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WO2004021760A1 - Machine de montage de pieces electroniques et procede permettant d'inspecter la precision de la position de montage - Google Patents

Machine de montage de pieces electroniques et procede permettant d'inspecter la precision de la position de montage Download PDF

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Publication number
WO2004021760A1
WO2004021760A1 PCT/JP2003/010803 JP0310803W WO2004021760A1 WO 2004021760 A1 WO2004021760 A1 WO 2004021760A1 JP 0310803 W JP0310803 W JP 0310803W WO 2004021760 A1 WO2004021760 A1 WO 2004021760A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
mounting
test
mounting position
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2003/010803
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English (en)
Japanese (ja)
Inventor
Tosuke Kawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of WO2004021760A1 publication Critical patent/WO2004021760A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection

Definitions

  • the present invention relates to an electronic circuit component mounting machine that holds an electronic circuit component (hereinafter, abbreviated as a component unless otherwise required) by a holding head and mounts the component on a circuit board.
  • the present invention relates to an inspection of the accuracy of the mounting position.
  • the electronic circuit component placement machine receives a component from the component supply device using a component supply device that supplies components, a board holding device that holds a circuit board, and a holding head, and mounts the component on the circuit board held by the circuit board holding device. It is configured to include a component mounting device.
  • a component mounting device In order to inspect the mounting position accuracy of the electronic circuit component mounting machine, that is, the accuracy of the mounting position of the component on the circuit board, it is described in, for example, JP-A-2001-1360000.
  • an inspection board provided with a plurality of mounting position reference marks is used. Usually, a plurality of mounting positions are set on the inspection board, and a plurality of mounting position reference marks are provided near each mounting position. The accuracy of the mounting position of the test chip on the test board is detected based on the relative positions of the mounted test chips with respect to the plurality of mounting position reference marks.
  • the surface of the test chip mounted on the test board is imaged by an imaging device, and the relative position of the image of the test chip obtained as a result with respect to the mounting position reference mark has been detected.
  • the side surface of the test chip is exactly perpendicular to the surface of the test substrate, this may be acceptable, but in practice, it does not always form a right angle.
  • the side surface of the inspection chip and the surface of the inspection substrate form an acute angle or an obtuse angle.
  • the outline of the front surface and the outline of the back surface of the inspection chip may be shifted from each other in a direction parallel to the surface of the inspection substrate. This is particularly likely when actual components are used as test chips. In such a case, it is desirable to detect the relative position of the surface image of the inspection chip with respect to the mounting position reference mark. Often not.
  • a position error of the test chip held by the holding head is often corrected.
  • the back surface of the test chip is imaged by the imaging device, and based on the image of the back surface, an error in the holding position of the test chip by the holding head is detected.
  • the error is corrected and mounted on the circuit board.
  • the outline of the front surface and the outline of the back surface of the inspection chip are displaced from each other, the position of the image on the back surface is accurate, but the mounting position accuracy based on the position of the image on the front surface is detected. In ⁇ , the accuracy is determined to be poor, or the accuracy is determined to be good despite the poor accuracy. Disclosure of the invention
  • the present invention has been made in view of the above circumstances as an object to improve the accuracy of mounting position accuracy inspection of an electronic circuit component mounting machine.
  • a mounting position accuracy inspection method, mounting position accuracy inspection device, and electronic circuit component mounting machine can be obtained. Similar to the claims, each mode is divided into sections, each section is numbered, and the number of another section is quoted as necessary. This is for the purpose of facilitating the understanding of the present invention and should be construed as limiting the technical features and combinations thereof described in this specification to those described in the following sections. is not.
  • the items need not always be adopted together. It is also possible to select and adopt only some of the items.
  • a mounting position accuracy detection method for an electronic circuit component mounting machine comprising: detecting a mounting position of the test chip on the test substrate at a position on a back surface of the test chip.
  • Detecting the mounting position of the test chip on the test board at the position on the back side of the test chip mounts the electronic circuit component mounting machine. In many cases, the position accuracy can be properly evaluated.
  • test chip is held by a holding head, an error of the holding position of the test chip by the holding head is obtained by imaging the test chip, and the obtained holding position error is corrected and applied to the test board.
  • Attachment The mounting position accuracy inspection method described in (1) or (2).
  • the holding head is to accurately position and hold the component, but if the position error of the test chip is acquired, corrected and mounted on the test board, the mounting position can be detected. Accuracy can be improved.
  • the holding position error is obtained by imaging the back surface of the inspection chip to obtain the corrected holding position error and mounted on the inspection substrate
  • the mounting position is detected by imaging the back surface of the mounted inspection chip according to the present invention.
  • the precision inspection of the electronic circuit component mounting machine can be performed particularly well.
  • the position of the back surface can be particularly accurately detected.
  • a plurality of mounting position reference marks are provided near the mounting position of the test chip on the test board, and the positions of the test chips are detected based on the mounting position reference marks (1) to (5).
  • Item 5 The mounting position accuracy inspection method according to any one of the above items. It is also possible to detect the position of the inspection chip based on the reference point on the imaging surface of the imaging device Noh. However, in this case, it is inevitable that the detection result is affected by a feed error of a relative movement device that relatively moves the imaging device and the inspection board in a direction parallel to the surface of the inspection board. On the other hand, if the position of the test chip is detected with reference to the mounting position reference mark, the influence of the feed error of the relative moving device can be eliminated. It is relatively easy to form a plurality of mounting position reference marks on the inspection board at accurate relative positions, and the mounting position can be accurately detected.
  • the planned mounting positions are set in a state where they are regularly arranged in two directions orthogonal to each other on the surface of the detection substrate, and the plurality of mounting position reference marks are provided for the plurality of planned mounting positions.
  • the mounting position may be set at one location, but setting multiple locations can increase the reliability of the inspection.
  • the setting is made in such a way as to be regularly arranged in two directions orthogonal to each other on the surface of the inspection board, it is possible to inspect the mounting position accuracy over the entire electronic circuit component mounting machine. it can. It is desirable that the inspection substrate has a small thermal expansion, such as a glass substrate.
  • the position of the substrate reference mark provided on the inspection substrate was detected to detect the position of the entire inspection substrate, and the position error of the inspection substrate was acquired based on the detected position.
  • the mounting position accuracy inspection method according to any one of (1) to (7), wherein the inspection chip is mounted while correcting a position error of the inspection substrate.
  • the position of the inspection board can be accurately defined, or when the mounting position accuracy is detected by comparing positional errors of the test chips at a plurality of planned mounting positions. If the position error of the inspection substrate is corrected based on the position of the substrate reference mark, the effect of improving the inspection accuracy or facilitating the inspection can be obtained.
  • the test substrate is made of a light-transmitting material, a test chip is mounted on the front surface of the test substrate, and the test chip is imaged from the back side of the test substrate to reduce the position of the rear surface of the test chip. Detecting The mounting position accuracy detecting method according to any one of (1) to (8).
  • the test substrate is made of a light transmitting material and the test chip is imaged from the back surface side of the test substrate, the relative position of the test chip with respect to the test substrate can be easily detected based on the position of the rear surface of the test chip.
  • the light transmitting material includes not only a transparent material but also a translucent material. Inspection ⁇ It is sufficient if the material has a light transmittance enough to image the test chip through the substrate.
  • a double-sided pressure-sensitive adhesive sheet is pasted on the test substrate, and the test chip is fixed to the test substrate by the double-sided pressure-sensitive adhesive sheet.
  • the mounting position accuracy test method according to any one of the above modes (1) to (9) .
  • the test chip When the test chip is mounted on the test board, the test chip can be simply placed on the test board or temporarily fixed with a temporary fixing agent such as an adhesive or creamy solder.
  • a temporary fixing agent such as an adhesive or creamy solder.
  • the double-sided adhesive sheet it is possible to prevent the inspection chip once mounted on the inspection substrate from being displaced satisfactorily, or the temporary fixing agent protrudes from the gap between the inspection chip and the inspection substrate. Thus, it is possible to prevent the detection of the exact position of the test chip from being hindered.
  • the double-sided adhesive sheet can be made larger than the back surface of the component tape, and the work of attaching the double-sided adhesive sheet to the inspection substrate becomes easy.
  • a double-sided pressure-sensitive adhesive sheet can be stuck all at once on the entire area where the inspection substrate mounting position is set. It is desirable that the double-sided pressure-sensitive adhesive sheet is also transparent. It is desirable that both the sheet and the adhesive applied to both sides of the sheet have as high a transparency as possible.However, a material having light transmittance enough to image the test chip through the test substrate and the double-sided pressure-sensitive adhesive sheet Should be fine.
  • test chip is mounted on the test board with the front side of the test board facing up, and then the test board is turned upside down to pass the test board from above through the rear face of the test chip.
  • the mounting position accuracy inspection method according to the above mode (10) or (11), wherein an image is taken.
  • a plurality of mounting position reference marks are provided near the mounting position of the test chip on the test board, and the inspection is performed at a mounting position relatively determined with respect to the plurality of mounting position reference marks.
  • the imaging device is positioned at a position directly facing each of the plurality of mounting position reference marks, and each mounting position reference mark is imaged to acquire the position of each mounting position reference mark.
  • the mounting position accuracy according to any one of paragraphs (9) to (12), wherein the imaging device is positioned at a position directly opposite to the mounting position determined based on the position of the mounting position reference mark, and the inspection chip is imaged. Inspection methods.
  • the aspect is also one embodiment of the present invention.
  • the inspection chip is positioned at the center of the screen, the plurality of mounting position reference marks will be located at the periphery of the screen, and the image will be taken from an oblique direction.
  • the detection accuracy of the position of the mounting position reference mark decreases due to the influence of the lens aberration.
  • each of the plurality of mounting position reference marks and the inspection chip can be imaged in a state where they are almost at the center of the screen.
  • the plurality of mounting position reference marks can be taken. The detection accuracy of the relative position between the inspection chip and the inspection chip can be improved.
  • the mounting position reference mark When the mounting position reference mark is acquired as a bright image, such as when the mounting position reference mark can be regarded as a mirror surface, if it is imaged by epi-illumination, the mounting position reference mark is acquired as an image with sufficient contrast And its position can be detected with high accuracy.
  • the mounting position reference mark can be regarded as a mirror surface, if the illumination is performed from a direction inclined with respect to the surface of the inspection board, the reflected light from the mounting position reference mark hardly enters the imaging device, and the mounting position reference mark The image becomes darker, while the image The diffusely reflected light enters the imaging device, and the image on the back surface of the inspection chip is obtained as a bright image.
  • detecting the position of the inspection chip it is possible to prevent the presence of the reflected light itself from the mounting position reference mark or the presence of the image of the mounting position reference mark from disturbing.
  • test board is held by the board holding device with the front side down, and the image is picked up from above (17). Inspection methods.
  • the same imaging device can be used for both imaging of the substrate reference mark and imaging of the back surface of the inspection chip, which can reduce the cost of the device and increase the accuracy of the mounting position inspection.
  • Item (18) is a device which holds the inspection substrate so that the focal point of the device is located on the surface of the inspection substrate both when imaging the substrate reference mark and when imaging the inspection chip. Inspection position accuracy inspection method.
  • the focus of the imaging device can be accurately adjusted both when imaging the substrate reference mark provided on the front side of the inspection substrate and when imaging the inspection chip from the back side of the inspection substrate.
  • the image can be adjusted to the target to be imaged, and good images can be obtained together.
  • the focus of the imaging device is located on the front surface of the inspection board when imaging the substrate reference mark, and is located on the back surface of the inspection chip when imaging the back surface of the inspection chip. It is desirable to do so.
  • the back side of the test chip is in close contact with the front side of the test board, they match, but when the test chip is fixed to the test board by the double-sided pressure-sensitive adhesive sheet, it differs by the thickness of the double-sided pressure-sensitive adhesive sheet .
  • the thickness of the double-sided adhesive sheet is ignored, and in the latter case, the focus of the imaging device may be located on the surface of the inspection substrate both when imaging the substrate reference mark and when imaging the inspection chip. Shall be assumed.
  • An inspection board which is a flat plate made of a light-transmitting material, on which a plurality of mounting positions are set on the surface and a plurality of mounting position reference marks are provided for each of the mounting positions;
  • An imaging device capable of imaging the back surface of the inspection chip mounted at the mounting position on the front surface of the inspection substrate and the plurality of mounting position reference marks from the back surface side of the inspection substrate;
  • a mounting position accuracy acquisition unit for causing the imaging device to image the mounting position reference mark and imaging the inspection chip, and acquiring the mounting position accuracy of the electronic circuit component mounting machine based on the imaging result;
  • a mounting position accuracy inspection device for electronic circuit component mounting machines including:
  • the mounting position accuracy detecting device described in this section is suitable for implementing the method invention of the above (1).
  • Each feature described in each of the above paragraphs (2) to (5) and (7) to (19) is also applicable to the mounting position accuracy inspection apparatus of this paragraph.
  • a component mounting device that receives an electronic circuit component from the component supply device by a holding head and mounts the electronic circuit component on a circuit board held by the circuit board holding device;
  • An electronic circuit component mounting machine comprising:
  • It has a flat shape, and a plurality of mounting positions are set. A plurality of mounting position reference marks are provided for each position, and a detection board held by the circuit board holding device;
  • An inspection chip mounting control unit for holding the inspection chip on the holding head, and mounting the inspection chip at each of the mounting expected positions;
  • the mounting position reference mark is placed on the imaging device through the inspection substrate from the back side of the inspection substrate.
  • a mounting position accuracy obtaining unit for obtaining an image of the back surface of the test chip mounted on the test board and obtaining a mounting position accuracy of the electronic circuit component mounting machine based on a result of the imaging.
  • FIG. 1 is a plan view showing an electronic circuit component mounting machine according to an embodiment of the present invention.
  • FIG. 2 is a side view showing the electronic circuit component mounting machine.
  • FIG. 3 is an enlarged side view (partial cross section) showing a main part of the electronic circuit component mounting machine.
  • FIG. 4 is a side view showing an epi-illumination device of the electronic circuit component mounting machine.
  • FIG. 5 is a block diagram showing a control device for controlling the electronic circuit component mounting machine.
  • FIG. 6 is (a) a plan view and (b) a front view showing an inspection board for performing a component mounting accuracy inspection.
  • FIG. 7 is a plan view showing a state where components are mounted on the inspection board.
  • FIG. 8 is a front view showing a state in which a circle mark on the inspection substrate is imaged.
  • FIG. 9 is a plan view showing a substrate jig for holding the inspection substrate.
  • FIG. 10 is a front view showing the substrate jig.
  • FIG. 11 is a front view showing a state in which the back surface of the component mounted on the inspection board is imaged.
  • FIG. 12 is a diagram showing an image obtained by capturing an image of an inspection board by epi-illumination.
  • FIG. 13 is a diagram showing an image obtained by capturing an image of an inspection board by illumination from an oblique direction.
  • FIG. 14 is a diagram for explaining image processing.
  • FIG. 15 is a graph showing the detection result of the mounting accuracy, which is a graph in the case where an image is taken from the back side of the test board and detected.
  • FIG. 16 is a graph showing a detection result of the mounting accuracy, which is a graph in a case where an image is detected from the component mounting surface side of the inspection board and detected.
  • the electronic circuit component mounting machine 10 is already known in, for example, Japanese Patent No. 2824378, and will be briefly described.
  • reference numeral 12 denotes a base as a machine main body of the electronic circuit component mounting machine 10.
  • a printed circuit board conveyor 16 for transporting a printed circuit board 14, which is a type of circuit board, in the X-axis direction (left and right in FIG. 1), and a board holding device for holding the printed circuit board 14 Parts are mounted on the component 18 and the component mounting device 22 for mounting electronic circuit components 20 (see FIG. 3; hereinafter, abbreviated as components 20) on the printed wiring board holding device 18 and the printed wiring board 14.
  • a component supply device 24 for supplying 20 is provided.
  • the printed wiring board 14 is placed horizontally on a pair of conveyor belts, and is conveyed while being guided by a pair of guide rails 26 and 28 by rotating the conveyor belt.
  • One guide rail 26 is a fixed guide rail provided to fix the position
  • the other guide rail 28 is a movable guide rail provided to be able to approach and separate from the fixed guide rail.
  • the guide rail 26 is referred to as a fixed guide rail 26
  • the guide rail 28 is referred to as a movable guide rail 28.
  • the movable guide rail 28 is provided with an access / separation device or It is moved in the Y-axis direction (the direction perpendicular to the transport direction) by the width changing device, and the distance between the fixed guide rail 26 and the printed wiring board 12 is adjusted.
  • the printed wiring board 14 is stopped at a predetermined work position, and is held by a printed wiring board holding device 18 provided at a portion corresponding to the work position of the base 12.
  • a component supply device 24 is provided stationary.
  • the component supply device 24 is a feeder-type component supply device.
  • the component supply device 24 includes a component supply table 3 in which a number of feeders 30 are arranged on a feeder support table 32, and component supply units are arranged in a line, for example, in a line parallel to the X-axis direction. With 4. Each feeder 30 holds the component 20 on a carrier tape and supplies the component 20 from the taped electronic circuit component.
  • the component mounting device 22 transports the component 20 by moving the component holding head 60 shown in FIG. 3 in a direction having components in the X-axis direction and the ⁇ -axis direction which are orthogonal to each other, and conveys the component 20. It is supposed to be mounted on the upper surface of the plate 14. Therefore, as shown in FIG.
  • the component mounting device 22 includes an X-axis slide 66 and an X-axis slide moving device 68 for moving the X-axis slide 66, and the X-axis slide 66. Is moved to any position in the direction parallel to the X axis.
  • the X-axis slide moving device 68 includes an X-axis slide drive motor 70 as a drive source, and the rotation of the X-axis slide drive motor 70 rotates the pole screw 64 to rotate the X-axis slide. 6 6 is moved.
  • the X-axis slide 66 has a length exceeding the wiring board conveyor 16 from the component supply device 24 as shown in FIG.
  • a ⁇ -axis slide 82 is provided on the X-axis slide 66 so as to be relatively movable in the ⁇ -axis direction.
  • the ⁇ -axis slide moving device 84 is capable of moving to an arbitrary position in the ⁇ -axis direction. I have.
  • the ⁇ -axis slide moving device 84 includes a ⁇ -axis slide driving motor 86 as a drive source, and the rotation of the motor 86 is transmitted to the ball screw 92 via gears 88, 90. ⁇ to move the axis slide 82.
  • the X-axis slide 66, the X-axis slide moving device 68, the ⁇ -axis slide 82, and the ⁇ -axis slide moving device 84 constitute a ⁇ ⁇ moving device 96, and the component holding head 60 Is moved by the ⁇ ⁇ moving device 96 to an arbitrary position in a horizontal plane which is a plane parallel to the ⁇ ⁇ coordinate plane. Can be done.
  • the support portion 102 provided on the Y-axis slide 82 has a head axial movement for raising and lowering the component holding head 60 and the component holding head 60.
  • the apparatus is provided with a head elevating device 104, a head rotating device 106 for rotating the component holding head 60 around its axis, and these component holding heads 60, etc.
  • the component mounting unit 108 is configured.
  • the component mounting unit 108 of the present embodiment has the same configuration as the component mounting unit described in Japanese Patent No. 3093339, and will be briefly described.
  • a shaft 110 is provided on the supporting portion 102 so as to be movable in a direction parallel to the axial direction and rotatable around the axis, and a suction nozzle 111 is provided by a holder 112 provided at a lower end thereof. 4 is detachably held.
  • the shaft 110 and the holder 111 constitute a component holding head 60.
  • the suction nozzles 1 14 suction the component 20 by negative pressure and mount it on the printed wiring board 14. Therefore, the suction nozzles 114 are connected to a negative pressure source (not shown), a positive pressure source (not shown), and the atmosphere, and are switched by an electromagnetic directional switching valve device (not shown). It is alternatively connected to the atmosphere.
  • the fiducial mark camera 152 (see FIG. 1), which is an image pickup device for imaging a plurality of fiducial marks 150 provided on the printed wiring board 14, is fixed to the ⁇ -axis slide 82.
  • the fiducial mark camera 152 is constituted by a CCD camera which is a type of a surface imaging device.
  • a ring-shaped illumination device 154 is provided around the fiducial mark camera 152 as shown in FIG. 4, and illuminates the fiducial mark 150 and its periphery.
  • an epi-illumination device 158 that illuminates the imaging target object with illumination light substantially parallel to the optical axis of the fiducial mark camera 152 is provided.
  • a half mirror 160 is provided below the reference mark camera 152 at an angle of 45 degrees with respect to the optical axis of the reference mark camera 152.
  • the half mirror 160 is irradiated with light from a horizontally arranged halogen lamp 162.
  • a concave mirror 16 6 is provided on the opposite side of the half mirror 16 0 of the halogen lamp 20, and light emitted from the halogen lamp 16 2 to the opposite side of the half mirror 16 0 is a half mirror. The light is reflected toward 160.
  • Halogen lamp 1 6 2 and concave mirror 1 6 6 cooperates to emit light that is substantially uniform from the entire surface of the concave mirror 16 6 facing the half mirror 16 0 and is substantially perpendicular to the optical axis of the reference mark camera 15 2. It is composed.
  • Non-reflective paper 1 74 is black paper with a particularly low surface reflectivity.
  • the fiducial mark camera 15 2, the illumination device 15 5 and the epi-illumination device 15 8 constitute an imaging system, and when imaging the printed wiring board 14 and the mounted components 20, etc. Either the illumination device 154 or the epi-illumination device 158 is selectively turned on to perform an imaging operation.
  • the X-axis slide 66 is located between the component supply device 24 and the printed wiring board 14 and at a position corresponding to the ball screw 64 that just moves the X-axis slide 66. 80 is immovably mounted.
  • the component imaging device 180 includes a component camera 182 for capturing an image of the component 20 and a light guiding device 18 4, and the light guiding device 18 4 serves as a reflecting device. It has reflecting mirrors 186 and 188.
  • the component camera 18 2 is a CCD camera, like the fiducial mark camera 15 2.
  • An illumination device 198 is provided just below the movement path of the suction nozzles 114 in the Y-axis direction and near the light guide device 184.
  • the lighting device 198 is equipped with a strobe 200 for irradiating ultraviolet rays and a luminous plate 200 for absorbing visible light and emitting visible light.
  • the component camera 18 2 projects the component 20 Capture an image.
  • the illuminating device 198 further includes another strobe 204 that emits visible light, and the reflected light from the bottom of the component 20 causes the component power lens 18 2 to form a front view of the component 20. Take an image.
  • the imaging device 180, the light guide device 184, and the lighting device 198 constitute an imaging system.
  • the electronic circuit component mounting machine 10 includes a control device 250 shown in FIG.
  • the control device 250 is mainly composed of a CPU 25 2, a ROM 25 4, a RAM 25 6, and a computer 260 having a bus connecting them.
  • the bus is further connected to an input / output interface 266, and a drive circuit 264 drives the X-axis slide drive motor 70, the Y-axis slide drive motor 86, and the head lifting / lowering device. 104, a head rotating device 106 and the like are connected.
  • the control device 250 is connected with an image processing computer 26 6, a reference mark camera 15 2, and a component camera 18 2.
  • the control device 250 is further connected to an input device 268 such as a keypad, and also connected to a display device 274 as a display device via a control circuit 272.
  • the motors as drive sources of the X-axis slide drive motor 70, the Y-axis slide drive motor 86, the head lifting / lowering device 104, and the head rotation device 106 are all provided. Each of them is also constituted by a servomotor, and its rotation angle is detected by the encoder 276 and inputted to the computer 260.
  • FIG. 5 representatively shows an encoder 276 provided on the X-axis slide drive motor 70.
  • the ROM 254 and the RAM 256 of the controller 250 store various programs such as a main routine, an electronic circuit component mounting routine, and data necessary for executing the programs. It is remembered.
  • the computer 260 is connected to a parts data generator (PDG) 278 which is a database storing various data of the parts 20 (abbreviated as part information).
  • PDG parts data generator
  • the mounting operation for mounting the component 20 on the printed wiring board 14 is described briefly in the aforementioned Japanese Patent No. 2824378, etc., and will be briefly described. Will be described.
  • the electronic circuit component mounting routine data of a component receiving position where the component holding head 60 should receive the component 20 from the feeder 30 and the component 20 are mounted on the printed wiring board 14.
  • the data of the component mounting position which is the power position, and the component information of each component 20 supplied from the part data generator (PDG) 278 are included.
  • the printed wiring board 14 is transported to a work position (or mounting space) where the component 20 is mounted by the wiring board conveyor 16, and is positioned and held by the printed wiring board holding device 18.
  • Component mounting unit 1 08 with XY moving device 96 In both cases, the fiducial mark camera 152 is positioned at the fiducial mark imaging position where the fiducial mark 150 provided on the printed wiring board 14 is imaged, and the two fiducial marks 150 are respectively imaged. As a result, the position error of the printed wiring board 14 is obtained by image processing of the obtained reference mark 150.
  • the component holding head 60 is moved by the XY moving device 96 to a component receiving position for receiving the component 20 from the feeder 30.
  • the component holding head 60 is moved up and down by the head elevating device 104, and negative pressure is supplied to the suction nozzles 114. As a result, the component 20 is sucked.
  • the component holding head 60 holding the component 20 is moved from the component receiving position to a component mounting position facing a component mounting point preset on the printed wiring board 14.
  • the X-axis slide 66 passes over the light guide device 184 fixed at a position between the component receiving position and the component mounting position. Regardless of whether the component receiving position and the component mounting position are on the component supply device 24 or the printed wiring board 14, the component holding head 60 must be moved from the component receiving position to the component mounting position without fail. It moves on the X-axis slide 66 in the Y-axis direction and passes through a portion between the component supply device 24 and the printed wiring board 14.
  • the component holding head 60 always passes over the light guide device 18 4 fixed to the portion of the X-axis slide 66 located between the component receiving position and the component mounting position, and A part 20 is imaged by the camera 18.
  • the position at which the component holding head 60 is located on the light guide device 184 and is imaged by the component camera 182 is referred to as a component holding position detection position or an imaging position.
  • the component holding head 60 is moved from the suction to the position of the component holding position detection position by the head rotating device 10 6 And the component 20 is rotated and changed to the rotational position at the time of mounting. Then, when the component holding head 60 reaches the component holding position detection position, the component 20 is imaged. Since the imaging device 180 and the strobes 200 and 204 are provided on the X-axis slide 66, the movement of the component holding head 60 is stopped in the Y-axis direction. The component 20 is imaged while being moved in the axial direction. The data of the captured image is stored in the image processing computer 266. The data is compared with the data of the normal image without the holding position error, and the holding position error, that is, the translational position error (often the center position error) and the rotational position error of the predetermined reference point are calculated.
  • the component holding head 60 Before the component holding head 60 moves to the component mounting position, the component holding head 60 is rotated by the head rotating device 106 to cancel the rotational position error, and The coordinates of the component mounting position are corrected so that the position error of the printed wiring board 14 and the translational position error of the component 20 (including the translational position error generated due to the cancellation of the rotational position error) are cancelled.
  • the component 20 is mounted at the correct mounting point on the printed wiring board 14 at the correct rotation position. This completes one cycle of mounting work. Next, the mounting position accuracy inspection work will be described. A dedicated inspection board is used for the inspection work.
  • the inspection substrate 300 is made of colorless and transparent glass and is formed in almost the same shape as the printed wiring board 14, and circle marks 3002 are formed on a large number of grid points on the component mounting surface on the front side. Are accurately formed in shape and position.
  • the component 20 is mounted in the same manner as the mounting operation described above. The front and back are reversed, and the back surface of the component 20 is imaged through the detection board 300, and the mounting position accuracy of the component 20 is detected. The details will be described below.
  • the inspection board 300 is transported to a mounting space by the wiring board conveyor 16 and positioned and held by the printed wiring board holding device 18.
  • the reference mark camera 152 captures a part of the circle mark 302 so that the position of the inspection board 300 is obtained. Since the inspection substrate 300 does not have a dedicated mark corresponding to the reference mark 150, two circular marks 3 02 at two corners located on two diagonal lines are provided. Each image is taken, the position of the mark center, which is the center of the image of each circle mark 302, is acquired, and the holding position of the inspection substrate 300 is acquired, considering the center of the four mark centers as a reference point. You.
  • the circle mark 302 is a mirror surface obtained by etching the surface of the inspection substrate 300 and applying a very thin metal plating. Therefore, as shown in FIG. 8, the reference mark camera 15 2 is positioned directly above the circle mark 302, and If the illumination device 158 illuminates from directly above, the portion of the circle mark 302 is totally reflected and an image brighter than the surrounding area can be captured.
  • the fiducial mark cameras 15 2 capture images of the four circle marks 302 from directly above by epi-illumination, and obtain the position of the reference point, which is the center of each circle mark, based on the positions of these reference points.
  • the position of the inspection board 300 is obtained. Note that a reference mark may be provided separately from the circle mark 302 in a margin of the inspection board 300 or the like.
  • the component 20 is mounted on the inspection board 300.
  • the inspection work is performed by mounting a component 20 which is a commercially available electronic circuit component.
  • the component holding head 60 receives the component 20 from the feeder 30 at the component supply position, and is moved toward the component mounting position by the XY moving device 96.
  • the back surface of the component 20 is imaged by the component camera 182.
  • the strobe light 204 that emits visible light is turned on, and a reflected image of the back surface of the component 20 is captured.
  • the component holding head 60 By the time the component holding head 60 reaches the component mounting position, image processing is executed to acquire the component holding position, and the holding position error of the inspection board 300 and the holding position error of the component 20 are eliminated.
  • the mounting position is corrected so that the component 20 is mounted on the inspection board 300.
  • a colorless and transparent double-sided adhesive tape (not shown) is previously attached to the entire component mounting surface of the inspection substrate 300, and the component 20 held by the suction nozzles 114 is attached to the inspection substrate 300. If placed on top, it will be fixed by the adhesive tape. In the following description, the thickness of the double-sided adhesive tape is assumed to be negligible.
  • the component 20 is preset at each position equidistant from four adjacent circle marks 302 of a large number of circle marks 302 of the inspection board 300, as shown in FIG.
  • the components 20 are mounted on the large number of mounting positions in the same manner as in the mounting operation described above.
  • the component 20 is mounted on the mounting area of the detection board 300, that is, the entire area where the circle mark 302 is provided.
  • FIG. 7 shows a state in which all of the components 20 are mounted at the rotational position where they are supplied from the feeder 30. However, even if they are mounted alternately at a rotation position rotated 90 degrees from the rotation position, 2003/010803
  • the mounting position can be set at various rotation positions, such as at a rotation position rotated 90 degrees, and a plurality of additional mounting positions of the inspection board 300 can be set at rotation positions further rotated 90 degrees. It is also possible to do so.
  • the operator turns the inspection board 300 over and sets it on the wiring board holding device 18, and the reference mark camera 15 2 passes the inspection board 300 through the inspection board 300.
  • the back surface of the component 20 is imaged, and the mounting position of the component 20 is detected.
  • the completion of the mounting work of the component 20 is notified to the operator, and the holding of the test board 300 by the wiring board holding device 18 is released.
  • the operator takes out the inspection board 300 based on the work completion information, turns the board upside down, and mounts the board on the board jig 304.
  • the substrate jig 304 has a generally flat plate shape, supports the inspection substrate 300 from below, and contacts or approaches both side surfaces of the inspection substrate 300. To define the horizontal position.
  • the board jig 304 supports the inspection board 300 with the component mounting surface of the inspection board 300 facing down, so that it does not interfere with the component 20 already mounted on the component mounting surface.
  • the portion opposing the area where the circle mark 302 is formed has a constant depth (for example, 5 mm) except for the support surface 303 that contacts and supports the edge of the lower surface of the inspection substrate 300. mm) Depressed.
  • the inspection board 300 is held by the wiring board holding device 18 via the board jig 304.
  • the board jig 304 has a height of the component mounting surface, that is, the back surface of the component 20, in a state where the inspection board 300 is held by the wiring board holding device 18 via the board jig 304. Is designed to hold the inspection board 300 at a height that matches the focus of the fiducial mark camera 152. Specifically, for example, assuming that the thickness of the inspection substrate 300 is t and the refractive index of the glass is 1.5, the focal length inside the glass increases by 1.5 times. As shown in Fig. 10, the inspection board 300 is mounted so that the component mounting surface is located at a position that is one-third the thickness t lower than the component mounting surface height h at the time of component mounting. It is made to hold.
  • the inspection board 300 has a height-adjusted component mounting surface when the component 20 is mounted. Since the upper surface of the substrate jig 304 is pressed against the fixed surface 308 and held, the component mounting surface of the inspection substrate 300 is raised when the upper surface of the substrate jig 430 is pressed and held against the surface 308. The thickness is set to be lower by one third of the thickness t of the inspection substrate 300 from the specified surface 308.
  • the width of the wiring board conveyor 16 is adjusted according to the board jig 304. That is, the movable guide rail 28 is moved in a direction away from the fixed guide rail 26 until the distance between the movable guide rail 28 and the fixed guide rail 26 matches the width of the board jig 304.
  • the circuit board holding device 18 (FIGS. 1 and 2) (not shown) is brought into a state in which the substrate jig 304 can be held. Thereafter, if the operator places the inspection board 300 on the wiring board holding device 18 via the inspection jig 304, the operator notifies the control device via the input device 268. It is transmitted to 250. Based on this information, the control device 250 sets the wiring board holding device 18 in a state in which the test jig 304 is fixedly held, and as a result, the test board 300 is detected and fixed. It is fixedly held through the tool 304.
  • the mounting position of the component 20 is detected by imaging the back surface of the component 20.
  • the positions of four surrounding circular marks 302 are acquired, and the mounting position is determined based on the relative positions of the circular marks 302 and the component 20. A shift is detected.
  • circle marks 302 around the component 20 are sequentially imaged.
  • the fiducial mark camera 15 2 is positioned at a position that should be located directly above the circle mark 30 2 to be imaged this time, and the epi-illumination device 15 8 8 is coaxial with the fiducial mark camera 15 2.
  • An example of an image obtained by being illuminated by the epi-illumination device 158 is shown in FIG. 12. ing. This is to make it easier to compare with FIG. 13 which is an image obtained by being illuminated from an oblique direction by the illumination device 154.
  • the circle mark 302 is usually located at the center of the image pickup. The image is taken to be located.
  • the circle mark 302 is almost totally reflected and a relatively bright image is formed, whereas the back surface of the part 210 disturbs the illumination light. Reflection results in a relatively dark image. Further, portions other than the circle mark 302 and the component 20 (referred to as background) are darker images. Therefore, if the image of the circle mark 302 is binarized by a threshold value set so that the image of the circle mark 302 is bright and the part 20 and the background are dark, only the image of the circle mark 302 is acquired as a bright image. And the position of the circle mark 302 can be easily detected.
  • the fiducial mark camera 15 2 is imaged while being directly opposed to each of the circle marks 302, and the planned position of the center of the circle mark 302 (in this embodiment, the fiducial mark The direction and distance from the center of the imaging surface of the camera 152 are detected as misregistration.
  • a plurality of seek lines 310 are preset in the vicinity of the position where the image of the circle mark 302 should exist, and The boundary position between the light part and the dark part is obtained for the seek line 310.
  • the boundary position is the position of the outline of the circle mark 302, and the center of a plurality of boundary positions on the seek line 310 is calculated as the mark center position which is the center of the circle mark 302.
  • the reference mark camera 152 is positioned at the center of the four mark center positions, that is, at a position equidistant from the four mark center positions.
  • the fiducial mark camera 152 is positioned just above the mounting position and imaging is performed. It is done.
  • the epi-illumination device 244 is turned off and the illumination device 154 is turned on, and the imaging is performed. By illuminating the back surface of the component 20 from an oblique direction, the component 20 is obtained as a relatively bright image, but the reflected light of the substantially circular mirror mark 302 is not reflected.
  • the circle mark 302 becomes relatively long as shown in FIG. Therefore, if the image is binarized by an appropriately set threshold value, only the image on the back surface of the component 20 is obtained as a bright image. Image processing is performed on this image data, and the horizontal displacement of the component 20 is obtained based on the displacement in the imaging plane. Further, the inclination of the inspection board 300 is also calculated based on the four mark center positions, and the rotational displacement of the component 20 in the rotation direction is also calculated based on the inclination of the inspection board 300 and the inclination of the component 20. Is obtained. That is all The work of inspecting the accuracy of the mounting position of the ital is completed.
  • the inclination of the inspection substrate 300 is such that after the inspection substrate 300 is held by the wiring board holding device 18 via the inspection jig 304, of the many circle marks 402, The positions of the circle marks 302 at the two corners or the four corners of the inspection board 300 may be detected, and the positions may be calculated based on the detection results.
  • Fig. 15 and Fig. 16 show the detection results (Fig. 15 (a), (b)) when the same test board 300 is imaged from the back side, and the image from the front side (component mounting surface) side.
  • the detection results (Figs. 16 (a) and (b)) are shown in comparison.
  • FIG. 15 (a) and FIG. 16 (a) the detection results of the horizontal displacement of the mounting position of the component 20 are shown for each mounting direction.
  • the bar graphs in FIG. 15 (b) and FIG. 16 (b) show 3 ⁇ , which is the variation in the mounting position, in the X-axis direction and the Y-axis direction.
  • the component holding position is acquired based on the reflection image of the back surface of the component 20, and after mounting, the back surface of the reproduced component 20 is imaged and the mounting position is detected. Therefore, mounting accuracy can be more properly evaluated when imaging from the back side than when imaging from the front side.
  • the operation of turning over the inspection board 300 may be performed on the inspection board 300 discharged from the electronic circuit component mounting machine 10. Specifically, for example, if all the components 20 are mounted on the inspection board 300, they are conveyed downstream from the wiring board conveyor 16 in the same manner as the printed wiring board 14, and once the electronic circuit component mounting machine is mounted. Emitted from 10 If the inspection board 300 is mounted on a board jig 304 by an operator and the width of the wiring board conveyor 16 is adjusted, the board is set upstream of the electronic circuit component mounting machine 10. It is positioned by being fed transportable to the attachment space by the wiring board Konpeya 1 6 again. The use of the substrate jig 304 is not essential.
  • the jig is ejected from the wiring board conveyer 16 from the electronic circuit component mounting machine 10 and then turned over by the upside down device. Then, the electronic circuit component mounting machine 10 can be transported again to the work position, and the mounting position inspection can be fully automated.
  • the component mounting machine is of the XY robot type.
  • the component mounting machine may have another mode. For example, a plurality of component holding heads may be held by an intermittent rotating body. It may be a so-called index table type component mounting machine that mounts components.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne une machine de montage de pièces électroniques permettant d'inspecter la précision du montage de pièces. Un grand nombre de pièces (20) sont montées sur la surface ascendante de montage de pièces d'un substrat inspecté (300), le substrat inspecté (300) est constitué d'un matériau transparent, une bande autocollante double-face constituée d'un matériau transparent est collée sur la surface de montage de pièces et les pièces sont fixées par pression sur la bande autocollante double-face, des marques circulaires (302) sont formées sur un grand nombre de points grille sur le substrat inspecté (300) et les pièces (20) sont montées sur le substrat inspecté (300), sur des positions de montage déterminées qui sont situées à des distances égales de quatre marques circulaires (302) adjacentes l'une à l'autre, le substrat inspecté (300) est inversé et maintenu sur un dispositif de maintien d'un panneau de câblage (18) au moyen d'un gabarit d'inspection et les pièces (20) et les marques circulaires (302) situées autour d'elles sont mises en image par une caméra de repère (152) depuis le côté arrière des pièces à travers le substrat inspecté (300) et la bande autocollante double-face afin de détecter les positions des pièces (20) en fonction de la position relative des pièces (20) par rapport aux marques circulaires (302).
PCT/JP2003/010803 2002-08-29 2003-08-26 Machine de montage de pieces electroniques et procede permettant d'inspecter la precision de la position de montage Ceased WO2004021760A1 (fr)

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JP2002251698A JP4224268B2 (ja) 2002-08-29 2002-08-29 電子回路部品装着機、ならびにそれの装着位置精度検査方法および装置
JP2002-251698 2002-08-29

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WO2005089036A1 (fr) 2004-03-15 2005-09-22 Matsushita Electric Industrial Co., Ltd. Procede et equipement d’inspection de la precision de montage d’un composant
CN108279034A (zh) * 2018-02-13 2018-07-13 上海微世半导体有限公司 一种双面对位平台
CN110987969A (zh) * 2019-12-28 2020-04-10 珠海广浩捷科技股份有限公司 一种avs精度验证机
CN111543125A (zh) * 2018-02-12 2020-08-14 株式会社富士 安装精度测定用芯片及安装精度测定用套件
TWI777740B (zh) * 2021-08-23 2022-09-11 鴻勁精密股份有限公司 校正裝置、校正方法及其應用之作業機
TWI882116B (zh) * 2020-05-12 2025-05-01 日商Ｖ科技股份有限公司 零件封裝裝置及零件封裝方法

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JP4619896B2 (ja) * 2004-08-20 2011-01-26 パナソニック株式会社 基準位置決定方法及び基準位置決定装置並びに接合材料の印刷方法及び印刷装置
KR100570276B1 (ko) 2005-10-04 2006-04-11 (주)글로벌링크 이방성 도전필름의 압흔 검사방법
JP6014315B2 (ja) * 2011-09-30 2016-10-25 ヤマハ発動機株式会社 電子部品装着装置の測定方法
FR3004582B1 (fr) * 2013-04-11 2015-04-10 Vit Systeme et procede d'inspection optique de circuits electroniques
AT516417B1 (de) * 2014-10-29 2018-10-15 Zkw Group Gmbh Begrenzung für das Ablegen von elektronischen Bauteilen auf eine Unterlage
KR101874409B1 (ko) 2016-10-25 2018-07-04 에이피시스템 주식회사 얼라인 검사 장치 및 이를 이용한 얼라인 검사 방법
CN110364468B (zh) * 2019-06-21 2022-02-15 华南理工大学 一种适用于自动上料机构的led芯片定位方法
KR102800188B1 (ko) * 2020-07-09 2025-04-28 에스케이하이닉스 주식회사 테스트용 소켓과 이를 이용한 반도체 패키지 테스트 장치

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JP2000341000A (ja) * 1999-05-27 2000-12-08 Tenryu Technics Co Ltd 電子部品装着精度評価用治具および電子部品装着精度評価方法
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Publication number Priority date Publication date Assignee Title
WO2005089036A1 (fr) 2004-03-15 2005-09-22 Matsushita Electric Industrial Co., Ltd. Procede et equipement d’inspection de la precision de montage d’un composant
EP1727416A4 (fr) * 2004-03-15 2008-08-06 Matsushita Electric Industrial Co Ltd Procede et equipement d'inspection de la precision de montage d'un composant
US7483277B2 (en) 2004-03-15 2009-01-27 Panasonic Corporation Method and apparatus for inspecting component mounting accuracy
CN111543125A (zh) * 2018-02-12 2020-08-14 株式会社富士 安装精度测定用芯片及安装精度测定用套件
CN111543125B (zh) * 2018-02-12 2021-06-29 株式会社富士 安装精度测定用芯片及安装精度测定用套件
CN108279034A (zh) * 2018-02-13 2018-07-13 上海微世半导体有限公司 一种双面对位平台
CN108279034B (zh) * 2018-02-13 2024-04-12 上海微世半导体有限公司 一种双面对位平台
CN110987969A (zh) * 2019-12-28 2020-04-10 珠海广浩捷科技股份有限公司 一种avs精度验证机
TWI882116B (zh) * 2020-05-12 2025-05-01 日商Ｖ科技股份有限公司 零件封裝裝置及零件封裝方法
TWI777740B (zh) * 2021-08-23 2022-09-11 鴻勁精密股份有限公司 校正裝置、校正方法及其應用之作業機

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