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WO2004109757A3 - Heat pipe with temperature control - Google Patents

Heat pipe with temperature control Download PDF

Info

Publication number
WO2004109757A3
WO2004109757A3 PCT/US2004/016495 US2004016495W WO2004109757A3 WO 2004109757 A3 WO2004109757 A3 WO 2004109757A3 US 2004016495 W US2004016495 W US 2004016495W WO 2004109757 A3 WO2004109757 A3 WO 2004109757A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat pipe
temperature associated
temperature control
temperature
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/016495
Other languages
French (fr)
Other versions
WO2004109757A2 (en
Inventor
Andrew J Hazelton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Nippon Kogaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, Nippon Kogaku KK filed Critical Nikon Corp
Priority to JP2006514959A priority Critical patent/JP2006526757A/en
Priority to EP04753338A priority patent/EP1629246A2/en
Publication of WO2004109757A2 publication Critical patent/WO2004109757A2/en
Publication of WO2004109757A3 publication Critical patent/WO2004109757A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Public Health (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)

Abstract

Methods and apparatus for controlling the boiling temperature of a fluid within a heat pipe (404) are disclosed. According to one aspect of the present invention, a method for controlling a temperature associated with a heat pipe that contains a fluid and has an evaporator end (606) includes measuring (640) the temperature associated with the heat pipe and determining when the temperature associated with the heat pipe is at a desired level. The method also includes changing a pressure (614) within the heat pipe when it is determined that the temperature associated with the heat pipe is not at a desired level. Changing the pressure within the heat pipe causes the temperature associated with the heat pipe to change.
PCT/US2004/016495 2003-06-05 2004-05-26 Heat pipe with temperature control Ceased WO2004109757A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006514959A JP2006526757A (en) 2003-06-05 2004-05-26 Heat pipe with temperature control
EP04753338A EP1629246A2 (en) 2003-06-05 2004-05-26 Heat pipe with temperature control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/455,004 US20040244963A1 (en) 2003-06-05 2003-06-05 Heat pipe with temperature control
US10/455,004 2003-06-05

Publications (2)

Publication Number Publication Date
WO2004109757A2 WO2004109757A2 (en) 2004-12-16
WO2004109757A3 true WO2004109757A3 (en) 2005-03-31

Family

ID=33489837

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/016495 Ceased WO2004109757A2 (en) 2003-06-05 2004-05-26 Heat pipe with temperature control

Country Status (7)

Country Link
US (1) US20040244963A1 (en)
EP (1) EP1629246A2 (en)
JP (1) JP2006526757A (en)
KR (1) KR20060018879A (en)
CN (1) CN1798953A (en)
TW (1) TW200504893A (en)
WO (1) WO2004109757A2 (en)

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US7174806B2 (en) * 2001-09-13 2007-02-13 Beacon Power Corporation Flexible bearing damping system, energy storage system using such a system, and a method related thereto
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes
US7288864B2 (en) * 2004-03-31 2007-10-30 Nikon Corporation System and method for cooling motors of a lithographic tool
CN1892206A (en) * 2005-07-08 2007-01-10 鸿富锦精密工业（深圳）有限公司 Heat-pipe measuring device
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
KR101239962B1 (en) 2006-05-04 2013-03-06 삼성전자주식회사 Variable resistive memory device comprising buffer layer on lower electrode
US20080073563A1 (en) * 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
KR101206036B1 (en) 2006-11-16 2012-11-28 삼성전자주식회사 Resistive random access memory enclosing a transition metal solid solution and Manufacturing Method for the same
JP2008147026A (en) * 2006-12-11 2008-06-26 Hitachi Ltd Solid oxide fuel cell
US8173989B2 (en) 2007-05-30 2012-05-08 Samsung Electronics Co., Ltd. Resistive random access memory device and methods of manufacturing and operating the same
TWM348267U (en) * 2008-07-25 2009-01-01 Micro Star Int Co Ltd Heat conducting pipe and heat dissipation system using the same
JP5355043B2 (en) * 2008-11-10 2013-11-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
WO2010084717A1 (en) * 2009-01-23 2010-07-29 日本電気株式会社 Cooling device
US20100218496A1 (en) * 2009-03-02 2010-09-02 Miles Mark W Passive heat engine systems and components
NL2006809A (en) * 2010-06-23 2011-12-27 Asml Netherlands Bv Lithographic apparatus and lithographic apparatus cooling method.
US8877080B2 (en) 2010-10-18 2014-11-04 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in microwave sources
EP2515170B1 (en) * 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
US8723205B2 (en) 2011-08-30 2014-05-13 Abl Ip Holding Llc Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
DE102011084324A1 (en) * 2011-10-12 2013-04-18 Siemens Aktiengesellschaft Cooling device for a superconductor of a superconducting dynamoelectric synchronous machine
US9684249B2 (en) 2012-01-30 2017-06-20 Asml Netherlands B.V. Lithographic apparatus with a metrology system for measuring a position of a substrate table
JP6140191B2 (en) * 2012-01-30 2017-05-31 エーエスエムエル ネザーランズ ビー．ブイ． Lithographic apparatus and device manufacturing method
KR101427924B1 (en) * 2012-11-21 2014-08-11 현대자동차 주식회사 Cooling device of compressed air in fuel cell system
US20150068703A1 (en) * 2013-09-06 2015-03-12 Ge Aviation Systems Llc Thermal management system and method of assembling the same
CA2923127A1 (en) * 2013-09-12 2015-03-19 Renew Group Private Limited System and method of using graphene enriched products for distributing heat energy
TWI506261B (en) * 2014-01-27 2015-11-01 Vacuum desorption device after sample gas concentration
CN105004232B (en) * 2015-08-20 2017-06-06 安徽华茂纺织股份有限公司 A kind of mike amplifying device
JP2017156465A (en) * 2016-02-29 2017-09-07 キヤノン株式会社 Driving device, lithographic apparatus, cooling method, and article manufacturing method
CN107300334B (en) * 2017-07-31 2018-10-02 大连碧蓝节能环保科技有限公司 Adjust evaporating pressure formula heat pipe
CN111566926A (en) * 2017-11-06 2020-08-21 碧绿威自动化股份有限公司 Linear Motor with Heat Dissipation Capability and Heat Reduction Considerations
CN110379729B (en) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 Heating base and semiconductor processing equipment
US10969841B2 (en) * 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
US10936031B2 (en) * 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
KR102098867B1 (en) * 2018-09-12 2020-04-09 (주)아이테드 Imprinting apparatus and imprinting method
JP7759107B2 (en) * 2019-11-29 2025-10-23 マルコム バリー ジェームズ Fluid phase change thermal management apparatus and method
JP7182574B2 (en) * 2020-02-28 2022-12-02 株式会社日立製作所 Elevator control device and elevator control method
CN112161501B (en) * 2020-09-28 2022-02-25 北京空间飞行器总体设计部 Controllable heat pipe
US12451448B2 (en) * 2022-06-22 2025-10-21 International Business Machines Corporation Electromagnetic waveguiding through liquid cooling conduit
CN115779812A (en) * 2022-11-15 2023-03-14 山东神驰石化有限公司 Energy-saving device of C3C4 dehydrogenation reaction feeding heating furnace

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517730A (en) * 1967-03-15 1970-06-30 Us Navy Controllable heat pipe
US3605878A (en) * 1969-10-08 1971-09-20 Sanders Associates Inc Heat pipe with variable evaporator
US3637007A (en) * 1967-08-14 1972-01-25 Trw Inc Method of and means for regulating thermal energy transfer through a heat pipe
US4787843A (en) * 1987-06-22 1988-11-29 Thermo Electron Corporation Pressure balanced heat pipe
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
US4986348A (en) * 1987-12-22 1991-01-22 Kenji Okayasu Heat conducting device
US5535818A (en) * 1992-10-12 1996-07-16 Fujitsu Limited Cooling system for electronic device
US5911272A (en) * 1996-09-11 1999-06-15 Hughes Electronics Corporation Mechanically pumped heat pipe
US6047766A (en) * 1998-08-03 2000-04-11 Hewlett-Packard Company Multi-mode heat transfer using a thermal heat pipe valve
US6229116B1 (en) * 1998-02-03 2001-05-08 Tokyo Electron Limited Heat treatment apparatus
US6684941B1 (en) * 2002-06-04 2004-02-03 Yiding Cao Reciprocating-mechanism driven heat loop

Family Cites Families (13)

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US3741289A (en) * 1970-07-06 1973-06-26 R Moore Heat transfer apparatus with immiscible fluids
JPS59180283A (en) * 1983-03-29 1984-10-13 Toshiba Corp Variable conductance heat pipe
US4573525A (en) * 1985-03-28 1986-03-04 Boyd Hermon A Thermally actuated heat exchange method and system
JPH0631702B2 (en) * 1985-09-30 1994-04-27 株式会社東芝 Two-phase fluid loop
JPS62107271U (en) * 1985-12-16 1987-07-09
JPH0285268U (en) * 1988-12-07 1990-07-04
JP2622603B2 (en) * 1989-01-13 1997-06-18 株式会社フジクラ Heat pipe heat exchanger
JP3475973B2 (en) * 1994-12-14 2003-12-10 株式会社ニコン Linear motor, stage device, and exposure device
JP4131038B2 (en) * 1998-06-26 2008-08-13 株式会社エクォス・リサーチ Fuel cell system
KR100629746B1 (en) * 1999-07-28 2006-09-28 동경 엘렉트론 주식회사 Developing apparatus and method thereof
KR100597287B1 (en) * 1999-07-28 2006-07-04 동경 엘렉트론 주식회사 Substrate processing apparatus and method
US6312171B1 (en) * 1999-08-12 2001-11-06 Tokyo Electron Limited Developing apparatus and method thereof
KR20010083206A (en) * 2000-02-22 2001-08-31 히가시 데쓰로 Treament apparatus

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517730A (en) * 1967-03-15 1970-06-30 Us Navy Controllable heat pipe
US3637007A (en) * 1967-08-14 1972-01-25 Trw Inc Method of and means for regulating thermal energy transfer through a heat pipe
US3605878A (en) * 1969-10-08 1971-09-20 Sanders Associates Inc Heat pipe with variable evaporator
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
US4787843A (en) * 1987-06-22 1988-11-29 Thermo Electron Corporation Pressure balanced heat pipe
US4986348A (en) * 1987-12-22 1991-01-22 Kenji Okayasu Heat conducting device
US5535818A (en) * 1992-10-12 1996-07-16 Fujitsu Limited Cooling system for electronic device
US5911272A (en) * 1996-09-11 1999-06-15 Hughes Electronics Corporation Mechanically pumped heat pipe
US6229116B1 (en) * 1998-02-03 2001-05-08 Tokyo Electron Limited Heat treatment apparatus
US6047766A (en) * 1998-08-03 2000-04-11 Hewlett-Packard Company Multi-mode heat transfer using a thermal heat pipe valve
US6684941B1 (en) * 2002-06-04 2004-02-03 Yiding Cao Reciprocating-mechanism driven heat loop

Also Published As

Publication number Publication date
WO2004109757A2 (en) 2004-12-16
US20040244963A1 (en) 2004-12-09
JP2006526757A (en) 2006-11-24
EP1629246A2 (en) 2006-03-01
KR20060018879A (en) 2006-03-02
TW200504893A (en) 2005-02-01
CN1798953A (en) 2006-07-05

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