[go: up one dir, main page]

WO2005107990A1 - Procede de soudage par faisceaux mous - Google Patents

Procede de soudage par faisceaux mous Download PDF

Info

Publication number
WO2005107990A1
WO2005107990A1 PCT/KR2004/002134 KR2004002134W WO2005107990A1 WO 2005107990 A1 WO2005107990 A1 WO 2005107990A1 KR 2004002134 W KR2004002134 W KR 2004002134W WO 2005107990 A1 WO2005107990 A1 WO 2005107990A1
Authority
WO
WIPO (PCT)
Prior art keywords
collimator
housing
solder
soldering
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2004/002134
Other languages
English (en)
Inventor
Jongdae Sim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of WO2005107990A1 publication Critical patent/WO2005107990A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.

Definitions

  • the present invention relates to a method of soldering using a soft beam, and more particularly, to a method of soldering using a soft beam to solder a contact portion between a housing and a collimator with a soft beam in a process of bonding each collimator with the housing, respectively.
  • passive devices for optical communications linearly process light generated from a light source unlike active devices which perform functions of amplification and oscillation.
  • the passive device includes an optical connector to connect optical fibers via a connector, an optical switch to switch an optical path by mechanically driving an optical device, an optical attenuator to attenuate the intensity of light used in optical communications continuously or at a constant interval, an optical coupler to distribute an optical signal received from one point over many points or condense optical signals received from many points at one point, an optical branching filter to multiplex many optical signals having different wavelengths, and an optical combiner to output light received from many input optical fibers through output optical fibers in the number less than that of the input optical fibers.
  • the optical attenuator has a typical structure as shown in FIG. 1 and the optical switch has a typical structure as shown in FIG. 2.
  • the optical attenuator attenuates the intensity of light incoming through an optical fiber 10 by about 0.5 db to 50 db using a lens 20 and a variable filter 30.
  • the present invention provides a method of soldering using a soft beam to solder a contact portion between a housing and a collimator with a soft beam in a process of bonding each collimator with the housing, respectively.
  • the present invention provides a method of soldering using a soft beam in which solder is supplied through a supply hole formed at the upper and the lower portions of the housing in a process of bonding each collimator with the housing, respectively.
  • the present invention provides a method of soldering using a soft beam with a housing in which a variable filter can be inserted in a space between collimators in a process of bonding each collimator with the housing, respectively.
  • the present invention provides a method of soldering using a soft beam with a housing in which a mirror for switching can be inserted in a space between two collimators
  • the present invention provides a method of soldering using a soft beam to connect a first collimator and a second collimator with the housing, respectively, the housing having both ends being penetrated, the method comprising the steps of inserting the first collimator in one end of the housing; supplying solder at a contact portion where the inner circumferential surface of the housing meets the outer circumferential surface of the first collimator; soldering the housing and the first collimator by irradiating a soft beam to the solder; inserting the second collimator in the other end of the housing so that the second collimator is separated from the first collimator; supplying solder at a contact portion where the inner circumferential surface of the housing meets the outer circumferential surface of the second collimator; and soldering the housing and the second collimator by irradiating a soft beam to the solder.
  • the housing is formed of a metallic material and has a tubular shape.
  • the housing has at least one supply hole formed at the upper and the lower por tions thereof , and the solder is supplied through the supply hole in supplying solder at a contact portion between an inner circumferential surface of the housing and an outer circumferential surface of the first collimator and in supplying solder at a contact portion between the inner circumferential surface of the housing and an outer circumferential surface of the second collimator, respectively.
  • the soft beam is an infrared ray having a wavelength in a range of 790 to 830 nm.
  • the housing has an insertion hole in which a variable filter is inserted and the insertion hole is a space formed by separating the first collimator and the second collimator.
  • Each of the first collimator and the second collimator is a single collimator.
  • the housing has an insertion hole in which a mirror for switching is inserted and the insertion hole is a space formed by separating the first collimator and the second collimator.
  • the first collimator is a single collimator and the second collimator is a dual collimator.
  • the housing has an insertion hole in which one of gas, liquid, or solid which changes at least one of an optical path and optical power is injected and the insertion hole is a space formed by separating the first collimator and the second collimator.
  • the first collimator and the second collimator include a pigtail to connect an optical fiber, a lens, a glass tube to connect the pigtail and the lens, and a metallic tube encompassing an outer circumference of the glass tube.
  • the method of soldering using a soft beam according to embodiments of the present invention has the following effects.
  • FIG. 1 is a view illustrating the operation of a general optical attenuator
  • FIG. 2 is a view illustrating the operation of a general optical switch
  • FIG. 3 is a view illustrating the configuration of an apparatus to perform a method of soldering using a soft beam according to an errbodiment of the present invention
  • FIG. 4 is a flow chart for explaining a method of soldering using a soft beam according to an errbodiment of the present invention
  • FIG. 5 is a graph showing the operation of a soft beam in the method shown in FIG. 4
  • FIG. 6 is a graph showing the speed of supplying solder in the method shown in FIG. 4. Best Mode [35] Referring to FIG.
  • a method of soldering using a soft beam according to an errbodiment of the present invention include an upper holding unit 102, a lower holding unit 104, a housing holding unit 106, a solder supplying unit 110, a soft beam generator 120, an auto-aligner 130, and a control unit 140.
  • the soft beam refers to an infrared ray having a wavelength range of 790 to 830 nm as a heat source to solder a housing 150 and first and second collimators 156 and 158 by melting solder.
  • the upper holding unit 102 holding the single or dual second collimator 158 may be a chuck connected to an LM-guide and capable of linearly moving up and down.
  • the lower holding unit 104 holding the single or dual first collimator 156 may be a chuck capable of moving in x, y, and z directions, that is, back and forth, left and right, and up and down; and fixed to a particular position.
  • the upper holding unit 102 and the lower holding unit 104 are driven by a rotary encoder converting a mechanical variation into an electric pulse and a stepping motor controlled by a pulse; has a function to determine self -position; and can be driven manually or automatically by a program.
  • the housing holding unit 106 holding the housing 150 with which the first and second collimators 156 and 158 are bonded can move up and down, and left and right; and can be controlled to automatically supply the housing 150.
  • the solder supplying unit 110 supplying solder in a form of wire to a contact portion between the housing 150 and the two collimators 156 and 158 may comprise a friction wheel, an encoder, and a stepping motor.
  • the solder may be a metallic alloy having a melting point of 170 to 190 ° C.
  • the solder supplying unit 110 can manually or automatically be moved up and down, and left and right by a program. For smoothly supplying solder, the solder supplying unit 110 may be controlled to systematically operate with the soft beam generator 120 by the program.
  • the soft beam generator 120 soldering the housing 150 and the first and second collimators 156 and 158 by melting solder may include a lamp portion 122, a lens portion 124, and an optical fiber 126 connecting the lamp house lamp portion 122 and the lens portion 124.
  • the lamp portion 122 includes a lamp generating an infrared ray having a wavelength of 790 to 830 nm.
  • the lens portion 124 may include a convex lens capable of adjusting a focus.
  • the lens portion 124 can heat a portion needing soldering in a non-contact state. Since the lens portion 124 is connected to the lamp portion 122 by the optical fiber 126, it can be smoothly moved to other position to be heated.
  • the auto-aligner 130 may include a return loss estimator estimating a loss of light returning in a direction opposite to a proceeding direction of the light, an optical power meter, and a tunable laser source.
  • the control unit 140 manually or automatically controls the upper holding unit 102, the lower holding unit 104, the housing holding unit 106, the solder supplying unit 110, the soft beam generator 120, and the auto-aligner 130 by the program.
  • the method of soldering using a soft beam according to the errbodiment of the present invention can be used in a method of manufacturing a passive device for optical communications including a bonding process in which the first and second collimators 156 and 158 are connected with the housing 150, respectively, the housing having both ends being penetrated.
  • the passive device for optical commu- nications may be an optical connector, an optical coupler, an optical branching filter, or an optical combiner, preferably, an optical attenuator or an optical switch.
  • the first and second collimators 156 and 158 generating a parallel beam includes a pigtail to which an optical fiber is connected, a lens, a glass tube where the pigtail and the lens are combined, and a metallic tube encompassing an outer circumference of the glass tube, but is not limited thereto.
  • the collimator can be errbodied by directly grinding an end of the optical fiber into a lens shape, hardening polymer at the end of the optical fiber in a lens shape, or grinding an end of ceramic ferrule, thereby having a property of the collimator.
  • the first and second collimators 156 and 158 used in the method of soldering using a soft beam according to the errbodiment of the present invention further include a metallic tube formed of a stainless steel material, unlike the related art passive device for optical communications such as the optical attenuator and the optical switch manufactured using epoxy.
  • the metallic tube makes the first and second collimators 156 and 158 easily soldered on an inner circumferential surface of the housing 150.
  • the metallic tube may be plated with gold after being plated with nickel.
  • the first and second collimators 156 and 158 may be single or dual collimators according to the nurrber of strands of optical fibers connected to the pigtail.
  • the housing 150 is an intermediary means for connecting two first and second collimators 156 and 158 and may be formed of a metallic material as a frame having both ends being penetrated.
  • the outer circumference of the housing 150 may be polygonal shape such as rectangular, but tubular shape is preferable.
  • One or more supply holes 152 can be formed at the upper and the lower portions of the housing 150.
  • the supply holes 152 are formed to supply solder to contact portions of the housing 150 and the first and second collimators 156 and 158 inserted in the housing 150.
  • each of the two supply holes 152 may be formed at upper portion and lower portion of the housing 150, respectively, wherein the two supply holes 152 penetrate the housing 150 in the direction of diameter thereof so that solder can be supplied through the two solder supplying units 110.
  • an insertion hole 154 in which a filter or a mirror can be inserted in a space between the two combined first and second collimators 156 and 158 may be formed at the housing 150.
  • FIG. 4 is a flow chart for explaining a method of soldering using a soft beam according to an errbodiment of the present invention.
  • the method of soldering using a soft beam includes steps of inserting a first collimator (S100), first supplying solder (SI 10), first soldering (S120), inserting a second collimator (S130), second supplying solder (S140), and second soldering (S150).
  • the first collimator 156 is inserted in one end of the housing 150.
  • This step may further include a step of performing optical alignment by holding the first and second collimators 156 and 158 using the lower holding unit 104 and the upper holding unit 102, respectively, and performing housing alignment by holding the housing 150 using the housing holding unit 106.
  • the optical alignment is performed by using the auto aligner 130 including the return loss (RIL) estimator estimating a loss of light returning in a direction opposite to a proceeding direction of the light, the optical power meter, and the tunable laser source.
  • the optical alignment and the housing alignment may be automatically performed by the control unit 140 according to a preprogrammed program.
  • the housing holding unit 106 holding the housing 150 descends toward the lower holding unit 104 holding the first collimator 156 so that the first collimator 156 is inserted in the housing 150.
  • solder is supplied at a contact portion where an inner circumferential surface of the housing 150 meets an outer circumferential surface of the first collimator 156 through the supply hole 152 of the housing 150.
  • first soldering S120
  • the housing 150 and the first collimator 156 are soldered by irradiating a soft beam to the solder.
  • the step of first supplying solder (SI 10) and the step of first soldering (S120) are performed systematically with each other.
  • the systematic operation of the step of first supplying solder (SI 10) and the step of first soldering (S120) is illustrated referring to the graphs in FIGS 5 and 6.
  • FIG. 5 is a graph showing the operation of a soft beam in the method shown in FIG. 4.
  • FIG. 6 is a graph showing the speed of supplying solder in the method shown in FIG. 4.
  • a soft beam is irradiated in three steps of changing power, that is, a preheating step to preheat the contact portion between the housing 150 and the first collimator 156, a heating step to melt the supplied solder, and a post-heating step to discontinue the supply of solder.
  • the post-heating step is needed to prevent the supplied solder from being hardened in a state of being combined to the housing 150 when the radiation of a soft beam discontinues just after the heating step in which the solder is melted.
  • a time interval for preheating may be 11 seconds
  • a time interval for heating may be 7.5 seconds
  • a time interval for post-heating may be 2 seconds
  • a power supplied for preheating may be 27W
  • a power supplied for heating may be 34W
  • a power supplied for post- heating may be 25W.
  • the a time interval for preheating may be 10 seconds, the a time interval for heating may be 6 seconds, a time interval for post-heating may be 2 seconds; and a power supplied for preheating may be 25W, the a power supplied for heating may be 28W, and the a power supplied for post-heating may be 25W.
  • feeding solder for soldering is made at a time Tl when the preheating step is finished and the heating step starts. Also, it is preferred that stopping supply of the solder and then retracting the solder is made at a time T2 when the heating step is finished and the post heating step starting before the solder is completely hardened is followed thereafter.
  • a speed for supplying solder is 19 mm/s and a speed for retracting solder is -5 mm/s.
  • the soft beam radiation time, the supplied power, and the solder supply speed are not limited to the above embodiment and can be optimized according to the length of the housing 150 and the standards of the first and second collimators 156 and 158. Also, the time for irradiating soft beam, the supplied power, and the speed of supplying solder may be appropriate values selected to minimize the variation of the value of loss between the first and second collimators 156 and 158 aligned during soldering.
  • the second collimator 158 is inserted in the upper end of the housing 150.
  • the second collimator 158 held by the upper holding unit 102 is lowered toward the housing 150 and inserted in the upper end of the housing 150.
  • the second collimator 158 is located in the housing 150 by being separated from the first collimator 156 bonded to the housing 150.
  • the step of second supplying solder (S140) and the step of second soldering (SI 50) may be followed after the solder supplying unit 110 and the lens portion 124 of the soft beam generator 120 ascends toward the upper end portion of the housing 150 where the supply hole 152 is located.
  • the other steps are the same as the step of inserting a first collimator (S100), the step of first supplying solder (SI 10), and the step of first soldering (S120).
  • a combined body of the first collimator 156, the second collimator 158, and the housing 150 made by the method of soldering using a soft beam according to the above-described errbodiment of the present invention can be used for manufacturing of an optical attenuator or an optical switch.
  • the combined body may be used as a component constituting the optical attenuator.
  • the optical attenuator may be constituted by inserting a variable filter in a space formed between the first and second collimators 156 and 158 separated from each other.
  • the combined body may be used as a component constituting an optical switch.
  • the optical switch may be constituted by inserting a mirror for switching in the space formed between the first and second collimators 156 and 158 separated from each other.
  • the combined body can be used as a component of a passive device for optical communications for various purposes by injecting gas, liquid, or solid to change an optical path and optical power into the space formed between the first collimator 156 and the second collimator 158, as well as the variable filter or the mirror for switching.
  • the method of soldering using a soft beam according to the present invention can be used in the field of manufacturing passive device for optical communications such as an optical attenuator or an optical switch.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention porte sur un procédé de soudage par faisceaux mou d'un premier collimateur et d'un deuxième collimateur sur un boîtier dont les deux extrémités sont pénétrées. Ledit procédé comporte les étapes suivantes: insertion du premier collimateur dans une extrémité du boîtier; apport de soudure sur la partie où la surface de la circonférence intérieure du boîtier rencontre la surface de la circonférence extérieure du premier collimateur; soudage du boîtier au premier collimateur en dirigeant un faisceau sur la soudure; insertion du deuxième collimateur dans l'autre extrémité du boîtier de manière à le séparer du premier collimateur; apport de soudure sur la partie où la surface de la circonférence intérieure du boîtier rencontre la surface de la circonférence extérieure du deuxième collimateur; et soudage du boîtier au deuxième collimateur en dirigeant un faisceau sur la soudure. Ce procédé de soudure par faisceau mou de la partie en contact d'un collimateur avec un boîtier raccourcit le temps d'exécution et accroît la plage de température garantie d'une opération stable, par rapport aux procédés similaires de collage par époxy.
PCT/KR2004/002134 2004-05-11 2004-08-24 Procede de soudage par faisceaux mous Ceased WO2005107990A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040033149A KR100595888B1 (ko) 2004-05-11 2004-05-11 소프트빔을 이용한 솔더링 방법
KR10-2004-0033149 2004-05-11

Publications (1)

Publication Number Publication Date
WO2005107990A1 true WO2005107990A1 (fr) 2005-11-17

Family

ID=35320098

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2004/002134 Ceased WO2005107990A1 (fr) 2004-05-11 2004-08-24 Procede de soudage par faisceaux mous

Country Status (2)

Country Link
KR (1) KR100595888B1 (fr)
WO (1) WO2005107990A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5086967A (en) * 1987-05-02 1992-02-11 Jacques Delalle Solder connection device
US5125556A (en) * 1990-09-17 1992-06-30 Electrovert Ltd. Inerted IR soldering system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100443987B1 (ko) * 2002-02-14 2004-08-09 삼성전자주식회사 콜리메이터용 솔더링장치 및 솔더링방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5086967A (en) * 1987-05-02 1992-02-11 Jacques Delalle Solder connection device
US5125556A (en) * 1990-09-17 1992-06-30 Electrovert Ltd. Inerted IR soldering system

Also Published As

Publication number Publication date
KR100595888B1 (ko) 2006-07-03
KR20050108092A (ko) 2005-11-16

Similar Documents

Publication Publication Date Title
CN100573207C (zh) 包括具有激光成形端面的抽头光纤的现场安装连接器
RU2304294C2 (ru) Присоединение оптического компонента к оптоэлектронным модулям
US20020195432A1 (en) Laser welding method and semiconductor laser module manufactured by this method
JPH0227307A (ja) 光ファイバと半導体レーザダイオード間にカップリングを有するオプトエレクトロニク装置
TW552444B (en) Method for connecting a first end of an optical fiber to a laser module, system for connecting a first end of an optical fiber to a first optical module, system for connecting a first end of an optical fiber to a laser transmitter
KR100265066B1 (ko) 비접촉 납땜을 이용한 광부품의 고정장치 및그 방법
US6582548B1 (en) Compression bonding method using laser assisted heating
US7163343B2 (en) Optical module aligned after assembly
EP0112211A1 (fr) Procédé d'alignement d'un dispositif optoélectronique
WO2005107990A1 (fr) Procede de soudage par faisceaux mous
WO2022221681A1 (fr) Fixation de fibre optique à un circuit photonique intégré à l'aide d'un durcissement dirigé par fibre optique
JP2006259727A (ja) 低価格、高精度の複数ポイントの光学部品の取り付け法
JPH04359207A (ja) レーザダイオード結合装置及びその組立方法
CA2509530C (fr) Dispositif de fixation pour fibre optique de precision utilisant une preforme de verre en fusion
JP3779049B2 (ja) 光モジュールとその製造方法、並びに、光学的反射部材とその位置決め方法及び装置
JP4421970B2 (ja) 光モジュールの製造方法
JPH1114859A (ja) 光導波路と光ファイバの接続方法
CN101063735B (zh) 光通信连接器用玻璃套管的固定方法
US12265261B2 (en) Optical fibers fusion-splicing to waveguides
JPH0429387A (ja) 光結合装置
JPH01158406A (ja) 光半導体アセンブリの製造方法
JPS6319608A (ja) 光学結合装置
JP4674133B2 (ja) 水晶及び金からなる複合体の製造方法
JPH05134137A (ja) フアイバ融着接続型石英系導波路デバイス搭載用マウントの構造
JP2003294989A (ja) 光学部品及びその製造方法

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 69(1) EPC

122 Ep: pct application non-entry in european phase