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WO2005104314A3 - Procede de fabrication de circuits electroniques et optoelectroniques - Google Patents

Procede de fabrication de circuits electroniques et optoelectroniques Download PDF

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Publication number
WO2005104314A3
WO2005104314A3 PCT/FR2005/000881 FR2005000881W WO2005104314A3 WO 2005104314 A3 WO2005104314 A3 WO 2005104314A3 FR 2005000881 W FR2005000881 W FR 2005000881W WO 2005104314 A3 WO2005104314 A3 WO 2005104314A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
electronic
production
heat sink
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FR2005/000881
Other languages
English (en)
Other versions
WO2005104314A2 (fr
Inventor
Jean-Charles Garcia
Regis Hamelin
Stephane Bernabe
Cyrille Rossat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intexys SA
Original Assignee
Intexys SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR0403837A external-priority patent/FR2868877B1/fr
Priority claimed from FR0410464A external-priority patent/FR2876191B1/fr
Priority claimed from FR0413629A external-priority patent/FR2879759B1/fr
Priority claimed from FR0502461A external-priority patent/FR2883105A1/fr
Priority claimed from FR0503108A external-priority patent/FR2884047A1/fr
Application filed by Intexys SA filed Critical Intexys SA
Priority to US11/578,304 priority Critical patent/US20070278666A1/en
Priority to EP05757050A priority patent/EP1741136A2/fr
Publication of WO2005104314A2 publication Critical patent/WO2005104314A2/fr
Publication of WO2005104314A3 publication Critical patent/WO2005104314A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Selon l’invention, dans un assemblage comportant un composant électronique (108), ledit composant électronique est relié par des microbilles (107) à au moins un dissipateur thermique (106, 109), lesdites billes étant reliées à des lignes électriquement conductrices sur ledit composant électronique et à des lignes électriquement conductrices sur au moins un dissipateur thermique, lesdites billes véhiculant, d’une part, des signaux électriques entre le composant électronique et chaque dissipateur thermique portant lesdites lignes électriquement conductrices et, d’autre part, par conduction thermique, de la chaleur depuis le composant électronique vers chaque dissipateur thermique.
PCT/FR2005/000881 2004-04-13 2005-04-12 Procede de fabrication de circuits electroniques et optoelectroniques Ceased WO2005104314A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/578,304 US20070278666A1 (en) 2004-04-13 2005-04-12 Method for Production of Electronic and Optoelectronic Circuits
EP05757050A EP1741136A2 (fr) 2004-04-13 2005-04-12 Procede de fabrication de circuits electroniques et optoelectroniques

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
FR0403837A FR2868877B1 (fr) 2004-04-13 2004-04-13 Composants lasers a comportement thermique ameliore et procede de fabrication
FR0403837 2004-04-13
FR0410464A FR2876191B1 (fr) 2004-10-05 2004-10-05 Procede et dispositif de couplage de composants optiques
FR0410464 2004-10-05
FR0413629A FR2879759B1 (fr) 2004-12-21 2004-12-21 Dispositif optoelectronique et procede de fabrication dudit dispositif
FR0413629 2004-12-21
FR0502461 2005-03-14
FR0502461A FR2883105A1 (fr) 2005-03-14 2005-03-14 Dispositif optoelectronique et procede de fabrication dudit dispositif
FR0503108A FR2884047A1 (fr) 2005-03-31 2005-03-31 Procede et dispositif d'encapsulation de composants electroniques et optoelectroniques
FR0503108 2005-03-31

Publications (2)

Publication Number Publication Date
WO2005104314A2 WO2005104314A2 (fr) 2005-11-03
WO2005104314A3 true WO2005104314A3 (fr) 2006-03-02

Family

ID=35414527

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2005/000881 Ceased WO2005104314A2 (fr) 2004-04-13 2005-04-12 Procede de fabrication de circuits electroniques et optoelectroniques

Country Status (3)

Country Link
US (1) US20070278666A1 (fr)
EP (1) EP1741136A2 (fr)
WO (1) WO2005104314A2 (fr)

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EP2937897A3 (fr) 2003-09-15 2016-03-23 Nuvotronics LLC Emballage de dispositif et procédés pour la fabrication et le test de celui-ci
US9299634B2 (en) 2006-05-16 2016-03-29 Broadcom Corporation Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages
US9013035B2 (en) 2006-06-20 2015-04-21 Broadcom Corporation Thermal improvement for hotspots on dies in integrated circuit packages
US7423341B2 (en) * 2006-08-16 2008-09-09 Agere Systems Inc. Plastic overmolded packages with mechanically decoupled lid attach attachment
EP1986028A3 (fr) * 2007-03-27 2008-11-05 Rohm and Haas Electronic Materials LLC Ensembles optiques et leurs procédés de formation
US20080303033A1 (en) * 2007-06-05 2008-12-11 Cree, Inc. Formation of nitride-based optoelectronic and electronic device structures on lattice-matched substrates
US20090041412A1 (en) * 2007-08-07 2009-02-12 Jeffrey Dean Danley Laser erosion processes for fiber optic ferrules
JP5277617B2 (ja) * 2007-11-26 2013-08-28 住友電気工業株式会社 光モジュール
CN102064465A (zh) * 2010-12-16 2011-05-18 刘兴胜 一种双向制冷式半导体激光器及其制备方法
JP5809866B2 (ja) * 2011-07-21 2015-11-11 オリンパス株式会社 光素子モジュール、光伝送モジュール、および光伝送モジュールの製造方法
JP6117445B2 (ja) * 2014-08-08 2017-04-19 古河電気工業株式会社 光ファイババンドル構造および光ファイバ接続構造
CN104362507B (zh) * 2014-11-25 2017-07-14 中国科学院半导体研究所 一种双面散热量子级联激光器器件结构
WO2016189691A1 (fr) * 2015-05-27 2016-12-01 オリンパス株式会社 Endoscope et module de transmission optique
JP6667307B2 (ja) * 2016-02-04 2020-03-18 古河電気工業株式会社 光ファイバと半導体レーザとの光結合構造
US10197751B2 (en) 2016-03-17 2019-02-05 Applied Optoelectronics, Inc. Coaxial transmitter optical subassembly (TOSA) including ball lens
JP2018078148A (ja) * 2016-11-07 2018-05-17 株式会社東芝 光半導体モジュール
US10418777B2 (en) * 2017-05-10 2019-09-17 Applied Optoelectronics, Inc. Coaxial transmitter optical subassembly (TOSA) including side-by-side laser diode and monitor photodiode arrangement
JP6920898B2 (ja) * 2017-06-23 2021-08-18 日本ルメンタム株式会社 光モジュール、及び光伝送装置
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10901161B2 (en) 2018-09-14 2021-01-26 Toyota Motor Engineering & Manufacturing North America, Inc. Optical power transfer devices with an embedded active cooling chip
US10903618B2 (en) * 2019-03-20 2021-01-26 Chroma Ate Inc. Fixture assembly for testing edge-emitting laser diodes and testing apparatus having the same
KR102862766B1 (ko) * 2019-05-29 2025-09-22 삼성전자주식회사 마이크로 엘이디 디스플레이 및 이의 제작 방법
TWI700780B (zh) * 2019-08-30 2020-08-01 矽品精密工業股份有限公司 電子封裝件及其製法
CN113816332B (zh) * 2020-06-19 2024-07-19 华为技术有限公司 一种光芯片封装结构与封装方法
US20220291462A1 (en) * 2021-03-11 2022-09-15 Intel Corporation Method to couple light using integrated heat spreader
JP2023151188A (ja) * 2022-03-31 2023-10-16 古河電気工業株式会社 光モジュール

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