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WO2004088674B1 - Power cable compositions for strippable adhesion - Google Patents

Power cable compositions for strippable adhesion

Info

Publication number
WO2004088674B1
WO2004088674B1 PCT/US2004/009075 US2004009075W WO2004088674B1 WO 2004088674 B1 WO2004088674 B1 WO 2004088674B1 US 2004009075 W US2004009075 W US 2004009075W WO 2004088674 B1 WO2004088674 B1 WO 2004088674B1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductive
polymer
composition
power cable
cable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2004/009075
Other languages
French (fr)
Other versions
WO2004088674A1 (en
Inventor
Timothy J Person
John Klier
Salvatore F Shurott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Priority to US10/549,828 priority Critical patent/US20060182961A1/en
Priority to EP04758293A priority patent/EP1611585A2/en
Priority to JP2006509265A priority patent/JP2006521679A/en
Priority to CA002520362A priority patent/CA2520362A1/en
Priority to MXPA05010313A priority patent/MXPA05010313A/en
Publication of WO2004088674A1 publication Critical patent/WO2004088674A1/en
Publication of WO2004088674B1 publication Critical patent/WO2004088674B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0853—Ethene vinyl acetate copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L7/00—Compositions of natural rubber
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Organic Insulating Materials (AREA)

Abstract

The present invention is a semiconductive power cable composition made from or containing (a) a mixture of a high­temperature polymer and a soft polymer, and (b) a conductive filler, wherein a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. The invention also includes a semiconductive cable layer prepared from the semiconductive power cable composition as well as a power cable construction prepared by applying the semiconductive cable layer over a wire or cable.

Claims

AMENDED CLAIMS
[received by the International Bureau on 19 October 2004 (19.10.04); original claim 1 amended, claims 2, 3 cancelled, claims 4-21 renumbered to 2-19, former claim 16 (now 14) amended]
1 1, A semiconductive power cable composition comprising:
2 a. a mixture of a high-temperature polymer and a soft polymer; and
3 b, a conductive filler,
4 wherein
5 (i) a semiconductive cable layer prepared from the composition strippably
6 adheres to a second cable layer,
7 (ii) in the absence of a curing agent, the semiconductive cable layer having
8 a heat resistance of less than 100% as measured by a Hot Creep test at
9 a testing temperature of 150 degrees Centigrade,
10 (iii) the high temperature polymer being a polymer suitable to impart heat
11 resistance to the semiconductive cable layer, and
12 (iv) the soft polymer being a polymer that enhances the processing
13 characteristics of the high temperature polymer.
1 2. The aemiconductivβ power cable composition of Claim 1 wherein the high-
2 temperature polymer is selected from the group consisting of polypropylenes,
3 polyesters, nylons, polysulfones, and polyaramides and the soft polymer is selected
4 from the group consisting of polyethylenes, polypropylenes, polyesters, and rubbers.
1 3. The semiconductive power cable composition of Claim 2 wherein the high-
2 temperature polymer is a polypropylene and the soft polymer is a polyethylene.
1 4, The semiconductive power cable composition of Claim 3 wherein the
2 polyethylene is a copolymer of a polar monomer and a nonpolar monomer.
1 5. The semiconductive power cable composition of Claim 1 wherein the
2 conductive filler is selected from the group consisting of carbon blacks, carbon fibers,
3 carbon nanotubes, graphite particles, metals, and metal-coated particlea.
1 6. The semiconductive power cable composition of Claim 1 wherein the second
2 cable layer being chemically-crosslinked.
1 7. The semiconductive power cable composition of Claim 1 , further comprising a
2 curing agent.
1 8. The semiconductive power cable composition of Claim 1 further comprising a
2 coupling agent.
1 9. The semiconductive power cable composition of Claim 8 wherein the coupling
2 agent reduces the amount of a curing agent required to impart heat resistance to the
3 semiconductive cable layer.
1 10. The semiconductive power cable composition of Claim 9 further comprising a curing agent.
1 11. The semiconductive power cable composition of Claim 1 wherein the mixture further comprises a compatibilizing polymer.
1 1 , A semiconductive cable layer prepared from the semiconductive power cable composition of Claim 1.
1 13. A power cable construction prepared by applying the semiconductive cable layer of Claim 12 over a wire or cable.
\ 14. A process for preparing a semiconductive power cable composition
2 comprising the step of;
3 blending a mixture of a high-temperature polymer, a soft polymer, and a
4 conductive filler,
5 wherein
6 (i) a semiconductive cable layer prepared from the composition strippably
7 adheres to a second cable layer,
S (ii) in the absence of a curing agent, the semiconductive cable layer having
9 a heat resistance of less than 100% as measured by a Hot Creep test at 0 a testing temperature of 150 degrees Centigrade, 1 (iϋ) the high temperature polymer being a polymer suitable to impart heat 2 resistance to the semiconductive cable layer, and 3 (iv) the soft polymer being a polymer that enhances the processing 4 characteristics of the high temperature polymer.
1 15. The process of Claim 14, wherein the mixture further comprises a coupling
2 agent.
1 16. A process for preparing a semiconductive power cable composition
2 comprising the steps of:
3 a. teactively-coupling a mixture of a high-temperature polymer, a soft
4 polymer, and a coupling agent, in the presence of a conductive filler, wherein
5 the coupling agent reduces the amount of a curing agent required to impart
6 heat resistance to a semiconductive cable layer prepared from a mixture of the
7 high-temperature polymer, the soft polymer, and the conductive filter in the
8 absence of the coupling agent; and
9 b. admixing a curing agent,
19 wherem a semiconductive cable layer prepared from the composition strippably adheres to a second cable layer. 17. A process for preparing a power cable comprising the steps of: a. extruding a semiconductive power cable composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor; and b. extruding a polymer-dielectric insulation over the semiconductive cable layer. 18. The process for preparing a power cable of Claim 17 further comprising the step of c. extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer. 19. A process for preparing a power cable comprising the steps of: a. extruding a power cable semiconductive composition comprising a mixture of a high-temperature polymer, a soft polymer, and a conductive filler, over a metallic conductor to yield a semiconductive cable layer over the metallic conductor; b. extruding a chemically-crosslinkable insulation composition over the semiconductive cable layer; c. extruding a second semiconductive power cable composition over the polymer-dielectric insulation to yield a second semiconductive cable layer; and d. crosslinking the chemically-crosslinkable insulation composition to yield a crosslinked, polymer-dielectric insulation.
20
PCT/US2004/009075 2003-03-27 2004-03-25 Power cable compositions for strippable adhesion Ceased WO2004088674A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/549,828 US20060182961A1 (en) 2003-03-27 2004-03-25 Power cable compositions for strippable adhesion
EP04758293A EP1611585A2 (en) 2003-03-27 2004-03-25 Power cable compositions for strippable adhesion
JP2006509265A JP2006521679A (en) 2003-03-27 2004-03-25 Peelable adhesive power cable composition
CA002520362A CA2520362A1 (en) 2003-03-27 2004-03-25 Power cable compositions for strippable adhesion
MXPA05010313A MXPA05010313A (en) 2003-03-27 2004-03-25 Power cable compositions for strippable adhesion.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45794303P 2003-03-27 2003-03-27
US60/457,943 2003-03-27

Publications (2)

Publication Number Publication Date
WO2004088674A1 WO2004088674A1 (en) 2004-10-14
WO2004088674B1 true WO2004088674B1 (en) 2004-12-16

Family

ID=33131732

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/009075 Ceased WO2004088674A1 (en) 2003-03-27 2004-03-25 Power cable compositions for strippable adhesion

Country Status (8)

Country Link
US (1) US20060182961A1 (en)
EP (1) EP1611585A2 (en)
JP (1) JP2006521679A (en)
CN (1) CN1762029A (en)
CA (1) CA2520362A1 (en)
MX (1) MXPA05010313A (en)
TW (1) TW200502995A (en)
WO (1) WO2004088674A1 (en)

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CA2971145C (en) 2014-12-17 2021-06-08 Prysmian S.P.A. Energy cable having a cold-strippable semiconductive layer
KR102664628B1 (en) 2015-10-07 2024-05-09 다우 글로벌 테크놀로지스 엘엘씨 Semiconductive shielding composition
CN105820558A (en) * 2016-05-04 2016-08-03 安徽省康利亚股份有限公司 High-abrasion-resistance, halogen-free and flame-retardant insulation material for thin-wall locomotive cable
MX2019006872A (en) 2016-12-21 2019-08-22 Dow Global Technologies Llc Curable semiconducting composition.
CN107880383A (en) * 2017-11-03 2018-04-06 成都乐维斯科技有限公司 A kind of novel cable insulating materials
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KR102057683B1 (en) * 2019-04-05 2019-12-19 (주)에스플러스컴텍 Carbon-based wire manufacturing method and manufacturing apparatus using the same

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Also Published As

Publication number Publication date
JP2006521679A (en) 2006-09-21
WO2004088674A1 (en) 2004-10-14
US20060182961A1 (en) 2006-08-17
TW200502995A (en) 2005-01-16
CN1762029A (en) 2006-04-19
MXPA05010313A (en) 2005-11-17
EP1611585A2 (en) 2006-01-04
CA2520362A1 (en) 2004-10-14

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