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WO2005098065A1 - Materiau de coulage d’alliage aluminium pour traitement thermique d’excellente conduction thermique et procédé de fabrication de celui-ci - Google Patents

Materiau de coulage d’alliage aluminium pour traitement thermique d’excellente conduction thermique et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2005098065A1
WO2005098065A1 PCT/JP2005/006639 JP2005006639W WO2005098065A1 WO 2005098065 A1 WO2005098065 A1 WO 2005098065A1 JP 2005006639 W JP2005006639 W JP 2005006639W WO 2005098065 A1 WO2005098065 A1 WO 2005098065A1
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WIPO (PCT)
Prior art keywords
aluminum alloy
mass
thermal conductivity
amount
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/006639
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English (en)
Japanese (ja)
Inventor
Hiroshi Horikawa
Sanji Kitaoka
Masahiko Shioda
Toshihiro Suzuki
Takahiko Watai
Hidetoshi Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Light Metal Co Ltd
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Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004111496A external-priority patent/JP4341453B2/ja
Priority claimed from JP2004113584A external-priority patent/JP4487615B2/ja
Application filed by Nippon Light Metal Co Ltd filed Critical Nippon Light Metal Co Ltd
Priority to US11/547,257 priority Critical patent/US20110132504A1/en
Priority to EP05728404.4A priority patent/EP1736561B1/fr
Publication of WO2005098065A1 publication Critical patent/WO2005098065A1/fr
Anticipated expiration legal-status Critical
Priority to US13/342,625 priority patent/US8936688B2/en
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C21/00Alloys based on aluminium
    • C22C21/02Alloys based on aluminium with silicon as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/043Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with silicon as the next major constituent

Definitions

  • the present invention relates to an aluminum alloy for heat treatment having excellent thermal conductivity and a method of manufacturing the same.
  • the present invention relates to an aluminum alloy composite material having high thermal conductivity and a method for producing the same.
  • the aluminum alloy composite material having a high thermal conductivity according to the present invention can be suitably used for a heat sink having a complicated shape or a heat sink having a thin portion in order to enhance heat dissipation.
  • the present invention relates to an aluminum alloy composite material having improved formability by adding Si, and at the same time, having improved thermal conductivity.
  • Aluminum alloy for heat conduction is a metal alloy for heat conduction.
  • Another object of the present invention is to provide a method for producing a strong aluminum alloy product.
  • the present invention proposes an aluminum alloy-made material according to claim 1, which contains 31: 5 to 10.0% by mass, Mg: 0.1 to 0.5% by mass, and the balance is A1 It is an aluminum alloy material with excellent thermal conductivity, which is made of unavoidable impurities and has been aged.
  • the above-mentioned aluminum alloy composite material includes
  • an aluminum alloy composite material having these compositions is an aluminum alloy composite material having both high heat conductivity and strength and excellent structural properties.
  • the aging treatment is performed at a temperature of 160 to 270 ° C.
  • the present invention according to claim 4 is also characterized in that before performing the aging treatment, the solution dipping treatment is performed by holding at 480 to 540 ° C for 1 to 10 hours, and thereafter, at 100 ° CZ seconds or more. It proposes quenching by cooling to a temperature below 100 ° C at a cooling rate.
  • the inventors of the present invention have conducted intensive studies to solve the above-mentioned problems.
  • the amount of Si dissolved in the mother phase of the Al—Si-based aluminum alloy material and the area of the crystallized material in the metal structure were determined. Influence on the thermal conductivity and strength of the material greatly.If both the S-dissolved amount and the area ratio of the crystallized material are optimized, the thermal conductivity is particularly excellent while having sufficient mechanical strength. It was also found that an aluminum alloy was obtained.
  • the content of Si: 6.0 to 8.0% by mass, the content of elements other than Si and A1 alone is 0.6% or less
  • the solid solution amount of Si in the phase is adjusted to 0.5 to 1.1% by mass, preferably 0.55 to: L 05% by mass, more preferably 0.6 to 1.0% by mass. 5 to 8%, preferably 5.5 to 7.5%, more preferably More preferably, the present invention provides an aluminum-palladium alloy material excellent in heat conductivity, characterized in that the content is adjusted to 6.0 to 7.0%.
  • the aluminum alloy solid is preferably made of an elemental force other than Si and A1 Mg: 0.2 to 0.5% by mass, and Fe: 0.6% by mass. And other elements having a total amount of 0.2% by mass or less.
  • the amount of Ti and Z or Zr is 0.03. It is preferably adjusted to not more than mass%.
  • the aluminum alloy article has a thermal conductivity superior to that of the conventional aluminum alloy article, and is preferably 160 W / m ⁇ k or more. And more preferably 165 WZm'k or more.
  • the aluminum alloy material containing 6.0 to 8.0% by mass of Si and containing 0.6% by mass or less of elements other than Si and A1 as a single element is used.
  • a method for producing an aluminum alloy article having excellent thermal conductivity characterized by performing a heat-holding treatment at 510 ° C. for 1 hour or more.
  • an aluminum alloy ⁇ material preferably, Si: 6. 0 to 8 0 wt 0/0, Mg:.. 0. 2 ⁇ 0 5 wt%, Fe: includes 0.6 mass% or less,
  • the balance becomes aluminum and other elemental forces having a total amount of 0.2 mass% or less, and the content of Ti, Z or Zr in the aluminum alloy material is adjusted to 0.03 mass% or less.
  • the heating and holding time of the aluminum alloy material is 1 hour or more. Note that even if the heating and holding treatment is performed for 7 hours or more, no further improvement in characteristics can be obtained.
  • a heat sink having a complicated shape or a heat sink having a thin portion is preferably used by virtue of the above-described properties of aluminum alloy having excellent heat conduction characteristics and mechanical strength and excellent formability. It can be manufactured.
  • FIG. 1 is a photomicrograph, instead of a drawing, showing the structures of an azcast material and an aluminum alloy composite (Nos. 1, 4 to 6).
  • Mg has the effect of improving mechanical strength but lowers the thermal conductivity. Therefore, high thermal conductivity is required. It is believed that lower amounts are preferred.
  • the present invention is to enhance the thermal conductivity of the aluminum alloy ⁇ material by Rukoto be added from 0.1 to 0.5 mass 0/0 with Mg Al- Si-based aluminum alloy.
  • Si has an effect of improving the structurability.
  • Si When manufacturing a material having a complicated shape or a thin portion such as a heat sink, it is necessary to add Si in an amount of 5% by mass or more from the viewpoint of the productivity.
  • Si also has the effect of improving the mechanical strength, wear resistance, and vibration isolation of the structural material.
  • the thermal conductivity and extensibility of the alloy decrease, and if the amount of Si exceeds 10% by mass, the plasticity becomes insufficient, so it is desirable that the content be 10.0% by mass or less. .
  • Fe not only improves the mechanical strength of the aluminum alloy but also has the effect of preventing seizure of the mold when it is manufactured by die casting. This effect becomes remarkable when Fe is contained in an amount of 0.3% by mass or more. However, the thermal conductivity and extensibility decrease with increasing Fe, and when the amount of Fe exceeds 0.6% by mass, the plasticity becomes insufficient.
  • Mg forms and precipitates with the Si-based compound in the parent phase to reduce the amount of solid solution of Si in the parent phase and improve the thermal conductivity. Furthermore, the mechanical strength is improved by the addition of Mg. This effect becomes remarkable when the amount of Mg added is 0.1% by mass or more. However, when the amount exceeds 0.5% by mass, the thermal conductivity decreases. [0022] (Inevitable impurities)
  • thermal conductivity decreases with an increase in impurities it is preferable to suppress unavoidable impurities to 0.1% by mass or less.
  • Ti, Mn and Zr have a large effect on the thermal conductivity, it is preferable to suppress the content to 0.05% by mass or less.
  • the micro-macro segregation seen in the microstructure is alleviated, and the variation in the thermal conductivity and mechanical strength is reduced.
  • transition elements such as Fe
  • transition elements such as Fe
  • extensibility by spheroidizing Si particles to improve plastic workability. Can be improved.
  • the treatment temperature is less than 480 ° C or the holding time is less than 1 hour, the above effect is insufficient. Conversely, if the temperature exceeds 540 ° C or the holding time is more than 10 hours, local melting occurs. The likelihood that the strength is reduced is increased.
  • the treatment temperature is preferably set to a temperature higher than 500 ° C. When the solution treatment is not performed, it is preferable to cool at a cooling rate of 100 ° CZ seconds or more up to 200 ° C. after fabrication.
  • Si and Mg dissolved in the mother phase are precipitated as Mg-Si-based compounds, and dissolved in the mother phase to reduce the amount of Si and Mg.
  • the thermal conductivity of the alloy can be improved.
  • Mg-Si compounds improve the mechanical strength of the alloy.
  • the heat treatment conditions can be selected based on the desired properties such as thermal conductivity and strength as in the case of the alloy composition, and can be selected in consideration of restrictions on industrial production. Considering the balance between thermal conductivity and strength, 180 More preferably, the temperature is in the range of 4 to 8 hours at ° C to 250 ° C.
  • Example 1 An alloy alloy containing 7.0 mass% of Si and 0, 0.3, 0.5, 0.6 mass% of Mg was prepared into an alloy material, and then the alloy material was added to the alloy material. After aging treatment under the conditions shown in Table 1, the thermal conductivity was measured. Table 1 shows the measurement results of the thermal conductivity. For alloys containing 0.3% by mass of Mg, the solid solution amounts of Si and Mg were also measured. The results are shown in Table 2. The fabrication was performed by a gravity mold fabrication method.
  • Table 2 shows that the aging treatment decreases the amount of Si dissolved in the alloy to which Mg is added.
  • Example 2 An aluminum alloy containing 7.0% by mass of Si and 0.4% by mass of Fe was added to an Al alloy containing 0 and 0.3% by mass of Mg.
  • the forging material was forged by the PF die casting method.
  • the obtained preform was solution-treated at 500 ° C. for 2 hours, and then water-quenched. Thereafter, the thermal conductivity was measured, and thereafter, the aging treatment was performed at 250 ° C. for 4 hours, and the thermal conductivity was measured again.
  • Table 3 The results are shown in Table 3.
  • the Mg-added structural material is not subjected to the aging treatment.
  • the thermal conductivity is lower than that of the Mg-free Mg-added material. It can be seen that the treatment improves the thermal conductivity to a level equal to or higher than that of the magnesium alloy-free material.
  • the aluminum alloy powder excellent in thermal conductivity of the present invention contains 31: 6.0 to 8.0% by mass, and the elements other than Si and A1 alone are 0.6% or less.
  • the amount of Si dissolved in the aluminum matrix is adjusted to 0.5 to 1.1% by mass, and the area ratio of the crystals in the metal structure is adjusted to 5 to 8%.
  • the aluminum alloy is preferably an elemental force other than Si and A1 Mg: 0.2 to 0.5% by mass, Fe: 0.6% by mass or less, and the total amount is 0.2% by mass or less. It has a composition consisting of other elements.
  • Si has an effect of improving the structurability.
  • the content of Si When manufacturing a material having a complicated shape or a thin-walled portion such as a heat sink, the content of Si must be 6.0% by mass or more in order to ensure sufficient productivity.
  • This Si is crystallized as a Si-based crystallized substance, and also has an effect of improving the mechanical strength, abrasion resistance and vibration damping properties of the substance.
  • the amount of Si is further increased, As the Si content exceeds 8.0% by mass, the thermal conductivity decreases. Therefore, for the purpose of the present invention, the amount of Si must be in the range of 6.0 to 8.0% by mass.
  • Mg is not an essential element in the present invention.
  • Mg has a function of forming an Mg-based crystallized substance and improving mechanical strength. Therefore, it is preferable to include Mg when mechanical strength is particularly required. This effect becomes remarkable at 0.2% by mass or more, and conversely, when it exceeds 0.5% by mass, the thermal conductivity decreases. Further, part of Mg forms an Mg-Si based precipitate and has an effect of improving mechanical strength. Therefore, If you store the products for a long is contained Mg, 0. 2 to 0. Preferably 5 mass 0/0 range.
  • Fe is an impurity that is inevitably mixed, but has the effect of improving the mechanical strength and suppressing seizure of the mold when it is manufactured by the die casting method.
  • the content of Fe increases, the thermal conductivity and extensibility decrease.
  • the content of Fe exceeds 0.6% by mass, the plasticity becomes insufficient. Therefore, even if Fe is inevitably mixed, the content is preferably not more than 0.3% by mass.
  • the aluminum alloy product according to the present invention may contain elements other than Si, Mg, Fe and A1 as long as the total is 0.2% by mass or less. These elements are usually unavoidable impurities, but need not be recognized as such. Specific examples of these elements include Ti, Mn, Cr, B, Zr, P, Ca, Na, Sr, Sb and Zn.
  • Ti, Mn and Zr have a large effect on the thermal conductivity, it is preferable to suppress their amounts to 0.05% by mass or less.
  • the amount of S-solution greatly affects its thermal conductivity. If the amount of solid solution of Si exceeds 1.1% by mass, the thermal conductivity is reduced. On the other hand, if the Si solid solution amount is less than 0.5% by mass, sufficient mechanical strength cannot be obtained. (Area ratio of crystallized product: 5 to 8%) (Preferable range: 5.5 to 7.5%, more preferable range: 6.0 to 7.0%)
  • the present inventors have newly found that, when the area ratio of the crystallized product of the aluminum alloy product exceeds 8%, the crystallized product inhibits heat conduction. Also, the elongation will be low. On the other hand, if the area ratio of the crystallized product is less than 5%, sufficient strength cannot be obtained.
  • the present inventors have found that the above aluminum alloy product can be obtained by further heating and holding a conventional aluminum alloy product having excellent formability at a predetermined temperature.
  • an aluminum alloy preform having a predetermined composition is produced.
  • any conventionally known manufacturing methods such as a molten metal manufacturing method, a DC method, a metal mold manufacturing method, and the like can be used. It can also be used as a material for the above method.
  • Such aluminum alloy products include, for example, products manufactured using JIS standard AC4C and AC4CH alloys.
  • the aluminum alloy raw material is heated and held at 400 to 510 ° C.
  • Si that had been dissolved in the mother phase was precipitated, and the amount of Si dissolved in the mother phase became 0.5 to 1.1% by mass, and the crystallized material was removed. Is partly dissolved in the parent phase, and the area ratio of the crystallized substance is in the range of 5 to 8%.
  • the heating and holding temperature is higher than 510 ° C.
  • many of the crystallized substances form a solid solution in the mother phase.
  • the area ratio of the crystallized substances is reduced and the Si solidified is reduced.
  • the solubility increases, and the thermal conductivity decreases.
  • the mechanical strength decreases.
  • thermal conductivity does not improve because Si in the mother phase does not precipitate and the amount of Si solid solution does not decrease.
  • the area ratio of the crystallized substance increases and the thermal conductivity decreases.
  • the heat holding treatment is preferably performed for one hour or more. More than 5 hours Even if heated and held, the amount of solid solution of Si and the area ratio of crystallized matter hardly change any more. Therefore, it is preferable that the holding time is less than 5 hours in terms of cost.
  • the mixture is cooled to room temperature, and the subsequent cooling may be water-cooled or furnace-cooled.
  • the amount of precipitates differs depending on the cooling rate, and the amount of solid solution of Si also changes.However, in the case of the alloy of the present invention, Si is already precipitated during the heating and holding treatment, and the amount of dissolved S is small. , The effect is small. If you want to increase the strength even slightly, water cooling is preferred. However, in the case of water cooling, the cooling rate differs depending on the portion, and deformation tends to occur during cooling. Therefore, in the case of a device having a thin portion such as a heat sink, slow cooling is preferable.
  • Si 7. consists of a mass 0/0, Mg and 0.32 mass 0/0, Fe and 0.2 mass 0/0 and aluminum, in a total amount of other elements of that is 0.2 wt% or less
  • a certain aluminum alloy material (CF4 standard, equivalent to AC4C) was manufactured to 203 mm x 2000 mm from the DC method. 380 of the resulting cast material (No. 1). C, 420. C, 450. C, 500. C, 535. C, 550. C. for 5 hours, and then cooled to room temperature by water cooling to obtain aluminum alloy particles (Nos. 2 to 7).
  • Microstructures of the as-cast material (No. 1) and the aluminum-pum alloy products (Nos. 4 to 6) obtained by performing the heat-holding treatment as described above were observed with a microscope.
  • Figure 1 shows some of the results.
  • the thermal conductivity, the tensile strength, the amount of solid solution of Si, and the area ratio of the crystallized product were measured for the above-mentioned azcast material and aluminum alloy material.
  • the amount of Si dissolved was determined by chemical deduction, and the amount of Si in the phenol residue was subtracted from the obtained amount of Si in the alloy. The amount was taken as the amount of Si solid solution.
  • the hot phenol dissolved residue was obtained by dissolving the alloy with hot phenol and filtering the solution with a membrane filter (0.1 m).
  • the area ratio of the crystallized substance was measured after setting the substance to mirror-polishing and then setting it in an image processing / analysis apparatus.
  • one visual field (0.014 mm 2 ) was measured for 10 visual fields, and the average value was taken.
  • Table 4 summarizes the results of the above measurements.
  • the heat-holding treatment was performed so that the force of the results in Table 4 was also applied.
  • the azcast material (No. 1) and the comparative aluminum alloy material (No. 2) having a low heat-holding temperature were as follows: The area ratio of the crystallized matter is large, so the thermal conductivity and elongation are low. From this, it is confirmed that the crystallized substances hinder heat conduction.
  • the comparative aluminum alloy particles (Nos. 6 to 7) having a high heat-holding treatment temperature have an increased amount of Si solid solution and low thermal conductivity.
  • the aluminum alloy particles (Nos. 3 to 5) according to the present invention all have an optimum range of the amount of solid solution and the area of the crystallized material, and have thermal conductivity, tensile strength and elongation. Are all high and numerical values! /
  • the azcast material obtained in Example 3 was subjected to a heat-holding treatment at 450 ° C for 0.5 hours, 1 hour, 3 hours, and 7 hours, and then gradually cooled to room temperature. Palladium alloys (Nos. 8 to 11) were obtained. Using the same method as in Example 3, the obtained aluminum alloy powder was measured for the amount of S-solution, the area ratio of the crystallized substance, the thermal conductivity, the tensile strength and the elongation.

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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Continuous Casting (AREA)
  • Conductive Materials (AREA)

Abstract

Il est prévu un matériau de coulage d'alliage aluminium pour conduction thermique obtenu en ajoutant du Si à un matériau de coulage d'alliage aluminium ayant une aptitude au coulage accrue pour ainsi augmenter la conductivité thermique. Il est prévu un matériau de coulage d'alliage aluminium d'une excellente conduction thermique, caractérisé en ce qu'il comprend 5 à 10,0 % en masse de Si, de 0,1 à 0,5 % en masse de Mg et le solde étant Al et les inévitables impuretés, le matériau de coulage d'alliage aluminium ayant subi un traitement de vieillissement. Il est prévu en outre un matériau de coulage d'alliage aluminium coulé qui tout en ayant une aptitude au coulage et une résistance mécanique équivalentes ou supérieures à celles des alliages aluminium coulés conventionnels, a également une meilleure conduction thermique, et un procédé de fabrication de l’alliage aluminium coulé. Il est prévu en particulier un alliage aluminium coulé et un procédé de fabrication de celui-ci, où Si est contenu dans une quantité de 6,0 à 8,0 % en masse, les éléments autres que Si et Al chacun sous forme simple dans une quantité inférieure ou égale à 0,6 %, et où la quantité de Si dissout en solide dans une phase parente aluminium est régulée à 0,5 à 1,1 % en masse tandis que le rapport de section de produit de cristallisation dans une structure de métal est régulé à 5 - 8 %. Dans cette perspective, la quantité de Si dissout en solide et le rapport de section de produit de cristallisation peuvent être obtenus grâce à un traitement de conservation de chaleur de l’alliage aluminium coulé objet de l’invention après l’opération de coulage à 400-510°C pendant une heure ou davantage.
PCT/JP2005/006639 2004-04-05 2005-04-05 Materiau de coulage d’alliage aluminium pour traitement thermique d’excellente conduction thermique et procédé de fabrication de celui-ci Ceased WO2005098065A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/547,257 US20110132504A1 (en) 2004-04-05 2005-04-05 Aluminum Alloy Casting Material for Heat Treatment Excelling in Heat Conduction and Process for Producing the Same
EP05728404.4A EP1736561B1 (fr) 2004-04-05 2005-04-05 Materiau de coulage d"alliage aluminium pour traitement thermique d"excellente conduction thermique et procédé de fabrication de celui-ci
US13/342,625 US8936688B2 (en) 2004-04-05 2012-01-03 Aluminum alloy casting material for heat treatment excelling in heat conduction and process for producing the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004-111496 2004-04-05
JP2004111496A JP4341453B2 (ja) 2004-04-05 2004-04-05 熱伝導性に優れたアルミニウム合金鋳物及びその製造方法
JP2004113584A JP4487615B2 (ja) 2004-04-07 2004-04-07 熱伝導性に優れたアルミニウム合金鋳造材の製造方法
JP2004-113584 2004-04-07

Related Child Applications (2)

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US11/547,257 A-371-Of-International US20110132504A1 (en) 2004-04-05 2005-04-05 Aluminum Alloy Casting Material for Heat Treatment Excelling in Heat Conduction and Process for Producing the Same
US13/342,625 Division US8936688B2 (en) 2004-04-05 2012-01-03 Aluminum alloy casting material for heat treatment excelling in heat conduction and process for producing the same

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WO2005098065A1 true WO2005098065A1 (fr) 2005-10-20

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US (2) US20110132504A1 (fr)
EP (3) EP2275584B1 (fr)
KR (1) KR20060130658A (fr)
WO (1) WO2005098065A1 (fr)

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JP2007197797A (ja) * 2006-01-27 2007-08-09 Mazda Motor Corp 低熱伝導性アルミニウム合金材料及び当該材料からなる鋳造品の製造方法
JP2008057029A (ja) * 2006-09-04 2008-03-13 Mazda Motor Corp 低熱伝導性アルミニウム合金材料及び鋳造品の製造方法
US9353429B2 (en) 2007-02-27 2016-05-31 Nippon Light Metal Company, Ltd. Aluminum alloy material for use in thermal conduction application
WO2018095186A1 (fr) * 2016-11-23 2018-05-31 比亚迪股份有限公司 Alliage d'aluminium thermoconducteur et son utilisation
US11097380B2 (en) 2010-02-10 2021-08-24 Hobart Brothers Llc Aluminum alloy welding wire
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US11890703B2 (en) * 2010-02-10 2024-02-06 Illinois Tool Works Inc. Aluminum alloy welding wire

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JP5747103B1 (ja) * 2014-05-02 2015-07-08 株式会社浅沼技研 アルミニウム合金から成る放熱フィン及びその製造方法
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