WO2004086469A1 - インライン接続設定方法および装置ならびに基板処理装置および基板処理システム - Google Patents
インライン接続設定方法および装置ならびに基板処理装置および基板処理システム Download PDFInfo
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- WO2004086469A1 WO2004086469A1 PCT/JP2004/002497 JP2004002497W WO2004086469A1 WO 2004086469 A1 WO2004086469 A1 WO 2004086469A1 JP 2004002497 W JP2004002497 W JP 2004002497W WO 2004086469 A1 WO2004086469 A1 WO 2004086469A1
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- information
- processing
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- processing device
- interface
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Definitions
- the present invention relates to an in-line connection setting method and apparatus for automatically setting connection between apparatuses for performing in-line processing, and further relates to a substrate processing technique.
- the present invention relates to an in-line connection setting method and a device for automatically confirming a device and automatically setting connection of a device connected in-line each time.
- a coating and developing apparatus for applying and developing a resist solution on a wafer or a glass substrate, and a wafer on which a resist solution is applied.
- an in-line process is performed by combining with an exposure apparatus that performs an exposure process on a glass substrate.
- the Send signal is turned on before the coating / developing device carries the wafer (the Send signal is turned on and the wafer is transported).
- the S end signal is turned on after the wafer transfer (the S end signal is turned on at the end of the wafer transfer).
- the timing of communication between the two differs depending on the capabilities of the exposure apparatus, and smooth operation cannot be performed.
- connector pin assignments in communication cables differ depending on the manufacturer. For example, a connector pin of a specific pin number of the exposure apparatus of maker A is assigned to an error signal, while a connector pin of the same pin number of an exposure apparatus of maker B is assigned to a lot end signal. Thus, there are many cases where specifications such as signal name assignment are different even for the same pin number.
- the manufacturer of the coating and developing device sets the data to the coating and developing device in advance according to the device connected at the delivery destination.
- the connected counterpart device for example, the exposure device may be replaced by another manufacturer, or the internal software of the exposure device may be changed to a different specification system.
- the coating and developing apparatus it is necessary for the coating and developing apparatus to reset the internal software settings for the new exposure apparatus. Conventionally, this re-setting is done manually by the operator (manual operation) from the terminal or by input setting.
- the operator manually operates the coating / developing device in a standby state or turns off the power.
- the operator performs improper processing such as restarting the coating and developing apparatus from a standby state without recovering from the failure of the exposure apparatus.
- An object of the present invention is to automatically set the internal software corresponding to the connected partner device when there is a change in the main body of the inline connection partner device or the internal software of the partner device.
- An object of the present invention is to provide an inline connection setting method and apparatus capable of automatically taking appropriate measures when a failure occurs in a partner apparatus.
- an inline connection setting method for automatically performing connection setting between apparatuses that perform inline processing on a target object
- the first processing device receiving the profile information from the second processing device;
- an inline connection setting method including:
- the first processing device receives the profile information by directly communicating with the second processing device via a communication path formed in a LAN (Loca 1 Area Network). It is desirable.
- LAN Local Area Network
- the profile information includes at least information of the manufacturer of the second processing apparatus, model information, and purge information of software used in the second processing apparatus. Good.
- connection partner apparatus With such information, it is possible to specify the operating conditions of the connection partner apparatus, so that it is possible to set a software file corresponding to the operating conditions.
- the profile information indicates that the second processing device is normal. It is desirable that information on whether or not the state is included is included.
- the first processing device is connected one-to-one with the second processing device by a communication cable, has a plurality of types of hardware definition files that are connector pin assignment information of the communication cable, and It is preferable to select a hardware definition file to be used in the first processing device from the plurality of types of hardware definition files in accordance with the file information.
- the first processing apparatus further includes software for processing the object to be processed, and a plurality of types of interface files, and the plurality of interface files correspond to the selected eight-dimensional definition file. It is desirable to select an interface file to be used in the first processing device from among various kinds of interface files.
- an interface file corresponding to the above-mentioned hash definition file can be selected and used.
- the first processing device requests the second processing device to transfer the profile information at predetermined time intervals.
- the information can be obtained and appropriate measures can be taken.
- connection of the second processing device to the first processing device that performs inline processing on the object to be processed.
- a connection state checking unit for automatically checking connection of information communication with the second processing device connected in-line to the first processing device; and
- An information acquisition unit that requests the processing device to transfer profile information related to the second processing device and receives the profile information; and a file selection unit that selects a software file to be used in accordance with the profile information.
- a first storage means for storing a program for sequentially executing them,
- Control means for executing the program stored in the first storage means
- An in-line connection setting device comprising:
- the first processing device is connected one-to-one with a second processing device that is a partner device connected inline by a communication cable, and the first storage device is connected to the first processing device.
- the means stores a plurality of types of hardware definition files which are connector pin assignment information of the communication cable.
- the file selection unit has a hardware definition file selection unit, and the hardware definition file selection unit selects a hardware definition file to be used from the plurality of types of hardware definition files.
- the first storage unit stores software for processing an object to be processed, the plurality of types of file definition files, and a plurality of types of interface files.
- the file selection unit has a hardware definition file selection unit and an interface file selection unit, and the hardware definition file selection unit uses a hardware definition file used from among the plurality of types of hardware definition files.
- a file is selected, and the interface file selection unit selects an interface file to be used from the plurality of types of interface files.
- the information acquisition unit receives the profile information by directly communicating with the in-line connected partner device via a communication path formed in a LAN (Loca 1 Area Network). It is desirable.
- the profile information includes at least maker information of the partner device, model information, and version information of software used in the partner device, and the inline connection setting device receives the profile information. It is preferable that the apparatus further includes a second storage unit for storing the profile information.
- the profile information indicates that the other device is in a normal state. It is desirable to include information on whether or not it is in a state.
- a substrate processing apparatus for performing in-line processing on a substrate in cooperation with a partner apparatus
- a processing unit for performing in-line processing on the substrate includes
- a substrate transfer mechanism for transferring the substrate between the processing unit and the counterpart device
- a first communication interface for performing information communication with the counterpart device for performing the inline processing on the board
- Information acquisition means for acquiring profile information on the other device from the other device via the second communication interface, and a software file for storing a plurality of software files for controlling the operation of the own device Storage means;
- a substrate processing apparatus comprising:
- a substrate processing apparatus by receiving the profile information of the partner substrate processing apparatus connected in-line, information on the partner substrate processing apparatus can be obtained.
- a series of substrates is processed in cooperation with the substrate processing equipment on the side.
- the in-line processing for performing the processing it is possible to select an appropriate software file for matching with the other substrate processing apparatus.
- a substrate processing system including a first processing apparatus and a second processing apparatus for performing in-line processing on an object to be processed
- the first processing device includes:
- a connection status confirmation unit for confirming a connection of information communication with the second processing device connected in-line, and requesting the second processing device to transfer profile information related to the second processing device.
- An information acquisition unit for receiving the profile information, and a file selection unit for selecting a software file to be used in accordance with the profile information, and a first for storing a program for sequentially executing them.
- Storage means ;
- Control means for executing the program stored in the first storage means
- a substrate processing system provided with a connection setting unit having: According to such a substrate processing system, the first processing apparatus and the second processing apparatus connected in-line receive the profile information of the apparatus from the processing apparatus of the other side, thereby processing the processing of the other side. Since information on the equipment can be obtained, in the in-line processing that performs a series of processing on the substrate in cooperation with the processing equipment on the partner side, an appropriate software for matching with the processing equipment on the partner side is used. Files can be selected.
- Figure 1 shows the relationship between multiple patterning devices and the host computer. It is a block diagram which shows an engagement.
- FIG. 2 is a plan view showing a configuration example of a mechanical system of the pattern forming apparatus.
- FIG. 3 is a block diagram showing an example of an internal configuration of a control system of a coating and developing apparatus and an exposure apparatus which constitute the pattern forming apparatus.
- FIG. 4 is a diagram showing a partial storage element of the auxiliary storage unit of the coating and developing apparatus.
- FIG. 5 is a diagram showing an execution flow of a software program in the coating and developing apparatus.
- FIG. 6 is a diagram showing the configuration modules of the connection setting program.
- FIG. 7 is a diagram illustrating an example of a code table stored as data in the auxiliary storage unit.
- FIGS. 8A and 8B show examples of connector pin assignments in exposure apparatuses of companies A and B, respectively.
- FIG. 9 is a diagram showing a processing flow of the connection setting program.
- FIG. 1 is a block diagram showing a relationship between a host computer and a plurality of pattern forming systems used in a photolithography process in a process of manufacturing an electronic device such as a semiconductor or a liquid crystal display.
- the pattern forming system 100 has a coating and developing device 1 and an exposure device 20, and these are transport lines 33 (corresponding to the interface unit 80 shown in FIG. 2).
- transport lines 33 corresponding to the interface unit 80 shown in FIG. 2.
- a plurality of pattern forming systems 100 are LAN cables that form LANs (Local Area Network) using, for example, Ethernet (registered trademark). 3 and 4 are connected respectively. Specifically, each of the coating developing device 1 and the exposure device 20 is connected to a LAN cable 34, and a host computer 45 is connected to the LAN cable 34.
- LANs Local Area Network
- Ethernet registered trademark
- the host computer 45 controls the operation of the plurality of pattern forming systems 100 via the LAN. For example, for each pattern forming system 100, a processing recipe for a wafer to be processed is specified, and a processing start command is issued.
- each pattern forming system 100 includes, as shown in FIG. 2, a coating and developing apparatus 1 for performing resist coating on the wafer W and development after exposure, and an exposure apparatus 2 for exposing the resist applied to the wafer W. 0, and the coating and developing apparatus 1 and the exposure apparatus 20 are connected in-line.
- the coating and developing apparatus 1 includes a loading / unloading section 60 for loading / unloading a cassette CS containing a plurality of wafers W, a coating / developing section 70 for applying a resist to the wafer W, and performing development after exposure. It comprises an interface section 80 for transferring a wafer W between the coating and developing section 70 and the exposure apparatus 20.
- the loading / unloading section 60 includes a transport mechanism 61 that transports the wafer W between the cassette CS and the coating and developing section 70.
- the coating / development unit 70 applies the resist to the wafer W Unit 76, two developing units 77 for developing exposed wafers, and two processing units for hydrophobizing, heating, cooling, etc. Processing units 71 and 73 are provided. Note that a processing unit tower 75 indicated by a broken line can be provided, and when the processing unit tower 75 is provided, the processing unit tower 75 can be moved along the guide rail 74.
- the coating and developing section 70 includes a transport mechanism 72 for transporting the wafer W, and a coating unit 76, a developing unit 77, and a processing unit tower 71, 73 around the transport mechanism 72. Are located.
- the transfer mechanism 72 transfers the wafer W to the processing units of the coating unit 76, the developing unit 77, and the processing unit towers 71 and 73.
- the transport mechanism 72 is configured to be vertically movable, movable back and forth, and rotatable around a vertical axis by a drive mechanism (not shown).
- the interface section 80 includes an edge exposure device 81 for exposing only the edge of the wafer W, a mounting section 83 for temporarily mounting the wafer W, and a transport mechanism 82 for transporting the wafer W. It has.
- the transport mechanism 82 transfers the wafer W to the mounting portion 83 and the peripheral exposure device 81, and transfers the wafer W to and from the coating / developing portion 70 and the exposure device 20.
- Mounting part 8 3 is constructed by stacking for example a retaining shelf buffer in two stages d
- the exposure apparatus 20 is a pre-processing stage on which a wafer W before exposure is placed. 9 1, a vacuum chamber 95 for performing exposure, an electron gun 94 for exposure, a post-processing stage 92 for mounting a wafer W after exposure, and each of the stages 91, 92 and the vacuum chamber 9. And a transfer arm 93 for transferring the wafer W to and from the transfer arm 5.
- the transfer of the wafer W between the loading / unloading section 60 and the coating and developing section 70 and the transfer of the wafer W between the coating and developing section 70 and the interface section 80 are performed by the processing unit tower. This is done via the delivery units provided at 71 and 73 respectively.
- the in-line processing of the wafer W in the pattern forming system 100 configured as described above is performed as follows.
- the wafer cassette CS in which the wafer W is stored from the outside is placed in the loading / unloading section 60, where the wafer W is taken out from the cassette CS by the transfer mechanism 61.
- the wafer W is transferred to the delivery unit of the processing unit tower 71.
- the wafer W placed on the delivery unit is transported by the transport mechanism 72 to the hydrophobizing unit in the processing unit tower 71, where it is hydrophobized.
- the wafer W is transferred to the coating unit 76, where a resist solution is coated to form a resist film.
- the wafer W is pre-baked in the heating unit in the processing unit tower 71, then transferred by the transfer mechanism 72 to the transfer unit of the processing unit tower 73, and transferred by the transfer mechanism 82. Conveyed to face section 80.
- the wafer W sent to the interface unit 80 is temporarily stored in a holding shelf of the mounting unit 83, where it is set to the same temperature as the ambient temperature in the exposure apparatus 20, and then transferred to the exposure apparatus 20. Sent.
- the wafer W After exposure by the exposure apparatus 20, the wafer W is again After being returned to 80, only the peripheral portion is exposed by the peripheral exposure device 81, if there is no space in the developing unit 77, it is temporarily stored in the mounting portion 83.
- the wafer W is transferred by the transfer mechanism 82 to the delivery unit in the processing unit tower 73, and transferred by the transfer mechanism 72 to the heating unit in the processing unit tower 71 or 73, where the post-exposure is performed.
- the garbage is treated in one jar, and then cooled by the cooling unit in the treatment unit 71 or 73.
- the wafer W is developed in the developing unit 77.
- post-baking is performed as necessary by the heating unit of the processing unit tower 71 or 73, and is cooled by the cooling unit.
- the post-wafer W is transferred by the transfer mechanism 72 to the delivery unit in the processing unit tower 71, and returned by the transfer mechanism 61 into the cassette CS of the loading / unloading section 60.
- the ambient temperature of the coating and developing apparatus 1 and the exposure apparatus 20 is automatically adjusted, and the coating and developing apparatus 1 and the The delivery timing during the interval 0 is also adjusted so that the transfer can be performed smoothly.
- a control system as described later matches the software system of the exposure apparatus on the coating and developing apparatus side. Then, various settings related to the internal software are made.
- FIG. 3 is a block diagram showing a configuration example of a control system in the coating and developing apparatus 1 and the exposure apparatus 20 constituting the pattern forming system 100 shown in FIGS.
- the coating and developing apparatus 1 which is the first processing apparatus and the in-line connection setting apparatus (substrate processing apparatus), performs overall control of the inside as operation control hardware. It has a central processing unit 2 that is the key to the process.
- the central processing unit 2 includes, as other control system hardware, an operation unit 10, a non-volatile auxiliary storage unit 11 as a first storage unit, and a second storage unit as a temporary storage unit.
- a main storage unit 12 for reading and writing information, a machine control unit 13 for controlling mechanical operations, and communication interfaces 15 and 16 for performing information communication are connected. I have.
- An input / output port 14 for carrying in / out a wafer is connected to the machine control unit 13.
- the central processing unit 2 includes a CPU 3 and an application-specific IC 4, and the IC 4 includes a connection detection unit 5, a processing command unit 6, a recipe selection unit 7, a status report unit 8, a communication control unit 9 It is composed of
- connection detecting section 5 has a function of detecting connection with the exposure apparatus 20 via a communication cable.
- the processing command unit 6 has a function of outputting a command to the coating and developing apparatus 1 based on a processing instruction from the host computer 45, for example, a processing start instruction or a wafer lot switching instruction. I have.
- the recipe selection unit 7 has a function of selecting a corresponding processing recipe from the recipe group stored in the auxiliary storage unit 11 based on the identification code sent from the host computer 45.
- the processing recipe is program software for processing a wafer as a substrate to be processed. For example, various conditions such as a resist solution used in the coating and developing apparatus 1, a type of the developing solution, and a processing time are determined. And various kinds are prepared by various combinations thereof. A group of recipes.
- the status report unit 8 stores the information of the coating and developing apparatus 1 such as the processing status report and the processing result report temporarily stored in the main storage unit 12 or the failure information on the host computer 45 and the exposure apparatus 2. Has the function to report to 0.
- the communication control unit 9 has a function of controlling communication with the exposure apparatus 20 and the host computer 45 via the communication interfaces 15 and 16.
- an exposure apparatus 20 (substrate processing apparatus), which is a second processing apparatus and is a counterpart apparatus of the coating and developing apparatus 1, is used as a control system hardware to control the operation of the exposure apparatus 20.
- the central processing unit 21 includes a nonvolatile auxiliary storage unit 28 as other control system hardware, a main storage unit 29 for temporarily reading and writing information, and an exposure apparatus.
- a machine control unit 30 for controlling internal mechanical operation is connected to communication interfaces 32 and 33 for performing information communication. Further, an input / output port 31 for carrying in / out a wafer is connected to the machine control unit 30.
- the central processing unit 21 includes a CPU 22 and an application-specific IC 23.
- the IC 23 includes a processing command section 24, a recipe selection section 25, a status report section 26, and a communication control section. Part 27.
- the processing command section 24 has a function of outputting a command to the exposure apparatus 20 based on a processing command from the host computer 45.
- the recipe selection unit 25 stores the recipe group stored in the auxiliary storage unit 28 based on the identification code sent from the host computer 45. And a function for selecting a corresponding processing recipe from the list.
- the processing recipe in the exposure apparatus 20 for example, the type of reticle, the exposure time, and the exposure amount are determined.
- the status report section 26 has a function of reporting information on the exposure apparatus 20 such as the processing status report and failure information stored in the main storage section 29 to the host computer 45 and the coating and developing apparatus 1. I have.
- the communication control unit 27 has a function of controlling communication with the coating developing device 1 and the host computer 45 via the communication interfaces 32 and 33.
- the communication interface 15 of the coating and developing apparatus 1 and the communication interface 32 of the exposure apparatus 20 are connected by an 8-pin parallel cable P to form a communication path 35.
- the coating developing device 1 and the exposing device 20 are connected to the LAN cable 34, respectively, but are connected via the communication interfaces 16 and 33, respectively, and the communication path 3 on the LAN.
- the pattern forming system 100 configured as described above operates as follows at the start of operation (when the power is turned on). First, when the coating and developing apparatus 1 and the exposure apparatus 20 are both turned on, the connection detection unit 5 in the central processing unit 2 of the coating and developing apparatus 1 establishes a hardware connection with the exposure apparatus 20. To detect. That is, it is detected that the communication interface 15 of the coating and developing apparatus 1 and the communication interface 32 of the exposure apparatus 20 are connected one-to-one by a parallel cable P which is a communication cable. Next, in the coating and developing apparatus 1, the in-line connection setting on the software with the exposure apparatus 20 is automatically performed according to the information exchange via the communication path 36 on the LAN. In addition, this soft The connection setting on the keyer is a feature of the present invention, and will be described later in detail.
- the recipe selecting section 7 of the coating and developing apparatus 1 stores the data in the auxiliary storage section 11 in accordance with a command from the host computer 45 (see FIG. 1).
- the corresponding processing recipe is selected from the stored processing recipes.
- the selected processing recipe is temporarily read into the main storage unit 12 capable of writing and reading information at high speed.
- the processing command unit 6 instructs the machine control unit 13 and the like according to the processing recipe in the main storage unit 12 in cooperation with the exposure apparatus 20 to execute the processing on the wafer as the object to be processed.
- the recipe selection unit 25 selects a corresponding processing recipe from a processing recipe group stored in the auxiliary storage unit 28 according to a command from the host computer 45.
- the selected processing recipe is temporarily read into the main storage unit 29 capable of writing and reading information at high speed.
- the processing command unit 24 instructs the machine control unit 30 and the like in accordance with the processing recipe on the main storage unit 29 in cooperation with the coating and developing apparatus 1, and executes the exposure processing on the wafer to be processed.
- FIG. 4 shows a partial storage element of the auxiliary storage unit 11 of the coating and developing apparatus 1.
- FIG. 5 is an execution flow of the software program in the coating and developing apparatus 1
- FIG. 6 shows a configuration module of the connection setting program.
- FIG. 7 is an example of a code table stored in the auxiliary storage unit 11 as data overnight.
- FIGS. 8B and 8B are examples of the pin assignment tables of the exposure apparatuses of Company A and Company B, respectively, and FIG. 9 shows the processing flow of the connection setting program.
- the auxiliary storage unit 11 of the coating and developing apparatus 1 includes at least a connection setting program 40, a code table 41, a processing recipe group 42, and a hard definition file group 43. And the interface file group 4 4 are stored.
- connection setting program 40 is a program for automatically performing a software connection setting with the exposure apparatus 20 in the coating and developing apparatus 1.
- the processing recipe group 42 is composed of a plurality of processing recipes.
- the code table 41 shows a combination of a manufacturer name, a model number, and a software purge line corresponding to a type code.
- the hardware definition file group 43 includes connector pin assignment information for the communication cable P (see FIG. 3) corresponding to the type code, and includes a plurality of types of files used in the selected processing recipe. It is configured.
- the hardware definition file group 43 includes, as illustrated in FIGS. 8A and 8B, connector pin assignment information for each maker such as a maker A and a maker B of the exposure apparatus on the other side.
- the signal name and function assigned to the pin number of the “connector pin” in the communication cable are stored.
- the interface file group 44 includes a plurality of types of interface files corresponding to the type codes and used in the program of the selected processing recipe. Note that this inn
- the evening face file is a software file that serves as an interface between the hardware definition file used in the program of the selected processing recipe and the processing recipe.
- a connection setting program 40 is executed in order to smoothly perform in-line processing with the connected exposure apparatus 20 (step S1).
- S l This is realized when the connection setting program 40 stored in the auxiliary storage unit 11 is started after the power of the coating and developing apparatus 1 and the exposure apparatus 20 is turned on.
- connection setting program 40 By executing the connection setting program 40, the coating / developing apparatus 1 and the exposure apparatus 20 are matched, and then the processing recipe specified and selected by the host computer 45 is selected by the recipe selection section 7, and the The selected recipe program is executed, and a predetermined process is performed on the wafer to be processed (step S2).
- connection setting program 40 includes, as sub-programs, at least a connection state confirmation unit 40a, an information acquisition unit 40b, and a file selection unit 40c.
- the file selection section 40c is composed of a hardware definition file selection section 40d and an interface file selection section 40e.
- connection state checking unit 40a checks whether communication with the exposure apparatus 20 is possible via the communication path 36 formed on the LAN, and if communication is possible, sets the communication enabled state. It has a function (program) to establish.
- the information acquisition unit 40b transmits profile information of the exposure apparatus 20 from the status report unit 26 of the exposure apparatus 20 via the communication path 36. It has a function (program) to acquire.
- This profile information includes information such as the maker, model, and software version of the exposure apparatus 20 and information on whether the exposure apparatus 20 is normal.
- the hardware definition file selection unit 40d finds the type code corresponding to the profile information acquired by the information acquisition unit 40b, and the hardware definition file corresponding to the type code is stored in the auxiliary storage unit 11 A function (program) for selecting from the hardware definition file group 43 is provided.
- the interface file selection unit 40e has a function (program) for selecting an interface file corresponding to the type code from the interface file group 44 stored in the auxiliary storage unit 11. ing.
- connection setting program 40 The information communication performed by the coating and developing apparatus 1 and the exposure apparatus 20 using the communication path 36 formed on the LAN is performed according to a commonly defined protocol.
- connection setting program 40 starts high-speed data transfer. It is read into the writable and readable main storage unit 12 and activated.
- the connection state confirmation unit 40a issues an inquiry signal to the exposure apparatus 20 via the communication path 36 formed on the LAN (step S11).
- a normal response signal is returned from the exposure apparatus 20 side, it is determined that the connection is normally established (step S12), and the process proceeds to the next step. If here If there is no normal response signal from the exposure apparatus 20 side (step S12), the inquiry to the exposure apparatus 20 is repeated again, and the coating and developing apparatus 1 is in a standby state while there is no normal response. It has become.
- the information acquisition unit 40b issues a profile information request command to the exposure apparatus 20 (step S13).
- information such as the manufacturer name, model, and software-to-air version of the exposure apparatus 20 via the communication path 36 on the LAN, and whether the exposure apparatus 20 is normal or not.
- Information and the like are returned to the information acquisition unit 40b as profile information.
- step S18 If it is determined from the profile information that there is no abnormality in the exposure apparatus 20 (step S14), an octet definition file selection setting is performed (step S18).
- the hardware definition file selection unit 40d uses the code table 41 to find the corresponding type code from the profile information acquired by the information acquisition unit 40b in step S13. Then, a hardware definition file corresponding to the type code is selected from a group of hardware definition files 43 stored in the auxiliary storage unit 11. Actually, the read address of the hardware definition file used during the execution of the processing recipe is determined. Then, following the hardware definition file selection setting, the selection of the interface file is performed (step S19). In the interface file selection setting, the interface file selection unit 40e stores the type file and the interface file corresponding to the selected hard definition file in the auxiliary storage unit 11. Face file group 4 Select from 4 You. In practice, the read address of the interface file used during execution of the processing recipe is determined.
- step S14 determines whether the exposure apparatus 20 is in an abnormal state. If it is determined that the repair is not possible, an operation stop command is issued to the processing command unit 6 (step S17), the operation of the coating and developing apparatus 1 is stopped (the power is turned off), and the process ends.
- step S15 If it is determined in step S15 that restoration is possible, after waiting for a predetermined time (step S16), the process returns to step S13 to request information acquisition of the exposure apparatus 20 again.
- the selected processing recipe is executed, but the processing recipe program, the selected hardware definition file, and the selected interface file are stored in the main storage unit 12. Read and executed. At this time, the processing recipe program is executed using the selected hardware definition file and interface file.
- the current state of the exposure apparatus can be grasped, and changes and abnormalities can be detected. If there is, appropriate measures such as operation stop (power OFF) may be taken.
- the profile information is acquired from the partner device connected in-line, and the setting in the in-line connection is automatically performed in accordance with the profile information. Automatically when the other device changes I can deal with it. That is, it is possible to reduce human error and prevent a decrease in yield.
- the auxiliary storage unit 11 stores a program for troubleshooting (return processing), the type of abnormality, and the type of the partner apparatus. Scenario (Procedure) file according to the type may be prepared.
- the trouble recovery program automatically operates, and appropriate recovery processing can be performed with reference to the scenario file.
- the auxiliary storage unit 11 in the coating and developing apparatus 1 is a single non-volatile storage unit, but may be divided into a plurality of storage units. Further, a method including a step by the connection setting program 40 stored in the auxiliary storage unit 11 may be realized by hardware.
- the coating and developing apparatus 1 is a first processing apparatus and an inline connection setting apparatus.
- the exposure apparatus 20 may be a first processing apparatus and an inline connection setting apparatus.
- the inline connection device is not limited to the coating and developing device and the exposure device, and the inline connection setting method and device of the present invention can be applied to other devices as long as the device is an inline connection device. [Industrial applicability]
- the internal software of the in-line connected partner device or the internal software of the partner device is changed, the internal software corresponding to the connected partner device is automatically set. You can perform key setting work. Also, when a failure occurs in the connection partner device, appropriate measures can be taken automatically.
- the present invention is not limited to substrates such as wafers, and can be widely applied to inline processing of substrates and the like in flat panel displays such as liquid crystal displays and plasma displays.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Computer Networks & Wireless Communication (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04716030A EP1601007A4 (en) | 2003-03-04 | 2004-03-01 | METHOD AND DEVICE FOR ESTABLISHING ONLINE CONNECTION AND DEVICE AND SYSTEM FOR PROCESSING SUBSTRATE |
| US10/546,385 US7167769B2 (en) | 2003-03-04 | 2004-03-01 | Inline connection setting method and device and substrate processing devices and substrate processing system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003056572A JP4001559B2 (ja) | 2003-03-04 | 2003-03-04 | インライン接続設定方法および装置 |
| JP2003-056572 | 2003-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004086469A1 true WO2004086469A1 (ja) | 2004-10-07 |
Family
ID=33094803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2004/002497 Ceased WO2004086469A1 (ja) | 2003-03-04 | 2004-03-01 | インライン接続設定方法および装置ならびに基板処理装置および基板処理システム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7167769B2 (ja) |
| EP (1) | EP1601007A4 (ja) |
| JP (1) | JP4001559B2 (ja) |
| KR (1) | KR100954899B1 (ja) |
| CN (1) | CN100442470C (ja) |
| WO (1) | WO2004086469A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7462011B2 (en) * | 2004-08-12 | 2008-12-09 | Tokyo Electron Limited | Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program |
| JP4492875B2 (ja) * | 2005-06-21 | 2010-06-30 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
| CN101989207A (zh) * | 2009-08-05 | 2011-03-23 | 镇江华扬信息科技有限公司 | 一种高效定时自动执行文件的系统 |
| US9400865B2 (en) * | 2014-06-13 | 2016-07-26 | Kla-Tencor Corp. | Extracting comprehensive design guidance for in-line process control tools and methods |
| JP6745673B2 (ja) * | 2016-08-05 | 2020-08-26 | 東京エレクトロン株式会社 | 半導体システム |
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| JPH0562873A (ja) * | 1991-09-03 | 1993-03-12 | Canon Inc | 半導体製造装置 |
| JPH11145979A (ja) * | 1997-11-12 | 1999-05-28 | Nikon Corp | 半導体製造装置の支援装置 |
| JPH11176723A (ja) * | 1997-12-05 | 1999-07-02 | Nikon Corp | 接続識別装置 |
| EP1164437A2 (en) | 2000-06-15 | 2001-12-19 | Nikon Corporation | Lithographic system |
| JP2002057100A (ja) * | 2000-05-31 | 2002-02-22 | Canon Inc | 露光装置、コートデベロップ装置、デバイス製造システム、デバイス製造方法、半導体製造工場および露光装置の保守方法 |
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| JP3174863B2 (ja) | 1991-07-15 | 2001-06-11 | 株式会社ニコン | 露光方法及びリソグラフィシステム |
| US5845090A (en) * | 1994-02-14 | 1998-12-01 | Platinium Technology, Inc. | System for software distribution in a digital computer network |
| JPH10125587A (ja) | 1996-10-17 | 1998-05-15 | Canon Inc | デバイス製造装置 |
| WO1998024115A1 (en) * | 1996-11-28 | 1998-06-04 | Nikon Corporation | Aligner and method for exposure |
| TW505984B (en) * | 1997-12-12 | 2002-10-11 | Applied Materials Inc | Method of etching patterned layers useful as masking during subsequent etching or for damascene structures |
| JP3495954B2 (ja) | 1998-10-13 | 2004-02-09 | 東京エレクトロン株式会社 | パタ−ン形成装置及び塗布、現像装置 |
| US6493594B1 (en) * | 1999-06-04 | 2002-12-10 | Lucent Technologies Inc. | System and method for improved software configuration and control management in multi-module systems |
| JP4187229B2 (ja) | 1999-07-05 | 2008-11-26 | キヤノン株式会社 | 露光装置およびパラメータ変更方法 |
| US6668376B1 (en) * | 2000-01-07 | 2003-12-23 | Ricoh Company, Ltd. | System and method for automatically loading a device driver |
| US20020124245A1 (en) * | 2000-08-14 | 2002-09-05 | Alvin Maddux | Method and apparatus for advanced software deployment |
| US6599437B2 (en) * | 2001-03-20 | 2003-07-29 | Applied Materials Inc. | Method of etching organic antireflection coating (ARC) layers |
| US6630407B2 (en) * | 2001-03-30 | 2003-10-07 | Lam Research Corporation | Plasma etching of organic antireflective coating |
| US6988193B2 (en) * | 2001-06-28 | 2006-01-17 | International Business Machines Corporation | System and method for creating a definition for a target device based on an architecture configuration of the target device at a boot server |
| US7610366B2 (en) * | 2001-11-06 | 2009-10-27 | Canon Kabushiki Kaisha | Dynamic network device reconfiguration |
| TW571187B (en) * | 2002-09-05 | 2004-01-11 | Mitac Technology Corp | Hardware information capturing and monitoring method for a computer system |
| EP1429243A3 (en) * | 2002-12-14 | 2007-01-03 | Samsung Electronics Co., Ltd. | Device driver installation |
| US7710587B2 (en) * | 2004-10-18 | 2010-05-04 | Microsoft Corporation | Method and system for configuring an electronic device |
-
2003
- 2003-03-04 JP JP2003056572A patent/JP4001559B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-01 CN CNB2004800056853A patent/CN100442470C/zh not_active Expired - Lifetime
- 2004-03-01 US US10/546,385 patent/US7167769B2/en not_active Expired - Lifetime
- 2004-03-01 EP EP04716030A patent/EP1601007A4/en not_active Withdrawn
- 2004-03-01 WO PCT/JP2004/002497 patent/WO2004086469A1/ja not_active Ceased
- 2004-03-01 KR KR1020057016154A patent/KR100954899B1/ko not_active Expired - Lifetime
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| JPH0562873A (ja) * | 1991-09-03 | 1993-03-12 | Canon Inc | 半導体製造装置 |
| JPH11145979A (ja) * | 1997-11-12 | 1999-05-28 | Nikon Corp | 半導体製造装置の支援装置 |
| JPH11176723A (ja) * | 1997-12-05 | 1999-07-02 | Nikon Corp | 接続識別装置 |
| JP2002057100A (ja) * | 2000-05-31 | 2002-02-22 | Canon Inc | 露光装置、コートデベロップ装置、デバイス製造システム、デバイス製造方法、半導体製造工場および露光装置の保守方法 |
| EP1164437A2 (en) | 2000-06-15 | 2001-12-19 | Nikon Corporation | Lithographic system |
| JP2002075853A (ja) * | 2000-06-15 | 2002-03-15 | Nikon Corp | 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US7167769B2 (en) | 2007-01-23 |
| KR20050105266A (ko) | 2005-11-03 |
| EP1601007A4 (en) | 2008-06-04 |
| KR100954899B1 (ko) | 2010-04-27 |
| JP4001559B2 (ja) | 2007-10-31 |
| US20060079985A1 (en) | 2006-04-13 |
| CN1757095A (zh) | 2006-04-05 |
| EP1601007A1 (en) | 2005-11-30 |
| JP2004266172A (ja) | 2004-09-24 |
| CN100442470C (zh) | 2008-12-10 |
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