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WO2005116670A1 - Appareil d’inspection de carte imprimee et procede d’inspection de carte imprimee - Google Patents

Appareil d’inspection de carte imprimee et procede d’inspection de carte imprimee Download PDF

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Publication number
WO2005116670A1
WO2005116670A1 PCT/JP2005/009571 JP2005009571W WO2005116670A1 WO 2005116670 A1 WO2005116670 A1 WO 2005116670A1 JP 2005009571 W JP2005009571 W JP 2005009571W WO 2005116670 A1 WO2005116670 A1 WO 2005116670A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
plate
inspected
inspection
intermediate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/009571
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English (en)
Japanese (ja)
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Satoshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of WO2005116670A1 publication Critical patent/WO2005116670A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards

Definitions

  • the present invention provides a circuit board to be subjected to an electrical inspection (hereinafter referred to as a "circuit board to be inspected”) which is pressed by an upper inspection jig and a lower inspection jig from both sides.
  • the present invention relates to a circuit board inspection apparatus and a circuit board inspection method for inspecting electrical characteristics of a circuit board to be inspected while electrodes formed on both surfaces of the circuit board to be inspected are electrically connected to a tester.
  • a printed circuit board on which an integrated circuit or the like is mounted is inspected for electrical characteristics before mounting the integrated circuit or the like in order to confirm that a wiring pattern of the circuit board has predetermined performance.
  • an inspection head is incorporated into an inspection tester provided with a circuit board transport mechanism, and different circuit boards are inspected by replacing the inspection head part.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 6-94768
  • a metal inspection pin that is in electrical contact with an electrode to be inspected on a circuit substrate to be inspected is planted on the substrate.
  • a method using an inspection jig with the installed structure has been proposed! RU
  • Patent Document 2 JP-A-5-159821
  • an inspection head having conductive pins, a circuit board for pitch conversion called off-grid adapter, and an anisotropic conductive sheet are used.
  • a method using a combined inspection jig is known.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 6-94768
  • a method using an inspection jig for directly bringing a metal inspection pin into contact with an electrode to be inspected on a circuit board to be inspected There is a possibility that the electrodes of the circuit board to be inspected may be damaged due to the contact with the metal conductive pins.
  • circuits on circuit boards have become finer and higher in density, and when such printed circuit boards are inspected, it is necessary to simultaneously conduct a large number of conductive pins to the electrodes to be inspected on the circuit boards to be inspected. Needs to press the inspection jig with high pressure, The electrode to be inspected is easily damaged.
  • an electrode to be inspected on a circuit board to be inspected is pinched via an anisotropic conductive sheet. Since the electrode of the circuit board to be tested comes into contact with the electrode of the circuit board, the electrode to be tested on the circuit board to be tested is not easily damaged. In addition, since a board that performs pitch conversion is used, the inspection pins that are to be implanted on the substrate can be implanted at a pitch that is wider than the pitch of the electrodes to be inspected on the circuit board to be inspected. There is also an advantage that the cost of manufacturing the inspection jig can be reduced without having to implant the inspection pin in the above.
  • Inspection jig it is necessary to create a pitch conversion board and an inspection jig for implanting inspection pins for each circuit board to be inspected. Inspection jigs are required in the same number as the number of printed circuit boards to be inspected.
  • FIG. 25 is a sectional view of an inspection apparatus using such a universal type inspection jig.
  • This inspection apparatus includes a pair of a first inspection jig 11 la and a second inspection jig 11 lb.
  • These inspection jigs include circuit board side connectors 121a and 121b, a relay pin unit 131a, 131b and tester side connectors 141a and 141b.
  • the circuit board side connectors 121a and 121b include pitch conversion boards 123a and 123b, and anisotropic conductive sheets 122a, 122b, 126a and 126b disposed on both sides thereof.
  • the relay pin units 131a and 131b are provided with a large number of (for example, 5000 pins) conductive pins 132a and 132b arranged on a grid point at a fixed pitch (for example, 2.54 mm pitch), and the conductive pins 132a and 132b can be moved up and down. It has a pair of supporting insulating plates 134a and 134b.
  • the tester-side connectors 141a and 141b include connector boards 143a and 143a for electrically connecting the tester and the conductive pins 132a and 132b when the circuit board 101 to be inspected is clamped by the inspection jigs 11la and 111b.
  • 143b anisotropic conductive sheets 142a and 142b placed on conductive pins 132a and 132bftlJ of connector boards 143a and 143b, and base plates 146a and 146b.
  • the circuit board side connectors 121a and 121b are replaced with ones corresponding to the inspected circuit board 101.
  • the relay pin units 13 la, 13 lb and the tester-side connectors 141a, 141b can be used in common.
  • the printed wiring board which is the circuit board 101 to be inspected, has been multi-layered and has a high density.
  • the electrodes to be inspected 102 and 103 such as solder ball electrodes such as BGA in the thickness direction. And warping of the substrate itself. Therefore, in order to achieve electrical connection to the electrodes to be inspected 102 and 103, which are inspection points on the circuit board 101 to be inspected, the first inspection jig 11 la and the second inspection jig 11 lb are required. It is necessary to apply high pressure to deform the circuit board 101 to be inspected flat.
  • the height of the electrodes to be inspected 102 and 103 by the first inspection jig 11la and the second inspection jig 11lb should be followed. Nature is required.
  • an imaging device such as a CCD camera is arranged on the back side of the pitch conversion board, and a window hole is formed in the pitch conversion board, anisotropic conductive sheet, etc. disposed between the circuit board to be inspected and the imaging device.
  • the force required to image the alignment mark of the circuit board to be inspected through this window hole In the universal type inspection jig described above, a large number of conductive pins 132a and 132b are densely arranged at regular intervals. Therefore, it is not possible to adopt an optical alignment method that makes a space for arranging the imaging device small.
  • Patent Document 1 JP-A-6-94768
  • Patent Document 2 JP-A-5-159821
  • Patent Document 3 JP-A-7-248350
  • Patent Document 4 JP-A-8-271569
  • Patent Document 5 JP-A-8-338858
  • the present invention has been made in order to solve the above-described problems of the related art. Even when a circuit board to be inspected has minute electrodes with a minute pitch, the present invention is not limited to the above. It is an object of the present invention to provide a circuit board inspection apparatus and an inspection method capable of performing an electrical inspection with high reliability, and capable of efficiently performing alignment between an inspection jig and a circuit board to be inspected. .
  • the present invention provides a circuit board capable of performing an accurate inspection with good responsiveness to variations in the height of an electrode to be inspected of a circuit board to be inspected, without causing a conduction failure.
  • the purpose of the present invention is to provide an inspection apparatus and an inspection method.
  • the present invention provides a circuit board inspection apparatus and an inspection method which are excellent in durability of repeated use of an anisotropic conductive sheet, have a small number of replacements of the anisotropic conductive sheet, and have high inspection work efficiency.
  • the present invention eliminates the necessity of arranging the conductive pins at regular intervals. Therefore, it is possible to reduce the cost of piercing the insulating plate holding the conductive pins by drilling the through-holes. It is an object of the present invention to provide a circuit board inspection apparatus and an inspection method that are possible.
  • the present invention provides a method for inspecting a circuit board having a good inspection workability, in which it is not necessary to correct the positional deviation of the anisotropic conductive sheet when performing a repeated continuous inspection on a circuit board to be inspected. It is intended to provide an apparatus and an inspection method.
  • the circuit board in a repeated and continuous inspection of a circuit board to be inspected to be inspected, when the anisotropic conductive sheet is deteriorated, the circuit board can be easily replaced when the anisotropic conductive sheet is deteriorated.
  • the circuit board inspection apparatus of the present invention uses a pair of a first inspection jig and a second inspection jig to perform an inspection between both inspection jigs on both sides of a circuit board to be inspected.
  • the first inspection jig and the second inspection jig are each
  • a second anisotropic conductive sheet disposed on the opposite side of the pitch conversion board from the circuit board to be inspected;
  • a circuit board side connector having
  • An intermediate holding plate disposed between the first insulating plate and the second insulating plate
  • a relay pin unit which is disposed at a different position from the projected intermediate holding plate projection surface,
  • a connector board for electrically connecting the tester and the relay pin unit, a third anisotropic conductive sheet disposed on the relay pin unit side of the connector board, and a relay pin unit of the connector board.
  • An imaging device is provided between the first insulating plate and the intermediate holding plate or between the second insulating plate and the intermediate holding plate in one of the inspection jigs.
  • the imaging device such as a CCD camera may be entirely or partially embedded in, for example, an insulating plate or an intermediate holding plate, or may be disposed on an upper surface of the insulating plate or the intermediate holding plate. Good.
  • the imaging device may be used to perform alignment between the circuit board to be inspected and the pitch conversion board by imaging an alignment mark of the circuit board to be inspected.
  • the first inspection jig and the second inspection jig press the circuit board to be inspected, which is to be inspected, from both sides of the circuit board to perform an electrical inspection
  • Initial stage of pressurization On the floor, the movement of the conductive pins of the relay pin unit in the thickness direction, the rubber elastic compression of the first anisotropic conductive sheet, the second anisotropic conductive sheet, and the third anisotropic conductive sheet
  • the variation in the height of the electrodes to be inspected on the circuit board to be inspected can be absorbed to some extent.
  • the first contact support position of the first support pin with respect to the intermediate holding plate and the second contact support position of the second support pin with respect to the intermediate holding plate are determined by the thickness of the intermediate holding plate.
  • the circuit board to be inspected is further pressurized between the first inspection jig and the second inspection jig because they are arranged at different positions on the intermediate holding plate projection surface projected in the vertical direction.
  • the first anisotropic conductive sheet Due to the panel elasticity of the second insulating plate and the intermediate holding plate disposed between the first insulating plate and the second insulating plate, the height variation of the electrode to be inspected on the circuit to be inspected, for example, the solder ball electrode
  • the pressure concentration can be dispersed in order to avoid local stress concentration. That.
  • an imaging device such as a CCD camera can be arranged in the relay pin unit in which it is not necessary to spread the conductive pins at a fixed pitch at a high density. For this reason, for example, by arranging a CCD camera at a position between the first insulating plate and the intermediate holding plate or between the second insulating plate and the intermediate holding plate in the lower inspection jig, The position adjustment mark of the circuit board to be inspected provisionally arranged by the position adjustment mechanism is imaged through a window provided in the pitch conversion substrate, anisotropic conductive sheet, or the like, between them. Based on this, the circuit board to be inspected can be relatively moved via the position adjusting mechanism to perform the alignment.
  • the position adjusting mechanism is provided between the first insulating plate and the intermediate holding plate or between the second insulating plate and the intermediate holding plate in the relay pin unit of one of the inspection jigs. Setting With a movable plate
  • a driving device for moving the movable plate.
  • the alignment mark of the circuit board to be inspected supported by the circuit board support pins is imaged by the imaging device, and based on the result, the movable plate is moved by the driving device.
  • the circuit board is moved in a horizontal direction or a rotating direction, thereby adjusting a relative position between the circuit board to be inspected and the pitch conversion board.
  • the movable plate As the movable plate, a through hole through which the first support pin or the second support pin and the conductive pin are penetrated is formed, and the movable plate force S is set relative to the support pin and the conductive pin. Anything that can be moved can be used. Accordingly, the movable plate can be arranged at a position between the insulating plate of the relay pin unit and the intermediate holding plate where a large number of pins are arranged so as to be movable in the horizontal and rotational directions. .
  • the circuit board support pin to be inspected there is provided an outer tube portion, and a rod-shaped expander and contractor housed inside the outer tube portion and protruding in the axial direction at one end of the outer tube portion.
  • a rod-shaped expander and contractor housed inside the outer tube portion and protruding in the axial direction at one end of the outer tube portion.
  • it can be used that is attached to the outer cylindrical portion via an elastic member and held so as to be movable in the axial direction.
  • the circuit board to be inspected held at the distal end of the expander is moved to the predetermined position by moving the movable plate in the horizontal or rotational direction, and then the circuit board to be inspected is pressed and the elastic member is pressed.
  • the expander By moving the expander downward in the axial direction against the elastic force of the substrate, the electrical connection between the electrode to be inspected on the circuit board to be inspected and the connection electrode of the pitch conversion board is ensured.
  • the contact surface of the inspection jig and the circuit board to be inspected can be brought into contact with each other in a state where they are accurately aligned.
  • the imaging device it is preferable to use a plurality of CCD cameras on one inspection jig, which is preferable to use a CCD camera.
  • the pair of first and second inspection jigs presses both surfaces of the circuit board to be inspected, which is an inspection target, between the two inspection jigs. Edge To
  • the intermediate holding plate is bent in the direction of the second insulating plate around a first contact support position of the first support pin with respect to the intermediate holding plate,
  • the present invention is characterized in that the intermediate holding plate is configured so as to extend in the direction of the first insulating plate around a second contact support position of the second support pin with respect to the intermediate holding plate.
  • the first contact support position of the first support pin with respect to the intermediate holding plate is arranged in a grid on the intermediate holding plate projection plane
  • a second contact support position of the second support pin with respect to the intermediate holding plate is arranged in a grid on the intermediate holding plate projection plane
  • one second contact support position is arranged in a unit lattice area where four adjacent first contact support position forces are also provided,
  • one first contact support position is arranged in a unit lattice region where four adjacent second contact support position forces are also provided.
  • the first contact support position and the second contact support position are arranged in a grid pattern, and the first contact support position and the second contact support position are arranged in a grid pattern.
  • the grid points of the support positions are all shifted from each other.
  • the intermediate holding plate is deflected in the directions opposite to each other with the first contact support position and the second contact support position as centers, and the first inspection jig and the second inspection jig.
  • the panel elasticity of the intermediate holding plate is further exerted.
  • a plurality of intermediate holding plates are disposed between the first insulating plate and the second insulating plate at a predetermined interval.
  • Holding plate support pins are arranged between these adjacent intermediate holding plates, between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, and Is characterized in that the imaging device is provided between the intermediate holding plates.
  • the imaging device such as a CCD camera may be entirely or partially embedded in, for example, an insulating plate or an intermediate holding plate, or may be mounted on the upper surface of the insulating plate or the intermediate holding plate. You may.
  • the circuit board inspection device of the present invention may be arranged such that the relay pin unit of one of the inspection jigs has a portion between the first insulating plate and the intermediate holding plate, and a portion between the second insulating plate and the intermediate holding plate.
  • a movable plate provided between and, or between the intermediate holding plates,
  • a plurality of circuit-inspected circuit board support pins which are inserted through through holes formed in the conductive sheet and support the circuit-inspected board vertically at its leading end;
  • a position adjusting mechanism comprising a driving device for moving the movable plate
  • the position adjusting mechanism moves the movable plate by the driving device based on a result of imaging the alignment mark of the circuit board to be inspected supported by the circuit board support pins by the imaging device. This adjusts the relative position between the circuit board to be inspected and the pitch conversion board.
  • the movable plate is provided with a through hole through which the first support pin, the second support pin, or the holding plate support pin and the conductive pin pass. , It is characterized in that the movable plate is configured to be able to move relative to the support pins and the conductive pins.
  • the circuit board support pin to be inspected is housed in an outer cylinder portion and the outer cylinder portion, and one end of the outer cylinder portion has a rod-like shape protruding in the axial direction.
  • An expander is provided, and the expander is attached to the outer cylindrical portion via an elastic member, and is held movably in the axial direction.
  • the imaging device it is preferable to use a plurality of CCD cameras on one inspection jig, which is preferable to use a CCD camera.
  • the panel elasticity is further exerted by the plurality of intermediate holding plates, and the pressure concentration is dispersed with respect to the variation in the height of the electrodes to be inspected on the circuit board to be inspected.
  • local stress concentration can be further avoided, and local damage to the anisotropic conductive sheet is suppressed.
  • repeated use of the anisotropic conductive sheet improves durability. The frequency of sheet replacement is reduced, and inspection work efficiency is improved.
  • a holding plate support pin which is in one-side force contact with the intermediate holding plate, has a contact support position with respect to the intermediate holding plate.
  • the contact support position of the first support pin, the second support pin, or the holding plate support pin with respect to the intermediate holding plate that is in contact with the intermediate holding plate on the other surface side is determined by the thickness of the intermediate holding plate. It is arranged at a different position on the projection surface of the intermediate holding plate projected in the vertical direction.
  • the contact support position of the holding plate support pin with the intermediate holding plate is displaced between the adjacent intermediate holding plates, so that the panel elasticity of the plurality of intermediate holding plates is adjusted.
  • the pressure concentration is dispersed against the height variation of the electrodes to be inspected on the circuit board to be inspected, and the local stress concentration can be further avoided. Local damage of the anisotropic conductive sheet is suppressed, and as a result, the repeated use durability of the anisotropic conductive sheet is improved, so that the number of times of replacement of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.
  • the circuit board inspection apparatus of the present invention may be arranged such that all of the intermediate holding plates include the intermediate holding plate.
  • the contact support position of the pin or the holding plate support pin with respect to the intermediate holding plate may be different from each other on the intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate.
  • the contact support positions from both sides are shifted from each other, so that the first insulating plate, the second insulating plate, and the intermediate holding plate
  • the elastic force is further exerted, and the pressure concentration is dispersed against the height variation of the electrodes to be inspected on the circuit board to be inspected.
  • Local damage of the conductive sheet is suppressed, and as a result, the durability of repeated use of the anisotropic conductive sheet is improved, so that the number of times of replacement of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.
  • the circuit board inspection device of the present invention includes a first insulating plate or a first insulating plate and an intermediate holding plate between the imaging device and the circuit board to be inspected, a pitch conversion substrate, A window hole is formed in the first and second anisotropic conductive sheets for imaging the alignment mark of the circuit board to be inspected,
  • Positioning marks for positioning the pitch converting substrate and the circuit board to be inspected by imaging with the imaging device are provided around the window holes formed in the pitch converting substrate. Being characterized by that.
  • an alignment mark provided around the window hole of the pitch conversion substrate is imaged by the imaging device, and the position of the circuit board to be inspected is determined based on the imaging data.
  • the correct position in the window hole where the alignment mark is to be located is calculated, and the position of the alignment mark on the circuit board to be inspected is determined by the above-mentioned position adjustment mechanism from the misalignment between the actual imaging position and the correct position. Alignment can be performed by calculating the direction and distance of movement of the inspection circuit board.
  • the alignment mark provided on the pitch conversion substrate can be provided by forming a metal pattern by photo-etching around the window hole on the surface on the relay pin unit side.
  • the first anisotropic conductive sheet is an anisotropic conductive sheet in which conductive particles are arranged in a thickness direction and uniformly dispersed in a plane direction.
  • the conductive particles are arranged in the thickness direction and the anisotropic conductive sheet dispersed in the plane direction is used as the first anisotropic conductive sheet, it is somewhat Even if the position is shifted, good electrical connection between the circuit board to be inspected and the first anisotropic conductive sheet is ensured.
  • the second anisotropic conductive sheet includes a plurality of conductive path forming portions extending in a thickness direction, and an insulating portion that insulates the conductive path forming portions from each other. That is, the conductive particles are contained only in the conductive path forming portion, whereby the conductive particles are non-uniformly dispersed in the surface direction, and the conductive path forming portion protrudes toward one surface of the sheet! /, Features! /, Ru.
  • the third anisotropic conductive sheet may include a plurality of conductive path forming portions extending in a thickness direction, and an insulating member that insulates the conductive path forming portions from each other.
  • the conductive particles are contained only in the conductive path forming part, whereby the conductive particles are dispersed non-uniformly in the plane direction, and the conductive path forming part protrudes to one side of the sheet! /, Features! /, Ru.
  • the second anisotropic conductive sheet and the third anisotropic conductive sheet include the conductive path forming portion and the insulating portion, and the conductive particles are contained only in the conductive path forming portion.
  • the pressing force and impact due to the pressing of the inspection jig can be used for these sheets. And thereby the deterioration of the first anisotropic conductive sheet is suppressed.
  • the plurality of conductive pins include a rod-shaped central portion shorter than an interval between the first insulating plate and the second insulating plate, and both ends of the central portion. Formed of a pair of end portions having a diameter larger than that of the central portion,
  • Each of the pair of end portions penetrates a through hole having a diameter larger than that of the central portion formed on the first insulating plate and the second insulating plate and having a diameter larger than that of the pair of end portions.
  • the conductive pin is supported movably in the axial direction.
  • the conductive pin is inserted between the first insulating plate and the intermediate holding plate, between the second insulating plate and the intermediate holding plate, or between the intermediate holding plates.
  • a bent holding plate having a through hole formed is provided,
  • the plurality of conductive pins are laterally pressed in mutually opposite directions with the through-holes formed in the first and second insulating plates and the through-hole formed in the bending holding plate as fulcrums, and the bending is performed.
  • the conductive pin is bent at the position of the through hole of the holding plate, whereby the conductive pin is supported movably in the axial direction.
  • the conductive pins can be held between the first insulating plate and the second insulating plate so as to be movable in the axial direction and not to fall off. Further, since a simple pin having a columnar structure can be used as the conductive pin, the cost of the conductive pin and a member holding the pin can be reduced as a whole.
  • a circuit board inspection method of the present invention is a circuit board inspection method using the above-described circuit board inspection apparatus,
  • the first inspection jig is performed after the alignment of the circuit board to be inspected and the pitch conversion board is performed.
  • the electrical inspection is performed by pressing both sides of the circuit board to be inspected between the tool and the second inspection jig.
  • a circuit board inspection method of the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,
  • the imaging device By using the imaging device to image the alignment mark provided on the circuit board to be inspected and the alignment mark provided on the board for pitch conversion, the circuit board for inspection and the board for the pitch conversion are imaged. After the alignment with the substrate, electrical inspection is performed by pressing both surfaces of the circuit board to be inspected between the first inspection jig and the second inspection jig.
  • the position of the circuit board to be inspected is determined based on the alignment mark of the pitch conversion board imaged by the imaging device.
  • a true position where the alignment mark should be located in the imaging visual field is calculated, and an actual position of the alignment mark of the circuit board to be inspected imaged by the imaging device in the imaging visual field, and the correct position are calculated. Based on the amount of gap between! It is characterized by performing positioning.
  • an imaging device is provided in the relay pin unit, and the positioning is performed using the imaging device. Therefore, the positioning can be performed efficiently with high accuracy.
  • a highly reliable electrical inspection can be performed.
  • the alignment between the circuit board and the pitch conversion board and the alignment between the pitch conversion board and the relay pin unit can be efficiently performed.
  • FIG. 1 is a cross-sectional view illustrating an embodiment of an inspection device of the present invention.
  • FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection.
  • FIG. 3 is a diagram showing a surface of a circuit board side of a pitch conversion board.
  • FIG. 4 is a diagram showing a pin-side surface of a pitch conversion substrate.
  • FIG. 5 is a partial cross-sectional view of a first anisotropic conductive sheet.
  • FIG. 6 is a partial cross-sectional view of a second anisotropic conductive sheet.
  • FIG. 7 is a cross-sectional view showing a state where a first anisotropic conductive sheet is laminated on a pitch conversion substrate.
  • FIG. 8 is a sectional view of a center pin unit.
  • FIG. 9 is a cross-sectional view showing a part of conductive pins, an intermediate holding plate, and an insulating plate of the relay pin unit.
  • FIG. 10 is a sectional view similar to FIG. 9, showing another example of the configuration of the relay pin unit. It is.
  • FIG. 11 is a cross-sectional view showing a process up to disposing conductive pins between a first insulating plate and a second insulating plate in the configuration of FIG.
  • FIG. 12 is a cross-sectional view of a relay pin unit in which a bending holding plate is arranged.
  • FIG. 13 is a partially enlarged view of an intermediate holding plate projection surface projected in the thickness direction of the intermediate holding plate of the relay pin unit.
  • FIG. 14 is a partially enlarged cross-sectional view illustrating an embodiment of the inspection device of the present invention.
  • FIG. 15 is a partially enlarged cross-sectional view illustrating a use state of the inspection device according to one embodiment of the present invention.
  • FIG. 16 is a partially enlarged cross-sectional view illustrating a use state of a relay pin unit of the inspection device of the present invention.
  • FIG. 17 is a partially enlarged cross-sectional view illustrating a use state of the inspection device according to one embodiment of the present invention.
  • FIG. 18 is a sectional view similar to FIG. 11, illustrating an embodiment of the inspection device of the present invention.
  • FIG. 19 is an enlarged sectional view of the relay pin unit.
  • FIG. 20 is a sectional view illustrating a mechanism for adjusting the position of a circuit board to be inspected in one embodiment of the inspection apparatus of the present invention.
  • FIG. 21 is a top view showing an example of a movable plate.
  • FIG. 22 is a side view showing a mechanism for adjusting the position of a circuit board to be inspected using the movable plate of FIG. 18.
  • FIG. 23 is a diagram showing an example of a substrate support pin.
  • FIG. 24 is a diagram for explaining a method of aligning a circuit board to be inspected by a CCD camera arranged in a relay pin unit.
  • FIG. 25 is a cross-sectional view of a conventional circuit board inspection apparatus.
  • first inspection jig and the second inspection jig for example, the circuit board side connector 21a and the circuit board side connector 21b, the first anisotropic conductive
  • the symbols "a” and "b” may be omitted (for example, the first anisotropic conductive sheet 22a and the The first anisotropic conductive sheet 22b may be collectively referred to as "first anisotropic conductive sheet 22").
  • FIG. 1 is a cross-sectional view showing an embodiment of the inspection apparatus of the present invention
  • FIG. 2 is a cross-sectional view showing a stacked state when the inspection apparatus of FIG. 1 is used for inspection
  • FIG. Fig. 4 shows the pin-side surface of the pitch conversion board.
  • Fig. 4 shows the pin-side surface of the pitch conversion board.
  • This inspection device inspects printed circuit boards for mounting integrated circuits, etc. In the circuit board 1 to be inspected, an electrical inspection of the circuit board to be inspected is performed by measuring an electric resistance between electrodes to be inspected.
  • this inspection apparatus includes a first inspection jig 11a disposed on the upper surface of the circuit board 1 to be inspected, and a second inspection jig 11a disposed on the lower surface.
  • the inspection jigs l ib are arranged so as to face each other up and down.
  • the first inspection jig 11a includes a circuit board-side connector 21a having an anisotropic conductive sheet (a first anisotropic conductive sheet 22a and a second anisotropic conductive sheet 26a) on both sides thereof, and a middle connector 21a. «I-pin unit 31a is provided. Further, the first inspection jig 11a includes a tester side connector 41a including a connector board 43a on which the third anisotropic conductive sheet 42a is disposed and a base plate 46a on the side of the relay pin unit 31a. .
  • the second inspection jig l ib is also configured in the same manner as the first inspection jig 11a, and has an anisotropic conductive sheet (the first anisotropic conductive sheet 22b and the second It has a circuit board side connector 21b provided with one conductive sheet 26b) and a relay pin unit 31b. Also a second inspection The jig lib is provided with a connector board 43b on which the anisotropic conductive sheet 42b is disposed on the 3 lb side of the relay pin unit, a tester-side connector 41b which also has a base plate 46b and a force.
  • a CCD camera 91 is arranged between the second insulating plate 35b and the intermediate holding plate 36b of the relay pin unit 31b, and a positioning marker provided in advance on one surface side of the circuit board 1 to be inspected.
  • the circuit to be inspected 1 is imaged by the CCD camera 91, and the circuit board 1 to be inspected is moved relative to the lower inspection jig lib based on the image to perform alignment.
  • the circuit board 1 to be inspected is moved by moving the movable plate 94 disposed between the first insulating plate 34b and the intermediate holding plate 36b in the relay pin unit 31b in the horizontal direction (the XY direction and the rotation). Direction).
  • circuit board support pins 92 to be tested on which the circuit board 1 to be tested is mounted are fixed to the end of the movable plate 94, and the movable plate 94 is moved horizontally to move the circuit board 1 under test.
  • the circuit board under test 1 held by the test circuit board support pins 92 can move in the same direction.
  • An electrode 2 to be inspected is formed on the upper surface of the circuit board 1 to be inspected, and an electrode 3 to be inspected is also formed on the lower surface thereof, and these are electrically connected to each other.
  • FIG. 3 is a diagram showing a surface of the pitch conversion board 23 on the circuit board under test 1 side
  • FIG. 4 is a diagram showing a surface of the pitch conversion board 23 on the relay pin unit 31 side
  • FIG. 7 is a cross-sectional view showing a state where the first anisotropic conductive sheet is laminated on the pitch conversion substrate.
  • a plurality of connection electrodes 25 electrically connected to the electrodes 2 and 3 of the circuit board 1 to be inspected are provided on one surface of the board 23 for pitch conversion, that is, on the side of the circuit board 1 to be inspected. Are formed.
  • These connection electrodes 25 are arranged so as to correspond to the patterns of the electrodes 2 and 3 to be inspected on the circuit board 1 to be inspected.
  • the through-hole 75 into which the circuit board to be inspected support pin 92 fixed to the movable plate 94 in Fig. 1 is inserted and the CCD camera 91 provided in the relay pin unit 31 provide the pitch conversion board 23.
  • a window hole 76 through which the circuit board 1 to be inspected is imaged is formed.
  • Terminal electrode 24 is formed on the other surface of the pitch conversion board 23, that is, on the side opposite to the circuit board 1 to be inspected. 4 .
  • Terminal electrode 24 is formed on the other surface of the pitch conversion board 23, that is, on the side opposite to the circuit board 1 to be inspected. 4
  • Terminal electrode 24 is formed. These terminal electrodes 24 are arranged at positions corresponding to the arrangement positions of the conductive pins 32a and 32b of the relay pin box.
  • the alignment mark 77 can be formed simultaneously with the terminal electrode 24 as a metal pattern by photoetching, and is formed in a size that fits within the imaging area of the CCD camera 91.
  • each connection electrode 25 in FIG. 3 is electrically connected to the corresponding terminal electrode 24 in FIG. 4 by the wiring 52 and the internal wiring 53 penetrating in the thickness direction of the insulating substrate 51. It is connected.
  • the insulating portion on the surface of the pitch conversion substrate 23 is composed of, for example, an insulating layer 54 formed on the surface of the insulating substrate 51 so as to expose the respective connection electrodes 25, as shown in FIG.
  • the thickness of the insulating layer 54 is preferably 5 to: LOO m, more preferably 10 to 60 m. If the thickness is too small, it may be difficult to form an insulating layer having a small surface roughness. On the other hand, if the thickness is excessive, electrical connection between the connection electrode 25 and the anisotropic conductive sheet may be difficult.
  • a material for forming the insulating substrate 51 of the pitch conversion substrate a material generally used as a substrate of a printed circuit board can be used. Specific examples include polyimide resin, glass fiber reinforced polyimide resin, glass fiber reinforced epoxy resin, and glass fiber reinforced bismaleimide triazine resin.
  • a polymer material that can be formed into a thin film can be used. Specifically, for example, epoxy resin, acrylic resin, phenol resin, polyimide resin Fats, polyamide resins, mixtures thereof, resist materials and the like.
  • the pitch conversion substrate 23 can be manufactured, for example, as follows. First, a laminated material in which thin metal layers are laminated on both sides of a flat insulating substrate is prepared, and the laminated material is penetrated in the thickness direction of the laminated material in accordance with the pattern corresponding to the terminal electrode to be formed. A plurality of through holes to be formed are formed by a numerically controlled drilling device, a photo-etching process, a laser processing process, or the like. Next, by applying electroless plating and electrolytic plating to the through-holes formed in the laminated material, no holes connected to the thin metal layers on both surfaces of the substrate are formed.
  • the metal thin layer is subjected to a photo-etching process to form a wiring pattern and a connection electrode on the surface of the insulating substrate and to form a terminal electrode on the opposite surface.
  • an insulating layer 54 is formed on the surface of the insulating substrate 51 so that each connection electrode 25 is exposed, and each terminal electrode 24 is exposed on the opposite surface.
  • the pitch conversion substrate 23 can be obtained by forming the insulating layer 55 as described above.
  • the thickness of the insulating layer 55 is preferably 5 to: LOO m, and more preferably 10 to 60 m.
  • the first anisotropic conductive sheet 22 that constitutes the circuit board side connector 21 and is laminated on the pitch conversion circuit board 23 is a sheet that also has an insulating elastic polymer force.
  • a large number of conductive particles 62 are dispersed in the plane direction and contained in the base material 61 in a state of being arranged in the thickness direction.
  • the thickness of the first anisotropic conductive sheet 22 is preferably in the range of 0.03 to 0.5 mm, more preferably 0.05 to 0.2 mm.
  • the minimum thickness is less than 0.03 mm, the mechanical strength of the first anisotropic conductive sheet 22 tends to be low, and the required durability may not be obtained.
  • the thickness of the first anisotropic conductive sheet 22 exceeds 0.5 mm, the electric resistance in the thickness direction tends to increase, and when the pitch of the electrodes to be connected is small, the additional resistance increases. The required insulation cannot be obtained between the conductive paths formed by the pressure, and an electrical short circuit may occur between the electrodes to be inspected, making it difficult to electrically inspect the circuit board to be inspected.
  • the elastic polymer material forming the sheet base 61 of the first anisotropic conductive sheet 22 preferably has a durometer hardness of 30 to 90, more preferably 35 to 80, and still more preferably. 40-70.
  • the term “Durometer hardness” refers to a value measured by a type A durometer based on a durometer hardness test of JIS K6253. ⁇ If the durometer hardness of the conductive polymer material is less than 30, compression and deformation of the anisotropic conductive sheet will be large when it is pressed in the thickness direction. And it is difficult to use for inspection, and the durability tends to be low.
  • the elastic polymer material constituting the base material of the first anisotropic conductive sheet 22 is not particularly limited as long as it exhibits the above durometer hardness. Therefore, it is preferable to use silicone rubber! / ,.
  • the number average particle diameter D force is preferably ⁇ to 50 ⁇ m. Preferably 5 to 3
  • the “number average particle size of the magnetic conductive particles” refers to a value measured by a laser diffraction scattering method.
  • the number average particle diameter 0 1 of the magnetic conductive particles is at least 3 m, are containing magnetic conductive particles in the anisotropically conductive sheet obtained is, part of it easier to deform under pressure Ru, also
  • the orientation of the magnetic conductive particles becomes easy.
  • the anisotropy of the resulting anisotropic conductive sheet increases, and the resolution of the anisotropic conductive sheet (electrical conduction between the electrodes facing in the thickness direction is achieved by pressing the anisotropic conductive sheet.
  • the ability to maintain electrical insulation between adjacent electrodes in a lateral manner is improved.
  • the elasticity of the conductive sheet is good, the pressure deformation is easy, and the resolution is good even for fine and fine pitch electrodes.
  • the first anisotropic conductive sheet 22 has a thickness Wm) and a number average particle size of the magnetic conductive particles.
  • the ratio W ZD to the diameter D m) is preferably 1.1 to 10. Ratio W ZD is 1
  • the ratio is less than 1, the diameter of the magnetic conductive particles is equal to or larger than the thickness of the anisotropic conductive sheet, and thus the anisotropic conductive sheet has low elasticity.
  • Inspection object such as printed wiring board (circuit under inspection 1) The test object is easily damaged when it is placed between the test electrode and the test electrode and pressurized to achieve a contact conduction state.
  • the magnetic conductive particles can be easily saturated in a sheet molding material for forming an anisotropic conductive sheet by the action of a magnetic field.
  • the magnetic layer is preferably used in an amount of at least 0.1 Wb / m 2 , more preferably at least 0.3 Wb / m 2 , particularly preferably at least 0.5 Wb / m 2 .
  • the magnetic conductive particles can be surely moved by the action of a magnetic field in the manufacturing process to obtain a desired orientation state.
  • a chain of magnetic conductive particles can be formed.
  • the magnetic conductive particles include particles of a metal exhibiting magnetism such as iron, nickel, and cobalt, particles of alloys thereof, particles containing these metals, or core particles.
  • the core particles are made of composite particles in which the surface of the core particles is coated with a highly conductive metal, or inorganic particles or polymer particles such as non-magnetic metal particles or glass beads as the core particles.
  • the composite particles include metal-coated composite particles and core particles coated with both a conductive magnetic material such as ferrite and an intermetallic compound and a highly conductive metal.
  • highly conductive metal refers to a metal having a conductivity of 5 ⁇ 10 6 ⁇ — 1 !!! ⁇ 1 or more at 0 ° C.
  • gold, silver, rhodium, platinum, chromium, and the like can be used.
  • gold is chemically stable and has high conductivity. It is preferable to use.
  • a composite particle in which nickel particles are used as core particles and the surface thereof is coated with a highly conductive metal such as gold or silver is preferred.
  • a means for coating the surface of the core particles with a highly conductive metal for example, an electroless plating method can be used.
  • the coefficient of variation of the number average particle diameter of the magnetic conductive particles is preferably 50% or less, more preferably 40% or less, further preferably 30% or less, and particularly preferably 20% or less.
  • the “variation coefficient of the number average particle diameter” is expressed by the following formula: ( ⁇ ZDn) X 100 (where ⁇ indicates the value of the standard deviation of the particle diameter, and Dn indicates the number average particle diameter of the particles. )).
  • Such magnetic conductive particles can be obtained by converting a metal material into particles by an ordinary method, or by preparing commercially available metal particles and performing a classification treatment on the particles.
  • the classification of the particles can be performed, for example, by a classifier such as an air classifier or a sonic sieve. Specific conditions for the classification treatment are appropriately set according to the number average particle diameter of the target conductive metal particles, the type of the classification device, and the like.
  • the specific shape of the magnetic conductive particles is not particularly limited! However, for example, secondary particles in which a plurality of spherical primary particles are integrally connected are preferably used.
  • a conductive material is obtained from the viewpoint that good conductivity is obtained.
  • the coverage of the highly conductive metal on the surface of the conductive composite metal particles is preferably 40% or more, more preferably 45% or more. And particularly preferably 47 to 95%.
  • the coating amount of the highly conductive metal is preferably from 2.5 to 50% by mass, more preferably from 3 to 45% by mass, even more preferably from 3.5 to 40% by mass of the weight of the core particles. %, Particularly preferably 5 to 30% by weight.
  • Such an anisotropic conductive sheet in which a large number of conductive particles 62 are dispersed in the plane direction and arranged in the thickness direction in an insulating elastic polymer material is disclosed in, for example, JP-A-2003-77560.
  • a polymer material for curing to become an elastic polymer material A flowable molding material containing conductive particles exhibiting magnetism is prepared in the material, and a molding material layer made of the molding material is formed on the one-side molding member in contact with one surface of the molding material layer.
  • the molding material layer is formed between the other side of the material layer and the other side molding member that is in contact with the other side, and a magnetic field is applied to this molding material layer in the thickness direction thereof, and the molding material layer is manufactured by a method of curing treatment or the like. be able to.
  • the second anisotropic conductive sheet 26 arranged on the relay pin unit 31 side of the pitch conversion board 23 has a large number of conductive materials in an insulating elastic polymer material.
  • the conductive particles 62 are non-uniformly dispersed only in the conductive path forming portion 72 in the plane direction.
  • the thickness W of the conductive path forming portion 72 is preferably 0.1 to 2 mm, more preferably 0.2 to 1.5.
  • the absorption of the pressing force by the inspection jig is reduced, and the effect of alleviating the impact on the circuit board side connector 21 is reduced. Therefore, the deterioration of the first anisotropic conductive sheet 22 is suppressed, and as a result, the number of times of replacement of the first anisotropic conductive sheet 22 in the repeated inspection of the circuit board 1 to be inspected is increased! ] And the efficiency of the inspection is reduced.
  • the thickness W exceeds 2 mm, the electrical resistance in the thickness direction tends to increase,
  • the thickness of the insulating portion 71 is preferably substantially the same as the thickness of the conductive path forming portion 72, and is preferably smaller than that. As shown in FIG. 6, the thickness of the insulating section 71 is made smaller than the thickness of the conductive path forming section 72 so that the conductive path forming section 72 forms a protruding section 73 protruding from the insulating section 71. Since the conductive path forming portion 72 is easily deformed in response to the pressure in the direction, and the ability to absorb the pressing force is increased, the pressing force of the inspection jig is absorbed at the time of inspection, and the connection to the connector on the circuit board side is reduced. Shock can be reduced.
  • the number average particle diameter is preferably 5 to 200 ⁇ m, more preferably 5 to 150 ⁇ m. ⁇ m, more preferably 10 to: LOO / zm.
  • the “number average particle size of the magnetic conductive particles” refers to a value measured by a laser diffraction scattering method. Shirahira of magnetic conductive particles When the average particle size is 5 ⁇ m or more, the conductive path forming portion of the anisotropic conductive sheet can be easily deformed under pressure. When the magnetic conductive particles are oriented by a magnetic field orientation treatment in the manufacturing process, the orientation of the magnetic conductive particles is easy. When the number average particle diameter of the magnetic conductive particles is 200 m or less, the elasticity of the conductive path forming portion 72 of the anisotropic conductive sheet is good, and the pressure deformation becomes easy.
  • the ratio W ZD to 22 is preferably 1.1 to 10.
  • the ratio W ZD is less than 1.1
  • the diameter of the magnetic conductive particles is equal to or larger than the thickness of the conductive path forming section 72, so that the elasticity of the conductive path forming section 72 is reduced, and the pressing force in the thickness direction is reduced.
  • the absorption capacity is reduced.
  • the ability of the inspection jig to absorb the pressing force during the inspection is reduced, and the effect of alleviating the impact on the circuit board side connector 21 is reduced, so that the first anisotropic conductive sheet 22 is deteriorated.
  • the efficiency of the inspection tends to decrease.
  • the electrical resistance value is likely to be high because the conductive particles are arranged in a chain and a large number of contacts between the conductive particles exist.
  • the elastic polymer (elastomer) which is the base material of the conductive path forming portion 72 preferably has a durometer hardness measured by a type A durometer of 15 to 60, more preferably 20 to 50, and still more preferably. 25-45.
  • the durometer hardness of the elastic polymer When the durometer hardness of the elastic polymer is smaller than 15, compression and deformation of the sheet when pressed in the thickness direction cause a large permanent strain, and the sheet shape is deformed at an early stage. Electrical connection tends to be difficult. If the durometer hardness of the elastic polymer is greater than 60, the deformation when pressed in the thickness direction will be small, and the absorption capacity for the applied pressure in the thickness direction will be small. For this reason, it is difficult to suppress the deterioration of the first anisotropic conductive sheet 22, and as a result, the number of times of replacement of the first anisotropic conductive sheet 22 increases during the repeated inspection of the circuit board 1 to be inspected. In addition, the efficiency of the inspection tends to decrease.
  • the elastic polymer serving as the base material of the conductive path forming section 72 exhibits the above durometer hardness. Although it is not particularly limited as long as it is a silicone rubber, it is preferable to use silicone rubber from the viewpoint of processability and electrical properties.
  • the insulating portion 71 of the second anisotropic conductive sheet 26 is formed of an insulating material that does not substantially contain conductive particles.
  • an insulating material for example, an insulating polymer material, an inorganic material, a metal material whose surface has been subjected to insulating treatment, and the like can be used, and the same material as the elastic polymer used for the conductive path forming portion can be used. It is easy to produce when used.
  • an elastic polymer is used as the material of the insulating portion, it is preferable to use one having a durometer hardness within the above range.
  • the magnetic conductive particles As the magnetic conductive particles, the conductive particles used in the first anisotropic conductive sheet 22 described above can be used.
  • the second anisotropic conductive sheet 26 can be manufactured, for example, by the following method. First, a magnetic field is applied to a material layer filled in a molding space between the upper and lower dies, each of which has a substantially flat plate-like shape and includes an upper die and a lower die corresponding to each other. A mold for forming an anisotropic conductive sheet having a configuration capable of heating and curing the material layer while acting is provided.
  • an intensity distribution is generated in the magnetic field in the die in order to form a conductive portion at an appropriate position by applying a magnetic field to the material layer.
  • the ferromagnetic portions are arranged corresponding to the pattern of the conductive path forming portion to be formed.
  • the molding surface of the upper mold is flat, and the molding surface of the lower mold has slight irregularities corresponding to the conductive path forming portions of the anisotropic conductive sheet to be formed.
  • a molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer material is injected into the molding space of the anisotropic conductive sheet molding die.
  • a magnetic field having an intensity distribution in the thickness direction is applied to the formed molding material layer using the ferromagnetic material portion and the non-magnetic material portion of the upper mold and the lower mold, whereby the conductive particles are formed.
  • the molding material layer is cured in that state.
  • the anisotropic conductive sheet in which the plurality of columnar conductive path forming portions are insulated from each other by the insulating portion is manufactured.
  • the tester-side connectors 41a and 41b include third anisotropic conductive sheets 42a and 42b, connector boards 43a and 43b, and base plates 46a and 46b.
  • the third anisotropic conductive sheets 42a and 42b have the same structure as that of the above-described second anisotropic conductive sheet 26, that is, a large number of insulating elastic polymer materials as shown in FIG.
  • An anisotropic conductive sheet including a conductive path forming portion formed by arranging the conductive particles in the thickness direction and an insulating portion separating each conductive path forming portion is used.
  • the connector boards 43a and 43b have pin-side electrodes 45a and 45b formed on the surface of the insulating board on the side of the relay pin units 31a and 31b, as shown in FIGS. 1 and 2. These pin-side electrodes 45a and 45b are arranged at positions corresponding to the arrangement positions of the conductive pins 32a and 32b of the relay pin units 3 la and 3 lb.
  • the pin-side electrodes 45a and 45b are electrically connected to the tester-side electrodes 44a and 44b by a wiring pattern formed on the surface of the insulating substrate and an internal wiring formed therein.
  • FIGS. 1, 2, and 8 shows the relay pin unit 3 la for convenience of description
  • FIGS. A large number of conductive pins 32a and 32b are provided in parallel at a predetermined pitch so as to face the direction (note that a position adjusting mechanism such as a movable plate is omitted in FIGS. 14 to 17).
  • the relay pin unit 31 is provided at both ends of the conductive pins 32a and 32b, and is disposed on the side of the circuit board under test 1 that supports the conductive pins 32a and 32b. , 34b and second insulating plates 35a, 35b arranged on the opposite side of the circuit board 1 to be tested.
  • the conductive pin 32 includes a central portion 82 having a large diameter and ends 81a and 81b having a smaller diameter.
  • the first insulating plate 34 and the second insulating plate 35 are formed with through holes 83 into which the ends 81 of the conductive pins 32 are inserted. Then, the diameter of the through hole 83 is formed larger than the diameter of the end portions 81a and 81b of the conductive pin 32 and smaller than the diameter of the central portion 82, thereby holding the conductive pin 32 so as not to fall off. Tepuru.
  • the first insulating plate 34 and the second insulating plate 35 are separated from each other by the first support pin 33 and the second support pin 37 in FIG.
  • the length of the end portion 81 of the conductive pin 32 is formed to be longer than the thickness of the insulating plate 34, so that the conductive pin 32 protrudes from at least one of the insulating plates 34.
  • the relay pin unit has a large number of conductive pins, for example, 2.54 mm, 1.8 mm, 1.27 mm, 1.06 mm, 0.8 mm, 0.75 mm, 0.5 mm, 0.45 mm, and 0.4 mm. They are arranged on grid points with a pitch of 3 mm or 0.2 mm.
  • the pitch conversion board 23 is connected to the tester via the conductive pins 32. Side to be electrically connected.
  • the relay pin unit 31 includes an intermediate holding plate 36a between the first insulating plates 34a, 34b and the second insulating plates 35a, 35b. , 36b power ⁇ Rooster is placed! And, between the first insulating plates 34a, 34b and the intermediate holding plates 36a, 36b, first supporting pins 33a, 33b are arranged, whereby the first insulating plates 34a, 34b and The space between the intermediate holding plates 36a and 36b is fixed.
  • second supporting pins 37a, 37b are arranged, whereby the second insulating plates 37a, 37b are disposed.
  • the space between 35a, 35b and intermediate holding plates 36a, 36b is fixed.
  • first support pin 33 and the second support pin 37 As a material of the first support pin 33 and the second support pin 37, for example, a metal such as brass or stainless steel is used.
  • the distance L1 between the first insulating plate 34 and the intermediate holding plate 36 and the distance L2 between the second insulating plate 35 and the intermediate holding plate 36 in FIG. 8 are not particularly limited. However, as will be described later, the height variations of the electrodes 2 and 3 of the circuit board 1 to be inspected due to the elasticity of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 In consideration of the absorptivity, it is preferably 2 mm or more, more preferably 2.5 mm or more.
  • Contact support position The device 38B is located at a different position on the intermediate holding plate projection plane A where the inspection device is projected in the thickness direction of the intermediate holding plate (from upward to downward in FIG. 1).
  • the different positions are not particularly limited.
  • the first contact support position 38A and the second contact support position 38B are, as shown in FIG. Preferably, it is formed on the lattice and on the surface A.
  • one unit lattice region R1 including four adjacent first contact support positions 38A is provided with one second The second contact support position 38B is arranged. Further, on the intermediate holding plate projection plane A, one first contact support position 38A is arranged in a unit lattice region R2 composed of four adjacent second contact support positions 38B.
  • the first contact support position 38A is indicated by a black circle
  • the second contact support position group 38B is indicated by a white circle.
  • one second contact support position 38B is disposed at the center of the diagonal line Q1 of the unit lattice region R1 of the first contact support position 38A, and the second contact support position 38B is provided.
  • One first contact support position 38A is arranged at the center of the diagonal line Q2 of the unit cell region R2 at the position 38B.
  • these relative positions are not limited to different positions on the intermediate holding plate projection plane A where the inspection apparatus is projected in the thickness direction of the intermediate holding plate. It is sufficient if they are arranged. In other words, if they are not arranged in a lattice, they are not restricted by such a relative positional relationship.
  • the inspection device is projected on the intermediate holding plate projection plane A projected in the thickness direction of the intermediate holding plate. It is only necessary that they are arranged at different positions.
  • the distance between the adjacent first contact support positions 38A and the distance between the second contact support positions 38B are preferably 10 to: LOOmm, and more preferably LOOmm. It is 12 to 70 mm, particularly preferably 15 to 50 mm.
  • first insulating plate 34 As a material for forming the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35, a material having flexibility is used.
  • the flexibility of these plates is from above when the both ends of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 are placed horizontally with each being supported at 10cm intervals.
  • insulating materials such as polyimide ⁇ Fat, polyester resin, polyamide resin, phenol resin, polyacetal resin, polybutylene terephthalate resin
  • Mesh was included in composite resin material, epoxy resin, phenol resin, etc. in which fiber, composite resin, epoxy resin, phenol resin, etc. were filled with inorganic materials such as silica, alumina, boron nitride, etc.
  • Composite resin materials and the like are also be used.
  • the thickness of the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35 depends on the type of the material forming the first insulating plate 34, the intermediate holding plate 36, and the second insulating plate 35. Force appropriately selected depending on the condition: preferably 1 to: LOmm. For example, a glass fiber reinforced epoxy resin having a thickness of 2 to 5 mm can be used.
  • a bent holding plate 84 is provided between the first insulating plate 34 and the second insulating plate 35.
  • conductive pins 32 cylindrical metal pins are used.
  • a through hole 85 through which the conductive pin 32 is inserted is formed in the bent holding plate 84.
  • the conductive pin 32 has a through hole 83a formed in the first insulating plate 34 and a through hole 83b formed in the second insulating plate 35, and a through hole 85 formed in the bent holding plate 84.
  • the conductive pins 32 are pressed laterally in opposite directions and bent at the positions of the through holes 85 of the bending holding plate 84, whereby the conductive pins 32 are supported movably in the axial direction.
  • the intermediate holding plate 36 is formed with a through hole 86 having a diameter large enough not to contact the conductive pin 32, and the conductive pin 32 is inserted through the through hole 86.
  • the conductive pins 32 are supported by the first insulating plate 34 and the second insulating plate 35 in the procedure shown in FIGS. 11A to 11C.
  • the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 are in the axial direction.
  • the bending holding plate 84 is arranged at the position aligned with.
  • the conductive pins 32 are passed through the through holes 83a of the first insulating plate 34 and through the through holes 85 of the bent holding plate 84 to penetrate the second insulating plate 35 Insert up to hole 83b.
  • the bending holding plate 84 is moved in a horizontal direction (horizontal direction) perpendicular to the axial direction of the conductive pins 32, and the position of the bending holding plate 84 is changed by appropriate means. Fix it.
  • the conductive pins 32 are opposite to each other with the through hole 83a of the first insulating plate 34 and the through hole 83b formed in the second insulating plate 35 and the through hole 85 of the bent holding plate 84 as fulcrums.
  • the conductive pin 32 is pressed laterally in the direction and bent at the position of the through hole 85 of the bending holding plate 84, whereby the conductive pin 32 is supported movably in the axial direction.
  • the conductive pin 32 can be held between the first insulating plate 34 and the second insulating plate 35 so as to be movable in the axial direction and not to fall off.
  • a simple cylindrical pin can be used as the conductive pin 32, the cost of the conductive pin 32 and a member holding the same can be reduced as a whole.
  • the position where the bent holding plate 84 is arranged may be between the first insulating plate 34 and the intermediate holding plate 36.
  • the electrodes 2 and 3 of the circuit substrate 1 to be inspected are the first anisotropic conductive sheets 22a and 22b.
  • the base plates 46a and 46b arranged on the outside are electrically connected to a tester (not shown) by pressing the base plates 46a and 46b with a predetermined pressure by a pressing mechanism of the tester. An electrical test such as resistance measurement is performed.
  • the pressure applied from the first and second inspection jigs 11a and 11b to the circuit board to be inspected at the time of measurement is, for example, 100 to 250 kgf.
  • electrical inspection is performed by clamping both surfaces of the circuit board 1 to be inspected between the first inspection jig 11a and the second inspection jig lib.
  • the rubber anisotropic compression of the third anisotropic conductive sheet 42 absorbs the pressure, so that the variation in the height of the electrodes to be inspected on the circuit board 1 to be inspected can be absorbed to some extent.
  • the first contact support position between the first support pin and the intermediate support plate and the second contact support position between the second support pin and the intermediate support plate are defined by the intermediate support plate.
  • a force acts in the vertical direction as shown by arrows in FIG.
  • the circuit board 1 to be inspected is further pressurized between the first inspection jig 11a and the second inspection jig l ib, the first anisotropic conductive sheet 22 and the second
  • the first anisotropic conductive sheet 22 and the second In addition to the rubber elastic compression of the anisotropic conductive sheet 26 and the third anisotropic conductive sheet 42, the first insulating plate 34, the second insulating plate 35 of the relay pin unit 31, and the first
  • the panel elasticity of the intermediate holding plate 36 disposed between the insulating plate 34 and the second insulating plate 35 causes variations in the height of the electrodes to be inspected on the circuit board 1 to be inspected, for example, solder balls. against poles of height variation, by dispersing pressure concentration, it can be avoided local stress concentration.
  • the intermediate holding plate 36 While bending in the direction of the insulating plate 35 (see the portion E surrounded by a dashed line in FIG. 17), the intermediate support is carried out about the second contact support position 38B between the second support pin 37 and the intermediate support plate 36.
  • the plate 36 is bent in the direction of the first insulating plate 34 (see a portion D surrounded by a dashed line in FIG. 17).
  • the “radius” and “radial direction” mean that the intermediate holding plate 36 protrudes in the convex direction and the protruding direction thereof.
  • the intermediate holding plate 36 radiates in the opposite directions about the first contact support position 38A and the second contact support position 38B.
  • the first inspection jig is provided.
  • the panel elasticity of the intermediate holding plate 36 is exerted.
  • the height of the conductive pin 32b is absorbed by the compression of the protruding portion of the conductive path forming portion of the second anisotropic conductive sheet 26.
  • the pressure force that cannot be absorbed by the compression of the protrusion is applied to the first insulating plate 34b
  • the first insulating plate 34 and the second insulating plate 35 are also formed by the first supporting pin 33 and the second supporting pin 37.
  • the circuit board 1 to be inspected which is the object to be inspected, was further pressed between the first inspection jig 11a and the second inspection jig l ib.
  • the panel elasticity of the first insulating plate 34 and the second insulating plate 35 is exerted.
  • FIG. 18 is a cross-sectional view similar to FIG. 14 for explaining another embodiment of the inspection apparatus of the present invention (only the second inspection jig is shown for convenience), and FIG. It is an expanded sectional view of a pin unit.
  • a position adjusting mechanism such as a movable plate is omitted.
  • This inspection device has basically the same configuration as the inspection device shown in FIG. 1, and the same components are denoted by the same reference numerals.
  • a plurality of (three in this embodiment) intermediate holding plates 36 are provided between the first insulating plate 34 and the second insulating plate 35.
  • the holding plate support pins 39 are arranged at predetermined intervals, and between the adjacent intermediate holding plates 36.
  • a contact supporting position of the holding plate support pin 39b that also contacts the one-side force against the intermediate holding plate 36b with the intermediate holding plate 36b is in the thickness direction of the intermediate holding plate 36b. It is necessary to be arranged at different positions on the projection plane of the intermediate holding plate projected on the surface.
  • the holding support positions of the holding plate support pins 39b which are in one-side contact with the intermediate holding plate 36b, with respect to the intermediate holding plate 36b, and with respect to the intermediate holding plate 36b.
  • the “different position” refers to the first contact support position 38A between the first support pin 33 and the intermediate holding plate 36 and the second contact position in the above-described embodiment.
  • the arrangement can be the same as the relative position described in the relation between the support pin 37 and the second contact support position 38B between the intermediate holding plate 36.
  • the holding plate support pins 39b that also contact the one-side force against the intermediate holding plate 36b abut on the intermediate holding plate 36b.
  • the support position 39A and the contact support position 38A of the first support pin 33b, which also abuts the other surface side force on the intermediate holding plate 36b, against the intermediate holding plate 36b are projected in the thickness direction of the intermediate holding plate 36b. It is arranged at a different position from the projection surface of the intermediate holding plate.
  • the holding support positions 39A of the holding plate support pins 39b that abut against the intermediate holding plate 36b from one surface side with respect to the intermediate holding plate 36b.
  • the supporting position 39A of the holding plate support pin 39b against the intermediate holding plate 36b which also contacts the other surface side force against the intermediate holding plate 36b, projected in the thickness direction of the intermediate holding plate 36b. It is located at a different position from the surface.
  • the holding plate support pins 39b that come into contact with the intermediate holding plate 36b from one surface side are in contact with the intermediate holding plate 36b.
  • the contact support position 39A and the contact support position 38B of the second support pin 37b abutting against the intermediate holding plate 36b from the other side with respect to the intermediate holding plate 36b project in the thickness direction of the intermediate holding plate 36b.
  • the plurality of intermediate holding plates 36 further exhibit spring resilience, and with respect to the variation in the height of the electrodes to be inspected of the circuit board 1 to be inspected,
  • the pressure concentration By dispersing the pressure concentration, local stress concentration can be further avoided, local damage of the anisotropic conductive sheet is suppressed, and as a result, the repeated use durability of the anisotropic conductive sheet is reduced.
  • the number of replacements of the anisotropic conductive sheet is reduced, and the inspection work efficiency is improved.
  • the number of the intermediate holding plates 36 is not particularly limited as long as it is plural.
  • FIG. 20 is a cross-sectional view illustrating a position adjusting mechanism of a circuit board to be inspected in one embodiment of the inspection apparatus of the present invention. In the figure, only a part of the second inspection jig is shown, and other parts are omitted.
  • the electrode 3 to be inspected of the circuit board 1 to be inspected and the second inspection are connected so that the connection electrode 25b of the jig pitch conversion board 23b is electrically connected to the connection electrode 25b via the first anisotropic conductive sheet 22b. It is necessary to align with the upper surface.
  • a CCD camera 91 is arranged at a position between the second insulating plate 35b and the intermediate holding plate 36b of the relay pin unit 31b.
  • An alignment mark (not shown) provided in advance on one surface of the circuit board 1 to be inspected held thereabove is attached to an intermediate holding plate disposed between the CCD camera 91 and the circuit board 1 to be inspected.
  • a movable plate 94 is provided between the first insulating plate 34b and the intermediate holding plate 36b of the relay pin unit 31b.
  • a plurality of circuit board support pins 92 on which the circuit board 1 to be tested is mounted are fixed to the end of the movable plate 94.
  • the test circuit board support pins 92 are formed on the first insulating plate 34b, the second anisotropic conductive sheet 26b, the pitch conversion board 23b, and the first anisotropic conductive sheet 22b.
  • the circuit board support pin 92 is inserted into a through-hole larger than the diameter of the circuit board support pin 92, so that the circuit board-under-test support pin 92 can be moved horizontally within the size of the through-hole.
  • a driving device 93 using, for example, a pulse motor or the like is attached to the movable plate 94.
  • the driving device 93 moves the movable plate 94 in the X-Y direction and the rotation direction, and accordingly, the circuit board 1 to be inspected held by the circuit board inspection support pins 92 moves in the same direction.
  • the driving device 93 is configured to control the electrical connection between the circuit board 1 to be inspected and the pitch conversion board 23 b based on the result of imaging the alignment mark of the circuit board 1 to be inspected by the CCD camera 91.
  • the movable plate 94 is moved so as to be located at a predetermined position where a proper connection is achieved.
  • two CCD cameras 91, 91 are arranged, and correspondingly, two alignment marks provided on the circuit board 1 to be inspected are imaged by the CCD cameras 91, 91, respectively. I am trying to do it.
  • the number of the CCD cameras 91 is preferably two, but the number is not particularly limited.
  • the movable plate 94 that allows the CCD camera 91 to be disposed at a position between the first insulating plate 34b and the intermediate holding plate 36b is provided between the second insulating plate 35b and the intermediate holding plate 36b. May be arranged at the position.
  • the first support plate 33b holds the first insulating plate 34b and the intermediate holding plate 36b
  • the second support pin 37b holds the second insulating plate 35b and the intermediate holding plate 3b. 6b, it is not necessary to arrange conductive pins 32b at a uniform pitch and high density over the entire area corresponding to the area of the circuit board 1 to be inspected.Reduce the number of conductive pins 32b in this area. Therefore, it is possible to dispose the CCD camera 91 in the gap between the plurality of second support pins 37b arranged at a sufficient interval for disposing the CCD camera 91. The alignment can be performed efficiently by optical alignment.
  • Figs. 9 and 10 show examples of the arrangement of the position adjusting mechanism in the relay pin unit.
  • the CCD camera 91 may be embedded and attached to the intermediate holding plate 36.
  • Window holes 76d and 76c are formed in the movable plate 94 and the first insulating plate 34 above the CCD camera 91, and a mark for positioning the circuit board 1 to be inspected is formed through the window holes 76d and 76c. The image is taken.
  • the circuit board under test support pins 92 are fixed to the movable plate 94, and the through holes 75c of a size larger than the cross section of the test circuit board support pins 92 formed on the first insulating plate 34 are provided. Projecting upward through For this reason, the movable plate 94 can move in the horizontal direction (the direction of the arrow in the figure), and the circuit board under test 1 supported at the tip of the circuit board support pin 92 under test moves with respect to the relay pin unit 31b. Relative movement is enabled.
  • FIG. 21 is a top view illustrating an example of a movable plate
  • FIG. 22 is a side view illustrating a position adjusting mechanism of a circuit board to be inspected using the movable plate.
  • the movable plate 94 in FIG. 21 has a through hole 96a through which many conductive pins 32b and support pins (the first support pin 33b or the second support pin 37b) pass, and one support pin (each A through hole 96b is formed through the first support pin 33b or the second support pin 37b).
  • the through-hole 96b is formed to have a size larger than the cross-sectional size of the support pin passing therethrough.
  • the movable plate 94 is moved by the driving device 93 in the linear (X-Y) direction or the rotation ( ⁇ ) Can be moved in the direction.
  • the driving is performed based on the result of imaging the alignment mark 95 provided on the lower surface of the circuit board 1 under test supported by the circuit board support pins 92 by the CCD camera 91.
  • the movable plate 94 can be moved by the device 93.
  • FIG. 23 is a schematic view showing an example of the circuit board under test support pins.
  • the circuit support pin 92 to be inspected has a cylindrical outer cylindrical portion 87 having an opening at one end, and is housed inside the outer cylindrical portion 87. One end of the outer cylindrical portion 87 at the opening side is protruded in the axial direction. And a bar-shaped elastic element 8.
  • the extender 88 is attached to the outer cylinder 87 via an elastic member (not shown) such as a spring provided inside the outer cylinder 87, and the elastic member 88 It is held movably in the direction.
  • the circuit board 1 to be inspected is held by engaging the through hole formed therein with the conical tip 89 of the expander 88, and the circuit board 1 to be inspected is moved by the position adjusting mechanism described above. Is positioned at a predetermined position, for example, the circuit board 1 to be inspected is pressed by the lower surface of the upper first inspection jig 11a, and the elastic element 88 is moved downward in the axial direction by staking the elastic force of the elastic member. By doing so (broken line in the figure), the electrodes 2 and 3 to be inspected of the circuit board 1 to be inspected and the connection electrodes 25a and 25b of the board 23 for pitch conversion are accurately connected so as to ensure electrical connection.
  • the contact surface of the inspection jig can be brought into contact with the circuit board 1 to be inspected in the aligned state.
  • FIG. 7 shows an arrangement relationship between the pitch conversion substrate and the position adjusting mechanism.
  • the pitch conversion board 23b is formed with a through hole 75b through which the circuit board under test support pin 92 is inserted, and the circuit board under test support pin 92 is connected to the through hole 75b in the first anisotropic direction. It protrudes upward through the through hole 75a formed in the conductive sheet 22b, and supports the circuit board 1 to be inspected at the tip.
  • the CCD camera 91 is connected to the circuit board 1 to be inspected via the window hole 76b formed in the pitch conversion board 23b and the window hole 76a formed in the first anisotropic conductive sheet 22b.
  • the alignment mark 77 provided on the periphery of the opening of the window hole 76b is imaged on the lower surface of the pitch conversion substrate 23b.
  • the alignment mark 77 provided on the lower surface of the pitch conversion substrate 23b can be formed, for example, as a copper pattern by photoetching, as shown in FIG.
  • FIG. 24 (a) shows a field of view taken by a CCD camera 91 arranged in the relay pin unit 31, and as shown, a window hole 76 formed in the pitch conversion substrate 23, The positioning mark 77 provided around it is accommodated.
  • the correct position 80 where the alignment mark 78 of the circuit board 1 to be inspected should be calculated from the alignment mark 77 of the pitch conversion substrate 23. For example, by processing the image data of the alignment mark 77 captured by the CCD camera 91, the normal position 80 can be specified.
  • the CCD camera 91 formed on the pitch conversion substrate 23.
  • the correct position 80 of the alignment mark 78 of the circuit board 1 to be originally calculated which is calculated from the alignment mark 77 of the board 23 for pitch conversion, and the position of the circuit board 1 actually observed Calculates the direction and distance of the misalignment with the alignment mark 78, and thereby calculates the circuit board to be inspected necessary to move the circuit board 1 so that the alignment mark 78 is located at the correct position 80.
  • the moving direction and the moving distance of the support pin 92 are calculated.
  • the movable plate 94 is moved based on the calculation result, so that the circuit board 1 to be inspected is positioned at a predetermined position with respect to the pitch conversion board 23 as shown in FIG. Can be.
  • the circuit substrate 1 to be inspected may be a semiconductor integrated circuit device such as a knock IC, MCM, or CSP, or a circuit device formed on a wafer, other than the printed circuit board.
  • the printed circuit board may be not only a double-sided printed circuit board but also a single-sided printed circuit board.
  • the first inspection jig 11a and the second inspection jig lib may be different from each other as long as they do not necessarily need to be the same in the material used, the member structure, and the like.
  • the tester-side connector may be configured by stacking a circuit board such as a connector board and a plurality of anisotropic conductive sheets.
  • a plurality of intermediate holding plates 36b are arranged at a predetermined interval between the first insulating plate 34b and the second insulating plate 35b, and the holding plate support is provided between these adjacent intermediate holding plates.
  • an imaging device such as a CCD camera and a movable plate are provided between the first insulating plate 34b or the second insulating plate 35b and the intermediate holding plate 36b, or between the intermediate holding plates 36b. It may be configured.
  • the first anisotropic conductive sheet 22 an anisotropic conductive sheet in which conductive particles are arranged in the thickness direction and uniformly dispersed in the plane direction is used, and the second anisotropic conductive sheet is used as the second anisotropic conductive sheet.
  • the conductive sheet 26 and the third anisotropic conductive sheet 42 includes a plurality of conductive path forming portions extending in the thickness direction and an insulating portion that insulates these conductive path forming portions from each other. Is contained only in the forming part, whereby the conductive particles are non-uniformly dispersed in the surface direction, and a force using a conductive path forming part protruding on one side of the sheet is used. This combination is particularly limited. Not a thing! / ,.
  • a support pin 49 is provided between the connector board 43 and the base plate 46 in the tester-side connector 41. It may be arranged. These support pins 49 have the same functions as the first support pins 33 and the second support pins 37 (the first support pins 33, the second support pins 37, and the holding plate support pins 39 in FIG. 18). As a result, it is also possible to provide an effect of dispersing the surface pressure. In order to provide this surface pressure dispersing action, it is preferable to dispose these so that the position of the support pin 49 and the position of the second support pin 37 are different from each other in the plane direction.
  • Circuit board inspection for inspecting the following evaluation circuit boards as shown in Fig. 1, which is compatible with the inspection section of the rail transfer type circuit board automatic inspection machine (manufactured by Nidec-Read Corporation, product name: STARREC V5) The device was made.
  • An evaluation circuit board 1 having the following specifications was prepared.
  • Diameter of the electrode to be inspected on the top side 0.3 mm
  • Diameter of the electrode to be inspected on the bottom side 0.3 mm
  • a circular alignment mark with a diameter of 0.8 mm was provided at two locations on the lower side.
  • the following first anisotropic conductive sheet 22 in which conductive particles were arranged in the thickness direction and uniformly dispersed in the plane direction was produced.
  • Conductive particles Material: nickel-plated gold particles, number average particle size: 20 m, content: 18% by volume
  • Elastic polymer material Material; silicone rubber, hardness; 40
  • a through-hole having a diameter of 6 mm is formed in a portion corresponding to the circuit board support pin 92 to be inspected, and a through-hole corresponding to the CCD camera 91 is provided.
  • the part was provided with a 4 mm diameter through hole.
  • a copper plating layer was formed on the inner wall of each through-hole by performing an electroless plating process on the laminated material in which the through-hole was formed using an EDTA-type copper plating solution.
  • electrolytic copper plating using a copper sulfate plating solution, a cylindrical via having a thickness of about 10 m is used to electrically connect the thin metal layers on the surface of the laminated material to each other in each through hole. A hole was formed.
  • a 25 ⁇ m-thick dry film resist (manufactured by Tokyo Ohka, product name: FP-225) was laminated on the thin metal layer on the surface of the laminated material to form a resist layer.
  • a protective seal was placed on the other side of the thin metal layer.
  • a photomask film is placed on this resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then developed to form a resist pattern for etching. Formed.
  • 7312 connection electrodes having a diameter of 200 m, and each connection electrode and via hole were electrically formed on the surface of the insulating substrate. Connect the pattern wiring with a connecting line width of 100 ⁇ m. After formation, the resist pattern was removed.
  • a 25 ⁇ m-thick dry film solder resist (manufactured by Hitachi Chemical Co., Ltd., product name: SR-2300G) was laminated on the surface of the insulating substrate on which the connection electrodes and the pattern wiring portion were formed to form an insulating layer.
  • a photomask film is placed on the insulating layer, and the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to development processing. 7312 openings with a diameter of 200 m were formed to expose the electrodes.
  • the protective seal on the thin metal layer on the other side of the laminated material was removed, and a 25 m thick dry film resist (manufactured by Tokyo Ohka, product name: FP — 225) was laminated to form a resist layer.
  • a photomask film is placed on the resist layer, and the resist layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.), and then subjected to a development treatment, whereby the metal in the laminated material is processed.
  • a resist pattern for etching was formed on the thin layer.
  • 7312 terminal electrodes and a pattern wiring portion for electrically connecting each terminal electrode to the via hole were formed on the back surface of the insulating substrate, and the resist pattern was removed.
  • a 38 ⁇ m-thick dry film solder resist (manufactured by Tigo Morton, product name: ConfoMask 2015) was laminated on the back surface of the insulating substrate on which the terminal electrodes and the pattern wiring portions were formed.
  • An insulating layer is formed, a photomask film is disposed on the insulating layer, and then the insulating layer is exposed to light using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) and then developed. Then, 7312 openings of 0.4 mm in diameter were formed to expose the electrodes.
  • the pitch conversion substrate 23a for the first inspection jig 11a was manufactured.
  • the pitch conversion substrate 23a has a vertical and horizontal dimension of 120 mm ⁇ 160 mm, a thickness of 0.5 mm, the surface of the insulating layer of the connection electrode has a diameter of about 300 m, and the height of the connection electrode protruding from the surface of the insulating layer. Is about 25 m, the minimum arrangement pitch of the connection electrodes is 0.4 mm, the diameter of the terminal electrodes is 0.4 mm, and the arrangement pitch of the terminal electrodes is 0.75 mm.
  • the surface roughness of the insulating layer on the surface side was 0.02 m.
  • a pitch conversion substrate 23b for a second inspection jig lib having 3784 connection electrodes on the front surface and 3784 terminal electrodes on the back surface was manufactured.
  • the pitch conversion substrate 23b has a vertical and horizontal dimension of 130 mm ⁇ 160 mm, a thickness of 0.5 mm, a diameter of a portion of the connection electrode exposed on the surface of the insulating layer is approximately 300 / ⁇ , and a surface force of the insulating layer on the connection electrode.
  • the projecting height is about 25 m
  • the minimum arrangement pitch of the connection electrodes is 0.4 mm
  • the diameter of the terminal electrodes is 0.4 mm
  • the arrangement pitch of the terminal electrodes is 0.75 mm
  • the surface roughness of the insulating layer on the (face) side is 0.02 m.
  • the pitch conversion board 23b for the second inspection jig lib is provided with a through-hole having a diameter of 6 mm at a position corresponding to the circuit board to be inspected support pin 92 provided on the movable plate 94.
  • an imaging window having a through-hole having a diameter of 3 mm was provided at a position corresponding to the CCD camera 91 provided on the intermediate holding plate 36b.
  • the first anisotropic conductive sheet 22 is disposed on the front side of the pitch conversion substrate 23, and on the back side, a large number of conductive path forming portions extending in the thickness direction and insulating portions for insulating these from each other.
  • the circuit board side connector 21 was formed by disposing a second anisotropic conductive sheet 26 made of an unevenly distributed anisotropic conductive sheet having a conductive path forming portion protruding on one surface.
  • the second anisotropic conductive sheet 26 disposed between the pitch conversion board 23 and the relay pin unit 31 has a shape shown in Fig. 6, and specifically has the following configuration. Was used.
  • Thickness of conductive path forming part 72 0.6 mm
  • Outer diameter of conductive path forming part 72 0.3 mm
  • Insulation part 71 thickness 0.5mm
  • Conductive particles 62 Material; gold-plated nickel particles, number average particle diameter; 30 m Content of conductive particles in conductive path forming portion 72: 15% by volume
  • Elastic polymer material Material; silicone rubber, hardness; 30
  • the second anisotropic conductive sheet 26b used for the lower second inspection jig l ib is provided with a through-hole having a diameter of 8 mm at a portion corresponding to the circuit board support pin 92 to be inspected, and is provided with a CCD power camera.
  • a through-hole with a diameter of 5 mm was provided in the part corresponding to 91.
  • circuit board side connector 21b used for the lower second inspection jig l ib, the first anisotropic conductive sheet 22b, the pitch conversion board 23b, the second anisotropic
  • the circuit board side connector 21b was formed by arranging the through holes of the conductive sheet 26b so as to match each other.
  • the material of the first insulating plate 34a, the intermediate holding plate 36a, and the second insulating plate 35a has a specific resistance of 1
  • first insulating plate (34a) and the second insulating plate are fixed. Between 35a
  • the first insulating plate 34b, the intermediate holding plate 36b, as a material of the second insulation plate 35b, intrinsic resistance Si X 1 ⁇ 10 ⁇ 'cm or more insulating material consists of fiberglass reinforced epoxy ⁇ , a thickness But the thing of 1.9mm was used.
  • the first insulating plate 34b has two through-holes 75c having a diameter of 6mm into which the circuit board support pins 92 fixed to the movable plate 94 are inserted, and an intermediate holding plate 36b.
  • an imaging window hole 76 having a through hole having a diameter of 8 mm was provided.
  • the CCD camera used was a CMOS image sensor 640 x 480 pixels from Pixelplus with a projector (flash) for shooting, which was part number PO1030K.
  • a movable plate 94 made of glass fiber reinforced epoxy resin having a thickness of 2.8 mm was arranged between the first insulating plate 34b and the intermediate holding plate 36b.
  • a through hole 96a into which a plurality of conductive pins 32b are inserted is disposed at a portion where the conductive pin 32b is disposed, and a first support pin 33b is disposed at a portion other than the through hole 96a.
  • a 5 mm diameter through-hole 96b is arranged at the portion corresponding to the.
  • the movable plate 94 is fixed with the following six circuit board support pins 92 to be inspected.
  • a through-hole 96a is arranged at a portion corresponding to the CCD camera 91 arranged on the intermediate holding plate 36b (an image of the alignment mark of the circuit board to be inspected is taken through the through-hole 96a). To do).
  • Expander 88 Diameter 2.5 mm Total length 16 mm in the direction of the tip exposed from the outer cylinder Tip 89 Length 2 mm conical
  • FIG. 13 shows a first contact support position 38A of the first support pin 33 with respect to the intermediate holding plate 36 and a second contact support position 38B of the second support pin 37 with the intermediate holding plate 36. In this way, they were arranged in a grid.
  • the distance and the separation distance between the second contact support positions 38B were set to 17.5 mm.
  • the movable plate 94 was arranged as shown in FIG. 20 to constitute the relay pin unit 31b.
  • the tester-side connector 41 was composed of a third anisotropic conductive sheet 42, a connector board 43, and a base plate 46.
  • the third anisotropic conductive sheet 42 the same as the above-described second anisotropic conductive sheet 26 was used.
  • the created inspection device is set on the inspection section of the rail transport type circuit board automatic inspection machine rSTARREC V5J, the evaluation circuit board 1 prepared for the inspection device is set, and the position provided on the evaluation circuit board 1 is set.
  • the alignment mark 95 is imaged by the CCD camera 79, the direction and the amount of positional shift of the imaged evaluation circuit board 1 are calculated, and the movable plate 94 is moved by operating the driving device 93, thereby Thus, the evaluation circuit board 1 was moved to a predetermined position.
  • the press pressure of the rail transfer type circuit board automatic inspection machine "STARREC V5" was changed stepwise within the range of 100 to 250 kgf, and the evaluation circuit board 1 was changed 10 times for each press pressure condition.
  • the conduction resistance was measured when a current of 1 mA was applied to the electrodes for inspection.
  • NG inspection points where the measured conduction resistance value is 100 ⁇ or more (hereinafter referred to as “NG inspection points”) are judged to be poor conduction, and the percentage of NG inspection points in the total inspection points (hereinafter “NG inspection point ratio”) The lowest press pressure at which the percentage of NG inspection points fell below 0.01% was taken as the lowest press pressure.
  • the number of NG test points was 73 12 for the upper surface of the circuit board 1 for evaluation and 3784 for the lower surface of the circuit board 1 for evaluation.
  • the ratio of the NG inspection points to the 110,960 inspection points calculated by the formula (7312 + 3784) X 10 110960 is shown.
  • minimum press pressure is small! /
  • the pressurization pressure at the time of inspection can be set low, it is possible to suppress the deterioration of the circuit board to be inspected, the anisotropic conductive sheet, and the inspection circuit board due to the pressurization pressure at the time of inspection. Since it is possible to use components with low durability as components of the inspection device, the structure of the inspection device can be made small and compact, and as a result, the durability of the inspection device can be improved and inspection can be performed. Preferably, a cost reduction in the production of the device is achieved.
  • the created inspection device is set on the inspection unit of the rail transport type circuit board automatic inspection machine rSTARREC V5J, and the evaluation circuit board 1 prepared for the inspection device is set and installed on the evaluation circuit board 1.
  • the position adjustment mark 95 is imaged by the CCD camera 79, the direction and the amount of position shift of the imaged evaluation circuit board 1 are calculated, and the movable plate 94 is moved by the driving device 93. Then, the evaluation circuit board 1 was moved to a predetermined position.
  • the press pressure condition of the rail transport type circuit board automatic inspection machine “STARREC V5” was set to 130 kgf, and after a predetermined number of pressurizations, the electrode under test of the evaluation circuit board 1 was subjected to a pressurization pressure of 130 kgf. Under these conditions, the operation of measuring the conduction resistance 10 times when a current of 1 mA was applied to the test electrode, applying pressure a predetermined number of times, and measuring the conduction resistance 10 times in the same manner was repeated.
  • Inspection points where the measured conduction resistance value was 100 ⁇ or more were determined as poor conduction, and the ratio of NG inspection points to the total inspection points (NG inspection point ratio) was calculated.
  • the anisotropic conductive sheet in the inspection device was replaced with a new one, and pressurization was performed a predetermined number of times under the same conditions as above except that the press pressure condition was changed to 150 kgf.
  • the NG inspection point ratio was calculated by the same method as above except that the weight was 150 kgf.
  • the number of NG test points is 73 12 for the upper surface of the circuit board 1 to be inspected and 3784 for the lower surface of the circuit board 1 for evaluation.
  • the percentage of the NG inspection points in the 110,960 inspection points calculated by the formula (7312 + 3784) X 10 110960 is shown.
  • the inspection equipment requires that the percentage of NG inspection points be practically 0.01% or less, and if the percentage of NG inspection points exceeds 0.01%, it is considered non-defective. In some cases, an erroneous inspection result indicating that the circuit board to be inspected is defective may be obtained, which may make it impossible to perform an electrical inspection of the circuit board with high reliability.
  • relay pin unit 31 instead of the relay pin unit 31 described above, conventional relay pin units 131a and 131b as shown in FIG. 25, that is, a large number (8000 pins) are arranged on a grid point at a constant pitch (2.54 mm pitch).
  • a large number 8000 pins
  • insulating plates 134a and 134b for supporting the conductive pins 132a and 132b movably up and down was used.
  • the minimum press pressure and the durability of the anisotropic conductive sheet were measured in the same manner as in Example 1.
  • Table 1 shows the measurement results of the minimum press
  • Table 2 shows the measurement results of the durability of the anisotropic conductive sheet.
  • the evaluation circuit board 1 is set in the inspection section using only the guide pins by the setting device of the rail transport type circuit board automatic inspection machine. At the time of setting, the predetermined position force evaluation circuit board 1 is set. When the position was deviated and a predetermined inspection was not performed, the setting operation was repeated until the evaluation circuit board 1 was set at the predetermined position.
  • the durability of the anisotropic conductive sheet having a low minimum pressing pressure is significantly improved as compared with the conventional inspection apparatus.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

Il est prévu un appareil d’inspection de carte imprimée et un procédé d’inspection de carte imprimée pour réaliser une inspection électrique très fiable d’un objet à inspecter, ou une carte imprimée à inspecter, même si la carte imprimée comporte une microélectrode à pas fin, et pour aligner efficacement un gabarit d’inspection et la carte imprimée à inspecter. Dans une unité à broches intermédiaire (31) entre un connecteur côté carte imprimée (21) et un connecteur côté testeur (41), une première carte isolante (34) et une carte de maintien intermédiaire (36) sont fixées par une première broche de support (33), une deuxième carte isolante (35) et une carte de maintien intermédiaire (36) sont fixées par une deuxième broche de support (37) et une première position de support en butée de la première broche de support (33) vis-à-vis de la carte de maintien intermédiaire (36) et une deuxième position de support en butée de la deuxième broche de support (37) vis-à-vis de la carte de maintien intermédiaire (36) sont placées en des positions différentes sur le plan de projection de la carte de maintien intermédiaire projeté dans une direction d’épaisseur de la carte de maintien intermédiaire (36). Puis, dans l’unité à broches intermédiaire (31), un dispositif de prise d’images, comme une caméra à CCD (91), est placé et le gabarit d’inspection (11) et la carte imprimée (1) à tester sont alignés.
PCT/JP2005/009571 2004-05-28 2005-05-25 Appareil d’inspection de carte imprimee et procede d’inspection de carte imprimee Ceased WO2005116670A1 (fr)

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JP2018136195A (ja) * 2017-02-22 2018-08-30 日置電機株式会社 プローブ装置および測定システム
TWI730828B (zh) * 2020-06-29 2021-06-11 群翊工業股份有限公司 板架寬度調整設備及其控制方法

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JP2002005980A (ja) * 2000-06-16 2002-01-09 Toppan Printing Co Ltd プリント配線板の検査治具及び検査装置並びにプリント配線板と上下検査治具の位置合わせ方法

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US9703623B2 (en) 2014-11-11 2017-07-11 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Adjusting the use of a chip/socket having a damaged pin
JP2018136195A (ja) * 2017-02-22 2018-08-30 日置電機株式会社 プローブ装置および測定システム
TWI730828B (zh) * 2020-06-29 2021-06-11 群翊工業股份有限公司 板架寬度調整設備及其控制方法

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