WO2005085309A3 - Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement - Google Patents
Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement Download PDFInfo
- Publication number
- WO2005085309A3 WO2005085309A3 PCT/DE2005/000392 DE2005000392W WO2005085309A3 WO 2005085309 A3 WO2005085309 A3 WO 2005085309A3 DE 2005000392 W DE2005000392 W DE 2005000392W WO 2005085309 A3 WO2005085309 A3 WO 2005085309A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hardening
- filler material
- photosensitive
- photosensitive filler
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE112005001114T DE112005001114A5 (de) | 2004-03-05 | 2005-03-04 | Verfahren zum Aushärten eines photosensitiven Füllmaterials und Aushärtevorrichtung |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004011391.2 | 2004-03-05 | ||
| DE102004011391 | 2004-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2005085309A2 WO2005085309A2 (fr) | 2005-09-15 |
| WO2005085309A3 true WO2005085309A3 (fr) | 2005-11-24 |
Family
ID=34917088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2005/000392 Ceased WO2005085309A2 (fr) | 2004-03-05 | 2005-03-04 | Procede pour durcir une matiere de remplissage photosensible et dispositif de durcissement |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE112005001114A5 (fr) |
| WO (1) | WO2005085309A2 (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5360873A (en) * | 1990-01-12 | 1994-11-01 | Asahi Denka Kogyo K.K. | Actinic radiation-reactive pressure-sensitive adhesive composition |
| DE19603962A1 (de) * | 1996-01-26 | 1997-07-31 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Mehrleitungs-Verbinders |
| WO2003058677A2 (fr) * | 2002-01-14 | 2003-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Systeme de production de circuits de commutation electriques et integres |
-
2005
- 2005-03-04 DE DE112005001114T patent/DE112005001114A5/de not_active Withdrawn
- 2005-03-04 WO PCT/DE2005/000392 patent/WO2005085309A2/fr not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5360873A (en) * | 1990-01-12 | 1994-11-01 | Asahi Denka Kogyo K.K. | Actinic radiation-reactive pressure-sensitive adhesive composition |
| DE19603962A1 (de) * | 1996-01-26 | 1997-07-31 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Mehrleitungs-Verbinders |
| WO2003058677A2 (fr) * | 2002-01-14 | 2003-07-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Systeme de production de circuits de commutation electriques et integres |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112005001114A5 (de) | 2007-05-24 |
| WO2005085309A2 (fr) | 2005-09-15 |
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