WO2004084758A1 - Photopolymerization unit - Google Patents
Photopolymerization unit Download PDFInfo
- Publication number
- WO2004084758A1 WO2004084758A1 PCT/JP2004/002264 JP2004002264W WO2004084758A1 WO 2004084758 A1 WO2004084758 A1 WO 2004084758A1 JP 2004002264 W JP2004002264 W JP 2004002264W WO 2004084758 A1 WO2004084758 A1 WO 2004084758A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- emitting diode
- light
- diode
- photopolymerization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0059—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence
- A61B5/0082—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence adapted for particular medical purposes
- A61B5/0084—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence adapted for particular medical purposes for introduction into the body, e.g. by catheters
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C19/00—Dental auxiliary appliances
- A61C19/003—Apparatus for curing resins by radiation
- A61C19/004—Hand-held apparatus, e.g. guns
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/0059—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence
- A61B5/0082—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence adapted for particular medical purposes
- A61B5/0088—Measuring for diagnostic purposes; Identification of persons using light, e.g. diagnosis by transillumination, diascopy, fluorescence adapted for particular medical purposes for oral or dental tissue
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/45—For evaluating or diagnosing the musculoskeletal system or teeth
- A61B5/4538—Evaluating a particular part of the muscoloskeletal system or a particular medical condition
- A61B5/4542—Evaluating the mouth, e.g. the jaw
- A61B5/4547—Evaluating teeth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Definitions
- the present invention relates to a visible light polymerization irradiator for uniformly curing and curing a dental composite resin filler by irradiating light emitted from a light emitting diode with high power, high uniformity and high uniformity.
- the light is directed to the light emitting surface side by a tapered tapered light condensing body 1 0 3 in which a metal reflection layer 1 0 4 is arranged on the front side of the light emitting diode 1 0 1 and arranged in a tapered manner. It is possible to condense the light from the plurality of light emitting diodes 101 by connecting the optical fiber to the tapered condensing part, that is, the outgoing part, and to make the light enter the optical fiber 105. It has been tried. Furthermore, when JP-A-09-19023 8 is described with reference to FIG. 11, a transparent, conical surface formed of a wedge-shaped quadric surface whose light emitting surface is formed with one end surface on one side is a metallic reflective layer.
- a plurality of resin lens type light emitting diodes 1 1 1 are disposed on the convex surface so that light can be emitted in a direction perpendicular to the tangent of the convex secondary surface in the conical light guide 1 1 2 attached with The light is condensed in a cylindrical light guide 1 1 3 1 4, so that the light from the light emitting surface side of the cylindrical light guide 1 1 3 passes through the conical light guide 1 1 2.
- a structure that emits light to the outside is known. Then, as a conventional example of a photopolymerization illuminator using the basic structure of these light source parts, a small photopolymerization irradiation apparatus shown in FIG. 12 is disclosed in Japanese Patent Application Laid-Open No. 2000-215115.
- a large number of light emitting diodes 1 2 1 are arranged on a light emitting diode support 1 2 2 composed of a spherical surface, and the light emitting diodes can be condensed at the incident end of the optical fiber 1 2 3 . It is possible that a handy photopolymerization irradiator is put into practical use by storing the circuit for controlling the optical system thus configured and the drive power source 125 together with the handpiece 126. It is well known.
- JP-A-09-90238 light from a plurality of light emitting diodes can be efficiently incident on an optical fiber by providing a condensing point in the optical fiber through the light guide.
- the uniformity of the light was poor, and the light emitted from the first optical fiber was also poor in uniformity.
- the diameter of the optical fiber to be guided becomes smaller as the variation of the light distribution characteristic of the shell type light emitting diode becomes larger, it becomes very difficult to condense a large number of light emitting diodes at the same point.
- JP-A-11-219608 although the light from the light emitting diode is condensed by the transparent tapered light guide, the light attenuation due to the light reflection or the light guiding fiber 1. Since the taper angle can not be increased in order to place the incident angle of the incident light within the specified angle, ie, within the critical angle, the taper angle becomes substantially smaller, and the light emitting diode can be used to That is, although the distance from the incident end of the light guiding fiber is long and light attenuation due to the distance is large, light leakage from the optical system is small, but the irradiation distance becomes long in addition to light reflection and refraction loss. Caused problems such as increased light attenuation.
- the basic configuration is a light source for a high light output fiber by optically devising using a large number of light emitting diodes in order to measure an increase in light emitted from one optical fiber.
- An object of the present invention is to provide a lightweight, compact and highly reliable photopolymerization irradiation apparatus capable of efficiently irradiating light from a light emitting diode onto an object to be irradiated and having no irradiation spot. Disclosure of the Invention
- a semiconductor device such as a light emitting diode has an absolute maximum rating in terms of electrical temperature, and its use beyond this should not be done in order to reduce the life of the light emitting element, and the absolute maximum rating is exceeded. If it is not used, its lifetime is guaranteed to be tens of thousands to hundreds of thousands of hours or more.
- halogen lamps are the main light source for dental photopolymerizers, but their service life is at most several dozen hours to several hundred hours, and they are sufficiently used for practical use. From this point of view, it can be said that the lifetime of the light emitting diode is sufficient if it is several hundred hours to several thousand hours.
- the practical irradiation time of the dental light polymerizer should be short, but the maximum is up to 1 minute.
- the junction temperature can be lowered by decreasing the duty ratio, which is larger It turned out that the current could flow.
- Iave (max) is the absolute maximum rating of the average current of the light emitting element
- Iave (ext) is the average current that can be flowed for 1 minute without any significant loss of the life of the light emitting element
- D is the duty ratio.
- Ton 24 sec
- Toff 36 sec
- Ipeak 1.3 A
- a light emitting diode with an absolute maximum rating of 350mA for average current can be used for up to 24 seconds at a current of 1.3A.
- the light output from the light emitting diode increased approximately in proportion to the current, and in the above example, the light output could be obtained about 3.5 times the maximum light output obtained when used within the rating.
- Fig. 5 shows the relationship between the irradiation time and the thickness of the cured film by irradiating the light obtained at this time to a commonly used dental composite resin. .
- the emission wavelength of the light emitting diode at this time is 470 nm.
- the light guide which has always been necessary is not required, the cost is reduced significantly, and the light loss due to the light guide is eliminated. It has become possible to increase the output.
- the light emitting diode when mounted inside the main body, it can be mounted in the immediate vicinity of the light guide because there is no need to collect light with a lens or the like, which offers the advantages of cost reduction and efficiency improvement.
- the relationship between the lighting current of the light emitting diode, the lighting time and the rest time, and the junction temperature of the light emitting diode 'and the temperature rise value on the rear surface side of the light emitting diode are examined in detail. As a result, as shown above, it was confirmed that it could be practically used even under lighting conditions above the rated current.
- reference numeral 1 1 denotes a light emitting element which emits 4 70 nm or 4 90 nm light mounted on a heat dissipation substrate 12, and around the light emitting element to improve the light extraction efficiency from the light emitting element And, in order to protect the light emitting element, it is covered with a convex transparent silicon resin or transparent epoxy resin 13.
- the electrode 14 ab on the light emitting element is electrically connected to the cathode lead 15 and the anode lead 16 by a gold wire 17 a, respectively, and the light emitting element emits light when current flows between the leads.
- one side of the heat dissipating member 23 is a copper metal rod whose surface is electrically insulated on the back surface of the heat dissipating substrate 22 of the light emitting diode 21 as shown in FIG. It is in close contact via the thermally conductive bonding material 24 to the end of the.
- the current is supplied to the light emitting diode 21 from the two electric wires 25 a and b and electrically connected to the anode and the cathode lead 26 ab from the light emitting diode 21 and along the heat sink 23. Wired to the power supply unit.
- the heat emitted from the light emitting diode 21 is dissipated directly to the outside by the heat dissipator 23, and the heat generated when the light emitting diode is lit is dissipated to the outside by the heat dissipator.
- a sewing wire obtained by bundling small diameter wires of copper metal, the surface of which is electrically insulated on the back surface of the heat dissipation substrate 6 2 of the light emitting diode 61. It is in close contact with one end of a flexible flexible heat sink 63 via a thermally conductive bonding material 64.
- This flexible heat sink 63 is embedded in a hollow pipe 65 made of stainless steel.
- the light emitting diode 61 is housed in a resin light emitting diode holder 66 airtightly bonded and fixed to one end of a hollow pipe, and the gap between the light emitting diode holder 65 and the light emitting diode 61 is Sealing resin 60 is filled and sealed. Further, the current supply to the light emitting diode 61 is electrically connected to the anode and the cathode lead 6 8 ab which are made from the two electric wires 6 7 a and b and are emitted from the light emitting diode 6 1.
- a flexible heat sink 63 consisting of a loose wire, and one of the wires enables an airtight and sealed electrical connection to the other end of the hollow pipe 65 and is airtight. It is connected to feed through terminals 6 and 9 that can be electrically energized while maintaining the characteristics.
- the other electric wire is fixed so as to be pressed against the inner surface of the hollow pipe made of stainless steel in the hollow pipe 65 by the flexible heat dissipating body, and is substantially electrically connected to the hollow pipe 65.
- a loose wire made of a thin wire of copper metal is used as the heat dissipating material, although it is expensive, it is easily conceivable that the same effect can be expected using soft copper or soft iron (pure iron).
- the object of the present invention is aimed at dental photopolymerization
- another object according to the basic constitution of the present invention that is, mounting of a light emitting diode having an emission wavelength exceeding the range of 350 to 500 nm Therefore, it can be easily considered to be applied to industrial endoscopes, medical endoscopes, various illumination devices, and light sources for various vehicles.
- a light fiber light guide made of a multi-core bundle or single-core hollow rod glass as shown in FIG. 7, a light emitting diode 71 is disposed in the vicinity of the incident end 74 of the optical fiber.
- the radiator 76 is disposed in close contact with the rear surface of the S photodiode 7 1 via the heat conductive adhesive 73. .
- FIG. 8 shows an embodiment of the whole apparatus based on claim 2.
- the light emitting unit 81 and the main unit 86 can be separated, the light emitting unit 81 can be easily removed and disinfected after use.
- the main unit and the power supply unit 8 5 can be separated at the time of use, which is a so-called cordless state, which is very convenient.
- FIG. 9 An embodiment of the entire apparatus is shown in FIG. 9 based on claim 3.
- the light emitting diode 91 attached near the light guide incident end and the heat radiation for emitting the heat of the light emitting diode 91
- a current source unit 95 that supplies an electric current to the body 94 and the light emitting diode 91
- a battery unit that supplies electric power to the current source unit.
- a power supply unit 97 for supplying power to the battery in the main unit 93.
- the main body and the power supply unit 97 can be separated at the time of use, and the so-called cordless state is obtained, which is very convenient. It is not necessary to have a built-in battery in the main body 93, so remove the battery It is also possible to connect the power supply unit 97 directly to the current source unit. In this case, the main body and the power supply unit 97 are connected at the time of use, which makes it possible to reduce the size and further reduce the size.
- the back surface side of the light emitting diode that emits light of 350 to 500 nm is closely fixed to the tip of the heat sink and the light emitting diode is energized.
- the current By setting the current to 1.5 times or less of the rated current, and by further limiting the continuous conduction time to 60 seconds or less, the amount of light from the fluorescent diode is enhanced without significantly reducing the reliability such as the life. It was possible.
- FIG. 1 is a schematic structural cross-sectional view of a light emitting diode according to the present invention.
- Fig. 2 shows the basic structure of the light emitting unit of this unit.
- Fig. 3 shows the measurement results of the relationship between the current application time and the current value.
- FIG. 4 is a diagram showing the relationship between the current application time and the junction temperature.
- FIG. 5 shows the results of curing experiments in Example 1.
- FIG. 6 is a diagram for explaining the construction of the second embodiment.
- FIG. 7 is another practical structural explanatory diagram in the second embodiment.
- FIG. 8 is a diagram for explaining the construction of the third embodiment.
- FIG. 9 is a diagram for explaining the construction of the fourth embodiment.
- Figure 10 is a conventional example
- Figure 11 is a conventional example
- Figure 12 is a conventional example
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Abstract
Description
明 細 書 Specification
光重合器 Photopolymerizer
技術分野 Technical field
本発明は歯科用コンポジットレジン充填材に、 発光ダイオードから発した光を高出力で 効率よく且つ均斉度高く照射させることによって、 ムラが無く重合硬化するための可視光 重合照射器に関するものである。 背景技術 The present invention relates to a visible light polymerization irradiator for uniformly curing and curing a dental composite resin filler by irradiating light emitted from a light emitting diode with high power, high uniformity and high uniformity. Background art
光ファイバ一を利用した光重合照射器の光源部の基本構造において、 従来から発光ダ ィォ一ドの発光素子から発する光を効率よく導光用ファイバーへ入射するために特開平 0 9一 0 1 0 2 3 8号、 特開平 0 7— 2 4 0 5 3 6号、 特開平 1 1— 2 1 9 6 0 8号などに 開示されているように種々の構造のものが案出されている。 例として図 1 0に示すような 特開平 1 1— 2 1 9 6 0 8号によれば複数の樹脂レンズ型発光ダイォード 1 0 1を同一方 向へ光が放射できるように回路基板 1 0 2上に配列し、 発光ダイオード 1 0 1の前方に配 置したテーパー部に金属反射層 1 0 4を被覆した先細のテーパー状の透明集光体 1 0 3に よって光を出射面側へ導きその先細の集光部即ち出射部に光フアイパー 1 0 5を接続する ことによって複数の発光ダイォード 1 0 1からの光を集光させることが可能となり光ファ ィバー 1 0 5へ光を入射させることが試みられている。 またさらに、 特開平 0 9— 0 1 0 2 3 8号を図 1 1で説明すると片側端面が発光面となる ΰ状の二次曲面からなる透明 で且つ円錐面上に金属反射層 1 1 5を付けた円錐状導光体 1 1 2において前記凸状の二次 曲面の接線に対して直角の方向に光を出射できるように複数の樹脂レンズ型発光ダイォー ド 1 1 1を凸面上に配置し、 その光を円柱状導光体 1 1 3内で集光 1 1 4することによつ て前記円錐状導光路 1 1 2を介して円柱状導光体 1 1 3の出射面側から光を外部へ照射す る構造などが知られている。 そして、 これらの光源部の基本構造を利用した光重合照 射器の従来例として図 1 2に示す小型の光重合照射装置が特開 2 0 0 0— 2 7 1 1 5 5号 に開示されているように多数個の発光ダイォード 1 2 1を球面からなる発光ダイォード支 持体 1 2 2に配列し、 その発光ダイォードは光ファイバ一 1 2 3の入射端に集光できるよ うになつている。 このように構成された光学系を制御する回路 1 2 4と駆動電源 1 2 5と 共にハンドピース 1 2 6内に収納することによって、 ハンディな光重合照射器が実用化さ れていることが良く知られている。 In the basic structure of the light source part of a light polymerization irradiator using an optical fiber, in order to efficiently cause light emitted from a light emitting element of a light emitting diode to be incident on a light guiding fiber conventionally Various structures have been proposed as disclosed in Japanese Patent Application Laid-Open No. 10 2 3 8, Japanese Patent Application Laid-Open No. 7 2 0 4 5 5 3 6, Japanese Patent Application Laid-Open No. 1 1 2 1 6 0 8 8, etc. There is. As shown in FIG. 10 as an example, according to Japanese Patent Application Laid-Open No. 11-219680, a plurality of resin-lens type light-emitting diodes 101 can be used to emit light in the same direction. The light is directed to the light emitting surface side by a tapered tapered light condensing body 1 0 3 in which a metal reflection layer 1 0 4 is arranged on the front side of the light emitting diode 1 0 1 and arranged in a tapered manner. It is possible to condense the light from the plurality of light emitting diodes 101 by connecting the optical fiber to the tapered condensing part, that is, the outgoing part, and to make the light enter the optical fiber 105. It has been tried. Furthermore, when JP-A-09-19023 8 is described with reference to FIG. 11, a transparent, conical surface formed of a wedge-shaped quadric surface whose light emitting surface is formed with one end surface on one side is a metallic reflective layer. A plurality of resin lens type light emitting diodes 1 1 1 are disposed on the convex surface so that light can be emitted in a direction perpendicular to the tangent of the convex secondary surface in the conical light guide 1 1 2 attached with The light is condensed in a cylindrical light guide 1 1 3 1 4, so that the light from the light emitting surface side of the cylindrical light guide 1 1 3 passes through the conical light guide 1 1 2. A structure that emits light to the outside is known. Then, as a conventional example of a photopolymerization illuminator using the basic structure of these light source parts, a small photopolymerization irradiation apparatus shown in FIG. 12 is disclosed in Japanese Patent Application Laid-Open No. 2000-215115. As shown in the figure, a large number of light emitting diodes 1 2 1 are arranged on a light emitting diode support 1 2 2 composed of a spherical surface, and the light emitting diodes can be condensed at the incident end of the optical fiber 1 2 3 . It is possible that a handy photopolymerization irradiator is put into practical use by storing the circuit for controlling the optical system thus configured and the drive power source 125 together with the handpiece 126. It is well known.
しかしながら、 特開平 0 9— 0 1 0 2 3 8号においては複数の発光ダイォードからの光 を導光体を介して光フアイパー内に集光点を持たせる事によって効率よく光ファイバ一へ 入射できるものの、 その光の均斉度が悪く光ファイバ一から出射された光も同様に均斉度 の悪いものであった。 そして、 砲弾型発光ダイオードの配光特性のバラツキが大きく導光 しょうとする光ファイバ一径が小さくなるほど多数個の発光ダイォードを同一点に集光す ることは非常に困難になり、 個々の発光ダイオード固有の配光バラツキ、 光軸バラツキが あるために発光ダイォード個別の光学的な位置調整が必要になったり、 導光体としても寸 法精度が要求される透明の且つ円錐面に金属層を設けた円錐状二次曲面が必要になるなど 実用上大変な困難性があった。 さらには、 多数個の発光ダイオードを配列したことに よって実質的な光源の大きさが大きくなり過ぎ、 さらに多数個の発光ダイォードを使用す るために消費電力も大きくなり蓄電池容量が大きくなつたり或いは直流電源部が大きくな るなど装置全体の大きさにも影響を与え小型軽量化を目的とする装置においてはハンドリ ングの悪さや重すぎるなどの実用上の問題があった。 特開平 1 1— 2 1 9 6 0 8号に おいては透明のテーパー状導光体によって発光ダイォ一ドからの光が集光されるものの光 反射による光減衰や光導光用ファイバ一^ .入射する光の入射角度を規定の角度以内即ち臨 界角内に納めるためにテーパー角度を大きくすることができないことから、 実質的にテ一 パ一角度が小さくなり発光ダイォ一ドから集光点即ち光導光用ファイバーの入射端との距 離が遠くなり距離による光減衰が大きくなるなど、光学系からの光の漏れが少ないものの、 光の反射、 屈折損失に加えて照射距離が長くなることによって光減衰が大きくなるなどの 問題があった。 一方、 実用上の面から小型にするためにテーパー角度を大きく取り実 質的な長さを短くしょうとすると発光ダイオードの光がテーパ面で大きく屈折することに よって反射ロスが大きくなりあまり効率の良いものにはならなかった。 このために前 者従来例と同様多数個の発光ダイォードを使用する点では変わりなく実用上装置が大きく なり、 消費電力も大きなものになっていたのが現状であった。 上述のように、 従来技 術においては基本的な構成は光ファイバ一からの出射光の増大を計るために多数個の発光 ダイォードを用いて光学的な工夫をすることによって高光出力のファイバー用光源を得る 工夫がなされ装置の小型化や低消費電力性さらには高価になるなど実用に供するには問題 があつたのが現状である。 さらにこれら光源部の基本構造を利用した例として特開 2 0 0 0 - 2 7 1 1 5 5号に示したハンディな装置においては、 前記したように基本的に多 数個の発光ダイォードを利用したものでありハンディとはいえその大きさは大きく実用上 問題があった。 However, in JP-A-09-90238, light from a plurality of light emitting diodes can be efficiently incident on an optical fiber by providing a condensing point in the optical fiber through the light guide. However, the uniformity of the light was poor, and the light emitted from the first optical fiber was also poor in uniformity. And, as the diameter of the optical fiber to be guided becomes smaller as the variation of the light distribution characteristic of the shell type light emitting diode becomes larger, it becomes very difficult to condense a large number of light emitting diodes at the same point. Due to the inherent light distribution variation of the diode and the optical axis variation, it is necessary to individually adjust the optical positions of the light emitting diodes individually, and as a light guide, a transparent and conical metal layer is required for dimensional accuracy. Needs a conical quadric surface, etc. There was a great difficulty in practical use. Furthermore, the arrangement of a large number of light emitting diodes makes the substantial size of the light source too large, and the use of a large number of light emitting diodes further increases the power consumption and the storage battery capacity. There is a practical problem such as handling being too bad or heavy in a device aiming to reduce the size and weight by affecting the size of the entire device, such as an increase in the size of the DC power supply unit. In JP-A-11-219608, although the light from the light emitting diode is condensed by the transparent tapered light guide, the light attenuation due to the light reflection or the light guiding fiber 1. Since the taper angle can not be increased in order to place the incident angle of the incident light within the specified angle, ie, within the critical angle, the taper angle becomes substantially smaller, and the light emitting diode can be used to That is, although the distance from the incident end of the light guiding fiber is long and light attenuation due to the distance is large, light leakage from the optical system is small, but the irradiation distance becomes long in addition to light reflection and refraction loss. Caused problems such as increased light attenuation. On the other hand, if the taper angle is made large and the practical length is made short in order to reduce the size from a practical point of view, the light of the light emitting diode is largely refracted by the taper surface, so that the reflection loss becomes large and the efficiency is reduced. It was not good. For this reason, as in the case of the former conventional example, there is no change in that it uses a large number of light emitting diodes, and the apparatus is practically large in size, and the power consumption is large. As described above, in the conventional technology, the basic configuration is a light source for a high light output fiber by optically devising using a large number of light emitting diodes in order to measure an increase in light emitted from one optical fiber. In the present situation, there have been problems in putting it to practical use, such as downsizing of the device, low power consumption and high cost. Furthermore, in the handy apparatus shown in Japanese Patent Application Laid-Open No. 2001-215, as an example using the basic structure of these light source units, basically, as described above, a number of light emitting diodes are basically used. Although it is handy and handy, its size was large and there was a problem in practical use.
本発明の目的は発光ダイォードからの光を効率良く照射対象物へ照射でき且つ照射ム ラのない軽量 ·小型で且つ信頼性の高い光重合照射装置を提供することにある。 発明の開示 発光ダイォード等の半導体素子は電気的温度的な絶対最大定格が有りこれを越えて使用 する事は発光素子の寿命を損ねるためにしてはならないことになつており、 絶対最大定格 を越えないで使用すればその寿命は数万ないしは数十万時間以上が保証される。 An object of the present invention is to provide a lightweight, compact and highly reliable photopolymerization irradiation apparatus capable of efficiently irradiating light from a light emitting diode onto an object to be irradiated and having no irradiation spot. Disclosure of the Invention A semiconductor device such as a light emitting diode has an absolute maximum rating in terms of electrical temperature, and its use beyond this should not be done in order to reduce the life of the light emitting element, and the absolute maximum rating is exceeded. If it is not used, its lifetime is guaranteed to be tens of thousands to hundreds of thousands of hours or more.
しかしながらそのような長寿命を必要としない場合には絶対最大定格を越えて使用する ことにより特性が大幅に改善されることが考えられる。 However, if such a long life is not required, it is considered that the characteristics can be greatly improved by using it beyond the absolute maximum rating.
現在歯科用光重合器の光源としてはハロゲンランプが主力であるがその寿命は高々数十 時間から数百時間であり、 実用に充分供されている。 この観点からすれば発光ダイオード の寿命は数百時間から数千時間もあれば充分なものと言える。 At present, halogen lamps are the main light source for dental photopolymerizers, but their service life is at most several dozen hours to several hundred hours, and they are sufficiently used for practical use. From this point of view, it can be said that the lifetime of the light emitting diode is sufficient if it is several hundred hours to several thousand hours.
—方歯科用光重合器の実用的な照射時間は短い方がよいのだが最長 1分までが限界とさ れる。 -The practical irradiation time of the dental light polymerizer should be short, but the maximum is up to 1 minute.
上記観点に立ち現在市販されている発光ダイォードで調べてみると、 発光ダイォードに 充分大きい放熱体を取り付けその発光素子の平均値電流の絶対最大定格値の 1.5倍以内、 通電時間が 1分以内であれば接合部温度が素子の絶対最大定格を越えて使用しても数千時 聞以上の寿命が有ることが判明した。 From the above viewpoint, when examining with a light emitting diode currently marketed, a sufficiently large radiator is attached to the light emitting diode, within 1.5 times the absolute maximum rating value of the average current of the light emitting element, It was found that if the conduction time is less than 1 minute, even if the junction temperature exceeds the absolute maximum rating of the element, it has a life of several thousand hours or more.
また発光素子に流す電流の平均値電流が、 その発光素子の平均値電流の絶対最大定格値 の 1.5倍以内であればデューディ比を小さくすることによりジャンクション温度を低下さ せることが出来、 更に大きな電流を流しうることが判明した。 In addition, if the average value of the current supplied to the light emitting element is within 1.5 times the absolute maximum rated value of the average value current of the light emitting element, the junction temperature can be lowered by decreasing the duty ratio, which is larger It turned out that the current could flow.
素子に電流を流してからしばらくして熱的に安定してからの通電時間と電流値の関係を 図 3に、 通電時間と接合部温度の関係を図 4に示してある。 The relationship between the conduction time and the current value is shown in Fig. 3 after the current has been supplied to the element for a while and then thermally stabilized. The relation between the conduction time and the junction temperature is shown in Fig. 4.
すなわち発光素子の平均値電流の絶対最大定格値を Iave (max)、 発光素子の寿命が大き く損なわれることなく 1 分間流しうる平均値電流を Iave (ext)、 デューディ比を D とし、 その時に流す電流値を Ipeak、 素子に電流が流れている時間(sec)とすると次の式が成り立 つことを確認した。 That is, Iave (max) is the absolute maximum rating of the average current of the light emitting element, Iave (ext) is the average current that can be flowed for 1 minute without any significant loss of the life of the light emitting element, and D is the duty ratio. Assuming that the flowing current value is Ipeak, and the time during which the current flows in the device (sec), it is confirmed that the following equation holds.
1.5 lave vmax)≤ lave (ext)≤ Ipeak氺 D . · · · i 1.5 lave vmax) lave (ext) ≤ Ipeak 氺 D. · · · i
D = Ton/ (Ton + Toff) · · · · 2 D = Ton / (Ton + Toff) · · · 2
Ton + Toff≤ 60 · · · · 3 Ton + Toff≤ 60 · · · · 3
例として Iave(max) = 0.35A, D = 0.4 とした場合最大に流しうる電流及び時間は上の 式より簡単に求められる。 For example, when Iave (max) = 0.35 A, D = 0.4, the maximum current and time can be calculated easily from the above equation.
1.5 * 0.35 = 0.4氺 Ipeak 1.5 * 0.35 = 0.4 氺 Ipeak
0.4 = Ton/ (Ton + Toff) 0.4 = Ton / (Ton + Toff)
Ton + Toff = 60 Ton + Toff = 60
より Ton = 24sec、 Toff = 36sec、 Ipeak = 1.3Aが得られる。 From this, Ton = 24 sec, Toff = 36 sec, Ipeak = 1.3 A can be obtained.
すなわち平均値電流の絶対最大定格が 350mA の発光ダイオードは 1.3Aの電流を最長 24 秒 That is, a light emitting diode with an absolute maximum rating of 350mA for average current can be used for up to 24 seconds at a current of 1.3A.
間流すことが可能である。 発光ダイオードからの光出力は電流にほぼ比例して増加し、 上 記の例においては光出力は定格内で使用したときに得られる最大光出力の約 3.5倍得るこ とが出来た。 It is possible to flow between them. The light output from the light emitting diode increased approximately in proportion to the current, and in the above example, the light output could be obtained about 3.5 times the maximum light output obtained when used within the rating.
図 5に一般に使用されている歯科用コンポジットレジンにこのとき得られる光を照射し 照射時間と硬化膜の厚さの関係を調べた。。 この時の発光ダイオードの発光波長は 470nm である。 Fig. 5 shows the relationship between the irradiation time and the thickness of the cured film by irradiating the light obtained at this time to a commonly used dental composite resin. . The emission wavelength of the light emitting diode at this time is 470 nm.
5秒照射で 3mm、 10秒照射で 4.3mm硬化し、 充分に実用範囲であることがわかった。 このような方法により従来複数個の発光ダイォードを使用しなければ得られなかつた特 性が一個の発光ダイォードを使用するだけで得られるため、 発光ダイォードを取り付ける 位置の自由度が増え色々な利点が得られるようになった。 It hardened 3 mm by 5 seconds irradiation, and 4.3 mm by 10 seconds irradiation, and it turned out that it is fully within the practical range. By such a method, the characteristics which could not be obtained unless a plurality of light emitting diodes are conventionally obtained can be obtained by using only one light emitting diode, so the degree of freedom in mounting the light emitting diode is increased and various advantages are obtained. It came to be obtained.
例えばへの字型の中空パイプの先端に一個の発光ダイォードを取り付けることにより 従来必ず必要であったライ トガイ ドが不要となり、 大幅なコストダウンや、 ライ トガイ ド による光の損失が無くなり更なる光出力増加が可能となった。 For example, by attaching a single light emitting diode to the end of the H-shaped hollow pipe, the light guide which has always been necessary is not required, the cost is reduced significantly, and the light loss due to the light guide is eliminated. It has become possible to increase the output.
また本体内部に発光ダイオードを取り付ける場合にはレンズなどで集光する必要が無い ためにライ トガイ ドの直近に取り付けることが可能で、 同様にコストダウン、 効率アップ が図れるという長所が得られる。 In addition, when the light emitting diode is mounted inside the main body, it can be mounted in the immediate vicinity of the light guide because there is no need to collect light with a lens or the like, which offers the advantages of cost reduction and efficiency improvement.
以上述べたように、 発光ダイォードの点灯電流と点灯時間及び休止時間と発光ダイォー ド'のジャンクション温度及ぴ発光ダイォード背面側の温度上昇値との関係をを詳細に検討 した結 ¾、 上記に示すように定格電流以上の点灯条件においても充分実用に供し得ること を確認した。 As described above, the relationship between the lighting current of the light emitting diode, the lighting time and the rest time, and the junction temperature of the light emitting diode 'and the temperature rise value on the rear surface side of the light emitting diode are examined in detail. As a result, as shown above, it was confirmed that it could be practically used even under lighting conditions above the rated current.
なお発光ダイォ一ドの光出力を増大させるためには発光ダイォード背面に密着固定した 放熱効果を持つ放熱体を設ける事が必須の条件であり、 このことによって発光ダイォード の動作時温度を低減化でき、 一定の時間を限定して通電できる電流を高めることを可能と し、 その結果発光ダイォ一ドへの入力電力を高められ放射される光出力の増大が計られた ことのみならずさらに短時間において過大な電流を通電しても放熱体の放熱効果により発 光ダイォードの熱劣化による信頼性を大きく損なわないですむ。 発明を実施するための最良の形態 以下、 本発明の第一の実施例を図 1、 図 2において説明する。 図 1において、 1 1 は放熱基板 1 2上に搭載されている 4 7 0 n m或いは 4 9 0 n mの光を放射する発光素子 でありその周囲を発光素子からの光の取り出し効率を改善するためと発光素子の保護のた めに凸状の透明シリコン樹脂或いは透明エポキシ樹脂 1 3にて覆われている。 そして発光 素子上の電極 1 4 a bはそれぞれカソードリード 1 5とアノードリード 1 6へ金線 1 7 a, にて電気的に接続されており、 リード間に電流を通電することによって発光素子が発 光する構造になっている。 このような発光ダイォードを用いて図 2に示すよう前記発光ダ ィオード 2 1の放熱基板 2 2の背面には表面が電気的絶縁処理が施された銅金属棒からな る放熱体 2 3の一方の端部に熱伝導性の接合材 2 4を介して密着されている。 そして発光 ダイオード 2 1への電流供給は 2本の電線 2 5 a , bから為され発光ダイオード 2 1から 出ているアノード及びカソードリード 2 6 a bと電気的に接続され放熱体 2 3に沿うよう に配線され電源部へと接続されている。 そしてこの様な構成にすることによってことによ つて発光ダイオード 2 1から発する熱は放熱体 2 3によって外部へ直接熱が放散され、 発 光ダイォード点灯時の発熱を放熱体によって外部へ放散することが出来る。 上記の実用的な構造として図 6に示すように、 前記発光ダイオード 6 1の放熱基板 6 2 の背面には表面が電気的絶縁処理が施された銅金属の細径線を束ねた縫り線状のフレキシ プルな放熱体 6 3の一方の端部に熱伝導性の接合材 6 4を介して密着されている。 このフ レキシブルな放熱体 6 3はステンレス金属からなる中空パイプ 6 5の中に揷入 '収納され ている。 そして発光ダイオード 6 1は中空パイプの一方の先端部に気密に接着固定した榭 脂製の発光ダイォ一ドホルダー 6 6の中に収納し、 発光ダイォードホルダ一 6 5と発光ダ ィォード 6 1の隙間は封着樹脂 6 0によって埋められ密封されている。 さらに前記発光ダ ィォ一ド 6 1への電流供給は 2本の電線 6 7 a , bから為され発光ダイオード 6 1から出 ているァノード及ぴカソードリ一ド 6 8 a bと電気的に接続され緩り線からなるフレキシ ブルな放熱体 6 3に沿うように配線され、 その一方の線は中空パイプ 6 5のもう一方の端 部に気密に封着された電気的な接続を可能とし且つ気密性を保ちながら電気的な通電が可 能なフィードスルー端子 6 9接続されている。 もう一方の電線は中空パイプ 6 5の中でス テンレス金属からなる中空パイプの内面にフレキシブルな放熱体によって押しつけられる ように固定され中空パイプ 6 5と実質的に電気的に接続されている。 又、 ここではフレ キシブルな放熱体として銅金属の細径線からなる緩り線を用いたが高価ではあるが軟銅ゃ 軟鉄 (純鉄) などを用いても同様の効果が期待できることは容易に考えられる。 In order to increase the light output of the light emitting diode, it is essential to provide a heat dissipating member with a heat radiation effect closely fixed to the back of the light emitting diode, which can reduce the operating temperature of the light emitting diode. It is possible to increase the current that can be conducted by limiting the constant time, and as a result, the input power to the light emitting diode is increased and the emitted light output is measured, but also for a short time. Therefore, even if an excessive current is applied, the heat radiation effect of the heat sink does not significantly impair the reliability of the light emitting diode due to the thermal deterioration. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a first embodiment of the present invention will be described with reference to FIG. 1 and FIG. In FIG. 1, reference numeral 1 1 denotes a light emitting element which emits 4 70 nm or 4 90 nm light mounted on a heat dissipation substrate 12, and around the light emitting element to improve the light extraction efficiency from the light emitting element And, in order to protect the light emitting element, it is covered with a convex transparent silicon resin or transparent epoxy resin 13. The electrode 14 ab on the light emitting element is electrically connected to the cathode lead 15 and the anode lead 16 by a gold wire 17 a, respectively, and the light emitting element emits light when current flows between the leads. It has a light structure. As shown in FIG. 2 using such a light emitting diode, one side of the heat dissipating member 23 is a copper metal rod whose surface is electrically insulated on the back surface of the heat dissipating substrate 22 of the light emitting diode 21 as shown in FIG. It is in close contact via the thermally conductive bonding material 24 to the end of the. The current is supplied to the light emitting diode 21 from the two electric wires 25 a and b and electrically connected to the anode and the cathode lead 26 ab from the light emitting diode 21 and along the heat sink 23. Wired to the power supply unit. With such a configuration, the heat emitted from the light emitting diode 21 is dissipated directly to the outside by the heat dissipator 23, and the heat generated when the light emitting diode is lit is dissipated to the outside by the heat dissipator. Can do. As shown in FIG. 6 as the practical structure described above, a sewing wire obtained by bundling small diameter wires of copper metal, the surface of which is electrically insulated on the back surface of the heat dissipation substrate 6 2 of the light emitting diode 61. It is in close contact with one end of a flexible flexible heat sink 63 via a thermally conductive bonding material 64. This flexible heat sink 63 is embedded in a hollow pipe 65 made of stainless steel. The light emitting diode 61 is housed in a resin light emitting diode holder 66 airtightly bonded and fixed to one end of a hollow pipe, and the gap between the light emitting diode holder 65 and the light emitting diode 61 is Sealing resin 60 is filled and sealed. Further, the current supply to the light emitting diode 61 is electrically connected to the anode and the cathode lead 6 8 ab which are made from the two electric wires 6 7 a and b and are emitted from the light emitting diode 6 1. It is wired along a flexible heat sink 63 consisting of a loose wire, and one of the wires enables an airtight and sealed electrical connection to the other end of the hollow pipe 65 and is airtight. It is connected to feed through terminals 6 and 9 that can be electrically energized while maintaining the characteristics. The other electric wire is fixed so as to be pressed against the inner surface of the hollow pipe made of stainless steel in the hollow pipe 65 by the flexible heat dissipating body, and is substantially electrically connected to the hollow pipe 65. Also, here Although a loose wire made of a thin wire of copper metal is used as the heat dissipating material, although it is expensive, it is easily conceivable that the same effect can be expected using soft copper or soft iron (pure iron).
又、本発明の目的は歯科用光重合を目的としたが、本発明の基本構成によって他の目的、 即ち 3 5 0〜 5 0 0 n mの範囲を越えた発光波長の発光ダイォードを搭載することによつ て工業用内視鏡、 医療用内視鏡、 各種照明装置、 各種車载用光源への応用展開が容易に考 えられる。 さらに図 7に示すような多芯結束或いは単芯ムク棒のガラスからなる光フアイパー製ラ ィトガイ ド 7 2を用いて、 その光ファイバ一の入射端 7 4近傍に発光ダイォード 7 1を配 置することによって発光ダイォード 7 1から放射された光を導光し、 一方の光ファイバ一 の出射端 7 5に導くことによって効率よく光利用が可能な構造とする事が出来る。 また、 この時発光ダイオード 7 1から発生した熱を背面側に放熱するために S光ダイオード 7 1 の背面に熱伝導性接着剤 7 3を介して密着して放熱器 7 6が配置してある。 Also, although the object of the present invention is aimed at dental photopolymerization, another object according to the basic constitution of the present invention, that is, mounting of a light emitting diode having an emission wavelength exceeding the range of 350 to 500 nm Therefore, it can be easily considered to be applied to industrial endoscopes, medical endoscopes, various illumination devices, and light sources for various vehicles. Furthermore, using a light fiber light guide made of a multi-core bundle or single-core hollow rod glass as shown in FIG. 7, a light emitting diode 71 is disposed in the vicinity of the incident end 74 of the optical fiber. As a result, the light emitted from the light emitting diode 71 can be guided to the light emitting end 75 of one of the optical fibers, so that the light can be efficiently utilized. At this time, in order to dissipate the heat generated from the light emitting diode 71 to the rear side, the radiator 76 is disposed in close contact with the rear surface of the S photodiode 7 1 via the heat conductive adhesive 73. .
以上のように二つの装置全体の構成例において前記したようにいずれの構造でも発光ダ ィォードへの通電電流条件が変わることはない。 さらには本実施例においては単一の発光 ダイオードを使用したが、 これが複数個になっても上記の条件は変わらないことは容易に 考えられる。 図 8に請求項 2項に基づき装置全体の一実施例を示してある。 As described above, in any of the configurations of the entire configuration of the two devices as described above, the conduction current condition to the light emitting diode does not change. Furthermore, although a single light emitting diode was used in the present embodiment, it is easily conceivable that the above conditions do not change even if a plurality of these are used. FIG. 8 shows an embodiment of the whole apparatus based on claim 2.
発光部 8 1と、 本体 8 6に內蔵され前記発光部 8 1のオン、 オフを制御する制御部 8 2 と前記発光部に平均値電流の絶対最大定格値以上、 1 . 5倍以下の電流を供給する電流源 部 8 3と電流源部に電力を供給するバッテリー部 8 と本体内のバッテリーに電力を供給 する電源供給部 8 5より構成されている。 A light emitting unit 81, a control unit 82 for storing on / off of the light emitting unit 81, which is stored in a main body 86, and an absolute maximum rating value of average current in the light emitting unit is 1.5 times or less It consists of a current source unit 83 that supplies current, a battery unit 8 that supplies power to the current source unit, and a power supply unit 85 that supplies power to the battery in the main unit.
発光部 8 1と本体 8 6は切り離すことが出来るために使用後発光部 8 1を取り外して消毒 する事が容易に出来る。 Since the light emitting unit 81 and the main unit 86 can be separated, the light emitting unit 81 can be easily removed and disinfected after use.
また本体 8 6にはバッテリーが內蔵されているために使用時には本体と電源供給部 8 5 は切り離すことが出来いわゆるコードレス状態となり使い勝手が大変良い。 In addition, since the battery is stored in the main unit 86, the main unit and the power supply unit 8 5 can be separated at the time of use, which is a so-called cordless state, which is very convenient.
本体 8 6内には必ずしもバッテリーを內蔵するする必要はなく、 バッテリーを取り外し て直接電流源部に電源供給部 8 5を接続することも可能である。 この場合使用時は本体と 電源供給部 8 5はつながれた状態になりコストが安くなり、 更なる小型化も可能となる。 図 9に請求項 3に基づき装置全体の一実施例を示してある。 It is not necessary to store the battery in the main body 86, but it is also possible to remove the battery and connect the power supply 85 directly to the current source. In this case, the main body and the power supply unit 85 are connected at the time of use, so that the cost can be reduced and further downsizing can be achieved. An embodiment of the entire apparatus is shown in FIG. 9 based on claim 3.
発光ダイォード 9 1からの光を外部に導出するライ トガイ ド 9 2と本体 9 3内にはライ トガイ ド入射端近傍に取り付けられた発光ダイオード 9 1と、 発光ダイオード 9 1の熱を 放出する放熱体 9 4と、 発光ダイォ一ド 9 1に平均値電流の絶対最大定格値以上、 1 . 5倍以下の電流を供給する電流源部 9 5と電流源部に電力を供給するバッテリー部 9 6と 本体 9 3内のバッテリーに電力を供給する電源供給部 9 7より構成されている。 In the light guide 92 for emitting the light from the light emitting diode 91 to the outside and in the main body 93, the light emitting diode 91 attached near the light guide incident end and the heat radiation for emitting the heat of the light emitting diode 91 A current source unit 95 that supplies an electric current to the body 94 and the light emitting diode 91, and a battery unit that supplies electric power to the current source unit. And a power supply unit 97 for supplying power to the battery in the main unit 93.
実施例 4と同様に本体にはパッテリ一が内蔵されているために使用時には本体と電源供 給部 9 7は切り離すことが出来いわゆるコードレス状態となり使い勝手が大変良い。 本体 9 3内には必ずしもバッテリーを内蔵するする必要はなく、 バッテリーを取り外し て直接電流源部に電源供給部 9 7を接続することも可能である。 この場合使用時は本体と 電源供給部 9 7はつながれた状態になり安くなり、 更なる小型化も可能となる。 産業上の利用の可能性 As in the fourth embodiment, since the battery 1 is built in the main body, the main body and the power supply unit 97 can be separated at the time of use, and the so-called cordless state is obtained, which is very convenient. It is not necessary to have a built-in battery in the main body 93, so remove the battery It is also possible to connect the power supply unit 97 directly to the current source unit. In this case, the main body and the power supply unit 97 are connected at the time of use, which makes it possible to reduce the size and further reduce the size. Industrial Applicability
以上説明したように、 本発明の基本構成は 3 5 0〜 5 0 0 n mの光を放射する発光ダ ィォ一ド背面側を放熱体の先端部に密着固定した構成とし且つ発光ダイォードに通電する 電流を定格電流の 1 . 5倍以下とすることによって、 さらに連続通電時間を 6 0秒以下に 限定することによつて篼光ダイォードからの光量を寿命などの信頼性を大きく損なわずに 高めることが出来た。 図面の簡単な説明 As described above, according to the basic configuration of the present invention, the back surface side of the light emitting diode that emits light of 350 to 500 nm is closely fixed to the tip of the heat sink and the light emitting diode is energized. By setting the current to 1.5 times or less of the rated current, and by further limiting the continuous conduction time to 60 seconds or less, the amount of light from the fluorescent diode is enhanced without significantly reducing the reliability such as the life. It was possible. Brief description of the drawings
図 1は本発明に基付く発光ダイォードの概略構造断面図である。 FIG. 1 is a schematic structural cross-sectional view of a light emitting diode according to the present invention.
図 2は本器の発光部の基本構造である。 Fig. 2 shows the basic structure of the light emitting unit of this unit.
図 3は通電時間と電流値の関係の測定結果である。 Fig. 3 shows the measurement results of the relationship between the current application time and the current value.
図 4は通電時間と接合部温度の関係を示した図である。 FIG. 4 is a diagram showing the relationship between the current application time and the junction temperature.
図 5は実施例 1における硬化実験結果である。 FIG. 5 shows the results of curing experiments in Example 1.
図 6は実施例 2における構成説明図である。 FIG. 6 is a diagram for explaining the construction of the second embodiment.
図 7は実施例 2におけるもう一つの実用上の構成説明図である。 FIG. 7 is another practical structural explanatory diagram in the second embodiment.
図 8は実施例 3における構成説明図である。 FIG. 8 is a diagram for explaining the construction of the third embodiment.
図 9は実施例 4における構成説明図である。 FIG. 9 is a diagram for explaining the construction of the fourth embodiment.
図 1 0は従来例 Figure 10 is a conventional example
図 1 1は従来例 Figure 11 is a conventional example
図 1 2は従来例 Figure 12 is a conventional example
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003048367A JP2004254880A (en) | 2003-02-26 | 2003-02-26 | Photopolymerizer |
| JP2003-048367 | 2003-02-26 |
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| Publication Number | Publication Date |
|---|---|
| WO2004084758A1 true WO2004084758A1 (en) | 2004-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2004/002264 Ceased WO2004084758A1 (en) | 2003-02-26 | 2004-02-26 | Photopolymerization unit |
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| WO (1) | WO2004084758A1 (en) |
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| JP2006253528A (en) * | 2005-03-14 | 2006-09-21 | Opto Device Kenkyusho:Kk | Reflective light emitting diode unit and light emitting diode |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999016136A1 (en) * | 1997-09-25 | 1999-04-01 | University Of Bristol | Optical irradiation device |
| JPH11272838A (en) * | 1998-01-22 | 1999-10-08 | Tenryu Technics:Kk | Article image pickup method and electronic component mounting device |
| WO2001064129A1 (en) * | 2000-03-01 | 2001-09-07 | 3M Innovative Properties Company | Method and apparatus for curing light-curable dental materials |
| JP2001356247A (en) * | 2000-06-13 | 2001-12-26 | Mitsubishi Rayon Co Ltd | Lighting equipment |
| JP2002151741A (en) * | 2000-11-08 | 2002-05-24 | Murata Mfg Co Ltd | Light emitting device, mounting substrate, and electronic equipment using the device and substrate |
| JP2002360605A (en) * | 2001-06-06 | 2002-12-17 | Morita Mfg Co Ltd | Medical light irradiator |
-
2003
- 2003-02-26 JP JP2003048367A patent/JP2004254880A/en active Pending
-
2004
- 2004-02-26 WO PCT/JP2004/002264 patent/WO2004084758A1/en not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999016136A1 (en) * | 1997-09-25 | 1999-04-01 | University Of Bristol | Optical irradiation device |
| JPH11272838A (en) * | 1998-01-22 | 1999-10-08 | Tenryu Technics:Kk | Article image pickup method and electronic component mounting device |
| WO2001064129A1 (en) * | 2000-03-01 | 2001-09-07 | 3M Innovative Properties Company | Method and apparatus for curing light-curable dental materials |
| JP2001356247A (en) * | 2000-06-13 | 2001-12-26 | Mitsubishi Rayon Co Ltd | Lighting equipment |
| JP2002151741A (en) * | 2000-11-08 | 2002-05-24 | Murata Mfg Co Ltd | Light emitting device, mounting substrate, and electronic equipment using the device and substrate |
| JP2002360605A (en) * | 2001-06-06 | 2002-12-17 | Morita Mfg Co Ltd | Medical light irradiator |
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