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WO2005005687A1 - Procede permettant de recouvrir de metal des nanostructures au moyen de sels metalliques - Google Patents

Procede permettant de recouvrir de metal des nanostructures au moyen de sels metalliques Download PDF

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Publication number
WO2005005687A1
WO2005005687A1 PCT/US2004/017440 US2004017440W WO2005005687A1 WO 2005005687 A1 WO2005005687 A1 WO 2005005687A1 US 2004017440 W US2004017440 W US 2004017440W WO 2005005687 A1 WO2005005687 A1 WO 2005005687A1
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Prior art keywords
metal
oxide
metalloid
nanostructured material
chosen
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PCT/US2004/017440
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English (en)
Inventor
Christopher H. Cooper
William K. Cooper
Alan G. Cummings
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Seldon Technologies LLC
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Seldon Technologies LLC
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Publication of WO2005005687A1 publication Critical patent/WO2005005687A1/fr
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/158—Carbon nanotubes
    • C01B32/168—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/18—Nanoonions; Nanoscrolls; Nanohorns; Nanocones; Nanowalls
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
    • C23C18/127—Preformed particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2202/00—Structure or properties of carbon nanotubes
    • C01B2202/02—Single-walled nanotubes
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2202/00—Structure or properties of carbon nanotubes
    • C01B2202/06—Multi-walled nanotubes

Definitions

  • nanostructured material carbon nanotubes
  • the nanostructured materials can be further tailored and improved to exhibit an even broader range of properties by coating them with various materials, including metals, polymers and ceramics.
  • most coatings for nanostructures have been created using deposition methods such as physical or chemical vapor deposition techniques. Such techniques common to the art include CVD, MOCVD, and various sputtering techniques. In addition to being very costly and complex, these methods have limitations, including the inability to produce large quantities of material in a single batch and uniform layer thicknesses.
  • Nanostructured refers to a structure on a nano-scale (e.g., one billionth of a meter), such as on the atomic or molecular level.
  • Nanostructured material is a material comprising at least one nanstructure. Examples of such nanostructured materials include, but are not limited to nanotubes, such as carbon nanotubes, nanowires, diamond, buckyballs, fullerene compounds, and biological moieties.
  • One aspect disclosed herein relates to a method of making a metal or metalloid coated nanostructured material comprising dissolving a metal or metalloid containing salt in a liquid medium to form a solution; [008] contacting the nanostructured material with the solution for a time sufficient to form an intermediate coating on the nanostructured material; and [009] subjecting the intermediate coated nanostructured material to at least one process to decompose the salt, thereby leaving a metal or metalloid coating on the nanostructured material.
  • Metalloids generally refer to those elements located along the line between the metals and nonmetals in the periodic table, and include boron, silicon, germanium, arsenic, antimony, and tellurium.
  • Polonium is also often considered a metalloid.
  • nitride metalloids are cubic boron nitride (cBN) and Si 3 N 4 .
  • An example of a carbide metalloid is B C.
  • An example of a bimetalloid compound is SiB 6 .
  • Fig. 1 is a representation showing how metals may concentrate at the intersection point of two nanostructures.
  • DETAILED DESCRIPTION OF THE INVENTION [012] The present disclosure describes the coating of nanostructure materials with metals or metalloids through a metal salt process. In this process, the metal salt is coated over the nanostructure, using a process, such as liquid phase chemistry.
  • the present invention relates to a method of making a metal or metalloid coated nanostructured material comprising dissolving a metal or metalloid containing salt in a liquid medium to form a solution.
  • the liquid medium may comprise water, organic solvents, acids, or bases.
  • Non- limiting examples of the organic solvents include alcohols, such as ethanol, isopropanol, methanol, and xylene.
  • the solution is formed, it is brought into contact with the nanostructured material for a time sufficient to form an intermediate coating on the nanostructured material. The time of this coating step varies depending on the amount and thickness of coating to be deposited.
  • the time to form an intermediate coating on the nanostructured material may range from a few seconds (for the deposition of a low concentration of metal) to a few minutes (for a denser concentration of metal) to hours and even days for a. thick metal coating.
  • the time to form an intermediate layer is less than 48 hours, such as greater than 1 second to 12 hours or even greater than 1 second to 1 hour.
  • a reaction may be induced, such as by thermal processing, to achieve thermodynamic effects, and form the resulting intermediate coating.
  • merely drying the coated nanostructured may be used to drive off the salt and to form a metal layer.
  • the intermediate coated nanostructured material is then subjected to at least one process to decompose the salt, thereby leaving a metal or metalloid coating on the nanostructured material.
  • decompose means to separate the metal salt into constituent parts or elements, leaving the metal component on the surface of the carbon nanotube and driving off the salt component.
  • an intermediate layer of NaCl which was deposited via an aqueous solution, can be decomposed to leave Na on the surface of the carbon nanotube while driving off gaseous CI.
  • the metal or metalloid comprises at least one material chosen from gold, platinum, titanium, rhodium, indium, copper, iron, palladium, gallium, germanium, tin, lead, tungsten, niobium, molybdenum, silver, nickel, cobalt, potassium, sodium, mixtures thereof, and alloys thereof.
  • "Chosen from” or “selected from” as used herein refers to selection of individual components or the combination of two (or more) components.
  • the above-mentioned metals or metalloids may be complexed with at least one anion chosen from chlorides, bromides, nitrates, chlorates, chlorites, sulfates, and sulfites.
  • the above-described method may further includes at least one process for decomposing the salt.
  • a process may comprise a thermal treatment process at or below the decomposition temperature of the intermediate coating.
  • One skilled in the art would readily be able to determine the decomposition temperature for the particular metal salt of interest.
  • metals may concentrate at the intersection point of two nanostructures. Therefore, in one embodiment, the metal coating can be used to glue or bond two or more nanostructures together. These nanostructures may either be the same type of material or two different nanostructured compounds.
  • the method described herein may also include a process for fusing all of the elements of the nanostructured material, including the metal coating layer, together, after the salt anion is removed.
  • one process may include heating the metal or metalloid coated nanostructured material to a temperature sufficient to fuse together at least two nanotubes, wherein the metal may act as a solder joint between the nanotubes. This temperature is typically the annealing temperature of the deposited nano- metal.
  • this temperature is typically that at which there is ion mobility, and in some case surface diffusion. In one embodiment, the temperature may range from 200°C to 600°C, such as 250°C to 350°C and 300°C.
  • fuse As used herein the term "fused,” “fusion,” or any version of the word “fuse” is defined as the bonding of nanotubes at their point or points of contact. For example, such bonding can be Carbon-Carbon chemical bonding including sp 3 hybridization or chemical bonding of carbon to other atoms.
  • Non-limiting examples of how such fused nanostructured material are made can be found in co-pending U.S. Patent Application No.
  • the nanbstructured material to be coated may comprise various nanotubes, including carbon nanotubes.
  • the carbon nanotubes may be single-walled, multi-walled, nanoscrolled or combinations thereof.
  • the carbon nanotubes may take a variety of known morphologies, such as those chosen from nanohorns, cylinders, nanospirals, dendrites, spider nanotube structures, Y-junction nanotubes, nanorods, and bamboo morphology.
  • the above described nanotube shapes are more particularly defined in M.S. Dresselhaus.G. Dresselhaus, and P.
  • the nanostructured material may comprise nanorods, such as metallic or metalloid oxide nanorods. Unlike nanotubes, nanorods are typically filled and have a multi-layer, graphite-type structure, aligned either parallel, perpendicular, or at an angle to the axis.
  • Non-limiting examples of metallic oxides or metalloid oxides that may form the nanorods include, copper oxide, magnesium oxide, silicon oxide, gold oxide, silver oxide, titanium oxide, and ferric oxide.
  • the nanostructured material comprises metal or metalloid nanowires. Nanowires differ from nanorods in that they have a larger length to width aspect ratio and a degree in flexibility not exhibited by nanorods.
  • Non-limiting examples of metals or metalloids that may form the nanowires include gold, platinum, titanium, rhodium, indium, I copper, iron, palladium, gallium, germanium, tin, lead, tungsten, niobium, molybdenum, silver, nickel, cobalt, potassium, sodium, mixtures and alloys thereof.
  • the nanostructured material comprises nano-wires or nano-threads of diamond, plastic, metal, ceramics, including glass.
  • the nanostructure material may comprise a three dimensional structure of one or more of the previously defined materials, such as one or more of the following: nanotubes, nanowires, nanorods, buckyballs (and/or diamond and fullerene compounds), and biological moieties.
  • the three-dimensional structure comprises a combination of carbon nanotubes, nanowires, and nanorods.
  • the three-dimensional structure may optionally comprise at least one support material chosen from polymers, ceramics, and metals.
  • the polymers, ceramics, and metals used as support material may be in any useful form, including fibers, beads, particles, wires, sheets, foils, and combinations thereof.
  • Typical polymers that may be used as a support material include single or multi-component polymers.
  • the single or multi-component polymers may be chosen from nylon, polyurethane, acrylic, methacrylic, polycarbonate, epoxy, silicone rubbers, natural rubbers, synthetic rubbers, vulcanized rubbers, polystyrene, aramid, polyethylene, ultra-high-molecular weight polyethylene, high-density polyethylene (HDPE), low-density polyethylene (LDPE), poly(p-fenyl-2, 6-benzobisoxazol), polypropylene, polychloroprene, polyimide, polyamide, polyacrylonitrile, polyhydroaminoester, polyester (polyethylene terephthalate), polybutylene terephthalate, poly-paraphylene terephtalamide, polyester ester ketene, viton fluoroelastomer, polytetrafluoroethylene, and polyvinylchloride.
  • Typical ceramics that may be used as a support material include boron carbide, boron nitride, boron oxide, boron phosphate, beryllium oxide, spinel, garnet, lanthanum fluoride, calcium fluoride, silicon carbide, carbon and its allotropes, silicon oxide, glass, quartz, aluminum oxide, aluminum nitride, zirconium oxide, zirconium carbide, zirconium boride, zirconium nitrite, hafnium boride, thorium oxide, yttrium oxide, magnesium oxide, phosphorus oxide, cordierite, mullite, silicon nitride, ferrite, sapphire, steatite, titanium carbide, titanium nitride, titanium boride, and combinations thereof.
  • Typical metals that may be used as a support material include aluminum, boron, copper, cobalt, gold, platinum, silicon, steel, titanium, rhodium, indium, iron, palladium, germanium, tin, lead, tungsten, niobium, molybdenum, nickel, silver, zirconium, yttrium, and alloys thereof.
  • the nanostructure material comprises a three dimensional structure of one or more carbon nanotubes, nanowires, nanorods, that are fused by irradiative, electrical, chemical, thermal, or mechanical processing, either independently or in conjunction with one another.
  • thermal processing of the three dimensional structure may be carried out in an oven at a temperature below the melting point of the support material, if present.
  • Examples of typical irradiative processing includes E-beam irradiation, Ultra Violet radiation, X-ray, Plasma, or other ionizing radiation.
  • Examples of typical chemical processing includes treating the carbon nanotubes with at least one chemical chosen from acids, bases, carboxyls, peroxides, and amines for a time sufficient to facilitate fusion of the carbon nanotubes with one another.
  • chemical processing may comprise photochemical bonding for a time sufficient to obtain chemical cross inking.
  • cross linking means that a chemical bond is formed between two or more nanotubes within the carbon nanotube nanostructured material.
  • a method of making a metal coated carbon nanotube mesh comprising: [043] dissolving a metal salt in an aqueous solution; [044] contacting the carbon nanotube mesh with the aqueous solution for a time sufficient to form an intermediate coating of metal salt on the carbon nanotube mesh; and [045] heating the coated carbon nanotube mesh to a temperature up to 300°C for a time sufficient to substantially remove the salt from the metal salt, thereby leaving a metal coating on the carbon nanotube mesh.
  • the metal salt is typically chosen from a chloride, bromide, nitrate, chlorate, chlorite, sulfate, and sulfite of gold, platinum, titanium, rhodium, indium, copper, iron, palladium, gallium, germanium, tin, lead, tungsten, niobium, molybdenum, silver, nickel, cobalt, potassium, and sodium, and mixtures thereof.
  • Particle size is determined by a number distribution, e.g., by the number of particles having a particular size.
  • the method is typically measured by microscopic techniques, such as by a calibrated optical microscope, by calibrated polystyrene beads and by calibrated scanning force microscope or scanning electron microscope or scanning tunneling microscope and scanning electron microscope. Methods of measuring particles of the sizes described herein are taught in Walter C. McCrone's et al., The Particle Atlas, (An encyclopedia of techniques for small particle identification), Vol. I, Principles and Techniques, Ed. Two (Ann Arbor Science Pub.), which is herein incorporated by reference. [048]
  • a carbon nanotube mesh can be coated with gold using an aqueous solution of gold chloride.
  • the intermediate layer is formed.
  • Tin coated carbon nanotube mesh and silver coated carbon nanomesh can be fabricated using a similar process. For example, a tin chloride aqueous solution and a silver nitrate aqueous solution, respectively, can be used to make the coated nanomesh.
  • coated nanostructured materials made by any one or any combination of the above-described processes.

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Abstract

La présente invention concerne un procédé qui permet de fabriquer un matériau nanostructuré recouvert d'un métal ou d'un métalloïde, selon lequel : on dissout un sel contenant un métal ou un métalloïde dans un milieu liquide pour former une solution ; on met le matériau nanostructuré en contact avec la solution pendant une période suffisante pour former un revêtement intermédiaire sur le matériau nanostructuré, et on soumet le matériau nanostructuré muni du revêtement intermédiaire à au moins un traitement afin de décomposer le sel, et laisser de la sorte un revêtement de métal ou de métalloïde sur le matériau nanostructuré. L'invention se rapporte également à un matériau nanostructuré recouvert de métal ou de métalloïde fabriqué selon le procédé de l'invention.
PCT/US2004/017440 2003-07-02 2004-07-02 Procede permettant de recouvrir de metal des nanostructures au moyen de sels metalliques Ceased WO2005005687A1 (fr)

Applications Claiming Priority (2)

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US48412503P 2003-07-02 2003-07-02
US60/484,125 2003-07-02

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006115486A1 (fr) * 2005-04-22 2006-11-02 Seldon Technologies, Llc Article comprenant des nanotubes de carbone et procede d’utilisation de celui-ci pour purifier des fluides
CN100371243C (zh) * 2006-03-03 2008-02-27 中国科学院上海硅酸盐研究所 纳米二氧化锡颗粒原位包裹碳纳米管复合粉体的制备方法
US7419601B2 (en) 2003-03-07 2008-09-02 Seldon Technologies, Llc Nanomesh article and method of using the same for purifying fluids
US7938987B2 (en) * 2006-05-01 2011-05-10 Yazaki Corporation Organized carbon and non-carbon assembly and methods of making
CN102233695A (zh) * 2010-04-27 2011-11-09 无锡百奥科环境科技有限公司 一种含竹碳纳米管复合涂层型吸波材料及其制备方法
WO2012060776A1 (fr) * 2010-07-19 2012-05-10 National University Of Singapore Nanofils métalliques, nanoréseau et procédé de fabrication
US8309226B2 (en) 2007-08-03 2012-11-13 Yazaki Corporation Electrically conductive transparent coatings comprising organized assemblies of carbon and non-carbon compounds
US20160175933A1 (en) * 2014-03-18 2016-06-23 United Technologies Corporation Fabrication of articles from nanowires
US9410007B2 (en) 2012-09-27 2016-08-09 Rhodia Operations Process for making silver nanostructures and copolymer useful in such process
US20180287608A1 (en) * 2013-02-26 2018-10-04 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
US10781324B2 (en) 2012-06-22 2020-09-22 C3Nano Inc. Metal nanostructured networks and transparent conductive material
US10870772B2 (en) 2014-07-31 2020-12-22 C3Nano Inc. Transparent conductive films with fused networks
US11274223B2 (en) 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
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US10870772B2 (en) 2014-07-31 2020-12-22 C3Nano Inc. Transparent conductive films with fused networks
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CN115504803A (zh) * 2022-09-14 2022-12-23 浙江天地环保科技股份有限公司 一种粉煤灰基堇青石蜂窝陶瓷及其制备方法
CN115491247A (zh) * 2022-09-29 2022-12-20 中国科学院兰州化学物理研究所 一种耐高温固体润滑涂层及其制备与应用
CN120329021A (zh) * 2025-04-28 2025-07-18 江西柚米一粒陶瓷有限公司 一种低温耐热陶瓷及其生产工艺
CN120329021B (zh) * 2025-04-28 2025-11-21 江西柚米一粒陶瓷有限公司 一种低温耐热陶瓷及其生产工艺

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