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WO2004088741A1 - Systeme de transport de plaquettes - Google Patents

Systeme de transport de plaquettes Download PDF

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Publication number
WO2004088741A1
WO2004088741A1 PCT/JP2004/003929 JP2004003929W WO2004088741A1 WO 2004088741 A1 WO2004088741 A1 WO 2004088741A1 JP 2004003929 W JP2004003929 W JP 2004003929W WO 2004088741 A1 WO2004088741 A1 WO 2004088741A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
tunnel
reticle
transfer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/003929
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English (en)
Japanese (ja)
Inventor
Yasushi Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Priority to JP2005504171A priority Critical patent/JPWO2004088741A1/ja
Publication of WO2004088741A1 publication Critical patent/WO2004088741A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Definitions

  • a system of the present invention comprises a tunnel for transporting a substrate and a reticle between a plurality of processing apparatuses for processing a substrate, and a control unit for controlling transport of the substrate and the reticle in the tunnel. And characterized in that:
  • a stocker for stocking the reticle conveyed in the tunnel is further provided, and the control means controls the unloading of the reticle from the stocking force to the tunnel and the transfer of the reticle from the tunnel to the stocking force.
  • the apparatus further includes a stock force for stocking the substrate and the reticle conveyed in the tunnel. It is characterized by control.
  • the stocker is provided with information reading means for reading information attached to the reticle or the substrate.
  • the stocker is characterized by comprising: a multi-stage table on which a reticle or a substrate is placed; and rotating means for independently rotating each of the tables.
  • a stocker includes: a multi-stage table on which a substrate, a reticle, or a substrate storage force set is placed; and a rotating unit that rotates the table for each stage.
  • the storage force and the substrate or reticle or substrate storage force set placed on the table are taken out and moved to the transport path, and the transport path has been transported.
  • FIG. 1A is a perspective view showing the appearance of the substrate transfer system according to the first embodiment of the present invention.
  • FIG. 1B is a diagram showing an arrangement of the interface device according to the first embodiment of the present invention.
  • FIG. 2A and FIG. 2B are diagrams showing the internal configuration of the tunnel and interface device according to the first embodiment of the present invention.
  • FIGS. 3A and 3B are views showing a connection portion between the tunnel and the interface device according to the first embodiment of the present invention.
  • FIG. 3C is a perspective view showing the internal configuration of the tunnel according to the first embodiment of the present invention.
  • 4A and 4B are diagrams showing a configuration of the substrate transport vehicle according to the first embodiment of the present invention.
  • FIG. 5 is a diagram for explaining a substrate transfer operation of the substrate transfer device according to the first embodiment of the present invention.
  • FIG. 6 is a view for explaining a substrate transfer operation of the substrate transfer apparatus according to the first embodiment of the present invention.
  • FIG. 7A and 7B are diagrams showing another example of the interface device according to the present invention.
  • FIG. 8A is a diagram for explaining the overall layout of the substrate transfer system according to the first embodiment of the present invention.
  • FIG. 8B is a diagram for explaining the overall layout of the substrate transfer system according to the first embodiment of the present invention.
  • 9A to 9E are diagrams showing various layout patterns of the tunnel and the processing device according to the first embodiment of the present invention.
  • FIG. 10 is a top view showing an internal configuration of a transfer device having no function of stocking a substrate.
  • -4-Fig. 11A is a top view showing the internal configuration of the transfer device having the function of stocking substrates.
  • FIG. 11B is a side sectional view showing an internal configuration of the transfer device having a function of stocking a substrate.
  • FIG. 11C and FIG. 11D are diagrams showing another example of a transfer device having a function of stocking a substrate.
  • FIG. 12A is a top view showing the internal configuration of the transfer device provided with the reading device. '
  • FIG. 12B is a side sectional view showing the internal configuration of the transfer device provided with the reading device.
  • FIG. 13 is a diagram for explaining the configuration and operation of the interface device according to the second embodiment of the present invention.
  • FIG. 14 is a diagram for explaining the configuration and operation of the interface device according to the second embodiment of the present invention.
  • FIG. 15 is a diagram for explaining the configuration and operation of the interface device according to the second embodiment of the present invention.
  • FIG. 16 is a diagram for explaining the configuration and operation of the interface device according to the second embodiment of the present invention.
  • FIG. 17 is a diagram for explaining the configuration and operation of the interface device according to the second embodiment of the present invention.
  • FIG. 18 is a diagram for explaining the configuration and operation of the interface device according to the second embodiment of the present invention.
  • FIG. 19 is a diagram showing a modified example of the interface device according to the second embodiment of the present invention.
  • FIG. 20A and FIG. 20B are schematic diagrams showing the internal configuration of the tunnel according to the third embodiment of the present invention.
  • FIG. 21 shows a tunnel and an interface according to the fourth embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the internal configuration of the device.
  • FIGS. 22A to 22E are views for explaining a rail switching operation in the tunnel according to the fifth embodiment of the present invention.
  • FIGS. 23A and 23B are diagrams illustrating a rail slide mechanism in a tunnel according to a fifth embodiment of the present invention.
  • FIGS. 24A to 24D are views showing layouts in a tunnel according to another embodiment of the present invention.
  • FIG. 25A to FIG. 25C are views showing examples of the distal end shape of an arm according to another embodiment of the present invention.
  • FIG. 1 is a schematic diagram showing a layout of a part of the substrate transfer system 100 according to the first embodiment of the present invention.
  • 101 is a tunnel
  • 102 is a processing device for processing a substrate
  • 103 is an interface for transferring a substrate between the tunnel 101 and the processing device 1 2.
  • Device is a tunnel
  • the tunnel 101 is laid out so as to connect the plurality of processing devices 102. Also, the tunnel 101 and the processing device 102 are not directly connected, and the interface device 103 is interposed. That is, the tunnel 101 is connected to the interface device 103 on the lower surface, and the interface device 103 is connected to the processing device 102 on the side surface.
  • -6-Tunnel 101 is unitized for each width approximately equal to the width of interface device 103, and each unit is removed so that maintenance is possible. Further, a combination of the tunnel 101 and the interface device 103 can be used as one unit.
  • one interface device 103 is provided for each of the plurality of processing devices 102.
  • a transport mechanism for transporting the substrate (wafer) is provided inside the tunnel 101, and the substrate transported in the tunnel is transferred to the interface device 103 and then further transferred to the interface device 103. It is transported from the interface device 103 to the processing device 102.
  • FIG. 1B is a diagram showing the layout of the present substrate transfer system 100 from another angle.
  • the upper diagram in FIG. 1A is a diagram of the present substrate transport system 100 as viewed from above, and the lower diagram of FIG. IB is a schematic cross-sectional diagram as viewed from the longitudinal direction of the tunnel.
  • a series of processing equipment 102 required to complete a wafer such as an etcher, asher, wet station, sputter, CMP, stepper, etc.
  • a tunnel 101 as shown in the upper part of FIG. 1B.
  • the height of the substrate delivery unit 102a may be different in each processing apparatus 102. Since the height of the tunnel 101 is basically constant, the length of the communication portion 104 between the tunnel 101 and the interface device 103 is changed according to the processing device 102, and the processing is performed.
  • the interface device 103 is installed at a height corresponding to the device 102.
  • the interface device 103 is installed low for the processing device 1 ⁇ 2 with a relatively low substrate transfer section 102a,
  • the interface apparatus 103 is installed at a high level as shown in the lower right diagram of FIG. 1B.
  • the interface device is configured to be compatible with a plurality of types of processing devices. Note that, here, the description will focus on the transfer of the substrate, but the transfer mechanism of the system 100 will be described. -7-Not only normal wafers but also other types of wafers such as reticles, monitor wafers, and dummy wafers can be mixed and transported.
  • a controller that comprehensively controls the transport of the substrate and the reticle in the tunnel.
  • this controller can be used to change the reticle to a predetermined processing device, such as a stepper, from the reticle storage unit.
  • the reticle is mounted on the transport vehicle and transported, and the transport of the substrate transport vehicle and the interface device are comprehensively controlled so that the reticle is loaded into the specified processing equipment that requires the reticle.
  • FIG. 2A is a schematic diagram showing the inside of the tunnel 101 and the interface device 103.
  • FIG. 2B is an external view of the tunnel 101 and the interface device 103 when viewed in the direction of the arrow from the A side in FIG. 1A.
  • two rails 201a and 201b are provided on the inner side wall of the tunnel 101 in parallel in the vertical direction.
  • Each of these two rails 201a and 201b can support a plurality of substrate transport vehicles 202, and the substrate transport vehicles 202 are driven by motors to drive the rails 201 Drive along a or level 201b.
  • the tunnel 101 has therein a first transport path for transporting the substrate and a second transport path for transporting the substrate above the first transport path.
  • the substrate transport vehicle 202 includes a C-shaped tray 202 a on which the substrate S can be placed, and a force 200 traveling along the rail 201 while supporting the tray 202 a. 2b.
  • C in FIG. 2A is an enlarged view near the root of the rail 201.
  • a feed element 203 is partially provided on the inner surface of the tunnel 101.
  • the power supply element 203 is disposed at a position where the substrate transport vehicle 202 stops to load or unload the substrate into or from the processing apparatus 102, and the substrate transport vehicle 202 supplies power during the stop.
  • Substrate transport by contacting element 203 -8-Power is supplied to the battery (not shown) in the car 202. Then, the motor is driven by using the electric power stored in the battery to travel on the rail.
  • a cleaning unit 301 equipped with an air cleaning filter (ULPA (Ultra Low Penetration Air) filter) is provided in the tunnel 101.
  • ULPA Ultra Low Penetration Air
  • a pipe 302 is connected to the cleaning unit 301, and the air flowing from the pipe 302 is purified through the air cleaning filter of the cleaning unit 301, and is indicated by an arrow. As shown, the air is sent from the exhaust duct 303 to the air exhaust unit 304 through the inside of the tunnel 101.
  • the pipe 302 is connected to each unit of the tunnel 101 as shown in FIG. 2B. That is, the substrate transport system 100 includes a large-sized air supply unit (not shown), and a pipe 302 is laid from the air supply unit along a tunnel 101, and along the tunnel. It branches and is connected to the clean unit 301 provided in each unit of the tunnel 101.
  • the cleaning unit 301 is configured to be detachable for maintenance.
  • the cleaning unit 301 has a ULPA filter, but the present invention is not limited to this, and the HEPA (High Efficiency Part iculate Air)
  • a clean filter such as a filter may be provided.
  • An opening 101 a is provided on the bottom surface of the tunnel 101 to carry out the substrate to the interface device 103 and to carry in the substrate from the interface device 103. Further, a shirt 204 for opening and closing the opening 101a is provided.
  • the communication part 104 has a certain hermetic seal to prevent dust and dirt from adhering to the board when transferring the board between the tunnel 101 and the interface device 103.
  • -9-A shielding wall 700 is provided for the purpose of ensuring the property.
  • the shielding wall 70 1 may have a function of damping the vibration so that the transmission of the vibration does not occur between the tunnel 101 and the interface device 103.
  • the shielding wall 700 is a member that freely expands and contracts, for example, a bellows member.
  • the shielding wall 700 is not limited to a configuration that allows communication between the tunnel 101 and the interface device 103. For example, as shown in FIGS.
  • the interface device 103 is disposed below the tunnel 101 at a height corresponding to the substrate receiving port of the processing device 102.
  • the interface device 103 includes a chamber 501 capable of forming a closed space, a slide unit 401 for transporting a substrate in the channel 501, and a slide unit 400 from the substrate transport vehicle 202. And a substrate elevating unit 600 for transferring the substrate to 1.
  • the substrate lifting unit 600 has a function of transferring the substrate to the tunnel 101 in the vertical direction.
  • the chamber 501 has an opening 501a and an opening 501b on the tunnel 101 side and the processing side, respectively, and gate valves 502 and 503 as opening and closing doors, respectively. It can be opened and closed freely.
  • the slide unit 401 includes a slide arm 401a, a slide base 401b, and a slider drive 401c, and the slider drive 401c transmits power to the slide base 401b.
  • the slide arm 401 a attached to the slide base 401 moves back and forth in the direction of the processing device 102.
  • the substrate placed on the slide arm 401a is slid to the left in FIG. 2A and transported into the processing apparatus 102.
  • -10-FIG. 3C is a perspective view showing the inside of the tunnel 101. As shown in FIG. 3C, the cleaning unit 301 can be removed for replacement or maintenance.
  • windows 101a and 101b in which transparent plates are fitted are provided on the ceiling and side surfaces of the tunnel 101, so that the inside of the tunnel 101 can be visually recognized. As a result, it is possible to instantly discover the state of the substrate in the tunnel and troubles that have occurred in the tunnel.
  • 4A and 4B are schematic configuration diagrams showing the internal structure of the substrate transport vehicle 202.
  • FIG. 4A shows an internal configuration when the substrate transport vehicle 202 is viewed from above.
  • FIG. 4B shows an internal configuration when the substrate transport vehicle 202 is viewed from below in FIG. 4A.
  • the tray 202a is C-shaped, and has a gap G at a part of the outer periphery.
  • three chucking ports 211 for holding the substrate by suction are provided on the upper surface of the tray 202a, and all these chucking ports 211 are force-splitting. It is connected to the pump unit 2 1 2 in 2 0 2 b.
  • the substrate is sucked to the tray 202a by driving the pump unit 212 with the substrate placed on the tray 202a and drawing air from the chucking port 211.
  • the tray 202a is provided with a groove 317 for mounting the substrate, and the substrate is fitted into the groove 317, and is sucked by the chucking port 211. As a result, the substrate is fixed without shifting or falling during transport.
  • the power unit 202 b controls the pump unit 212 for driving the power unit 202 b, the pump unit 212 and the drive unit 212 in addition to the pump unit 212.
  • a control unit 2 14 controls the pump unit 212 for driving the power unit 202 b, the pump unit 212 and the drive unit 212 in addition to the pump unit 212.
  • the driving unit 2 13 includes a motor 2 13 a, a gear 2 13 b, a 2 13 c, and a driving roller 2 13 d inside thereof, and a rotating force of the motor 2 13 a is provided. And transmitted to the drive roller 2 13 d via the gears 2 13 b and 2 13 c, -11-
  • the cart 202 b has a horizontal rail between the guide roller 2 15 for holding the rail 201 in the vertical direction and the drive roller 2 13. And a guide roller 216 for holding the nip. With these guide rollers, the cart 202b can run stably on the rail 201.
  • FIGS. 5 (a) and 5 (e) show the position of the substrate carrier 202 in the tunnel 101, and show the ceiling of the tunnel 101 from above the tunnel.
  • FIGS. 5B and 6B and 6F show partial appearances when the interface device 103 is viewed from the tunnel 101 side.
  • c, d, f, g, and a, c, d, e, and g in FIG. 6 show the inside of the tunnel 101 and the interface device 103, as in FIG. 2A.
  • the substrate transport vehicle 202 on which the substrate S is mounted travels along the rail 201 and stops at the upper part of the interface device 103.
  • the shirt 204 at the bottom of the tunnel 101 and the gate valve 502 at the top of the interface are opened.
  • the arm connects the support shaft provided on the upper surface of the interface device 103 with the center axis of the disk-shaped gate valve 502. Then, by performing an opening operation of rotating the arm about the support shaft, the gate valve 502 moves from a position where the opening portion 501a is closed to a position where it is opened.
  • the board elevating unit 601 When the gate valve 502 and the shirt 204 open, the board elevating unit 601 operates as shown in d, and the push-up port 601 a rises and the tray 1 Push up the substrate S on 0 2 a. -12-When the lifting of the substrate S is completed, the substrate carrier 202 moves in the direction without the gap G (downward in the figure) as shown in e. That is, the substrate transport vehicle 202 is moved so that the push-up rod 601a passes through the gap G.
  • the substrate elevating unit 601 When the substrate carrier 202 retreats completely from the substrate delivery position, the substrate elevating unit 601 operates as shown in ⁇ , and the ejection port 601 a descends while the substrate S is mounted. I do.
  • the system temporarily stops near the top plate of the interface device 103, rotates the push-up rod 61a, and aligns the orientation flat of the substrate S.
  • the orientation flat alignment means that a broken portion provided on a part of the substrate S is directed in a predetermined direction.
  • Some types of processing apparatus 102 require that the substrate be carried in a specific direction. Therefore, when a substrate is carried into such a processing apparatus 102, the substrate lifting / lowering unit 601 functions as a direction adjusting means for adjusting the direction of the substrate. Specifically, a broken portion of the substrate S is detected by an optical sensor (not shown) provided on an upper surface of the top plate of the interface device 103.
  • the push-up rod 61a is further lowered as shown in FIG. 6A, and the substrate is placed on the slide arm 401a. Then, in this state, as shown in b and c, the shirt 204 at the bottom of the tunnel 101 and the gate valve 502 at the top of the interface device 103 move to the closed position. Also, after confirming that the gate valve 502 of the interface device 103 is completely closed according to the type of the processing device 102, the pressure inside the chamber 501 of the interface device 103 is reduced. I do. That is, when the processing apparatus 102 is of a type that performs processing under low pressure, the pressure in the chamber 501 is reduced accordingly.
  • the processing device 102 is a device that performs processing under a high vacuum
  • an interface is provided as shown in FIG. 7A and FIG.
  • a low-vacuum pump 801 and a high-vacuum pump 802 are further connected to the vacuum apparatus 103.
  • processing equipment If the device 102 requires a low vacuum, only the low vacuum pump 801 needs to be connected to the interface device 103.
  • the gate valve 503 provided on the processing side of the interface device is opened as shown in FIG. Then, the slider drive 401c is operated to slide the slide arm 401a attached to the slide base 401b in the direction of the processing device 102, as shown in e.
  • the processing apparatus 102 receives the substrate S mounted on the fork-shaped tip of the slide arm 401a, and enters the state of f and g. After that, the slide arm 401 a is retracted into the chamber 501 and returned to the position d. Then, when the processing of the substrate is completed in the processing apparatus 102, the slide arm 410a is again slid, and waits in the state of f and g. Next, the substrate S is placed on the slide arm 401 a on the processing apparatus 102 side, and when the state of e is reached, d in FIG. 6—b & c in FIG. 6 ⁇ a in FIG. The state changes in the order of f ⁇ d in Fig. 5 ⁇ c in Fig. 5.
  • the slide arm 401 a retreats, takes the substrate S into the chamber 501 (d in FIG. 6), closes the gate valve 503, and reduces the pressure in the chamber 501. Return to atmospheric pressure (c in Figure 6).
  • a substrate unloading request is issued to the substrate carrier 202, and the substrate carrier 202 is made to stand by in front of the substrate receiving position above the interface device 103, and the shirt 204 and the gate valve 5 are set.
  • 0 2 opens (a in Fig. 6).
  • the push-up rod 600a rises and pushes up the substrate S on the slide arm 401a, and further rises and stops (f in FIG. 5).
  • the substrate transport vehicle 202 that has been waiting at the standby position moves so that the push-up rod 601a passes through the gap G and waits at the receiving position (d in FIG. 5).
  • the push-up rod 60a descends and transfers the substrate S to the tray 202a of the substrate carrier 202.
  • the substrate transporter 202 transports the substrate S to the next processing device, and at the same time, the shirt 204 -14-Close the valve 502.
  • FIG. 8A is a diagram showing the relationship between the main transport path and the sub transport path.
  • the substrate transfer system 100 includes a main transfer path 901 and a sub-transfer path 902, and a tunnel 101 of the main transfer path 901 and a tunnel 1001 of the sub-transfer path 902. And are connected by a transfer device 903.
  • the transfer device 903 is a device that transfers a substrate transferred in the tunnel 101 of the main transfer path 901 to the tunnel 101 of the sub transfer path 902. Since the tunnel 101 included in the sub-transport path 902 is straight and has no end, the substrate transferred from the main transport path 901 to the sub-transport path 902 is The processing is performed by the processing device 102 while reciprocating in the tunnel 101 of the sub-transport path 902. At this time, the wafer is transported from the tunnel 101 to the processing device 102 by the interface device 103.
  • the substrate that has been processed in the sub-transport path 902 is transferred to the main transport path 901 again and sent to the next step.
  • FIG. 8B is a diagram showing a layout example of the overall substrate transfer system.
  • a container warehouse 905 is connected to an end of the main transport path 901.
  • the container warehouse 905 stocks the containers containing the substrates sent from the substrate manufacturing plant, takes out the substrates one by one from the containers, and carries them into the main transfer path 901.
  • the sub-transport path 902 is a linear pattern similar to that described with reference to FIG. 8A, but the sub-transport path 905 has an endless tunnel 101, and By transporting the substrate in one direction within 905, the same process can be repeated many times.
  • the main transport path 9 0 1 A processing apparatus group 906 to which the substrate is directly transferred without passing through the sub-transport path is connected to the sub-transport path. Substrates that have been transported through the main transport path 901 and subjected to a series of processing are collected in a container storage device 907, stored in containers every predetermined number, and transported to another factory or a post-process. .
  • FIG. 9A to 9E are diagrams showing various layout patterns of the tunnel 101 and the processing device 102.
  • FIG. 9A to 9E are diagrams showing various layout patterns of the tunnel 101 and the processing device 102.
  • FIG. 9A shows a layout in which a processing apparatus 102 is disposed on both sides of a transport path including one straight tunnel 101.
  • an interface device 103 (not shown here) that transports the substrate from the tunnel 101 to the processing device 102 requires the ability to transport the substrate to both sides of the tunnel. It is necessary to have. With this arrangement on both sides, the installation area of the plurality of processing equipment is reduced as a whole, and the space in the substrate processing plant can be effectively used, and the cost of the factory can be reduced.
  • FIG. 9B shows a layout in which processing devices 102 are arranged on both sides of a transport path including a loop-shaped tunnel 101.
  • the transport path has a transfer device 903 in part.
  • the transfer device 903 can convey the substrate returned after the series of processing to the conveyance path again or stock it in the transfer device 903.
  • FIG. 9C shows a layout in which a processing apparatus 102 is arranged on both sides of a transport path including two straight tunnels 101. Also here, the transfer path has a transfer device 903 partially.
  • the transfer device 903 can transfer the substrate that has returned after completing a series of processing in one tunnel 10. 1 to the other tunnel 101. Further, maintenance of each processing apparatus 102 can be easily performed from the side of the passage sandwiched between the tunnels 101.
  • FIG. 9D shows a layout in which a processing device 102 is arranged on one side of a transport path including one straight tunnel 101.
  • Figure 9E shows a straight tunnel -16-
  • FIG. 10 is a top view showing the internal configuration of the transfer device 903 having no function of stocking substrates.
  • the transfer device 903 is a device for transferring the substrate S between the main transport path 901 and the sub transport path 902a or 902b.
  • a continuous rail 201a from within the tunnel 101 of the main transport path 901 and continuous rails 201b, 201 from within the tunnel 101 of the secondary transport paths 902a, 902b. c is provided.
  • the transfer device 903 and the substrate transport vehicle 202 traveling in the tunnel 101 of each transport path 901 can enter and exit.
  • push-up tables 1001a, 1001b, and 1001c the same number as the number of rails, and a transfer robot 1002 are provided.
  • the substrate carrier 202 which has transported each of the rails 201a, 201b, 201c, stops above the push-up tables 1001a, 1001b, 1001c, the push-up tables 1001a, 1001b, 10 01c pushes up the substrate S transported by the substrate transport vehicle 202 from below.
  • FIG. 11A is a top view showing the internal configuration of a transfer device 903 having a function of stocking a substrate.
  • FIG. 11B is a side sectional view thereof.
  • the transfer device 903 is used to transfer a substrate between the main transport path 901, and the sub-transport path 902a or the sub-transport path 902b, and to stock the substrates.
  • Device By storing the substrates S one by one in this way, it is possible to adjust the number of substrates transported in the sub-transport path and the main transport path, and function as a buffer when the processing load increases.
  • the transfer device 903 shown in Fig. 11A and Fig. 11B has a transfer device with two arms 1 1 0 2a and 1 1 0 2b in addition to the stocker 1 1 1
  • a transfer robot 1102 is provided as a means.
  • the other configuration is the same as that of the transfer device 903 shown in FIG.
  • the transfer device having the stocker 111 the number of substrates S to be transferred is large, and thus the transfer robot 1102 has two arms 110102a, although it is desirable to have the unit 110 b, it is needless to say that a transfer robot 1002 of the type shown in FIG. 10 having only one arm may be used.
  • the respective arms 1102a and 1102b of this transfer port pot 1102 also operate in the same manner as the arms of the transfer pot 1002 described in FIG. Here, the description is omitted.
  • the shape of the stocker 111 is an octagonal prism, and the substrate can be inserted into eight shelves 110 d from eight surfaces by rotating as shown by arrows.
  • FIG. 11A shows a state in which substrates are stocked in four of the eight shelves.
  • the door 111a is opened as shown in the figure.
  • the cleaning unit 101b is provided, and clean air is blown downward as indicated by an arrow.
  • the cleaning unit may be further provided on the upper part of the transfer device 903.
  • each of the eight shelves 1 101 d has a shape in which a plurality of substrate storage rooms 110 e are vertically stacked.
  • a stocker rotating device 111c is provided below the eight shelves, and rotates the entire stocker 1101 clockwise or counterclockwise.
  • the transfer robot 1102 can also be moved in the vertical direction in order to transport the substrate to each of the substrate storage chambers 111e that are vertically continuous.
  • a table that cannot be moved up and down can be used instead of the push-up table 1001.
  • a configuration in which the transfer port pot 1102 directly receives the substrate S from the substrate transport vehicle 202 is also possible.
  • the hand provided at the tip of the arms 110102a and 110102b of the transfer robot 110102 must be attached to the substrate transport vehicle 202. It is necessary to make the shape according to the tray shape of 02.
  • FIG. 11B it is desirable that the main transport path 901 and the sub transport path 902 are vertically displaced so that their rails do not conflict with each other.
  • the shape of the Stot force is not limited to an octagonal prism, but may be a cylinder or another polygonal prism.
  • the transfer robot 1102 has a mechanism for moving up, down, left, and right, a flat shelf that does not rotate may be used as the stopping force.
  • FIG. 11C is a top view for explaining another example of the stocker 1101
  • FIG. 11D is a partial cross-sectional view taken along XX of FIG. 11C. In the example shown in FIGS.
  • the plurality of substrate storage chambers 110 1 e are formed on a donut-shaped table 111 f, and the table 110 f is hollow at the center. Supported by the motor. As a result, the substrate storage chambers 111 e can be integrally rotated for each stage.
  • the entire stocker 1101 has a multilayer structure in which these tables 1101f and hollow motors are stacked vertically. -19- More specifically, the hollow motor includes a donut-shaped rotating part 111 g and a donut-shaped fixing part 111 h, and the rotating part 111 g has a fixing part 110 101 h. It is rotatable with respect to.
  • the lower surface of the table 111f is fixed to the upper surface of the rotating portion 110g, and the lower surface of the fixing portion 111h is fixed to the upper surface of the fixing member 111i.
  • the fixing members 1101i in each stage are connected to each other by a plurality of columnar supporting members 1101j, and have a hollow, hollow shape as a whole.
  • a cleaning unit (not shown) is provided above the hollow portion located at the center of the storage force 1101, and blows clean air downward as indicated by an arrow.
  • the motors are provided at each stage, the load on each motor can be reduced, and the motor can be rotated and stopped at high speed and with high accuracy. Then, the storage / replacement operation of the reticle or the substrate or the like with respect to the stocker 111 can be efficiently performed. In addition, a reticle or a substrate can be stored separately for each stage, which facilitates the management. Furthermore, since the movement required for the mouth pot is small, the mouth pot can be reduced in size, and the size of the entire system can be reduced.
  • the stocker described above can be used to store a reticle instead of a substrate. Further, the substrate and the reticle may be stored with the same stopping power. Further, this storage force can be applied to a system that does not assume a single-sheet transfer. In other words, it is possible to transform a cassette containing substrates (for example, FOUP: Front Opening Unifed Pod) as a temporary storage. If the stocker shown in Fig. 11C is applied as a stocking force for accommodating cassettes, the movement required for the mouth pot can be reduced as compared with the conventional case, so that the mouth pot can be downsized. The size of the entire system can be reduced.
  • FOUP Front Opening Unifed Pod
  • FIGS. 12A and 12B show the transfer with a reader device for reading board information.
  • FIG. 20 is a diagram for explaining the device 903.
  • the transfer device 903 shown in FIGS. 12A and 12B is a reading device for reading information attached to a reticle or a substrate, etc. It is provided above 01a, 1001b, and 1001c.
  • the other configuration is the same as that of the transfer device 903 shown in FIGS. 11A and 11B.
  • the reader device 201 reads information attached to the reticle or the substrate, etc., and transfers the stored information about the reticle or the substrate, etc. stored in the stocker 111 to an information management device (not shown). Send. As a result, it is possible to manage the number of substrates / reticles in the storage force 111. Then, based on the information of the information management device, a reticle or a substrate corresponding to the request of each processing device 102 is taken out from the stocker 111 and transported to a target processing device. In this case, the reader 1 201 was placed above the push-up tables 1001a, 1001b, and 1001c, but the substrate storage room 1 1 0 Each of them may be arranged within 1 e. In addition, if information is managed using wireless communication IC memory (wireless IC tags), information on multiple reticles or substrates can be communicated at once, and the information in the stocker 111 Real-time management of information such as reticles and substrates.
  • the number of stop forces included in the transfer device has been described as one, but a plurality may be provided.
  • the substrate and the like are conveyed one by one in the tunnel, so that the surrounding environment of the substrate and the like can be cleaned with high accuracy, and as a result, the substrate processing accuracy is improved.
  • the interface device Since the interface device has been generalized so that it can be adapted to various processing devices, there is no need to prepare various types of interface devices for each processing device. The equipment cost can be reduced.
  • the interface device below the tunnel it is possible to cope with various processing devices with different heights of the substrate entrance simply by changing the installation position of the interface device.
  • the system can be generalized.
  • the interface device installed at any height can be changed simply by changing the stroke of the push-up stroke.
  • the substrate can also be delivered to the server, and generalization can be achieved.
  • the orientation flat alignment function into the push-up mechanism, the size of the device can be further reduced.
  • the interface device can be equipped with a vacuum compatible:, there is no need to provide a pressure switching device for switching the air pressure, and the equipment installation area can be used effectively, and the equipment cost can be greatly reduced. Become.
  • each substrate transport vehicle can travel independently in both directions, and can pass, etc., so that substrates can be transported without stagnation. It becomes possible.
  • the interface device according to the present embodiment is different from the first embodiment in that the interface device has a rod arm inside the chamber 132.
  • Other configurations are the same as those in the first embodiment, and thus the same components are denoted by the same reference numerals and description thereof will be omitted.
  • FIGS. 13 to 18 are views showing the inside of the channel 13 02 of the interface device 103 according to the present embodiment, and a in FIGS. 13 to 18 denotes the chamber 13.
  • FIG. 2B is a plan view of the inside of the chamber 132
  • FIG. 13C is a left side view of the inside of the chamber 1302.
  • the wall of the chamber 1302 is shown in cross section for easy understanding.
  • the robot programs 1303 and 1304 have hands 1303a and 1304a on which substrates are placed, respectively.
  • the hands 1303 a and 1304 a have a fork-like tip similar to the tray 202 a of the substrate carrier, and the opening gap is wider than the outer diameter of the push-up rod 601 a.
  • the nodes 1303 a and 1304 a are rotatably connected to one ends of the first arm portions 1303 b and 1304 b, respectively, and
  • FIG. 13C shows a state where both the robot arm 1303 and the robot arm 1304 are waiting at the basic position. In this basic position, the hands 1303a and 1304a are located at the same position in the horizontal direction, and therefore only the upper hand 1303a is shown in FIG. 13A.
  • FIG. 14 is a diagram showing a state where the interface device 103 according to the present embodiment has received the substrate S from the tunnel 101.
  • the processing from receiving the substrate from the substrate transport vehicle 202 traveling in the tunnel 101 to placing it on the hand 1303a is almost the same as in the first embodiment. That is, the substrate transport vehicle 202 on which the substrate S is mounted travels along the rail 201 and stops at the upper portion of the interface device 103.
  • the shirt 204 at the lower part of the tunnel 101 and the gate valve 502 at the upper part of the interface are opened, the board elevating unit 6001 is operated, the push-up port 601a is raised, and the board - twenty three -
  • the substrate transport vehicle 202 When the lifting of the substrate S is completed, the substrate transport vehicle 202 is moved so that the lifting rod 600a passes through the gap G of the tray 202a. Substrate transport vehicle
  • the substrate elevating unit 601 When 202 is completely retracted from the substrate transfer position, the substrate elevating unit 601 operates, and the push-up rod 601a descends with the substrate S placed thereon. At the same time, the joints of the mouth pot arm 133 are driven so that the push-up rod 61 a enters into the fork-shaped opening provided at the tip of the hand 133 a. Move the hand 1303a. On the other hand, the push-up port 6 101 a on which the substrate S is placed temporarily stops before the substrate S reaches the hand 133 a, and rotates the substrate S at that position to rotate the orientation flat (or i entat ion frame). When the orientation flat alignment is completed, the push-up rod 61 a is further lowered, and as shown in FIG.
  • the internal pressure of the face device 103 is made to match the pressure of the processing device 102.
  • the gate valve 503 on the processing apparatus 102 side is opened, and as shown in FIG. 15, the robot arm 1303 protrudes toward the processing apparatus 102 side.
  • the processing device 102 receives the substrate S placed on the hand 1303a of the robot arm 1303, the processor 130 is retracted to the basic position shown in FIG. .
  • the gate valve 503 is closed, and the pressure in the chamber 501 is returned to the atmospheric pressure.
  • the substrate S is received again from the substrate transport vehicle 202 in exactly the same procedure as described above, and the state is shifted to the state shown in FIG.
  • the lower robot arm 1304 is extended to the processing device 102 side, and the state shown in FIG. 16 is shifted to the state shown in FIG. Receive 1 In FIG. 16, the unprocessed substrate placed on the upper robot arm 13 - twenty four ⁇
  • the upper arm 1303 is instead extended toward the processing apparatus 102, and the state shifts to the state shown in FIG.
  • the processing apparatus 102 receives the unprocessed substrate S2 placed on the hand 1303a of the robot arm 1303, the mouth pot arm 1303 as shown in FIG. Is retracted to the basic position, the gate valve 503 is closed, and the pressure in the chamber 501 is returned to the atmospheric pressure.
  • a substrate removal request is issued to the substrate transport vehicle 202, and the substrate transport vehicle 202 is made to stand by in front of the substrate receiving position above the interface device 103, and the shirt 204 and the gate valve 502 Opens.
  • the push-up rod 600a rises to push up the substrate S1 on the hand 134a, and further rises and stops. Then, the substrate transporter 202 is moved so that the push-up rod 601a passes through the gap G of the substrate transporter 202 that has been waiting at the standby position. In this state, the push-up rod 61 a descends, and the substrate S 1 is placed on the tray 202 a of the substrate carrier 202. After the push-up rod 601a has been lowered, the substrate transporter 202 transports the substrate S1 to the next processing apparatus, and at the same time, closes the shutter 204 and the gate valve 502.
  • robot arm 1304 is returned to the basic position shown in Fig. 13 again, and then a series of state changes such as Fig. 14 ⁇ Fig. 16 ⁇ Fig. 17 ⁇ Fig. 18 ⁇ Fig. Repeatedly, robot arm 13 0 3, 1 3 4 4, push-up rod 6 0 1 a, substrate carrier 2 0 2, shirt 2 0 4, gate valve 5 0 2, 5 0 3, Activate the pump 801 etc.
  • FIG. 19 shows a modification of the present embodiment.
  • Fig. 19 is similar to Fig. 13 -25-Fig. 19 is a diagram showing the inside of the chamber 1902 of the face device 103.
  • Fig. 19a shows a plan view of the inside of the chamber 1902, and b shows the front of the interior of the chamber 1902.
  • Fig. 13c is a left side view of the inside of the chamber 1902. Note that the wall portion of the chamber 1902 is shown in cross section in these figures for easy understanding.
  • a slide unit 1903 including two slide arms 1903a and 1903b is provided inside the chamber 1902.
  • the slide unit 1903 includes a slide base 1903c and a slider drive 1903d, and was attached to the slide base 1903c by power from the slider drive 1903d.
  • the slide arms 1903 a and 1903 b reciprocate horizontally in the direction of the arrow.
  • Each of the slide arms 1903a and 1903b has a fork-like tip like the above-mentioned mouth pot arm, and the gap of the opening is the same as that of the push-up rod 61a. It is wider than the outside diameter.
  • the slide arms 1903 a and 1903 b are slidably connected to both sides of the slide table 1903 c, and each has a height as shown in Fig. 19c. It is supported by differently shaped arms. For this reason, the slide arm 1903 a and the slide arm 1903 b can freely slide in the horizontal direction without hitting each other.
  • FIG. 19 shows a state in which both the slide arm 1903a and the slide arm 193b are waiting at the basic position. At this basic position, the leading ends of the slide arms 1903 a and 1903 b are retracted in the opposite direction to the processing apparatus 102, as in the first embodiment, and The raised push rod 6 01 a can freely move up and down.
  • the processed substrate is carried out by one of the slide arms. , Untreated with the other slide arm
  • the substrate can be loaded into the processing apparatus 102, and the substrate processing speed can be improved as described above.
  • a multi-stage slide mechanism may be incorporated in the slide arms 1903a and 1903b shown in FIG. In this case, since the slide arm is not only slid, but also expandable and contractible, it is possible to reduce the size of the interface device 103 in the width direction of FIG.
  • FIGS. 2OA and 20B are schematic configuration diagrams extracting and showing only the internal configuration of the tunnel 101, and correspond to the tunnel portion of FIG. 2A.
  • FIG. 20A shows a case where the reading device 2001 is provided on the ceiling portion of the tunnel 101, and FIG.
  • the reading device 2002 is provided on the side wall of the tunnel 101.
  • the readers 2001 and 2002 are readers for reading information recorded on the substrate S to be conveyed. For example, when a bar code is printed on the substrate S, a bar code is used. Any reader is acceptable. If a wireless communication IC memory (wireless IC tag) is embedded in, attached to, or has an ID tag attached to the substrate S, the wireless communication IC memory (wireless IC tag) is attached. ) Or a receiving device for receiving data transmitted from an ID tag. Further, the reading devices 2001 and 2002 may be character recognition sensors that read characters recorded on the surface of the substrate S.
  • the IC memory for wireless communication is a storage device provided with an antenna for transmitting and receiving data in an ultra-small IC chip. Frequency of electricity -27-Data is transmitted and received by operating by waves.
  • a reading device for reading data from an IC tag or an ID tag is provided in a tunnel, but this reading device writes data to an IC tag or the like attached to the substrate. It may have a function to insert. For example, on which substrate the processing is completed is recorded on the substrate, and the substrate is transported under feedback control or feedforward control based on the processing information. And further facilitates the control of substrate transfer. Further, a writing device for writing data to an IC tag or the like attached to the substrate may be provided instead of the reading device. Further, here, the device for reading and writing data from and to the substrate in a non-contact manner has been described. However, it goes without saying that a contact-type reading or writing device may be used instead. 4th embodiment>
  • the tunnel 101 according to the present embodiment differs from the first embodiment in that it performs self-circulating air cleaning.
  • Other configurations and operations are the same as those in the first embodiment, and therefore, the same components are denoted by the same reference characters and description thereof will not be repeated.
  • FIG. 21 is a schematic diagram showing the inside of the tunnel 101 and the interface device 103.
  • the air discharge unit 304 has a built-in pump function. Then, the air discharged from the air discharge unit 304 is sent again to the clean unit 301 through the pipe 211.
  • self-circulating air cleaning can be realized, the entire facility can be simplified as compared with the case where pipes are laid along the tunnel 101, and the independence of each unit of the tunnel 101 is increased. As a result, maintenance becomes easier.
  • FIG. -28-It will be explained using Fig. 23B.
  • the system 100 according to the present embodiment has means for switching the transport path within the tunnel. More specifically, the present embodiment differs from the first embodiment in that a tunnel 101 has one unit, and a tunnel unit having a rail switching mechanism is provided. Other configurations and operations are the same as those of the first embodiment, and thus, the same components are denoted by the same reference characters and description thereof will not be repeated.
  • FIGS. 22A to 22E are diagrams for explaining the rail switching operation.
  • a tunnel switch having a rail switching function is required. Stop the board carrier 2222a in the knit 2221.
  • the rail in the tunnel unit 222 is slid upward.
  • the substrate transporter 222a is run.
  • the substrate transport vehicle 220 2b is stopped in the tunnel unit 2201, and the rail is slid downward as shown in Fig. 22D, and then the substrate transport vehicle 222b as shown in Fig. 22E.
  • the substrate transport vehicle 222b is stopped in the tunnel unit 2201, and the rail is slid downward as shown in Fig. 22D, and then the substrate transport vehicle 222b as shown in Fig. 22E.
  • FIG. 23A and FIG. 23B are views for explaining a rail sliding mechanism in the tunnel unit 222.
  • FIG. 23A is a schematic configuration diagram viewed from the longitudinal direction of the tunnel
  • FIG. 23B is a schematic configuration diagram viewed from the left side in FIG. 23A.
  • the rails 201a and 201b are both fixed to the rail support member 2301.
  • the rail support member 2301 is fixed to the belt 2303 through the groove 230a of the guide member 2302.
  • the belt 2303 can be reciprocated up and down by the motor 2304.
  • the rails 201a and 20lb are fixed to auxiliary support members 230a and 230b on both sides of the support member 2301, respectively.
  • the auxiliary support members 2305a and 2305b are Each of the auxiliary guide members 2306a and 2306b can slide along the grooves.
  • the rail support member 2301 moves up and down together with the belt 2303, and the rail 201a and the rail 201b slide up and down while maintaining the interval.
  • the rail pair is slid using the motor 2304 and the belt 2303, but the present invention is not limited to this.
  • another wire such as a wire winding mechanism or a pressure cylinder may be used.
  • the rail pair may be slid by a mechanism.
  • the number of rails in the tunnel is not limited to this, and may be three or more or one.
  • a substrate transport vehicle 2401 traveling on the upper rail 201a and a substrate transport vehicle 402 traveling on the lower rail 201b may have different configurations. That is, the tray 2401a of the substrate transport vehicle 2401 traveling on the upper rail 201a may be formed in an L shape, and the distance from the tray 2402a of the lower substrate transport vehicle 2402 may be reduced. In this way, the ceiling of the tunnel can be lowered, and the overall configuration of the tunnel can be reduced.
  • rails 201a and 201b may be laid at the bottom of the tunnel.
  • the substrate transport vehicle 2401 traveling on the rail 201a and the substrate transport vehicle 402 traveling on the rail 201b need to have different configurations so that each tray travels with a gap above and below. .
  • bending stress is less likely to be generated on the rails, and the substrate transport vehicle can travel relatively stably.
  • rails 201a and 201b may be laid outside the tunnel, and only the tray of the substrate carrier may be accommodated inside the tunnel. With this configuration, dust or dust that is rolled up by the traveling of the substrate transport vehicle does not adhere to the substrate, and the traveling environment of the substrate can be extremely clean.
  • the rail 201a may be laid on the side wall of the tunnel and the rail 201b may be laid on the bottom of the tunnel.
  • the air purifying unit is installed on the ceiling of the tunnel, but may be installed on any of the tunnel side walls.
  • a robot / slide unit may further include an elevating mechanism capable of moving the substrate in the vertical direction.
  • the substrate can be moved in the vertical direction in accordance with the substrate loading ports of a plurality of types of processing equipment.
  • the processing apparatus waits at the transfer position of the processing apparatus and transfers the substrate, the substrate can be transferred to a mounting table (not shown) of the processing apparatus.
  • the arm provided with a U-shaped fork-shaped hand at the tip is shown as the arm for transferring the substrate to the processing apparatus in the interface device, but the present invention is not limited to this. Absent.
  • FIGS. 25A to 25C are applicable. That is, FIG. 25A shows a C-shaped hand having a circular outer end, and FIG. 25B shows a C-shaped hand having a hole into which a push-up port is inserted. FIG. 25C shows a U-shaped hand that opens laterally toward the processing apparatus.
  • these hand parts may be configured to be detachable so that they can be replaced according to the type of processing device.
  • processing equipment when processing equipment is arranged on both sides of the tunnel, openings are provided on both sides of the interface device, and one transfer means is moved to both processing equipments.
  • -31-It is good also as a movable structure.
  • the space for installing the equipment can be more effectively utilized.
  • the configuration has been described in which power is supplied from the power supply element 203 to the substrate transport vehicle 202 and the substrate is transported on the rail by the motor inside the substrate transport vehicle 202.
  • the present invention is not limited to this.
  • the present invention includes a configuration in which a substrate transport vehicle is lifted and transported by air or magnetism.

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Abstract

L'invention concerne un dispositif de transport de plaquettes à l'aide duquel l'échelle du système peut être réduite. Ledit dispositif de transfert (903) est un dispositif destiné au transfert de plaquettes (S) et de réticules entre un chemin de transport principal (901) et un chemin de transport secondaire (902a ou 902b) ainsi qu'au stockage des plaquettes (S), réticules, ou cassettes de réception des plaquettes. Le stockage séparé des plaquettes (S) ou le stockage séparé des cassettes de réception des plaquettes permet de réguler le nombre des plaquettes (S), réticules ou cassettes de réception des plaquettes transportées sur les chemins de transport principaux et secondaires. Le dispositif de transfert fait office de tampon lorsqu'une charge de traitement devient élevée.
PCT/JP2004/003929 2003-03-28 2004-03-23 Systeme de transport de plaquettes Ceased WO2004088741A1 (fr)

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WO2004088741A1 true WO2004088741A1 (fr) 2004-10-14

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009057758A1 (fr) * 2007-10-31 2009-05-07 Asahi Glass Co., Ltd. Dispositif d'échange de conteneurs et procédé d'échange de conteneurs
JP2009545141A (ja) * 2006-07-26 2009-12-17 テック・セム アーゲー 電子部品製造分野由来の対象物を保存するための装置
KR20190054572A (ko) * 2017-11-14 2019-05-22 에스케이하이닉스 주식회사 기판 이송 시스템
US12147167B2 (en) 2015-11-20 2024-11-19 Asml Netherlands B.V. Imprint apparatus with movable stages
TWI870443B (zh) * 2019-09-26 2025-01-21 日商昕芙旎雅股份有限公司 搬運系統

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101502130B1 (ko) * 2008-07-10 2015-03-13 주식회사 원익아이피에스 반송장치, 그가 설치된 반송챔버 및 이를 포함하는진공처리시스템
JP6791665B2 (ja) * 2016-06-30 2020-11-25 日本電産サンキョー株式会社 搬送システム
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188646A (ja) * 1989-12-18 1991-08-16 Dan Sangyo Kk クリーン・ストッカ
JPH07147310A (ja) * 1993-11-22 1995-06-06 Ebara Corp 移載装置及び方法
JP2002158155A (ja) * 2000-11-17 2002-05-31 Canon Inc 露光装置および露光方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07172578A (ja) * 1993-12-15 1995-07-11 Ebara Corp トンネル搬送装置
JPH07228345A (ja) * 1994-02-14 1995-08-29 Ebara Corp トンネル搬送装置
JP2003072916A (ja) * 2001-08-30 2003-03-12 Sony Corp 保管装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188646A (ja) * 1989-12-18 1991-08-16 Dan Sangyo Kk クリーン・ストッカ
JPH07147310A (ja) * 1993-11-22 1995-06-06 Ebara Corp 移載装置及び方法
JP2002158155A (ja) * 2000-11-17 2002-05-31 Canon Inc 露光装置および露光方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009545141A (ja) * 2006-07-26 2009-12-17 テック・セム アーゲー 電子部品製造分野由来の対象物を保存するための装置
WO2009057758A1 (fr) * 2007-10-31 2009-05-07 Asahi Glass Co., Ltd. Dispositif d'échange de conteneurs et procédé d'échange de conteneurs
JP2009107797A (ja) * 2007-10-31 2009-05-21 Asahi Glass Co Ltd 容器交換装置および容器交換方法
CN101842303B (zh) * 2007-10-31 2013-07-10 旭硝子株式会社 容器的交换装置和容器的交换方法
US12147167B2 (en) 2015-11-20 2024-11-19 Asml Netherlands B.V. Imprint apparatus with movable stages
KR20190054572A (ko) * 2017-11-14 2019-05-22 에스케이하이닉스 주식회사 기판 이송 시스템
KR102398568B1 (ko) * 2017-11-14 2022-05-17 에스케이하이닉스 주식회사 기판 이송 시스템
TWI870443B (zh) * 2019-09-26 2025-01-21 日商昕芙旎雅股份有限公司 搬運系統

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