WO2005076673A1

WO2005076673A1 - Plasma generator and plasma coupling pipe therefor

Info

Publication number: WO2005076673A1
Application number: PCT/KR2004/002446
Authority: WO
Inventors: Kyoung-Ae You; Myung-Suk Kim
Original assignee: PRONIX CO Ltd
Current assignee: PRONIX CO Ltd
Priority date: 2004-02-09
Filing date: 2004-09-23
Publication date: 2005-08-18
Anticipated expiration: 2006-08-09
Also published as: TW200526314A; TWI238081B

Abstract

Disclosed are a plasma generator and a plasma coupling pipe for coupling the plasma generator to another pipe, and more particularly a plasma generator for applying a high power supply voltage while a fluid flows therein, thus activating predetermined matter present in the fluid, and a plasma coupling pipe for coupling the plasma generator to a general pipe. In the plasma generator, a first dielectric is formed in a plate shape. First and second electrodes are formed on front and rear surfaces of the first dielectric, respectively. A plurality of fluid vent-holes pass through the first dielectric and the first and second electrodes. The first electrode is coupled to a power supply voltage and the second electrode is coupled to a ground so that the first and second electrodes operate.

Description

Description PLASMA GENERATOR AND PLASMA COUPLING PIPE THEREFOR Technical Field

[1] The present invention relates to a plasma generator and a plasma coupling pipe for coupling the plasma generator to another pipe, and more particularly to a plasma generator for applying a high power supply voltage while a fluid flows therein, thus activating predetermined matter present in the fluid, and a plasma coupling pipe for coupling the plasma generator to a general pipe.

[2] Background Art

[3] Conventionally, deionized water (DIW) is used to improve the precision of products in facilities for producing semiconductor, liquid crystal display (LCD), plasma display panel (PDP) and organic electro luminescence (EL) products and to prevent surfaces of the products from being contaminated.

[4] Because organic/inorganic impurities may be present in the DIW in the form of microorganisms (bacteria) or particles, a filter is provided at an inlet of a pipe that supplies the DIW to production equipment, such that the DIW can be filtered. Although the filter carries out a filtering operation on the DIW, thereby removing relatively large-sized impurities, various microorganisms and fine impurities may be not filtered out.

[5] Accordingly, the microorganisms passing through the filter attach to the inside wall of the pipe and breed in large quantities. These microorganisms generate floating matter after a predetermined time has passed and also generate particles in a process for producing products.

[6] Furthermore, the smooth flow of cooling water is obstructed in a DIW line used for cooling within the production equipment because the microorganisms passing through the filter attach to the inside wall of the pipe and breed in large quantities. Thus, the cooling action is not smooth and hence the unsmooth cooling operation has a negative effect on the production equipment.

[7] In a process for fabricating the semiconductor, LCD, PDP and organic EL products, a cleaning process is performed to remove microorganisms and impurities from the inside portion of the DIW line provided in the production equipment using chemicals (sulfuric acid, fluoric acid, oxygenated water, etc.). Although the cleaning process is performed, consumption costs, such as filter replacement costs, etc. still increase. When the cleaning process is performed, there is a problem in that workers may be endangered due to waste matter and chemicals, and environmental contamination may occur.

[8] Moreover, there are serious problems due to bacteria and impurities in most bathrooms, cooling towers of air conditioners, and agriculture and livestock fields as well as the above-described production equipment.

[9] Disclosure of Invention Technical Problem

[10] Therefore, the present invention has been made in view of the above and other problems, and it is one object of the present invention to provide a plasma generator that can activate specific matter present in a fluid while the fluid constantly flows in the plasma generator.

[11] It is another object of the present invention to provide a plasma coupling pipe that can accommodate a plasma generator therein and that can be coupled to a general pipe through which a fluid flows. Technical Solution

[12] In accordance with the first aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma generator, comprising: a first dielectric formed in a plate shape; first and second electrodes formed on front and rear surfaces of the first dielectric, respectively; and a plurality of fluid vent-holes passing through the first dielectric and the first and second electrodes, wherein the first electrode is coupled to a power supply voltage and the second electrode is coupled to a ground so that the first and second electrodes operate.

[13] In accordance with the second aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma generator, comprising: a second dielectric formed in a plate shape; at least one third electrode contained within the second dielectric or depressed below one surface of the second dielectric; a third dielectric formed in a shape corresponding to the second dielectric; and at least one fourth electrode contained within the third dielectric or depressed below one surface of the third dielectric, wherein the second dielectric has at least one first fluid vent-hole formed in a predetermined part in which the at least one third electrode is not provided and the third dielectric has at least one second fluid vent-hole formed in a pre- determined part in which the at least one fourth electrode is not provided, the at least one second fluid vent-hole not being overlapped with the at least one first fluid vent- hole, wherein the third and fourth electrodes are spaced at a predetermined interval, and wherein the third electrode is coupled to a power supply voltage and the fourth electrode is coupled to a ground so that the third and fourth electrodes operate.

[14] In accordance with the third aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma coupling pipe, comprising: a first connector comprising a first pipe connection part connected to a first pipe through which a fluid can flow and a first holder in which at least one plasma generator can be disposed; a second connector comprising a second pipe connection part connected to a second pipe opposite to the first pipe and a second holder in which at least one plasma generator can be disposed; and the plasma generator comprising: a first dielectric formed in a plate shape; first and second electrodes formed on front and rear surfaces of the first dielectric, respectively; and a plurality of fluid vent-holes passing through the first dielectric and the first and second electrodes, wherein the first electrode is coupled to a power supply voltage and the second electrode is coupled to a ground so that the first and second electrodes operate.

[15] In accordance with the fourth aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma coupling pipe, comprising: a third connector comprising a third pipe connection part connected to a third pipe through which a fluid can flow and a third holder in which at least one plasma generator can be disposed; a fourth connector comprising a fourth pipe connection part connected to a fourth pipe opposite to the third pipe and a fourth holder in which at least one plasma generator can be disposed; and the plasma generator comprising: a second dielectric formed in a plate shape; at least one third electrode contained within the second dielectric or depressed below one surface of the second dielectric; a third dielectric formed in a shape corresponding to the second dielectric; and at least one fourth electrode contained within the third dielectric or depressed below one surface of the third dielectric, wherein the second dielectric has at least one first fluid vent-hole formed in a predetermined part in which the at least one third electrode is not provided and the third dielectric has at least one second fluid vent-hole formed in a predetermined part in which the at least one fourth electrode is not provided, the at least one second fluid vent-hole not being overlapped with the at least one first fluid vent- hole, wherein the third and fourth electrodes are spaced at a predetermined interval, and wherein the third electrode is coupled to a power supply voltage and the fourth electrode is coupled to a ground so that the third and fourth electrodes operate.

[16] In accordance with the fifth aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma generation electrode, comprising: at least one metal plate formed in a plate shape, one side of the metal plate having a terminal; and at least one dielectric surrounding the metal plate so that an end of the terminal can be exposed.

[17] In accordance with the sixth aspect of the present invention, the above and other objects can be accomplished by the provision of a method for fabricating at least one plasma generation electrode, comprising the steps of: (a) putting a ceramic paste in a lower dielectric frame and forming a lower dielectric; (b) forming a metal plate having a thin plate shape on an upper surface of the lower dielectric; (c) putting a ceramic paste in an upper dielectric frame based on a shape corresponding to a shape of the lower dielectric frame and forming an upper dielectric; (d) making contact between the upper dielectric with the upper surface of the lower dielectric and pressing the upper and lower dielectrics; and (e) baking the upper and lower dielectrics that are adhered to each other.

[18] In accordance with the seventh aspect of the present invention, the above and other objects can be accomplished by the provision of a method for fabricating at least one plasma generation electrode, comprising the steps of: (a) forming and baking a lower dielectric in a predetermined shape; (b) forming and baking an upper dielectric in a shape corresponding to the lower dielectric; (c) forming a metal plate on an upper surface of the lower dielectric; (d) forming an adhesive material on an upper surface of the metal plate and lower dielectric; (e) disposing the upper dielectric on the adhesive material; and (f) heating the upper and lower dielectrics, the metal plate and the adhesive material, to a melting temperature of the adhesive material, and adhering the upper and lower dielectrics.

[19] In accordance with the eighth aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma cleaner, comprising: a casing having a fluid input port at one end thereof and a fluid output port at the other end thereof, the casing having a space through which a fluid flows; at least one plasma generator provided in a predetermined internal part for converting the fluid into a plasma state; and an oxygen supply unit provided between the plasma generator and the fluid input port for supplying oxygen gas to the fluid passing through the casing, wherein the plasma generator comprises: an electrode unit in which at least two plasma generation electrodes spaced at a predetermined interval are stacked so that the fluid can flow between the electrodes; and a power supply unit electrically coupled to the electrode unit for supplying a high-voltage current to the electrode unit.

[20] In accordance with the ninth aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma cleaner, comprising: a dielectric pipe having a predetermined thickness, the cross-sectional shape of the dielectric pipe being circular or polygonal; an electrode unit embedded in the dielectric pipe, the electrode unit having positive (+) and negative (-) electrodes that are alternately arranged in a parallel fashion; and a power supply unit for supplying power to the electrode unit.

[21] In accordance with the tenth aspect of the present invention, the above and other objects can be accomplished by the provision of a plasma cleaner, comprising: a dielectric pipe having a predetermined thickness, the cross-sectional shape of the dielectric pipe being circular or polygonal; an electrode unit attached to an inner surface of the dielectric pipe, the electrode unit having positive (+) and negative (-) electrodes that are alternately arranged in a parallel fashion; and a power supply unit for supplying power to the electrode unit.

[22] Brief Description of the Drawings

[23] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[24] FIG. 1 is a perspective view and a partial cross-sectional view illustrating the structure of a plasma generator in accordance with a first embodiment of the present invention;

[25] FIG. 2 is an exploded perspective view illustrating the structure of a plasma generator in accordance with a second embodiment of the present invention;

[26] FIG. 3 is an exploded perspective view illustrating a structure of a plasma coupling pipe in accordance with the first embodiment of the present invention;

[27] FIG. 4 is an exploded perspective view illustrating the structure of the plasma coupling pipe in accordance with the second embodiment of the present invention;

[28] FIG. 5 is a cross-sectional view illustrating a state in which the plasma generator and the plasma coupling pipe are combined with each other in accordance with the second embodiment of the present invention;

[29] FIG. 6 is an exploded perspective view illustrating the structure of the plasma coupling pipe implemented in another shape in accordance with the second embodiment of the present invention; [30] FIG. 7 is a cross-sectional view illustrating the structure of the plasma coupling pipe implemented in another shape in accordance with the second embodiment of the present invention; [31] FIG. 8 shows one embodiment of a structure of a plasma generation electrode in accordance with the present invention; [32] FIG. 9 is a cross-sectional view illustrating one embodiment of the plasma generation electrode in accordance with the present invention; [33] FIG. 10 is a cross-sectional view illustrating one embodiment of a shape of stacked plasma generation electrodes in accordance with the present invention; [34] FIG. 11 is a perspective view illustrating one embodiment of a metal plate used for the plasma generation electrode in accordance with the present invention; [35] FIG. 12 is a process flowchart illustrating one embodiment of a method for fabricating the plasma generation electrode in accordance with the present invention; [36] FIG. 13 is a process flowchart illustrating another embodiment of the method for fabricating the plasma generation electrode in accordance with the present invention; [37] FIG. 14 is a block diagram illustrating a power supply unit applied to the present invention; [38] FIG. 15 is a cross-sectional view illustrating one embodiment of a structure of a plasma cleaner in accordance with the present invention; [39] FIG. 16 is a cross-sectional view illustrating another embodiment of the structure of the plasma cleaner in accordance with the present invention; [40] FIG. 17 is an exploded perspective view illustrating another embodiment of the structure of the plasma cleaner in accordance with the present invention; [41] FIG. 18 is a cross-sectional view illustrating the plasma cleaner shown in FIG. 17;

[42] FIG. 19 is an exploded perspective view illustrating yet another embodiment of the structure of the plasma cleaner in accordance with the present invention; and [43] FIG. 20 is a cross-sectional view illustrating the plasma cleaner shown in FIG. 19.

[44] Mode for the Invention [45] Now, constitutions, actions, and embodiments of the present invention will be described in detail with reference to the annexed drawings. [46]

[47] <Embodiment 1>

[48] FIG. 1 is a perspective view and a partial cross-sectional view illustrating the structure of a plasma generator 1 in accordance with a first embodiment of the present invention.

[49] The plasma generator 1 in accordance with the first embodiment of the present invention comprises a first dielectric 10, a plurality of fluid vent-holes 20 and first and second electrodes 30 and 40 as shown in FIG. 1.

[50] It is preferred that a thin plate as shown in FIG. 1 forms the first dielectric 1Q Furthermore, it is preferred that the first dielectric 10 is formed by a precisely processed fine ceramic. That is, the fine ceramic is processed so that it has a uniform thickness. The front shape of the fine ceramic can be formed in various shapes such as a circular or rectangular shape, etc.

[51] The thickness of the first dielectric 10 is the same as the thickness between the first and second electrodes 30 and 40, and has an intimate relationship with characteristics of the plasma generator 1. It is preferred that the first dielectric 10 is constantly processed within a thickness range of Ql ~ 3 mm and an interval between the first and second electrodes 30 and 40 can be constantly maintained. As shown in FIG. 1, the first dielectric 10 and the first and second electrodes 30 and 40 have the plurality of fluid vent-holes 20 formed at predetermined intervals therein. Here, the fluid vent- holes 20 are formed so that a fluid can pass through the dielectric 10 and the electrodes 30 and 40 It is preferred that as many as possible fluid vent-holes 20 are formed in the first dielectric 1Q Moreover, the fluid vent-holes 20 can be formed before the electrodes are formed on both surfaces of the first dielectric 1Q In this case, when the electrodes are formed, electrodes must not be formed on a part in which the fluid vent- holes 20 are formed. Alternatively, after the electrodes of the first dielectric 10 are formed, the holes are simultaneously formed in the dielectric and the electrodes, such that the fluid vent-holes 20 can be formed.

[52] The first and second electrodes 30 and 40 are formed in both surfaces of the first dielectric 10 as shown in FIG. 1. At this point, the first and second electrodes 30 and 40 are formed on different surfaces of the first dielectric 10, respectively. As shown in the partial cross-sectional view of FIG. 1, the first and second electrodes 30 and 40 are formed on the entire front and rear surfaces except for the holes 20 It is preferred that the first and second electrodes 30 and 40 are formed by a coating process. Alternatively, metals are processed into thin films and then the thin films can be attached to both surfaces of the dielectric 1Q However, when the fluid vent-holes 20 are formed in the first dielectric 10 and then the electrodes are formed, metal must not be coated on the inside walls of the fluid vent-holes 20 so that the first and second electrodes 30 and 40 do not contact each other.

[53] It is preferred that the first and second electrodes 30 and 40 have excellent electric conductivity and are formed by metals processable into thin films. In particular, it is further preferred that the first and second electrodes 30 and 40 are formed by any one selected from among Pt, Au, Ag, Ti, W, stainless (SUS) and Mo, respectively.

[54] It is preferred that an electrode protection member (not shown) is further formed on an exposed surface of the electrode 40 That is, the electrode protection member is formed by a method for coating a specific material on the surface of the electrode 40 so that it can prevent the electrode 40 from being directly exposed to the fluid and oxidized by the fluid. In this case, it is preferred that the electrode protection member is a material such as glass, Epoxy, Teflon, Urethane or etc. In particular, because glass is a dielectric, it is the most preferable material for the electrode protection member.

[55] The plasma generator 1 having the above-described structure operates when a power supply voltage is applied in a state in which the first electrode 30 is coupled to the power supply voltage and the second electrode 40 is coupled to a ground. Of course, a high power supply voltage is applied between the first and second electrodes 30 and 40 Accordingly, plasma is generated by dielectric barrier discharge while a specific fluid passes through the fluid vent-holes 20

[56] In a state in which one or more plasma generators 1 in accordance with the first embodiment of the present invention are stacked at an intermediate part of the pipe through which the fluid flows or at an end part of the pipe through which the fluid is outputted, the plasma generator 1 generates the plasma while passing the fluid through the fluid vent-holes 20

[57]

[58] <Embodiment 2>

[59] FIG. 2 is an exploded perspective view illustrating the structure of a plasma generator in accordance with a second embodiment of the present invention.

[60] A plasma generator 100 in accordance with the second embodiment of the present invention comprises a second dielectric 110, a third dielectric 120, a third electrode 130 and a fourth electrode 140 as shown in FIG. 2.

[61] As shown in FIG. 2, the second dielectric 110 is implemented with a thin plate, and can be formed in a circular or rectangular shape. Furthermore, it is preferred that the third dielectric 120 has the same shape as the second dielectric 110, and can be implemented with a thin plate. In this case, it is preferred that the second or third dielectric 110 or 120 is formed by a fine ceramic and is processed to have an entirely uniform thickness.

[62] As shown in FIG. 2, the third electrode 130 is provided in a predetermined surface area of the second dielectric 110 opposite to the third dielectric 12Q In this case, the third electrode 130 can be depressed below the surface of the second dielectric 110 and can be embedded in the second dielectric 110 so that it is not externally exposed.

[63] Depressing the electrode below the surface of the dielectric means that only one of both surfaces is externally exposed in a state in which the electrode is attached to the surface of the dielectric and a part or the entirety of the electrode is depressed in the dielectric.

[64] Furthermore, it is preferred that an exposed surface of the third electrode 130 is further coated by an electrode protection member (not shown). That is, coating a predetermined material on the surface of the third electrode 130 serves to prevent the electrode from being directly exposed to the fluid and oxidized by the fluid. In this case, it is preferred that the electrode protection member is a material such as glass, Epoxy, Teflon, Urethane or etc. In particular, because glass is a dielectric, it is the most preferable material for the electrode protection member.

[65] The fourth electrode 140 is contained in or depressed below the third dielectric 120 like the third electrode 13Q It is preferred that an electrode protection member is attached to an exposed surface of the fourth electrode 14.

[66] In this case, the third and fourth electrodes 130 and 140 are formed by any one selected from among Pt, Au, Ag, Ti, W, stainless (SUS) and Mo, respectively. The third and fourth electrodes 130 and 140 have excellent electric conductivity and are formed by metals processable into thin films. Moreover, the third and fourth electrodes 130 and 140 are provided so that they can maintain a predetermined interval. The plasma generator 100 operates when a power supply voltage is applied in a state in which the third electrode 130 is coupled to the power supply voltage and the fourth electrode 140 is coupled to the ground. Because an interval between both the electrodes is intimately associated with the plasma generator in accordance with the present invention, it is preferred that the interval between both the electrodes is maintained within a range of Q 1 ~ 3 mm.

[67] After the electrode protection member is coated on the electrode surface, it is more preferred that a thin dielectric is further attached to the coated electrode protection member. Accordingly, a structure in which the electrodes 130 and 140 are depressed in the dielectrics 110 and 120 is formed, and a structure in which thin ceramic plates 190 are further disposed is formed, as shown in FIG. 2 in accordance with this embodiment.

[68] As shown in FIG. 2, the plasma generator 100 in accordance with the second embodiment further comprises a space retainer 150 having a predetermined thickness between the third and fourth electrodes 130 and 140 so that they can maintain a uniform space therebetween. It is preferred that a space between the electrodes is present within a range of Ql ~ 3 mm and also the thickness of the space retainer 150 is present within that range. In this case, it is preferred that the space retainer 150 is formed by the same material as the second and third dielectrics 110 and 120 so that adhesive strength between the second and third dielectrics 110 and 120 is superior.

[69] As shown in FIG. 2, first fluid vent-holes 160 are formed in predetermined areas of the second dielectric 11Q The first fluid vent-holes 160 are formed in the areas in which the third electrode 130 is not provided. The number of the first vent-holes 160 can be at least two. A second fluid vent-hole 170 is formed in a predetermined area of the third dielectric 120, and is formed in the area in which the fourth electrode 140 is not provided. Furthermore, the second fluid vent-hole 170 is formed so that it is not overlapped with any one of the first fluid vent-holes 16Q The purpose of this is to allow the fluid in the plasma generator 100 to flow through a space between the third and fourth electrodes 130 and 140 as the fluid incoming from the first fluid vent-holes 160 is outgoing into second fluid vent-holes 170 formed at different positions. Accordingly, the fluid is exposed to the plasma generated by dielectric barrier discharge while it passes through the third and fourth electrodes 130 and 14Q

[70] As shown in FIG. 2, when the plasma generator 100 further comprises the space retainer 150, it is preferred that a third fluid vent-hole 180 is formed in the space retainer 150 so that the fluid vent-hole 180 can be coupled to the first fluid vent-holes 160 and the second fluid vent-hole 17Q Accordingly, the fluid passing through the first fluid vent-holes 160 is induced into the third fluid vent-hole 180 and then is outgoing through the second fluid vent-hole 170, such that the fluid naturally passes through the space between the third and fourth electrodes 130 and 14Q

[71]

[72] <Embodiment 3>

[73] FIG. 3 is an exploded perspective view illustrating a structure of pipes 210 and 220, into which the fluid flows, to be coupled to the plasma generator 1 in accordance with the first embodiment of the present invention.

[74] The plasma generator 1 in accordance with the first embodiment is coupled to the first and second pipes 210 and 220 by a plasma coupling pipe 200 as shown in FIG. 3. In this case, the first embodiment of the plasma coupling pipe 200 includes a first connector 230 and a second connector 240 as shown in FIG. 3.

[75] The first connector 230 has a structure in which it can be coupled to the first pipe 210 so that the fluid can internally pass through the first connector 23Q The first connector 230 comprises a first pipe connection part 232 coupled to the first pipe 210 and a first holder 234 in which the plasma generator 1 can be disposed. The first holder 234 has a structure in which it can be coupled to one end of a second holder, such that the first and second connectors 230 and 240 can be coupled to each other. As shown in FIG. 3, a plurality of plasma generators can be stacked. This case has an advantage in that stronger cleaning capability can be achieved.

[76] Furthermore, the second connector 240 is formed so that it can be coupled to the second pipe 220 opposite to the first pipe 21Q The second connector 240 comprises a second pipe connection part coupled to the second pipe 220 and a second holder in which the plasma generator 1 can be disposed. Of course, the second holder has a structure in which it can be coupled to the first holder 234 as shown in FIG. 3.

[77] It is preferred that a cross-sectional area of the first and second connectors 230 and 240 and the plasma generator 1 is wider than that of the first and second pipes 210 and 22Q This is aimed at lengthening a time period of passing through the fluid between the first and second electrodes 30 and 40 on the basis of the fact that a speed of the fluid in the wider cross-sectional area is slower than that of the fluid in the first and second pipes 210 and 220 when the fluid in the first pipe 210 passes through the wider cross-sectional area. Consequently, a time period in which the fluid is exposed to the plasma is lengthened.

[78]

[79] <Embodiment 4>

[80] FIG. 4 is a perspective view illustrating a structure in which the plasma generator 100 in accordance with the second embodiment of the present invention is coupled to the pipe, and FIG. 5 is a cross-sectional view illustrating the coupling structure.

[81] As shown in FIG. 4, the plasma generator 100 in accordance with the second embodiment is connected to another pipe by the plasma coupling pipe. The plasma generator 100 in accordance with the second embodiment is connected to the pipe by the plasma coupling pipe 30Q

[82] The plasma coupling pipe 300 consists of a third connector 310 and a fourth connector 320 as shown in FIG. 4.

[83] The third connector 310 has a structure in which it can be coupled to a third pipe (not shown) so that the fluid can internally pass through the third connector 31Q The third connector 310 comprises a third pipe connection part 312 coupled to the third pipe and a third holder 314 in which the plasma generator 100 can be disposed. At this point, one or more plasma generators 100 can be stacked in the plasma coupling pipe 30Q

[84] The fourth connector 320 has a structure in which it can be coupled to a fourth pipe (not shown) opposite to the third pipe. The fourth connector 320 comprises a fourth pipe connection part 322 coupled to the fourth pipe and a fourth holder 324 in which the plasma generator 100 can be disposed.

[85] In this case, the third and fourth connectors 310 and 320 have a structure so that they can be coupled to each other. As shown in FIG. 4, a plurality of coupling protrusions 316 are formed on a surface of the third holder 314 at predetermined intervals. A plurality of coupling grooves 326 are formed in a surface of the fourth holder 324 so that they can be coupled to the surface of the third holder 314. Accordingly, the plurality of coupling protrusions 316 are coupled to the plurality of grooves 326.

[86] Since a cross-sectional area of the plasma coupling pipe 300 is wider than that of the third and fourth pipes, flow of the fluid in the plasma coupling pipe is preferably slow and hence the fluid flows through a plasma generation space for a sufficient time.

[87] As shown in FIGS. 4 and 6, the cross-sectional shape of the plasma coupling pipe can be circular or rectangular. Since the shape of the plasma coupling pipe is the same as that of another pipe when the cross-sectional shape of the plasma coupling pipe is circular, there is an advantage in that assembly and fabrication are simplified. When the cross-sectional shape of the plasma coupling pipe 300 is rectangular, the plasma generator 100 is fixed to a wall surface of the plasma coupling pipe 300, a contact area between the wall surface of the plasma coupling pipe 300 and the plasma generator 100 is wide and hence the plasma generator 100 can be stably coupled to the wall surface of the plasma coupling pipe 30Q

[88] Furthermore, the plasma generator 100 coupled to the plasma coupling pipe 300 is coupled to an electric wire connected to a power supply voltage and an electric wire connected to a ground. It is preferred that the electric wires connected to the power supply voltage and the ground are electrically separated from each other as they are disposed in different directions in the structure shown in FIG. 4. That is, the power supply wire coupled to the third electrode is disposed at the right side, and the ground wire coupled to the fourth electrode is disposed at the left side, such that they cannot come into electrical contact with each other.

[89]

[90] <Embodiment 5>

[91] FIGS. 6 and 7 are an exploded perspective view and a cross-sectional view illustrating a structure in the case where the shape of a plasma coupling pipe 300a is circular, respectively.

[92] Although the plasma coupling pipe 300a is circular as shown in FIGS. 6 and 7, its component functions are the same as those of the plasma coupling pipe having the rectangular shape described above.

[93]

[94] <Embodiment 6>

[95] Now, one embodiment of a plasma generation electrode usable in a plasma generator and plasma cleaner in accordance with the present invention will be described.

[96] The plasma generation electrode 410 in accordance with the present invention has a structure in which a conductive metal plate 412 is provided in a dielectric 414 as shown in FIGS. 8 and 9 It is preferred that an end 412a of the conductive metal plate 412 is exposed to one side of the plasma generation electrode 41Q In this case, the exposed end 412a is coupled to a power supply voltage, such that it can apply a high voltage to the plasma generation electrode 41Q More preferably, a concave portion having a predetermined depth is provided in a predetermined side part of the dielectric 414 so that the end 412a of the metal plate 412 can be externally exposed. When the concave is provided in the side part of the dielectric 414 and the end 412a of the metal plate 412 is exposed, both sides of the end 412a are protected by the dielectric 414 as shown in FIG. 8, such that there is an advantage in that the end 412a is not damaged by external force and is not short-circuited.

[97] When the plasma generation electrode 410 having the above-described structure is actually used in the plasma generator or the plasma cleaner, at least two electrodes are stacked and spaced at predetermined intervals so that the fluid can flow through spaces formed between the electrodes as shown in FIG. 1Q When the plasma generation electrodes are stacked, it is preferred that the adjacent electrodes are stacked so that sides in which metal plate ends are exposed are disposed in different directions as shown in FIG. 1Q

[98] It is preferred that a space retainer 420a is inserted between electrodes 410a and 410b so that the stacked electrodes 410a and 410b are spaced at a predetermined interval. Because the space retainer 420a is inserted between the sides of the electrodes 410a and 410b as shown in FIG. 10 and a center space between the electrodes 410a and 410b is empty, the fluid can flow between the electrodes 410a and 410b. The total number of stacked electrodes must be an odd number.

[99] To manufacture a plurality of stacked electrodes, several methods will be described in the following.

[100] There is a method for simultaneously forming a ceramic and a metal plate disposed in a structure shown in FIG. 1Q This simultaneous forming method includes a low temperature cofired ceramic process (LTCC) and a high temperature cofired ceramic process (HTCC).

[101] Moreover, there is used a method for inserting glass serving as an adhesive material between an electrode and a space retainer and heating the electrode and the space retainer attached by the adhesive material to a high temperature, such that the electrode and the space retainer can be adhered to each other. In this case, it is preferred that a plurality of electrodes and space retainers be fixed by a predetermined jig, heated, and adhered to one another.

[102] Another method uses a predetermined shaped mold to couple a plurality of electrodes arranged at predetermined intervals in a parallel fashion. That is, the above- described method prepares the mold in which grooves are formed at the predetermined intervals so that peripheral parts of the electrodes are inserted and fixed to the grooves, inserts the electrodes into the mold and stacks the inserted electrodes.

[103] Yet another method forms a plurality of through holes in the electrodes and the space retainers, passes coupling members, such as bolts, through the through holes to fix the electrodes and the space retainers, and stacks the electrodes.

[104]

[105] <Embodiment 7>

[106] A method for fabricating the above-described plasma generation electrode will now be described.

[107] In this embodiment, two methods are disclosed to manufacture the above-described plasma generation electrode.

[108] In accordance with the first method, a metal plate is inserted between upper and lower dielectrics before the dielectrics are hardened, and the upper and lower dielectrics are baked. FIG. 12 is a process flowchart illustrating a method for fabricating the plasma generation electrode.

[109] First, the method places a ceramic paste within a lower dielectric frame having a predetermined shape, and forms the lower dielectric. Subsequently, when the lower dielectric is formed in the predetermined shape, the metal plate is formed on the lower dielectric. Here, various methods for forming the metal plate can be used. In this embodiment, two metal forming methods are disclosed. First, a thin metal plate is disposed on an upper surface of the lower dielectric, a pressure is applied to the metal plate, and the electrode plate is depressed below the upper surface of the lower dielectric. In accordance with the second method, a conductive material is coated on the upper surface of the lower dielectric in a predetermined shape so that a metal plate can be formed, and then the metal plate is depressed below the lower dielectric by pressure. In particular, when the latter method is used, it is preferred that the conductive material is coated using a silkscreen pattern. The conductive material is, for example, a silver paste.

[110] FIG. 11 shows one embodiment of the metal plate denoted by reference nimeral 43Q

[111] As shown in FIG. 11, it is preferred that the metal plate 430 has a plurality of through holes 432 in areas thereof. When the through holes 432 are formed, part of the lower dielectric is passed through the through holes 432 in a process for depressing the metal plate 430 in the lower dielectric by pressure. Accordingly, there is an advantage in that a contact area between the metal plate 430 and the lower dielectric increases and the metal plate 430 and the lower dielectric are robustly coupled to each other.

[112] After the metal plate is formed on an upper surface of the lower dielectric as described above, the upper dielectric is formed by the same method as in the lower dielectric. In a state in which the upper dielectric is placed on the lower dielectric, they are pressed. When the upper and lower dielectrics have been pressed, they are baked and hardened at a high temperature. When the electrodes are formed according to this process, the upper and lower dielectrics configure one complete unit, such that there is an advantage in that adhesive force between the upper and lower dielectrics is strong.

[113] As the second method, there is a method for inserting the metal plate between the hardened dielectrics. FIG. 13 is a flowchart illustrating a process for fabricating a plasma generation electrode in accordance with the second method.

[114] That is, the lower dielectric is formed in a predetermined shape and then the shaped lower dielectric is baked and hardened. Simultaneously, the upper dielectric is shaped, baked and hardened. Of course, the upper dielectric can be manufactured after the lower dielectric. However, the upper dielectric must be formed on the basis of the shape of the lower dielectric. If so, when the upper and lower dielectrics are adhered to each other, their adhesion parts match, such that a neat appearance is provided and the adhesion parts are not damaged.

[115] Subsequently, a metal plate is formed on an upper surface of the lower dielectric. At this point, various methods for forming the metal plate can be used, but two methods are disclosed in this embodiment. The first method disposes a predetermined shaped-thin metal plate on the upper surface of the lower dielectric. The second method coats a conductive material on the upper surface of the lower dielectric in a predetermined shape. It is preferred that a silkscreen is used so that the conductive material is coated in a desired shape. That is, after patterning the predetermined shape on the silkscreen, the conductive material is coated on the upper surface of the lower dielectric through the silkscreen. Subsequently, the conductive material is dried, such that the metal plate is completely formed.

[116] Subsequently, an adhesive material is formed on the upper surface of the lower dielectric and metal plate. This adhesive material is used for robustly adhering the previously hardened upper and lower dielectrics. In this case, the adhesive material must have a lower melting point than the upper and lower dielectrics. In a baking process for adhering the upper dielectric to the lower dielectric, the upper and lower dielectrics and the adhesive material are heated at a higher temperature than the melting point of the adhesive material so that the adhesive material can be fully permeated through the contact surface in a new baking process. In this baking process, the baking temperature must be lower than a melting point of the dielectrics so that the shape of the dielectrics cannot be influenced. In this embodiment, glass is used as the adhesive material. Of course, Epoxy, etc. can be used as the adhesive material.

[117] Subsequently, the upper dielectric disposed on the adhesive material is heated to the melting point of the adhesive material so that the upper and lower dielectrics can be adhered to each other. At this point, the adhesive material is melted and permeated through the surfaces of the dielectrics so that the upper and lower dielectrics can be strongly adhered to each other. Because melting points of the upper and lower dielectrics are very high, their original shapes are maintained. In order to prevent positions of the upper and lower dielectrics and the metal plate from being changed, a predetermined jig more preferably fixes the upper and lower dielectrics and the metal plate so that they can accurately adhere to each other.

[118] Now, the configuration of a power supply unit used in the present invention will be described. The power supply unit supplies a power supply voltage to electrodes provided in the plasma coupling pipe 200 or 300, the plasma generator or the plasma cleaner 600 or 70Q Here, the power supply unit 500 comprises a main controller 510, a power rectifier 520, an inverter 530 and a voltage regulator 54Q

[119] The main controller 510 measures a fluid amount or speed using a flux sensor through a micro controller, and controls a valve of an oxygen supply unit using a value indicative of a result of the measurement. The power supply unit 500 is turned on or off using a component capable of performing a switching operation such as a relay, solid state relay, photo metal-oxide-semiconductor (MOS) relay, transistor or etc.

[120] The power rectifier 520 converts an applied 220V voltage into a low voltage using a converter and converts an alternating current (AC) voltage into a direct current (DC) voltage or a low plasma DC voltage by configuring a rectification circuit using a diode, regulator, and condenser.

[121] The inverter 530 converts the DC voltage into the AC voltage using a thyristor or high-speed thyristor, flip-flop, operational amplifier, transistor, insulated gate bipolar transistor (IGBT), field effect transistor (FET), silicon rectifier, etc. Furthermore, the inverter 530 controls a predetermined frequency to within a frequency band required by the plasma generator using a coil, condenser, resistor, etc.

[122] The voltage regulator 540 converts a low AC voltage into a high AC voltage using a converter.

[123] In accordance with the present invention, it is preferred that the power supply unit 500 applies, to the plasma generator 1 or 100, power having a frequency with a range of 60 ~ 40,000 Hz, and a voltage with a range of 380 ~ 15,000 V.

[124]

[125] <Embodiment 8>

[126] Now, one embodiment of a plasma cleaner in accordance with the present invention will be described in detail. FIG. 15 is a cross-sectional view illustrating a structure of a plasma cleaner 600 in accordance with this embodiment.

[127] In accordance with this embodiment, the plasma cleaner 600 comprises a casing 610, a plasma generator 620 and an oxygen supply unit 63Q

[128] The casing 610 has a structure into which a pipe can be inserted at one area to pass through the fluid. Accordingly, a fluid input port 612 is formed at one end of the casing 610, while a fluid output port 614 is formed at the other end of the casing 61Q An internal space is formed between the fluid input port 612 and the fluid output port 614 so that the fluid can flow through the internal space. The plasma generator 620 and the oxygen supply unit 630 are provided in the internal space.

[129] First, the plasma generator 620 is provided in the above-described casing 610, and converts the fluid flowing through the casing 610 into a plasma state. At this point, it is preferred that the plasma generator 620 comprises an electrode unit 622 and a power supply unit 624. At least two plasma generation electrodes are stacked in the electrode unit 622. The electrodes 622a, 622b, 622c, 622d and 622e are stacked at predetermined intervals. The electrodes 622a to 622e are provided so that the fluid can flow between them. The stacked electrodes are sequentially coupled to positive (+) and negative (-) terminals of the power supply unit 624. It is preferred that the electrodes of the electrode unit 622 in the casing 610 are installed in a direction parallel with wall surfaces of the casing 610 so that the fluid can flow through spaces between the electrodes. The power supply unit 624 is electrically coupled to the electrode unit 622, and supplies a high- voltage current to the electrode unit 622.

[130] The oxygen supply unit 630 is provided in the casing 610, and provides oxygen gas to the fluid flowing through the casing 61Q In this case, the oxygen supply unit 630 comprises a microbubble generation part 632 and an oxygen supply part 634. The mi- crobubble generation part 632 is disposed inside the above-described casing and plays a role to supply oxygen gas to the fluid in the form of a microbubble. A plurality of microbubble holes are formed on the microbubble generation part 632, such that oxygen is transferred to the fluid through the microbubble holes.

[131] The oxygen supply part 634 is coupled to the microbubble generation part 632 and plays a role to supply the oxygen to the microbubble generation part 632. The oxygen supply part 634 includes a pipe for supplying oxygen, and is equipped with a valve 636 capable of adjusting oxygen flow in a middle of the pipe.

[132] It is preferred that the plasma cleaner 600 in accordance with this embodiment further comprises an oxygen collector 64Q The oxygen collector 640 is provided between the plasma generator 620 and the fluid output port 614. The oxygen collector 640 collects oxygen remaining in the fluid flowing through the casing and plays a role to supply the collected oxygen to the oxygen supply unit 63Q

[133] Moreover, it is preferred that the plasma cleaner 600 further comprises a flux meter 65Q That is, the flux meter 650 is disposed at a position adjacent to the fluid input port 612, and measures the speed of the fluid flowing through the casing 61Q Because it is difficult for the fluid to be converted into a plasma state when the speed of the fluid flowing through the plasma generator 620 is too fast, the flux meter 650 is installed to measure the fluid flux so that appropriate fluid flow can be maintained.

[134]

[135] <Embodiment 9> [136] FIG. 15 shows a structure of another embodiment of the plasma cleaner denoted by reference numeral 700 in accordance with the present invention. This embodiment has a structure in which a plasma generator 720 and an oxygen supply unit 730 are separated from each other. In some cases, the plasma cleaner 700 containing only the plasma generator without the oxygen supply unit is used. If desired, the oxygen supply unit 730 is additionally installed so that more powerful cleaning effects can be achieved.

[137] Accordingly, there is an advantage in that the oxygen supply unit 730 can be selectively used.

[138]

[139] Embodiment 10>

[140] Next, another embodiment of the plasma cleaner denoted by reference numeral 800 will be described.

[141] The plasma cleaner 800 in accordance with this embodiment comprises a dielectric pipe 810, electrodes 820 and 830 and a power supply unit (not shown).

[142] As shown in FIG. 17, a cross-sectional shape of the dielectric pipe 810 is circular or polygonal. The dielectric pipe 810 indicates a structure having a pipe shape having a predetermined thickness. An empty space is formed in the center of the dielectric pipe 810, such that a fluid such as water or etc. can flow through the space. It is preferred that the dielectric pipe 810 is a ceramic.

[143] The electrodes 820 and 830 are provided in the dielectric pipe 81Q As shown in FIGS. 17 and 18, the (+) and (-) electrodes 820 and 830 are alternately arranged in a parallel fashion in the dielectric pipe 81Q In this case, the (+) electrode 820 is coupled to a power supply voltage and the (-) electrode 830 is coupled to a ground. As shown in FIG. 17, the (+) and (-) electrodes 820 and 830 are protruded on an outer surface of the dielectric pipe 810, such that protrusions 822 and 832 coupled to the power supply voltage are provided on the (+) and (-) electrodes 820 and 830, respectively. It is preferred that the protrusion 822 of the (+) electrode 820 and the protrusion 832 of the (-) electrode 830 are protruded in different directions so that short circuiting can be prevented.

[144] A power supply unit for supplying power to the electrodes 820 and 830 is provided. In this embodiment, the power supply unit supplies an alternating current (AC) to the electrodes. Of course, it is preferred that the power supply unit in accordance with this embodiment comprises a main controller, power rectifier, inverter and voltage regulator as described above. [145] It is preferred that a protection member 840 is further provided in the plasma cleaner 800 in accordance with this embodiment. As shown in FIG. 17, the protection member 840 has a structure capable of surrounding and protecting the dielectric pipe 810, and must be configured by a material having a strong hardness. It is more preferred that pipe joints 842 capable of being coupled to the pipe through which the fluid can flow are formed at both ends of the protection member 84Q Accordingly, the plasma cleaner 800 in accordance with this embodiment can be inserted into a predetermined part of a running water supply pipe such as a general water pipe.

[146]

[147] Embodiment 11>

[148] A plasma cleaner 900 in accordance with this embodiment comprises a dielectric pipe 910, electrodes 920 and 930 and a power supply unit (not shown) as in the plasma cleaner 800 in accordance with Embodiment 1Q

[149] The dielectric pipe 910 and the power supply unit have the same structure and function as the dielectric pipe 810 and the power supply unit provided in the plasma cleaner 800 in accordance with Embodiment 1Q Accordingly, the structure and function of the dielectric pipe 910 and the power supply unit will not be repeatedly described. In this embodiment, the power supply unit supplies a DC voltage to electrodes.

[150] The electrodes 920 and 930 are different from the electrodes in accordance with Embodiment 1Q In this embodiment, the electrodes 920 and 930 are not embedded in the dielectric of the dielectric pipe 910, but are attached to an inner surface of the dielectric pipe 91Q That is, as shown in FIGS. 19 and 20, the (+) and (-) electrodes 920 and 930 are alternately attached to the inner surface of the dielectric pipe 910 in a parallel fashion. The respective electrodes are attached so that they are spaced at predetermined intervals.

[151] Moreover, the electrodes 920 and 930 are attached to the inner surface of the dielectric pipe 910, and protrusions 922 and 932 coupled to the power supply unit are provided on the inner surface of the dielectric pipe 91Q It is preferred that the protrusion 922 of the (+) electrode and the protrusion 923 of the (-) electrode are protruded in different directions.

[152] As shown in FIG. 19, a protection member 940 is further provided outside the dielectric pipe 910 to surround and protect it in accordance with this embodiment like Embodiment 1Q It is more preferred that pipe joints 942 capable of being coupled to the pipe through which the fluid can flow are formed at both ends of the protection member 94Q Accordingly, the plasma cleaner 900 in accordance with this embodiment can be inserted into a predetermined part of a running water supply pipe such as a general water pipe. [153] According to a plasma generator of the present invention, oxygen (O ) contained in 2 water flowing through the plasma generator is resolved into oxygen atoms (O) by plasma. An oxygen atom is coupled to an oxygen molecule and hence ozone (O ) is 3 generated. Moreover, a water molecule collides with electrons accelerated by plasma, such that hydrogen, oxygen and OH radicals are generated.

[154] The ozone and radicals remove not only organic and inorganic matters contained in water, but also oxidize and remove heavy metals such as Mn, Fe, Cd, As, Hg, etc. The ozone can remove various kinds of bacteria through a bactericidal action.

[155] Accordingly, when a plasma generator in accordance with the present invention is installed and used in a deionized water (DIW) line such as semiconductor production equipment, there is an advantage in that inorganic and organic matters present on a surface of a product as well as inorganic and organic matters present in DIW can be removed, and heavy metals such as Mn, etc. can be oxidized and removed by fine cleaning effects. Of course, because the ozone removes various bacteria, the problems caused by microorganism can be addressed.

[156] Furthermore, because the concentration of ozone generated from the plasma generator is less than 1 ppm, and ozone contained in water is restored into natural oxygen, such that a worker's body is not influenced by the ozone.

[157] When the plasma generator in accordance with the present invention is installed at urinal/toilet bowls used in a public lavatory, bacteria causing a bad smell or contamination and organic/inorganic impurities therein can be removed, such that there is an advantage in that a budget required for decontamination and washing can be reduced.

[158] Moreover, the same effect can be achieved in a regular home toilet using the plasma generator. More particularly, the plasma generator can disinfect more than 99.0 % of various bacteria that live on the skin when used in a bidet.

[159] Moreover, when the plasma generator in accordance with the plasma is installed in a water line through which water circulates in a cooling tower of a large building, various bacteria can be disinfected and impurities can be removed, such that le- gionellosis due to an air-conditioner in the summer time, etc. can be prevented.

[160] Moreover, because the concentration of ozone generated from the plasma generator in accordance with the present invention is very low, the plasma generator can be used when a person cleans his or her hands and fishes and vegetables in a restaurant and home, such that various bacteria can be easily disinfected.

[161] Moreover, when the plasma generator in accordance with the present invention is installed in an irrigation channel of a farm or a water line for cleaning in a livestock field, livestock diseases can be prohibited and disease spread can be prevented.

[162] Moreover, because the plasma generator in accordance with the present invention can be manufactured in various sizes, there is an advantage in that various pipes from a small diameter to a large diameter can be used.

[163] Moreover, because the plasma generator can be conveniently coupled to an existing water pipe by a plasma coupling pipe, a high cost for installation is not required. As a general alternating current (AC) voltage can be used as it is, there is an advantage in that a structure of the plasma generator can be simplified.

[164] Moreover, when a plasma cleaner in accordance with the present invention is used, more powerful cleaning effects can be obtained as a large amount of oxygen is externally supplied and plasma is generated. There is an advantage in that cleaning force can be controlled according to a need.

[165] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

[166]

Claims

[ 1 ] A plasma generator, comprising : a first dielectric formed in a plate shape; first and second electrodes formed on front and rear surfaces of the first dielectric, respectively; and a plurality of fluid vent-holes passing through the first dielectric and the first and second electrodes, wherein the first electrode is coupled to a power supply voltage and the second electrode is coupled to a ground so that the first and second electrodes operate.

[2] The plasma generator of claim 1, wherein the first dielectric is a ceramic.

[3] The plasma generator of claim 1, wherein the first and second electrodes are configured by any one selected from the group consisting of Pt, Au, Ag, Ti, W, stainless (SUS) and Mo, respectively.

[4] The plasma generator of claim 1, wherein the dielectric and the first and second electrodes are circular or rectangular.

[5] The plasma generator of any one of claims 1 to 4, wherein the first and second electrodes further comprise: an electrode protection member provided on an exposed surface of each electrode for protecting the electrode, respectively.

[6] The plasma generator of claim 5, wherein the electrode protection member is configured by any one selected from the group consisting of glass, Epoxy, Teflon and Urethane.

[7] A plasma generator, comprising: a second dielectric formed in a plate shape; at least one third electrode contained within the second dielectric or depressed below one surface of the second dielectric; a third dielectric formed in a shape corresponding to the second dielectric; and at least one fourth electrode contained within the third dielectric or depressed below one surface of the third dielectric, wherein the second dielectric has at least one first fluid vent-hole formed in a predetermined part in which the at least one third electrode is not provided and the third dielectric has at least one second fluid vent-hole formed in a predetermined part in which the at least one fourth electrode is not provided, the at least one second fluid vent-hole not being overlapped with the at least one first fluid vent-hole, wherein the third and fourth electrodes are spaced at a predetermined interval, and wherein the third electrode is coupled to a power supply voltage and the fourth electrode is coupled to a ground so that the third and fourth electrodes operate.

[8] The plasma generator of claim 7, wherein an electrode protection member coats an externally exposed surface of the electrodes when the third or fourth electrode is depressed below one surface of the second or third dielectric.

[9] The plasma generator of claim 7, wherein the electrode protection member is configured by any one selected from the group consisting of glass, Epoxy, Teflon and Urethane.

[10] The plasma generator of claim 7, further comprising: a space retainer having a predetermined thickness between the third and fourth electrodes.

[11] The plasma generator of claim 7, wherein the second and third dielectrics are a ceramic, respectively.

[12] The plasma generator of claim 7, wherein the third and fourth electrodes are configured by any one selected from the group consisting of Pt, Au, Ag, Ti, W, stainless (SUS) and Mo, respectively.

[13] The plasma generator of claim 10, wherein the second and third dielectrics and the space retainer are configured by the same material.

[14] The plasma generator of claim 10, wherein the space retainer has at least one third fluid vent-hole capable of being coupled to the at least one first fluid vent- hole and the at least one second fluid vent-hole.

[15] The plasma generator of claim 10, wherein a space between the third and fourth electrodes or a thickness of the space retainer is present within a range of Q 1 ~ 3 mm.

[16] A plasma coupling pipe, comprising: a first connector comprising a first pipe connection part connected to a first pipe through which a fluid can flow and a first holder in which at least one plasma generator can be disposed; a second connector comprising a second pipe connection part connected to a second pipe opposite to the first pipe and a second holder in which at least one plasma generator can be disposed; and the plasma generator comprising: a first dielectric formed in a plate shape; first and second electrodes formed on front and rear surfaces of the first dielectric, respectively; and a plurality of fluid vent-holes passing through the first dielectric and the first and second electrodes, wherein the first electrode is coupled to a power supply voltage and the second electrode is coupled to a ground so that the first and second electrodes operate.

[17] The plasma coupling pipe of claim 16, wherein a cross-sectional area of the first and second connectors and the plasma generator is wider than that of the first and second pipes.

[18] The plasma coupling pipe of claim 16, wherein the at least one plasma generator comprises at least two stacked plasma generators.

[19] A plasma coupling pipe, comprising: a third connector comprising a third pipe connection part connected to a third pipe through which a fluid can flow and a third holder in which at least one plasma generator can be disposed; a fourth connector comprising a fourth pipe connection part connected to a fourth pipe opposite to the third pipe and a fourth holder in which at least one plasma generator can be disposed; and the plasma generator comprising: a second dielectric formed in a plate shape; at least one third electrode contained within the second dielectric or depressed below one surface of the second dielectric; a third dielectric formed in a shape corresponding to the second dielectric; and at least one fourth electrode contained within the third dielectric or depressed below one surface of the third dielectric, wherein the second dielectric has at least one first fluid vent-hole formed in a predetermined part in which the at least one third electrode is not provided and the third dielectric has at least one second fluid vent-hole formed in a predetermined part in which the at least one fourth electrode is not provided, the at least one second fluid vent-hole not being overlapped with the at least one first fluid vent-hole, wherein the third and fourth electrodes are spaced at a predetermined interval, and wherein the third electrode is coupled to a power supply voltage and the fourth electrode is coupled to a ground so that the third and fourth electrodes operate.

[20] The plasma coupling pipe of claim 19, wherein a cross-sectional area of the third and fourth connectors and the plasma generator is wider than that of the third and fourth pipes.

[21] The plasma coupling pipe of claim 19, wherein an outer surface of the third holder has a plurality of coupling protrusions formed at predetermined intervals and an outer surface of the fourth holder has a plurality of coupling grooves that can be coupled to the outer surface of the third holder.

[22] The plasma coupling pipe of claim 19, wherein a cross-sectional shape of the plasma coupling pipe is circular in a state in which components are coupled to each other.

[23] The plasma coupling pipe of claim 19, wherein a cross-sectional shape of the plasma coupling pipe is rectangular in a state in which components are coupled to each other.

[24] The plasma coupling pipe of claim 19, further comprising: electric wires coupled to the power supply voltage and the ground, the electric wires being disposed in different directions.

[25] The plasma coupling pipe of claim 19, further comprising: a power supply unit for supplying the power supply voltage to the third electrode.

[26] The plasma coupling pipe of claim 25, wherein the power supply unit is configured by a main controller, a power rectifier, an inverter and a voltage regulator.

[27] The plasma coupling pipe of claim 25, wherein the power supply unit supplies, to the third electrode, the power having a frequency with a range of 60 ~ 40,000 Hz and a voltage with a range of 380 ~ 15,000 V.

[28] The plasma coupling pipe of claim 19, wherein the at least one plasma generator comprises at least two stacked plasma generators.

[29] A plasma generation electrode, comprising: at least one metal plate formed in a plate shape, one side of the metal plate having a terminal; and at least one dielectric surrounding the metal plate so that an end of the terminal can be exposed.

[30] The plasma generation electrode of claim 29, wherein the metal plate internally has at least one through hole.

[31] The plasma generation electrode of claim 29, further comprising: at least two stacked electrodes; and at least one space retainer inserted between the electrodes so that a predetermined space can be maintained between the electrodes.

[32] The plasma generation electrode of claim 31, wherein the electrodes are adjacently stacked so that terminals can be disposed in different directions.

[33] A method for fabricating at least one plasma generation electrode, comprising the steps of: (a) putting a ceramic paste in a lower dielectric frame and forming a lower dielectric; (b) forming a metal plate having a thin plate shape on an upper surface of the lower dielectric; (c) putting a ceramic paste in an upper dielectric frame based on a shape corresponding to a shape of the lower dielectric frame and forming an upper dielectric; (d) making contact between the upper dielectric with the upper surface of the lower dielectric and pressing the upper and lower dielectrics; and (e) baking the upper and lower dielectrics that are adhered to each other.

[34] The method of claim 33, wherein the metal plate has at least one through hole.

[35] The method of claim 33, wherein the step (b) comprises the steps of: (b-1) disposing a thin metal plate on the upper surface of the lower dielectric; and (b-2) depressing the metal plate below the upper surface of the lower dielectric.

[36] The method of claim 33, wherein the step (b) comprises the steps of: (b-1) coating a conductive material on the upper surface of the lower dielectric and forming the metal plate; and (b-2) depressing the metal plate below the upper surface of the lower dielectric.

[37] The method of claim 36, wherein the step (b) further comprises the step of: (b-3) forming the conductive material in a predetermined shape using a silkscreen pattern.

[38] A method for fabricating at least one plasma generation electrode, comprising the steps of: (a) forming and baking a lower dielectric in a predetermined shape; (b) forming and baking an upper dielectric in a shape corresponding to the lower dielectric; (c) forming a metal plate on an upper surface of the lower dielectric; (d) forming an adhesive material on an upper surface of the metal plate and lower dielectric; (e) disposing the upper dielectric on the adhesive material; and (f) heating the upper and lower dielectrics, the metal plate, and the adhesive material, to a melting temperature of the adhesive material, and adhering the upper and lower dielectrics.

[39] The method of claim 38, wherein the step (c) comprises the step of: disposing a thin metal plate on the upper surface of the lower dielectric.

[40] The method of claim 38, wherein the step (c) comprises the step of: coating a conductive material on the upper surface of the lower dielectric in a predetermined shape and forming the metal plate.

[41] The method of claim 40, wherein the step (c) further comprises the step of: forming the conductive material in the predetermined shape using a silkscreen pattern.

[42] The method of claim 38, wherein the adhesive material has a lower melting point than the dielectric.

[43] The method of claim 42, wherein the adhesive material is one of glass and Epoxy.

[44] The method of claim 38, wherein the step (f) comprises the step of: proceeding the heating and adhering processes in a state in which the upper and lower dielectrics, the metal plate and the adhesive material are fixed by a jig.

[45] A plasma cleaner, comprising: a casing having a fluid input port at one end thereof and a fluid output port at the other end thereof, the casing having a space through which a fluid flows; at least one plasma generator provided in a predetermined internal part for converting the fluid into a plasma state; and an oxygen supply unit provided between the plasma generator and the fluid input port for supplying oxygen gas to the fluid passing through the casing, wherein the plasma generator comprises: an electrode unit in which at least two plasma generation electrodes spaced at a predetermined interval are stacked so that the fluid can flow between the electrodes; and a power supply unit electrically coupled to the electrode unit for supplying a high- voltage current to the electrode unit.

[46] The plasma cleaner of claim 45, wherein the oxygen supply unit comprises: a microbubble generation part disposed in the casing for supplying oxygen in the form of a microbubble; and an oxygen supply part coupled to the microbubble generation part for supplying the oxygen to the microbubble generation part.

[47] The plasma cleaner of claim 45, further comprising: an oxygen collector provided between the plasma generator and the fluid output port for collecting oxygen remaining in the fluid flowing through the casing and supplying the collected oxygen to the oxygen supply unit.

[48] The plasma cleaner of claim 45, further comprising: a flux meter provided in a position adjacent to the fluid input port for measuring a speed of the fluid passing through the casing.

[49] A plasma cleaner, comprising: a dielectric pipe having a predetermined thickness, a cross-sectional shape of the dielectric pipe being circular or polygonal; an electrode unit embedded in the dielectric pipe, the electrode unit having positive (+) and negative (-) electrodes that are alternately arranged in a parallel fashion; and a power supply unit for supplying power to the electrode unit.

[50] The plasma cleaner of claim 49, wherein the dielectric pipe is a ceramic.

[51] The plasma cleaner of claim 49, wherein protrusions coupled to the power supply unit and protruded outside the dielectric pipe are provided on the (+) and (-) electrodes, and the protrusion of the (+) electrode and the protrusion of the (-) electrode are protruded in different directions. [52] The plasma cleaner of claim 49, wherein the power supply unit supplies an alternating current (AC) to the electrode unit. [53] The plasma cleaner of claim 49, further comprising: a protection member for surrounding and protecting the dielectric pipe. [54] The plasma cleaner of claim 53, wherein pipe joints are formed at both ends of the protection member so that the dielectric pipe can be coupled to another pipe through which a fluid can flow. [55] A plasma cleaner, comprising: a dielectric pipe having a predetermined thickness, the cross-sectional shape of the dielectric pipe being circular or polygonal; an electrode unit attached to an inner surface of the dielectric pipe, the electrode unit having positive (+) and negative (-) electrodes that are alternately arranged in a parallel fashion; and a power supply unit for supplying power to the electrode unit. [56] The plasma cleaner of claim 55, wherein protrusions coupled to the power supply unit and protruded outside the dielectric pipe are provided on the (+) and (-) electrodes, and the protrusion of the (+) electrode and the protrusion of the (-) electrode are protruded in different directions. [57] The plasma cleaner of claim 55, wherein the power supply unit supplies a direct current (DC) to the electrode unit. [58] The plasma cleaner of claim 55, further comprising: a protection member for surrounding and protecting the dielectric pipe. [59] The plasma cleaner of claim 58, wherein pipe joints are formed at both ends of the protection member so that the dielectric pipe can be coupled to another pipe through which the fluid can flow.