WO2004097069A3 - Procede de preparation et d'utilisation de systemes a base de silicates afin de traiter des surfaces electroconductrices et produits obtenus a partir dudit procede - Google Patents
Procede de preparation et d'utilisation de systemes a base de silicates afin de traiter des surfaces electroconductrices et produits obtenus a partir dudit procede Download PDFInfo
- Publication number
- WO2004097069A3 WO2004097069A3 PCT/US2004/012676 US2004012676W WO2004097069A3 WO 2004097069 A3 WO2004097069 A3 WO 2004097069A3 US 2004012676 W US2004012676 W US 2004012676W WO 2004097069 A3 WO2004097069 A3 WO 2004097069A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrically conductive
- preparing
- silicate
- products obtained
- obtained therefrom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Treatment Of Metals (AREA)
- Silicates, Zeolites, And Molecular Sieves (AREA)
Abstract
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04760370A EP1618229A2 (fr) | 2003-04-25 | 2004-04-23 | Procede de preparation et d'utilisation de systemes a base de silicates afin de traiter des surfaces electroconductrices et produits obtenus a partir dudit procede |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46541403P | 2003-04-25 | 2003-04-25 | |
| US60/465,414 | 2003-04-25 | ||
| US51023003P | 2003-10-08 | 2003-10-08 | |
| US60/510,230 | 2003-10-08 | ||
| US52803403P | 2003-12-09 | 2003-12-09 | |
| US60/528,034 | 2003-12-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2004097069A2 WO2004097069A2 (fr) | 2004-11-11 |
| WO2004097069A3 true WO2004097069A3 (fr) | 2004-12-16 |
Family
ID=33425177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2004/012676 Ceased WO2004097069A2 (fr) | 2003-04-25 | 2004-04-23 | Procede de preparation et d'utilisation de systemes a base de silicates afin de traiter des surfaces electroconductrices et produits obtenus a partir dudit procede |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20040222105A1 (fr) |
| EP (1) | EP1618229A2 (fr) |
| WO (1) | WO2004097069A2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103180488A (zh) * | 2010-11-05 | 2013-06-26 | 麦克德米德尖端有限公司 | 暗色铬基电沉积物 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060079409A1 (en) * | 2004-09-08 | 2006-04-13 | Omniseal, Inc. | Complex mixtures of ions and processes for deposition |
| US20060049383A1 (en) * | 2004-09-08 | 2006-03-09 | Omniseal, Inc. | Complex mixtures of ions and processes for deposition |
| EP1712659A1 (fr) * | 2005-04-11 | 2006-10-18 | Elisha Holding LLC | Article résistant à la corrosion et méthode pour sa production |
| WO2008073887A2 (fr) * | 2006-12-11 | 2008-06-19 | Elisha Holding, Llc | Procédé de traitement de surfaces métalliques avec un courant électrique alternatif |
| EP2186928A1 (fr) * | 2008-11-14 | 2010-05-19 | Enthone, Inc. | Procédé pour le post-traitement des couches métalliques |
| DE102011002836A1 (de) | 2011-01-18 | 2012-07-19 | Henkel Ag & Co. Kgaa | Vorbehandlung von Weißblech vor einer Lackierung |
| DE102011002837A1 (de) | 2011-01-18 | 2012-07-19 | Henkel Ag & Co. Kgaa | Mehrstufige Vorbehandlung von Weißblech vor einer Lackierung |
| MX350444B (es) * | 2012-12-19 | 2017-09-06 | Mabe S A De C V * | Recubrimiento de facil limpieza aplicado en superficies metalicas de acero inoxidable empleadas en la fabricacion de electrodomesticos. |
| CN111742078B (zh) | 2017-12-21 | 2023-07-04 | 埃科莱布美国股份有限公司 | 无荧光的经涂黑光学组件 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149794A (en) * | 1997-01-31 | 2000-11-21 | Elisha Technologies Co Llc | Method for cathodically treating an electrically conductive zinc surface |
| US6153080A (en) * | 1997-01-31 | 2000-11-28 | Elisha Technologies Co Llc | Electrolytic process for forming a mineral |
| US6322687B1 (en) * | 1997-01-31 | 2001-11-27 | Elisha Technologies Co Llc | Electrolytic process for forming a mineral |
| US20020012804A1 (en) * | 1997-01-31 | 2002-01-31 | Heimann Robert L. | Electrolytic process for treating a conductive surface and products formed thereby |
| US20020054998A1 (en) * | 1997-01-31 | 2002-05-09 | Heimann Robert L. | Energy enhanced process for treating a conductive surface and products formed thereby |
| US20030209290A1 (en) * | 2001-08-03 | 2003-11-13 | Heimann Robert L. | Process for treating a conductive surface and products formed thereby |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1199089A (en) * | 1967-11-22 | 1970-07-15 | Nippon Kokan Kk | A Method of Electrolytically Treating Metal Articles |
| US3988216A (en) * | 1975-10-15 | 1976-10-26 | National Steel Corporation | Method of producing metal strip having a galvanized coating on one side while preventing the formation of a zinc deposit on cathode means |
| US3989604A (en) * | 1975-10-15 | 1976-11-02 | National Steel Corporation | Method of producing metal strip having a galvanized coating on one side |
| IT1203794B (it) * | 1986-06-06 | 1989-02-23 | Rinetto Collini | Elettrodeposizione del rame,o altri metalli,su elettrodi di piombo bipolari |
| JP3160238B2 (ja) * | 1997-08-04 | 2001-04-25 | 岸本産業株式会社 | 半導体デバイス製造プロセス用および液晶デバイス製造プロセス用洗浄剤 |
| US6620519B2 (en) * | 1998-04-08 | 2003-09-16 | Lockheed Martin Corporation | System and method for inhibiting corrosion of metal containers and components |
| DE69934780T2 (de) * | 1998-11-08 | 2007-10-18 | Jfe Steel Corp. | Oberflächenbehandeltes stahlblech mit hervorragendem korrosionwiderstand |
-
2004
- 2004-04-23 US US10/831,581 patent/US20040222105A1/en not_active Abandoned
- 2004-04-23 WO PCT/US2004/012676 patent/WO2004097069A2/fr not_active Ceased
- 2004-04-23 EP EP04760370A patent/EP1618229A2/fr not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6149794A (en) * | 1997-01-31 | 2000-11-21 | Elisha Technologies Co Llc | Method for cathodically treating an electrically conductive zinc surface |
| US6153080A (en) * | 1997-01-31 | 2000-11-28 | Elisha Technologies Co Llc | Electrolytic process for forming a mineral |
| US6258243B1 (en) * | 1997-01-31 | 2001-07-10 | Elisha Technologies Co Llc | Cathodic process for treating an electrically conductive surface |
| US6322687B1 (en) * | 1997-01-31 | 2001-11-27 | Elisha Technologies Co Llc | Electrolytic process for forming a mineral |
| US20010050231A1 (en) * | 1997-01-31 | 2001-12-13 | Heimann Robert L. | Aqueous electrolytic medium |
| US20020012804A1 (en) * | 1997-01-31 | 2002-01-31 | Heimann Robert L. | Electrolytic process for treating a conductive surface and products formed thereby |
| US20020054998A1 (en) * | 1997-01-31 | 2002-05-09 | Heimann Robert L. | Energy enhanced process for treating a conductive surface and products formed thereby |
| US20030178317A1 (en) * | 1997-01-31 | 2003-09-25 | Heimann Robert I. | Energy enhanced process for treating a conductive surface and products formed thereby |
| US20030209290A1 (en) * | 2001-08-03 | 2003-11-13 | Heimann Robert L. | Process for treating a conductive surface and products formed thereby |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103180488A (zh) * | 2010-11-05 | 2013-06-26 | 麦克德米德尖端有限公司 | 暗色铬基电沉积物 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20040222105A1 (en) | 2004-11-11 |
| WO2004097069A2 (fr) | 2004-11-11 |
| EP1618229A2 (fr) | 2006-01-25 |
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