WO2004096513A2 - Metal-plastic composite component and methods for the production thereof - Google Patents
Metal-plastic composite component and methods for the production thereof Download PDFInfo
- Publication number
- WO2004096513A2 WO2004096513A2 PCT/EP2004/004461 EP2004004461W WO2004096513A2 WO 2004096513 A2 WO2004096513 A2 WO 2004096513A2 EP 2004004461 W EP2004004461 W EP 2004004461W WO 2004096513 A2 WO2004096513 A2 WO 2004096513A2
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- WO
- WIPO (PCT)
- Prior art keywords
- component
- conductor comb
- peninsula
- contact surfaces
- comb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14409—Coating profiles or strips by injecting end or corner or intermediate parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- Metal-plastic composite component and method for its production
- the invention relates to a metal-plastic composite component with a conductor comb for fitting with at least one electronic component, the at least one electronic component comprising at least one SMD component, in particular with layer-shaped contacts, and wherein the conductor comb has at least two electrically conductive carrier strips, each of which Have at least one peninsular contact surface for mechanical fastening and electrical contacting of the SMD component, in particular one of the layer-shaped electrical contacts, and suitable methods for producing such a metal-plastic composite component.
- Such metal-plastic composite components are known from DE 196 40 255 A1, which discloses a method for producing an electrical module with a plastic-molded lead frame.
- the punched leadframe is provided with solder paste and equipped with components.
- the components are attached by reflow soldering.
- a bending process on the leadframe can take place directly after punching or only after soldering.
- the lead frame, including the components is then overmolded in a first phase, with niches remaining in the first plastic injection molded part for inserting extra parts.
- a permanent magnet is mentioned as an extra part.
- the first plastic injection molded part is then overmolded in a second phase.
- the contacts between the soldered components and the leadframe can be damaged or torn off due to the spray pressure. Deformation of the lead frame with undesired contact formation between the conductor tracks of the lead frame can also occur.
- metal-plastic composite components tend to fatigue due to temperature changes, which can lead to the contacts shearing off. It is now the object of the invention to provide metal-plastic composite components which withstand thermal cycling in the range between -50 ° C to + 150 ° C and to eliminate such problems when encapsulating conductor combs equipped with electronic components and a suitable metal-plastic - Specify composite component and suitable processes for its production.
- the carrier strips have elastic structures in their areas adjacent to the peninsula-shaped contact surfaces, which have a higher elasticity than the rest of the conductor comb.
- the metal-plastic composite components according to the invention have proven themselves for use in the range from -50 ° C. to + 150 ° C. against temperature fluctuations.
- the different coefficients of thermal expansion of the carrier strip and the injection molded plastic part lead to a load in the area of the connection between the electronic components and the carrier strip when the composite component is heated, which means a further source of danger for damage to the electrical connection.
- the elastic structures are suitable for absorbing the different thermal expansion of the carrier strips compared to the plastic injection molding and for relieving the connection areas between the conductor comb and the components.
- the area of the peninsula-shaped contact surfaces is supported against the injection molding tool.
- Arrangements for supporting the conductor comb in the area of the peninsula-shaped contact surfaces or the elastic structures against the injection mold can protect the conductor comb or the connection to the electrical component from deformation by the injection pressure with one or more support elements between the injection mold and the peninsula-shaped contact surfaces or the elastic structures. Adequate deformation of the conductor comb leads to damage to the electrical contact or to damage to the electrical component. Support elements can be attached to the injection mold as well as to the metal-plastic composite component for this purpose, but do not necessarily have to.
- the object is achieved in that in the region of the peninsula-shaped contact surfaces at least one support element is arranged on the peninsula-shaped contact surfaces and is mechanically fixed to the conductor comb in such a way that the support element rises above the peninsula-shaped contact surfaces.
- the support element is only partially covered by the injection molded plastic part.
- At least one support element is arranged perpendicular to the peninsula-shaped contact surfaces; the at least one support element is formed from the material of the carrier strips; at least one support element is designed as a separate part fastened to the conductor comb;
- a support element is arranged on a peninsula-shaped contact surface; in particular the support elements are each in the form of a tab; and / or the support elements are arranged parallel to one another and at the same height; the carrier strips have, in their regions adjoining the peninsula-shaped contact surfaces, elastic structures which have a higher elasticity than the rest of the conductor comb; in particular the elastic structure by at least one omega-shaped and / or at least one S-shaped and / or one Z-shaped and / or at least one L-shaped and / or at least one V-shaped and / or at least one U-shaped and / or at least one multiply kinked area is formed; and / or the carrier strips have a smaller cross-section in the area of the elastic structure than in the area of the peninsula-shaped contact areas.
- preferred production methods include the following steps, in particular if the at least one support element is formed from the material of the carrier strips:
- the support element does not have to be in contact over the entire spraying process, but at least at the beginning.
- the support element rests against a wall of the injection mold when the conductor comb is overmolded and provides support for the conductor comb during spraying, so that deformation due to pressure fluctuations and flow processes when filling the injection mold and curing the plastic is largely suppressed.
- the area of the support element which bears against the wall of the injection mold is not covered by the plastic injection molded part formed. This simple design measure protects the contact areas between the electronic components and the conductor comb and effectively protects them from damage.
- the support element can rise from the plane determined by two spatial axes, in which the semi-island-shaped contact surface is located, in different ways or project in the direction of the third spatial axis.
- the at least one support element is arranged perpendicular to the peninsula-shaped contact surfaces. Tilting or slipping of the support element with respect to the wall of the injection mold during the injection molding process, as could occur, for example, with a support element which is arranged at an angle unequal to 90 ° with respect to the plane in which a peninsular contact surface is located avoided with it.
- the conductor comb is preferably formed from materials such as copper, copper alloys or steel, which can be processed in a simple manner by means of a stamping process.
- the carrier strips have elastic structures in their areas adjacent to the peninsula-shaped contact surfaces that have a higher structure Have elasticity than the rest of the conductor comb.
- the different coefficients of thermal expansion of the carrier strip and the injection molded plastic part cause a load in the area of the connection between the electronic components and the carrier strip when the composite component is heated, which means a further source of danger for damage to the electrical connection.
- the elastic structures are suitable for absorbing the higher thermal expansion compared to the plastic strip compared to the carrier strips and for relieving the connection areas between the conductor comb and the components. It has proven effective if the at least one support element is formed from the material of the carrier strips. However, it is equally possible to design the at least one support element as a separate part fastened on the conductor comb.
- a support element is preferably arranged on a respective peninsula-shaped contact surface, so that the support strips are optimally supported in the injection mold.
- the support elements are preferably each in the form of a tab.
- the support elements are arranged parallel to one another and at the same height. However, they can also be arranged in a different way, e.g. offset from each other.
- the elastic structure has at least one omega-shaped and / or at least one S-shaped and / or at least one Z-shaped and / or at least one L-shaped and / or at least one V-shaped and / or at least one U-shaped and / or at least one multiply kinked area is formed.
- the metal strips have a smaller cross-section in the area of the elastic structure than in the area of the peninsula-shaped contact areas. This results in an additional increase in elasticity in this area.
- the object for a first method for producing a metal-plastic composite component, in which the at least one support element is formed from the material of the carrier strips is achieved with the following steps:
- the object is achieved for a second preferred method for producing a metal-plastic composite component, in which the at least one support element is designed as a separate part fastened to the conductor comb, with the following steps: Forming the at least one support element in the area of the peninsula-shaped contact surfaces, the at least one support element being mechanically fixed to the conductor comb,
- the at least one support element is formed by pre-molding a part of the conductor comb with plastic.
- the at least one support element can also be plugged onto the conductor comb or clamped or glued or riveted.
- a conductor comb is equipped with at least one electronic component, the at least one electronic component comprising at least one SMD component with layered electrical contacts, and wherein the conductor comb has at least two electrically conductive carrier strips, each of which has at least one peninsula-shaped contact surface for mechanical fastening and electrical contacting of one of the layer-shaped electrical contacts of the SMD component, and wherein the carrier strips have elastic structures in their regions adjacent to the peninsula-shaped contact surfaces, which have a higher elasticity than the rest of the conductor comb, solved with the following steps:
- the injection tool having at least one support element which touches the conductor comb in the region of the peninsula-shaped contact surfaces or the elastic structures, overmoulding parts of the assembled conductor comb and at least the at least one SMD component with a plastic and
- Light soldering has proven to be a particularly good process for permanently and mechanically firmly and gently connecting the electronic components to the conductor comb.
- SMD components are called "surface mounted device”. SMD components are electronic components that can have a resistor, a capacitor or an inductor, such as resistors, capacitors, inductors, LEDs, ICs, transistors or diodes. These can have layered electrical contacts.
- FIGS. 1 to 4a are intended to explain the metal-plastic composite component according to the invention and the method according to the invention by way of example.
- FIG. 1 shows a conductor comb with two carrier strips
- FIG. 2 shows the conductor comb from FIG. 1 after a bending process in a three-dimensional view
- FIG. 3 shows the conductor comb from FIG. 2 with an SMD component mounted thereon in three dimensions
- FIG. 4 a metal-plastic composite component with conductor comb and SMD component from FIG. 3 in a three-dimensional view including hidden lines
- FIG. 4a the metal-plastic composite component from FIG. 4 without hidden lines.
- Figure 1 shows the conductor comb 2, which is formed from two carrier strips 2a, 2b made of CuSn ⁇ , which were punched out of a metal strip.
- the carrier strips 2a, 2b each have a peninsular contact surface 2c, 2d.
- the carrier strips 2a, 2b have elastic structures 2e, 2f in their regions adjacent to the peninsula-shaped contact surfaces 2c, 2d, which have a higher elasticity than the rest of the conductor comb 2. This becomes achieved by reducing the cross section of the carrier strips 2a, 2b in the region of the elastic structures 2e, 2f and also by 90 ° bending.
- FIG. 2 shows the conductor comb 2 from FIG. 1 after a bending process in a three-dimensional view.
- the edges of the peninsula-shaped contact surfaces 2c, 2d were bent such that a support element 6a, 6b was formed perpendicular to the peninsula-shaped contact surfaces 2c, 2d from the material of the carrier strips 2a, 2b.
- FIG. 3 shows the conductor comb 2 from FIG. 2 with an SMD component 3 mounted thereon in a three-dimensional view.
- the SMD component 3 has layered electrical contacts 4a, 4b, which are each electrically and mechanically firmly connected to one of the peninsula-shaped contact surfaces 2c, 2d. This is preferably done with the aid of a solder paste that is applied to the peninsula-shaped contact surfaces 2c, 2d, placing the SMD component 3 on the solder paste and connecting the peninsula-shaped contact surfaces 2c, 2d and the layer-shaped electrical contacts 4a, 4b by light soldering.
- FIG. 4 shows a metal-plastic composite component 1 with the conductor comb 2 and the SMD component 3 from FIG. 3 in a three-dimensional view including hidden lines (shown in dashed lines).
- the SMD component 3 and parts of the conductor comb 2 were overmolded with a plastic injection-molded part 5, parts of the support elements 6a, 6b not being covered by the plastic injection-molded part 5.
- the conductor comb 2, including the SMD component 3 is inserted into an injection molding tool in such a way that the supporting elements 6a, 6b rest against a wall of the injection molding tool and support the conductor comb 2 against the wall during the injection molding process.
- Warping, warping or bending of the conductor comb 2 while the liquid plastic is being shot into the injection mold to form the plastic injection molded part 5 is thus effectively reduced or avoided.
- the connection between the layer-shaped, electrical contacts 4a, 4b of the SMD component 3 and the peninsula-shaped contact surfaces 2c, 2d is thereby protected and possible faults in the electrical contact are avoided.
- FIG. 4a shows the metal-plastic composite component 1 from FIG. 4 without hidden lines. It can now be seen more clearly that the regions of the support elements 6a, 6b that were pressed against a wall in the injection mold during the injection process are not covered with the plastic injection-molded part 5.
- the support elements 6a, 6b arranged in the region of the peninsula-shaped contact surfaces 2c, 2d and / or elastic regions it is also possible, for example, to use those which are arranged in the injection mold in such a way that after removal of the metal-plastic composite component 1 from the injection mold there is a The opening in the area of the plastic injection-molded part 5 remains, where the support elements 6a, 6b are located in FIG. 4 or 4a. A part of the peninsula-shaped contact surfaces 2c, 2d and / or elastic regions would then be recognizable through these openings.
- FIGS. 1 to 4a merely represent exemplary embodiments which can be varied within wide limits without leaving the scope of the invention.
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Abstract
Description
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Metall-Kunststoff-Verbundbauteil und Verfahren zu dessen HerstellungMetal-plastic composite component and method for its production
Die Erfindung betrifft ein Metall-Kunststoff-Verbundbauteil mit einem Leiterkamm zur Bestückung mit mindestens einem elektronischen Bauteil, wobei das mindestens eine elektronische Bauteil mindestens ein SMD-Bauteil umfasst, insbesondere mit schichtformigen Kontakten und wobei der Leiterkamm mindestens zwei elektrisch leitende Trägerstreifen aufweist, die jeweils mindestens eine halbinselförmige Kontaktfläche zur mechanischen Befestigung und elektrischen Kontaktierung des SMD-Bauteils aufweisen, insbesondere eines der schichtformigen elektrischen Kontakte, und geeignete Verfahren zur Herstellung eines solchen Metall-Kunststoff-Verbundbauteils.The invention relates to a metal-plastic composite component with a conductor comb for fitting with at least one electronic component, the at least one electronic component comprising at least one SMD component, in particular with layer-shaped contacts, and wherein the conductor comb has at least two electrically conductive carrier strips, each of which Have at least one peninsular contact surface for mechanical fastening and electrical contacting of the SMD component, in particular one of the layer-shaped electrical contacts, and suitable methods for producing such a metal-plastic composite component.
Derartige Metall-Kunststoff-Verbundbauteile sind aus der DE 196 40 255 A1 bekannt, die ein Verfahren zur Herstellung eines elektrischen Moduls mit einem kunststoffumspritzten Leadframe offenbart. Der gestanzte Leadframe wird mit Lötpaste versehen und mit Bauelementen bestückt. Die Befestigung der Bauelemente erfolgt durch Reflow-Löten. Ein Biegevorgang am Leadframe kann direkt nach dem Stanzen oder erst nach dem Löten erfolgen. Daraufhin erfolgt das Umspritzen des Leadframes inklusive der Bauelemente in einer ersten Phase, wobei im gebildeten ersten Kunststoffspritzteil Nischen zum Einlegen von Extrateilen verbleiben. Als Extrateil wird dabei ein Dauermagnet genannt. Das erste Kunststoffspritzteil wird dann in einer zweiten Phase endumspritzt. Bereits beim Umspritzen des Leadframes in der ersten Phase können aufgrund des Spritzdrucks die Kontakte zwischen den aufgelöteten Bauelementen und dem Leadframe beschädigt oder abgerissen werden. Auch Deformierungen des Leadframes mit ungewünschter Kontaktausbildung zwischen den Leiterbahnen des Leadframes können auftreten.Such metal-plastic composite components are known from DE 196 40 255 A1, which discloses a method for producing an electrical module with a plastic-molded lead frame. The punched leadframe is provided with solder paste and equipped with components. The components are attached by reflow soldering. A bending process on the leadframe can take place directly after punching or only after soldering. The lead frame, including the components, is then overmolded in a first phase, with niches remaining in the first plastic injection molded part for inserting extra parts. A permanent magnet is mentioned as an extra part. The first plastic injection molded part is then overmolded in a second phase. When the leadframe is overmolded in the first phase, the contacts between the soldered components and the leadframe can be damaged or torn off due to the spray pressure. Deformation of the lead frame with undesired contact formation between the conductor tracks of the lead frame can also occur.
Derartige Metall-Kunststoff-Verbundbauteile neigen durch Temperaturwechselbeanspruchung zur Materialermüdung, die bis zum Abscheren der Kontakte führen kann. Es ist nun die Aufgabe der Erfindung, Metall-Kunststoff-Verbundbauteile bereitzustellen, die Temperaturwechselbelastungen im Bereich zwischen -50°C bis +150°C standhalten und derartige Probleme beim Umspritzen von mit elektronischen Bauteilen bestückten Leiterkämmen zu beseitigen und ein dazu geeignetes Metall-Kunststoff-Verbundbauteil sowie geeignete Verfahren zu dessen Herstellung anzugeben.Such metal-plastic composite components tend to fatigue due to temperature changes, which can lead to the contacts shearing off. It is now the object of the invention to provide metal-plastic composite components which withstand thermal cycling in the range between -50 ° C to + 150 ° C and to eliminate such problems when encapsulating conductor combs equipped with electronic components and a suitable metal-plastic - Specify composite component and suitable processes for its production.
Zur Lösung der Aufgabe weisen die Trägerstreifen in ihren an die halbinselformigen Kontaktflächen angrenzenden Bereiche elastische Strukturen auf, die eine höhere Elastizität aufweisen als der übrige Leiterkamm. Die erfindungsgemäßen Metall-Kunststoff-Verbundbauteile haben sich für einen Einsatz im Bereich -50°C bis +150°C gegen Temperaturschwankungen bewährt. Die unterschiedlichen Wärmeausdehnungskoeffizienten von Trägerstreifen und Kunststoff- Spritzteil führen nämlich bei Erwärmung des Verbundbauteils zu einer Belastung im Bereich der Verbindung zwischen den elektronischen Bauteilen und den Trägerstreifen, was eine weitere Gefahrenquelle für eine Beschädigung der elektrischen Verbindung bedeutet. Die elastischen Strukturen sind dazu geeignet, die im Vergleich zum Kunststoff-Spritzgussteil unterschiedliche Wärmedehnung der Trägerstreifen aufzufangen und die Verbindungsbereiche zwischen Leiterkamm und Bauelementen zu entlasten.To achieve the object, the carrier strips have elastic structures in their areas adjacent to the peninsula-shaped contact surfaces, which have a higher elasticity than the rest of the conductor comb. The metal-plastic composite components according to the invention have proven themselves for use in the range from -50 ° C. to + 150 ° C. against temperature fluctuations. The different coefficients of thermal expansion of the carrier strip and the injection molded plastic part lead to a load in the area of the connection between the electronic components and the carrier strip when the composite component is heated, which means a further source of danger for damage to the electrical connection. The elastic structures are suitable for absorbing the different thermal expansion of the carrier strips compared to the plastic injection molding and for relieving the connection areas between the conductor comb and the components.
Zur Herstellung des Metall-Kunststoff-Verbundbauteils wird der Bereich der halbinselformigen Kontaktflächen gegen das Spritzgusswerkzeug abgestützt.To produce the metal-plastic composite component, the area of the peninsula-shaped contact surfaces is supported against the injection molding tool.
Das Abstützen des Leiterkamms im Bereich der halbinselformigen Kontaktflächen oder der elastischen Strukturen gegen das Spritzwerkzeug schützt den Leiterkamm und die Verbindung zum elektrischen Bauteil vor Verformung durch den Spritzdruck.Supporting the conductor comb in the area of the peninsula-shaped contact surfaces or the elastic structures against the injection mold protects the conductor comb and the connection to the electrical component from deformation due to the injection pressure.
Anordnungen zum Abstützen des Leiterkamms im Bereich der halbinselformigen Kontaktflächen oder der elastischen Strukturen gegen das Spritzwerkzeug können mit einem oder mehreren Stützelementen zwischen dem Spritzwerkzeug und den halbinselformigen Kontaktflächen oder den elastischen Strukturen den Leiterkamm oder die Verbindung zum elektrischen Bauteil vor Deformation durch den Spritzdruck bewahren. Eine hinreichende Deformation des Leiterkamms führt zur Beschädigung der elektrischen Kontaktierung oder zur Beschädigung des elektrischen Bauteils. Stützelemente können hierfür sowohl am Spritzwerkzeug als auch am Metall-Kunststoff-Verbundbauteil befestigt sein, müssen dies aber nicht zwangsläufig. In einer bevorzugten Ausführung wird die Aufgabe dadurch gelöst, dass im Bereich der halbinselformigen Kontaktflächen mindestens ein Stützelement an den halbinselformigen Kontaktflächen derart angeordnet und mechanisch fest mit dem Leiterkamm verbunden ist, dass sich das Stützelement über die halbinselformigen Kontaktflächen erhebt. Vorzugsweise wird das Stützelement nur teilweise von dem Kunststoff-Spritzteil bedeckt.Arrangements for supporting the conductor comb in the area of the peninsula-shaped contact surfaces or the elastic structures against the injection mold can protect the conductor comb or the connection to the electrical component from deformation by the injection pressure with one or more support elements between the injection mold and the peninsula-shaped contact surfaces or the elastic structures. Adequate deformation of the conductor comb leads to damage to the electrical contact or to damage to the electrical component. Support elements can be attached to the injection mold as well as to the metal-plastic composite component for this purpose, but do not necessarily have to. In a preferred embodiment, the object is achieved in that in the region of the peninsula-shaped contact surfaces at least one support element is arranged on the peninsula-shaped contact surfaces and is mechanically fixed to the conductor comb in such a way that the support element rises above the peninsula-shaped contact surfaces. Preferably, the support element is only partially covered by the injection molded plastic part.
Diesbezügliche Metall-Kunststoff-Verbundbauteile sind besonders vorteilhaft ausgeführt, wenn das mindestens eine Stützelement senkrecht zu den halbinselformigen Kontaktflächen angeordnet ist; das mindestens eine Stützelement aus Material der Trägerstreifen gebildet ist; mindestens eine Stützelement als ein auf dem Leiterkamm befestigtes separates Teil ausgebildet ist;Relevant metal-plastic composite components are particularly advantageous if the at least one support element is arranged perpendicular to the peninsula-shaped contact surfaces; the at least one support element is formed from the material of the carrier strips; at least one support element is designed as a separate part fastened to the conductor comb;
- je ein Stützelement an je einer halbinselformigen Kontaktfläche angeordnet ist; insbesondere die Stützelemente jeweils in Form einer Lasche ausgebildet sind; und/oder die Stützelemente parallel zueinander und auf gleicher Höhe angeordnet sind; die Trägerstreifen in ihren an die halbinselformigen Kontaktflächen angrenzenden Bereichen eleastische Strukturen aufweisen, die eine höhere Elastizität aufweisen als der übrige Leiterkamm; insbesondere die elastische Struktur durch mindestens einen omega- förmigen und/oder mindestens einen S-förmigen und/oder einen Z-förmigen und/oder mindestens einen L-förmigen und/oder mindestens einen V-förmigen und/oder mindestens einen U-förmigen und/oder mindestens einen mehrfach geknickten Bereich gebildet ist; und /oder die Trägerstreifen im Bereich der elastischen Struktur einen geringeren Querschnitt aufweisen, als im Bereich der halbinselformigen Kontaktflächen.- A support element is arranged on a peninsula-shaped contact surface; in particular the support elements are each in the form of a tab; and / or the support elements are arranged parallel to one another and at the same height; the carrier strips have, in their regions adjoining the peninsula-shaped contact surfaces, elastic structures which have a higher elasticity than the rest of the conductor comb; in particular the elastic structure by at least one omega-shaped and / or at least one S-shaped and / or one Z-shaped and / or at least one L-shaped and / or at least one V-shaped and / or at least one U-shaped and / or at least one multiply kinked area is formed; and / or the carrier strips have a smaller cross-section in the area of the elastic structure than in the area of the peninsula-shaped contact areas.
Diesbezüglich umfassen bevorzugte Herstellungsverfahren insbesondere wenn das mindestens eine Stützelement aus Material der Trägerstreifen gebildet ist, folgende Schritte:In this regard, preferred production methods include the following steps, in particular if the at least one support element is formed from the material of the carrier strips:
Bestücken des Leiterkamms mit dem mindestens einen elektronischen Bauteil,Equipping the conductor comb with the at least one electronic component,
- Anordnen des bestückten Leiterkamms in einem Spritzgusswerkzeug derart, dass das mindestens eine Stützelement an mindestens einer Wandung des Spritzgusswerkzeuges anliegt, undArranging the assembled conductor comb in an injection molding tool such that the at least one support element rests on at least one wall of the injection molding tool, and
Spritzen des Kunststoffspritzteils.Injection molding of the molded plastic part.
Das Anliegen des Stützelementes ist nicht über den gesamten Spritzvorgang erforderlich, aber zumindest an dessen Anfang. In einer bevorzugten Ausführung liegt das Stützelement beim Umspritzen des Leiterkammes an einer Wandung der Spritzgussform an und sorgt für eine Abstützung des Leiterkammes während des Spritzens, so dass eine Verformung aufgrund Druckschwankungen und Strömungsvorgängen beim Füllen der Spritzgussform sowie beim Aushärten des Kunststoffes weitgehend unterdrückt wird. Der an der Wandung der Spritzgussform anliegende Bereich des Stützelements wird dabei nicht von dem gebildeten Kunststoff-Spritzteil bedeckt. Durch diese einfache konstruktive Maßnahme werden die Kontaktbereiche zwischen den elektronischen Bauteilen und dem Leiterkamm geschont und effektiv vor Beschädigung geschützt. Das Stützelement kann sich dabei aus der durch zwei Raumachsen bestimmten Ebene, in welcher sich die halb- inselförmige Kontaktfläche befindet, in unterschiedlicher Art und Weise erheben bzw. in Richtung der dritten Raumachse ragen.The support element does not have to be in contact over the entire spraying process, but at least at the beginning. In a preferred embodiment, the support element rests against a wall of the injection mold when the conductor comb is overmolded and provides support for the conductor comb during spraying, so that deformation due to pressure fluctuations and flow processes when filling the injection mold and curing the plastic is largely suppressed. The area of the support element which bears against the wall of the injection mold is not covered by the plastic injection molded part formed. This simple design measure protects the contact areas between the electronic components and the conductor comb and effectively protects them from damage. The support element can rise from the plane determined by two spatial axes, in which the semi-island-shaped contact surface is located, in different ways or project in the direction of the third spatial axis.
Besonders bevorzugt ist es dabei, wenn das mindestens eine Stützelement senkrecht zu den halbinselformigen Kontaktflächen angeordnet ist. Ein Verkippen oder Verrutschen des Stützelements im Hinblick auf die Wandung der Spritzgussform beim Spritzvorgang, wie es beispielsweise bei einem Stützelement vorkommen könnte, das in Bezug auf die Ebene, in der sich eine halbinselförmige Kontaktfläche befindet, in einem Winkel ungleich 90° angeordnet ist, wird damit vermieden.It is particularly preferred if the at least one support element is arranged perpendicular to the peninsula-shaped contact surfaces. Tilting or slipping of the support element with respect to the wall of the injection mold during the injection molding process, as could occur, for example, with a support element which is arranged at an angle unequal to 90 ° with respect to the plane in which a peninsular contact surface is located avoided with it.
Der Leiterkamm ist vorzugsweise aus Materialien wie Kupfer, Kupferlegierungen oder Stahl gebildet, die sich in einfacher Art und Weise durch einen Stanzvorgang bearbeiten lassen.The conductor comb is preferably formed from materials such as copper, copper alloys or steel, which can be processed in a simple manner by means of a stamping process.
Wenn ein Einsatz des gebildeten Metall-Kunststoff-Verbundbauteil bei Temperaturen im Bereich von - 40°C bis + 150°C erfolgen soll, hat es sich bewährt, wenn die Trägerstreifen in ihren an die halbinselformigen Kontaktflächen angrenzenden Bereichen elastische Strukturen aufweisen, die eine höhere Elastizität aufweisen als der übrige Leiterkamm. Die unterschiedlichen Wärmeausdehnungskoeffizienten von Trägerstreifen und Kunststoff-Spritzteil führen nämlich bei Erwärmung des Verbundbauteils zu einer Belastung im Bereich der Verbindung zwischen den elektronischen Bauteilen und den Trägerstreifen, was eine weitere Gefahrenquelle für eine Beschädigung der elektrischen Verbindung bedeutet. Die elastischen Strukturen sind dazu geeignet, die im Vergleich zum Kunststoff-Spritzgussteil höhere Wärmedehnung gegenüber den Trägerstreifen aufzufangen und die Verbindungsbereiche zwischen Leiterkamm und Bauelementen zu entlasten. Es hat sich bewährt, wenn das mindestens eine Stützelement aus Material der Trägerstreifen gebildet ist. Genauso ist es aber möglich, das mindestens eine Stützelement als ein auf dem Leiterkamm befestigtes separates Teil auszubilden.If the metal-plastic composite component formed is to be used at temperatures in the range from -40 ° C. to + 150 ° C., it has proven to be useful if the carrier strips have elastic structures in their areas adjacent to the peninsula-shaped contact surfaces that have a higher structure Have elasticity than the rest of the conductor comb. The different coefficients of thermal expansion of the carrier strip and the injection molded plastic part cause a load in the area of the connection between the electronic components and the carrier strip when the composite component is heated, which means a further source of danger for damage to the electrical connection. The elastic structures are suitable for absorbing the higher thermal expansion compared to the plastic strip compared to the carrier strips and for relieving the connection areas between the conductor comb and the components. It has proven effective if the at least one support element is formed from the material of the carrier strips. However, it is equally possible to design the at least one support element as a separate part fastened on the conductor comb.
Vorzugsweise wird je ein Stützelement an je einer halbinselformigen Kontaktfläche angeordnet, damit eine optimale Abstützung der Trägerstreifen in der Spritzgussform erreicht wird.A support element is preferably arranged on a respective peninsula-shaped contact surface, so that the support strips are optimally supported in the injection mold.
Die Stützelemente werden dabei vorzugsweise jeweils in Form einer Lasche ausgebildet.The support elements are preferably each in the form of a tab.
Auch hat es sich bewährt, wenn die Stützelemente parallel zueinander und auf gleicher Höhe angeordnet sind. Sie können aber auch in einer anderen Art und Weise angeordnet sein, z.B. versetzt zueinander.It has also proven useful if the support elements are arranged parallel to one another and at the same height. However, they can also be arranged in a different way, e.g. offset from each other.
Für die elastische Struktur hat es sich bewährt, wenn diese durch mindestens einen Omega- förmigen und/oder mindestens einen S-förmigen und/oder mindestens einen Z-förmigen und/oder mindestens einen L-förmigen und/oder mindestens einen V-förmigen und/oder mindestens einen U-förmigen und /oder mindestens einen mehrfach geknickten Bereich gebildet ist.It has proven useful for the elastic structure if it has at least one omega-shaped and / or at least one S-shaped and / or at least one Z-shaped and / or at least one L-shaped and / or at least one V-shaped and / or at least one U-shaped and / or at least one multiply kinked area is formed.
Besonders bevorzugt ist es dabei, wenn die Metallstreifen im Bereich der elastischen Struktur einen geringeren Querschnitt aufweisen als im Bereich der halbinselformigen Kontaktflächen. Dadurch wird eine zusätzliche Erhöhung der Elastizität in diesem Bereich erreicht.It is particularly preferred if the metal strips have a smaller cross-section in the area of the elastic structure than in the area of the peninsula-shaped contact areas. This results in an additional increase in elasticity in this area.
In weiterer bevorzugter Ausführung wird die Aufgabe für ein erstes Verfahren zur Herstellung eines Metall-Kunststoff-Verbundbauteils, bei welchem das mindestens eine Stützelement aus Material der Trägerstreifen gebildet ist, mit folgenden Schritten gelöst:In a further preferred embodiment, the object for a first method for producing a metal-plastic composite component, in which the at least one support element is formed from the material of the carrier strips, is achieved with the following steps:
Bestücken des Leiterkamms mit dem mindestens einen elektronischen Bauteil,Equipping the conductor comb with the at least one electronic component,
- Anordnen des bestückten Leiterkamms in einem Spritzgusswerkzeug derart, dass das mindestens eine Stützelement an mindestens einer Wandung des Spritzgusswerkzeuges anliegt, undArranging the assembled conductor comb in an injection molding tool such that the at least one support element rests on at least one wall of the injection molding tool, and
- Spritzen des Kunststoff-Spritzteils.- Injection molding of the molded plastic part.
Die Aufgabe wird für ein zweites bevorzugtes Verfahren zur Herstellung eines Metall-Kunststoff- Verbundbauteils, bei dem das mindestens eine Stützelement als ein auf dem Leiterkamm befestigtes separates Teil ausgebildet ist, mit folgenden Schritten gelöst: Bilden des mindestens einen Stützelements im Bereich der halbinselformigen Kontaktflächen, wobei das mindestens eine Stützelement mechanisch fest mit dem Leiterkamm verbunden wird,The object is achieved for a second preferred method for producing a metal-plastic composite component, in which the at least one support element is designed as a separate part fastened to the conductor comb, with the following steps: Forming the at least one support element in the area of the peninsula-shaped contact surfaces, the at least one support element being mechanically fixed to the conductor comb,
Bestücken des Leiterkamms mit dem mindestens einen elektronischen Bauteil, Anordnen des bestückten Leiterkamms in einem Spritzgusswerkzeug derart, dass das mindestens eine Stützelement an mindestens einer Wandung des Spritzgusswerkzeuges anliegt, undEquipping the conductor comb with the at least one electronic component, arranging the assembled conductor comb in an injection molding tool such that the at least one support element rests on at least one wall of the injection molding tool, and
- Spritzen des Kunststoff-Spritzteils.- Injection molding of the molded plastic part.
Dabei hat es sich bewährt, wenn das mindestens eine Stützelement durch eine Vorumspritzung eines Teils des Leiterkamms mit Kunststoff gebildet wird. Das mindestens eine Stützelement kann aber auch auf den Leiterkamm gesteckt oder geklemmt oder geklebt oder genietet werden.It has proven to be useful if the at least one support element is formed by pre-molding a part of the conductor comb with plastic. The at least one support element can also be plugged onto the conductor comb or clamped or glued or riveted.
Die Aufgabe wird für ein drittes bevorzugtes Verfahren zur Herstellung eines Metall-Kunststoff- Verbundbauteils, bei welchem ein Leiterkamm mit mindestens einem elektronischen Bauteil bestückt wird, wobei das mindestens eine elektronische Bauteil mindestens ein SMD-Bauteil mit schichtformigen elektrischen Kontakten umfasst, und wobei der Leiterkamm mindestens zwei elektrisch leitende Trägerstreifen aufweist, die jeweils mindestens eine halbinselförmige Kontaktfläche zur mechanischen Befestigung und elektrischen Kontaktierung eines der schichtformigen elektrischen Kontakte des SMD-Bauteils aufweisen, und wobei die Trägerstreifen in ihren an die halbinselformigen Kontaktflächen angrenzenden Bereichen elastische Strukturen aufweisen, die eine höhere Elastizität aufweisen als der übrige Leiterkamm, mit folgenden Schritten gelöst:The object is achieved for a third preferred method for producing a metal-plastic composite component, in which a conductor comb is equipped with at least one electronic component, the at least one electronic component comprising at least one SMD component with layered electrical contacts, and wherein the conductor comb has at least two electrically conductive carrier strips, each of which has at least one peninsula-shaped contact surface for mechanical fastening and electrical contacting of one of the layer-shaped electrical contacts of the SMD component, and wherein the carrier strips have elastic structures in their regions adjacent to the peninsula-shaped contact surfaces, which have a higher elasticity than the rest of the conductor comb, solved with the following steps:
Bestücken des Leiterkamms mit dem mindestens einen elektronischen Bauteil,Equipping the conductor comb with the at least one electronic component,
- Anordnen des bestückten Leiterkamms in einem Spritzgusswerkzeug, wobei das Spritzwerkzeug mindestens ein Stützelement aufweist, das den Leiterkamm im Bereich der halbinselformigen Kontaktflächen oder der elastischen Strukturen berührt, Umspritzen von Teilen des bestückten Leiterkamms und mindestens des mindestens einen SMD-Bauteils mit einem Kunststoff und- Arranging the assembled conductor comb in an injection molding tool, the injection tool having at least one support element which touches the conductor comb in the region of the peninsula-shaped contact surfaces or the elastic structures, overmoulding parts of the assembled conductor comb and at least the at least one SMD component with a plastic and
Entfernen des mindestens einen Stützelements aus dem gebildeten Kunststoff-Spritzteil. Bei diesem Verfahren verbleiben im Bereich der aus dem Kunststoff-Spritzteil entfernten Stützelemente Öffnungen im Kunststoff-Spritzteil, die bis zu den Trägerstreifen und/oder halbinselformigen Kontaktflächen und/oder elastischen Elementen reichen. Für alle drei Verfahren hat es sich bewährt, wenn das Bestücken des Leiterkamms mit dem mindestens einen SMD-Bauteil wie folgt ausgeführt wird:Removing the at least one support element from the molded plastic part. With this method, openings remain in the area of the support elements removed from the plastic injection molded part in the plastic injection molded part, which extend as far as the carrier strips and / or peninsula-shaped contact surfaces and / or elastic elements. For all three methods, it has proven effective if the conductor comb is equipped with the at least one SMD component as follows:
Beschichten der halbinselformigen Kontaktflächen mit einer Lotpaste,Coating the peninsula-shaped contact surfaces with a solder paste,
- Aufsetzen der schichtformigen elektrischen Kontakte des SMD-Bauteils auf die beschichteten halbinselformigen Kontaktflächen,- placing the layered electrical contacts of the SMD component on the coated peninsula-shaped contact surfaces,
- Verbinden der schichtformigen elektrischen Kontakte des SMD-Bauteils mit den halbinselformigen Kontaktflächen mittels Lichtlöten.- Connection of the layered electrical contacts of the SMD component with the peninsula-shaped contact surfaces by means of light soldering.
Das Lichtlöten hat sich als ein besonders gutes Verfahren herausgestellt, die elektronischen Bauteile dauerhaft mechanisch fest und schonend mit dem Leiterkamm zu verbinden.Light soldering has proven to be a particularly good process for permanently and mechanically firmly and gently connecting the electronic components to the conductor comb.
SMD-Bauteile sind nach dem englischen Ausdruck „Surface Mounted Device" bezeichnet. SMD-Bauteile sind elektronische Bauteile, die einen Widerstand, eine Kapazität oder eine Induktivität aufweisen können, wie beispielsweise Widerstände, Kondensatoren, Induktivitäten, LED, IC, Transistoren oder Dioden. Diese können schichtförmige elektrische Kontakte aufweisen.SMD components are called "surface mounted device". SMD components are electronic components that can have a resistor, a capacitor or an inductor, such as resistors, capacitors, inductors, LEDs, ICs, transistors or diodes. These can have layered electrical contacts.
Die Figuren 1 bis 4a sollen das erfindungsgemäße Metall-Kunststoff-Verbundbauteil und erfindungsgemäße Verfahren beispielhaft erläutern.FIGS. 1 to 4a are intended to explain the metal-plastic composite component according to the invention and the method according to the invention by way of example.
So zeigt:So shows:
Figur 1 einen Leiterkamm mit zwei Trägerstreifen,FIG. 1 shows a conductor comb with two carrier strips,
Figur 2 den Leiterkamm aus Fig. 1 nach einem Biegevorgang in dreidimensionaler Ansicht,FIG. 2 shows the conductor comb from FIG. 1 after a bending process in a three-dimensional view,
Figur 3 den Leiterkamm aus Fig. 2 mit darauf montiertem SMD-Bauteil in dreidimensionaler3 shows the conductor comb from FIG. 2 with an SMD component mounted thereon in three dimensions
Ansicht, Figur 4 ein Metall-Kunststoff-Verbundbauteil mit Leiterkamm und SMD-Bauteil aus Fig. 3 in dreidimensionaler Ansicht inklusive verdeckten Linien, Figur 4a das Metall-Kunststoff-Verbundbauteil aus Fig. 4 ohne verdeckte Linien.4, a metal-plastic composite component with conductor comb and SMD component from FIG. 3 in a three-dimensional view including hidden lines, FIG. 4a the metal-plastic composite component from FIG. 4 without hidden lines.
Figur 1 zeigt den Leiterkamm 2, der aus zwei Trägerstreifen 2a, 2b aus CuSnδ gebildet ist, die aus einem Metallstreifen ausgestanzt wurden. Die Trägerstreifen 2a, 2b weisen dabei jeweils eine halbinselförmige Kontaktfläche 2c, 2d auf. Außerdem weisen die Trägerstreifen 2a, 2b in ihren an die halbinselformigen Kontaktflächen 2c, 2d angrenzenden Bereichen elastische Strukturen 2e, 2f auf, die eine höhere Elastizität aufweisen als der übrige Leiterkamm 2. Dies wird erreicht, indem der Querschnitt der Trägerstreifen 2a, 2b im Bereich der elastischen Strukturen 2e, 2f vermindert ist und zudem eine 90°-Abwinkelung erfolgt.Figure 1 shows the conductor comb 2, which is formed from two carrier strips 2a, 2b made of CuSnδ, which were punched out of a metal strip. The carrier strips 2a, 2b each have a peninsular contact surface 2c, 2d. In addition, the carrier strips 2a, 2b have elastic structures 2e, 2f in their regions adjacent to the peninsula-shaped contact surfaces 2c, 2d, which have a higher elasticity than the rest of the conductor comb 2. This becomes achieved by reducing the cross section of the carrier strips 2a, 2b in the region of the elastic structures 2e, 2f and also by 90 ° bending.
Figur 2 zeigt den Leiterkamm 2 aus Fig. 1 nach einem Biegevorgang in dreidimensionaler Ansicht. Die Ränder der halbinselformigen Kontaktflächen 2c, 2d wurden so gebogen, dass je ein Stützelement 6a, 6b senkrecht zu den halbinselformigen Kontaktflächen 2c, 2d aus dem Material der Trägerstreifen 2a, 2b ausgebildet wurde.FIG. 2 shows the conductor comb 2 from FIG. 1 after a bending process in a three-dimensional view. The edges of the peninsula-shaped contact surfaces 2c, 2d were bent such that a support element 6a, 6b was formed perpendicular to the peninsula-shaped contact surfaces 2c, 2d from the material of the carrier strips 2a, 2b.
Figur 3 zeigt den Leiterkamm 2 aus Fig. 2 mit einem darauf montierten SMD-Bauteil 3 in dreidimensionaler Ansicht. Das SMD-Bauteil 3 weist schichtförmige, elektrische Kontakte 4a, 4b auf, die jeweils mit einer der halbinselformigen Kontaktflächen 2c, 2d elektrisch und mechanisch fest verbunden sind. Dies erfolgt vorzugsweise unter Zuhilfenahme einer Lotpaste, die auf die halbinselformigen Kontaktflächen 2c, 2d aufgebracht wird, Aufsetzen des SMD-Bauteils 3 auf die Lotpaste und Verbinden der halbinselformigen Kontaktflächen 2c, 2d und den schichtformigen elektrischen Kontakten 4a, 4b durch Lichtlöten.FIG. 3 shows the conductor comb 2 from FIG. 2 with an SMD component 3 mounted thereon in a three-dimensional view. The SMD component 3 has layered electrical contacts 4a, 4b, which are each electrically and mechanically firmly connected to one of the peninsula-shaped contact surfaces 2c, 2d. This is preferably done with the aid of a solder paste that is applied to the peninsula-shaped contact surfaces 2c, 2d, placing the SMD component 3 on the solder paste and connecting the peninsula-shaped contact surfaces 2c, 2d and the layer-shaped electrical contacts 4a, 4b by light soldering.
Figur 4 zeigt ein Metall-Kunststoff-Verbundbauteil 1 mit dem Leiterkamm 2 und dem SMD- Bauteil 3 aus Fig. 3 in dreidimensionaler Ansicht inklusive verdeckter Linien (gestrichelt dargestellt). Das SMD-Bauteil 3 und Teile des Leiterkamms 2 wurden mit einem Kunststoff-Spritzteil 5 umspritzt, wobei Teile der Stützelemente 6a, 6b nicht von dem Kunststoff-Spritzteil 5 bedeckt sind. Der Leiterkamm 2 inklusive SMD-Bauteil 3 wird zum Umspritzen derart in ein Spritzwerkzeug eingelegt, dass die Stützelemente 6a, 6b an einer Wandung des Spritzwerkzeuges anliegen und den Leiterkamm 2 während des Spritzvorganges gegen die Wandung abstützen. Ein Verwinden, Verziehen oder Verbiegen des Leiterkamms 2 während des Einschießens des flüssigen Kunststoffes in das Spritzwerkzeug zur Ausbildung des Kunststoff-Spritzteils 5 wird damit wirkungsvoll vermindert beziehungsweise vermieden. Die Verbindung zwischen den schichtformigen, elektrischen Kontakten 4a, 4b des SMD-Bauteils 3 und den halbinselformigen Kontaktflächen 2c, 2d wird dadurch geschont und eventuelle Störungen des elektrischen Kontakts vermieden.FIG. 4 shows a metal-plastic composite component 1 with the conductor comb 2 and the SMD component 3 from FIG. 3 in a three-dimensional view including hidden lines (shown in dashed lines). The SMD component 3 and parts of the conductor comb 2 were overmolded with a plastic injection-molded part 5, parts of the support elements 6a, 6b not being covered by the plastic injection-molded part 5. The conductor comb 2, including the SMD component 3, is inserted into an injection molding tool in such a way that the supporting elements 6a, 6b rest against a wall of the injection molding tool and support the conductor comb 2 against the wall during the injection molding process. Warping, warping or bending of the conductor comb 2 while the liquid plastic is being shot into the injection mold to form the plastic injection molded part 5 is thus effectively reduced or avoided. The connection between the layer-shaped, electrical contacts 4a, 4b of the SMD component 3 and the peninsula-shaped contact surfaces 2c, 2d is thereby protected and possible faults in the electrical contact are avoided.
Figur 4a zeigt das Metall-Kunststoff-Verbundbauteil 1 aus Fig. 4 ohne verdeckte Linien. Es ist nun deutlicher zu erkennen, dass die Bereiche der Stützelemente 6a, 6b, die während des Spritzvorganges gegen eine Wandung im Spritzwerkzeug gedrückt wurden, nicht mit dem Kunststoff-Spritzteil 5 bedeckt sind. Anstelle der im Bereich der halbinselformigen Kontaktflächen 2c, 2d und/oder elastischen Bereiche angeordneten Stützelemente 6a, 6b können beispielsweise auch solche verwendet werden, die im Spritzwerkzeug derart angeordnet sind, dass nach dem Entfernen des Metall- Kunststoff-Verbundbauteils 1 aus dem Spritzwerkzeug dort eine Öffnung im Bereich des Kunststoff-Spritzteils 5 verbleibt, wo sich in Fig. 4 oder 4a die Stützelemente 6a, 6b befinden. Durch diese Öffnungen wäre dann ein Teil der halbinselformigen Kontaktflächen 2c, 2d und/oder elastischen Bereiche zu erkennen.FIG. 4a shows the metal-plastic composite component 1 from FIG. 4 without hidden lines. It can now be seen more clearly that the regions of the support elements 6a, 6b that were pressed against a wall in the injection mold during the injection process are not covered with the plastic injection-molded part 5. Instead of the support elements 6a, 6b arranged in the region of the peninsula-shaped contact surfaces 2c, 2d and / or elastic regions, it is also possible, for example, to use those which are arranged in the injection mold in such a way that after removal of the metal-plastic composite component 1 from the injection mold there is a The opening in the area of the plastic injection-molded part 5 remains, where the support elements 6a, 6b are located in FIG. 4 or 4a. A part of the peninsula-shaped contact surfaces 2c, 2d and / or elastic regions would then be recognizable through these openings.
Es wird ausdrücklich darauf hingewiesen, dass die Figuren 1 bis 4a lediglich Ausführungsbeispiele darstellen, die in weiten Grenzen variiert werden können, ohne dabei den Bereich der Erfindung zu verlassen. It is expressly pointed out that FIGS. 1 to 4a merely represent exemplary embodiments which can be varied within wide limits without leaving the scope of the invention.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10319470.3 | 2003-04-29 | ||
| DE10319470A DE10319470A1 (en) | 2003-04-29 | 2003-04-29 | Metal-plastic composite component and method for its production |
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| Publication Number | Publication Date |
|---|---|
| WO2004096513A2 true WO2004096513A2 (en) | 2004-11-11 |
| WO2004096513A8 WO2004096513A8 (en) | 2005-01-06 |
| WO2004096513A3 WO2004096513A3 (en) | 2005-07-28 |
Family
ID=33394013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2004/004461 Ceased WO2004096513A2 (en) | 2003-04-29 | 2004-04-28 | Metal-plastic composite component and methods for the production thereof |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE10319470A1 (en) |
| WO (1) | WO2004096513A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007020132A1 (en) * | 2005-08-16 | 2007-02-22 | Robert Bosch Gmbh | Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4737032B2 (en) | 2006-10-26 | 2011-07-27 | 株式会社デンソー | Connector integrated sensor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4242566A1 (en) * | 1992-12-16 | 1994-06-23 | Deutsche Aerospace | Process for mounting semiconductor components in housings by mechanical clamping |
| FR2748105B1 (en) * | 1996-04-25 | 1998-05-29 | Siemens Automotive Sa | MAGNETIC SENSOR AND METHOD FOR PRODUCING SUCH A SENSOR |
| US6003369A (en) * | 1997-05-19 | 1999-12-21 | Continental Teves, Inc. | Method for manufacturing encapsulated semiconductor devices |
| DE19929026B4 (en) * | 1999-06-25 | 2011-02-24 | Robert Bosch Gmbh | Method for producing a pressure sensor |
| US20020089064A1 (en) * | 2001-01-08 | 2002-07-11 | Jiahn-Chang Wu | Flexible lead surface-mount semiconductor package |
| WO2002095335A1 (en) * | 2001-05-23 | 2002-11-28 | Continental Teves Ag & Co. Ohg | Electronic sensor with electronic sensor components and method for the production thereof |
| DE10220761A1 (en) * | 2001-05-23 | 2002-12-19 | Continental Teves Ag & Co Ohg | Electronic sensor with electronic sensor components and method for its production |
-
2003
- 2003-04-29 DE DE10319470A patent/DE10319470A1/en not_active Withdrawn
-
2004
- 2004-04-28 WO PCT/EP2004/004461 patent/WO2004096513A2/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007020132A1 (en) * | 2005-08-16 | 2007-02-22 | Robert Bosch Gmbh | Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004096513A3 (en) | 2005-07-28 |
| WO2004096513A8 (en) | 2005-01-06 |
| DE10319470A1 (en) | 2004-11-25 |
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