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WO2004079496A3 - System for fabricating electrical circuits employing a fluid flow supporter - Google Patents

System for fabricating electrical circuits employing a fluid flow supporter Download PDF

Info

Publication number
WO2004079496A3
WO2004079496A3 PCT/IL2004/000201 IL2004000201W WO2004079496A3 WO 2004079496 A3 WO2004079496 A3 WO 2004079496A3 IL 2004000201 W IL2004000201 W IL 2004000201W WO 2004079496 A3 WO2004079496 A3 WO 2004079496A3
Authority
WO
WIPO (PCT)
Prior art keywords
supporter
electrical circuits
fluid flow
circuits employing
fabricating electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IL2004/000201
Other languages
French (fr)
Other versions
WO2004079496A2 (en
Inventor
Yamamoto Shigeru
Raanan Adin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orbotech Ltd
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of WO2004079496A2 publication Critical patent/WO2004079496A2/en
Anticipated expiration legal-status Critical
Publication of WO2004079496A3 publication Critical patent/WO2004079496A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Solid Materials (AREA)
  • Magnetic Bearings And Hydrostatic Bearings (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A method for supporting a flat substrate (122) during fabrication, employing a fluid flow supporter (125,127) operating at a first fluid pressure and a first flow volume. A high pressure, low volume, fluid input is converted to reduce the pressure and increase the volume for levitating in fabrication electrical circuits.
PCT/IL2004/000201 2003-03-03 2004-03-02 System for fabricating electrical circuits employing a fluid flow supporter Ceased WO2004079496A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003-055361 2003-03-03
JP2003055361A JP3995617B2 (en) 2003-03-03 2003-03-03 Air levitation device

Publications (2)

Publication Number Publication Date
WO2004079496A2 WO2004079496A2 (en) 2004-09-16
WO2004079496A3 true WO2004079496A3 (en) 2006-05-04

Family

ID=32958661

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2004/000201 Ceased WO2004079496A2 (en) 2003-03-03 2004-03-02 System for fabricating electrical circuits employing a fluid flow supporter

Country Status (3)

Country Link
JP (1) JP3995617B2 (en)
TW (1) TW200505780A (en)
WO (1) WO2004079496A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7908885B2 (en) 2004-11-08 2011-03-22 New Way Machine Components, Inc. Non-contact porous air bearing and glass flattening device
JP4664117B2 (en) * 2005-03-03 2011-04-06 住友重機械工業株式会社 Transported object floating unit, transported object floating device, and stage device
JP4869612B2 (en) * 2005-03-25 2012-02-08 東京エレクトロン株式会社 Substrate transport system and substrate transport method
JP4830339B2 (en) * 2005-04-27 2011-12-07 株式会社Ｉｈｉ Transport device
JP4553376B2 (en) 2005-07-19 2010-09-29 東京エレクトロン株式会社 Floating substrate transfer processing apparatus and floating substrate transfer processing method
JP4700430B2 (en) * 2005-07-26 2011-06-15 シーケーディ株式会社 Non-contact support device inspection method
JP4917780B2 (en) * 2005-09-08 2012-04-18 住友化学株式会社 Exposure equipment
JP4535972B2 (en) * 2005-09-09 2010-09-01 株式会社ブイ・テクノロジー Work stage and exposure apparatus
JP2007182304A (en) * 2006-01-06 2007-07-19 Tokyo Electron Ltd Substrate carrying device and its method, and computer program
JP4594241B2 (en) * 2006-01-06 2010-12-08 東京エレクトロン株式会社 Substrate transport apparatus, substrate transport method, and computer program
JP2007194508A (en) * 2006-01-20 2007-08-02 Tokyo Electron Ltd Substrate transport device, substrate transport method, and computer program
JP2007283428A (en) * 2006-04-14 2007-11-01 Yokogawa Electric Corp Workpiece processing apparatus and work transfer system
JP2008140953A (en) * 2006-12-01 2008-06-19 Tanken Seal Seiko Co Ltd Levitation device
JP5221508B2 (en) * 2009-12-25 2013-06-26 東京エレクトロン株式会社 Substrate processing equipment
JP5485928B2 (en) * 2011-03-09 2014-05-07 東京エレクトロン株式会社 Substrate floating transfer device and substrate processing apparatus
JP2014218342A (en) * 2013-05-09 2014-11-20 オイレス工業株式会社 Supporting air plate and gas flow resistor thereof
JP2015034078A (en) * 2013-08-09 2015-02-19 オイレス工業株式会社 Supporting air plate, and gas flow resistor of the same
CN115070493A (en) * 2022-07-25 2022-09-20 南通康弘机械制造有限公司 Machining material receiving mechanism for machining of numerical control machine tool

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589704A (en) * 1968-11-12 1971-06-29 Ibm Holders for irregularly formed integrated circuit devices
US6590633B1 (en) * 1997-03-25 2003-07-08 Nikon Corporation Stage apparatus and method for producing circuit device utilizing the same
US6625877B1 (en) * 1998-01-27 2003-09-30 Fuji Machine Mfg. Co., Ltd. Apparatus for supporting electric-component mounter
US6666928B2 (en) * 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber
US6711797B1 (en) * 1999-06-21 2004-03-30 Dek International Gmbh Hydraulic tooling fixture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589704A (en) * 1968-11-12 1971-06-29 Ibm Holders for irregularly formed integrated circuit devices
US6590633B1 (en) * 1997-03-25 2003-07-08 Nikon Corporation Stage apparatus and method for producing circuit device utilizing the same
US6625877B1 (en) * 1998-01-27 2003-09-30 Fuji Machine Mfg. Co., Ltd. Apparatus for supporting electric-component mounter
US6711797B1 (en) * 1999-06-21 2004-03-30 Dek International Gmbh Hydraulic tooling fixture
US6666928B2 (en) * 2001-09-13 2003-12-23 Micell Technologies, Inc. Methods and apparatus for holding a substrate in a pressure chamber

Also Published As

Publication number Publication date
JP2004262608A (en) 2004-09-24
TW200505780A (en) 2005-02-16
JP3995617B2 (en) 2007-10-24
WO2004079496A2 (en) 2004-09-16

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