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WO2005086547A1 - Carte a cablage imprime souple et son procede de fabrication - Google Patents

Carte a cablage imprime souple et son procede de fabrication Download PDF

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Publication number
WO2005086547A1
WO2005086547A1 PCT/JP2005/004100 JP2005004100W WO2005086547A1 WO 2005086547 A1 WO2005086547 A1 WO 2005086547A1 JP 2005004100 W JP2005004100 W JP 2005004100W WO 2005086547 A1 WO2005086547 A1 WO 2005086547A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
thickness
conductor
polyimide
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2005/004100
Other languages
English (en)
Japanese (ja)
Inventor
Ichiro Higasayama
Seiji Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Publication of WO2005086547A1 publication Critical patent/WO2005086547A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

Definitions

  • the present invention relates to a substrate for flexible printed wiring and a method for manufacturing the same, which meets the demands for downsizing and lightweight electronic devices.
  • the present invention relates to a high-quality single-sided conductor flexible printed wiring board having no warpage in a polyimide film portion after wiring processing and a method of manufacturing the same.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 62-212140
  • Patent Document 2 JP-A-63-84188
  • Patent Document 3 JP-A-63-245988
  • Patent Document 4 Japanese Patent Publication No. 6-49185
  • the cause of this phenomenon is that the degree of orientation of polyimide molecules in the thickness direction of the formed polyimide resin layer is different in the process of applying and drying the polyimide precursor resin solution and imidizing by heat treatment.
  • the mechanism has not been elucidated yet.
  • an object of the present invention is to curl the film even after the circuit is cut to the conductor side.
  • An object of the present invention is to provide a flexible printed wiring board having stable quality and a method of manufacturing the same.
  • the inventors of the present invention have conducted intensive studies on the above problems, and as a result, have predicted a difference in the coefficient of thermal expansion in the thickness direction, which also causes a difference in the degree of orientation of the polyimide molecules in the thickness direction of the multilayer polyimide layer.
  • a polyimide resin layer having a higher thermal expansion coefficient than the base layer present between the two layers is arranged on the layer in contact with the conductor and the top layer, and the thickness of the layer in contact with the conductor is greater than the thickness of the top layer. It has been found that the object of the present invention can be achieved by reducing the size, and the present invention has been completed.
  • the flexible printed wiring board of the present invention is a flexible printed wiring board having a multilayer polyimide layer having a different thermal expansion coefficient on one surface of a conductor, and is provided with a bottom layer and a conductor that are in contact with the conductor.
  • at least one thermal expansion coefficient is made of 30 X 10- 6 (1Z ° C ) or lower thermal expansion polyimide-based ⁇ base layer is disposed intermediate the opposite top layer of, and, the bottom layer and the top layer Is made of a thermoplastic polyimide resin with a larger coefficient of thermal expansion than the base layer, and the conditions of bottom layer thickness P and top layer thickness P force P
  • the ratio P / (P + P) of the total thickness of the bottom layer and the top layer on both sides thereof to the thickness P of the base layer in the present invention is in the range of 2-100.
  • the thickness P of the bottom layer in the present invention is in the range of 0.2-10 / zm, and the ratio P / P to the thickness P of the top layer is in the range of 0.2-0.8. It is desirable that
  • a multi-layered polyimide precursor resin solution is directly applied on one side of a conductor, dried and then heat-cured to obtain a multilayer having a different coefficient of thermal expansion.
  • the coefficient of thermal expansion is 30 X 10 —
  • a base layer that can be converted to a low thermal expansion polyimide resin of 6 (1Z ° C) or less is provided, and the bottom layer and the top layer are made of a thermoplastic polyimide resin having a higher thermal expansion coefficient than the base layer.
  • the polyimide resin solution that can be converted is applied so as to satisfy the conditions of the bottom layer thickness p and the top layer thickness p 1S p ⁇ p.
  • the ratio P / (P + P) of the thickness P of the base layer to the total thickness of the bottom layer and the top layer on both sides thereof is preferably in the range of 2-100. Furthermore, in the present invention, the thickness P of the bottom layer satisfies the range of 0.2-10 / zm, and the ratio P / P to the thickness P of the top layer satisfies the range of 0.2-0.8.
  • the polyimide film does not curl or warp even if unnecessary metal foil is removed by applying circuit strength to the substrate for flexible printed wiring, resulting in excellent dimensional stability.
  • a printed wiring board can be manufactured.
  • the conductor used in the present invention is a conductive metal foil having a thickness of 5 to 150 ⁇ m, such as copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, and alloys thereof. And copper is preferable.
  • copper there are rolled copper foil and electrolytic copper foil, both of which can be used.
  • the surface may be subjected to chemical or mechanical surface treatment such as siding, nickel plating, copper-zinc alloy plating, or aluminum alcoholate, aluminum chelate, or silane coupling agent. ,.
  • An insulating layer can be formed by forming a plurality of polyimide-based resin layers on one surface of a conductive metal foil as a conductor.
  • the polyimide-based resin used as the insulating layer is as follows. This is a general term for resins having an imide ring structure, and examples thereof include polyimide, polyamide imide, and polyester imide.
  • the polyimide-based resin layer those having low thermal expansion as described in the above-mentioned Patent Documents 14 and thermoplastic polyimides which melt or soften when heated can be used, and are not particularly limited.
  • insulator layer as a base layer of low thermal expansion property ⁇ layer of thermal expansion coefficient (or linear expansion coefficients) 30 X 10- 6 (lZk), greater thermal expansion coefficient than the base layer on the upper and lower It is desirable to use at least three polyimide resin layers in which two layers (bottom layer and top layer) of thermoplastic polyimide resin are arranged.
  • the coefficient of thermal expansion was determined by using a sample after the imidization reaction was sufficiently completed, using a thermomechanical analyzer (TMA), raising the temperature to 250 ° C, cooling at a rate of 10 ° CZ, and The average coefficient of thermal expansion in the range of 100 ° C was determined.
  • TMA thermomechanical analyzer
  • a polyimide resin having a unit structure represented by the following general formula (I) is desirable.
  • thermoplastic polyimide resin used to form the bottom and top layers above and below the base layer should have a coefficient of thermal expansion greater than that of the base layer and a glass transition temperature of 350 ° C or lower. Just fine. It is preferable that the adhesive strength at the interface is sufficient when pressed under heat and pressure.
  • the thermoplastic polyimide resin species of the bottom layer and the top layer may be the same or may have different unit structures as long as the above conditions are satisfied.
  • the thermoplastic polyimide resin as used herein includes those which can be adhered by pressure so that they do not necessarily show sufficient fluidity in a normal state above the glass transition point. Specific examples of the thermoplastic polyimide resin having such properties include those having a unit structure represented by the following general formula (II) or general formula (III). [0019] [Formula 2] 0 tt 0 o>
  • Ar is a divalent aromatic group having 12 or more carbon atoms.
  • Ar is a divalent aromatic group having 12 or more carbon atoms.
  • divalent aromatic group Ar or Ar include, for example,
  • a polyimide precursor solution or a polyimide solution is cured by a known acid anhydride-based amine-based curing method.
  • Metal foils by adding various additives and catalysts such as curing agents such as silane coupling agents, silane coupling agents, titanate coupling agents, adhesion-imparting agents such as epoxy compounds, and flexibility-imparting agents such as rubber. Apply to one side of Next, heat treatment is performed by heat treatment to obtain a single-sided conductor laminate.
  • the single-sided conductor laminate has a conductive metal foil as a bottom layer, a thermoplastic polyimide resin layer having a larger coefficient of thermal expansion than the base layer, and an intermediate base layer as at least one kind of low thermal expansion polyimide resin layer. It is preferable to further laminate a thermoplastic polyimide resin layer having a larger coefficient of thermal expansion than the base layer as the outermost top layer.
  • the intermediate base layer must be a polyimide resin layer having a smaller thermal expansion coefficient V than the thermoplastic polyimide resin layer of the bottom layer or the top layer.
  • the base layer has the function of suppressing curling and warpage of the manufactured flexible printed wiring board substrate, and the bottom layer in contact with the conductor has the function of ensuring adhesion to the conductive metal foil.
  • the layer is expected to have the effect of suppressing the curl of the film alone. In some cases, it is also expected to have an effect of securing an adhesive property when used as a flexible printed wiring board substrate having double-sided conductors by laminating another conductive metal foil on the top layer and applying heat and pressure.
  • P is in the range of 2100, preferably 520. If this thickness ratio is less than 2,
  • the thermal expansion coefficient of the entire polyimide resin layer is too high as compared with that of the metal foil, and the resulting flexible printed wiring board substrate is greatly warped or curled, and the workability during circuit processing is significantly reduced.
  • the total thickness (P + P) of the thermoplastic polyimide resin layers on both sides is too small and the ratio of the thicknesses exceeds 100, the conductive polyimide foil and
  • the adhesive strength may not be sufficiently exhibited.
  • the thickness (P) of the bottom layer in contact with the conductor layer is preferably in the range of 0.2 to 10 m. If the thickness is smaller than this range, the adhesive strength to the conductor layer cannot be secured, and if the thickness is larger, the heat resistance is reduced.
  • the application of the polyimide precursor resin which can be converted into the plurality of polyimide resins onto the conductive metal foil can be performed in the form of the resin solution. As described, there is a simultaneous or sequential application of a plurality of precursor solutions in the form of the precursor solution! /, To the polyimide of the precursor after the solvent removal treatment below the imide ring closure temperature. It is preferable to perform the heating conversion at once. If another polyimide-based precursor solution is applied on the layer completely converted to polyimide and heat-treated to close the imide ring, the adhesion between the polyimide-based resin layers may not be sufficiently exhibited, This will cause the quality of the double-sided laminate of the product to deteriorate.
  • the polyimide precursor resin solution (polyamic acid solution) on the conductive metal foil is used as a method for applying the resin solution containing the precursor compound, for example, a knife coater, a die coater, a roll, or the like.
  • the coating can be carried out by a known method using a coater, a curtain coater or the like, and a die coater or a knife coater is particularly suitable for thick coating.
  • the polymer concentration of the polyimide precursor resin solution used for coating is usually 5 to 30% by weight, preferably 10 to 20% by weight, though it depends on the degree of polymerization of the polymer. If the polymer concentration is lower than 5% by weight, a single coating will not provide a sufficient film thickness, and if it is higher than 30% by weight, the solution viscosity will be too high to make coating difficult.
  • the polyimide precursor resin solution (polyamic acid solution) applied to the conductive metal foil to have a uniform thickness is then subjected to a heat treatment to remove the solvent and further close the imide ring.
  • a heat treatment to remove the solvent and further close the imide ring.
  • the final heat treatment temperature is usually preferably 300 to 400 ° C. Above 400 ° C, the polyimide begins to decompose gradually, and below 300 ° C, the polyimide film becomes conductive. A single-sided conductor laminate with good flatness was obtained, which was not sufficiently oriented on metal foil Rena,
  • the overall thickness of the polyimide resin layer as an insulator thus formed is usually 10 to 150 m.
  • the coefficient of thermal expansion, the curl and adhesion of a single-sided copper-clad product, and the curl of a film were measured by the following methods.
  • thermomechanical analyzer (TMA100) manufactured by Seiko Denshi Kogyo Co., Ltd., and then the temperature was raised to 250 ° C and then cooled at a rate of 10 ° CZ, and the temperature was reduced to 240 ° C
  • the average coefficient of linear expansion between 100 ° C was calculated and determined.
  • the radius of curvature of the copper-clad product having dimensions of 100 mm ⁇ 100 mm after imidization by heat treatment was measured.
  • the adhesive strength of a single-sided copper-clad product is the value when a copper foil is peeled off at a speed of 50mmZ in a 180 ° direction using a pattern with a conductor width of 3mm in accordance with JIS C5016: 7.1. (kgZcm).
  • solder heat resistance was measured up to a maximum of 400 ° C from 260 ° C at an interval of 10 ° C gradually according to the method of JIS C5016.
  • a polyimide precursor solution was prepared in the same manner as in Synthesis Example 1, except that 1 mol of DDE was used as the diamine component and 1 mol of BTDA was used as the acid anhydride component.
  • the obtained polyimide precursor solution had a polymer concentration of 15% by weight and an apparent viscosity of 300 mPa ⁇ s at 25 ° C. by a B-type viscometer.
  • the polyimide precursor solution 2 prepared in Synthetic Example 2 was uniformly coated with a thickness of 20 ⁇ m using a die coater as the bottom layer on the roughened surface of a 35 ⁇ m rolled electrolytic copper foil (manufactured by Nikko Gould). After coating, the mixture was continuously treated in a hot air drying oven at 120 ° C. to remove the solvent. Next, the polyimide precursor solution 1 prepared in Synthesis Example 1 was applied uniformly as a base layer to a thickness of 200 ⁇ m using a reverse type roll coater using a reverse roll coater at a temperature of 120 ° C.
  • the polyimide precursor solution 2 prepared in Synthesis Example 2 was evenly applied as a top layer with a thickness of 40 m, and then in a hot-air drying oven for 30 minutes. And heat-treated by heating from 120 ° C to 360 ° C, and imidized.
  • the polyimide resin layer has a thickness of 25 ⁇ m and has no warpage or curl.
  • the product a) was obtained.
  • the base point of the thickness of the bottom layer was measured as 1Z2 of the surface roughness of the rough surface of the conductor.
  • the 180 ° peel strength (JIS C-5016) between the copper foil layer and the polyimide resin layer of the single-sided conductor laminate a was 1.8 KgZcm.
  • circuit processing is performed on the conductor side of this single-sided conductor laminate a to remove unnecessary metal foil, no curl occurs on the exposed polyimide film, and the coefficient of linear expansion of the film after etching is 23. 5 was X 10- 6 (lZ ° C) .
  • Example 1 The thickness of the polyimide resin layer of the bottom layer, the base layer, and the top layer in Example 1 was changed variously, dried in the same manner, and then heated from 120 ° C to 360 ° C in a hot-air drying oven for 30 minutes. Thus, a single-sided conductor laminate (single-sided copper-clad product) a was obtained. The situation of occurrence of warpage and curl of this single-sided conductor laminate a, 180 ° peel strength, and the situation of occurrence of curl of the exposed polyimide film when circuit processing is performed on the conductor side and unnecessary metal foil is removed Tables 1 and 2 summarize the coefficient of linear expansion of the film after etching. [Table 1]
  • the method for flexible printed wiring board and its manufacturing at least one thermal expansion coefficient of 30 X 10- 6 to the middle of the bottom layer and the conductor opposite the top layer of which is in contact with the conductor (1Z ° C)
  • a base layer made of the following low thermal expansion polyimide resin is disposed, and the bottom layer and the top layer are made of a thermoplastic polyimide resin having a larger thermal expansion coefficient than the base layer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

Il est prévu une carte à câblage imprimé souple de qualité stable et ne formant pas d’ondulations sur un film, même après traitement des circuits sur un côté à conducteur, et un procédé de fabrication d’une telle carte à câblage imprimé souple. La carte à câblage imprimé souple est pourvue d’une couche de base, composée d’au moins un type de résine polyimide à faible coefficient de dilatation, entre une couche de dessous au contact du conducteur et une couche de dessus du côté opposé au conducteur. La couche de dessous et la couche de dessus sont composées d’une résine polyimide thermoplastique dont le coefficient de dilatation thermique est supérieur à celui de la couche de base, et une épaisseur P1 de la couche de dessous et une épaisseur P2 de la couche supérieure satisfont à la condition P1<P2.
PCT/JP2005/004100 2004-03-09 2005-03-09 Carte a cablage imprime souple et son procede de fabrication Ceased WO2005086547A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-065854 2004-03-09
JP2004065854A JP2005259790A (ja) 2004-03-09 2004-03-09 フレキシブルプリント配線用基板とその製造方法

Publications (1)

Publication Number Publication Date
WO2005086547A1 true WO2005086547A1 (fr) 2005-09-15

Family

ID=34918279

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/004100 Ceased WO2005086547A1 (fr) 2004-03-09 2005-03-09 Carte a cablage imprime souple et son procede de fabrication

Country Status (5)

Country Link
JP (1) JP2005259790A (fr)
KR (1) KR20060129081A (fr)
CN (1) CN1947476A (fr)
TW (1) TW200536444A (fr)
WO (1) WO2005086547A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5291006B2 (ja) * 2008-02-08 2013-09-18 新日鉄住金化学株式会社 回路配線基板の製造方法
JP5869458B2 (ja) * 2012-09-27 2016-02-24 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド組成物、積層体、回路基板、その使用方法、積層体の製造方法及び回路基板の製造方法
JP6439636B2 (ja) * 2015-09-10 2018-12-19 株式会社デンソー プリント基板の製造方法
CN106113803A (zh) * 2016-06-16 2016-11-16 常州市超顺电子技术有限公司 一种铝基覆铜板及其用途和制备方法
JP7212480B2 (ja) * 2017-09-29 2023-01-25 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルム、金属張積層板及び回路基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250860A (ja) * 1995-11-13 1996-09-27 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH11354900A (ja) * 1998-06-05 1999-12-24 Sony Chem Corp フレキシブルプリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3405242B2 (ja) * 1998-12-21 2003-05-12 ソニーケミカル株式会社 フレキシブル基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250860A (ja) * 1995-11-13 1996-09-27 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH11354900A (ja) * 1998-06-05 1999-12-24 Sony Chem Corp フレキシブルプリント配線板

Also Published As

Publication number Publication date
CN1947476A (zh) 2007-04-11
TW200536444A (en) 2005-11-01
KR20060129081A (ko) 2006-12-14
JP2005259790A (ja) 2005-09-22

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