A1 - Plaque de cuisson dotee d'un capteur de temperature - Google Patents

Plaque de cuisson dotee d'un capteur de temperature Download PDF

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Publication number
WO2006045705A1
WO2006045705A1 PCT/EP2005/055243 EP2005055243W WO2006045705A1 WO 2006045705 A1 WO2006045705 A1 WO 2006045705A1 EP 2005055243 W EP2005055243 W EP 2005055243W WO 2006045705 A1 WO2006045705 A1 WO 2006045705A1
Authority
WO
WIPO (PCT)
Prior art keywords
hob
temperature sensor
sensor
plate
sensor carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/055243
Other languages
German (de)
English (en)
Inventor
Uwe Has
Peter Vetterl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Bosch und Siemens Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSH Bosch und Siemens Hausgeraete GmbH filed Critical BSH Bosch und Siemens Hausgeraete GmbH
Publication of WO2006045705A1 publication Critical patent/WO2006045705A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater

Definitions

  • the invention relates to a hob with a hob plate, in particular of glass ceramic, below which at least one heating element is arranged for heating a shut-off cooking hob on the hob, with a temperature sensor for detecting the temperature of the hob plate.
  • Such cooktop panels are used to achieve the most accurate possible driving the necessary or desired for the cooking process temperature.
  • the heating energy supplied to the cooktop panel is to be controlled as a function of the temperature actually present in the food to be cooked.
  • the detection of the temperature present in the food to be cooked proves to be problematic. Your detection would be detected with a sensor that receives the temperature directly in the food, the safest and most accurate. A corresponding device that would have to be set up again during each cooking process, but is cumbersome and expensive.
  • hobs of the type mentioned are known. Instead of a temperature measurement directly in the food to detect the local temperature sensor, the temperature of the underside of the hob plate and thus indirectly the temperature of the bottom of a parked on the hob cooking vessel. From the temperature thus determined is closed to that of the food in the cooking vessel. So that the measurement of the temperature sensor is as little as possible affected by the plate in the hob arranged heating elements, modern glass ceramic hotplates have a high transmission and at the same time a low transverse conductivity. In addition, a shading in relation to the heating elements is arranged in the hob in the region of the temperature sensor.
  • the hood can be unscrewed either at the outer peripheral wall of the heating element at different heights or with a Spring is equipped to the hood defined to be able to press on the underside of the glass ceramic.
  • the hood also has a receiving portion for the temperature sensor and a mounting portion for mounting the element on the heating element, said the mounting portion is arranged radially laterally offset from the receiving portion.
  • glass ceramic cooktop panels are generally formed with knobs on their side facing the heating element.
  • the temperature sensor To the temperature at the bottom of the hob plate by the temperature sensor is not quasi punctiform, but integrating over a larger area integrating, therefore, the temperature sensor must be equipped according to the prior art plate with a specially designed contact surface on the underside of the hob.
  • a suitable attachment of the temperature sensor receiving hood must be selected so that the hood can give in to a mechanical load or movement of the hob plate. Otherwise would be feared by a too tight-fitting hood on the hob plate chipping on the underside of the plate or possibly also their breakage.
  • this object is achieved by a hob of the type mentioned, in which the temperature sensor is arranged at a distance without contact with respect to the hob plate.
  • Non-contact means that the temperature sensor has no direct and otherwise at least no heat conductive contact to the hob plate.
  • the invention thus turns away from a construction of a hob, in which the temperature is detected by heat conduction and the temperature sensor must therefore at least indirectly abut plate on the underside of the hob. Rather, the invention pursues the principle of producing a thermal coupling by way of thermal radiation instead of a heat conduction. This allows the non-contact arrangement of the temperature sensor relative to the hob base plate.
  • the temperature sensor for example, a so-called PTC or NTC - against loads from the hob plate or those that act on the hob plate, protected. Because of lack of investment on the hob plate loads can not be forwarded to the temperature sensor. The temperature sensor is thus no longer particularly affected by shock loads from a careless operation of the hob, for example, by hard touchdown of a cooking pot. This also ensures a longer life of the sensitive temperature sensor.
  • the temperature sensor is therefore inventively spaced from the cooktop panel via an air gap.
  • the distance is specifically dimensioned so that it serves as an electrical insulator between the temperature sensor and the hob plate.
  • the invention thus also takes the path of electrical insulation of the temperature sensor relative to the hob plate.
  • the air gap between the temperature sensor and the underside of the hob plate serves for this purpose.
  • other electrically non-conductive gases can be used as insulators - A -
  • the ambient air of the hotplate is sufficient as an insulator and cheapest available. Due to the insulating distance between the temperature sensor and cooktop underside measures for earthing of the temperature sensor - as required by the prior art - dispensable.
  • the temperature sensor at a distance of at least 4 millimeters from the cooktop plate bottom.
  • these distances of live elements are prescribed according to VDE guidelines. They ensure that there is no voltage flashover from the temperature sensor on the hob plate or on a cooking vessel placed on it.
  • the temperature sensor can be constructed to be self-supporting or held by a sensor carrier at the required distance from the hob plate.
  • the sensor carrier may be formed approximately in the manner of a tripod of thermally non-conductive material.
  • the temperature sensor is arranged on a preferably plate-shaped sensor carrier which has an underside of the hob plate facing top and a side facing away from it. This allows a simple definition of the distance, the temperature sensor has to comply with the attachment of the sensor carrier in the hob and thus leads to a low susceptibility to error during assembly of the temperature sensor.
  • Sensor carrier and temperature sensor also form a larger unit, which is therefore easier to handle during assembly, pre-assembled and pre-testable and easier to replace.
  • the sensor carrier consists of an electrically insulating material. This is excluded that the sensor carrier must be considered electrically at the prescribed distance between the temperature sensor and the underside of the hob plate. Rather, the sensor support supports electrical insulation of the temperature sensor relative to the underside of the hob plate.
  • the temperature sensor is arranged on the underside of the sensor carrier, so that the thickness of the sensor carrier can be taken into account in the dimensioning of the necessary distance.
  • the sensor carrier assumes a dual function, namely on the one hand the defined support of the temperature sensor and on the other hand the function of a component of the electrical insulation.
  • the sensor carrier thus exploits at least a portion of that space formed by the air gap between the temperature sensor and the underside of the cooktop panel.
  • the sensor carrier is formed or arranged such that it defines by its shape and / or dimensions an air or creepage path for current between the temperature sensor and the underside of the hob plate, the minimum value according to VDE directive of not less than four millimeters.
  • the temperature sensor is arranged on the underside of the sensor carrier.
  • the sensor carrier also includes an edge that projects over the temperature sensor on all sides, and is configured and arranged to maintain a distance of about 4 mm.
  • the temperature sensor is at least no longer directly exposed to the heat radiation of the underside of the hob plate in such an arrangement.
  • the sensor carrier is in a further advantageous embodiment of the invention of a material that absorbs infrared radiation well.
  • it is coated on its upper side facing the cooktop plate underside with such a material. This ensures that the radiation emitted by the underside of the hob plate radiation is absorbed by the sensor carrier, which passes on their heat energy by way of heat conduction to the temperature sensor.
  • a large absorption surface can be made available with the surface usually larger sensor carrier, which can pass the absorbed energy to the surface generally smaller temperature sensor.
  • This construction proves to be advantageous not only when the temperature sensor is arranged on the side facing away from the cooktop plate underside of the sensor carrier and thus can not detect the emitted radiation from the cooktop plate bottom radiation directly. Rather, it may also be advantageous if the temperature sensor is directly exposed to the heat radiation of the cooktop plate underside, because even then a larger absorption surface for heat radiation is created. With a large absorption area, the temperature sensor can then be designed to be less sensitive, which reduces the costs for its production.
  • the sensor carrier ceramic As a particularly advantageous material for the sensor carrier ceramic has been found because it is both an electrical insulator and on the other hand is sufficiently stable even in a small thickness. A thickness of the sensor carrier of about 0.8 millimeters proves to be the optimum between the carrying capacity or mounting strength of the sensor carrier on the one hand and the applied material use and the consequent cost.
  • the temperature sensor Since the temperature sensor is to allow a conclusion on the temperature at the bottom of a cooking vessel during operation of a hob, it is to shield against heat from the heating element or the heating elements of the hob. For this purpose, a shading of the temperature sensor is generally provided.
  • the cooktop according to the invention can also be developed advantageous in that the sensor carrier consists of a material that absorbs infrared radiation poorly or reflects well, or that on its side facing away from the cooktop plate underside with a such material is coated.
  • the negative influence of the heating element on the measurement result of the temperature sensor can be further reduced and at least reduce the design effort for the shadowing of the temperature sensor.
  • a coating can be used, for example, a glass passivation.
  • a corresponding embodiment comprises a sensor carrier, which consists of an infrared radiation (IR) absorbing material and is coated with an IR-reflecting layer on its side facing away from the hob plate bottom.
  • the temperature sensor can be arranged both on the upper side and on the underside of the sensor carrier, then more sensibly between coating and sensor carrier.
  • the underside of the hob plate is provided in the region of the temperature sensor with a well-emitting in the infrared wavelength range stratification.
  • the attachment of the temperature sensor is of particular importance. On the one hand, it should be stable and durable and, on the other hand, it should be easy and error-free to install.
  • the attachment ensures the required minimum distance between the temperature sensor and the underside of the hob plate.
  • attachment For example, screwing, riveting or gluing in question.
  • the sensor carrier is mounted in the heating element in which it is inserted between an edge of the heating element and the hob plate in a recess in the edge and / or clamped at the edge with a latch.
  • the required position of the sensor carrier to maintain the minimum distance is defined in a simple manner.
  • the sensor carrier may be jammed at an opposite edge of the shade with a latch between the hob plate and the rim.
  • a latch between the hob plate and the rim.
  • one of the hob plate facing end face of the edge with this form a gap, in which the sensor carrier is inserted.
  • the bottom of the cooking vessel is often concave, so that it often rests in the cold state only in an edge region of the hob and thus the heating element in an annular surface on the hob plate, while it is spaced plate in the central residual region by an air gap of the hob. Therefore, temperature sensors are generally disposed on an edge of the heating element.
  • At least two, preferably three temperature sensor at the edge of the hob plate are arranged distributed uniformly over the circumference.
  • the values detected by the temperature sensor are supplied to software associated with the control of the cooktop, which forms an average value therefrom. This ensures a reliable detection of the temperature of the bottom of the cooking vessel.
  • three sensors an optimum in terms of a meaningful averaging on the one hand and the cost of the arrangement and interconnection of the sensors on the other hand found.
  • the temperature sensor is therefore provided with a coating, preferably a glass passivation layer against moisture absorption. It can be screen printed on the temperature sensor and include its leads.
  • Figure 1 shows a detail of a sectional view of a hob after the
  • FIG. 2 shows a comparable sectional view of the invention
  • FIG. 3 shows a sectional view along the line III-III in FIG. 2,
  • FIG. 4 shows a sectional view along the line IV-IV in FIG. 3,
  • FIGS. 6 a and b show an alternative arrangement of a sensor carrier
  • a hob 1 according to Figure 1, a hob plate 2, which consists of glass ceramic. Below the hob plate 2, a heating element 3 is arranged for heating a storeable on the hob 1 cooking vessel 4.
  • a heating element 3 is arranged for heating a storeable on the hob 1 cooking vessel 4.
  • the cooking vessel 4 is a frying pan or the like, is heated in the food is lying substantially on a bottom 5 of the cooking vessel 4, so is not additionally heated by the heat conduction of side walls, such as a liquid in a saucepan.
  • the bottom 5 is concave, at least in the cold state, so that it is only in an edge region in an annular surface on the hob plate 2, while in the enclosed by the annular surface of the central region of the bottom 5, an air gap to the hob plate 2.
  • the detection is directed to the bottom 5 of the cooking vessel 4.
  • a temperature sensor 6 is arranged in the edge region of the heating element 5. It is glued together with leads by means of a temperature-resistant and thermally conductive ceramic adhesive 7 in a metallic sleeve 8, which is in the largest possible contact with the underside of the hob plate 2.
  • the temperature of the bottom 5 by way of heat conduction through the hob plate 2 through the sleeve 8 is transmitted to the temperature sensor 6. So that the measurement results of the temperature sensor 6 are not influenced by the heat output of arranged in the heating element 3 Bandbyleitern 9, the metallic sleeve 8 is shadowed by an insulating block 10 against a heated interior 13 of the heating element 3. Together with a raised edge 11 of the heating element 3, the insulation block 10 forms a recess 12 into which the metallic sleeve 8 protrudes. It does not lie completely on the bottom of the recess 12 so that it can yield slightly to a blow on the hob plate 2. As a result, damage or breakage of the hob plate 2 can be avoided, especially if it consists of Glas ⁇ or glass ceramic material.
  • the temperature sensor 6 is in operation and thus immediately below the cooktop plate 2, a low voltage, for example, 5 to 10 volts to. According to VDE guidelines, therefore, measures must be taken so that no voltage flashover from the temperature sensor 6 to the cooking vessel 4 can take place.
  • the temperature sensor 6 is housed in the metallic sleeve 8, and the metallic sleeve 8 grounded by a contact, not shown. As a result, it is ensured in the known case that, despite thermally conductive conditioning of the electrically conductive metallic sleeve 8 and the temperature sensor 6 therein even in the case of breakage of the hob plate 2 is not a voltage flashover of the voltage applied to the temperature sensor 6 to the cooking vessel 4 via the temperature sensor 6 can come.
  • FIGs 2, 3 and 4 a first embodiment of the invention is shown in three sectional views.
  • the known from the prior art components are provided with the same reference numerals as in Figure 1.
  • the hob 1 according to Figures 2, 3 and 4 accordingly also comprises a hob plate 2, below which a heating element 3 is provided with a Bandterrorismleiter 9 and an insulation block 10 and a recess 12 immediately adjacent to a raised edge 11 of the heating element 3.
  • the hob plate 2 is in this as in the other embodiments of Figures 5 and 6 via a ring insulation, not shown, on the upstand 11 on. Instead of the ring insulation, only one gap is left in a simplified manner.
  • a sensor assembly 20 which has a plate-shaped sensor carrier 21, a temperature sensor 22, the supply conductor 23 ( Figure 4) and connecting wires 24.
  • the sensor carrier 21 comprises an upper side 25 facing the underside of the hob plate and an opposite lower side 26 to which the temperature sensor 22 and the feeders 23 are attached. The detailed structure of the sensor arrangement 20 will be described in more detail in FIG.
  • the feeders 23 are connected via a connection 27 to the connecting wires 24. They terminate in a connection section, not shown, which is connected during assembly of the sensor assembly 20 to a power supply.
  • the connection section is only bound to the space conditions on the outside of the upstand 11.
  • connection sections for BandMapleiter 9 and a temperature limiter In order to simplify the assembly of the hotplate 1, they are moved as close together as possible in terms of safety.
  • the connection sections for BandMapleiter 9 and the sensor assembly 20 can be combined in one component.
  • the temperature sensor 22 is mounted on the hob plate 2 opposite bottom of the sensor assembly 20.
  • a known PT 500 or a PT 1000 is used as a temperature sensor 22. He is also operated with a low voltage 5 to 10 volts.
  • the sensor assembly 20 is arranged by an attachment, not shown, and in the figures 5 a to 5c explained in more detail within the recess 12 that the temperature sensor 22 maintains a well-defined distance a to the underside of the hob plate 2.
  • the distance a has to be a value of four millimeters at an operating voltage of 5 to 10 volts according to VDE guidelines.
  • the distance a also causes the hob plate 2 at least slightly yield at a shock load a top of the hob plate 2 in the region of the sensor assembly 20, so can escape the load, without being hindered by the sensor assembly 20.
  • the load is absorbed by a ring insulation, not shown, over which the hob plate 2 rests on the heating element 3 in the region of the upstand 11. Thus, the risk of damage to the hob plate 2 or their break in this area is excluded.
  • the distance a also protects the sensor assembly 20 against impact loads on the top of the Hob 2, because it is no longer in direct contact with her and due to the distance a the shock loads are not forwarded to her.
  • the arrangement of the temperature sensor 22 on the sensor carrier 21 and the course of feeders 23 can be seen.
  • the temperature sensor 22 occupies a place in the front third of the sensor carrier 20 and is connected via the feeders 23 with connecting wires 24, which ensure the power supply of the temperature sensor 22.
  • the feeders 23 keep the minimum distance a required according to the VDE directive by being arranged on the same side of the sensor carrier 21 as the temperature sensor 22, since they must have a high temperature resistance, for example they become pasty Platinum mass applied to the sensor carrier 21 and then baked.
  • Zuleiter 23 which are highly resistant to corrosion, because they consist of an inert material. Due to their porosity, however, they attract water, which can lead to the separation of the feeders 23 from the sensor carrier 21. In contrast, they are protected with a glass passivation. Alternatively, they may consist of vapor-deposited metal, which, however, makes their production more expensive.
  • connection 27 is preferably arranged in a cold area, ie outside of the heating element 3, or in the region of the ring insulation, not shown, which extends between the upstand 11 and the hob plate 2 ,
  • FIGS. 5 a to 5 c three different attachment possibilities for the sensor arrangement 20 are shown by way of example.
  • An insulation block 30 according to FIG. 5a is U-shaped in cross section, so that it forms a depression 12 between two unequal legs 31, 32.
  • the sensor assembly 20 is placed on the end face 33 of the shorter of the two legs 32.
  • An end face 34 of the longer leg 31 serves as a support for the hob plate 2.
  • the difference between the lengths of the longer leg 31 and the shorter leg 32 thus defines the minimum distance a, the temperature sensor 22 must comply with respect to the underside of the hob plate 2. So that is the exact location of the temperature sensor 22 and the sensor assembly 20 by the configuration of the insulation block 30th definable.
  • a bolt 35 is inserted between it and the underside of the hob plate 2.
  • the sensor assembly 20 is clamped in its defined position, so that it protrudes freely projecting into the recess 12. Since not only the temperature sensor 22 and its feeders 23, but also the adjoining the lead 23 connecting wires 24 must comply with the minimum distance a from the bottom of the hob plate 2, in the upstand 11 of the heating element 3 in the region of the insulation block 30, a channel 36th arranged in which the connecting wires 24 extend.
  • FIG. 5 b An alternative mounting option for a sensor arrangement 20 is shown in FIG. 5 b.
  • the insulation block 40 there also has in a cross section a U-shaped configuration with a recess 12 between two unequal-length legs 41, 42. Similar to the arrangement described above, here also defines an end face 43 of the shorter leg 42 a minimum distance a from the bottom of the hob plate 2.
  • a groove 44 for receiving a front edge of the sensor assembly 20th educated. It cooperates with a chamfer 45, which is formed on an edge of a clamping piece 46.
  • the sensor assembly 20 is secured by being inserted between the hob plate 2 and insulation block 40 with its front edge 48 in the groove 44 and is stored with the opposite edge 49 on the end face 43.
  • the connecting wires 24 are inserted into a connecting channel 47, which is milled in both the shorter leg 42 and in the upstand 11.
  • the clamping piece 46 is now inserted between the hob plate 2 and the upstand 11 or the insulation block 40. Characterized the sensor assembly 20 is clamped between the groove 44 and the chamfer 45 in its intended position. For clarity only, a gap between the clamping piece 46 and the upstand 11 and the leg 42 is shown in Figure 5b, which does not exist in the assembled state of the sensor assembly 20.
  • FIG. 5c shows a further, similar fastening variant:
  • the sensor arrangement 20 is clamped between a groove 50 on the one hand and two chamfers 51, 52 which are respectively arranged on an edge of the upstand 11 and an edge of a clamping piece 53. It is in turn a connection channel 54 arranged in the upstand 11, in which the connecting wires 24 are laid.
  • FIG. 5 c furthermore shows a different configuration of shading for the sensor arrangement 20: A balcony-like projection 55, which forms a recess 12 like the previously described insulation blocks 30, 40, is arranged on the upstand 11. This makes it possible to bring the Bandsammlungleiter 9 up to the upstand 11. The arrangement of Bandterrorisms 9 is therefore not limited by the shading.
  • a hob 1 closes in the manner described above between its heating element 3 and a hob plate 2 a heater by band 9 heated interior 13 a.
  • a shading 90 which is integrally formed on a raised edge 11 on the heating element 3 in the manner of a balcony. It has a substantially rectangular cross-section and forms a recess 91 on its upper side facing the hob plate 2.
  • the depression 91 is surrounded by edges 92 on the three sides, with which the shading 90-viewed in plan view-protrudes into the heatable interior 13.
  • the recess 91 continues into an opening 93 in the upstand 11.
  • a shoulder 94 which is U-shaped in plan view extends.
  • a sensor assembly 80 is arranged in the recess 91 and thus between the hob plate 2 and the shading 90. It comprises a sensor carrier 81, on the hob plate 2 remote from the bottom, a temperature sensor 82 is attached. It is supplied via feeder 83 and leads 84 with operating voltage.
  • the temperature sensor 82 is arranged on the sensor carrier 81 in such a way that the sensor carrier 81 forms on all sides around the temperature sensor 82 a rim 85 which has at least the width b.
  • the sensor carrier 81 also has a material thickness d.
  • the sensor assembly 80 receives its intended position by being deposited with the edge 85 of the sensor carrier 81 on the shoulder 94 of the recess 91. If the hob plate 2 is not yet mounted, the sensor assembly 80 can be inserted from an upper side of the shading in the recess.
  • the recess 91 is dimensioned in dimensions so that the sensor assembly 80 almost completely filled out.
  • hob plate 2 z. As in an exchange of the sensor assembly 80, it is inserted through the opening 93 in the upstand 11, ie laterally into the heating element 3 under the hob plate 2 in the recess 91 of the shading 90.
  • the circumferential shoulder 94 in the recess 91 care is taken that while the temperature sensor 82 damage place in the recess 91 finds.
  • the sensor carrier 81 lies with its edge 85 on the shoulder 94 of the depression 91.
  • the shoulder 94 frames a bottom 96 of the depression 91 and serves as a spacer for the sensor carrier 81.
  • the shoulder is on the shoulder 94 lying sensor carrier 81 by a slight gap 97 from the bottom 96 of the recess 91 spaced.
  • the arranged on the underside of the sensor carrier 81 temperature sensor 82 protrudes into the intermediate space 97, without touching the bottom 96.
  • the space 97 formed between the sensor carrier 81 and the bottom 96 of the recess 91 is almost closed. Influences on the temperature sensor 82 due to water evaporating from the hygroscopic insulating material are therefore reduced.
  • the minimum distance is complied with in accordance with VDE guidelines. It is ensured by the fact that the sensor carrier 81 consists of a good electrical insulating material, preferably ceramic. Thus, the direct distance of the temperature sensor 82 from the underside of the hob plate 2 is no longer the critical size. Rather, a creepage distance Ci, C 2 shown in Figure 6a is now decisive, so that path, the current from the temperature sensor 82 on the sensor carrier 81st should take over to the bottom of the hob plate 2.
  • the creepage distance Ci, C 2 is composed of a proportion Ci, which corresponds to the width b of the edge 85 of the sensor carrier 81, and a proportion C 2 corresponding to the thickness d. Both the width b of the edge 85 and the thickness d of the sensor carrier 81 are dimensioned such that a minimum dimension for the creepage distance Ci, C 2 of at least 4 mm is complied with in accordance with VDE guidelines. In this way, the sensor arrangement 80 can be moved particularly close to the underside of the hob plate 2. This allows for a space-saving Construction and on the other hand the shortest possible transmission path of the heat radiation. Thus, the distance between the bottom of the hob plate 2 and the top of the sensor carrier 81 can reduce to a value below one millimeter.
  • FIG. 7 shows a sectional view through a sensor arrangement 20:
  • a sensor carrier 60 is provided on its upper side, which faces the underside of the hob plate 2, with a coating 61 which absorbs radiation well in an infrared wavelength range. It thus provides a good thermal coupling between the sensor carrier
  • the sensor carrier 60 has, on its underside facing away from the cooktop plate 2, a temperature sensor 62, which overlies the coating
  • the temperature sensor 62 detected via thermal conduction in the sensor carrier 60 coupled thermal radiation.
  • the temperature sensor 62 in turn is coated with a glass passivation 63 which prevents the temperature sensor 62 or its feeders from absorbing moisture.
  • the glass passivation 63 must be resistant to cracking even with large temperature fluctuations.
  • Figure 8 illustrates a principle distribution of temperature sensor 70 along the circumference of a heating element 3. Accordingly, an optimal arrangement of three temperature sensor 70 with an angular distance of 120 0 C with each other as low, because this arrangement on the one hand for a uniform detection of the detected Temperature of a cooking vessel can be used and on the other hand, the material or cost is not excessive. LIST OF REFERENCE NUMBERS

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Electric Stoves And Ranges (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

L'invention concerne une plaque de cuisson comprenant une plaque, notamment en vitrocéramique, sous laquelle est monté au moins un élément chauffant pour chauffer un ustensile de cuisson posé sur la plaque, ainsi qu'un capteur de température pour saisir la température de la plaque de cuisson. L'invention est caractérisée en ce que le capteur de température est disposé à un intervalle ne pouvant être occupé et sans contact relativement à la plaque de cuisson.
PCT/EP2005/055243 2004-10-29 2005-10-13 Plaque de cuisson dotee d'un capteur de temperature Ceased WO2006045705A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004053012.2 2004-10-29
DE102004053012.2A DE102004053012B4 (de) 2004-10-29 2004-10-29 Kochfeld mit einem Temperatursensor

Publications (1)

Publication Number Publication Date
WO2006045705A1 true WO2006045705A1 (fr) 2006-05-04

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PCT/EP2005/055243 Ceased WO2006045705A1 (fr) 2004-10-29 2005-10-13 Plaque de cuisson dotee d'un capteur de temperature

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WO (1) WO2006045705A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021111260A1 (de) * 2021-04-30 2022-11-03 Infrasolid Gmbh Thermische Strahlungsquelle und Verfahren zur Messung der exakten Temperatur und / oder abgestrahlten Strahlungsleistung der thermischen Strahlungsquelle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2192279A (en) * 1983-09-10 1988-01-06 Micropore International Ltd Thermal cut-out devices for radiant heaters
EP0551172A2 (fr) * 1992-01-10 1993-07-14 Ceramaspeed Limited Plaque de cuisson en vitro-céramique muni de plusieurs zones de chauffage
WO1995016334A1 (fr) * 1993-12-06 1995-06-15 Aktiebolaget Electrolux Dispositif permettant de determiner la charge thermique d'une zone de cuisson

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Publication number Priority date Publication date Assignee Title
GB2071969B (en) 1980-03-05 1983-09-21 Kenwood Mfg Co Ltd Cooking apparatus
GB2335541A (en) 1998-03-20 1999-09-22 Ceramaspeed Ltd Electric heater comprising a temperature sensing and limiting arrangement
DE19942967A1 (de) 1999-09-09 2001-03-15 Ego Elektro Geraetebau Gmbh Strahlheizkörper
DE10006953A1 (de) 2000-02-16 2001-08-23 Bsh Bosch Siemens Hausgeraete Kochfeld mit Temperaturfühler
GB0116884D0 (en) 2001-07-11 2001-09-05 Ceramaspeed Ltd Temperature sensor assembly and radiant electric heater incorporating the same
DE10163549A1 (de) 2001-10-15 2003-04-30 Heraeus Electro Nite Gmbh Temperatur-Sensor mit einem Sensor-Element sowie dessen Verwendung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2192279A (en) * 1983-09-10 1988-01-06 Micropore International Ltd Thermal cut-out devices for radiant heaters
EP0551172A2 (fr) * 1992-01-10 1993-07-14 Ceramaspeed Limited Plaque de cuisson en vitro-céramique muni de plusieurs zones de chauffage
WO1995016334A1 (fr) * 1993-12-06 1995-06-15 Aktiebolaget Electrolux Dispositif permettant de determiner la charge thermique d'une zone de cuisson

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DE102004053012B4 (de) 2023-01-12
DE102004053012A1 (de) 2006-05-04

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