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WO2005043699B1 - Traitement laser d'une matiere cible localement chauffee - Google Patents

Traitement laser d'une matiere cible localement chauffee

Info

Publication number
WO2005043699B1
WO2005043699B1 PCT/US2004/034903 US2004034903W WO2005043699B1 WO 2005043699 B1 WO2005043699 B1 WO 2005043699B1 US 2004034903 W US2004034903 W US 2004034903W WO 2005043699 B1 WO2005043699 B1 WO 2005043699B1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing laser
target material
laser output
heating energy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/034903
Other languages
English (en)
Other versions
WO2005043699A3 (fr
WO2005043699A2 (fr
Filing date
Publication date
Priority claimed from US10/777,973 external-priority patent/US20050087522A1/en
Application filed filed Critical
Priority to DE112004002009T priority Critical patent/DE112004002009T5/de
Priority to CA002543463A priority patent/CA2543463A1/fr
Priority to GB0608158A priority patent/GB2422343B/en
Priority to JP2006536791A priority patent/JP2007508946A/ja
Publication of WO2005043699A2 publication Critical patent/WO2005043699A2/fr
Publication of WO2005043699A3 publication Critical patent/WO2005043699A3/fr
Publication of WO2005043699B1 publication Critical patent/WO2005043699B1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Abstract

L'invention concerne une méthode et un système de laser permettant un retrait rapide de matière d'une pièce (20) par l'application d'énergie chauffante, sous la forme d'un faisceau lumineux (28) sur un emplacement cible (16) d'une pièce, pour élever la température de cette pièce, tout en maintenant sa stabilité dimensionnelle. Lorsque la partie cible de la pièce est chauffée, un faisceau laser (12) est dirigé pour une incidence sur l'emplacement cible chauffé. Ce faisceau laser présente de préférence une sortie laser de traitement appropriée pour effectuer un retrait de matière cible de la pièce. L'incidence combinée de la sortie laser de traitement et de l'énergie chauffante, sur l'emplacement cible, permet à la sortie laser de traitement de retirer une partie de matière cible, à une vitesse de retrait de matière supérieure à une vitesse de retrait de matière pouvant être obtenue lorsque la matière cible n'est pas chauffée.
PCT/US2004/034903 2003-10-24 2004-10-20 Traitement laser d'une matiere cible localement chauffee Ceased WO2005043699A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE112004002009T DE112004002009T5 (de) 2003-10-24 2004-10-20 Laserbearbeitung eines lokal erhitzten Zielmaterials
CA002543463A CA2543463A1 (fr) 2003-10-24 2004-10-20 Traitement laser d'une matiere cible localement chauffee
GB0608158A GB2422343B (en) 2003-10-24 2004-10-20 Laser processing of a locally heated target material
JP2006536791A JP2007508946A (ja) 2003-10-24 2004-10-20 局所的に加熱されたターゲット材料のレーザ加工

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US51424003P 2003-10-24 2003-10-24
US60/514,240 2003-10-24
US10/777,973 US20050087522A1 (en) 2003-10-24 2004-02-11 Laser processing of a locally heated target material
US10/777,973 2004-02-11

Publications (3)

Publication Number Publication Date
WO2005043699A2 WO2005043699A2 (fr) 2005-05-12
WO2005043699A3 WO2005043699A3 (fr) 2005-12-08
WO2005043699B1 true WO2005043699B1 (fr) 2006-01-19

Family

ID=34526973

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/034903 Ceased WO2005043699A2 (fr) 2003-10-24 2004-10-20 Traitement laser d'une matiere cible localement chauffee

Country Status (8)

Country Link
US (1) US20050087522A1 (fr)
JP (1) JP2007508946A (fr)
KR (1) KR20060099517A (fr)
CA (1) CA2543463A1 (fr)
DE (1) DE112004002009T5 (fr)
GB (1) GB2422343B (fr)
TW (1) TW200518411A (fr)
WO (1) WO2005043699A2 (fr)

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